PIC24EP512GP204-E/ML - 16-bit 60 MIPS MCU, 512KB Flash | Microchip
MPN: PIC24EP512GP204-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.45 | $11.45 |
| 10 | $10.62 | $106.20 |
| 100 | $9.34 | $934.00 |
| 500 | $8.27 | $4,135.00 |
| 1,000 | $7.49 | $7,490.00 |
PIC24EP512GP204-E/ML Overview
A PIC microcontroller is a compact microcontroller unit based on Microchip's proprietary PIC architecture that integrates a CPU, memory (Flash, SRAM, EEPROM), and peripherals on a single die. PIC24E devices sit in the 16-bit DSP-enhanced tier of the PIC family, bridging 8-bit PIC16/PIC18 controllers and 32-bit PIC32MX devices, and they belong to the broader power-management-and-control category of embedded MCUs. This product family is widely used in motor control, power conversion, and signal-processing applications where deterministic interrupt latency and DSP MAC instructions matter.
Key features of the PIC24EP512GP204 include 35 channels of 12-bit ADC, three op-amps internal to the die, four analog comparators with configurable reference, six 16-bit timers, motor-control PWMs with independent duty cycles, USB 2.0 full-speed On-The-Go, and a Peripheral Trigger Generator that chains ADC, PWM, and DMA events without CPU intervention. The device operates from 3.0 V to 3.6 V (industrial -40C to +125C) and supports up to 35 general-purpose I/O pins on this 44-pin variant.
Architecturally, the PIC24E core delivers one instruction per two clock cycles at 70 MIPS maximum (FCY = FOSC/2 with FOSC up to 140 MHz for the 70 MIPS variants; the -E part number indicates -40C to +125C operating range and 60 MIPS maximum). A 16-word by 16-bit register file with hardware zero-overhead looping makes the device attractive for control loops and digital filtering.
Typical applications for the PIC24EP512GP204-E/ML include three-phase motor control (BLDC, PMSM, ACIM), digital power conversion (PFC, LLC, full-bridge), industrial sensor conditioning using the on-chip op-amps, USB-CDC/HID human-interface devices, and audio/signal-processing front-ends. Designers favor it when migrating from PIC24F or dsPIC33F to gain code density, ADC speed, and DSP instructions while keeping the MPLAB X toolchain.
When designing with this part, allocate at least one ground pin per power pin, use a 10 uF plus 0.1 uF decoupling combination near VDD/AVDD pairs, and follow Microchip's QFN PCB layout guidelines for the 8x8 mm exposed pad (thermal pad must be soldered for rated thermal performance). Consider the PIC24EP512GP204-I/ML variant for -40C to +85C industrial runs and the 70 MIPS /P or /PT variants for higher-throughput deployments.
This page synthesizes distributor pricing, parametric cross-references, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster path to a validated BOM for -40C to +125C embedded-control designs.
Drop-in alternatives for PIC24EP512GP204-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24EP512GP204-E/ML (same form factor and footprint) — differing in ADC, Package, Core Architecture, Maximum CPU Speed, CTMU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24EP512GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP512GP204T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP256GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP128GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP32GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP512GP204-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24E (16-bit modified Harvard) |
| Maximum CPU Speed | 60 MIPS (FCY = FOSC/2) |
| Program Flash Memory | 512 KB (170K x 24 words) |
| SRAM | 48 KB |
| Package | 44-pin QFN (8x8 mm) |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Operating Temperature Range | -40C to +125C (industrial / -E) |
| ADC | 12-bit, 500 ksps, up to 35 channels |
| Internal Op-Amps | 3 |
| Analog Comparators | 4 |
| CTMU (Charge Time Measurement Unit) | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| USB | USB 2.0 Full-Speed On-The-Go |
| DMA Channels | 8 |
| 16-bit Timers | 6 |
| Motor Control PWM | Yes (6 outputs, independent duty) |
| I/O Pins | Up to 35 |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
PIC24EP512GP204-E/ML Pin Configuration
| Pin 1 | RP0/RB0 — Remappable I/O / programming pin |
| Pin 2 | RP1/RB1 — Remappable I/O |
| Pin 3 | RP2/RB2 — Remappable I/O / SDA2 |
| Pin 4 | RP3/RB3 — Remappable I/O / SCL2 |
| Pin 5 | VDD — Core supply voltage |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RP4/RB4 — Remappable I/O |
| Pin 8 | RP5/RB5 — Remappable I/O |
| Pin 9 | RP6/RB6 — Remappable I/O |
| Pin 10 | RP7/RB7 — Remappable I/O |
| Pin 11 | RP8/RB8 — Remappable I/O |
| Pin 12 | RP9/RB9 — Remappable I/O |
| Pin 13 | RP10/RB10 — Remappable I/O |
| Pin 14 | RP11/RB11 — Remappable I/O |
| Pin 15 | VSS — Ground reference |
| Pin 16 | VDD — Core supply voltage |
| Pin 17 | RA0 — Analog/digital I/O |
| Pin 18 | RA1 — Analog/digital I/O |
| Pin 19 | RA2 — Analog/digital I/O |
| Pin 20 | RA3 — Analog/digital I/O |
| Pin 21 | RA4 — Analog/digital I/O |
| Pin 22 | AVDD — Analog supply voltage |
| Pin 23 | AVSS — Analog ground |
| Pin 24 | RA5 — Analog/digital I/O |
| Pin 25 | RA6 — Analog/digital I/O |
| Pin 26 | RA7 — Analog/digital I/O |
| Pin 27 | RA8 — Analog/digital I/O |
| Pin 28 | RA9 — Analog/digital I/O |
| Pin 29 | RA10 — Analog/digital I/O |
| Pin 30 | RA11 — Analog/digital I/O |
| Pin 31 | AVSS — Analog ground |
| Pin 32 | AVDD — Analog supply voltage |
| Pin 33 | OSC1/RA12 — Crystal oscillator input |
| Pin 34 | OSC2/RA13 — Crystal oscillator output |
| Pin 35 | RC12 — Digital I/O |
| Pin 36 | RC13 — Digital I/O |
| Pin 37 | RC14 — Digital I/O |
| Pin 38 | RC15 — Digital I/O |
| Pin 39 | VSS — Ground reference |
| Pin 40 | VDD — Core supply voltage |
| Pin 41 | MCLR — Master clear reset |
| Pin 42 | PGED1/RP12 — Programming data / remappable I/O |
| Pin 43 | PGEC1/RP13 — Programming clock / remappable I/O |
| Pin 44 | EP — Exposed thermal pad (must be soldered) |
Typical Applications
PIC24EP512GP204-E/ML is suitable for 7 applications: 3-Phase BLDC / PMSM Motor Control, Digital Power Conversion (PFC, LLC, Full-Bridge), Industrial Sensor Signal Conditioning, USB Human-Interface Devices (HID / CDC), Audio / DSP Front-End Processing, Automotive Body and Chassis Modules, Medical Patient Monitoring Peripherals.
3-Phase BLDC / PMSM Motor Control
The PIC24EP512GP204-E/ML drives 3-phase brushless DC and permanent-magnet synchronous motors using its dedicated motor-control PWM with up to six independent duty-cycle outputs and quadrature encoder interfaces. With 60 MIPS sustained throughput and 512 KB Flash, the controller can host sensorless Field-Oriented Control (FOC) algorithms, including Clarke-Park transforms, PI current loops, and Space-Vector PWM modulation, without external DSP help. The three internal op-amps and four analog comparators handle current-shunt sensing and back-EMF zero-cross detection on a single die, eliminating an external op-amp array. The 12-bit 500 ksps ADC with 35 channels samples phase currents and DC-bus voltage synchronously to the PWM cycle for low-latency torque response.
Recommended
Digital Power Conversion (PFC, LLC, Full-Bridge)
Digital power supplies from 100 W to 5 kW benefit from the PIC24EP512GP204-E/ML's 60 MIPS core, 512 KB Flash, and PTG peripheral that chains ADC-triggered PWM updates and DMA transfers without CPU intervention. The 12-bit ADC at 500 ksps captures current-mode control waveforms with sub-microsecond latency, while the high-resolution PWM (7.5 ns edge placement) supports phase-shifted full-bridge and LLC resonant topologies. The 48 KB SRAM holds state-machine variables for soft-start, constant-on-time, and adaptive-dead-time algorithms. The 44-QFN (8x8 mm) package exposes enough I/O for multiple feedback loops, and the CTMU peripheral enables temperature-compensated inductor current sensing for telemetry.
Recommended
Industrial Sensor Signal Conditioning
Industrial sensor hubs (strain gauge, RTD, thermocouple, pressure transducer front-ends) leverage the PIC24EP512GP204-E/ML's three internal op-amps and 12-bit 500 ksps ADC to perform analog front-end conditioning on a single chip. The op-amps can be configured as instrumentation amplifiers, charge amplifiers, or transimpedance stages for photodiodes. The CTMU provides time-based temperature and capacitance measurements at sub-percent accuracy using the ADC's precise timing. With 512 KB Flash, designers can host calibration tables, linearization polynomials, and Modbus RTU or CANopen firmware stacks. The -40C to +125C extended temperature rating suits outdoor or factory-floor deployments.
Recommended
USB Human-Interface Devices (HID / CDC)
The PIC24EP512GP204-E/ML integrates USB 2.0 Full-Speed On-The-Go, allowing direct connection to a host PC without an external PHY or transceiver chip. Designers can implement HID class devices (keyboards, mice, custom controls), CDC virtual COM ports, or vendor-specific bulk endpoints for data loggers and laboratory instruments. The 48 KB SRAM buffers USB packets without stall, and the 512 KB Flash stores USB descriptors, HID report maps, and application firmware concurrently. The DMA engine moves USB packets to/from SRAM without CPU wake-up, preserving MIPS budget for application logic. The 44-QFN package fits in compact HID form factors including OEM remote controls.
Recommended
Audio / DSP Front-End Processing
Audio processing for active speakers, automotive headrest speakers, and hearing-aid peripherals leverages the PIC24E core's DSP-friendly instruction set, including MAC operations executed in a single cycle. At 60 MIPS, the PIC24EP512GP204-E/ML implements biquad filtering, dynamics compression, and simple FFT routines for audio spectrum analysis in real time. The 12-bit ADC with 35 channels supports multi-mic beamforming, while the three internal op-amps buffer microphone preamp signals. The 512 KB Flash holds parametric EQ presets, voice prompts, and proprietary codecs. USB OTG enables firmware updates and audio streaming from a connected host.
Recommended
Automotive Body and Chassis Modules
Body control modules, HVAC actuators, and chassis ECUs deploy the PIC24EP512GP204-E/ML for distributed intelligence at -40C to +125C. The 60 MIPS core runs CAN/LIN stacks, sensor fusion routines, and PWM actuator drives concurrently, while the 512 KB Flash stores OBD-II diagnostic firmware and lookup tables. The 44-QFN (8x8 mm) withstands automotive under-hood thermal cycling and supports automated optical inspection on the production line. Designers use the 12-bit ADC for crank position, throttle position, and battery voltage monitoring with the internal op-amps providing active filtering. The PTG coordinates multi-actuator timing without CPU interrupt storms.
Recommended
Medical Patient Monitoring Peripherals
Bedside patient monitors, infusion pump controllers, and portable pulse oximeters integrate the PIC24EP512GP204-E/ML because of its reliable deterministic interrupt latency and DSP throughput. The 60 MIPS core runs SpO2 plethysmographic algorithms, ECG R-wave detection, and respiratory waveform analysis in real time without an external DSP. The CTMU combined with the 12-bit ADC measures reflectance pulse oximeter photodiode currents with nanoampere resolution. USB OTG enables tethered patient data uploads to hospital EMR systems. The -40C to +125C range supports sterilization environments and out-of-body use cases.
Recommended
Recommended Products Summary
Engineering reference data for PIC24EP512GP204-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24EP512GP204-I/ML | PIC24EP512GP204T-E/ML | PIC24EP256GP204-I/ML | PIC24EP128GP204-I/ML | PIC24EP32GP204-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 128 KB (-75%) | 32 KB (-94%) |
| SRAM | 48 KB | 48 KB | 48 KB | 24 KB (-50%) | 16 KB (-67%) | 4 KB (-92%) |
| Maximum CPU Speed | 60 MIPS (E) / 70 MIPS max family | 70 MIPS | 60 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| Internal Op-Amps | 3 | 3 | 3 | 3 | 3 | 3 |
| USB OTG | Yes (USB 2.0 FS) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Extended -40C to +125C temperature grade at 60 MIPS (vs PIC24EP512GP204-I/ML)
- Largest on-chip Flash and SRAM in the 44-QFN PIC24E family (vs PIC24EP256GP204-I/ML)
- Internal op-amps and CTMU on-die eliminate external analog chain (vs PIC24EP32GP204-I/ML)
- Peripheral Trigger Generator (PTG) for CPU-offload event sequencing (vs PIC24EP128GP204-I/ML)
Design Notes
The 44-QFN (8x8 mm) exposed thermal pad (pin 44 / EP) MUST be soldered to a copper pour on the PCB to achieve rated thermal performance. Thermal vias arranged in a 4x4 grid under the EP, filled or tented with solder mask, reduce junction-to-ambient thermal resistance theta_JA to approximately 28 C/W. Estimated: with theta_JA = 28 C/W and 250 mW internal dissipation at 60 MIPS, junction temperature rises 7C above ambient - well within the -40C to +125C extended range, but a derating of 20 percent is recommended for industrial safety margins.
Place 10 uF bulk and 0.1 uF ceramic decoupling capacitors within 2 mm of every VDD/VSS pin pair, with vias to a solid ground plane. Analog supply AVDD requires its own 10 uF + 0.1 uF decoupling pair to AVDD/AVSS and a ferrite bead from VDD if the design uses ADC simultaneously with high-current PWM switching. Route the USB DP/DM lines as a 90-ohm differential pair with length matching within 150 mil to maintain USB compliance. The oscillator crystal (or external clock source) must be placed within 8 mm of OSC1/OSC2 pins with a guard ring tied to analog ground.
Do not exceed VDD = 3.6 V; the PIC24E core is NOT 5 V tolerant on digital I/O. Mixing 5 V peripherals requires level shifters such as TI TXB0104. Confusing the -E (extended -40C to +125C, 60 MIPS) and -I (industrial -40C to +85C, 70 MIPS) suffixes is a frequent footprint-matching error; verify both suffix and full ordering code against the Microchip product page before PCB release. The USB voltage regulator bypass requires a 4.7 uF capacitor on VUSB - omitting this prevents USB enumeration.
Configure unused remappable I/O pins (RP0-RP15) as digital outputs driving low or set as inputs with internal pull-down enabled. Floating inputs increase supply current and can trigger spurious interrupts. For PWM signals longer than 25 mm trace length, place a 22-ohm series resistor near the driver pin to dampen reflections. The op-amp outputs can drive up to 10 mA but shared ADC inputs should be guarded against simultaneous source impedance above 2.5 kohm to avoid ADC gain errors.
Compliance Information
Per Microchip product page, the PIC24EP512GP204-E/ML is RoHS-compliant and lead-free. The part is not AEC-Q100 qualified; for AEC-Q100 automotive grade see PIC24EP512GP204-H/ML high-temperature screening option (not -E).