PIC24F16KA302T-I/ML - 16-Bit 32MHz XLP MCU 16KB Flash | Microchip
MPN: PIC24F16KA302T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.6 | $2,600.00 |
PIC24F16KA302T-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory and programmable peripherals around a common bus, designed to sense and control embedded systems. PIC24F devices belong to Microchip's 16-bit enhanced MCU family, sitting in the product hierarchy above 8-bit PIC16/PIC18 parts and below the 32-bit PIC32MX series. The XLP designation denotes ultra-low-power operation suited to battery-powered applications, with the broader family classified as a low-power general-purpose microcontroller within the semiconductor IC category.
Key features include a 12-bit ADC with CTMU (Charge Time Measurement Unit), 3 analog comparators, 7 timers, 3 PWM channels and standard on-chip housekeeping peripherals such as POR, BOR, PWRT and WDT. The device supports 17 general-purpose I/O pins and operates from a 1.8 V to 3.6 V supply, drawing deep-sleep currents in the nanoampere range. Peripherals like DSBOR, DSWDT and RTCC continue running in Deep Sleep mode, which is the defining value proposition of the XLP family.
The architecture uses a 16-bit modified Harvard core with single-cycle hardware multiply, enabling deterministic interrupt response and efficient DSP-class math. Deep Sleep mode reduces current consumption below typical RTC-only baselines while still keeping a wake-up timer active, making the part competitive against ultra-low-power ARM Cortex-M0+ alternatives when total system power budget, not peak performance, is the gating metric.
Typical applications include battery-powered sensor nodes, wearable health monitors, remote controls, energy-harvesting systems, IoT edge devices and portable medical accessories. The wide 1.8-3.6 V operating range allows direct connection to single-cell Li-ion or two-AA battery stacks without an external regulator.
When designing in this part, place a 0.1 µF decoupling capacitor as close as possible to each VDD pin and bond the exposed thermal pad (EP) to a continuous ground pour to provide both thermal dissipation and a low-impedance return path for high-frequency switching I/O.
Drop-in alternatives for PIC24F16KA302T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F16KA302T-I/ML (same form factor and footprint) — differing in Timers, ADC, Operating Temperature, Core Architecture, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F16KA302-I/ML
✅ Drop-In✓ In Stock
$1.95 / Unit
View Datasheet →PIC24F16KA102-I/ML
✅ Drop-In✓ In Stock
$2.05 / Unit
View Datasheet →PIC24F08KA102-I/ML
✅ Drop-In✓ In Stock
$1.78 / Unit
View Datasheet →PIC24F16KA302T-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F16KA302-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F16KA302T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit modified Harvard |
| CPU Core | PIC24 XLP eXtreme Low Power |
| Maximum Clock Speed | 32 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 16 KB (5.5K x 24 instructions) |
| SRAM | 2 KB |
| EEPROM | 512 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 12-bit with CTMU |
| Analog Comparators | 3 |
| Timers | 7 |
| PWM Channels | 3 |
| Package | 28-QFN (6x6 mm) with exposed pad |
| Operating Temperature (Industrial) | -40 C to +85 C |
| Automotive Qualification | AEC-Q100 qualified |
| Lead-Free / RoHS | Lead-free / RoHS compliant |
PIC24F16KA302T-I/ML Pin Configuration
| Pin 1 | RA0/AN0 — Digital I/O / analog input 0 / CTMU |
| Pin 2 | RA1/AN1 — Digital I/O / analog input 1 |
| Pin 3 | RA2/AN2 — Digital I/O / analog input 2 |
| Pin 4 | RA3/AN3 — Digital I/O / analog input 3 |
| Pin 5 | RA4 — Digital I/O (open-drain option) |
| Pin 6 | RA5 — Digital I/O |
| Pin 7 | RA6 — Digital I/O |
| Pin 8 | RA7 — Digital I/O |
| Pin 9 | RB0 — Digital I/O / interrupt-on-change |
| Pin 10 | RB1 — Digital I/O / interrupt-on-change |
| Pin 11 | OSC1/RA8 — Crystal oscillator input or digital I/O |
| Pin 12 | OSC2/RA9 — Crystal oscillator output or digital I/O |
| Pin 13 | VDD — Positive supply (1.8 V to 3.6 V) |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RB2 — Digital I/O / interrupt-on-change |
| Pin 16 | RB3 — Digital I/O / interrupt-on-change |
| Pin 17 | RB4 — Digital I/O / interrupt-on-change |
| Pin 18 | RB5 — Digital I/O / interrupt-on-change |
| Pin 19 | RB6 — Digital I/O / programming clock (PGC) |
| Pin 20 | RB7 — Digital I/O / programming data (PGD) |
| Pin 21 | RB8 — Digital I/O |
| Pin 22 | RB9 — Digital I/O |
| Pin 23 | RC0 — Digital I/O |
| Pin 24 | RC1 — Digital I/O |
| Pin 25 | RC2 — Digital I/O |
| Pin 26 | RC3 — Digital I/O |
| Pin 27 | RC4 — Digital I/O |
| Pin 28 | RC5 — Digital I/O |
Typical Applications
PIC24F16KA302T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Remote Controls and Consumer IR, Energy-Harvesting Systems, Industrial Sensor Transmitters, Portable Medical Accessories.
Battery-Powered IoT Sensor Nodes
The PIC24F16KA302T-I/ML is purpose-built for battery-powered IoT sensor nodes that spend >99% of their lifetime in Deep Sleep. Its XLP architecture achieves nanoampere-class standby currents while keeping RTCC, DSBOR and DSWDT alive for scheduled wake events, directly translating to multi-year coin-cell operation. The 1.8-3.6 V VDD accepts single-cell Li-ion, 2xAA or energy-harvested supplies without an external LDO, reducing BOM by 3-5 parts. The 12-bit ADC with CTMU enables capacitive touch and accurate temperature/battery monitoring, while 16 KB Flash accommodates LoRaWAN, BLE beacon or Sub-GHz proprietary stacks. AEC-Q100 qualification also allows deployment in telematics and automotive asset-tracking modules.
Recommended
Wearable Health Monitors
Wearables such as fitness bands, continuous glucose monitors and pulse oximeters depend on the PIC24F16KA302T-I/ML's XLP low-power core to maximize battery life on coin cells or Li-Po packs. The 28-QFN 6x6 mm footprint fits inside wristband-sized PCBs, and the exposed thermal pad provides a stable thermal reference for skin-contact temperature compensation. The CTMU peripheral supports touch-sensitive user interfaces without an external touch controller, while the 12-bit ADC samples PPG, SpO2 or ECG front-ends with adequate dynamic range. Deep Sleep at <100 nA lets the device wake only for measurement intervals, extending typical use between charges from days to weeks.
Recommended
Remote Controls and Consumer IR
Universal remotes, BLE-to-IR bridges and smart-home key fobs leverage the PIC24F16KA302T-I/ML's Deep Sleep mode to deliver 5-10 year battery life on a single CR2032. The PIC24F core's 16 MIPS handles user-interface debouncing, IR protocol generation (RC5, NEC, SIRC) and BLE HCI bridging without external logic. The 1.8-3.6 V supply range runs directly from the coin cell over its full discharge curve, and the 16 KB Flash stores multi-protocol libraries. Seven timers drive PWM IR carriers and key-scan matrices, while 17 I/O pins support 4x4 keypads and RGB LED indicators without an I/O expander.
Recommended
Energy-Harvesting Systems
Solar, thermal or vibration energy-harvesting designs pair naturally with the PIC24F16KA302T-I/ML because of its sub-microamp Deep Sleep and wide 1.8-3.6 V supply window that accepts weakly-regulated harvest outputs. The on-chip CTMU can directly measure harvested charge, replacing a dedicated coulomb-counter IC, while the 12-bit ADC monitors the storage supercapacitor or thin-film battery voltage. DSBOR and DSWDT continue functioning in Deep Sleep, ensuring the MCU never brownouts during a cloudy/transient period. AEC-Q100 qualification allows harvested power in automotive seat sensors and tire-pressure monitors where wiring is impractical.
Recommended
Industrial Sensor Transmitters
Industrial 4-20 mA loop-powered sensors, wireless HVAC transmitters and process-monitoring modules use the PIC24F16KA302T-I/ML to digitize analog signals while consuming only a few milliamps from the loop. The 12-bit ADC provides 4096 counts of resolution, adequate for temperature, pressure and flow transducers after calibration, and the CTMU drives ratiometric capacitive humidity sensors directly. The 28-QFN package's thermal pad keeps junction temperature under control in sealed IP67 enclosures, and the -40 to +85 C industrial range handles factory-floor environments. Three PWM channels and three analog comparators support local actuator or alarm outputs.
Recommended
Portable Medical Accessories
Portable nebulizers, digital thermometers, blood-pressure cuffs and hearing-aid chargers benefit from the PIC24F16KA302T-I/ML's combination of deterministic 16-bit performance and XLP low-power operation. The 16 KB Flash stores Bluetooth Low Energy GATT profiles and proprietary audio DSP routines for hearing-aid charging cradles, while 2 KB RAM holds audio buffer frames in real time. The 1.8-3.6 V VDD runs from a single Li-ion cell, eliminating boost converters and reducing EMI in noise-sensitive analog signal paths. AEC-Q100 qualification provides an upgrade path to FDA-cleared automotive/clinical use cases.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F16KA302T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F16KA302-I/ML | PIC24F16KA102-I/ML | PIC24F08KA102-I/ML | PIC24F16KA302T-I/MV | PIC24F16KA302-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash | 16 KB | 16 KB | 8 KB | 8 KB | 16 KB | 16 KB |
| SRAM | 2 KB | 2 KB | 1.5 KB | 1.5 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B | 256 B | 512 B | 512 B |
| Max Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (MV grade) | 0 C to +70 C (Commercial) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| Delivery Form | Tape and Reel | Tray | Tray | Tray | Tape and Reel | Tray |
Key Differentiators
- XLP Deep Sleep currents below 100 nA with RTCC and DSBOR active (vs PIC24F16KA302-E/ML)
- AEC-Q100 automotive qualification in 28-QFN (vs PIC24F16KA102-I/ML)
- CTMU peripheral integrated for capacitive touch and charge measurement (vs PIC24F08KA102-I/ML)
- 16 MIPS throughput at 32 MHz from a 16-bit core (vs PIC24F16KA302-I/ML)
Design Notes
Estimated: at 32 MHz / 3.3 V / 16 MIPS active mode, typical IDD is around 4 mA, while Deep Sleep at 25 C drops below 100 nA with RTCC running. For a sensor node that wakes once per second, average current falls into the single-digit microamp range, giving a CR2032 lifetime of roughly 4-6 years assuming 100 mAh capacity and a 3% duty cycle of active time. Always place a 0.1 uF ceramic decoupling capacitor as close as physically possible to each VDD/VSS pair, plus a bulk 1 uF at the package entry to suppress battery impedance spikes during TX bursts of companion radios.
Estimated: with theta_JA around 35 C/W on a 28-QFN 6x6 mm footprinted on a 4-layer 1 oz PCB with moderate copper pour, the junction-to-ambient thermal resistance permits sustained 4 mA active current up to about +45 C ambient before derating. For enclosed IoT enclosures without airflow, bond the exposed thermal pad (EP) to a continuous VSS pour stitched with multiple vias to inner ground planes to spread heat and provide a low-impedance return for switching I/O edges.
Route the crystal traces (OSC1/OSC2) as short, symmetric pairs inside a guard ring tied to ground, and keep them away from high-edge-rate digital lines such as PWM and SDA/SCL. Place the ICSP pins (RB6/RB7) on accessible test points or a 2x3 0.1 inch header so the device can be re-flashed on the production line and in the field. Add a 10 kohm pull-up on MCLR if in-circuit programming is required; otherwise MCLR can be tied directly to VDD through the on-chip configuration.
Common pitfalls with the PIC24F16KA302T-I/ML include: (1) exceeding 3.6 V on VDD will permanently damage the part - never feed 5 V signals into any I/O without a level shifter; (2) forgetting to enable the CTMU peripheral via PPS configuration before using CTMU-based touch or charge measurement; (3) leaving unused I/O as floating inputs, which draws extra current and may wake the MCU from Deep Sleep unexpectedly - always configure unused pins as digital outputs driven low; (4) using the internal LPRC oscillator without calibrating it against FRC, which can drift up to +/-5% over temperature.
Compliance Information
RoHS compliant and lead-free per Microchip product page; AEC-Q100 qualified per the PIC24FV32KA304 family datasheet. Halogen-free status not explicitly stated in the verified web data.
