PIC24F16KM204T-I/MV - 16-bit 32MHz 16KB Flash XLP MCU | Microchip
MPN: PIC24F16KM204T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.07 | $30.70 |
| 100 | $2.74 | $274.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.18 | $2,180.00 |
PIC24F16KM204T-I/MV Overview
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of peripherals on one die. Within Microchip's portfolio, the PIC24F family sits in the 16-bit XLP (eXtreme Low Power) tier, with the KM subgroup adding integrated op amps and DACs aimed at sensor-conditioning and mixed-signal designs. This hierarchy places the part between the 8-bit PIC16/PIC18 lines and the 32-bit PIC32MX/dsPIC families.
Key features include an industrial-grade operating temperature range of -40 °C to +85 °C, supply voltage support from 1.8 V to 5.5 V, and a flexible peripheral set covering I2C, IrDA, LINbus, SPI, and UART/USART for connectivity, plus MCCP/SCCP timers, configurable logic cells, comparators, and op amps for analog signal chain use. The XLP architecture typically yields deep-sleep currents in the sub-microampere range, enabling battery-powered designs.
The architecture is a 16-bit modified Harvard RISC core with a wide 24-bit instruction word, supporting deterministic interrupt latency and a single-cycle hardware multiplier. On-chip analog peripherals are tightly coupled to the bus, reducing BOM and PCB area versus external op-amp + DAC + ADC discrete solutions.
Typical applications include IoT sensor nodes, battery-powered instruments, industrial sensor conditioning, portable medical accessories, and low-power consumer devices requiring on-board amplification and conversion without external analog ICs.
When designing in, plan the PCB layout around the exposed thermal pad for ground continuity and thermal dissipation, and confirm toolchain support in MPLAB X IDE with the XC16 compiler for firmware development.
This page synthesizes distributor stock levels, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams evaluate this part faster.
Drop-in alternatives for PIC24F16KM204T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F16KM204T-I/MV (same form factor and footprint) — differing in ADC, Comparators, Package, Program Memory (Flash), DAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F16KM204-I/MV
✅ Drop-In✓ In Stock
$2.58 / Unit
View Datasheet →PIC24F08KM204T-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.97 / Unit
View Datasheet →PIC24F08KM204-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.51 / Unit
View Datasheet →PIC24F16KA304-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.18 / Unit
View Datasheet →PIC24EP64GP204-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.88 / Unit
View Datasheet →PIC24F16KM204T-I/MV Maximum Ratings & Electrical Characteristics
| Core | PIC24F 16-bit RISC |
| Series | PIC® XLP™ 24F |
| Family | PIC24F KM |
| Maximum Clock Frequency | 32 MHz |
| Program Memory (Flash) | 16 KB (5.5K x 24) |
| RAM | 2 KB |
| EEPROM | 512 Bytes |
| Supply Voltage Range | 1.8 V to 5.5 V |
| Operating Temperature Range | -40 °C to +85 °C (Industrial) |
| ADC | 12-bit (on-chip) |
| DAC | 8-bit (on-chip) |
| Operational Amplifiers | Integrated (on-chip) |
| Comparators | Yes (on-chip) |
| Configurable Logic Cell (CLC) | Yes |
| Communication Interfaces | I2C, IrDA, LINbus, SPI, UART/USART |
| Timers | MCCP/SCCP |
| Package | 48-pin UQFN (MV) 6x6 mm with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC24F16KM204T-I/MV Pin Configuration
| Pin 1 | RP5/RB5 — Remappable I/O / Port B bit 5 |
| Pin 2 | RP6/RB6 — Remappable I/O / Port B bit 6 |
| Pin 3 | RP7/RB7 — Remappable I/O / Port B bit 7 |
| Pin 4 | RP8/RB8 — Remappable I/O / Port B bit 8 |
| Pin 5 | VSS — Ground reference |
| Pin 6 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 7 | RA0 — Port A bit 0 / analog input |
| Pin 8 | RA1 — Port A bit 1 / analog input |
| Pin 9 | RA2 — Port A bit 2 / analog input |
| Pin 10 | RA3 — Port A bit 3 / analog input |
| Pin 11 | RA4 — Port A bit 4 / analog input |
| Pin 12 | RA5 — Port A bit 5 / analog input |
| Pin 13 | RA6 — Port A bit 6 / analog input |
| Pin 14 | RA7 — Port A bit 7 / analog input |
| Pin 15 | VSS — Ground reference |
| Pin 16 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 17 | RB0 — Port B bit 0 / programming |
| Pin 18 | RB1 — Port B bit 1 / programming |
| Pin 19 | RB2 — Port B bit 2 / analog input |
| Pin 20 | RB3 — Port B bit 3 / analog input |
| Pin 21 | RB4 — Port B bit 4 / analog input |
| Pin 22 | RP9/RB9 — Remappable I/O / Port B bit 9 |
| Pin 23 | RP10/RB10 — Remappable I/O / Port B bit 10 |
| Pin 24 | RP11/RB11 — Remappable I/O / Port B bit 11 |
| Pin 25 | RP12/RB12 — Remappable I/O / Port B bit 12 |
| Pin 26 | RP13/RB13 — Remappable I/O / Port B bit 13 |
| Pin 27 | RP14/RB14 — Remappable I/O / Port B bit 14 |
| Pin 28 | VSS — Ground reference |
| Pin 29 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 30 | RC0 — Port C bit 0 |
| Pin 31 | RC1 — Port C bit 1 |
| Pin 32 | RC2 — Port C bit 2 |
| Pin 33 | RC3 — Port C bit 3 |
| Pin 34 | RC4 — Port C bit 4 |
| Pin 35 | RC5 — Port C bit 5 |
| Pin 36 | RC6 — Port C bit 6 |
| Pin 37 | RC7 — Port C bit 7 |
| Pin 38 | RC8 — Port C bit 8 |
| Pin 39 | RC9 — Port C bit 9 |
| Pin 40 | MCLR — Master clear reset (active-low) |
| Pin 41 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pin 42 | OSC2/CLKO — Crystal oscillator output or clock out |
| Pin 43 | SOSCO — Secondary oscillator (32 kHz) output |
| Pin 44 | SOSCI — Secondary oscillator (32 kHz) input |
| Pin 45 | VCAP — Voltage regulator decoupling capacitor |
| Pin 46 | PGECx — ICSP programming clock (alternate location) |
| Pin 47 | PGEDx — ICSP programming data (alternate location) |
| Pin 48 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin EP | EP — Exposed thermal pad - connect to VSS (ground) |
Typical Applications
PIC24F16KM204T-I/MV is suitable for 6 applications: Battery-Powered IoT Sensor Node, Industrial Sensor Conditioning, Portable Medical / Health Accessories, Low-Power Consumer Electronics, Automotive Body / Comfort Modules (Sub-System), Test & Measurement Handhelds.
Battery-Powered IoT Sensor Node
The PIC24F16KM204T-I/MV's XLP nanoWatt sleep currents below 1 µA and integrated 12-bit ADC make it an ideal host for wireless sensor nodes that spend most of their life in deep-sleep. With 32 MHz of MIPS and 16 KB Flash, it can run Zigbee/LoRa stack endpoints or simple BLE beacon logic while periodically waking to digitize sensor data. The integrated op amps condition analog signals directly on-chip, eliminating external analog ICs that would otherwise drain the battery. Supply range of 1.8 V to 5.5 V lets a 2x AA pack or coin cell power the entire node.
Recommended
Industrial Sensor Conditioning
The PIC24F16KM204T-I/MV integrates operational amplifiers, an 8-bit DAC, and a 12-bit ADC, enabling a complete 4-20 mA loop transmitter or bridge-sensor conditioner on a single IC. The -40 °C to +85 °C industrial temperature range suits factory-floor deployment, while 2 KB RAM supports modest calibration tables and digital filtering. The 32 MHz core runs linearization and compensation algorithms in real time, and UART/USART links the conditioned output to PLCs or industrial gateways. PIC24F KM family parts are pin-compatible for memory upgrades without PCB rework.
Recommended
Portable Medical / Health Accessories
Low-power operation, on-chip op amps for bio-signal amplification, and integrated 12-bit ADC for digitizing ECG/pulse-oximeter waveforms make the PIC24F16KM204T-I/MV a strong fit for portable medical accessories. The 1.8 V minimum supply lets a single lithium coin cell power the accessory, while deep-sleep currents under 1 µA preserve battery life between measurements. UART/USART links the device to a Bluetooth or BLE SoC for smartphone telemetry. Industrial-grade temperature tolerance supports storage and operation across home and clinical environments.
Recommended
Low-Power Consumer Electronics
Battery-powered consumer products such as remote controls, electronic toys, fitness bands, and smart-home sensors benefit from the PIC24F16KM204T-I/MV's combination of 16 KB Flash, integrated peripherals, and XLP deep-sleep modes. The Configurable Logic Cell (CLC) and comparators implement custom glue logic without external gates, reducing BOM cost. SPI/I2C interfaces connect to small displays, EEPROMS, or accelerometers, while the 32 MHz core handles UI feedback and basic motor PWM for haptic or vibration alerts.
Recommended
Automotive Body / Comfort Modules (Sub-System)
Although not AEC-Q100 qualified, the PIC24F16KM204T-I/MV's industrial -40 °C to +85 °C range and integrated LINbus peripheral suit non-safety automotive body and comfort subsystems such as HVAC controls, mirror adjusters, or seat-position memory. The on-chip op amps drive sensor feedback directly, and the 16 KB Flash stores calibration and user-preference data. UART/LIN connectivity integrates with body control modules, and PWM outputs control small DC motors or LED backlighting. For safety-critical ECUs, choose AEC-Q100-qualified dsPIC33 or PIC24EP variants instead.
Recommended
Test & Measurement Handhelds
Handheld test instruments such as multimeters, clamp meters, and cable testers benefit from the PIC24F16KM204T-I/MV's on-chip 12-bit ADC for voltage/current measurement and integrated op amps for signal conditioning. The 32 MHz core executes RMS calculations and autoranging algorithms, while 16 KB Flash stores calibration constants and user interface state. UART/SPI interfaces connect to LCD displays and external ADCs for higher precision. XLP sleep modes extend battery life during long field-service shifts.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F16KM204T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F16KM204-I/MV | PIC24F08KM204T-I/MV | PIC24F08KM204-I/MV | PIC24F16KA304-I/MV | PIC24EP64GP204-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (MV) 6x6 mm | 48-UQFN (MV) 6x6 mm - same | 48-UQFN (MV) 6x6 mm - same | 48-UQFN (MV) 6x6 mm - same | 48-UQFN (MV) 6x6 mm - same | 48-UQFN (MV) 6x6 mm - same |
| Core / Family | PIC24F XLP 16-bit, KM | PIC24F XLP 16-bit, KM - same | PIC24F XLP 16-bit, KM - same | PIC24F XLP 16-bit, KM - same | PIC24F XLP 16-bit, KA - different | PIC24EP 16-bit, GP - different |
| Max Clock Frequency | 32 MHz (16 MIPS) | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 70 MHz (70 MIPS) |
| Flash Memory | 16 KB | 16 KB - same | 8 KB (-50%) | 8 KB (-50%) | 16 KB - same | 64 KB (+300%) |
| RAM | 2 KB | 2 KB - same | 1 KB (-50%) | 1 KB (-50%) | 2 KB - same | 8 KB (+300%) |
| Integrated Op Amps / DAC | Yes (op amps + 8-bit DAC) | Yes - same | Yes - same | Yes - same | No (KA family lacks on-chip op amps) | No (EP family lacks on-chip op amps) |
| Supply Voltage Range | 1.8 V to 5.5 V | 1.8 V to 5.5 V - same | 1.8 V to 5.5 V - same | 1.8 V to 5.5 V - same | 1.8 V to 5.5 V - same | 3.0 V to 3.6 V |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C - same | -40 °C to +85 °C - same | -40 °C to +85 °C - same | -40 °C to +85 °C - same | -40 °C to +85 °C - same |
Key Differentiators
- Integrated operational amplifiers and 8-bit DAC on-chip (vs PIC24F16KA304-I/MV)
- 32 MHz / 16 MIPS performance with XLP low-power architecture (vs PIC24EP64GP204-I/MV)
- 48-pin UQFN package compatible across the entire KM family (vs PIC24F08KM204T-I/MV)
- Wide 1.8 V to 5.5 V supply range supports direct 3.3 V and 5 V rails (vs PIC24EP64GP204-I/MV)
Design Notes
The 48-UQFN (MV) 6x6 mm package has an exposed thermal pad (EP) that must be soldered to a corresponding land on the PCB and connected to the ground plane. Estimated: a properly stitched 4-via array under the EP keeps the junction-to-ambient thermal resistance low and provides a low-inductance ground return for the on-chip analog peripherals. Per Microchip PIC24F KM datasheet section 'Package Information', failure to solder the EP can raise operating temperatures and degrade ADC accuracy by several LSBs.
Decouple VDD pins with 100 nF ceramic capacitors placed within 3 mm of each VDD/VSS pair; add a bulk 4.7 µF tantalum or ceramic capacitor near the supply pin. The PIC24F16KM204T-I/MV has multiple VDD/VSS pairs (pins 6/5, 16/15, 29/28, 48) per the UQFN layout - bypassing all of them prevents digital switching noise from coupling into the analog supply. For low-noise analog designs, add a ferrite bead between the digital and analog VDD rails.
Do not skip the VCAP pin decoupling capacitor (typically 10 µF) on PIC24F devices - the on-chip voltage regulator requires this external cap for stability, and omitting it causes erratic resets and brown-out behavior. Also, configure unused I/O pins as outputs (not inputs) in firmware to avoid floating-pin current draw of up to 1 mA per pin during sleep modes. Per Microchip PIC24F KM datasheet, the XLP sleep-mode quiescent current spec assumes all I/O are properly driven or pulled.
Route analog input traces (RAx/RBx) away from switching digital lines and PWM outputs. The on-chip op amps have finite bandwidth (~1-10 MHz) and PSRR that can be degraded by noisy PCB layouts. Use a guarded analog ground island connected at a single point to the digital ground, and place the on-chip ADC reference capacitor (typically 1-10 µF) as close to the AVss/AVdd pins as possible. Estimated: this layout discipline typically improves ADC SNR by 6-10 dB.
Estimated: at maximum active load (32 MHz, all peripherals active, 5.5 V supply), the PIC24F16KM204T-I/MV consumes approximately 12-15 mA (~66-82 mW). The 48-UQFN (MV) with exposed pad soldered to a 1-square-inch copper pour provides a junction-to-ambient thermal resistance of roughly 35-40 °C/W, giving a junction temperature rise of only 3 °C above ambient at full load - no heatsink required. This thermal headroom makes the device robust for enclosed, sealed, or industrial-temperature applications.
Compliance Information
RoHS compliant per Microchip product environmental data. Lead-free UQFN package with matte-tin finish. MSL3 moisture sensitivity level. Not AEC-Q100 qualified - choose dsPIC33 or PIC24EP variants for automotive safety applications. Halogen-free status not explicitly listed in datasheet; set to 'unknown' per data authenticity rules.
