PIC24F32KA301-E/SO - 16-bit 32MHz XLP MCU 32KB Flash SOIC-20 | Microchip
MPN: PIC24F32KA301-E/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.32 | $4.32 |
| 10 | $3.89 | $38.90 |
| 100 | $3.42 | $342.00 |
| 500 | $2.96 | $1,480.00 |
| 1,000 | $2.61 | $2,610.00 |
PIC24F32KA301-E/SO Overview
A 16-bit microcontroller (MCU) is an embedded processor with a 16-bit data path, sitting between 8-bit MCUs (lower cost, lower performance) and 32-bit MCUs (higher performance, higher cost). 16-bit MCUs occupy the power-management sweet spot for applications requiring real-time deterministic peripherals (12-bit ADC, comparators, timers, RTCC), more code space than 8-bit parts, and lower cost than Cortex-M0+ alternatives. Within the taxonomy, the PIC24F32KA301 belongs to the PIC24 family (16-bit), the PIC24F sub-family (Flash, low-power), the PIC24FKA series (XLP nano-watt), and ultimately the broader MCU -> microcontroller -> embedded processor -> semiconductor hierarchy.
Key features include XLP nanoWatt technology with Deep Sleep mode currents in the nanoamp range, RTCC, DSBOR (Deep Sleep Brown-Out Reset), and DSWDT (Deep Sleep Watchdog Timer) that remain active in Deep Sleep for industry-leading low power performance. The device supports 3V and 5V operation, includes a 12-bit A/D converter with CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, multiple UART/SPI/I2C peripherals, and up to 18 I/O pins. The E suffix indicates the -40C to +125C industrial/automotive temperature range.
Architecturally, the PIC24F32KA301 uses a modified Harvard architecture with separate program and data buses, a 16-bit instruction word, and a wide variety of low-power modes. The XLP technology integrates Deep Sleep peripherals (DSBOR, DSWDT, RTCC) that operate below 1 uA, enabling years of battery life from a single coin cell in sleep-dominant applications such as wireless sensor nodes, utility metering, and IoT edge devices.
Typical applications include battery-powered IoT sensor endpoints, low-energy wireless sensor nodes, medical wearable monitors, portable instrumentation, and remote controls. The wide temperature range also supports industrial sensor interface modules and automotive body electronics.
When designing with the PIC24F32KA301-E/SO, consider the trade-off between pin count (20-SOIC limits I/O to ~18) and feature set. For designs requiring more I/O or larger memory, the PIC24F32KA302/304 family or dsPIC33 alternatives are pin-compatible migration paths within the same footprint family.
This page synthesizes distributor stock and pricing, drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone, providing an engineering-oriented decision resource for component selection.
Drop-in alternatives for PIC24F32KA301-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F32KA301-E/SO (same form factor and footprint) — differing in ADC, Package, Core Architecture, MSL Level, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F32KA301-I/SO
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC24F32KA301T-I/SO
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC24F16KA301-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F16KA301T-I/SO
✅ Drop-In✓ In Stock
$1.48 / Unit
View Datasheet →PIC24F32KA302-I/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F32KA301-E/SO Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Series | PIC® XLP™ 24F |
| Sub-series | PIC24FKA (XLP nanoWatt) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Flash Program Memory | 32 KB (11K x 24 instructions) |
| RAM | 2 KB |
| EEPROM | 512 B |
| ADC | 12-bit, with CTMU |
| I/O Pins | 18 (approx.) |
| Operating Voltage | 1.8 V to 5.5 V (3V and 5V operation) |
| Operating Temperature Range | -40C to +125C (E suffix) |
| Package | 20-pin SOIC (SO) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 1 (unlimited) |
| Lead-Free | Yes |
PIC24F32KA301-E/SO Pin Configuration
| Pin 1 | MCLR/VPP — Master Clear (Reset) input / Programming voltage |
| Pin 2 | RA0 — Port A bit 0 (analog/digital I/O) |
| Pin 3 | RA1 — Port A bit 1 (analog/digital I/O) |
| Pin 4 | RA2 — Port A bit 2 (analog/digital I/O) |
| Pin 5 | VDD — Positive supply voltage |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RA3 — Port A bit 3 (analog/digital I/O) |
| Pin 8 | RB0 — Port B bit 0 (analog/digital I/O, PGED) |
| Pin 9 | RB1 — Port B bit 1 (analog/digital I/O, PGEC) |
| Pin 10 | RB2 — Port B bit 2 (analog/digital I/O) |
| Pin 11 | RB3 — Port B bit 3 (analog/digital I/O) |
| Pin 12 | RB4 — Port B bit 4 (analog/digital I/O) |
| Pin 13 | RB5 — Port B bit 5 (analog/digital I/O) |
| Pin 14 | RB6 — Port B bit 6 (analog/digital I/O) |
| Pin 15 | RB7 — Port B bit 7 (analog/digital I/O) |
| Pin 16 | RC0 — Port C bit 0 (analog/digital I/O, OSC2) |
| Pin 17 | RC1 — Port C bit 1 (analog/digital I/O, OSC1) |
| Pin 18 | RC2 — Port C bit 2 (analog/digital I/O) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage |
Typical Applications
PIC24F32KA301-E/SO is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Portable Medical Wearable Monitors, Industrial Sensor Interface Modules, Remote Controls and Wireless Key Fobs, Smart Metering Endpoints (Gas/Water/Electric), Automotive Body Electronics and HMI.
Battery-Powered IoT Sensor Nodes
The PIC24F32KA301-E/SO is well matched to battery-powered IoT sensor nodes because of its XLP nanoWatt Deep Sleep mode with RTCC, DSBOR, and DSWDT that remain active in Deep Sleep at currents below 100 nA. The 32 KB Flash and 2 KB SRAM accommodate Zigbee, LoRa, or BLE stack sensor application code plus user application logic, while the 12-bit ADC with CTMU supports capacitive touch sensing and precision analog measurement. Placed as the central MCU on a sensor PCB with coin-cell or 2xAA battery, the device delivers years of service life in duty-cycled wake/sleep operation. The wide 1.8V to 5.5V VDD range simplifies power supply design for both 3V coin cells and 3.7V Li-ion chemistries without external level translation.
Recommended
Portable Medical Wearable Monitors
The PIC24F32KA301-E/SO suits portable medical wearable monitors due to its low active current at 16 MIPS, wide 1.8V-5.5V supply range, and E-temperature grade to +125C for skin-contact thermal margin. The 12-bit ADC captures biopotential signals (heart rate, SpO2 LED current sensing), while the CTMU enables capacitive touch for user input on the wearable surface. EEPROM (512 B) stores calibration and patient identifier data without flash wear. Compared to 32-bit Cortex-M0+ alternatives, the PIC24F32KA301-E/SO consumes less sleep current and is more cost-effective for non-USB wearable designs operating under 32 KB code size.
Recommended
Industrial Sensor Interface Modules
The PIC24F32KA301-E/SO is appropriate for industrial 4-20 mA loop-powered sensor transmitters and process instrumentation because of its -40C to +125C operating range, robust 12-bit ADC for analog sensor signal conditioning, and integrated CTMU for precise time-based measurements. The UART, SPI, and I2C peripherals support Modbus RTU, HART, and proprietary fieldbus protocols. Compared to 8-bit PIC16 alternatives, the 16-bit PIC24F core delivers more MIPS for sensor linearization and digital filtering algorithms. EEPROM stores calibration coefficients and unit serial numbers in the field.
Recommended
Remote Controls and Wireless Key Fobs
The PIC24F32KA301-E/SO is a strong fit for remote controls and wireless key fobs because of its nanoWatt XLP sleep modes that extend coin-cell operation to multiple years, integrated RTCC for wake-on-timer, and 32 KB Flash for protocol stacks (proprietary RF, BLE beaconing). The 12-bit ADC reads battery voltage and user potentiometers, while CTMU supports capacitive touch buttons replacing mechanical keys. The 20-SOIC footprint is small enough for key fob PCBs while remaining hand-solderable for prototypes. The E-temperature grade supports automotive fob thermal extremes from cold-start to sun-heated dashboards.
Recommended
Smart Metering Endpoints (Gas/Water/Electric)
The PIC24F32KA301-E/SO is well-suited for smart utility metering endpoints because of its XLP nanoWatt Deep Sleep with active RTCC that allows 15+ year battery life on a single D-cell or lithium primary cell. The 12-bit ADC with CTMU measures pulse output from mechanical meter registers or interfaces to solid-state flow sensors. EEPROM stores consumption logs and tampering events without wearing the Flash. The wide 1.8V-5.5V supply accommodates battery droop over service life. Integrated DSBOR and DSWDT survive brown-out conditions during battery swap or cold-temperature operation.
Recommended
Automotive Body Electronics and HMI
The PIC24F32KA301-E/SO operates across -40C to +125C automotive temperature extremes and supports body electronics applications such as interior lighting controllers, seat position memory, and HVAC blend door actuators. The 12-bit ADC reads potentiometer or Hall sensor inputs, while PWM outputs drive LED drivers and small DC motors. The 32 KB Flash accommodates CANLIN driver and LIN basic transport stack software plus diagnostic routines. Compared to higher-spec dsPIC33 parts, the PIC24F32KA301-E/SO is cost-optimized for body-domain modules where computational throughput is modest.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F32KA301-E/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F32KA301-I/SO | PIC24F32KA301T-I/SO | PIC24F16KA301-I/SO | PIC24F16KA301T-I/SO | PIC24F32KA302-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-SOIC | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) |
| Flash Memory | 32 KB | 32 KB | 32 KB | 16 KB | 16 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| CTMU (Touch/Time) | Yes | Yes | Yes | Yes | Yes | Yes |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
Key Differentiators
- Wider temperature range (-40C to +125C E-grade) versus I-grade alternatives (vs PIC24F32KA301-I/SO)
- Larger Flash (32 KB vs 16 KB) within the same XLP family (vs PIC24F16KA301-I/SO)
- Integrated CTMU and EEPROM on a 16-bit XLP core (vs 8-bit PIC16F1xxx MCU 50% scale alternative)
- PIC24F XLP nanoWatt Deep Sleep with active RTCC versus generic 16-bit MCU (vs NXP LPC1500 or STM32L0 32-bit alternative)
Design Notes
The PIC24F32KA301-E/SO supports multiple low-power modes (Sleep, Deep Sleep, Retention Sleep) with currents ranging from ~20 uA/MIPS in active to nanoamp-level in Deep Sleep with RTCC. For battery-powered designs, use Deep Sleep mode with RTCC wake to maximize coin-cell life. Configure the DSBOR and DSWDT to remain enabled in Deep Sleep to protect against firmware lockup during sleep. The 1.8V to 5.5V VDD range eliminates the need for level translators when interfacing 3.3V and 5V peripherals. Place a 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair on the PCB.
The PIC24F32KA301-E/SO E temperature grade operates -40C to +125C. At maximum active MIPS (~16 MIPS) and 5.5V supply, the active current is in the single-digit mA range, so self-heating is minimal. However, in sealed enclosures with limited airflow or in hot automotive environments, ensure the ambient temperature stays below 125C including internal enclosure heating. For continuous high-duty-cycle operation, route a small copper pour to the package VDD pins to spread heat. Theta_JA for the 20-SOIC is approximately 70-80 C/W - well above the typical temperature rise at expected operating currents.
Place the IC close to the ICSP programming connector (PGED on RB0, PGEC on RB1) to keep programming trace lengths under 50 mm for robust in-circuit programming. Keep the analog ADC inputs (RAx pins) away from switching regulator inductor traces and digital clock lines to minimize coupled noise. Add a ground plane under the MCU to provide a low-impedance return path and reduce EMI. For CTMU capacitive touch applications, the touch electrode traces should be guarded by a grounded trace and shielded from adjacent digital signals.
Estimated: When migrating from PIC24F32KA301 to PIC24F16KA301, code size must shrink below 16 KB or the bootloader/linker will fail at build. The E temperature suffix is required for automotive designs above +85C; using an I (industrial) suffix part in an automotive environment risks field failures. Configure the Configuration Words (FBS, FSS, FGS) before programming Flash to enable proper code protection. The MCLR pin requires a pull-up resistor (typically 10 kOhm) for normal operation; floating MCLR can cause spurious resets. Always verify the part ID register matches expected silicon revision to avoid counterfeit parts.
Compliance Information
RoHS and lead-free compliant per Microchip product page. E temperature suffix extends to +125C but is not AEC-Q100 qualified; for AEC-Q100 Grade 0 automotive qualification consult Microchip automotive-grade product line.
