PIC24FJ256GA610T-I/BG - 16-bit 32MHz 256KB Flash MCU 121-TFBGA
MPN: PIC24FJ256GA610T-I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.56 | $75.60 |
| 100 | $6.78 | $678.00 |
| 500 | $6.04 | $3,020.00 |
| 1,000 | $5.36 | $5,360.00 |
PIC24FJ256GA610T-I/BG Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically Flash), data memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and GPIO onto one silicon die. The PIC24F family sits in the 16-bit MCU segment between Microchip's 8-bit PIC16/PIC18 lines and its higher-end 32-bit PIC32MX/ME families, balancing code density, deterministic interrupt latency, and low power consumption. Within Microchip's product taxonomy, a PIC24F MCU belongs to the broader category of microcontrollers -> embedded processors -> semiconductor ICs, and is widely deployed where 8-bit MCUs lack performance and 32-bit MCUs are over-spec.
Key features of the PIC24FJ256GA610T-I/BG include 256KB Flash with dual-partition Live Update capability, 32KB RAM, 16 MIPS performance from the 32MHz core, six UART modules, three SPI modules, three I2C modules, two IrDA interfaces, six PWM channels, five timers, eight DMA channels, three analog comparators, and a Charge Time Measurement Unit (CTMU) for capacitive touch sensing. Configurable Logic Cells (CLC) and Peripheral Pin Select (PPS) provide flexible routing of digital functions to physical pins.
The device is fabricated on an eXtreme Low Power CMOS process and supports deep sleep, sleep, idle and doze operating modes to extend battery life. Integrated peripherals such as Real-Time Clock and Calendar (RTCC), brown-out reset (BOR), power-on reset (POR), watchdog timer (WDT), and a 16-channel 12-bit ADC (with 200K samples/sec throughput) provide a near-complete system-on-chip implementation. The 121-TFBGA package exposes 100+ GPIO lines for maximum peripheral connectivity in compact industrial designs.
Typical applications include industrial control and HMI, USB device/host bridges, graphic LCD displays, low-power sensor hubs, building automation controllers, medical patient monitors, automotive body and infotainment modules, and capacitive touch user interfaces. The combination of Live Update Flash and CTMU makes it especially attractive for firmware over-the-air capable IoT nodes and touch-panel appliances.
When designing with this device, pay close attention to BGA PCB layout - the 0.8mm ball pitch requires laser-drilled or micro-via PCB technology with controlled-impedance traces. Use PPS to remap peripherals and avoid I/O conflicts, and remember that Live Update firmware upgrades require the dual-partition Flash to be configured properly at compile time.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical PCB design notes not found in the manufacturer datasheet alone, giving engineers a one-stop procurement and design reference.
Drop-in alternatives for PIC24FJ256GA610T-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ256GA610T-I/BG (same form factor and footprint) — differing in Package, ADC, Program Memory (Flash), Operating Temperature, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ256GA610-I/BG
✅ Drop-In✓ In Stock
$3.41 / Unit
View Datasheet →PIC24FJ256GA610T-E/BG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FJ1024GB610-I/BG
✅ Drop-In✓ In Stock
$7.44 / Unit
View Datasheet →PIC24FJ1024GA610T-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.85 / Unit
View Datasheet →PIC24FJ128GA610-I/PT
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →PIC24FJ128GA610-E/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.95 / Unit
View Datasheet →PIC24FJ256GA610T-I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit RISC |
| CPU Core Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data Memory (SRAM) | 32 KB |
| Flash Type | Dual-partition Live Update capable |
| Operating Voltage | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 121-TFBGA (10x10 mm, 0.8 mm pitch) |
| ADC | 12-bit, up to 16 channels, 200K samples/sec |
| DMA Channels | 8 |
| UART Modules | 6 |
| SPI Modules | 3 |
| I2C Modules | 3 |
| IrDA Interfaces | 2 |
| PWM Channels | 6 |
| 16-bit Timers | 5 |
| Analog Comparators | 3 |
| CTMU Channels | Yes (Capacitive Touch) |
| CLC | Configurable Logic Cells |
| PPS | Peripheral Pin Select supported |
| Watchdog Timer | Yes |
| RTCC | Real-Time Clock and Calendar |
| Brown-out Reset | Yes |
| Power-on Reset | Yes |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 |
| Series | PIC24FJ256GA610 |
PIC24FJ256GA610T-I/BG 121-tfbga (10x10 mm, 0.8 mm pitch) Pin Configuration Guide
Pin configuration for PIC24FJ256GA610T-I/BG (121-tfbga (10x10 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24FJ256GA610T-I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24FJ256GA610T-I/BG is suitable for 7 applications: Industrial Control & HMI, Capacitive Touch User Interface, USB Device / Host Bridge, Medical Patient Monitoring, Building Automation Controller, Automotive Body & Infotainment Module, Low-Power Sensor Hub / IoT Edge Node.
Industrial Control & HMI
The PIC24FJ256GA610T-I/BG fits industrial control and HMI panels because its 32MHz/16 MIPS core drives graphic LCDs and touch interfaces while CTMU enables capacitive buttons without a separate touch IC. The 256KB dual-partition Flash supports Live Update firmware over RS-485 or Ethernet in field-deployed controllers, eliminating downtime during bug fixes. With six UART, three SPI and three I2C plus eight DMA channels, the MCU can manage sensor arrays, motor drivers and fieldbus gateways concurrently. The -40C to +85C industrial temperature range handles factory floor thermal stress.
Recommended
Capacitive Touch User Interface
The PIC24FJ256GA610T-I/BG's integrated CTMU provides hardware-timed capacitance measurement that scans multiple touch electrodes with deterministic latency, ideal for white goods, appliance and consumer-electronics touch panels. Configurable Logic Cells (CLC) and Peripheral Pin Select (PPS) allow designers to remap scan timing to any GPIO, enabling PCB routing flexibility for unusual panel geometries. The 100+ GPIOs in the 121-TFBGA package can drive 30+ touch keys plus an LCD without external expanders, reducing BOM cost and improving EMI immunity versus discrete touch ASICs.
Recommended
USB Device / Host Bridge
Although the GA610 lacks an integrated USB controller, the PIC24FJ256GA610T-I/BG is frequently used as the host processor paired with the pin-compatible PIC24FJ1024GB610 in dual-MCU USB bridge designs, where it handles application logic and the GB610 manages USB protocol stacks. The 32MHz core, 32KB SRAM and dual-partition Flash provide ample bandwidth for CDC, HID and Mass Storage class implementations, while six UARTs bridge USB to RS-232/RS-485 industrial gear. The BGA package keeps board area minimal for dongle-form-factor products.
Recommended
Medical Patient Monitoring
The PIC24FJ256GA610T-I/BG's 12-bit ADC at 200K samples/sec captures multi-channel biopotential signals (ECG, SpO2, temperature) with adequate dynamic range for diagnostic peripherals, while its eXtreme Low Power sleep modes extend battery life in portable patient monitors. CTMU supports touch-based user interfaces on medical equipment housings that require IP-rated sealed front panels. The -40C to +85C industrial range and Bor/POR/WDT supervisor functions meet IEC 60601 patient-safety reliability guidelines when paired with appropriate isolation.
Recommended
Building Automation Controller
In BACnet, Modbus and KNX building controllers, the PIC24FJ256GA610T-I/BG's six UARTs manage multiple isolated fieldbus channels, while DMA offloads protocol parsing from the CPU, leaving headroom for HVAC control loops and scheduling logic. The dual-partition Flash allows secure over-the-air firmware updates via Ethernet or Wi-Fi co-processors, critical for installed-base devices that cannot be easily returned for service. The wide operating voltage range (2.0-3.6V) tolerates noisy 24V industrial supplies when paired with a TVS-protected LDO.
Recommended
Automotive Body & Infotainment Module
The PIC24FJ256GA610T-I/BG powers body control modules, HVAC panels and infotainment secondary displays where 32MHz and 256KB Flash are sufficient for LIN/CAN gateway tasks and graphic rendering on small TFTs. CTMU provides robust touch input on dashboard controls, and the dual-partition Flash enables OEM firmware reflashing over the vehicle network without bricking modules. For under-hood applications, designers select the -40C to +125C extended-temperature sibling such as PIC24FJ256GA610T-E/BG for the same pinout.
Recommended
Low-Power Sensor Hub / IoT Edge Node
Battery-powered IoT edge nodes leverage the PIC24FJ256GA610T-I/BG's eXtreme Low Power sleep modes (sub-uA) combined with RTCC wake-up to duty-cycle sensor sampling and LoRa/Sigfox/sub-GHz radio transmissions. The 32KB SRAM buffers multiple sensor frames before transmission, and DMA moves I2C/SPI sensor data without waking the CPU. The 256KB Flash stores over-the-air firmware images for dual-partition Live Update, eliminating the need for physical service calls across geographically distributed sensor fleets.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ256GA610T-I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ256GA610-I/BG | PIC24FJ256GA610T-E/BG | PIC24FJ1024GB610-I/BG | PIC24FJ1024GA610T-I/PT | PIC24FJ128GA610-I/PT | PIC24FJ128GA610-E/BG |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same | 121-TFBGA - same |
| Core Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 1024 KB (+300%) | 1024 KB (+300%) | 128 KB (-50%) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB Controller | No | No | No | Yes (USB 2.0 FS Host/Device/OTG) | No | No | No |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
| Live Update Flash | Yes (dual-partition) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Dual-partition Live Update Flash for firmware-over-the-air (vs PIC24FJ128GA610-I/PT)
- Industrial temperature range with same die as automotive sibling (vs PIC24FJ256GA610T-E/BG)
- 100+ GPIO in compact 10x10mm BGA (vs PIC24FJ256GA110T-I/PF)
Design Notes
The 121-TFBGA package uses a 0.8mm ball pitch. The PCB must use laser-drilled stacked micro-vias (typical 0.1mm drill on 0.2mm pad) or sequential build-up technology for fan-out; standard 0.3mm mechanical drills will not fit between balls. Plan for at least a 4-layer stack-up with a continuous ground plane under the BGA for power integrity and thermal dissipation, and use 0.4mm via-in-pad with filled-and-capped plating for the inner-row balls to escape the dense array.
Estimated: with the 32MHz core toggling up to 100+ I/O lines, total switching current peaks can reach 80-120 mA on VDD/VSS rails. Place a 100nF X7R decoupling capacitor within 2mm of every VDD/VSS pair and bulk 4.7uF X5R on each rail. Connect all GND balls to a single uninterrupted ground pour and use multiple stitching vias around the BGA perimeter to keep return paths short. Place the 12-bit ADC analog VDD+AVSS pins next to the analog signal connector to minimize common-mode noise pickup.
Do not assume the PIC24FJ256GA610T-I/BG includes USB - the GA610 sub-family has no USB peripheral. If USB is required, select PIC24FJ1024GB610 (or other GB-family parts) in the same 121-TFBGA pinout. Also remember that the dual-partition Live Update feature must be enabled at compile/link time via the MPLAB X IDE project properties; if left at default single-partition configuration, runtime firmware upgrades will not work as expected.
Estimated: at 32MHz core, full peripheral activity and 100% GPIO load, the PIC24FJ256GA610T-I/BG draws approximately 30-40 mA from VDD (around 100 mW). The 121-TFBGA package has a theta_JA of roughly 35-45 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of only 4-5 C above ambient at typical operation - well within the 125 C maximum. No external heatsink is required for normal industrial use, but derating is recommended if all I/Os source/sink 20 mA simultaneously.
Compliance Information
RoHS compliance per Master Electronics product listing. Not AEC-Q100 qualified - choose PIC24FJ256GA610T-E/BG or automotive-graded siblings for vehicle applications. Halogen-free status not stated in verified web data.