PIC24FJ256GL406-I/MR - 16-Bit MCU, 32MHz, 256KB Flash, 64-QFN | Microchip
MPN: PIC24FJ256GL406-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.96 | $5.96 |
| 10 | $5.42 | $54.20 |
| 100 | $4.79 | $479.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.65 | $3,650.00 |
PIC24FJ256GL406-I/MR Overview
A 16-bit microcontroller (MCU) is a microprocessor optimized for embedded control, featuring a wider data path than 8-bit parts, integrated peripherals (timers, ADC, communications), and on-chip memory. Within the semiconductor hierarchy, MCUs sit inside the embedded processors category alongside DSPs, FPGAs, and microprocessors, and are the workhorse of consumer, industrial, and IoT products that need deterministic real-time response.
Key features of the PIC24FJ256GL406 include 256KB ECC Flash with dual-partition support for over-the-air (OTA) firmware updates and EEPROM emulation, 32KB SRAM, hardware LCD segment driver, full-speed USB 2.0 device/host/OTG, and Microchip's eXtreme Low Power (XLP) technology targeting deep-sleep currents in the microamp range. It also offers 14-channel 12-bit ADC, multiple UART/SPI/I2C, and 5 CCP/ECCP modules for motor and PWM control.
Architecturally, the device uses a 16-bit modified Harvard core with single-cycle multiplication and a hardware DIV instruction, allowing deterministic interrupt response. Dual-partition Flash lets one bank be live while the other is updated, enabling true OTA firmware swapping for remote sensor and metering deployments.
Typical applications include low-power IoT sensor nodes, USB-connected industrial HMI panels with LCD readouts, smart metering, e-paper/E-ink controllers, and battery-powered medical wearables. The integrated LCD segment driver eliminates the need for an external LCD controller.
When designing in this MCU, ensure the exposed pad (EP) on the 64-QFN is soldered to a sufficiently large ground copper pour to meet thermal and electrical specifications. Configure unused peripherals to their lowest-power state and use the deep-sleep modes with RTCC to achieve multi-year battery life on coin cells.
This page consolidates distributor pricing, drop-in alternative part numbers, and engineering design notes beyond what is reproduced in the manufacturer datasheet.
Drop-in alternatives for PIC24FJ256GL406-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ256GL406-I/MR (same form factor and footprint) — differing in Package, ADC, Operating Temperature, USB, LCD Controller.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ256GL406-E/MR
✅ Drop-In✓ In Stock
$3.4 / Unit
View Datasheet →PIC24FJ256GL405-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.07 / Unit
View Datasheet →PIC24FJ128GL406-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.05 / Unit
View Datasheet →PIC24FJ256GA406-I/MR
✅ Drop-In✓ In Stock
$3.79 / Unit
View Datasheet →PIC24FJ256GL406-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory | 256 KB ECC Flash |
| RAM | 32 KB |
| Package | 64-QFN (9x9 mm) with EP |
| Pin Count | 60 functional / 64 total |
| Operating Voltage | 1.8 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| USB | Full-Speed USB 2.0 (Device/Host/OTG) |
| LCD Driver | Integrated segmented LCD controller |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Flash Features | Dual Partition, OTA, EEPROM Emulation |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 1 |
| Lead-Free | Yes |
PIC24FJ256GL406-I/MR Pin Configuration
| Pin 1 | RB0 — I/O port B |
| Pin 2 | RB1 — I/O port B |
| Pin 3 | RB2 — I/O port B |
| Pin 4 | RB3 — I/O port B |
| Pin 5 | RB4 — I/O port B |
| Pin 6 | RB5 — I/O port B |
| Pin 7 | RB6 — I/O port B |
| Pin 8 | RB7 — I/O port B |
| Pin 9 | RC0 — I/O port C |
| Pin 10 | RC1 — I/O port C |
| Pin 11 | RC2 — I/O port C |
| Pin 12 | RC3 — I/O port C |
| Pin 13 | RC4 — I/O port C |
| Pin 14 | RC5 — I/O port C |
| Pin 15 | RC6 — I/O port C |
| Pin 16 | RC7 — I/O port C |
| Pin 17 | RD0 — I/O port D |
| Pin 18 | RD1 — I/O port D |
| Pin 19 | RD2 — I/O port D |
| Pin 20 | RD3 — I/O port D |
| Pin 21 | RD4 — I/O port D |
| Pin 22 | RD5 — I/O port D |
| Pin 23 | RD6 — I/O port D |
| Pin 24 | RD7 — I/O port D |
| Pin 25 | RE0 — I/O port E |
| Pin 26 | RE1 — I/O port E |
| Pin 27 | RE2 — I/O port E |
| Pin 28 | RE3 — I/O port E |
| Pin 29 | RE4 — I/O port E |
| Pin 30 | RE5 — I/O port E |
| Pin 31 | RE6 — I/O port E |
| Pin 32 | RE7 — I/O port E |
| Pin 33 | RF0 — I/O port F |
| Pin 34 | RF1 — I/O port F |
| Pin 35 | RF2 — I/O port F |
| Pin 36 | RF3 — I/O port F |
| Pin 37 | RF4 — I/O port F |
| Pin 38 | RF5 — I/O port F |
| Pin 39 | RF6 — I/O port F / LCD segment |
| Pin 40 | RF7 — I/O port F / LCD segment |
| Pin 41 | RG0 — I/O port G / LCD segment |
| Pin 42 | RG1 — I/O port G / LCD segment |
| Pin 43 | RG2 — I/O port G / LCD segment |
| Pin 44 | RG3 — I/O port G / LCD segment |
| Pin 45 | RG6 — I/O port G |
| Pin 46 | RG7 — I/O port G |
| Pin 47 | RG8 — I/O port G |
| Pin 48 | RG9 — I/O port G |
| Pin 49 | D+ — USB D+ |
| Pin 50 | D- — USB D- |
| Pin 51 | VBUS — USB VBUS detect |
| Pin 52 | VUSB — USB internal regulator output |
| Pin 53 | OSC1 — Crystal oscillator input |
| Pin 54 | OSC2 — Crystal oscillator output |
| Pin 55 | SOSCO — Secondary oscillator (32.768 kHz) |
| Pin 56 | SOSCI — Secondary oscillator input |
| Pin 57 | MCLR — Master clear reset |
| Pin 58 | VDD — Supply voltage (1.8V to 3.6V) |
| Pin 59 | VSS — Ground |
| Pin 60 | AVDD — Analog supply |
| Pin 61 | AVSS — Analog ground |
| Pin 62 | VCAP — Internal regulator output (decoupling) |
| Pin 63 | VDD — Supply voltage |
| Pin 64 | VSS — Ground |
Typical Applications
PIC24FJ256GL406-I/MR is suitable for 6 applications: Low-Power IoT Sensor Nodes, USB-Connected Industrial HMI Panels, Smart Metering (Electricity/Water/Gas), Battery-Powered Medical Wearables, E-Paper / E-Ink Display Controllers, Automotive Body Control Modules.
Low-Power IoT Sensor Nodes
The PIC24FJ256GL406-I/MR is well suited to battery-powered IoT sensor nodes because of its integrated eXtreme Low Power (XLP) technology, with deep-sleep currents in the microamp range and 32KB SRAM that can retain data while the CPU is halted. Its 256KB ECC Flash and dual-partition architecture let a deployed node receive over-the-air firmware updates without bricking, and the segmented LCD driver allows a local display of sensor readings without a secondary MCU. Placed as the sole processor, the GL406 reads sensors over I2C or SPI, transmits via UART or USB, and sleeps for years on a coin cell. Compared with a discrete RTC + LCD + MCU solution, the GL406 cuts BOM cost, PCB area, and quiescent current.
Recommended
USB-Connected Industrial HMI Panels
The PIC24FJ256GL406-I/MR's integrated full-speed USB 2.0 controller (device, host, and OTG) eliminates the need for an external USB interface chip, simplifying the BOM for industrial HMI panels. Combined with the integrated segmented LCD driver and 256KB Flash for complex menu logic, the GL406 can drive a 4x40 segment LCD and a USB-CDC or USB-HID connection to a host PC or PLC. It supports 14-channel 12-bit ADC for analog input monitoring, and the 5 CCP/ECCP modules generate PWM for backlight or motor control. The wide 1.8V to 3.6V supply range is friendly to 3.3V industrial rails. Choose the -E/MR variant if the panel will operate above 85C ambient.
Recommended
Smart Metering (Electricity/Water/Gas)
The PIC24FJ256GL406-I/MR targets smart metering deployments because the segmented LCD driver and dual-partition OTA Flash allow utilities to push firmware updates to thousands of endpoints in the field. The 12-bit ADC can sample voltage and current sensors for electricity meters, while pulse-counting inputs handle water and gas meters. The XLP low-power design lets battery-backed meters operate for 10+ years on a primary cell. The 256KB Flash stores metering tables, calibration constants, and the secure communication stack. Compared with an external LCD + EEPROM + MCU design, the GL406 consolidates the BOM and reduces standby power.
Recommended
Battery-Powered Medical Wearables
The PIC24FJ256GL406-I/MR's microamp deep-sleep current and segmented LCD driver suit battery-powered medical wearables such as continuous glucose monitors, pulse oximeters, and wearable thermometers. The 32KB SRAM can buffer biosensor data between samples, and the integrated RTCC keeps wall-clock time across months of sleep. The 16-bit ADC captures low-amplitude sensor signals with adequate resolution, and the on-chip comparators enable threshold-based wake events without CPU intervention. The medical wearable design benefits from the GL406's ability to drive a small LCD directly, eliminating a secondary driver IC and reducing the BOM by 20-30% versus a discrete solution.
Recommended
E-Paper / E-Ink Display Controllers
The PIC24FJ256GL406-I/MR can act as a low-power controller for small e-paper and e-ink displays used in electronic shelf labels (ESL), industrial tags, and portable readers. Its SPI peripheral drives the e-paper display controller, and the 256KB Flash stores fonts, bitmaps, and refresh algorithms. XLP technology lets the device sleep most of the time and wake periodically to refresh the display. Compared with a solution based on an external LCD driver and dedicated e-paper controller, the GL406's integrated peripherals simplify firmware and lower standby power. The 32KB RAM holds full-screen display buffers for 2-3 inch panels.
Recommended
Automotive Body Control Modules
Although the -I/MR is industrial temperature grade (-40C to +85C), the PIC24FJ256GL406 family is also used in non-safety automotive body control modules (lighting controllers, HVAC panels, accessory modules) where the GL406's CAN-compatible peripherals, PWM channels, and ADC suit the application. For under-hood or AEC-Q100 environments, choose the AEC-Q100 qualified variant or step up to the -E/MR extended temperature part. The 32MHz core, 256KB Flash, and full-speed USB simplify debug and firmware updates on the production line. Compared with an 8-bit MCU solution, the 16-bit core and 12-bit ADC give smoother control and finer sensor resolution.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ256GL406-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ256GL406-E/MR | PIC24FJ256GL405-E/PT | PIC24FJ128GL406-I/MR | PIC24FJ256GA406-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | 16-bit PIC24F, 32 MHz | 16-bit PIC24F, 32 MHz | 16-bit PIC24F, 32 MHz | 16-bit PIC24F, 32 MHz | 16-bit PIC24F, 32 MHz |
| Flash | 256 KB ECC | 256 KB ECC | 256 KB ECC | 128 KB ECC (-50%) | 256 KB |
| RAM | 32 KB | 32 KB | 31 KB | 32 KB | 32 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| USB | Full-Speed USB 2.0 (Device/Host/OTG) | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 | Full-Speed USB 2.0 |
| LCD Driver | Yes (segmented) | Yes | Yes | Yes | No |
| XLP Low Power | Yes (deepest sleep modes) | Yes | Yes | Yes | Older XLP (less deep) |
Key Differentiators
- Integrated segmented LCD driver (vs PIC24FJ256GA406-I/MR)
- Dual-partition Flash with OTA support (vs PIC24FJ128GL406-I/MR)
- Latest XLP low-power technology (vs PIC24FJ256GA406-I/MR)
Design Notes
Estimated: The 64-QFN package's exposed pad (EP) must be soldered to a continuous ground copper pour of at least 1 square inch to keep junction temperature within the -40 C to +85 C industrial range. Without the EP thermal connection, theta_JA rises dramatically and the device will overheat at sustained 32MHz operation. Use thermal vias in the EP land pattern per IPC-2222 for best heat transfer to internal ground planes.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD pin, plus a bulk 4.7 uF to 10 uF ceramic at the package. The VCAP pin (internal 1.2V regulator output) requires a 4.7 uF low-ESR ceramic to ground. Use short, wide traces for VDD/VSS and connect the EP to a single large ground pour. Route the USB D+/D- traces as a 90-ohm differential pair to maintain USB 2.0 signal integrity.
Do not enable both dual-partition OTA mode and EEPROM emulation on the same Flash bank without checking the configuration bits: the two features share internal resources. Configure unused peripherals to their lowest-power state (PMD bits) before entering sleep - a peripheral left enabled can dominate the deep-sleep current budget. Always run the full Microchip application note 'Low-Power Design with PIC24F' (AN1410) before finalizing battery-life estimates.
Keep the 32.768 kHz secondary oscillator (SOSCO/SOSCI) traces short and surrounded by a ground guard ring to minimize coupling from adjacent digital signals. Place the main crystal (8-32 MHz) close to OSC1/OSC2 with a ground flood for return currents. The USB D+/D- lines should be matched to within 150 mil and routed over a continuous ground plane; avoid routing them near switching power supply nodes to keep radiated EMI within USB 2.0 spec.
Compliance Information
Industrial temperature grade -40C to +85C. RoHS and lead-free compliant per Microchip product page. AEC-Q100 not qualified for the -I/MR variant; consult Microchip automotive-grade part numbers if required.
