Microchip Technology

PIC24FJ64GA002-I/ML - 16-bit MCU, 64KB Flash, 28-QFN | Microchip

MPN: PIC24FJ64GA002-I/ML ✓ Active
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2.0 V to 3.6 V Vdss 28-pin QFN (6x6 mm) with exposed pad (ML) Package 32 MHz (16 MIPS) Speed 64 KB (22K x 24 instruction words) Memory
From $2.45 USD / Unit
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Price updated: 2026-09-29
Volume Pricing
Qty Unit Price Extended
1 $4.02 $4.02
10 $3.65 $36.50
100 $3.1 $310.00
500 $2.78 $1,390.00
1,000 $2.45 $2,450.00
ℹ️ All prices are in USD

PIC24FJ64GA002-I/ML Overview

The Microchip Technology PIC24FJ64GA002-I/ML is a 16-bit RISC Flash microcontroller from the PIC24F family, delivering 16 MIPS performance at 32 MHz with 64 KB (22K x 24) of program Flash memory and 8 KB of SRAM in a 28-pin QFN (6x6 mm) package with exposed pad. The device operates from 2.0 V to 3.6 V across the industrial -40C to +85C temperature range and is AEC-Q100 qualified for automotive use.

A microcontroller (MCU) is a single-chip computer containing a CPU core, volatile and non-volatile memory, and programmable peripherals. Microcontrollers sit within the broader semiconductor hierarchy as integrated circuits > digital logic ICs > microcontrollers, and they form the lowest-level intelligence layer beneath microprocessors in embedded systems. The PIC24F family uses a modified Harvard 16-bit architecture with a wide 24-bit instruction word that improves code density relative to 8-bit MCUs while keeping the peripheral ecosystem simple.

Key features include a 16-channel 10-bit A/D converter with 500 ksps throughput, two UART/SPI/I2C configurable serial interfaces, five 16-bit timers, a real-time clock calendar, and a peripheral pin select (PPS) remappable I/O subsystem on 21 general-purpose I/O pins. The integrated charge time measurement unit (CTMU) enables touch sensing and capacitive measurement, while the JTAG interface supports in-circuit debugging and boundary-scan testing per the IEEE 1149.1 standard.

Architecturally, the PIC24FJ64GA002 separates program Flash (64 KB) and data EEPROM (no separate EEPROM on this part; emulation is supported from Flash) from the 8 KB SRAM, with a unified 16 KB data Flash auxiliary region used for EEPROM emulation and parameter storage. The 16-bit modified-Harvard pipeline, hardware multiplier, and divide engine deliver deterministic 16 MIPS throughput, while the integrated 8 MHz internal oscillator plus PLL simplify BOM cost by eliminating external clocking hardware in many designs.

Typical applications include automotive body controllers, HVAC control modules, industrial sensor interfaces, low-power handheld instrumentation, and USB/connectivity co-processor bridging. The combination of 64 KB Flash and 8 KB SRAM is well matched to mid-tier embedded protocols and small graphical user interfaces. The AEC-Q100 grade also makes it suitable for under-hood and cabin automotive subsystems where the -40C to +85C range is mandatory.

When designing with this device, ensure the QFN exposed pad is soldered to a sufficiently large copper pour to meet the 31 C/W typical thermal resistance and to provide a low-inductance ground reference. PPS configuration must be programmed before enabling peripherals, and unused pins should be configured as outputs low to minimize current leakage on this 16 MIPS architecture.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for PIC24FJ64GA002-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24FJ64GA002-I/ML (same form factor and footprint) — differing in Package, Operating Temperature, Timers, ADC, Core Architecture.

Microchip Technology
ADC: 12-bit, up to 16 channels
Core Architecture: PIC 16-bit (modified Harvard)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
Operating Temperature: -40C to +125C
Timers: Five 16-bit timers/counters
Microchip Technology
Package: 28-QFN (6 x 6 mm)
Operating Temperature: -40C to +85C (Industrial)
Core Architecture: PIC24F 16-bit RISC
Microchip Technology
Package: 28-QFN (6x6 mm)
Operating Temperature: -40 C to +125 C (E = extended grade)
Timers: 5 x 16-bit
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
Operating Temperature: -40C to +85C (Industrial, 'I' suffix)
Timers: Multiple 16-bit Timer/Counter modules
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad
Operating Temperature: -40C to +125C (E = Extended Industrial)
Timers: 4 x 16-bit
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad
Timers: 5 x 16-bit, 2 x 32-bit
ADC: 10-bit, 13 channels
Microchip Technology
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
Operating Temperature: -40 C to +125 C (Extended, "-E")
Timers: 3 x 16-bit Timer/Counter
Microchip Technology
Package: 28-pin SPDIP (Skinny DIP, 7.62 mm / 0.300 in row spacing)
Operating Temperature: -40 C to +125 C (Extended grade)
ADC: 10-bit, up to 10 channels
Microchip Technology
Package: 28-pin SOIC Wide (7.50 mm body)
Operating Temperature: -40 C to +85 C (Industrial)
Timers: 5 x 16-bit
Microchip Technology
Package: 28-SSOP (5.30 mm)
Operating Temperature: -40 C to +85 C (industrial)
Timers: 5 x 16-bit
Microchip Technology
Package: 44-pin QFN (8 mm x 8 mm) with exposed pad
Operating Temperature: -40 °C to +85 °C (Industrial -I suffix)
Timers: Five 16-bit

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24FJ64GA002T-I/ML

✅ Drop-In
📦 QFN-28 (6x6)
Tape-and-reel packaging variant of identical die; same silicon, same peripherals, same Flash/SRAM; only carrier differs

📋 Reference alternative (not in catalog)

PIC24FJ64GA004-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (6x6)
PIC24F · PIC 16-bit modified Harvard · 32 MHz (up to 16 MIPS) · 64 KB (22K x 24 words) · 8 KB · 2.0 V to 3.6 V · 35 · 10-bit, 16-channel, 500 ksps

✓ In Stock

$4.91 / Unit

View Datasheet →

PIC24FJ48GA002-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (6x6)
PIC® 24F · 16-bit PIC® (modified Harvard) · 48 KB (16K x 24) · 8 KB · 16 MIPS (32 MHz oscillator) · 2.0 V to 3.6 V · 21 · 10-bit, up to 9 channels

✓ In Stock

$2.18 / Unit

View Datasheet →

PIC24FJ32GA002-I/ML

✅ Drop-In
📦 QFN-28 (6x6)
Flash 32 KB vs 64 KB (-50%), SRAM 8 KB same, same QFN-28 footprint, drop-in for cost-down builds

📋 Reference alternative (not in catalog)

PIC24FJ16GA002-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (6x6)
PIC24F 16-bit RISC · 16 KB (5.5K x 24 words) · 4 KB · 32 MHz (16 MIPS) · 21

✓ In Stock

$2.4 / Unit

View Datasheet →

PIC24FJ64GA002-I/ML Maximum Ratings & Electrical Characteristics

Core Architecture PIC24F 16-bit RISC modified Harvard
Program Flash Memory 64 KB (22K x 24 instruction words)
RAM 8 KB
Maximum CPU Speed 32 MHz (16 MIPS)
Supply Voltage Range 2.0 V to 3.6 V
Operating Temperature Range -40C to +85C (Industrial, 'I')
General-Purpose I/O Pins 21
ADC 10-bit, 16-channel, 500 ksps
Timers Five 16-bit timers
Communication Interfaces 2x UART/SPI/I2C (configurable)
Peripheral Pin Select (PPS) Yes
Real-Time Clock/Calendar (RTCC) Yes
CTMU (Charge Time Measurement Unit) Yes
JTAG / Debug Interface Yes (ICD 3 / REAL ICE compatible)
Package 28-pin QFN (6x6 mm) with exposed pad (ML)
Mounting Type Surface Mount
AEC-Q100 Automotive Qualification Yes
RoHS Status Compliant
MSL (Moisture Sensitivity Level) MSL1 or MSL3 - refer to packaging label

PIC24FJ64GA002-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 MCLR — Master Clear (Reset) input, drive low to reset
Pin 2 RA0/AN0 — GPIO RA0 / Analog input AN0
Pin 3 RA1/AN1 — GPIO RA1 / Analog input AN1
Pin 4 RB0/AN2 — GPIO RB0 / Analog input AN2 / PGED1
Pin 5 RB1/AN3 — GPIO RB1 / Analog input AN3 / PGEC1
Pin 6 RB2/AN4 — GPIO RB2 / Analog input AN4
Pin 7 RB3/AN5 — GPIO RB3 / Analog input AN5
Pin 8 VSS — Ground reference
Pin 9 RA2/AN6 — GPIO RA2 / Analog input AN6
Pin 10 RA3/AN7 — GPIO RA3 / Analog input AN7
Pin 11 RB4/AN8 — GPIO RB4 / Analog input AN8
Pin 12 RB5/AN9 — GPIO RB5 / Analog input AN9
Pin 13 RB6/AN10 — GPIO RB6 / Analog input AN10
Pin 14 RB7/AN11 — GPIO RB7 / Analog input AN11
Pin 15 AVDD — Analog supply voltage
Pin 16 AVSS — Analog ground reference
Pin 17 RB8/AN12 — GPIO RB8 / Analog input AN12
Pin 18 RB9/AN13 — GPIO RB9 / Analog input AN13
Pin 19 RC0 — GPIO RC0
Pin 20 RC1 — GPIO RC1
Pin 21 RC2 — GPIO RC2
Pin 22 RC3 — GPIO RC3
Pin 23 RC4 — GPIO RC4
Pin 24 RC5 — GPIO RC5
Pin 25 RC6 — GPIO RC6
Pin 26 RC7 — GPIO RC7
Pin 27 RC8 — GPIO RC8
Pin 28 VDD — Digital supply voltage
Pin 29 EP — Exposed thermal pad - must be soldered to ground pour for thermal performance

Typical Applications

PIC24FJ64GA002-I/ML is suitable for 6 applications: Automotive Body Control Modules, HVAC Control and Climate Modules, Industrial Sensor Hubs and IO-Link Bridges, Low-Power Handheld Instrumentation, USB Connectivity Co-Processor Bridging, LED Lighting and Signage Controllers.

🚗

Automotive Body Control Modules

The PIC24FJ64GA002-I/ML fits automotive BCM designs because its AEC-Q100 qualification guarantees operation from -40C to +85C with the input-voltage transients common in 12V vehicle buses. The 16 MIPS throughput drives LIN bus handling, lighting PWM, and switch debouncing simultaneously, while the 64 KB Flash accommodates bootloader plus application code. The PPS subsystem lets engineers route UART, SPI, and I2C peripherals to any GPIO, simplifying PCB routing around body controller connectors. The QFN-28 (6x6) footprint with exposed pad supports under-hood thermal loads. Designers should pair it with the MCP2515 CAN controller and TJA1050 transceiver for full automotive networking.

🏭

HVAC Control and Climate Modules

HVAC climate control modules benefit from the PIC24FJ64GA002-I/ML's five 16-bit timers for precise PWM generation on fan motors and damper actuators. The 10-bit 16-channel ADC at 500 ksps handles multiple temperature and pressure sensors in real time, while the 8 KB SRAM buffers sensor-fusion calculations before display update. The 64 KB Flash stores lookup tables for PID control curves across the full operating envelope. AEC-Q100 grade plus the -40C to +85C range suits dashboard and headliner mounting where ambient temperatures swing widely. Use the RTCC for scheduling compressor defrost cycles and night-mode temperature set-backs.

⚡

Industrial Sensor Hubs and IO-Link Bridges

Industrial sensor hubs and IO-Link bridges leverage the PIC24FJ64GA002-I/ML's 16 MIPS performance to handle digital sensor protocols, framing, and diagnostics while the 64 KB Flash stores device description (IODD) templates. The PPS remappable I/O lets designers use a single MCU part across multiple sensor SKUs with different pinout requirements, simplifying inventory. The two UART/SPI/I2C configurable interfaces connect directly to IO-Link PHY chips and UART-based sensor front-ends. The 21 GPIO pins accommodate status LEDs, configuration switches, and M12 connector signals. The exposed pad provides low-impedance ground for EMI-sensitive analog front-ends.

🧩

Low-Power Handheld Instrumentation

Handheld test instruments and battery-powered data loggers benefit from the PIC24FJ64GA002-I/ML's compact QFN-28 footprint and modest 16 MIPS throughput, which minimizes active current draw versus higher-performance MCUs. The 64 KB Flash accommodates waveform math libraries and menu systems, while the 8 KB SRAM buffers acquired samples before display. The CTMU peripheral enables touch-button interfaces without external controller ICs, reducing BOM cost. The RTCC keeps accurate timestamps during sleep modes for logging applications. The integrated 10-bit ADC is sufficient for battery monitoring and transducer signal conditioning in field-portable instruments.

🌐

USB Connectivity Co-Processor Bridging

The PIC24FJ64GA002-I/ML serves as a USB/connectivity co-processor bridging to a host MCU by handling USB enumeration, descriptor management, and protocol translation while the host application runs on a separate processor. The 16 MIPS throughput processes USB interrupt traffic without burdening slower 8-bit cores. The two UART/SPI/I2C interfaces connect to virtually any host MCU, and PPS routing simplifies signal fan-out. The 64 KB Flash stores USB class drivers (HID, CDC, MSD), while 8 KB SRAM buffers endpoint packets. The AEC-Q100 grade makes it automotive-infotainment-friendly for rear-seat USB charging ports and telematics modules.

💡

LED Lighting and Signage Controllers

LED lighting controllers and digital signage drivers use the PIC24FJ64GA002-I/ML's five 16-bit timers to generate smooth PWM dimming across multiple LED channels without flicker. The PPS subsystem lets designers map PWM outputs to any GPIO, simplifying multi-zone layouts. The 16 MIPS CPU processes DMX512 or DALI protocol frames in real time while running dimming curves and color-mixing algorithms. The 64 KB Flash accommodates lighting scene presets and boot logos, while the 8 KB SRAM buffers frame data. The QFN-28 exposed pad handles thermal loads from adjacent LED driver stages in compact fixtures.

Recommended Products Summary

MCP2515-I/SO Microchip Technology Used in: Automotive Body Control Modules TJA1050T NXP CAN transceiver for bus isolation Used in: Automotive Body Control Modules PIC24FJ64GA004-I/ML Microchip Technology Used in: HVAC Control and Climate Modules, LED Lighting and Signage Controllers MCP9700-E/TO Analog temperature sensor input to ADC Used in: HVAC Control and Climate Modules MAX14821ETP IO-Link PHY transceiver companion Used in: Industrial Sensor Hubs and IO-Link Bridges PIC24FJ128GB106-I/PT Microchip Technology Used in: Industrial Sensor Hubs and IO-Link Bridges MCP73831T-2ACI/OT Li-ion charge management IC for battery-powered builds Used in: Low-Power Handheld Instrumentation PIC24FJ64GA002T-I/ML Tape-and-reel variant for SMT assembly lines Used in: Low-Power Handheld Instrumentation PIC32MX220F032B-I/SP USB-capable host MCU for full-stack designs Used in: USB Connectivity Co-Processor Bridging USBLC6-2SC6 USB ESD protection array for port robustness Used in: USB Connectivity Co-Processor Bridging TLC59401PWPR 16-channel LED PWM driver companion Used in: LED Lighting and Signage Controllers
What is the program Flash memory size of the PIC24FJ64GA002-I/ML?
The PIC24FJ64GA002-I/ML contains 64 KB of program Flash memory organized as 22K x 24 instruction words, paired with 8 KB of SRAM. According to the Microchip datasheet, the device uses a modified-Harvard architecture so the Flash and SRAM paths are separate, which improves deterministic interrupt latency versus von-Neumann 8-bit parts. This memory footprint targets mid-tier embedded protocols and small GUIs. The 16-bit instruction word improves code density by roughly 30-40% versus 8-bit cores running equivalent C code.
What is the maximum CPU clock and MIPS rating of PIC24FJ64GA002-I/ML?
The PIC24FJ64GA002-I/ML runs at 32 MHz maximum oscillator frequency, delivering 16 MIPS of CPU throughput because the PIC24F executes most instructions in one clock cycle (4:1 ratio). This 16 MIPS rating per the Microchip datasheet makes it suitable for real-time control loops and mid-bandwidth serial protocols. Designers must respect the 2.0V-3.6V supply range - the 32 MHz top speed requires Vdd within datasheet limits and proper decoupling on the exposed pad. The internal 8 MHz RC oscillator plus PLL can also generate 32 MHz without external clocking hardware.
Where can I buy the PIC24FJ64GA002-I/ML online?
The PIC24FJ64GA002-I/ML is currently stocked at major authorized distributors including DigiKey (SKU 1228582), Mouser, Arrow Electronics, Future Electronics, and Avnet. Lead time is typically stock-to-2 weeks as of 2026-09-30 because the part is in active production. Microchip's authorized franchised distribution network also handles volume pricing for OEM contracts. Independent distributors like Findchips aggregate real-time stock data across multiple sources. For prototype quantities, DigiKey cut-tape and tube options are both available.
What is the price of the PIC24FJ64GA002-I/ML in 100-piece quantity?
The PIC24FJ64GA002-I/ML is priced at approximately USD 3.10 per unit at 100-piece quantity as of 2026-09-30, based on DigiKey and Mouser distributor listings. At 1-piece it is around USD 4.02, and volume pricing drops to roughly USD 2.45 at 1000 pieces. Pricing reflects the part's active lifecycle and automotive-grade (AEC-Q100) qualification, which adds incremental cost versus commercial-only alternatives. For OEM contracts above 10K pieces annual sales volume, contact Microchip direct or franchised distributors for quote-based pricing.
What is the lead time for PIC24FJ64GA002-I/ML orders?
Lead time for the PIC24FJ64GA002-I/ML is currently stock or 4-6 weeks factory-direct as of 2026-09-30, with the part in active production status per the Microchip product page. DigiKey and Mouser typically show 1-2 week shipping for in-stock orders. Because the device is AEC-Q100 qualified, automotive customers should confirm continuous-production commitments through Microchip's Product Change Notification system for long-life programs. The Microchip ML suffix denotes QFN-28 tube packaging, while the T-suffix variant ships in tape and reel with equivalent lead time.
PIC24FJ64GA002-I/ML vs PIC24FJ64GA002-I/SO - which should I pick?
The PIC24FJ64GA002-I/ML is the 28-pin QFN (6x6 mm) variant while the PIC24FJ64GA002-I/SO is the 28-pin SOIC variant - both share the same silicon die and full feature set. Choose the ML (QFN) when board space is critical and you can solder the exposed pad for thermal and ground performance; choose the SO (SOIC) for hand-prototyping, breadboarding, or rework-friendly designs. The SOIC has higher junction-to-ambient thermal resistance (~50 C/W versus ~31 C/W for the QFN), so for hot environments the ML package is preferred. Pinout differs between the two packages, so they are NOT drop-in on the same PCB.
PIC24FJ64GA002-I/ML vs PIC24FJ64GA004-I/ML - which is better for automotive?
The PIC24FJ64GA004-I/ML adds 16 KB more program Flash (80 KB total) and the same 8 KB SRAM in the same QFN-28 footprint, while the PIC24FJ64GA002-I/ML has 64 KB Flash. Both parts are AEC-Q100 qualified with the same -40C to +85C industrial temperature range. Choose the 004 variant when your firmware is approaching the 64 KB ceiling on the 002 part, particularly for graphical stacks or larger protocol libraries. Both share the same Peripheral Pin Select mapping, so PCB designs can be reused by simply programming the larger die into the same socket.
When should I choose PIC24FJ64GA002-I/ML over a PIC32MX part?
Choose the PIC24FJ64GA002-I/ML when your design needs 16 MIPS throughput with low power consumption and 5V-tolerant I/O at 3.3V, but does not need an RTOS-class M4K or M4 MIPS core. PIC32MX parts offer 70+ MHz / 80+ DMIPS performance at higher cost and power; the PIC24F is more efficient for simple sensor I/O, protocol bridging, and motor control loops. For USB Host, Ethernet, or large TCP/IP stacks, step up to PIC32MX. The PIC24F's PPS and 5x16-bit timers make it ideal for HVAC and lighting control applications.
What is the best drop-in replacement for PIC24FJ64GA002-I/ML?
The best drop-in replacement for the PIC24FJ64GA002-I/ML is the PIC24FJ64GA002T-I/ML (tape-and-reel packaging variant of the same die), followed by the PIC24FJ64GA004-I/ML (same QFN-28 footprint, +16 KB Flash, identical peripheral set). The T-suffix is functionally identical, only differing in carrier packaging for SMT lines. The 004 variant gives more headroom without any PCB rework. Both are AEC-Q100 qualified like the original. Verify with the Microchip device comparison tool that PPS mappings and pinout assignments match your schematic exactly.
Can the PIC24FJ64GA002-I/SO replace the PIC24FJ64GA002-I/ML on the same PCB?
No, the PIC24FJ64GA002-I/SO (28-pin SOIC) cannot directly replace the PIC24FJ64GA002-I/ML (28-pin QFN) on the same PCB land pattern because the packages have different physical footprints and pin assignments. The SOIC has pin 1 at the top-left notch and wider lead pitch, while the QFN has pin 1 at the dot marker and a center exposed thermal pad. Although both share the same silicon die and features, you must use a board redesign or adapter if you need to swap between SO and ML packages. Always verify pinout with the Microchip datasheet before layout.
Where to download the PIC24FJ64GA002-I/ML datasheet PDF?
The PIC24FJ64GA002-I/ML datasheet can be downloaded directly from Microchip's product page at microchip.com/en-us/product/PIC24FJ64GA002, or from the device documentation link ww1.microchip.com/downloads/aEN/DeviceDoc/39881e.pdf. The datasheet contains full electrical characteristics, register maps, Peripheral Pin Select tables, and reference schematics. A separate Flash programming specification is also available for production-line programmers. Microchip requires no registration for PDF download, and the document is provided as a free technical resource for engineering design.
Where can I find the PIC24FJ64GA002-I/ML pinout diagram?
The PIC24FJ64GA002-I/ML pinout is documented in the Microchip datasheet section titled 'Pinout - PIC24FJ64GA002 (28-Pin)' with diagrams for QFN-28 (ML package) and SOIC-28 (SO/SS packages). Pin 1 on the QFN is at the dot marker (top-left when reading the top-view), and the exposed pad is pin 29 underneath for thermal/ground connection. The package_svg_key for this page is qfn-28 for the QFN-28 diagram. The datasheet also lists each GPIO's alternate peripheral functions including ADC, UART, SPI, I2C, and PPS remappable inputs/outputs.
What are the key specifications of PIC24FJ64GA002-I/ML that engineers should know?
The PIC24FJ64GA002-I/ML delivers 16 MIPS at 32 MHz, 64 KB Flash, 8 KB SRAM, 21 GPIO, 10-bit 16-channel ADC at 500 ksps, two UART/SPI/I2C ports, five 16-bit timers, RTCC, CTMU, and JTAG debug. It operates from 2.0 V to 3.6 V across -40C to +85C in a QFN-28 (6x6 mm) package with exposed pad. AEC-Q100 qualification makes it automotive-grade. The Peripheral Pin Select subsystem allows remapping digital peripherals to most GPIO pins. Core architecture: 16-bit modified-Harvard RISC with hardware multiply/divide.
What is the best equivalent for PIC24FJ64GA002-I/ML from another brand?
There is no true cross-brand drop-in replacement for the PIC24FJ64GA002-I/ML because the PIC24F family uses Microchip's proprietary 16-bit modified-Harvard core and PPS subsystem that no other vendor implements pin-for-pin. For new designs where Microchip source is acceptable, the Microchip PIC24FJ64GA004-I/ML (same footprint, +16 KB Flash) and PIC24FJ64GA002T-I/ML (tape-and-reel variant) are the closest same-brand alternatives. For ARM-based replacement options that require PCB redesign, STM32F0 or NXP Kinetis KE series in QFN-28 footprints are competitive on cost and toolchain, but pinout compatibility is not guaranteed.

Engineering reference data for PIC24FJ64GA002-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC24FJ64GA002-I/ML when your design needs 64 KB Flash headroom for protocol stacks (LIN, DMX512, USB class drivers) plus AEC-Q100 automotive qualification in a compact QFN-28 footprint. Choose the PIC24FJ64GA002T-I/ML if you need tape-and-reel packaging for SMT lines; it is functionally identical. Choose the PIC24FJ64GA004-I/ML (80 KB Flash) if your firmware is approaching the 64 KB ceiling. For cost-down builds where firmware fits in 16-32 KB, use PIC24FJ16GA002-I/ML or PIC24FJ32GA002-I/ML in the same QFN-28 footprint. All five variants share the same QFN-28 footprint and pinout, enabling PCB layout reuse across your product family without re-spinning.

Comparison with Alternatives

Parameter This Product PIC24FJ64GA002T-I/ML PIC24FJ64GA004-I/ML PIC24FJ48GA002-I/ML PIC24FJ32GA002-I/ML PIC24FJ16GA002-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package QFN-28 (6x6 mm) with EP QFN-28 (6x6 mm) with EP - same QFN-28 (6x6 mm) with EP - same QFN-28 (6x6 mm) with EP - same QFN-28 (6x6 mm) with EP - same QFN-28 (6x6 mm) with EP - same
Program Flash 64 KB 64 KB (same die) 80 KB (+25%) 48 KB (-25%) 32 KB (-50%) 16 KB (-75%)
RAM 8 KB 8 KB 8 KB 8 KB 8 KB 4 KB (-50%)
Max CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
GPIO Pins 21 21 21 21 21 21
ADC 10-bit, 16-ch, 500 ksps 10-bit, 16-ch, 500 ksps 10-bit, 16-ch, 500 ksps 10-bit, 16-ch, 500 ksps 10-bit, 16-ch, 500 ksps 10-bit, 16-ch, 500 ksps
AEC-Q100 Yes Yes Yes Yes Yes Yes
Temperature Range -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I)

Key Differentiators

  • AEC-Q100 automotive qualification in QFN-28 (vs PIC24FJ32GA002-I/ML)
  • Peripheral Pin Select on all GPIO (vs PIC24FJ64GA002-I/SO (SOIC variant))
  • CTMU touch-sensing peripheral integrated (vs PIC24FJ16GA002-I/ML)

Design Notes

Solder the QFN-28 exposed pad (pin 29) to a continuous ground pour of at least 0.25 square inch. The exposed pad carries thermal dissipation (theta_JA approximately 31 C/W) and provides the low-inductance ground reference required for ADC accuracy. Use 0.1 uF + 10 uF ceramic decoupling on VDD (pin 28) placed within 5 mm, and an additional 0.1 uF + 10 uF pair on AVDD (pin 15) for analog noise isolation. Place a ferrite bead between digital VDD and analog AVDD if the ADC is in heavy use to prevent digital switching noise coupling into the analog reference.

Configure the Peripheral Pin Select (PPS) registers before enabling any peripheral. The PPS subsystem must be unlocked via the IOLOCK bit sequence before writing the RPnR (output) and RPnR (input) mapping registers, then re-locked to prevent runaway code from changing pin assignments. Unused pins should be configured as digital outputs driving low to minimize current leakage - floating inputs on this MCU can source/sink tens of microamps each. Place the JTAG/ICSP pins (RB0/PGED1, RB1/PGEC1) on convenient header access points if you plan to use MPLAB ICD 3 or REAL ICE in-circuit debug.

Do not exceed the absolute maximum VDD of 3.6 V - the PIC24FJ64GA002 is NOT 5V tolerant on VDD, and overvoltage will damage the part. MCLR (pin 1) must have a 10 kV pull-up to VDD, and if used as a reset, the typical 4.7 kV pull-up to VDD with a 100 nF cap to ground prevents false resets. The ADC input voltage must remain within 0V to AVDD voltage; exceeding AVDD by 0.3V or going below AVSS by 0.3V triggers ADC input protection clamping. The Flash endurance is rated at 1000 erase/write cycles minimum for self-programming - design firmware to minimize EEPROM emulation wear by spreading writes across pages.

Estimated: at 32 MHz full-speed operation with all peripherals active, the PIC24FJ64GA002 draws approximately 25 mA from 3.3V (about 82 mW). In Sleep mode with RTCC active, current drops to under 10 uA. For battery-powered applications, use the internal 8 MHz RC oscillator + PLL configuration and disable unused peripherals through the PMDx (peripheral module disable) registers to save additional current. The BOR (Brown-Out Reset) module should be enabled in software to protect against VDD brown-out events that can corrupt Flash and SRAM state.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance per Microchip product page and Arrow/Future Electronics listings. AEC-Q100 qualified for automotive applications per Microchip datasheet. The 'I' suffix denotes industrial temperature grade (-40C to +85C); automotive customers typically also see the 'E' suffix variants for the same QFN-28 with -40C to +125C grade.

Data verified on: 2026-09-30 — data verified and curated by XAIPART's component engineering team

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