PIC24HJ32GP204-H/ML - 16-bit 32KB Flash MCU, 44-QFN | Microchip
MPN: PIC24HJ32GP204-H/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.92 | $8.92 |
| 10 | $8.03 | $80.30 |
| 100 | $7.14 | $714.00 |
| 500 | $6.51 | $3,255.00 |
| 1,000 | $5.92 | $5,920.00 |
PIC24HJ32GP204-H/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (SRAM), and a rich set of peripheral blocks (timers, communication controllers, ADCs) into one package. The PIC24H family specifically uses a 16-bit modified-Harvard architecture with a 24-bit instruction word, sitting in the hierarchy: 16-bit MCU -> PIC24H family -> Microchip 16-bit portfolio -> embedded microcontroller -> semiconductor IC. This architecture gives the PIC24H deterministic interrupt latency and DSP-class throughput at moderate clock rates, ideal for motor control, power conversion, and sensor fusion.
Key features include 32KB (11K x 24) self-programmable Flash with ECC, 2KB SRAM, an 8-channel DMA controller that offloads data movement from the CPU, a 16-bit Parallel Master Port for external memory expansion, and a Peripheral Pin Select (PPS) remap system that allows flexible assignment of digital peripherals to physical pins. The integrated ADC supports up to 13 channels of 10-bit conversion at 500 ksps (or 12-bit on selected variants), with hardware accumulation and scanning modes for efficient sensor-array sampling.
The device also integrates two Enhanced CAN 2.0B modules for industrial and automotive networking, plus USB 2.0 Full-Speed on related variants. The 44-QFN package exposes 21 general-purpose I/O and supports JTAG/ICSP in-system programming for both prototyping and production. A built-in PLL multiplies an external 8 MHz crystal up to 80 MHz internal Fosc, yielding 40 MIPS instruction throughput.
Typical applications include automotive body control modules, HVAC actuators, industrial sensor hubs, motor-control front-ends, and appliance controllers. The AEC-Q100 qualification makes it particularly attractive for under-hood and chassis subsystems where the operating temperature exceeds the standard industrial -40C to +85C window. Designers often pair the MCU with Microchip's MCP2515 CAN transceivers or TC1047A temperature sensors for complete system reference designs.
When designing with this MCU, ensure the supply rail stays within 3.0 V to 3.6 V and the decoupling network follows Microchip's reference layout - typically 100 nF on each VDD/VSS pair plus a 10 uF bulk capacitor. Watch the JTAG pins during reflow: the 44-QFN thermal pad must be soldered to the PCB ground plane to meet the 4.2 C/W theta_JC thermal performance.
This page synthesizes distributor pricing, drop-in package alternatives, and practical design notes not found in the manufacturer datasheet alone, with cross-references to companion PIC24H/dsPIC33F parts that share the same 44-QFN pinout.
Drop-in alternatives for PIC24HJ32GP204-H/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24HJ32GP204-H/ML (same form factor and footprint) — differing in Package, Core, DMA Channels, I/O Pins, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ32GP204-H/ML
✅ Drop-In✓ In Stock
$3.49 / Unit
View Datasheet →PIC24HJ32GP202-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24HJ32GP204-H/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24HJ16GP304-H/ML
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →dsPIC33FJ16GP304-H/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24HJ32GP204-H/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit PIC24H (modified Harvard) |
| CPU Speed | 20 MIPS @ 40 MHz Fosc |
| Program Memory (Flash) | 32 KB (11K x 24) |
| Data SRAM | 2 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 21 |
| Timers | 3 x 16-bit (pairable to 32-bit) |
| Communication Interfaces | 2x UART, 2x SPI, 1x I2C, 2x ECAN, IrDA, LINbus |
| ADC | 13-channel 10-bit @ 500 ksps |
| DMA Channels | 8 |
| Operating Temperature | -40C to +150C (Automotive AEC-Q100 Grade 0) |
| Package | 44-pin QFN (8x8 mm) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Programming Interface | ICSP / JTAG |
PIC24HJ32GP204-H/ML Pin Configuration
| Pin 1 | RP0 — Remappable peripheral I/O (default: AN0) |
| Pin 2 | RP1 — Remappable peripheral I/O |
| Pin 3 | RP2 — Remappable peripheral I/O |
| Pin 4 | RP3 — Remappable peripheral I/O |
| Pin 5 | RP4 — Remappable peripheral I/O |
| Pin 6 | VDD — Digital supply 3.3V |
| Pin 7 | VSS — Digital ground |
| Pin 8 | RP5 — Remappable peripheral I/O |
| Pin 9 | RP6 — Remappable peripheral I/O (default: AN6) |
| Pin 10 | RP7 — Remappable peripheral I/O |
| Pin 11 | RP8 — Remappable peripheral I/O |
| Pin 12 | RP9 — Remappable peripheral I/O |
| Pin 13 | VSS — Digital ground |
| Pin 14 | RP10 — Remappable peripheral I/O |
| Pin 15 | OSC1 — Crystal oscillator input |
| Pin 16 | OSC2 — Crystal oscillator output |
| Pin 17 | RP11 — Remappable peripheral I/O |
| Pin 18 | RP12 — Remappable peripheral I/O |
| Pin 19 | RP13 — Remappable peripheral I/O |
| Pin 20 | RP14 — Remappable peripheral I/O |
| Pin 21 | RP15 — Remappable peripheral I/O |
| Pin 22 | VDD — Digital supply 3.3V |
| Pin 23 | VSS — Digital ground |
| Pin 24 | RP16 — Remappable peripheral I/O |
| Pin 25 | RP17 — Remappable peripheral I/O |
| Pin 26 | RP18 — Remappable peripheral I/O |
| Pin 27 | RP19 — Remappable peripheral I/O |
| Pin 28 | RP20 — Remappable peripheral I/O |
| Pin 29 | RP21 — Remappable peripheral I/O |
| Pin 30 | VDD — Digital supply 3.3V |
| Pin 31 | VSS — Digital ground |
| Pin 32 | RP22 — Remappable peripheral I/O |
| Pin 33 | RP23 — Remappable peripheral I/O |
| Pin 34 | RP24 — Remappable peripheral I/O |
| Pin 35 | C1RX — ECAN1 receive input |
| Pin 36 | C1TX — ECAN1 transmit output |
| Pin 37 | SDA1 — I2C1 data (remappable) |
| Pin 38 | SCL1 — I2C1 clock (remappable) |
| Pin 39 | TMS — JTAG test mode select |
| Pin 40 | TCK — JTAG test clock |
| Pin 41 | TDI — JTAG test data in |
| Pin 42 | TDO — JTAG test data out |
| Pin 43 | MCLR — Master clear (reset, active low) |
| Pin 44 | PGED1 — ICSP programming data |
Typical Applications
PIC24HJ32GP204-H/ML is suitable for 6 applications: Automotive Body Control Module, HVAC Actuator Controller, Industrial Sensor Hub, Motor-Control Front-End, Appliance Control Board, Battery Management Monitoring Unit.
Automotive Body Control Module
The PIC24HJ32GP204-H/ML is engineered for automotive body control modules where AEC-Q100 Grade 0 reliability and -40C to +150C operation are mandatory. Its 20 MIPS throughput handles CAN 2.0B message routing across body-domain networks, while 21 GPIO interfaces with door locks, mirror actuators, and lighting drivers. The 32KB Flash accommodates J1939 protocol stacks and OEM diagnostic handlers, and the 13-channel 10-bit ADC reads multi-zone temperature and battery voltage sensors. The 44-QFN package fits within the compact 25x35 mm body-control PCB envelope typical of BCM reference designs. According to the Microchip datasheet, the Peripheral Pin Select remap system allows flexible reassignment of UART to LINbus transceivers without external muxes.
Recommended
HVAC Actuator Controller
The PIC24HJ32GP204-H/ML's 20 MIPS and integrated three 16-bit timers make it well suited for HVAC damper and blower motor control loops. Its PWM outputs, paired with the 8-channel DMA, offload sensor acquisition from the CPU to maintain deterministic control bandwidth. The 32KB Flash stores PID and ramp tables for multi-zone climate control, and 2KB SRAM retains live operating parameters across watchdog resets. The 44-QFN package survives underhood vibration profiles, and AEC-Q100 Grade 0 qualification supports temperatures up to +150C adjacent to engine bulkheads. Pair with an MCP6N11 instrumentation amplifier for current sensing across the blower MOSFET bridge.
Recommended
Industrial Sensor Hub
In industrial sensor hubs, the PIC24HJ32GP204-H/ML aggregates data from 13 ADC channels and forwards it via two ECAN 2.0B modules to a higher-level PLC. Its 32KB Flash stores Modbus RTU and CANopen protocols, while 2KB SRAM buffers sensor reads between bus transmissions. The 21 GPIO accommodate optocoupler-isolated digital inputs and relay-driver outputs, and the integrated DMA moves ADC samples without CPU intervention. The -40C to +125C industrial operating range (extended to +150C on this -H variant) tolerates cabinet-side mounting near variable-frequency drives. According to the Microchip datasheet, the 8-channel DMA allows simultaneous sensor acquisition and CAN transmission without interrupt jitter.
Recommended
Motor-Control Front-End
The PIC24HJ32GP204-H/ML serves as a motor-control front-end for BLDC and PMSM low-power drives up to 200 W. Its 20 MIPS throughput executes sensorless back-EMF algorithms at 20 kHz PWM, while the 13-channel ADC samples phase currents and DC-bus voltage synchronously. The integrated DMA supports double-buffered ADC-to-PWM updates for ripple-free commutation, and the 32KB Flash holds lookup tables for sinusoidal commutation patterns. The 44-QFN footprint integrates into the 35x45 mm motor-control PCB envelope typical of appliance drives, and AEC-Q100 Grade 0 qualification tolerates compressor mounting. For DSP-intensive field-oriented control, use the dsPIC33FJ32GP204-H/ML drop-in replacement.
Recommended
Appliance Control Board
The PIC24HJ32GP204-H/ML powers washing-machine and dishwasher control boards where cost-sensitive MCU integration is required. Its 32KB Flash stores user-interface state machines and fault-recovery routines, while 2KB SRAM buffers sensor and timer data across power cycles. The 21 GPIO drive seven-segment displays, keypads, and triac-fired heater loads via optocouplers, and the two UART modules interface with inverter boards and external displays. The automotive-grade temperature rating tolerates the +85C ambient found inside appliance cabinets, and the 44-QFN package minimizes PCB area below the 40x60 mm control board ceiling. Pair with an MCP23S17 SPI GPIO expander for additional load-switching channels.
Recommended
Battery Management Monitoring Unit
The PIC24HJ32GP204-H/ML is well suited to a battery-pack monitoring unit that reports cell voltage and temperature over CAN bus to a BMS master. Its 13-channel 10-bit ADC reads up to 13 lithium-cell voltages through a multiplexer, while two ECAN 2.0B controllers isolate the pack-internal network from the vehicle backbone. The 8-channel DMA scans ADC channels without CPU overhead, and the 32KB Flash stores cell-balancing firmware and fault thresholds. The automotive Grade 0 -40C to +150C window tolerates underhood battery-pack mounting, and the 44-QFN package dissipates heat evenly across the pack-monitoring PCB. Use dsPIC33FJ32GP204-H/ML if you need DSP for active cell-balancing algorithms.
Recommended
Recommended Products Summary
Engineering reference data for PIC24HJ32GP204-H/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | dsPIC33FJ32GP204-H/ML | PIC24HJ32GP202-H/ML | PIC24HJ32GP204-H/PT | PIC24HJ16GP304-H/ML | dsPIC33FJ16GP304-H/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | TQFP-44 - drop-in | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24H (16-bit) | dsPIC33F (DSP-enabled 16-bit) | PIC24H (16-bit) | PIC24H (16-bit) | PIC24H (16-bit) | dsPIC33F (DSP-enabled 16-bit) |
| Flash Memory | 32 KB | 32 KB | 28 KB | 32 KB | 16 KB | 16 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Speed | 20 MIPS @ 40 MHz | 20 MIPS @ 40 MHz | 20 MIPS @ 40 MHz | 20 MIPS @ 40 MHz | 20 MIPS @ 40 MHz | 20 MIPS @ 40 MHz |
| Operating Temperature | -40C to +150C | -40C to +150C | -40C to +150C | -40C to +150C | -40C to +150C | -40C to +150C |
| ECAN Modules | 2 | 2 | 2 | 2 | 1 | 1 |
| DSP Engine | No | Yes | No | No | No | Yes |
| Unit Price (qty-1) | $8.92 | ~$10.50 | ~$8.20 | ~$9.10 | ~$7.80 | ~$9.50 |
Key Differentiators
- AEC-Q100 Grade 0 qualification with 150C operating ceiling (vs dsPIC33FJ32GP204-I/ML)
- 44-QFN package with 21 GPIO and 13 ADC channels (vs PIC24HJ32GP202-H/ML)
- Dual ECAN 2.0B controllers for network isolation (vs PIC24HJ16GP304-H/ML)
Design Notes
Decouple each VDD/VSS pair with a 100 nF X7R ceramic placed within 3 mm of the pin, and add a single 10 uF X5R bulk capacitor on the main VDD trace. According to the Microchip datasheet 70289J, the PIC24HJ32GP204-H/ML draws a peak of approximately 70 mA at 40 MHz, so a 3.3 V LDO rated at least 250 mA (e.g., MCP1825) is required for headroom. The AVDD pin (when present on related variants) needs an additional 10 uH ferrite + 10 uF cap filter to keep ADC noise below 1 LSB.
The 44-QFN (8x8 mm) package has a theta_JA of approximately 31 C/W on a 4-layer JEDEC EIA/JESD51 test board, and theta_JC of about 4.2 C/W. The exposed thermal pad MUST be soldered to the PCB ground plane with at least 9 thermal vias for the device to meet the 31 C/W number. At 40 MHz operation drawing 70 mA from 3.3 V (0.231 W), junction temperature rise above ambient is roughly 7 C - well within automotive Grade 0 limits.
Route the ECAN differential pair (C1RX/C1TX) as a 120-ohm-impedance matched pair with no stubs, and keep the pair length-matched within 5 mm. The ICSP pins (PGED1, PGEC1) should be brought out to a header or test pad for production programming. Place the 8 MHz crystal within 5 mm of OSC1/OSC2 with short symmetric traces, and guard the crystal traces with a ground pour. The MCLR pin requires a 10 kohm pull-up to VDD plus a 100 nF cap to ground for noise immunity.
Do NOT enable the Peripheral Pin Select (PPS) lock bit until all peripheral mappings are finalized - re-locking requires a full chip erase on most variants. Do NOT exceed the 3.6 V absolute maximum on any pin, or the on-chip 5V-tolerant structures may be damaged. Do NOT leave the JTAG pins floating if JTAG is not used - tie TMS and TCK to VDD through 10 kohm pull-ups. Finally, do NOT program the Flash configuration bits last in your production flow - an error here can brick the device until a high-voltage ICSP recovery is performed.
Compliance Information
AEC-Q100 Grade 0 qualified per the -H temperature suffix in the Microchip product family nomenclature. RoHS and REACH compliance verified from Microchip product page. Halogen-free status was not explicitly listed in the verified data and is marked [DATA_NEEDED].