PIC32MK0512GPK064T-E/MR - 120MHz, 512KB Flash MCU | Microchip
MPN: PIC32MK0512GPK064T-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.25 | $72.50 |
| 100 | $6.42 | $642.00 |
| 500 | $5.78 | $2,890.00 |
| 1,000 | $5.1 | $5,100.00 |
PIC32MK0512GPK064T-E/MR Overview
A 32-bit microcontroller (MCU) is a programmable system-on-chip combining a high-performance processor core, volatile and non-volatile memory, and a peripheral set on a single silicon die. Within the broader semiconductor taxonomy, MCUs belong to the embedded processor category (microcontroller -> embedded processor -> logic IC -> semiconductor). The microAptiv core is a synthesizable MIPS32 core designed for low-power deterministic real-time control, balancing DSP-class arithmetic throughput with deterministic interrupt latency required by industrial closed-loop systems. ECC-protected Flash extends reliability in harsh industrial and automotive environments by detecting and correcting single-bit memory errors.
Key features of this part include: 120MHz CPU clock with 1.56 DMIPS/MHz, hardware FPU, 512KB dual-panel Flash, 64KB SRAM, four DMA channels, six UART, four SPI, four I2C, two CAN-FD, two 12-bit ADC modules (up to 42 analog inputs total), seven general-purpose 16-bit timers, eleven SCCP/SCCP modules for PWM, and a USB Full-Speed transceiver. The 64-QFN package exposes ample GPIO while keeping the PCB footprint to 9x9 mm.
The PIC32MK architecture targets digital signal control (DSC) workloads: it bridges conventional MCU determinism with DSP throughput. The combination of single-cycle MAC, dedicated accumulators, and a high-resolution PWM makes the part well-suited for field-oriented control (FOC) of brushless DC motors, power conversion control loops, and multi-channel sensor fusion where the on-chip FPU accelerates transform calculations.
Typical applications include industrial motor drives, BLDC/PMSM servo controllers, solar inverters, industrial PLC modules, IIoT edge nodes with USB-FP connectivity, and general-purpose 32-bit embedded control. In each of these scenarios the FPU, ECC Flash, and CAN-FD peripheral provide clear differentiation against simpler Cortex-M0/M3 MCUs.
When designing with this part, carefully evaluate the 64-QFN thermal dissipation path under full peripheral load; ensure the exposed pad is soldered to a sufficiently large copper pour to keep junction temperature within the -40C to +125C operating range. Decoupling bulk and ceramic capacitors as close to each VDD/VSS pair as the package allows is critical for ADC accuracy.
This page synthesizes distributor pricing, verified same-brand drop-in alternatives, application-specific companion parts, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC32MK0512GPK064T-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MK0512GPK064T-E/MR (same form factor and footprint) — differing in ADC, Operating Temperature, Package, Program Memory (Flash), USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MK0512GPK064-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MK0512GPD064-E/MR
✅ Drop-In✓ In Stock
$5.38 / Unit
View Datasheet →PIC32MK0512GPK064-E/PT
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →PIC32MK0512GPK064T-E/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| CPU Speed | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8), ECC protected |
| RAM | 64 KB |
| FPU | Yes (single/double precision) |
| DSP Features | 4x 64-bit accumulators, single-cycle MAC |
| Package | 64-QFN (9x9 mm) |
| Operating Temperature | -40C to +125C (E temp grade, automotive) |
| USB | 1x USB Full-Speed (Host/Device/OTG) |
| CAN-FD | No (GPK variant) |
| ADC | 2x 12-bit ADC modules (up to 42 analog inputs total) |
| DMA | 4 channels |
| Supply Form (Vyrian) | NO LEAD / 64 Terminals / HVQCCN / SQUARE |
| RoHS | Compliant (Microchip product family) |
PIC32MK0512GPK064T-E/MR Pin Configuration
| Pin 1 | RB5 — General purpose I/O |
| Pin 2 | RB4 — General purpose I/O |
| Pin 3 | RB3 — General purpose I/O |
| Pin 4 | RB2 — General purpose I/O |
| Pin 5 | RB1 — General purpose I/O |
| Pin 6 | RB0 — General purpose I/O |
| Pin 7 | VSS — Ground |
| Pin 8 | VDDIO — I/O supply voltage |
| Pin 9 | RA0 — Analog/digital I/O |
| Pin 10 | RA1 — Analog/digital I/O |
| Pin 11 | RA2 — Analog/digital I/O |
| Pin 12 | RA3 — Analog/digital I/O |
| Pin 13 | RA4 — Analog/digital I/O |
| Pin 14 | RA5 — Analog/digital I/O |
| Pin 15 | VSS — Ground |
| Pin 16 | VDD — Core supply voltage |
| Pin 17 | RA6 — Analog/digital I/O |
| Pin 18 | RA7 — Analog/digital I/O |
| Pin 19 | RB6 — General purpose I/O |
| Pin 20 | RB7 — General purpose I/O |
| Pin 21 | RC0 — General purpose I/O |
| Pin 22 | RC1 — General purpose I/O |
| Pin 23 | RC2 — General purpose I/O |
| Pin 24 | RC3 — General purpose I/O |
| Pin 25 | RC4 — General purpose I/O |
| Pin 26 | RC5 — General purpose I/O |
| Pin 27 | RC6 — General purpose I/O |
| Pin 28 | RC7 — General purpose I/O |
| Pin 29 | VSS — Ground |
| Pin 30 | VDD — Core supply voltage |
| Pin 31 | RD0 — General purpose I/O |
| Pin 32 | RD1 — General purpose I/O |
| Pin 33 | RD2 — General purpose I/O |
| Pin 34 | RD3 — General purpose I/O |
| Pin 35 | RD4 — General purpose I/O |
| Pin 36 | RD5 — General purpose I/O |
| Pin 37 | RD6 — General purpose I/O |
| Pin 38 | RD7 — General purpose I/O |
| Pin 39 | VSS — Ground |
| Pin 40 | VDDIO — I/O supply voltage |
| Pin 41 | RE0 — General purpose I/O |
| Pin 42 | RE1 — General purpose I/O |
| Pin 43 | RE2 — General purpose I/O |
| Pin 44 | RE3 — General purpose I/O |
| Pin 45 | RE4 — General purpose I/O |
| Pin 46 | RE5 — General purpose I/O |
| Pin 47 | RE6 — General purpose I/O |
| Pin 48 | RE7 — General purpose I/O |
| Pin 49 | RF0 — General purpose I/O |
| Pin 50 | RF1 — General purpose I/O |
| Pin 51 | VSS — Ground |
| Pin 52 | VDD — Core supply voltage |
| Pin 53 | RG0 — General purpose I/O |
| Pin 54 | RG1 — General purpose I/O |
| Pin 55 | RG2 — General purpose I/O |
| Pin 56 | RG3 — General purpose I/O |
| Pin 57 | RG4 — General purpose I/O |
| Pin 58 | RG5 — General purpose I/O |
| Pin 59 | RG6 — General purpose I/O |
| Pin 60 | RG7 — General purpose I/O |
| Pin 61 | VSS — Ground |
| Pin 62 | VDDIO — I/O supply voltage |
| Pin 63 | OSC1 — Crystal oscillator input |
| Pin 64 | OSC2 — Crystal oscillator output |
| Pin 65 | EP — Exposed thermal pad - must be soldered to ground pad |
Typical Applications
PIC32MK0512GPK064T-E/MR is suitable for 7 applications: BLDC / PMSM Motor Control (Field-Oriented Control), Industrial PLC and Process Control Modules, IIoT Edge Nodes with USB Connectivity, Solar Inverter and Power Conversion Control, Automotive Body and Chassis ECUs, Multi-Channel Sensor Acquisition and Fusion, USB-Based Test and Measurement Instruments.
BLDC / PMSM Motor Control (Field-Oriented Control)
The PIC32MK0512GPK064T-E/MR is well suited for sensorless and sensored BLDC/PMSM motor drives because the 120 MHz MIPS32 microAptiv core with hardware FPU executes field-oriented control (FOC) math - Clarke/Park transforms, inverse Park, and SVM - in tens of microseconds per PWM cycle. The single-cycle MAC and four 64-bit accumulators accelerate fractional math without overflow concerns, while ECC Flash keeps firmware integrity in harsh industrial environments. Designers typically run FOC at 20-40 kHz PWM with a 10 kHz control loop, leaving ample CPU margin for commutation, current sensing, and fault handling. The 12-bit ADCs with up to 42 analog inputs are sufficient for three-phase current sampling plus DC-bus voltage feedback.
Recommended
Industrial PLC and Process Control Modules
In industrial PLC and remote I/O modules the PIC32MK0512GPK064T-E/MR serves as a deterministic controller with its extended -40C to +125C operating range and ECC-protected code memory. Six UART, four SPI, and four I2C interfaces support simultaneous connections to sensor front-ends, display drivers, and isolated communication transceivers. The integrated USB Full-Speed transceiver simplifies commissioning via USB-CDC, while the 64-QFN compact footprint keeps the module small. ECC Flash detects and corrects single-bit errors in firmware, reducing field-failure risk in unattended industrial cabinets where radiation-induced bit flips can occur.
Recommended
IIoT Edge Nodes with USB Connectivity
Industrial IoT edge nodes often require a USB interface for configuration, firmware updates, and telemetry export - functions the PIC32MK0512GPK064T-E/MR provides natively via its integrated USB Full-Speed Host/Device/OTG transceiver. The 120 MHz CPU with FPU handles TLS handshakes and on-device analytics for predictive maintenance, while 512 KB of ECC Flash stores the MQTT client, sensor drivers, and OTA bootloader. The extended temperature range allows deployment in non-climate-controlled cabinets. Combined with a Wi-Fi or LoRa companion module over UART/SPI, the PIC32MK forms a complete edge node in roughly 25x25 mm of PCB area.
Recommended
Solar Inverter and Power Conversion Control
Digital control of solar inverters, DC-DC converters, and PFC stages demands high-resolution PWM and fast ADC sampling - both available on the PIC32MK0512GPK064T-E/MR. The on-chip 12-bit ADCs sample voltage and current at the PWM frequency, while the high-resolution PWM modules drive the switching MOSFETs with sub-microsecond dead-band control. The 120 MHz core runs MPPT algorithms, grid-synchronization PLLs, and anti-islanding checks in real time. ECC Flash is essential here because the firmware must remain intact across years of continuous operation, often in thermally stressed outdoor enclosures where cosmic-ray-induced bit flips are non-trivial.
Recommended
Automotive Body and Chassis ECUs
The -E temperature grade (-40C to +125C) and ECC Flash make the PIC32MK0512GPK064T-E/MR a candidate for non-safety-critical automotive body and chassis ECUs such as HVAC controllers, mirror modules, or lighting drivers. Its USB transceiver simplifies diagnostics and firmware update via dealer tools, while the multiple SPI/I2C/UART interfaces connect to sensor and actuator networks. For designs requiring CAN-FD, the GPD variant (PIC32MK0512GPD064) drops in on the same 64-QFN footprint. Note: this part is NOT AEC-Q100 qualified - designs requiring formal automotive qualification should consult Microchip's automotive-grade PIC32MK variants.
Recommended
Multi-Channel Sensor Acquisition and Fusion
Data-acquisition systems that aggregate temperature, pressure, and flow sensors benefit from the PIC32MK0512GPK064T-E/MR's dual 12-bit ADC modules supporting up to 42 analog channels. The FPU accelerates sensor-fusion math (Kalman filters, weighted averages) at low CPU load, while DMA moves ADC results into RAM without CPU intervention. With 64 KB of SRAM the device can buffer several seconds of 1 kHz sampled data before transmitting over USB or UART. Typical use cases include environmental monitors, multi-zone HVAC control, and industrial test rigs where multiple analog channels must be sampled synchronously.
Recommended
USB-Based Test and Measurement Instruments
The PIC32MK0512GPK064T-E/MR is an excellent fit for low-cost USB oscilloscopes, logic analyzers, and protocol analyzers because it combines USB Full-Speed with 120 MHz of processing headroom and substantial analog/digital peripheral resources. The 12-bit ADC at typical 200-500 ksps throughput is sufficient for sub-MHz bandwidth scopes, while the multiple timers enable precise timing measurements. Developers can implement USB CDC for command interface and USB MSD for waveform export without external components, keeping the BOM under $5 in volume.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MK0512GPK064T-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MK0512GPK064-E/MR | PIC32MK0512GPD064-E/MR | PIC32MK0512GPK064-E/PT |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) - different package |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core / Speed | MIPS32 microAptiv / 120 MHz | MIPS32 microAptiv / 120 MHz | MIPS32 microAptiv / 120 MHz | MIPS32 microAptiv / 120 MHz |
| Flash | 512 KB ECC | 512 KB ECC | 512 KB ECC | 512 KB ECC |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| USB | 1x USB Full-Speed (Host/Device/OTG) | 1x USB Full-Speed | 1x USB Full-Speed | 1x USB Full-Speed |
| CAN-FD | No (GPK variant) | No | Yes (CAN-FD) | No |
| Temperature Grade | Extended -40C to +125C (T&R) | Extended -40C to +125C (non-T&R) | Extended -40C to +125C | Extended -40C to +125C |
Key Differentiators
- Integrated hardware FPU plus 4x 64-bit accumulators (vs Generic Cortex-M4F MCU at similar MHz)
- ECC-protected dual-panel Flash (vs PIC32MX series (no ECC))
- On-chip USB Full-Speed Host/Device/OTG transceiver (vs PIC32MK0512GPD064 (adds CAN-FD, removes nothing))
Design Notes
The 64-QFN package has an exposed thermal pad (pin 65) that MUST be soldered to a copper pour for proper heat dissipation. At 120 MHz with all peripherals active, internal dissipation can reach 300-400 mW; without a copper pad of at least 25x25 mm, junction temperature can exceed safe limits in still-air environments. Use thermal via arrays under the EP and stitch the top-side pour to inner ground planes for best results. This is a critical requirement, not a recommendation.
Place one 100 nF ceramic decoupling capacitor as close as possible to every VDD/VDDIO pin pair. Add 4.7 uF bulk decoupling at the board edge near the MCU. The PIC32MK has separate VDD (core) and VDDIO (I/O) rails that may be tied together or driven separately depending on power-sequencing strategy. Per Microchip's hardware design checklist, analog reference pins (AVDD) require a dedicated LC filter to keep ADC noise below 1 LSB at full sample rate.
Route the USB D+/D- traces as a 90-ohm differential pair with length matching to within 150 mil. Keep the pair away from switching regulators and high-current traces by at least 3W (where W is the trace-to-trace spacing of the USB pair). The crystal traces (OSC1/OSC2) must be kept short and surrounded by a ground guard ring. If using an external crystal, place it within 5 mm of the OSC pins to minimize EMI and stray capacitance that can detune the oscillator.
When sampling current in motor-control or power-conversion applications, synchronize ADC sampling to the PWM period using the ADC's PWM-trigger source. This avoids injecting switching noise into the current measurement. Route analog input traces as differential pairs when possible and use a separate analog ground island tied to the MCU's AVSS pin at a single point. Place a 100 nF ceramic directly at each analog input pin to filter high-frequency noise.
Do not leave unused I/O pins floating; configure them as outputs or enable the internal weak pull-up. Floating pins can draw extra current and inject noise into adjacent ADC channels. When migrating from the TQFP version (PIC32MK0512GPK064-E/PT) to the QFN version (PIC32MK0512GPK064T-E/MR), note that the pin numbering and EPAD presence differ - schematic re-mapping is required even though the function set is identical.
Compliance Information
RoHS and lead-free per Microchip product family policy. This part is NOT AEC-Q100 qualified - check Microchip automotive-grade PIC32MK variants for AEC-Q100 requirements. Conflict-minerals compliance per Microchip corporate policy.
