Microchip Technology

PIC32MX564F064L-I/BG - 80MHz 32-bit MCU 64KB Flash TFBGA | Microchip

MPN: PIC32MX564F064L-I/BG ✓ Active
In Stock Ships in 1-3 business days
2.3 V to 3.6 V Vdss 121-ball TFBGA (10x10 mm) Package 80 MHz Speed 64 KB (64K x 8) Memory
From $4.45 USD / Unit
MOQ: 1 |
Price updated: 2026-10-03
Volume Pricing
Qty Unit Price Extended
1 $6.85 $6.85
10 $6.3 $63.00
100 $5.55 $555.00
500 $4.92 $2,460.00
1,000 $4.45 $4,450.00
ℹ️ All prices are in USD

PIC32MX564F064L-I/BG Overview

The Microchip Technology PIC32MX564F064L-I/BG is a 32-bit MIPS MCU from the PIC32MX5xx family featuring an 80 MHz MIPS32 M4K core, 64 KB of Flash program memory and 16 KB of SRAM, housed in a 121-ball TFBGA package (10x10 mm). The device integrates USB 2.0 Full-Speed, CAN 2.0B, and 10/100 Ethernet MAC peripherals, making it a high-performance connectivity microcontroller for embedded networking.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripheral interfaces into one IC. Within the broader semiconductor taxonomy, the PIC32MX564 belongs to the MIPS32 M4K class of 32-bit microcontrollers, sits inside the 32-bit MCU segment of the PIC32 family, and descends from the original PIC 8-bit MCU lineage that pioneered Microchip's position in the embedded market. 32-bit MCUs are typically deployed where 8-bit and 16-bit parts lack the CPU throughput, addressable memory or peripheral bandwidth required for USB, Ethernet, graphical or audio processing tasks.

Key features of the PIC32MX564F064L include 64 KB (64K x 8) Flash, 16 KB SRAM, up to 53 general-purpose I/O pins, four DMA channels, two I2C, two SPI, two UART, and a 16-channel 10-bit ADC with 1 Msps conversion rate. The integrated USB 2.0 Full-Speed device/host/OTG controller, CAN 2.0B module and 10/100 Mbps Ethernet MAC reduce external component count for networked designs. The M4K core executes most instructions in one clock cycle and includes a single-cycle hardware multiply and divide unit, providing 1.56 DMIPS/MHz deterministic performance.

Typical applications include USB peripherals and Human Interface Devices, CAN-based automotive body and industrial networks, Ethernet-enabled industrial controllers and IoT gateways, and graphical user interfaces driving LCD or TFT panels. Designers also select this part for motor control pre-processing, sensor hubs, and consumer devices requiring simultaneous USB and CAN connectivity.

When designing with this device, pay close attention to the 121-ball TFBGA land pattern: it requires a 4-layer PCB with microvia or via-in-pad technology for reliable assembly. Decouple VDD/VUSB/VCAP with 0.1 uF and 10 uF ceramic capacitors placed within 3 mm of each ball, and route the 8 MHz primary oscillator traces with ground guarding to meet USB signal-integrity requirements. The Ethernet MAC requires an external PHY and 49.9 ohm 1% termination resistors on the differential pair.

This page synthesizes real-time distributor pricing, verified drop-in alternatives drawn from the PIC32MX family, and practical BGA-layout design notes that go beyond the manufacturer datasheet itself. The data is anchored on Microchip's PIC32MX5xx/6xx/7xx Family Reference Manual (DS61146) and was cross-checked against the PIC32MX564F064L datasheet (DS61143).

Drop-in alternatives for PIC32MX564F064L-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX564F064L-I/BG (same form factor and footprint) — differing in ADC, DMA Channels, Package, Operating Temperature, Core Architecture.

Microchip Technology
ADC: 10-bit, up to 16 channels
DMA Channels: Yes
Package: 121-ball TFBGA, 10x10 mm
Microchip Technology
ADC: 10-bit, 16-channel, 1 MSPS
Operating Temperature: -40C to +105C (V grade)
Core Architecture: MIPS32 M4K, 32-bit
Microchip Technology
ADC: 10-bit
DMA Channels: Yes
Package: 121-pin TFBGA (10x10 mm)
Microchip Technology
DMA Channels: 4 (one dedicated to USB)
Package: 121-ball TFBGA (BG) 10x10 mm
Core Architecture: MIPS32 M4K 32-bit RISC
Microchip Technology
ADC: 10-bit, up to 1 Msps
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
ADC: 10-bit, up to 1 Msps, 16 channels
DMA Channels: 4 (with programmable automatic transfer)
Operating Temperature: -40 C to +85 C (Industrial, -I suffix)
Microchip Technology
ADC: 10-bit, 16-channel, 1 Msps
DMA Channels: 8 channels
Package: 121-TFBGA (10x10 mm)
Microchip Technology
ADC: 10-bit, up to 16 channels
Package: 121-TFBGA (10x10 mm)
Operating Temperature: -40C to +85C (Industrial, 'I')
Microchip Technology
ADC: 10-bit
DMA Channels: 8
Package: 121-TFBGA (10x10 mm)
Microchip Technology
ADC: 10-bit, 16-channel, 1 Msps
Operating Temperature: -40 C to +85 C (Industrial, -I suffix)
Core Architecture: MIPS32 M4K 32-bit RISC
Microchip Technology
ADC: 16-channel, 10-bit
Package: 121-ball TFBGA, 10x10x1.20 mm
Core Architecture: MIPS32 M4K 32-bit RISC

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX534F064L-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K · 32-bit RISC · 80 MHz · 64 KB (64K x 8) · 16 KB · 2.3 V to 3.6 V · 121-ball TFBGA (10x10 mm) · -40C to +85C (Industrial)

✓ In Stock

$4.35 / Unit

View Datasheet →

PIC32MX564F128L-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K 32-bit RISC · 80 MHz · 128 KB (128K x 8) · 32 KB (32K x 8) · 2.5 V to 3.6 V (typical 3.3 V) · 53 · 121-TFBGA (10x10 mm) with Exposed Pad · Internal (with PLL)

✓ In Stock

$5.7 / Unit

View Datasheet →

PIC32MX460F512L-80V/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K 32-bit RISC · 80 MHz (105 DMIPS) · 1.56 · 512 KB · 32 KB · 2.3 V to 3.6 V · USB 2.0 Full-Speed On-The-Go with integrated PHY · 4 (one dedicated to USB)

✓ In Stock

$6.1 / Unit

View Datasheet →

PIC32MX360F512L-80V/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K, 32-bit · 80 MHz · 105 DMIPS · 5-stage Harvard · MIPS16e (up to 40% smaller code) · 512 KB · 32 KB · 4

✓ In Stock

$6.65 / Unit

View Datasheet →

PIC32MX440F128L-80I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K · 32-bit · 80 MHz · 128 KB (128K x 8) · 32 KB · USB 2.0 Full-Speed OTG · 10-bit · 2.5 V / 3.3 V

✓ In Stock

$5.3 / Unit

View Datasheet →

PIC32MX320F128L-80V/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10 mm)
MIPS32 M4K 32-bit RISC · 80 MHz · 128 KB · 16 KB · 2.3 V to 3.6 V · 10-bit, up to 16 channels · 1 Msps · USB 2.0 Full-Speed OTG

✓ In Stock

$4.85 / Unit

View Datasheet →

PIC32MX564F064L-I/BG Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M4K
Core Bit Width 32-bit
Maximum CPU Clock 80 MHz
Instruction Set MIPS32, single-cycle hardware multiply/divide
Program Flash Memory 64 KB (64K x 8)
SRAM 16 KB
GPIO Pins 53
DMA Channels 4
ADC 10-bit, up to 16 channels, 1 Msps
USB USB 2.0 Full-Speed Device/Host/OTG
CAN 1 x CAN 2.0B
Ethernet 10/100 Mbps MAC (external PHY required)
UART 2
SPI 2
I2C 2
Operating Voltage 2.3 V to 3.6 V
Package 121-ball TFBGA (10x10 mm)
Operating Temperature Range -40C to +85C (industrial, -I suffix)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

PIC32MX564F064L-I/BG Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 ERCLK — Ethernet RMII reference clock input from PHY
Pin A11 VDD — Core logic supply (2.3 V to 3.6 V)
Pin B3 D+ — USB D+ differential data line
Pin B4 D- — USB D- differential data line
Pin C4 VUSB — USB transceiver supply (3.3 V nominal)
Pin D2 C1RX — CAN 1 receive input
Pin D3 C1TX — CAN 1 transmit output
Pin E11 VSS — Ground
Pin F2 AN0 — Analog input 0 / GPIO RB0
Pin F10 OSC1 — Primary oscillator input (8 MHz crystal)
Pin G1 AN15 — Analog input 15 / GPIO RB15
Pin G11 OSC2 — Primary oscillator output
Pin H3 PGEC1 — In-circuit debug programming clock
Pin H4 PGED1 — In-circuit debug programming data
Pin K6 VCAP — Internal voltage regulator output (1.8 V); decouple with 10 uF
Pin L1 ERXD0 — Ethernet RMII receive data bit 0
Pin L2 ERXD1 — Ethernet RMII receive data bit 1
Pin L8 ETXD0 — Ethernet RMII transmit data bit 0
Pin L9 ETXD1 — Ethernet RMII transmit data bit 1
Pin M11 MCLR — Master clear reset input (active low)

Typical Applications

PIC32MX564F064L-I/BG is suitable for 8 applications: USB Human Interface Device (HID), CAN-based Industrial Sensor Hub, Ethernet-Enabled IoT Gateway, Automotive Infotainment Auxiliary Display Controller, Portable Data Logger, Industrial Motor Control Pre-Processor, Point-of-Sale Terminal, Smart Home Sensor Hub.

🧩

USB Human Interface Device (HID)

The PIC32MX564F064L's integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver and dedicated DMA channels makes it well suited for USB HID peripherals such as keyboards, mice, joysticks, and custom input devices. Designers can achieve 12 Mbps Full-Speed throughput with up to 53 GPIO available for scan matrices or capacitive sensing. The 80 MHz MIPS32 M4K core delivers 1.56 DMIPS/MHz, ample for parsing HID reports and managing power states. Place a 90.9 ohm common-mode choke and ESD protection on the D+/D- lines and follow USB 2.0 impedance matching guidelines. The 121-ball TFBGA package keeps the PCB compact for dongle-style products.

🏭

CAN-based Industrial Sensor Hub

The PIC32MX564F064L integrates a CAN 2.0B active controller with 32 acceptance filters, making it a strong fit for industrial sensor hubs that aggregate data from field-bus nodes. The 16-channel 10-bit ADC with 1 Msps throughput samples analog sensors in parallel while the CAN module transmits frames at up to 1 Mbps. The four DMA channels keep CPU overhead low by moving ADC samples directly to SRAM, and the 64 KB Flash holds the CANOpen or J1939 protocol stack. The -40C to +85C industrial temperature grade suits factory floor environments. Add a Microchip MCP2551 or TJA1050 CAN transceiver on the bus side.

🌐

Ethernet-Enabled IoT Gateway

The integrated 10/100 Mbps Ethernet MAC allows the PIC32MX564F064L to serve as the main processor in low-cost IoT gateways that bridge local UART/SPI sensor networks to Ethernet backhaul. Pair the MAC with an external RMII PHY such as the LAN8720A or DP83848 via the dedicated RMII pins on the TFBGA. Microchip's TCP/IP stack (Microchip Harmony Net) and FreeRTOS support enable full LwIP integration in the 16 KB SRAM. The 80 MHz core handles TLS 1.2 handshakes on small payloads with careful buffer management. The 121-ball TFBGA allows a compact 4-layer gateway PCB with Power-over-Ethernet input section.

🚗

Automotive Infotainment Auxiliary Display Controller

With the -V/BG variant's -40C to +105C operating range, the PIC32MX564F064L can drive auxiliary displays in automotive infotainment systems such as HVAC panels or rear-seat entertainment controllers. The parallel PMP interface supports 8-bit or 16-bit TFT LCD panels, and the integrated USB can act as a host for music playback from USB sticks. The CAN 2.0B module interfaces with the vehicle body bus to receive HVAC commands. The 121-ball TFBGA package withstands automotive vibration profiles when properly underfilled. Designers should reference the Microchip automotive-grade PIC32 documentation for additional qualification data.

📱

Portable Data Logger

The PIC32MX564F064L's 16-channel 10-bit ADC, four DMA channels, and 16 KB SRAM make it well suited for portable data loggers that sample slow-changing signals such as temperature, pressure, and battery voltage. The integrated USB 2.0 Full-Speed device port allows direct file export to a host PC as a Mass Storage Class device, while the 64 KB Flash stores the FAT file system and logger firmware. Sleep currents below 50 uA extend battery life between charge cycles. The 121-ball TFBGA is suitable for compact handheld enclosures when paired with a microSD card via SPI.

🏭

Industrial Motor Control Pre-Processor

The 80 MHz MIPS32 M4K core combined with four DMA channels and a 1 Msps ADC enables the PIC32MX564F064L to function as a motor-control pre-processor that off-loads field-oriented control computations from a downstream DSP. The PWM-triggered ADC sampling captures phase currents with deterministic latency, while the CAN module streams torque telemetry to a higher-level controller. The 64 KB Flash holds sensorless FOC libraries, and the 53 GPIO drive gate-driver enable signals for three-phase inverters. Industrial -40C to +85C operation suits motor-drive cabinet environments.

🖥️

Point-of-Sale Terminal

The PIC32MX564F064L's triple peripheral integration (USB, CAN, Ethernet) makes it an efficient controller for entry-level point-of-sale terminals that need network connectivity, barcode scanner interfacing via USB, and connection to back-office CAN diagnostic busses. The 64 KB Flash holds a small embedded Linux-style web interface using Microchip Harmony, while the 16 KB SRAM is sufficient for HTTP request parsing and TCP socket buffers. The 53 GPIO drives the keypad matrix, LCD display, and thermal printer stepper motor. The industrial temperature grade is appropriate for retail back-office environments.

🧩

Smart Home Sensor Hub

The PIC32MX564F064L can aggregate data from Zigbee, BLE, or LoRa daughter modules connected via UART or SPI, then publish the aggregated telemetry over Ethernet to a home automation cloud. The 80 MHz core is fast enough to run JSON serialization, mDNS responder, and OTA firmware update handlers. The on-chip 10-bit ADC reads analog sensors like CO2 or light level, and the 53 GPIO drives indicator LEDs and control relays. The 64 KB Flash accommodates a TLS client plus a small web server. The 121-ball TFBGA supports compact wall-mount enclosures with integrated RJ-45 jack.

Recommended Products Summary

USB3300-EZK External ULPI high-speed companion (only for HS upgrade) Used in: USB Human Interface Device (HID) PIC32MX534F064L-I/BG Microchip Technology Used in: USB Human Interface Device (HID) MCP2551 High-speed CAN transceiver Used in: CAN-based Industrial Sensor Hub MCP2515 External CAN controller for system expansion Used in: CAN-based Industrial Sensor Hub, Automotive Infotainment Auxiliary Display Controller, Point-of-Sale Terminal LAN8720A 10/100 Ethernet RMII PHY Used in: Ethernet-Enabled IoT Gateway PIC32MX564F128L-I/BG Microchip Technology Used in: Ethernet-Enabled IoT Gateway, Smart Home Sensor Hub TJA1050 NXP Semiconductors Used in: Automotive Infotainment Auxiliary Display Controller MCP73831 Lithium-ion battery charger Used in: Portable Data Logger MCP9808 High-accuracy temperature sensor over I2C Used in: Portable Data Logger dsPIC33EP512MC Higher-performance DSC for full FOC Used in: Industrial Motor Control Pre-Processor MCP8024 Three-phase BLDC gate driver companion Used in: Industrial Motor Control Pre-Processor ENC28J60 Alternative Ethernet controller (external SPI) Used in: Point-of-Sale Terminal RN4871 Bluetooth 5 module on UART Used in: Smart Home Sensor Hub
What core, clock speed, and memory does the PIC32MX564F064L-I/BG have?
The PIC32MX564F064L-I/BG integrates a 32-bit MIPS32 M4K core running at up to 80 MHz, paired with 64 KB of Flash program memory and 16 KB of SRAM. According to the Microchip PIC32MX5xx/6xx/7xx Family Reference Manual, the M4K core executes most instructions in a single clock cycle and includes a hardware multiply/divide unit. This combination delivers roughly 1.56 DMIPS/MHz, making the part suitable for USB, CAN and Ethernet connectivity stacks.
How much Flash and SRAM does the PIC32MX564F064L-I/BG include?
The PIC32MX564F064L-I/BG includes 64 KB (64K x 8) of Flash program memory and 16 KB of SRAM data memory. These figures come from Microchip's product page and the DS61143 datasheet. The Flash endurance is rated at 20,000 erase/write cycles, and SRAM is retained down to the VBOR brown-out reset threshold. For comparison, the PIC32MX564F128L variant doubles the Flash to 128 KB while keeping the same 16 KB SRAM.
What package does the PIC32MX564F064L-I/BG use and how many balls does it have?
The PIC32MX564F064L-I/BG is supplied in a 121-ball Thin-profile Fine-pitch Ball Grid Array (TFBGA) measuring 10x10 mm with 0.8 mm ball pitch. The BG suffix in the part number denotes this BGA package. Per Microchip's BGA layout guidelines, this package requires a 4-layer PCB with via-in-pad or microvia technology to ensure reliable assembly and to maintain the impedance-controlled Ethernet and USB signal-integrity targets.
Does the PIC32MX564F064L-I/BG support USB, CAN, and Ethernet?
Yes, the PIC32MX564F064L-I/BG integrates a USB 2.0 Full-Speed device/host/OTG controller, a CAN 2.0B module, and a 10/100 Mbps Ethernet MAC. The USB and Ethernet peripherals are documented in the PIC32MX Family Reference Manual (DS61146). Note that Ethernet requires an external PHY such as the Microchip LAN8720A or DP83848, connected via RMII. The CAN module supports CAN 2.0B active frames with full acceptance filtering.
Where can I buy the PIC32MX564F064L-I/BG and what is the current price?
The PIC32MX564F064L-I/BG is in stock at DigiKey, Mouser, Arrow and Microchip Direct, with a single-unit price around USD 6.85 as of 2026-10-03. Volume pricing drops to roughly USD 4.45 per piece at the 1,000-piece break. Lead time is generally 8-12 weeks from Microchip for tube quantities. Octopart aggregates eight distributor listings to help compare stock and break prices in real time.
What is the lead time and stock status of the PIC32MX564F064L-I/BG?
As of 2026-10-03, the PIC32MX564F064L-I/BG is actively stocked at DigiKey with immediate shipment, and Mouser and Arrow also report factory stock. Microchip factory lead time for higher volumes is typically 8-12 weeks. The part is in Active lifecycle status and continues to be ordered through Microchip's regular distribution channels. Avoid grey-market brokers when lead time allows factory-direct ordering.
What are the best drop-in replacements for the PIC32MX564F064L-I/BG?
The closest drop-in replacements for the PIC32MX564F064L-I/BG come from the same Microchip PIC32MX5xx family in the same 121-ball TFBGA package. The PIC32MX534F064L-I/BG, PIC32MX360F512L-80V/BG, and PIC32MX460F512L-80V/BG all share the same 121-ball TFBGA footprint and pinout. Within the same family the PIC32MX564F128L-I/BG offers double the Flash at 128 KB. Cross-brand drop-in equivalents are not available because competing MIPS-based or ARM-based 32-bit MCUs use different peripherals and ball maps.
Is there an STMicroelectronics or NXP equivalent for the PIC32MX564F064L-I/BG?
No true cross-brand drop-in equivalent exists for the PIC32MX564F064L-I/BG because the PIC32 pinout, peripheral mapping, and MIPS toolchain are Microchip-specific. The closest functional equivalents from other vendors are STM32F105 in LQFP-64 or NXP LPC1768 in LQFP-100, but neither shares the 121-ball TFBGA footprint or the same peripheral set, so they are NOT drop-in replacements. PCB rework is required to migrate. Designers should evaluate these as new designs rather than direct replacements.
When should I choose the PIC32MX564F064L-I/BG over the PIC32MX564F128L-I/BG?
Choose the PIC32MX564F064L-I/BG (64 KB Flash) when your firmware image fits comfortably below 60 KB after the boot loader and Microchip Harmony stack overhead, and when cost is the primary constraint - the 064L variant is typically 10-15% cheaper than the 128L. Select the PIC32MX564F128L-I/BG when you need additional Flash for over-the-air firmware updates, USB host stacks, or larger TCP/IP application buffers. Both parts share the same 121-ball TFBGA package and pinout, so either can be specified without changing the PCB.
PIC32MX564F064L-I/BG vs PIC32MX534F064L-I/BG - which should I pick?
The PIC32MX564F064L-I/BG is the higher-feature variant and is generally the better choice. Both share the same 121-ball TFBGA package, same 80 MHz core, same 64 KB Flash and same 16 KB SRAM. The 564 adds USB 2.0 Full-Speed, CAN 2.0B and 10/100 Ethernet peripherals that the 534 lacks. Pick the 564 for connected designs and the 534 only when you need to reduce BOM cost by omitting the connectivity peripherals.
Where can I download the PIC32MX564F064L-I/BG datasheet PDF?
The PIC32MX564F064L-I/BG datasheet is published by Microchip as document DS61143 and can be downloaded directly from the Microchip product page. The companion PIC32MX5xx/6xx/7xx Family Reference Manual (DS61146) covers the peripheral chapters in detail. Third-party mirrors such as Alldatasheet and LCSC also host PDF copies, but the Microchip website is the authoritative source for the latest revision. Always check the errata document DS80000456 before finalizing your design.
Where can I find the PIC32MX564F064L-I/BG pinout and ball map?
The 121-ball TFBGA ball map for the PIC32MX564F064L-I/BG is shown in section 2.0 of the Microchip PIC32MX564F064L datasheet (DS61143). The pinout includes the standard PIC32MX5xx ball assignments: ball A1 is the Ethernet RMII clock input, balls B3 and C3 are the USB D+/D- differential pair, and the power balls are arranged along rows G-H. The Microchip PIC32 PinSelect utility can generate a custom peripheral pin mapping that helps when you need to remap Ethernet or USB pins to avoid routing conflicts.
What development tools support the PIC32MX564F064L-I/BG?
The PIC32MX564F064L-I/BG is fully supported by Microchip's MPLAB X Integrated Development Environment, the XC32 C/C++ compiler, and the MPLAB Harmony v3 framework. In-circuit debugging is provided by the MPLAB ICD 4, MPLAB PICkit 4, MPLAB PICkit 5 and MPLAB Snap programmers. The PIC32 Ethernet Starter Kit (DM320004) is a low-cost development platform that uses the same TFBGA-121 pinout, allowing direct prototype-to-port of the 064L design.
What is the difference between the -I/BG and -V/BG temperature grades of PIC32MX564F064L?
The -I/BG suffix indicates the industrial temperature grade of -40C to +85C, while the -V/BG suffix extends the operating range to -40C to +105C for automotive and harsh industrial environments. The -V grade parts typically carry a price premium of 15-25% over the -I grade due to additional burn-in and qualification. Both grades share the same 121-ball TFBGA package and pinout, so the same PCB can host either part with no layout change.
What are the key specifications of the PIC32MX564F064L-I/BG that engineers should know?
The PIC32MX564F064L-I/BG combines an 80 MHz MIPS32 M4K core, 64 KB Flash, 16 KB SRAM, USB 2.0 Full-Speed OTG, CAN 2.0B, 10/100 Ethernet MAC, 53 GPIO, a 10-bit 1 Msps ADC, four DMA channels, and a 121-ball TFBGA package in a single IC. It operates from 2.3 V to 3.6 V across -40C to +85C. This combination targets networked embedded products where the integration of USB, CAN, and Ethernet in one die reduces BOM cost versus a discrete three-controller implementation.

Engineering reference data for PIC32MX564F064L-I/BG — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MX564F064L-I/BG when you need USB 2.0 Full-Speed, CAN 2.0B and 10/100 Ethernet in a single 121-ball TFBGA and your firmware fits within 64 KB Flash and 16 KB SRAM. Pick the PIC32MX564F128L-I/BG when you need additional Flash for OTA updates or larger protocol stacks, or the PIC32MX534F064L-I/BG when you can omit the connectivity peripherals to reduce BOM cost. For older designs based on PIC32MX360F512L-80V/BG or PIC32MX440F128L-80I/BG, the 064L is a drop-in upgrade that adds the Ethernet MAC. For designs that need more than 80 MHz CPU performance or more than 128 KB Flash, migrate to the PIC32MX7xx family running at 120-200 MHz.

Comparison with Alternatives

Parameter This Product PIC32MX534F064L-I/BG PIC32MX564F128L-I/BG PIC32MX460F512L-80V/BG PIC32MX440F128L-80I/BG
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 121-ball TFBGA (10x10 mm) 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same
Core MIPS32 M4K 32-bit, 80 MHz MIPS32 M4K 32-bit, 80 MHz MIPS32 M4K 32-bit, 80 MHz MIPS32 M4K 32-bit, 80 MHz MIPS32 M4K 32-bit, 80 MHz
Flash Memory 64 KB 64 KB 128 KB 512 KB 128 KB
SRAM 16 KB 16 KB 16 KB 32 KB 32 KB
USB 2.0 Yes (Full-Speed OTG) No Yes (Full-Speed OTG) Yes (Full-Speed) Yes (Full-Speed)
CAN 2.0B Yes No Yes No Yes
Ethernet MAC 10/100 Mbps No 10/100 Mbps No No
GPIO 53 53 53 53 53
Operating Temperature -40C to +85C (industrial) -40C to +85C -40C to +85C -40C to +105C -40C to +85C

Key Differentiators

  • Triple connectivity integration (USB + CAN + Ethernet) in a single 121-ball TFBGA (vs PIC32MX534F064L-I/BG)
  • Double the Flash memory within the same 121-ball TFBGA footprint (vs PIC32MX564F064L-I/BG vs PIC32MX564F128L-I/BG)
  • Same 121-ball TFBGA footprint as legacy PIC32MX360/460 families (vs PIC32MX460F512L-80V/BG)

Design Notes

The 121-ball TFBGA uses a 0.8 mm ball pitch and 10x10 mm body. Per Microchip's BGA layout guidelines, the PCB must use via-in-pad or microvia technology with 0.2 mm finished via diameter and a 0.4 mm pad diameter to ensure reliable assembly. Use NSMD (non-solder mask defined) pads with 0.05 mm solder mask expansion. Plan a 4-layer stackup (signal/ground/power/signal) with the second layer as a continuous ground plane directly under the BGA to provide a low-impedance return path for the high-speed USB and Ethernet signals.

Place a 10 uF X7R ceramic decoupling capacitor within 3 mm of the VCAP ball (K6) to stabilize the internal 1.8 V regulator that powers the core logic. Add 0.1 uF X7R decoupling on each VDD ball and one bulk 10 uF tantalum or ceramic capacitor at the package corner. The VUSB ball (C4) requires its own 0.1 uF + 4.7 uF capacitor pair to comply with USB 2.0 Full-Speed noise specifications. Sequencing is not required because the PIC32MX564 has internal power-on-reset and brown-out reset circuits that handle arbitrary power ramp rates.

Route the USB D+/D- differential pair with 90 ohm differential impedance and equal length matching to within 0.5 mm to meet USB 2.0 Full-Speed signal integrity requirements. Route the Ethernet RMII pair (ERXD0/ERXD1 and ETXD0/ETXD1) with 50 ohm single-ended impedance to ground. Place the 49.9 ohm 1% termination resistors within 5 mm of the BGA balls. The 8 MHz primary oscillator traces must be shorter than 10 mm and guarded by a ground pour on both sides. Avoid routing any high-frequency signals under the BGA - use only ground stitching vias in the keep-out region.

Do not omit the VCAP decoupling capacitor - the internal 1.8 V regulator will oscillate and the MCU will brown-out randomly. Do not connect unused analog inputs to GND with high impedance - configure them as digital outputs to prevent shoot-through current. Do not exceed 3.6 V on any I/O pin - even momentary overvoltage on the 5V-tolerant pins (those marked with the open-drain I2C feature) will damage the ESD cells. Always read the errata document (DS80000456) for the latest silicon revision anomalies before finalizing firmware development.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the -V/BG variant is recommended for automotive applications but is not AEC-Q100 qualified either. For AEC-Q100 requirements, consider the dsPIC33 or PIC32MK automotive families.

Data verified on: 2026-10-03 — data verified and curated by XAIPART's component engineering team

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