PIC32MX570F512HT-I/PT - 32-bit 40MHz 512KB Flash MCU | Microchip
MPN: PIC32MX570F512HT-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.86 | $8.86 |
| 10 | $7.94 | $79.40 |
| 100 | $6.83 | $683.00 |
| 500 | $6.02 | $3,010.00 |
| 1,000 | $5.42 | $5,420.00 |
PIC32MX570F512HT-I/PT Overview
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, flash program memory, SRAM data memory, and configurable peripherals on a single die, sitting above 8/16-bit MCUs in processing capability while below microprocessors in system cost. The PIC32MX family belongs to the broader category of embedded microcontrollers, which in turn are part of the power management and digital IC ecosystem used in industrial, consumer, and IoT products. Within that taxonomy, PIC32MX570 devices are positioned for USB-connected and graphics-capable embedded designs.
Key features include 83 DMIPS core performance, peripheral pin select (PPS) for flexible I/O mapping, parallel master port (PMP) with dual buffers for graphics, two I2S and four SPI modules for codec and serial communications, an integrated CTMU for capacitive touch, and a real-time clock/calendar (RTCC). The 64-pin TQFP package provides 5V-tolerant I/O on most pins and supports industrial temperature grades from -40C to +85C.
Technically, the PIC32MX570F512HT-I/PT uses a 5-stage pipeline M4K core with single-cycle multiply and hardware divide, supported by a prefetch cache that boosts flash throughput. The 40 MHz version (the -I grade) operates at 3.3V and targets cost-sensitive general-purpose embedded designs, while the 50 MHz -50I grade in the same family offers higher throughput. PPS remapping means peripherals can be assigned to most digital I/O pins, simplifying PCB routing.
Typical applications include industrial control panels, USB peripherals (HID, CDC, mass storage), embedded audio I2S bridges, CAN node interfaces, low-cost graphics displays, and capacitive touch human-machine interfaces. The integrated USB and CAN make it well-suited for industrial automation, point-of-sale terminals, and home appliances.
When designing with this part, ensure the JTAG/ICD programming header follows Microchip's recommended 4-wire or 2-wire layout and that the USB D+/D- lines include proper 90-ohm differential routing. Pin-compatibility with PIC32MX570F512H-I/PT in the same TQFP-64 footprint enables direct placement on existing boards.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MX5xx family, and practical design notes not found in the manufacturer datasheet, sourced from Microchip product page DS60001357 and DigiKey catalog data as of 2026-10-03.
Drop-in alternatives for PIC32MX570F512HT-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX570F512HT-I/PT (same form factor and footprint) — differing in ADC, Package, Core Architecture, Parallel Master Port (PMP), SPI Modules.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX570F512H-I/PT
✅ Drop-In✓ In Stock
$5.07 / Unit
View Datasheet →PIC32MX570F512HT-50I/PT
✅ Drop-In✓ In Stock
$4.41 / Unit
View Datasheet →PIC32MX570F512H-50I/PT
✅ Drop-In✓ In Stock
$4.11 / Unit
View Datasheet →PIC32MX570F512HT-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K (PIC32MX) |
| Data Bus Width | 32-bit |
| Maximum CPU Speed | 40 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V (3.3 V typical) |
| Core Performance | Up to 83 DMIPS |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 64-pin TQFP (PT) 10x10 mm |
| Mounting Type | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | 1x CAN module |
| SPI | 4 modules |
| I2S | 2 modules |
| PMP (Parallel Master Port) | Yes, dual buffers |
| CTMU (Touch) | Yes |
| RTCC | Yes |
| RoHS Status | Compliant |
| MSL Level | MSL3 (per JEDEC J-STD-020) |
PIC32MX570F512HT-I/PT Pin Configuration
| Pin 1 | RPB0/RD0 — PPS remappable I/O / PMP data 0 |
| Pin 2 | RPB1/RD1 — PPS remappable I/O / PMP data 1 |
| Pin 3 | RPB2/RD2 — PPS remappable I/O / PMP data 2 |
| Pin 4 | RPB3/RD3 — PPS remappable I/O / PMP data 3 |
| Pin 5 | VSS — Ground |
| Pin 6 | RPC0 — PPS remappable I/O |
| Pin 7 | RPC1 — PPS remappable I/O |
| Pin 8 | RPC2 — PPS remappable I/O |
| Pin 9 | RPC3 — PPS remappable I/O |
| Pin 10 | RPC4 — PPS remappable I/O |
| Pin 11 | VDD — 3.3V supply |
| Pin 12 | RPC5 — PPS remappable I/O |
| Pin 13 | RPC6 — PPS remappable I/O |
| Pin 14 | RPC7 — PPS remappable I/O |
| Pin 15 | RPC8 — PPS remappable I/O |
| Pin 16 | RPC9 — PPS remappable I/O |
| Pin 17 | VSS — Ground |
| Pin 18 | VDD — 3.3V supply |
| Pin 19 | RPB4 — PPS remappable I/O |
| Pin 20 | RPB5 — PPS remappable I/O |
| Pin 21 | RPB6 — PPS remappable I/O |
| Pin 22 | RPB7 — PPS remappable I/O |
| Pin 23 | RPB8 — PPS remappable I/O |
| Pin 24 | RPB9 — PPS remappable I/O |
| Pin 25 | RPB10 — PPS remappable I/O |
| Pin 26 | RPB11 — PPS remappable I/O |
| Pin 27 | VSS — Ground |
| Pin 28 | VDD — 3.3V supply |
| Pin 29 | RPB12 — PPS remappable I/O |
| Pin 30 | RPB13 — PPS remappable I/O |
| Pin 31 | RPB14 — PPS remappable I/O |
| Pin 32 | RPB15 — PPS remappable I/O |
| Pin 33 | RPA0 — PPS remappable I/O |
| Pin 34 | RPA1 — PPS remappable I/O |
| Pin 35 | RPA2 — PPS remappable I/O |
| Pin 36 | RPA3 — PPS remappable I/O |
| Pin 37 | VSS — Ground |
| Pin 38 | VDD — 3.3V supply |
| Pin 39 | OSC1 — Crystal oscillator input |
| Pin 40 | OSC2 — Crystal oscillator output |
| Pin 41 | RPD0 — PPS remappable I/O |
| Pin 42 | RPD1 — PPS remappable I/O |
| Pin 43 | RPD2 — PPS remappable I/O |
| Pin 44 | RPD3 — PPS remappable I/O |
| Pin 45 | RPD4 — PPS remappable I/O |
| Pin 46 | RPD5 — PPS remappable I/O |
| Pin 47 | RPD6 — PPS remappable I/O |
| Pin 48 | RPD7 — PPS remappable I/O |
| Pin 49 | RPD8 — PPS remappable I/O |
| Pin 50 | RPD9 — PPS remappable I/O |
| Pin 51 | RPD10 — PPS remappable I/O |
| Pin 52 | RPD11 — PPS remappable I/O |
| Pin 53 | VSS — Ground |
| Pin 54 | VDD — 3.3V supply |
| Pin 55 | RPD12 — PPS remappable I/O |
| Pin 56 | RPD13 — PPS remappable I/O |
| Pin 57 | RPD14 — PPS remappable I/O |
| Pin 58 | RPD15 — PPS remappable I/O |
| Pin 59 | RPG0 — PPS remappable I/O |
| Pin 60 | RPG1 — PPS remappable I/O |
| Pin 61 | RPG2 — PPS remappable I/O |
| Pin 62 | RPG3 — PPS remappable I/O |
| Pin 63 | MCLR — Master clear reset input |
| Pin 64 | VSS — Ground (additional) |
Typical Applications
PIC32MX570F512HT-I/PT is suitable for 6 applications: USB HID Peripheral Devices, Industrial CAN Node Controllers, Embedded Audio I2S Bridges, Low-Cost Graphics Display Controllers, Capacitive Touch User Interfaces, USB-to-CAN Gateway Bridges.
USB HID Peripheral Devices
The PIC32MX570F512HT-I/PT is well-suited to USB Human Interface Device peripherals such as keyboards, mice, joysticks, and custom HID controls. Its integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver eliminates external PHY cost, while the 40 MHz MIPS32 M4K core runs USB stacks comfortably at 12 Mbps. The 512 KB flash and 64 KB RAM accommodate full HID report descriptors and composite device firmware. According to the Microchip MLA, common HID class drivers are pre-validated.
Recommended
Industrial CAN Node Controllers
The PIC32MX570F512HT-I/PT serves well as an industrial CAN node controller in factory automation, building HVAC, and automotive body-control networks. Its integrated CAN 2.0B active module supports up to 1 Mbit/s with hardware acceptance filters, while the 64 KB SRAM buffers CAN message payloads efficiently. Combined with the 64-pin TQFP industrial-grade package and -40C to +85C temperature range, it operates reliably in factory-floor environments with electromagnetic noise.
Recommended
Embedded Audio I2S Bridges
The PIC32MX570F512HT-I/PT handles embedded audio I2S bridge functions in consumer and prosumer audio products. Its two I2S modules support up to 32-bit audio at 192 kHz sample rates for stereo input and output paths simultaneously. The 512 KB flash stores audio processing algorithms, while the 83 DMIPS core runs lightweight DSP tasks such as EQ and mixing. Combined with the four SPI modules, it can also drive external DACs and ADCs.
Recommended
Low-Cost Graphics Display Controllers
The PIC32MX570F512HT-I/PT drives low-cost graphics displays through its Parallel Master Port (PMP) with dual read/write buffers, supporting TFT LCDs up to QVGA resolution. The 64 KB SRAM provides off-screen framebuffer headroom, while peripheral pin select (PPS) allows flexible routing of PMP data and control signals. This makes it ideal for industrial HMI panels, point-of-sale terminals, and appliance user interfaces requiring color graphics under $10 BOM cost.
Recommended
Capacitive Touch User Interfaces
The PIC32MX570F512HT-I/PT implements capacitive touch user interfaces through its integrated Charge Time Measurement Unit (CTMU), supporting up to 16 touch buttons or slider/wheel sensors with no external touch controller required. The CTMU hardware measures capacitance changes with sub-pF resolution, while the MIPS core processes touch events and reports them over USB or CAN. This is ideal for appliance control panels, elevator buttons, and industrial operator panels.
Recommended
USB-to-CAN Gateway Bridges
The PIC32MX570F512HT-I/PT serves as a USB-to-CAN gateway bridge for PC-based industrial diagnostics, flashing tools, and protocol analyzers. With both USB 2.0 Full-Speed and CAN 2.0B integrated on a single chip, the design requires only an external CAN transceiver like the MCP2561. The 512 KB flash holds USB CDC/HID driver stacks plus CANopen or J1939 protocol layers, while the 64 KB RAM buffers bridge traffic between the two buses.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX570F512HT-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX570F512H-I/PT | PIC32MX570F512HT-50I/PT | PIC32MX570F512H-50I/PT | PIC32MX570F512H-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-64 (PT) 10x10 mm | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same | TQFP-64 (PT) 10x10 mm - same | QFN-64 (MR) - NOT drop-in |
| Core Speed | 40 MHz (83 DMIPS) | 40 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B |
| I2S Modules | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Tape and Reel packaging for high-volume assembly (vs PIC32MX570F512H-I/PT)
- Cost-optimized 40 MHz speed grade for general-purpose designs (vs PIC32MX570F512HT-50I/PT)
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX570F512H-50I/MR)
Design Notes
Place a 0.1 uF decoupling capacitor as close as possible to every VDD pin (pins 11, 18, 28, 38, 54) and a bulk 4.7-10 uF tantalum or ceramic capacitor near the package. For USB applications, add 90-ohm differential impedance routing on the D+ and D- lines with matched length and a 90-ohm differential termination. The 64-pin TQFP exposes multiple ground pins (5, 17, 27, 37, 53, 64) which must all be connected to a continuous ground plane for signal integrity and thermal performance.
The USB D+/D- lines require 90-ohm differential impedance with matched trace lengths within 150 mils. For USB full-speed signals, route them over a continuous ground plane and avoid splits or vias. The integrated USB transceiver requires no external pull-up resistor on D+ for full-speed device mode; however, an external 1.5 kohm pull-up to 3.3V may be added if soft-connect behavior is needed during enumeration. CAN bus requires twisted-pair cabling with 120-ohm termination at both ends of the bus.
Do not exceed 3.6V on any digital I/O pin; although PIC32MX I/O is 5V tolerant on most pins, the absolute maximum on VDD is 3.6V. Ensure the MCLR pin (pin 63) has a proper reset circuit with 10 kohm pull-up to VDD and a 1 nF capacitor to ground for clean reset behavior. For PMP graphics applications, configure the PMAEN register correctly before enabling the parallel master port, otherwise the PMP bus can be left in an undefined state causing display glitches at startup.
The PIC32MX570F512HT-I/PT in TQFP-64 has a thermal resistance of approximately 70 C/W theta-JA. At maximum operating temperature of 85C, this allows for limited self-heating from core activity. Estimated: with all peripherals active at 40 MHz, typical core power is around 200 mW, yielding about 14C temperature rise above ambient - well within industrial-grade limits. For elevated-temperature applications above 70C ambient, consider the 64-pin QFN package variant (PIC32MX570F512H-50I/MR) which has lower theta-JA of approximately 28 C/W.
Route the 8 MHz primary oscillator traces (pins 39 OSC1 and 40 OSC2) as short as possible with a guard ring or ground pour on both sides. Keep the crystal traces away from high-speed digital lines such as SPI, USB, and PMP data bus signals. If using the internal 8 MHz RC oscillator instead of an external crystal, leave pins 39-40 floating or grounded. The JTAG programming pins (PGECx/PGEDx) should be brought to test points or a 2x5 header for in-circuit debugging.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; not designed for automotive under-hood applications. Industrial temperature grade only.
