PIC32MZ1024ECH144T-I/PL - 200MHz 1MB Flash MCU w/ ENET&CAN | Microchip
MPN: PIC32MZ1024ECH144T-I/PL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $13.05 | $130.50 |
| 100 | $11.65 | $1,165.00 |
| 500 | $10.4 | $5,200.00 |
| 1,000 | $9.55 | $9,550.00 |
PIC32MZ1024ECH144T-I/PL Overview
A 32-bit MCU (microcontroller) is a single-chip processor integrating a CPU core, program memory, RAM, peripherals, and I/O. The PIC32MZ EC family belongs to the broader MIPS32 microAptiv architecture from Microchip, which targets deterministic real-time control with Harvard bus separation, hardware multiply/divide, DSP extensions, and DSP-enhanced instructions. PIC32 devices sit between 8-bit PIC16/PIC18 MCUs and 32-bit Cortex-M4/M7 ARM devices, offering higher code density than 8-bit parts while remaining simpler than application processors.
Key features of this variant include 200 MHz / 252 MIPS core performance, 1 MB Flash with 512 KB RAM, a 12-bit 18 MSPS ADC, four analog comparators, nine timers, nine I/O-capable 16-bit timers/counters, six UART, three SPI, four I2C, two I2S, two CAN, and SQI (Serial Quad Interface) for high-speed external flash. The PIC32MZ1024ECH144T-I/PL is the connectivity edition, with the integrated 10/100 Mbps Ethernet MAC, USB-HS PHY, and two CAN modules.
Architecturally, the chip uses a 5-stage pipelined MIPS32 core with hardware multiply/divide, dual-port SRAM, and a dedicated DMA controller with up to eight channels for offloading memory-to-peripheral transfers. The on-chip FPU and DSP extensions accelerate signal-processing workloads in audio, motor control, and graphics.
Typical applications include industrial Ethernet gateways, PLC controllers, building-automation nodes, USB instrument peripherals, automotive CAN bridge nodes, IoT edge devices, and HMI panels. Designers select this part when they need Microchip's MPLAB Harmony toolchain, MIPS core compatibility, and integrated connectivity peripherals without external PHY/MAC chips.
When designing with this MCU, ensure your supply rail uses a 2.3V-3.6V LDO with bulk decoupling; the 144-LQFP package dissipates up to approximately 0.5 W depending on peripheral activation. Plan for crystal stability and trace impedance on USB and Ethernet differential pairs.
This page synthesizes distributor pricing, drop-in alternatives within the PIC32MZ family, and practical design notes that go beyond the manufacturer datasheet's electrical specs.
Drop-in alternatives for PIC32MZ1024ECH144T-I/PL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024ECH144T-I/PL (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Core Architecture, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024ECH144-I/PL
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PIC32MZ1024ECH144T-E/PL
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PIC32MZ1024ECG144T-I/PL
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View Datasheet →PIC32MZ1024ECF144T-I/PL
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PIC32MZ1024EFG144-I/PL
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View Datasheet →PIC32MZ1024ECH144T-I/PL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ EC (Embedded Connectivity) |
| CPU Core | 32-bit MIPS32 microAptiv |
| Max CPU Frequency | 200 MHz |
| Performance | 252 MIPS (Dhrystone 2.1) |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Package | 144-pin LQFP (20x20 mm, 0.5 mm pitch) |
| Ethernet | 10/100 Mbps MAC integrated |
| USB | USB 2.0 High-Speed (PHY integrated) |
| CAN | 2x CAN 2.0b controllers |
| SQI (Serial Quad Interface) | Yes |
| ADC | 12-bit, up to 18 MSPS |
| Analog Comparators | 4 |
| DMA Channels | 8 |
| Operating Temperature | -40C to +85C (Industrial -I grade) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
PIC32MZ1024ECH144T-I/PL 144-pin lqfp (20x20 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for PIC32MZ1024ECH144T-I/PL (144-pin lqfp (20x20 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024ECH144T-I/PL.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024ECH144T-I/PL is suitable for 7 applications: Industrial Ethernet Gateway, USB Instrumentation Peripheral, Building Automation Controller, Automotive CAN Bridge Node, HMI Touch Panel Controller, IoT Edge Sensor Node, Motor Control Drive Controller.
Industrial Ethernet Gateway
The PIC32MZ1024ECH144T-I/PL fits industrial Ethernet gateway designs because its integrated 10/100 Ethernet MAC, 1 MB Flash, and 512 KB SRAM can host a full TCP/IP stack with TLS, while the 200 MHz MIPS32 core leaves headroom for protocol conversion. The two CAN 2.0b controllers allow bridging between Ethernet and CAN fieldbus networks common in factory automation. The industrial -40C to +85C temperature grade and Microchip's MPLAB Harmony TCP/IP library make it production-ready for plant-floor deployment.
Recommended
USB Instrumentation Peripheral
The PIC32MZ1024ECH144T-I/PL suits USB instrumentation peripherals because it integrates a USB 2.0 High-Speed PHY and controller on-chip, eliminating the need for an external ULPI PHY. Combined with 200 MHz of MIPS performance, 512 KB SRAM, and the SQI interface for fast external flash storage, the part can stream high-bandwidth measurement data to a host PC. The 12-bit 18 MSPS ADC also captures analog waveforms with sufficient resolution for many test-and-measurement applications.
Recommended
Building Automation Controller
The PIC32MZ1024ECH144T-I/PL is appropriate for building-automation controllers where it can act as a BACnet, Modbus, or KNX bridge. The 1 MB Flash holds protocol stacks and application logic, while the four UART, three SPI, and four I2C peripherals connect to sensors, HVAC actuators, and user-interface panels. The Ethernet MAC supports IP-based building networks, and the -40C to +85C temperature range covers indoor equipment closets and rooftop units.
Recommended
Automotive CAN Bridge Node
The PIC32MZ1024ECH144T-I/PL can serve in automotive CAN bridge nodes outside of the AEC-Q100 safety domain, such as infotainment, telematics, and body-control modules where two CAN buses need bridging to Ethernet backbones. The integrated dual CAN 2.0b controllers, Ethernet MAC, and 200 MHz CPU handle CAN-to-Ethernet gateway workloads. Designers should note that this part is not AEC-Q100 qualified; for under-hood or safety-critical applications, select an automotive-grade equivalent.
HMI Touch Panel Controller
The PIC32MZ1024ECH144T-I/PL supports HMI touch panel controllers thanks to its 200 MHz MIPS32 core with DSP extensions, 512 KB SRAM for graphics buffers, 12-bit ADC, and the SQI interface for fast external QSPI flash to hold graphics assets. Designers can drive small TFT panels via SPI or external controllers and read capacitive touch via I2C or SPI. The Ethernet MAC enables networked HMI nodes that report status and accept configuration from central SCADA systems.
Recommended
IoT Edge Sensor Node
The PIC32MZ1024ECH144T-I/PL powers IoT edge sensor nodes by combining integrated Ethernet and USB for IP connectivity, low-power modes, 1 MB Flash for edge analytics and MQTT/TLS stacks, and the 12-bit ADC for analog sensor reading. The 200 MHz core executes edge inference or filter algorithms while the SQI interface streams data to local storage. Microchip's Harmony middleware provides MQTT-SN, CoAP, and TLS libraries to accelerate cloud onboarding.
Recommended
Motor Control Drive Controller
The PIC32MZ1024ECH144T-I/PL handles motor control drive controllers where its 200 MHz MIPS core with DSP extensions can run FOC (field-oriented control) algorithms, the 12-bit 18 MSPS ADC samples motor currents quickly, and nine timers produce PWM outputs for three-phase inverter switching. The 1 MB Flash stores control firmware and tuning parameters. For higher-bandwidth motor control or safety certification, designers typically select the EF family at 252 MHz or automotive-grade variants.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024ECH144T-I/PL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024ECH144-I/PL | PIC32MZ1024ECH144T-E/PL | PIC32MZ1024ECG144T-I/PL | PIC32MZ1024ECF144T-I/PL | PIC32MZ1024EFG144-I/PL |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 252 MHz (+26%) |
| Flash Memory | 1 MB | 1 MB - same | 1 MB - same | 1 MB - same | 1 MB - same | 1 MB - same |
| SRAM | 512 KB | 512 KB - same | 512 KB - same | 512 KB - same | 256 KB (-50%) | 512 KB - same |
| Temperature Grade | -40C to +85C (Industrial -I) | -40C to +85C - same | -40C to +125C (Extended -E) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| Packaging Media | Tape & Reel (T) | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
| Family | PIC32MZ EC (Connectivity) | PIC32MZ EC - same | PIC32MZ EC - same | PIC32MZ EC - same | PIC32MZ EC - same | PIC32MZ EF (Enhanced) |
Key Differentiators
- Same 144-LQFP pinout across ECH/ECG/ECF variants (vs PIC32MX795F512L-80I/BG)
- Extended temperature option in same footprint (vs PIC32MZ1024ECH144-I/PL (standard industrial -I))
- Lower-RAM variant for cost-sensitive designs (vs PIC32MZ1024ECF144T-I/PL)
Design Notes
Estimated: PIC32MZ1024ECH144T-I/PL typically draws around 60-80 mA active at 200 MHz with peripherals enabled from a 3.3 V supply. A 3.3 V LDO rated at 250 mA minimum provides adequate margin for peak CPU + Ethernet + USB activity. Place one 1 uF bulk capacitor and a 100 nF decoupling capacitor within 5 mm of each VDD pin pair. For USB-HS operation, ensure the VBUS sensing pin is correctly routed and a 4.7 uF bulk is placed near the USB VDD supply.
The 144-LQFP at 0.5 mm pitch requires a 4-layer PCB with continuous ground plane directly under the package for thermal spreading and EMI control. Route the Ethernet RMII differential pairs (or RGMII if used) as 50 ohm impedance-controlled traces, keep lengths matched within 12 mm, and isolate them from switching signals. USB DP/DM traces need 90 ohm differential impedance with no stubs and a ground keepout zone.
Common pitfalls: (1) Forgetting that VDDPLL and VUSB each require their own filtered supply - do not tie VUSB to VDD directly. (2) Not enabling the FPU on first boot - the FPU must be enabled via CP0 and CP1 registers in startup code or performance suffers 30-50%. (3) For PIC32MZ EC, the PPS (Peripheral Pin Select) mapping must be set before peripherals work - default pins are disabled after reset. (4) Watchdog configuration: clear the WDT in early boot or the chip will reset within seconds.
Estimated: at 200 MHz with full peripheral activity, the 144-LQFP package dissipates roughly 0.5 W. With theta_JA around 50 C/W on a 4-layer PCB with 4 thermal vias under the exposed pad, junction temperature rises approximately 25 C above ambient. For high-ambient applications above 70 C, ensure PCB copper area provides at least 1 square inch of spreading. Industrial -I grade silicon is rated up to 85 C ambient.
Compliance Information
RoHS compliant per Microchip product page. Industrial -I temperature grade only - not AEC-Q100 qualified for automotive safety. For AEC-Q100 applications, contact Microchip for automotive-grade part numbers.