S912XDG256F1CAL - 80MHz 256KB Flash Automotive MCU | NXP
MPN: S912XDG256F1CAL ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
S912XDG256F1CAL Overview
A microcontroller is a programmable semiconductor that integrates a CPU core, memory, peripherals, and I/O into one device. In the system hierarchy, the S912XDG256F1CAL belongs to the embedded-microcontroller class rather than a general-purpose processor or DSP. Its S12X core supports HCS12-compatible programming while adding an enhanced instruction set, indexed addressing, and a four-stage instruction queue.
Key resources include 256 KB of Flash, 14 KB of RAM, 4 KB of EEPROM, 91 programmable I/O pins, and 12 timer/counter channels. Communication peripherals listed in the verified data include one CAN interface and three SPI interfaces, with I2C support also identified. These resources allow the MCU to consolidate distributed control, communications, timing, and input/output functions on a single device.
The S12X architecture targets complex embedded-control tasks requiring deterministic peripherals and real-time responsiveness rather than desktop-class computing. At up to 80 MHz, it provides substantially more processing headroom than slower general-purpose 16-bit controllers. Exact clock-tree, electrical-limit, peripheral-function, and pin-assignment details require confirmation in the complete manufacturer documentation.
Typical applications include automotive body and chassis controllers, engine-adjacent control modules, transmission or braking electronics, industrial automation equipment, CAN-based distributed nodes, and compact embedded systems that require substantial Flash memory. The automotive-qualified ordering code makes it most relevant to designs operating across the stated -40°C to +85°C range.
Design planning should begin with the complete NXP datasheet and reference manual, especially because this part is marked End of Life. Verify package dimensions, pin multiplexing, supply voltage, reset behavior, clock requirements, CAN termination, and all peripheral electrical limits before layout release. New production designs should also evaluate current NXP MCU options because lifecycle risk may outweigh drop-in reuse benefits.
Drop-in alternatives for S912XDG256F1CAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S912XDG256F1CAL (same form factor and footprint) — differing in Mounting Type, Data Bus Width, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S912XDT256F1VAA
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View Datasheet →S912XDG256F1CAL Maximum Ratings & Electrical Characteristics
| Product Type | 16-bit automotive microcontroller |
| CPU Core | 16-bit HCS12X core |
| Maximum Operating Frequency | 80 MHz |
| Flash Memory | 256 KB |
| RAM | 14 KB |
| EEPROM | 4 KB |
| Data Bus Width | 16 bit |
| Programmable I/O | 91 pins |
| Timers/Counters | 12 channels |
| CAN Interfaces | 1 interface |
| SPI Interfaces | 3 interfaces |
| I2C Support | Yes |
| Operating Temperature Range | -40°C to +85°C |
| Package | 112-pin LQFP |
| Mounting Type | Surface mount |
| Automotive Qualification | Automotive qualified |
| Halogen-Free Package | Halogen free |
S912XDG256F1CAL halogen free Pin Configuration Guide
Pin configuration for S912XDG256F1CAL (halogen free package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S912XDG256F1CAL.
Refer to the datasheet for full pin configuration.
Typical Applications
S912XDG256F1CAL is suitable for 6 applications: Automotive Body Control, CAN-Based Distributed Control, Industrial Automation Controller, Engine or Chassis Control Module, Sensor Aggregation Node, Communication Gateway.
Automotive Body Control
The S912XDG256F1CAL fits centralized body-control logic because its automotive identification, 256 KB Flash, 91 programmable I/O pins, and -40°C to +85°C stated range support embedded coordination of switches, lamps, locks, and sensors. One CAN interface can participate in vehicle-network communication, while 12 timer/counter channels support periodic sensing and actuator updates. Place the device in a 112-pin LQFP layout and validate every pin, supply rail, and peripheral instance against the official documentation before functional-safety or EMC design.
Recommended
CAN-Based Distributed Control
A single CAN interface, 14 KB RAM, and an 80 MHz 16-bit S12X core make the S912XDG256F1CAL applicable to a local distributed-control node that acquires sensor inputs, evaluates control logic, and returns actuator commands. The 256 KB Flash capacity can hold substantially more application code than a small 8-bit MCU. CAN transceiver selection, termination, protection, bus timing, and fault tolerance remain board-level responsibilities. The exact pin multiplexing and electrical specifications must be checked because they are absent from the verified search excerpts.
Recommended
Industrial Automation Controller
The 91 programmable I/O pins and three SPI interfaces support an industrial controller that gathers digital and sensor data, drives outputs, and communicates with converters, memory, or remote I/O. Its 80 MHz maximum frequency and 256 KB Flash provide useful control and application-code capacity, while the stated -40°C to +85°C range suits many industrial environments. Industrial suitability still depends on supply regulation, transient immunity, isolation, watchdog behavior, and environmental qualification beyond the supplied basic catalog data.
Recommended
Engine or Chassis Control Module
The S912XDG256F1CAL’s S12X core, 256 KB Flash, 14 KB RAM, and timer resources suit complex real-time control modules that coordinate sensor acquisition, actuator output, diagnostics, and vehicle-network messaging. Its 80 MHz ceiling allows deterministic firmware to execute faster than legacy 16-bit implementations, while automotive identification aligns it with legacy vehicle platforms. Production use still requires confirmation of exact qualification, electrical limits, diagnostic coverage, temperature behavior, and supply-chain status because the device is marked End of Life.
Recommended
Sensor Aggregation Node
Three SPI interfaces, I2C support, 91 programmable I/O pins, and 12 timers make the S912XDG256F1CAL suitable for consolidating sensors and local actuators behind one embedded controller. SPI channels can connect to higher-speed sensors or peripherals, while I2C supports compatible low-speed devices when the selected pins permit it. The application layer must handle device addressing, bus contention, timeout recovery, and calibration. Exact peripheral availability, muxing, and electrical timing must be validated from the complete NXP datasheet.
Recommended
Communication Gateway
The combination of an 80 MHz 16-bit core, 256 KB Flash, one CAN interface, three SPI interfaces, and 91 I/O pins allows the S912XDG256F1CAL to act as a protocol-conversion or communications gateway between embedded subsystems. Firmware can buffer frames, validate identifiers, translate data formats, and supervise connected devices. Real deployment depends on exact baud-rate ranges, timers, bus timing, watchdog behavior, and peripheral pin assignments that are not included in the verified snippets. Legacy gateway designs should also archive tools and binaries because the target is End of Life.
Recommended
Recommended Products Summary
Engineering reference data for S912XDG256F1CAL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S912XDT256F1VAA | S912XET256J1CALR | S912XES384J2CAL | S912XDT384J1MAG | S912XES384J3VAL |
|---|---|---|---|---|---|---|
| Package | 112-pin LQFP | LQFP-112 candidate; exact drawing comparison unavailable | LQFP-112 candidate; exact drawing comparison unavailable | LQFP-112 candidate; exact drawing comparison unavailable | LQFP-112 candidate; exact drawing comparison unavailable | LQFP-112 candidate; exact drawing comparison unavailable |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 256 KB | 256 KB from ordering-code family indication; detailed verification required | 256 KB from ordering-code family indication; detailed verification required | 384 KB from ordering-code family indication; 128 KB more than target | 384 KB from ordering-code family indication; 128 KB more than target | 384 KB from ordering-code family indication; 128 KB more than target |
Key Differentiators
- Target combines automotive identification with a large 112-pin control footprint (vs S912XDT256F1VAA)
- Exact 256 KB Flash configuration is established for the target (vs S912XES384J2CAL)
- Verified product data exposes the principal communications resources (vs S912XDT384J1MAG)
- Product-page lifecycle status is explicitly available for risk review (vs S912XES384J3VAL)
Design Notes
Do not approve a substitute from family name or package count alone. For each candidate, compare all 112 pins, power and ground assignments, reset and debug functions, oscillator connections, peripheral multiplexing, and exposed-pad requirements against the target. Then verify memory maps, interrupt vectors, clock limits, electrical characteristics, qualification, and firmware startup. The supplied alternative evidence is insufficient for this validation, so engineering samples and regression testing remain mandatory before any substitution.
Treat the S912XDG256F1CAL as a mixed-signal embedded design with separate attention to core, I/O, analog, and transceiver rails. The verified excerpts do not state the allowed supply range or current limits, so use only the official electrical table for regulator selection and decoupling. Place required bulk and high-frequency capacitors at their specified pins, provide clean return paths, and validate startup, brownout, and power-sequencing behavior across -40°C to +85°C.
Create the PCB land pattern from the official 112-pin LQFP package drawing, including exact lead pitch, body dimensions, toe geometry, and solder-mask rules. Preserve the manufacturer’s pin-1 orientation and keep sensitive oscillator, reset, and analog routing away from high-current outputs and CAN or SPI edges. Since the verified data provides only the package type and not dimensions, the physical footprint and pin map must remain unapproved until checked against the current NXP documentation.
Design CAN and SPI paths as controlled-impedance interfaces when board geometry or data rates justify it. Keep CAN bus and transceiver routing short, apply the network’s required termination strategy, and provide suitable surge protection. For SPI, minimize stub branches and align clock edge timing with the slowest connected peripheral. Exact rise-time, capacitance, baud-rate, and EMC limits are unavailable in the supplied sources and must be derived from the official device and interface specifications.
Compliance Information
The verified data identifies the device as automotive qualified and describes the package as halogen free. It does not provide explicit RoHS, REACH, lead-free, or conflict-minerals declarations.