S912XET256BMAAR - 16-bit S12X MCU 256KB Flash 50MHz | NXP
MPN: S912XET256BMAAR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.45 | $28.45 |
| 10 | $25.62 | $256.20 |
| 100 | $22.18 | $2,218.00 |
| 500 | $19.5 | $9,750.00 |
| 1,000 | $17.95 | $17,950.00 |
S912XET256BMAAR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, RAM, and peripheral interfaces into one package. The S12X family from NXP is a 16-bit MCU architecture positioned between classic 8-bit microcontrollers and full 32-bit ARM Cortex-M parts, often classified as a 16-bit automotive MCU under the broader category of embedded microcontroller -> semiconductor IC.
Key features of the S912XET256BMAAR include 256KB (256K x 8) of in-application programmable Flash, CANbus plus EBI/EMI, I2C, IrDA, SCI, and SPI connectivity, on-chip peripherals such as Low-Voltage Detection (LVD), Power-On Reset (POR), Pulse-Width Modulation (PWM), and a Watchdog Timer (WDT). The HCS12X core delivers 32-bit-like performance while preserving the cost and code-density advantages of a 16-bit MCU.
Architecturally, the S12X family builds on the classic S12 with an enhanced XGATE coprocessor for offloading interrupt-driven tasks, larger address windows, and improved peripheral integration. The 256KB Flash variant targets mid-complexity automotive body and chassis ECUs where deterministic interrupt response, multi-channel CAN, and automotive-grade reliability are mandatory.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and CAN/LIN gateway nodes. The wide temperature range and AEC-Q100 qualification also suit industrial and heavy-equipment ECUs that follow automotive-grade design rules.
When designing with this part, ensure that the 80-LQFP land pattern includes thermal vias under the exposed pad (if present), allow adequate decoupling on VDDX/VSSR pairs, and verify CAN bus termination against the chosen transceiver. Production programming should use the BDM or JTAG interface for in-circuit Flash updates.
This page synthesizes distributor pricing, NXP in-family drop-in alternatives, and practical design notes beyond the manufacturer datasheet to help engineers evaluate and source the S912XET256BMAAR efficiently.
Drop-in alternatives for S912XET256BMAAR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S912XET256BMAAR (same form factor and footprint) — differing in Package, Operating Temperature, Connectivity, Core Processor, Co-Processor.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S912XET256BMAA
✅ Drop-In📋 Reference alternative (not in catalog)
S912XET256J2VAG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →S912XET512BMAGR
✅ Drop-In✓ In Stock
$6.6 / Unit
View Datasheet →MC9S12XDT512MAA
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MC9S12XA256CAAR
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →S912XET256BMAAR Maximum Ratings & Electrical Characteristics
| Core Processor | HCS12X |
| Core Size | 16-bit |
| Core Architecture | S12X (with XGATE coprocessor) |
| Series | HCS12X |
| Speed | 50 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| Program Memory Type | FLASH |
| Number of I/O | 59 |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Operating Supply Voltage | 1.8 V |
| Operating Temperature | -40C to +125C |
| Package | 80-LQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 Automotive |
| RoHS Status | Compliant |
S912XET256BMAAR 80-lqfp (14x14 mm) Pin Configuration Guide
Pin configuration for S912XET256BMAAR (80-lqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S912XET256BMAAR.
Refer to the datasheet for full pin configuration.
Typical Applications
S912XET256BMAAR is suitable for 6 applications: Automotive Body Control Module, Automotive HVAC Control Module, Instrument Cluster Driver, Automotive Lighting Controller, CAN/LIN Gateway Node, Industrial CAN-Based Motor Controller.
Automotive Body Control Module
The S912XET256BMAAR is well suited for automotive body control modules (BCMs) that coordinate lighting, door locks, wipers, and accessory power. The HCS12X core at 50 MHz with XGATE offload provides deterministic response to LIN/CAN wake events, and the 256KB Flash holds BCM state-machine code plus diagnostic libraries. Its integrated CANbus and SCI peripherals connect to chassis and powertrain ECUs without an external transceiver. The AEC-Q100 qualification and -40C to +125C operating range are mandatory for under-hood or cabin deployments, and the 80-LQFP footprint fits typical BCM PCB real estate.
Recommended
Automotive HVAC Control Module
HVAC control modules need analog sensing, motor PWM, and CAN/LIN communication with the body network, all of which the S912XET256BMAAR delivers on-chip. The PWM channels drive blower and mode-door motors while ADC channels read cabin temperature, humidity, and pressure. The 256KB Flash holds temperature-control algorithms plus diagnostics, and the 80-LQFP footprint allows compact PCB integration behind the dashboard. AEC-Q100 qualification supports passenger-compartment thermal environments, and the -40C to +125C range covers cold-start and high-ambient operation.
Recommended
Instrument Cluster Driver
Digital instrument clusters need real-time gauge rendering, warning-lamp logic, and CAN messaging with the powertrain ECU. The S912XET256BMAAR handles CAN bus communication with the engine and ABS ECUs while managing SPI-driven stepper-motor gauges and segmented LCD drivers. The 256KB Flash stores cluster graphics tables, gauge calibration, and CAN DBC parsing code. Its 80-LQFP package supports the typical cluster PCB form factor, and AEC-Q100 qualification is required for the harsh thermal and vibration environment near the steering column.
Recommended
Automotive Lighting Controller
Adaptive front-lighting and LED matrix controllers depend on fast PWM generation, CAN/LIN communication, and reliable automotive-grade operation. The S912XET256BMAAR's PWM peripherals drive LED current-control stages, and the CANbus peripheral receives light-level and steering-angle commands from the BCM. The 256KB Flash accommodates LED matrix lookup tables and safety diagnostics, while the -40C to +125C range covers headlamp thermal extremes. The 80-LQFP footprint allows placement near the lamp housing.
Recommended
CAN/LIN Gateway Node
Body and powertrain gateways route messages between CAN, LIN, and other in-vehicle networks. The S912XET256BMAAR integrates multiple CAN controllers plus SCI for legacy UART links and SPI for diagnostics, eliminating the need for an external communications MCU. The 256KB Flash stores gateway routing tables and OEM-specific transport-layer code, and AEC-Q100 qualification satisfies automotive reliability requirements. The 80-LQFP package allows integration into the central gateway module PCB.
Recommended
Industrial CAN-Based Motor Controller
Industrial servo and stepper motor controllers benefit from the S912XET256BMAAR's deterministic 16-bit interrupt handling, CANopen support, and industrial-grade wide temperature range. The PWM and timer peripherals generate multi-axis motor drive signals, while CANbus connects the controller to PLCs and HMIs. The 256KB Flash holds motor-control algorithms and CANopen object dictionaries, and the 80-LQFP footprint supports IP65 sealed enclosures. Engineers frequently select the automotive-grade variant for industrial reliability headroom.
Recommended
Recommended Products Summary
Engineering reference data for S912XET256BMAAR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S912XET256BMAA | S912XET256J2VAG | S912XET512BMAGR | MC9S12XDT512MAA | MC9S12XA256CAAR |
|---|---|---|---|---|---|---|
| Package | 80-LQFP (14x14 mm) | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X (16-bit) 50 MHz | HCS12X (16-bit) 50 MHz | HCS12X (16-bit) 50 MHz | HCS12X (16-bit) 50 MHz | HCS12XD (16-bit) 40 MHz | HCS12XA (16-bit) 40 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 512 KB (+100%) | 512 KB (+100%) | 256 KB |
| AEC-Q100 Qualified | Yes | No (industrial grade) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Number of I/O | 59 | 59 | 59 | 59 | 59 | 59 |
| CAN Controllers | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) |
Key Differentiators
- Automotive AEC-Q100 qualification at standard price tier (vs S912XET256BMAA)
- Higher Flash density available in same package (vs S912XET512BMAGR)
- Newer XE mask with XGATE coprocessor (vs MC9S12XA256CAAR)
Design Notes
The S912XET256BMAAR requires a clean 5V VDDX supply plus a regulated 2.5V VDD rail; decoupling must include 100 nF ceramic caps on each VDDX/VSSR pair placed within 5 mm of the pins, plus a bulk 10 uF tantalum or ceramic capacitor near the IC. In-rush current during Flash programming can spike above 100 mA; ensure the LDO upstream can supply the peak transient. Power-On Reset (POR) is asserted internally below 1.8V, so VDD must ramp monotonically and reach the operating threshold within the POR timeout.
At maximum 50 MHz CPU clock and full peripheral activity, internal dissipation is well under 1W and the 80-LQFP (14x14 mm) thermal pad keeps junction temperature within the -40C to +125C range without an external heatsink. For sealed enclosures with limited airflow, place thermal vias under the exposed pad (if present) and ensure the PCB copper pour area around the IC is at least 1 square inch. Use theta_JA of approximately 60 C/W as a starting estimate for junction-to-ambient thermal rise calculation.
Route the CAN bus differential pair (CANH, CANL) as a 100-ohm impedance matched pair with ground reference on an adjacent layer; keep length matching within 5 mm to meet CAN signal-integrity requirements. Place the CAN transceiver within 50 mm of the MCU CAN pins to minimize stub length. The BDM (Background Debug Mode) and RESET pins should be brought to a header or test pad for production programming and field debugging; add ESD protection diodes if the connector is exposed.
Do not confuse the S912XET256BMAAR (80-LQFP) with the S912XET256BMALR (112-LQFP) - the package pinouts differ even though the silicon is similar. Always verify the suffix in the part number against the PCB land pattern before PCB fab. Also note that AEC-Q100 BMAAR suffix and industrial-grade BMAA suffix share the same silicon, so a BMAAR can drop into a BMAA socket but AEC-Q100 cost will not be recovered for industrial designs.
Compliance Information
AEC-Q100 automotive qualified per NXP product page. RoHS and REACH compliant per distributor listings. Lead-free confirmed; halogen-free status not explicitly stated in verified data.
