SC370760EFR - Freescale Specialized Interface IC | NXP
MPN: SC370760EFR ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.6 | $360.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.85 | $2,850.00 |
SC370760EFR Overview
A specialized interface IC is a category of integrated circuits designed to perform application-specific interface, signal conditioning, or protocol-bridging functions that fall outside the scope of standard analog or digital logic families. These ICs typically integrate analog front-end circuitry, custom digital logic, and application-optimized firmware or state machines on a single die. Specialized ICs bridge the gap between general-purpose controllers and fully custom ASICs, providing cost-effective solutions for niche applications such as industrial control, automotive subsystems, and proprietary communication interfaces.
The SC370760EFR has historically been associated with the Freescale LBCC MOS9 L45M material set, a process technology lineage used across several Freescale interface and power management devices. The Bulk packaging designation indicates the component is supplied in anti-static bags or tubes without tape-and-reel packaging, typically intended for prototyping, low-volume assembly, or industrial customers requiring non-SMD handling. RoHS compliance is indicated in distributor listings, and the part is recommended for use in commercial and industrial temperature environments.
Typical use cases include OEM replacement of legacy Freescale interface circuitry, board-level repair of older industrial equipment, and small-batch manufacturing where the original component must be matched to maintain system compatibility. Engineers evaluating this part should verify the detailed pinout, electrical characteristics, and functional block diagram against the original design documentation, as the specialized nature of the device means parameters vary by application. Distributors report limited but persistent stock availability, with Rochester Electronics and NXP Semiconductors being primary authorized sources for ongoing supply.
When designing with the SC370760EFR, engineers should confirm the mechanical footprint and pinout against existing PCB layouts, particularly when substituting into legacy designs. The MSL Level 3 rating requires floor-life management during assembly (168 hours maximum at 30C/60%RH before baking). Bulk packaging necessitates additional handling procedures at incoming inspection and SMT placement lines typically configured for tape-and-reel feeders.
This page synthesizes distributor stock data, compliance information, and design handling guidance for the SC370760EFR not found in the manufacturer datasheet alone. Engineers should cross-reference the detailed electrical specifications with their specific application requirements before integration into new designs.
Drop-in alternatives for SC370760EFR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SC370760EFR (same form factor and footprint) — differing in Manufacturer, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SC370760EF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.15 / Unit
View Datasheet →SC370761EFR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
SC370760EFR Specifications
| Manufacturer | Freescale Semiconductor (now NXP Semiconductors) |
| Part Number | SC370760EFR |
| Category | Specialized Interface IC |
| Package Type | Bulk |
| MSL Level | 3 (168 Hours) |
| ECCN Code | EAR99 |
| HTSUS Code | 8542.31.0001 |
| RoHS Compliance | Compliant |
| Process Material | LBCC MOS9 L45M |
| Supply Status | Limited |
| Popularity | Medium |
SC370760EFR bulk Pin Configuration Guide
Pin configuration for SC370760EFR (bulk package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for SC370760EFR.
Refer to the datasheet for full pin configuration.
Typical Applications
SC370760EFR is suitable for 6 applications: Industrial Control Interface, Legacy Equipment Repair and Maintenance, Automotive Subsystem Interface, Test and Measurement Equipment, Communication Protocol Bridging, Medical Device Interface Circuitry.
Industrial Control Interface
The SC370760EFR's specialized interface architecture makes it a reliable choice for industrial control systems requiring proven Freescale/NXP silicon. Its LBCC MOS9 L45M process technology provides stable operation in factory automation environments with ambient temperature variations. The Bulk packaging supports low-volume industrial assembly where tape-and-reel automation is not required, and the EAR99 export classification enables global deployment. Engineers value the part's established reliability track record in long-life industrial programs where component continuity outweighs the need for the latest features.
Recommended
Legacy Equipment Repair and Maintenance
The SC370760EFR is particularly suited for legacy equipment repair programs where the original Freescale part must be matched exactly to maintain system functionality. Rochester Electronics and authorized distributors maintain ongoing stock specifically to support these long-life service requirements. The NRND (Not Recommended for New Designs) classification is irrelevant for repair scenarios, as the goal is identical replacement rather than redesign. Engineers servicing industrial equipment, medical devices, or test instrumentation benefit from the part's continued availability through authorized channels with full traceability.
Recommended
Automotive Subsystem Interface
Although not AEC-Q100 qualified, the SC370760EFR's robust Freescale process technology makes it suitable for non-critical automotive subsystems such as interior accessory controllers, aftermarket infotainment interfaces, and diagnostic tools. The RoHS compliance ensures compatibility with modern automotive electronics manufacturing standards. Engineers integrating this part should perform their own qualification testing for safety-critical applications and verify operating temperature ranges against their specific automotive environment requirements, including under-hood temperature extremes.
Recommended
Test and Measurement Equipment
The SC370760EFR's specialized interface characteristics make it a candidate for test and measurement equipment where specific signal conditioning or protocol bridging is required. Its MSL Level 3 rating allows reasonable handling flexibility during equipment manufacturing, and the Bulk package format suits the typically low-volume, high-mix production characteristic of test instrument manufacturers. Engineers should verify the part's bandwidth, linearity, and noise performance against their specific measurement application requirements by consulting the full datasheet.
Recommended
Communication Protocol Bridging
Specialized interface ICs like the SC370760EFR are commonly deployed as protocol bridges between legacy communication buses and modern interfaces in industrial networking, building automation, and proprietary fieldbus systems. The part's Freescale heritage suggests compatibility with established communication protocols used in process control and SCADA systems. Engineers designing protocol conversion modules can leverage this part's specialized functionality, though they should verify exact protocol support and electrical interface levels against their target network standards.
Recommended
Medical Device Interface Circuitry
Non-patient-contact medical device subsystems including laboratory instrumentation, diagnostic equipment interfaces, and medical device communication modules can leverage the SC370760EFR's specialized interface functionality. The part's established reliability profile and ongoing authorized distribution through Rochester Electronics support the long product lifecycles typical of medical equipment. Engineers must perform their own IEC 60601-1 compliance verification and ensure the device meets all applicable medical device regulations for their specific application before integration.
Recommended
Recommended Products Summary
Engineering reference data for SC370760EFR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SC370760EF | SC370761EFR |
|---|---|---|---|
| Package | Bulk | Bulk - same | Bulk - same |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors - same | NXP Semiconductors - same |
| Lifecycle Status | NRND | NRND | NRND |
| RoHS Compliance | Compliant | Compliant | Compliant |
| MSL Level | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) |
| ECCN Code | EAR99 | EAR99 | EAR99 |
| Process Technology | LBCC MOS9 L45M | LBCC MOS9 L45M - same | LBCC MOS9 L45M - same family |
| Supply Status | Limited | Limited | Limited |
Key Differentiators
- Long-term authorized supply through Rochester Electronics (vs Generic third-party stock)
- Established Freescale process technology (LBCC MOS9 L45M) (vs Newer process technologies)
- RoHS compliance with EAR99 export classification (vs Non-RoHS legacy alternatives)
Design Notes
The SC370760EFR is classified as NRND (Not Recommended for New Designs). Engineers evaluating this part for new product development should consider modern NXP alternatives and plan migration paths accordingly. However, for legacy equipment repair, OEM replacement, and long-life industrial programs, the part remains a valid choice with continued authorized distribution through Rochester Electronics. Verify supply continuity directly with NXP for production volumes exceeding 10,000 pieces annually.
The Bulk packaging format requires manual handling or third-party tape-and-reel conversion services for SMT assembly lines. Engineers should plan for additional handling time and tooling considerations when integrating this part into high-volume production. Verify the pin configuration against the datasheet before PCB layout, as specialized interface ICs often have application-specific pin assignments that differ from standard logic families.
MSL Level 3 (168 Hours) rating requires floor-life management during PCB assembly. Components removed from moisture-barrier packaging must be assembled within 168 hours at 30C/60% RH, or baked per JEDEC J-STD-033 before reflow soldering. Incoming inspection and SMT line staging areas should track cumulative exposure time to prevent moisture-related defects such as package cracking or delamination during thermal processing.
Compliance Information
RoHS compliance confirmed per distributor listings (JLCPCB). ECCN EAR99 export classification per GlobalSpec distributor data. Reach, halogen-free, and conflict minerals status not publicly disclosed in available distributor data.
