SY87701VSC - 1.25 Gbps Clock/Data Recovery IC | Microchip
MPN: SY87701VSC ✓ ActiveSY87701VSC Overview
A clock and data recovery IC, commonly abbreviated CDR, belongs to the clock-and-timing IC hierarchy and provides the timing reference needed by high-speed serial links. Unlike a receiver that only detects transitions, a CDR extracts or reconstructs a usable clock from a serial data stream and aligns recovered data with that clock. The SY87701 therefore supports systems that need deterministic timing, serial-to-parallel or parallel-to-serial conversion, and multiplexing between high-speed data paths.
The manufacturer datasheet identifies the SY87701 as a protocol-independent CDR capable of operation through 1.25 Gbps. It is associated with Ethernet, SONET/SDH, and ATM applications, allowing the same device family to address multiple telecommunications and networking signal formats. The 32-TQFP exposed-pad package provides a defined PCB footprint and a central thermal connection for power handling and ground-plane connection.
Its clock and data recovery architecture separates the device from generic fixed-format transceivers. Protocol independence allows the surrounding system to establish the required framing and encoding, while the CDR handles the critical task of maintaining clock-to-data alignment. At high data rates, this alignment directly affects whether the receiver can distinguish valid data from timing uncertainty and transition noise.
Typical implementation areas include Ethernet line interfaces, SONET/SDH transport equipment, ATM networking systems, optical-module signal paths, and test equipment that reproduces high-speed serial links. The device can be especially relevant where a parallel source must be serialized or where a received serial stream must be converted into a parallel bus for downstream digital processing.
When laying out a board for the SY87701VSC, preserve the manufacturer's recommended high-speed differential and bypass-connection topology. Keep the exposed pad tied to the designated ground plane, place input and output decoupling capacitors close to their associated pins, and maintain controlled impedance on high-speed signal routes. Differential routing symmetry and short return paths are important because even small timing skew can reduce margin at 1.25 Gbps.
This product record combines the verified device classification, speed, package, and application information with engineering guidance for footprint reuse, high-speed layout, thermal implementation, and replacement assessment. It also distinguishes verified drop-in replacements from generic functional substitutes, helping engineers confirm pin-level and parameter-level compatibility before modifying a production design.
Drop-in alternatives for SY87701VSC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
No drop-in alternatives available for this product.
Request AlternativesSY87701VSC Specifications
| Product Type | Clock and data recovery IC |
| Minimum Data Rate | 32 Mbps |
| Maximum Data Rate | 1.25 Gbps |
| Protocol Independence | Protocol-independent clock and data recovery |
| Output Count | 1 output |
| Multiplexer Function | Multiplexer IC |
| Package | 32-TQFP exposed pad, 7 mm x 7 mm |
| Total Pin Count | 32 pins |
| Mounting Type | Surface mount |
| Ethernet Compatibility | Supported application |
| SONET/SDH Compatibility | Supported application |
| ATM Compatibility | Supported application |
SY87701VSC 32-tqfp exposed pad, 7 mm x 7 mm Pin Configuration Guide
Pin configuration for SY87701VSC (32-tqfp exposed pad, 7 mm x 7 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for SY87701VSC.
Refer to the datasheet for full pin configuration.
Typical Applications
SY87701VSC is suitable for 6 applications: Ethernet High-Speed Interfaces, SONET/SDH Transport Equipment, ATM Network Equipment, Optical Module Data Paths, High-Speed Serial Test Equipment, Backplane and Parallel-Serializer Links.
Ethernet High-Speed Interfaces
The SY87701VSC fits Ethernet interface circuitry requiring recovery of clock and data from a high-speed serial stream. Its manufacturer-specified operating range extends from 32 Mbps to 1.25 Gbps, while the protocol-independent architecture separates timing recovery from the framing rules implemented elsewhere in the link. In a 1.25 Gbps design, the CDR can align the recovered stream before it is routed to a serializer, parallel interface, test point, or network-processing block. Engineers should verify logic levels, acquisition requirements, reference-clock topology, and the complete timing margin rather than treating the headline data rate as the only selection criterion.
SONET/SDH Transport Equipment
The SY87701VSC is appropriate for SONET/SDH transport paths that require reliable clock and data alignment before framing or descrambling operations. Because the device is protocol-independent and supports rates through 1.25 Gbps, it can serve line-card signal chains handling multiple transport-related rates. The exposed-pad TQFP package also provides a defined thermal and grounding footprint for compact telecommunications hardware. A production design should confirm the required serial format, reference-clock relationship, jitter tolerance, and standard-specific line rate against the manufacturer datasheet before selecting the device for a new SONET/SDH board.
ATM Network Equipment
The SY87701VSC is identified by the manufacturer for ATM applications, making it suitable for equipment that must recover timing and data from asynchronous transfer mode links. Its protocol-independent CDR function supports implementations in which the surrounding ASIC or FPGA handles ATM segmentation and framing while the SY87701 performs the timing-sensitive recovery function. At the top operating rate of 1.25 Gbps, controlled-impedance routing, low-skew differential connections, and careful grounding are essential. Prototype validation should include worst-case data pattern, jitter, temperature, and supply variation to confirm the recovered clock and data margins.
Optical Module Data Paths
The SY87701VSC can support the high-speed electrical data path between an optical serializer or transceiver and surrounding processing logic. Clock and data recovery is useful when the serial link must present deterministic timing to a digital block, particularly at rates approaching 1.25 Gbps. The 32-TQFP exposed-pad package is compatible with compact module layouts, but thermal design and high-speed return paths remain essential. Confirm differential impedance, connector or pad-transition geometry, supply filtering, and serializer compatibility in the manufacturer reference circuit before adapting the design to a specific optical module.
High-Speed Serial Test Equipment
The SY87701VSC is suitable for test and measurement systems that generate or analyze serial traffic between 32 Mbps and 1.25 Gbps. Clock and data recovery provides a repeatable timing relationship for stimulus generation, loopback testing, and protocol-analyzer front ends. A reusable platform can route recovered data toward an FPGA, ASIC, or pattern engine while allowing the reference clock and acquisition behavior to be evaluated under changing jitter and data-pattern conditions. Because the CDR is protocol-independent, system-level test software must establish framing, error detection, and stimulus interpretation around the recovered stream.
Backplane and Parallel-Serializer Links
The SY87701VSC can be used where a backplane or processing architecture requires a serial-to-parallel or parallel-to-serial timing boundary. The multiplexer function adds flexibility for systems that need controlled routing between high-speed data paths, while clock recovery maintains alignment between the recovered stream and downstream logic. This makes the device relevant to legacy telecommunications and industrial interface designs that were developed around protocol-independent CDR components. Layout review should compare every board-level differential pair with the manufacturer reference design, particularly return vias, layer transitions, and the exposed-pad ground arrangement.
Engineering reference data for SY87701VSC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Microchip Technology |
| Package | 32-TQFP exposed pad, 7 mm x 7 mm |
| Product Type | Clock and data recovery IC |
| Minimum Data Rate | 32 Mbps |
| Maximum Data Rate | — |
| Protocol Independence | Protocol-independent |
| Output Count | 1 output |
| Multiplexer Function | Yes |
| Ethernet Application | Supported |
| SONET/SDH and ATM Applications | Supported |
Key Differentiators
- Broad protocol-independent recovery range (vs No verified drop-in alternative is established)
- Combines recovery and multiplexing (vs No verified drop-in alternative is established)
- Supports multiple transport applications (vs No verified drop-in alternative is established)
Design Notes
Use the manufacturer reference layout as the baseline for every power, ground, control, and high-speed connection. Place the input and output bypass capacitors at the pins they serve, provide a continuous ground reference beneath the device, and connect the exposed pad using the specified pad geometry and via arrangement. Do not route sensitive signals through the plane split used by other high-speed circuitry, because return-path discontinuities can couple edge energy into the recovered clock and data nets.
Treat all serial data and clock routes as controlled-impedance interconnects rather than ordinary low-speed traces. Maintain symmetry between each differential pair, minimize layer transitions, preserve continuous reference planes, and avoid stubs. At the device's upper 1.25 Gbps rate, connector and package parasitics, trace-length mismatch, and unequal return paths can consume timing and jitter margin even when the nominal wiring looks electrically correct.
Connect the 32-TQFP exposed pad to the manufacturer-specified thermal and electrical ground construction. The exposed pad is not only a heat-transfer feature; it also participates in the package's electrical and return-path architecture. Use the footprint's land pattern and the recommended via count, keep thermal vias clear of sensitive routing, and verify junction-temperature limits under the highest expected clocking activity and supply condition.
Do not substitute a generic CDR solely because its maximum data rate is equal or higher. Verify pin names and functions, power sequencing, reference-clock frequency and polarity, input/output thresholds, acquisition time, jitter performance, and serializer interface type. Also confirm the exact 7 mm x 7 mm 32-TQFP exposed-pad footprint rather than treating all 32-pin TQFP packages as mechanically or electrically interchangeable.
Compliance Information
The manufacturer product information identifies the function, speed, package, and applications but does not state the requested compliance status. The exposed-pad package is not itself evidence of RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance.
