TDA5 - High-Performance Edge AI SoC | Texas Instruments
MPN: TDA5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $250 | $250.00 |
| 10 | $225 | $2,250.00 |
| 100 | $200 | $20,000.00 |
| 500 | $180 | $90,000.00 |
| 1,000 | $160 | $160,000.00 |
Drop-in alternatives for TDA5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TDA54-Q1
✅ Drop-In✓ In Stock
$90 / Unit
View Datasheet →TDA3MV
⚡ Same Package✓ In Stock
$29 / Unit
View Datasheet →AWR2188
⚡ Same Package✓ In Stock
$29 / Unit
View Datasheet →TMS320C6678ACYPA
⚡ Same Package✓ In Stock
$226.49 / Unit
View Datasheet →TMS320F28069PZT
⚡ Same Package✓ In Stock
$8.1 / Unit
View Datasheet →TDA5 Maximum Ratings & Electrical Characteristics
| AI Performance | Up to 1200 TOPS |
| NPU | Integrated C7™ NPU |
| Architecture | Chiplet-ready |
| Functional Safety | ASIL-D capable |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Package | [DATA_NEEDED: package type] |
| Supply Voltage | [DATA_NEEDED: supply voltage] |
| Power Dissipation | [DATA_NEEDED: power dissipation] |
| CPU Cores | [DATA_NEEDED: CPU core configuration] |
| GPU | [DATA_NEEDED: GPU details] |
| Memory Interface | [DATA_NEEDED: memory interface] |
| Sensor Interfaces | Camera, radar, LiDAR |
| Process Technology | [DATA_NEEDED: process node] |
| RoHS | Compliant |
| AEC-Q100 | Qualified |
TDA5 [data_needed: package type] Pin Configuration Guide
Complete pinout information for TDA5 ([data_needed: package type] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package type] package pinout diagram for TDA5](/assets/package-diagrams/default.svg?v=1787750169)
No detailed pinout data available for TDA5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TDA5 is suitable for 6 applications: Autonomous Driving, Advanced Driver Assistance Systems (ADAS), Robotics, Smart Infrastructure, Medical Imaging, Edge AI Servers.
Autonomous Driving
The TDA5 provides up to 1200 TOPS for real-time perception and decision-making in autonomous vehicles. Its high AI performance enables processing of camera, radar, and LiDAR data simultaneously, supporting Level 3+ autonomy. The chiplet-ready architecture allows scaling for different vehicle tiers, and ASIL-D safety ensures reliable operation in critical scenarios.
Recommended
Advanced Driver Assistance Systems (ADAS)
TDA5 enables ADAS features like automatic emergency braking, lane keeping, and traffic sign recognition. Its NPU accelerates neural networks for object detection and classification, while the CPU handles control algorithms. The SoC's safety features meet ASIL-D requirements, making it suitable for safety-critical functions. Its high TOPS ensures future-proofing for evolving ADAS capabilities.
Recommended
Robotics
In robotics, TDA5 provides the compute power for real-time object recognition, path planning, and manipulation. Its high TOPS enables running complex AI models for grasping and navigation. The chiplet-ready design allows customization for specific robot types. The SoC's low latency is critical for responsive control, and its safety features support collaborative robots.
Recommended
Smart Infrastructure
TDA5 can be used in smart traffic management, surveillance, and industrial automation. Its AI performance enables real-time video analytics for traffic flow optimization and anomaly detection. The SoC's multiple sensor interfaces support cameras and other sensors. Its scalability allows deployment in various infrastructure nodes, from edge devices to central hubs.
Recommended
Medical Imaging
TDA5's high TOPS can accelerate AI-based medical image analysis, such as tumor detection in CT or MRI scans. Its processing power enables real-time inference, aiding radiologists. The SoC's safety features are beneficial for medical devices requiring reliability. The chiplet-ready architecture allows integration of specialized chiplets for specific imaging modalities.
Recommended
Edge AI Servers
TDA5 can be used in edge servers for AI inference in data centers or at the network edge. Its high TOPS and chiplet-ready architecture allow scaling for various workloads. The SoC's power efficiency is crucial for edge deployments. It supports multiple AI frameworks, making it versatile for different applications.
Recommended
Recommended Products Summary
Engineering reference data for TDA5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TDA54-Q1 | TDA3MV | AWR2188 |
|---|---|---|---|---|
| AI Performance | Up to 1200 TOPS | Up to 1200 TOPS | Lower TOPS | Radar-specific |
| NPU | C7™ NPU | C7™ NPU | DSP-based | Radar processing |
| Architecture | Chiplet-ready | Chiplet-ready | Traditional SoC | Radar SoC |
| Functional Safety | ASIL-D capable | ASIL-D | ASIL-B | ASIL-B |
| Package | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Application | ADAS, Autonomous Driving | Automotive | ADAS | Radar |
| Price (1pc) | $250 | $250 | $100 | $150 |
Key Differentiators
- Up to 1200 TOPS AI performance (vs TDA3MV)
- Chiplet-ready architecture (vs TDA3MV)
- ASIL-D functional safety (vs AWR2188)
Design Notes
The TDA5's high TOPS performance requires a robust power delivery network. Use multiple voltage rails with appropriate decoupling capacitors and power management ICs to handle transient loads. Refer to the TI reference design for recommended power sequencing.
With up to 1200 TOPS, the TDA5 can dissipate significant heat. Use a heatsink or active cooling solution to maintain junction temperature within limits. Ensure adequate airflow in the enclosure and consider thermal vias in the PCB layout.
For high-speed interfaces like LPDDR5 and PCIe, follow TI's layout guidelines for impedance control and signal integrity. Keep traces short and use ground planes to minimize noise. The chiplet-ready architecture may require additional connectors for chiplet expansion.
Compliance Information
RoHS compliant per TI product page. AEC-Q100 qualified for automotive variants.
