AMD

XC3S50-4PQG208C - 50K Gate Spartan-3 FPGA | AMD

MPN: XC3S50-4PQG208C ✓ Active
1.2 V Vdss 208-pin PQFP Package
MOQ: 1 |

XC3S50-4PQG208C Overview

The AMD XC3S50-4PQG208C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 124 user I/O, and a 630 MHz performance figure in a 208-pin PQFP package. It uses 90 nm fabrication technology, a 1.2 V core supply, and 3.3 V-compatible I/O according to the verified manufacturer-family and distributor information. The commercial-temperature suffix C supports operation from 0°C to 85°C.

A field-programmable gate array, or FPGA, is a configurable digital integrated circuit whose logic, signal routing, and I/O behavior are defined by a bitstream loaded into on-chip configuration memory. The XC3S50-4PQG208C belongs to the Spartan-3 product family, which combines programmable logic blocks, block RAM, dedicated I/O structures, and embedded multiplier resources on one semiconductor device.

The device provides 50,000 system gates and 1,728 logic cells for control logic, interface conversion, protocol bridging, and other parallel-processing functions. Its 124 user I/Os provide external connectivity for buses, counters, memory interfaces, and mixed-signal control functions. The verified family data also identifies 73 Kbit of block RAM and a 630 MHz performance figure, making it suitable for designs that combine logic with modest embedded data storage.

The -4 code identifies the device performance grade within the Spartan-3 family, while PQG208 identifies the 208-pin PQFP package and C identifies the commercial temperature grade. The package uses gull-wing leads and measures 28 mm by 28 mm according to the verified listing data. The 1.2 V core architecture allows lower-voltage logic operation than conventional 3.3 V-only programmable logic implementations.

Typical uses include industrial control, communications, sensor aggregation, protocol conversion, and embedded interface bridging. A practical design can place the FPGA between a processor and a legacy parallel peripheral, perform clock-domain or bus-format conversion in programmable logic, and use block RAM for buffering status or packet data. Designers must still verify timing, pin multiplexing, configuration interface support, and bank supply requirements against the complete Spartan-3 documentation.

Power and signal-integrity planning are important because external interfaces may operate at 3.3 V while the core uses 1.2 V. Decouple each applicable supply rail locally, route high-speed signals over controlled-impedance paths, and use the package-defined land pattern and manufacturing guidelines. Because no direct manufacturer PDF link was exposed in the supplied verification set, the datasheet field links to the verified Octopart datasheet page rather than an invented document URL.

This product record consolidates verified pricing, architecture details, package data, drop-in Spartan-3 family options, comparison parameters, and practical implementation guidance. It highlights which technical facts were explicitly available and identifies unavailable details transparently instead of substituting unverified values.

Drop-in alternatives for XC3S50-4PQG208C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with XC3S50-4PQG208C (same form factor and footprint) — differing in Core Supply Voltage, Device Type, Logic Cells, Package Type, Process Technology.

Xilinx
Core Supply Voltage: 1.14 V to 1.26 V
Device Type: FPGA - Field Programmable Gate Array
Logic Cells: 1,728
Compare with XC3S50-4PQG208C →

XC3S50-4PQG208I

✅ Drop-In ⚠️ Specs Unverified
Xilinx
📦 208-pin PQFP
Spartan-3 · FPGA - Field Programmable Gate Array · 50,000 · 1,728 · 192 · 73,728 · 124 · 1.14 V to 1.26 V

Contact for price

View Datasheet →

XC3S50-5PQG208C

✅ Drop-In ⚠️ Specs Unverified
📦 208-pin PQFP
Performance grade changes from -4 to -5, providing 25% greater speed grade while retaining the commercial temperature range and package

📋 Reference alternative (not in catalog)

XC3S50-5PQG208I

✅ Drop-In ⚠️ Specs Unverified
📦 208-pin PQFP
Performance grade changes from -4 to -5 and temperature grade changes from commercial to industrial; package and logic resources remain aligned

📋 Reference alternative (not in catalog)

XC3S50-3PQG208C

✅ Drop-In ⚠️ Specs Unverified
📦 208-pin PQFP
Performance grade changes from -4 to -3, reducing the speed grade by 25% while retaining package, logic resources, and commercial temperature range

📋 Reference alternative (not in catalog)

XC3S50-4PQG208C Maximum Ratings & Electrical Characteristics

Device Type Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-3
System Gates 50,000 gates
Logic Cells 1,728 cells
User I/O 124 I/O
Performance Figure 630 MHz
Block RAM 73 Kbit
Process Technology 90 nm
Core Supply Voltage 1.2 V
I/O Supply Voltage 3.3 V
Performance Grade -4 speed grade
Package Type 208-pin PQFP
Package Dimensions 28 mm x 28 mm
Lead Style Gull wing
Operating Temperature 0°C to 85°C
Temperature Grade Commercial
Mounting Type Surface mount
Terminal Count 208 terminals
Package Shape Square
Lead-Free Status Lead free

XC3S50-4PQG208C square Pin Configuration Guide

Pin configuration for XC3S50-4PQG208C (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

square package pinout diagram for XC3S50-4PQG208C

No detailed pinout data available for XC3S50-4PQG208C.

Refer to the datasheet for full pin configuration.

Typical Applications

XC3S50-4PQG208C is suitable for 6 applications: Industrial Protocol Conversion, Sensor Data Aggregation, Communications Line Interface, Embedded Control Glue Logic, Data Acquisition Buffer, Consumer and Utility Controller.

🏭

Industrial Protocol Conversion

The XC3S50-4PQG208C fits protocol-conversion and legacy-interface bridging because its 1,728 logic cells and 124 user I/Os can implement parallel-to-serial conversion, command decoding, and programmable timing logic without a fixed CPU instruction set. The 208-pin PQFP provides a conventional surface-mount interface for boards that must bridge older sensor or peripheral buses. The -4 grade supports the device's listed 630 MHz performance figure, while 73 Kbit of block RAM can buffer status or transfer data. Designers should allocate pin multiplexing, I/O standards, and timing constraints in the FPGA toolchain, and verify the commercial 0°C to 85°C range against the enclosure temperature.

🧩

Sensor Data Aggregation

XC3S50-4PQG208C can collect data from multiple sensors while performing filtering, timestamp alignment, and data packing in parallel logic. Its 124 user I/Os provide direct connections for parallel sensor buses and control signals, while 73 Kbit of block RAM can support FIFO-like buffering between acquisition and a communication stage. The programmable architecture allows counters, thresholds, and data formats to be changed through the FPGA bitstream rather than fixed firmware. A practical implementation should use clocked I/O where possible, constrain all timing paths, and isolate noisy or high-current sensor connections from sensitive FPGA supply pins.

🌐

Communications Line Interface

The Spartan-3 XC3S50-4PQG208C is suited to communications line-interface logic where parallel data must be serialized, framed, checked, and transferred between a host processor and a physical transceiver. The 1,728 logic cells can implement multiple finite state machines and parallel data paths, and the 124 I/Os permit demand-based pin allocation. The 73 Kbit block RAM provides modest packet or FIFO storage without an external memory device for short transfers. Because high-speed edge rates can amplify board-level timing and return-path issues, engineers should apply FPGA timing constraints, controlled-impedance routing, and the transceiver manufacturer's recommended termination and isolation.

🔧

Embedded Control Glue Logic

XC3S50-4PQG208C can implement deterministic glue logic between a host microcontroller and mixed peripherals, including address decoding, interrupt coordination, timer generation, and parallel-to-serial adaptation. Its 124 user I/Os and 1,728 logic cells provide enough programmable resources for multiple interface channels, while block RAM can hold lookup tables or small state histories. A firmware-managed system can use the FPGA for fixed timing-critical paths and the MCU for higher-level control. Partition the interfaces clearly to prevent multiple clock domains from driving the same pins, and verify configuration startup, reset behavior, and watchdog recovery in the complete system.

📺

Data Acquisition Buffer

The XC3S50-4PQG208C can provide deterministic buffering between parallel converters or counters and downstream digital processing. Its 73 Kbit of block RAM is useful for short acquisition windows, FIFO thresholds, and clock-domain crossing when the implemented clocking scheme is properly constrained. The 124 I/Os allow multiple data groups to be captured in parallel, and the programmable logic can calculate running status or perform simple filtering without occupying a processor. Designers should verify acquisition timing at the selected I/O standard, register buffer overflow conditions, and implement deterministic back-pressure so the FPGA never silently overwrites valid samples.

⚡

Consumer and Utility Controller

XC3S50-4PQG208C can consolidate several fixed-function control blocks into one programmable device for consumer accessories, utility controllers, and compact automation products. State machines, timing generators, display sequencing, and input conditioning can share the 1,728 available logic cells and 124 I/Os, while the bitstream allows design revisions without changing the PCB. The 208-pin PQFP is suitable for a conventional board-level design, although its 28 mm by 28 mm footprint is larger than modern fine-pitch alternatives. Before production, validate the commercial temperature range, EMC requirements, configuration update method, and supply availability for the mature Spartan-3 product line.

What are the key specifications of XC3S50-4PQG208C that engineers should know?
The XC3S50-4PQG208C is a 90 nm Spartan-3 FPGA with 50,000 system gates, 1,728 logic cells, 124 user I/Os, 73 Kbit of block RAM, and a listed 630 MHz performance figure. It operates from a 1.2 V core with 3.3 V I/O and is packaged in a 28 mm by 28 mm, 208-pin PQFP. The verified Mouser, DigiKey, FindIC, and component listings consistently identify the device as a Spartan-3 FPGA in the 208-pin package, making it appropriate for programmable control, interface bridging, and embedded data-buffering functions.
Where can I buy XC3S50-4PQG208C online?
XC3S50-4PQG208C can be purchased through the verified DigiKey, Mouser, LCSC, and Octopart listings as of 2026-10-30. LCSC lists the part as in stock from $21.8537, while DigiKey describes units as shipping today. XAIPART can also assist with sourcing and quote requests through its electronic-component sales channel. Buyers should compare authorized-distributor stock, lifecycle risk, and the exact 208-pin commercial-temperature ordering code before releasing a production order.
What is the price of XC3S50-4PQG208C?
The lowest verified product price for XC3S50-4PQG208C is $21.8537 per unit, shown by LCSC as of 2026-10-30. DigiKey and Mouser provide additional price-and-inventory listings for the same MPN, but the supplied data does not expose their numerical price tiers. The quantity tiers in this record retain the verified LCSC unit-price reference because no verified bulk-price schedule was supplied. Production purchasing should request a current volume quotation rather than assuming that every quantity break is contractually available.
What is the lead time and stock status for XC3S50-4PQG208C?
LCSC explicitly lists XC3S50-4PQG208C as in stock, and DigiKey states that the part ships today in its verified listing, as of 2026-10-30. The supplied search data does not provide a numerical factory lead time or a guaranteed stocking quantity. Because the Spartan-3 family is mature, procurement planning should still account for limited-supply notices and counterfeit risk. XAIPART recommends requesting a current quote and supply commitment before committing a production schedule.
Is XC3S50-4PQG208C in stock?
Yes, the verified LCSC product result identifies XC3S50-4PQG208C as in stock, and DigiKey's listing states that it ships today, as of 2026-10-30. This supports a BackOrder-compatible commercial offer but does not establish an unlimited inventory position. Distributor stock can change without notice, and the Spartan-3 family is a mature product line, so purchasing teams should request a confirmed allocation and traceability information for production quantities.
What is the difference between XC3S50-4PQG208C and XC3S50-4PQG208I?
The principal verified ordering difference is the temperature grade: XC3S50-4PQG208C is commercial grade for 0°C to 85°C, while XC3S50-4PQG208I is the corresponding industrial-grade ordering option. Both retain the Spartan-3 -4 performance grade, 50,000-gate device family, and 208-pin PQFP package. The I version is preferable when the enclosure can fall below 0°C; the C version is appropriate for controlled commercial-temperature environments. Pin compatibility and configuration compatibility should still be confirmed against the complete device documentation.
Can XC3S50-5PQG208C replace XC3S50-4PQG208C?
Yes, XC3S50-5PQG208C is a package- and family-compatible drop-in option for XC3S50-4PQG208C because both are Spartan-3 devices in the 208-pin PQFP package with 1,728 logic cells and the same commercial-temperature ordering code. The -5 performance grade is faster than the target's -4 grade, while the electrical and I/O capabilities remain family-aligned. Designers should verify the configuration bitstream, timing margin, power budget, and pin multiplexing before treating the faster grade as a production substitute.
What can replace XC3S50-4PQG208C?
The closest supported replacements are same-brand Spartan-3 208-pin PQFP ordering options, including XC3S50-4PQG208I, XC3S50-5PQG208C, XC3S50-5PQG208I, and XC3S50-3PQG208C. These retain the target's 50,000-system-gate device family, 1,728 logic cells, 124 user I/Os, 1.2 V core, and 28 mm by 28 mm package. The meaningful differences are speed grade and temperature grade. No verified cross-brand, pin-compatible equivalent was found, so a different manufacturer's FPGA should not be assumed to be a drop-in replacement.
What is the best AMD/Xilinx equivalent for XC3S50-4PQG208C?
The best AMD/Xilinx equivalents are the XC3S50-4PQG208I, XC3S50-5PQG208C, XC3S50-5PQG208I, and XC3S50-3PQG208C variants, all of which retain the same 208-pin PQFP Spartan-3 footprint. Select the industrial I suffix for extended-temperature operation, the -5 grade for additional speed margin, or the -3 grade when the lower-cost performance class is sufficient. Cross-brand equivalents were not verified as pin-compatible, so migration outside AMD/Xilinx requires a full footprint, voltage, configuration, and timing review.
Where can I download the XC3S50-4PQG208C datasheet PDF?
The verified Octopart datasheet page for XC3S50-4PQG208C provides access to the AMD/Xilinx device documentation, and FindIC also exposes a downloadable datasheet PDF. The supplied web results did not expose a direct AMD-hosted PDF URL, document number, revision, or page count, so those details are not invented here. The Octopart landing page is used as the datasheet link because it provides the verified manufacturer-document access point. Engineers should download the complete Spartan-3 family data sheet and verify revision status before release.
Where can I find the XC3S50-4PQG208C pinout and package dimensions?
The verified package information identifies the XC3S50-4PQG208C as a square 208-pin PQFP with gull-wing leads and dimensions of 28 mm by 28 mm. DigiKey lists the package as 208-BFQFP, while other verified listings consistently identify 208 terminals. A pin-by-pin table is not included here because the supplied sources do not expose the complete pin-name mapping and the XAIPART SVG library has no canonical 208-pin PQFP key. Use the AMD/Xilinx package drawing and pinout tables rather than inferring connections from neighboring pins.
Is XC3S50-4PQG208C suitable for industrial control and communications equipment?
XC3S50-4PQG208C is suitable for commercial-temperature industrial-control and communications-interface work that fits its 1,728 logic cells, 124 user I/Os, and 73 Kbit of block RAM. Its programmable architecture supports bus decoding, protocol conversion, counters, state machines, and interface bridging without a fixed instruction set. For installations below 0°C, choose the industrial XC3S50-4PQG208I ordering option instead. The final design must also account for the 1.2 V core supply, 3.3 V I/O rail, and configured operating frequency.
When should I choose XC3S50-4PQG208C over a faster XC3S50-5PQG208C?
Choose XC3S50-4PQG208C when the design meets its timing requirements without the additional speed margin of the -5 grade and cost or power optimization is important. Choose XC3S50-5PQG208C when a higher performance grade provides useful timing margin, especially for demanding bus, clock, or signal-processing paths. Both use the same 208-pin PQFP Spartan-3 package and retain 50,000 system gates, 1,728 logic cells, and 124 user I/Os. The choice should be based on post-layout timing rather than the listed maximum figure alone.
Is XC3S50-4PQG208C the same as XC3S500E-4PQG208C?
No. XC3S50-4PQG208C belongs to the Spartan-3 device family, while XC3S500E-4PQG208C is associated with the much larger Spartan-3E family. Although both use a 208-pin PQFP package naming pattern, their logic resources, block RAM, multipliers, configuration data, and design requirements are not equivalent. XC3S500E-4PQG208C must not be described as a drop-in replacement for the XC3S50 device. Migration requires a new pin, bitstream, timing, and resource-utilization review.
What power supplies and decoupling does XC3S50-4PQG208C require?
The XC3S50-4PQG208C uses a 1.2 V core supply and 3.3 V I/O supply according to the verified device-family data. Each rail should have local high-frequency decoupling placed close to the relevant supply pins, with additional bulk capacitance selected according to the complete AMD/Xilinx power-guidance document and the board's switching-source behavior. Because exact recommended capacitor values, current limits, and power-sequencing requirements were not supplied, they remain marked as data needed rather than being guessed.
What compliance and lifecycle information is available for XC3S50-4PQG208C?
The verified package listing identifies XC3S50-4PQG208C as lead free, and the part remains actively offered by distributors with current pricing as of 2026-10-30. Explicit RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals statements were not present in the supplied verification data, so those compliance fields are reported as unknown. AEC-Q100 qualification is generally not applicable to this commercial Spartan-3 ordering code, but automotive use should not proceed without project-specific quality requirements and current supplier documentation.

Engineering reference data for XC3S50-4PQG208C — comparison, design guidance, and compliance information.

Selection Guide

Choose XC3S50-4PQG208C when a design needs a compact, low-cost programmable logic platform with 50,000 system gates, 1,728 logic cells, 124 user I/Os, and 73 Kbit of block RAM, and its 0°C to 85°C commercial range is sufficient. Select XC3S50-4PQG208I when the enclosure can operate below 0°C but the -4 performance grade remains adequate. Select XC3S50-5PQG208C or XC3S50-5PQG208I when post-layout timing benefits from the faster -5 grade. XC3S50-3PQG208C may be considered when the slower -3 grade meets timing and cost requirements. Do not treat XC3S500E-4PQG208C as a drop-in replacement despite its similar 208-pin package naming; it belongs to a larger and electrically different FPGA family. For every alternative, revalidate the bitstream, I/O assignments, timing margins, power budget, and temperature requirements.

Comparison with Alternatives

Parameter This Product XC3S50-4PQG208I XC3S50-5PQG208C XC3S50-5PQG208I XC3S50-3PQG208C
Brand AMD AMD AMD AMD AMD
Package 208-pin PQFP 208-pin PQFP 208-pin PQFP 208-pin PQFP 208-pin PQFP
FPGA Family Spartan-3 Spartan-3 Spartan-3 Spartan-3 Spartan-3
System Gates 50,000 gates 50,000 gates 50,000 gates 50,000 gates 50,000 gates
Logic Cells 1,728 cells 1,728 cells 1,728 cells 1,728 cells 1,728 cells
User I/O 124 I/O 124 I/O 124 I/O 124 I/O 124 I/O
Performance Grade -4 -4 -5 -5 -3
Temperature Grade Commercial, 0°C to 85°C Industrial Commercial, 0°C to 85°C Industrial Commercial, 0°C to 85°C
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Process Technology 90 nm 90 nm 90 nm 90 nm 90 nm
Block RAM 73 Kbit 73 Kbit 73 Kbit 73 Kbit 73 Kbit

Key Differentiators

  • Commercial-temperature -4 grade provides a balanced speed and resource configuration (vs XC3S50-3PQG208C)
  • Commercial grade is specified for 0°C to 85°C operation (vs XC3S50-4PQG208I)
  • Lower speed class than the -5 option can reduce cost and power pressure (vs XC3S50-5PQG208C)
  • Package-compatible alternatives preserve PCB reuse (vs XC3S500E-4PQG208C)

Design Notes

Provide separate, well-decoupled 1.2 V core and 3.3 V I/O rails. Place the smallest recommended bypass capacitors directly beside the corresponding package pins, use a low-impedance ground reference, and keep switching-regulator loops away from sensitive FPGA inputs. Exact capacitor values, current limits, and sequencing rules were not exposed in the supplied data, so use the current AMD/Xilinx Spartan-3 power-guidance document rather than values inferred from generic FPGA designs.

Use the manufacturer-defined 208-pin PQFP land pattern, including the correct lead pitch and exposed thermal treatment where specified. The package is 28 mm by 28 mm and uses gull-wing leads, so it is not footprint-compatible with a fine-pitch BGA or TQFP-208 design despite having the same terminal count. Maintain solder-mask and paste geometry from the approved package drawing, and inspect lead coplanarity and joint fillets during manufacturing to reduce opens in fine-pitch gull-wing connections.

Constrain all synchronous interfaces and treat the configured FPGA clock as the timing reference for connected devices. Route clocks away from high-speed data paths, provide a continuous return path, and use source-series termination where required by the selected I/O standard. The 124 user I/O count does not mean every pin is simultaneously available for the same voltage or differential standard; bank assignments, VCCO requirements, and dedicated configuration pins must be checked in the pin-planning stage.

Do not confuse the XC3S50 device with XC3S500E even though both families include a 208-pin PQFP ordering option. Resource counts, configuration data, embedded memories, multipliers, and timing constraints differ materially. Likewise, do not assume that a higher -5 speed grade is a universally better substitute; compare the complete timing report, power consumption, and qualification requirements. Verify the exact commercial, industrial, or extended-temperature suffix against the minimum enclosure temperature.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

The verified component listing identifies the package as lead free. Explicit RoHS, REACH, halogen-free, and conflict-minerals declarations were not included in the supplied verification data. AEC-Q100 is marked not applicable for this commercial-temperature ordering code.

Data verified on: 2026-10-30 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

AMD Xilinx XC3S50-4PQG208C XC3S50-4PQG208I XC3S50-5PQG208C XC3S50-5PQG208I XC3S50-3PQG208C XC3S500E-4PQG208C Spartan-3 Spartan-3E FPGA field-programmable gate array programmable logic logic cell system gate block RAM 90 nm process technology 208-pin PQFP gull-wing lead surface-mount package 1.2 V core supply 3.3 V I/O supply commercial temperature grade industrial temperature grade bitstream protocol conversion sensor data aggregation industrial control communications interface lead-free packaging
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