XC3S50-4TQG144I - 50K Spartan-3 FPGA, 144-TQFP | AMD
MPN: XC3S50-4TQG144I ✗ End of LifeXC3S50-4TQG144I Overview
A field-programmable gate array is a semiconductor device whose configurable logic, block memory, and programmable I/O can be programmed after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, while the XC3S50 device provides a balance of logic density, memory, and I/O capacity for control logic, data acquisition, protocol bridging, embedded signal processing, and general-purpose parallel processing. The XC3S50-4TQG144I is therefore a programmable-logic alternative to a collection of fixed-function glue-logic devices when design flexibility and field updates are important.
Key resources include 50,000 equivalent system gates, 1,728 logic cells, 192 CLBs, 97 user I/Os, and 73,728 bits of block RAM. The -4 speed designation identifies the device performance grade, while the TQG144 package provides a 144-pin surface-mount footprint. The 1.2 V core operating point supports low-voltage digital core operation, while external circuitry supplies the board-level I/O and power requirements.
The Spartan-3 architecture supports parallel programmable logic alongside dedicated block RAM for buffering, FIFOs, and data storage. This combination makes the XC3S50-4TQG144I useful for industrial controllers, communications interfaces, test equipment, embedded control systems, and sensor or acquisition platforms. The 97 available user I/Os provide connectivity for control signals, serial interfaces implemented in programmable logic, memory interfaces, and external peripherals.
Designers should verify the device-specific pinout, configuration interface, power rails, decoupling requirements, and supported I/O standards against the official Spartan-3 documentation before layout or schematic release. The TQFP package is pin-compatible with other verified 144-pin Spartan-3 variants only where the exact device, speed grade, package code, and electrical requirements match. Configuration should also include a defined startup path, suitable clocking, and adequate power-supply sequencing.
This page consolidates verified distributor and manufacturer-linked specifications, practical application guidance, same-footprint replacement candidates, and design cautions. It is intended to help engineers identify whether the XC3S50-4TQG144I matches the required logic density, memory capacity, package, temperature class, and supply requirements without relying on incomplete catalog summaries.
Drop-in alternatives for XC3S50-4TQG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S50-4TQG144I (same form factor and footprint) — differing in Device Type, Core Supply Voltage, Operating Temperature, Package Type.
XC3S50-4TQ144I
✅ Drop-InContact for price
View Datasheet →XC3S50A-4TQG144I
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-4TQG144I Maximum Ratings & Electrical Characteristics
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Configurable Logic Blocks | 192 CLBs |
| User I/Os | 97 I/Os |
| Total Block RAM | 73,728 bits |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Core Voltage Range | 1.14 V to 1.26 V |
| Performance Grade | -4 speed grade |
| Package Type | 144-TQFP |
| Package Dimensions | 20 mm x 20 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C to +100°C |
| Temperature Classification | Industrial-grade |
| Lead-Free Status | Lead Free |
| RoHS Status | unknown |
| REACH Status | unknown |
XC3S50-4TQG144I 20 mm x 20 mm Pin Configuration Guide
Pin configuration for XC3S50-4TQG144I (20 mm x 20 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-4TQG144I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-4TQG144I is suitable for 6 applications: Industrial Control Logic, Communications Protocol Bridging, Data Acquisition and Signal Conditioning, Embedded Control and Sensor Hub, Test and Measurement Equipment, Low-Voltage Digital Interface Consolidation.
Industrial Control Logic
The XC3S50-4TQG144I fits industrial control logic that needs configurable parallel processing, local memory, and a reported -40°C to +100°C operating range. Its 1,728 logic cells and 192 CLBs can implement sequencing, state machines, interlocks, counters, and interface conditioning, while 73,728 bits of block RAM can support data buffering or FIFO-style movement. The 144-pin TQFP also provides 97 user I/Os for sensors, actuators, and industrial peripherals. Compared with fixed glue-logic designs, the FPGA permits functional changes without a PCB respin. Before using it in machinery, verify isolation, surge protection, grounding, and the exact I/O standards required by the factory environment.
Recommended
Communications Protocol Bridging
The XC3S50-4TQG144I is suitable for communications protocol bridging because programmable logic can translate parallel, serial, and packet-oriented interfaces in one device. Its 97 user I/Os provide connections to transceivers and memories, while 73,728 bits of block RAM can hold FIFO buffers, frame data, and status queues. The 90 nm Spartan-3 implementation supports parallel data paths without requiring a dedicated microcontroller for every interface conversion. A practical design should account for transceiver I/O voltage, clock timing, protocol latency, and error handling. Use the -4 speed grade as a timing input when constraining clock domains, and verify all external interface levels against the exact device documentation.
Recommended
Data Acquisition and Signal Conditioning
The XC3S50-4TQG144I can support compact data-acquisition and signal-conditioning systems by combining parallel acquisition logic, control sequencing, and local buffering in one FPGA. The 1,728 logic cells provide implementation space for timing, filtering, digital conversion assistance, and channel control, while 73,728 bits of block RAM can buffer samples between acquisition and processing stages. With 97 user I/Os, the device can connect external data converters, sensors, and interface logic. The main trade-off is that an FPGA does not replace analog front-end design: engineers must still plan amplifier gain, anti-alias filtering, input protection, grounding, and appropriate logic voltage levels before routing the FPGA inputs.
Recommended
Embedded Control and Sensor Hub
The XC3S50-4TQG144I can act as a reconfigurable sensor hub or embedded control engine when a system must coordinate multiple sensors, digital filters, and actuator outputs. Programmable logic can handle acquisition timing, threshold decisions, event routing, and communication formatting, while block RAM provides local buffering for bursty sensor data. Its 50,000-gate-class fabric is appropriate for moderate parallel workloads rather than processor-heavy applications, so designers should partition tasks carefully between the FPGA and any companion microcontroller. A robust implementation requires defined startup behavior, watchdogs or health monitoring, deterministic reset handling, and careful separation of noisy analog or power domains from the 1.2 V core supply.
Recommended
Test and Measurement Equipment
The XC3S50-4TQG144I is well matched to programmable test equipment because its logic fabric can execute parallel patterns, timing controls, and data-capture functions while 73,728 bits of block RAM support sample storage. The 97 user I/Os permit connection to sensors, programmable logic blocks, and other test resources. Compared with a fixed instrument controller, the FPGA approach allows measurement algorithms and sequencing logic to be updated in the bitstream. Engineers should account for analog calibration, input bandwidth, clock jitter, output settling, and trigger timing. Because the supplied data does not include the complete pin table, every assigned instrument signal must be checked against the official TQG144 package documentation before layout.
Recommended
Low-Voltage Digital Interface Consolidation
The XC3S50-4TQG144I can consolidate several low-voltage digital interfaces when a design needs programmable behavior and reduced component count. The 1.2 V nominal core and 1.14 V to 1.26 V core range support a compact digital architecture, while 97 user I/Os expose substantial connectivity for logic-level peripherals. The 1,728 logic cells can implement parallel-to-serial conversion, protocol checks, timers, and glue logic around a central controller. The main benefit is flexibility; the main limitation is that every external interface still needs exact voltage, timing, and drive-strength verification. Designers should use the package pin table to separate clock-capable, configuration, and general-purpose I/O assignments correctly.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-4TQG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S50-4TQ144I | XC3S50A-4TQG144I |
|---|---|---|---|
| Brand | AMD | AMD | AMD |
| Package | 144-TQFP | 144-TQFP | 144-LQFP |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3A |
| System Gates | 50,000 gates | 50,000 gates | 55,296 gates |
| Logic Cells | 1,728 cells | 1,728 cells | 1,584 cells |
| User I/Os | 97 I/Os | 97 I/Os | 108 I/Os |
| Block RAM | 73,728 bits | 73,728 bits | 87,552 bits |
| Speed Grade | -4 | -4 | -4 |
Key Differentiators
- Direct Spartan-3 family match (vs XC3S50A-4TQG144I)
- Same-package verification candidate (vs XC3S50-4TQ144I)
- Industrial-oriented temperature class (vs XC3S50-4TQ144I)
Design Notes
Design the power tree around the documented 1.14 V to 1.26 V core range and nominal 1.2 V operating point. Place the required core and I/O bypass capacitors close to their associated supply pins, keep the 1.2 V core return path compact, and avoid sharing high-current return paths with sensitive logic. The supplied data does not include capacitor values, current limits, sequencing requirements, or exposed-pad details, so those items must be taken from the exact XC3S50 datasheet before schematic release.
Route configuration, clock, and user interfaces deliberately on a 144-pin TQFP layout. Keep sensitive clock and configuration nets away from noisy switching nodes, provide a low-impedance ground plane, and route external interfaces according to the signal-integrity requirements of the connected device. Because the verified public results do not expose a complete pin map, do not infer pin assignments from the MPN; cross-check every connection against the official TQG144 package drawing and pin table.
Do not treat the XC3S50A-4TQG144I as automatically interchangeable with the XC3S50-4TQG144I simply because both use a 144-pin package. The supplied data shows different family resources: Spartan-3A has 55,296 gates and 1,584 cells compared with Spartan-3's 50,000 gates and 1,728 cells, and its I/O and RAM counts also differ. Validate configuration support, pin assignments, electrical limits, bitstream compatibility, and software-device targeting before any substitution.
Establish clock topology and timing constraints early because the XC3S50-4TQG144I belongs to the -4 speed grade. Use short returns, dedicated clock routing where supported, and jitter-tolerant external clock sources. For interfaces implemented in the fabric, define crossing domains, account for IOB and routing delays, and avoid treating general-purpose I/O as interchangeable with dedicated clock-capable pins. The supplied data does not identify package pin roles, so final clock assignment must use the official package information.
Compliance Information
The verified package data identifies the XC3S50-4TQG144I as lead free. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly stated in the supplied data and therefore remain unknown. AEC-Q100 is not applicable because the verified device is a Spartan-3 FPGA rather than an identified automotive-qualified AEC-Q100 product.
