FPGA & CPLD
Produtos (6666)
EP3SL340F1760C2 - Stratix III L FPGA 337K LE | Intel | 1760-BGA
The Intel (formerly Altera) EP3SL340F1760C2 is a high-density Stratix III L-series Field Programmable Gate Array (FPGA) featuring 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/Os, housed in a 1760-ball FineLine BGA (FCBGA) package. This device targets high-throughput DSP, communications infrastructure, and ASIC prototyping designs that demand maximum logic density and rich memory/serDes resources. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as block RAM, DSP slices, transceivers, and PLLs. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital logic hierarchy. Unlike fixed-function ASICs, FPGAs are reconfigured at runtime via SRAM-based configuration cells, enabling iterative design, in-system updates, and hardware acceleration for compute-bound workloads. Key features of the EP3SL340F1760C2 include 13,500 LABs (Logic Array Blocks), 1120 general-purpose I/Os, embedded Multipliers and DSP blocks for high-performance arithmetic, dedicated memory controllers, and high-speed serial transceivers. The 1760-ball FCBGA package uses Altera's FineLine BGA technology to deliver 1,120 user I/Os at a 1.0 mm ball pitch, supporting large pin-count designs that would otherwise require multi-chip partitioning. The Stratix III architecture combines a 40 nm process node with Altera's adaptive logic module (ALM) structure, doubling register density per LAB versus prior generations. Programmable Power Technology allows unused logic and routing to be powered down, reducing static power by up to 50% compared to fixed-power predecessors. Embedded PCI Express hard IP blocks and up to 48 transceivers running at 6.375 Gbps make the part suitable for high-bandwidth backplane and line-card applications. Typical applications include 40G/100G optical transport line cards, LTE baseband processing, radar and electronic warfare DSP pipelines, high-performance ASIC prototyping, and high-channel-count test and measurement instrumentation. The combination of large memory (18.8 Mbits), abundant DSP blocks, and high I/O count positions this part for designs that previously required multiple mid-range FPGAs. When designing with the EP3SL340F1760C2, careful attention must be paid to PCB layout for the FCBGA-1760 package: 1.0 mm ball pitch requires microvia stack-up, controlled-impedance routing for transceiver channels, and substantial power-plane coverage for the multi-rail core (0.9V/1.1V/1.5V/2.5V/3.3V). Designers should also budget configuration memory and select appropriate configuration schemes (e.g., fast passive parallel, JTAG) per design security and boot time requirements. This page synthesizes distributor pricing, drop-in alternatives drawn from the Stratix III/IV family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL340F1760C3 - Stratix III L FPGA, 337500 Cells, 1760-FBGA | Intel
The Intel (formerly Altera) EP3SL340F1760C3 is a high-density, low-power member of the Stratix III L FPGA family, integrating 337,500 logic elements, 18,822,144 bits of embedded memory, and 1120 user I/O in a 1760-ball FC-FBGA package. Built on a 65 nm CMOS process with a 1.1 V core voltage, the device supports logic speeds up to 717 MHz and is intended for high-throughput, logic-rich designs in communications, DSP, and signal-processing subsystems. The part ships in the commercial temperature grade (-C speed grade 3), making it suitable for prototype builds and non-extended-temperature deployments. A field-programmable gate array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon after fabrication. FPGAs sit above fixed-function ASICs in design flexibility and below microprocessors in programmability granularity, occupying a unique role in parallel processing pipelines. Within the Stratix III L sub-family, the 'L' suffix denotes the lower-static-power variant, optimized for power-sensitive applications while preserving the high-performance adaptive logic module (ALM) fabric. Stratix III devices support transceiver rates up to 6.375 Gbps, embedded transceivers, and hard IP for PCI Express Gen1/Gen2, depending on the die variant. Key features include 337,500 logic elements, 18,822,144 RAM bits distributed across TriMatrix memory blocks, 1120 general-purpose I/O, integrated DSP blocks with up to 224 GMACs of throughput, and a high-speed serial interface supporting multi-gigabit transceivers. The 1760-pin FC-FBGA package provides ample signal headroom for parallel buses and memory interfaces common in image processing and telecom line-card designs. Industrial design tools such as Intel Quartus Prime provide synthesis, place-and-route, and timing closure for the device, with pre-verified IP cores available for DDR2/DDR3 memory controllers, PCIe, and Ethernet MACs. Architecturally, the EP3SL340F1760C3 employs a logic-array block (LAB) structure composed of adaptive logic modules (ALMs) with eight inputs and dedicated carry chains for arithmetic operations. The 65 nm process node balances leakage and dynamic power, while the 'L' designation specifically targets reduced static power consumption. The device integrates PLLs, high-speed serial interface channels, and dedicated hardware multipliers for DSP, simplifying complex SoC designs and reducing external component count. Typical applications include high-speed image processing, telecom line cards, military and aerospace signal processing, ASIC prototyping, and high-performance DSP compute engines. The combination of 337,500 logic elements and 1120 I/O suits designs requiring many parallel interfaces. When designing with this FPGA, ensure proper power-rail sequencing and adequate decoupling per Quartus Prime power-supply design guidelines. The large FC-FBGA package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length traces for DDR memory interfaces.
EP3SL340F1760C3N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760C3N is a high-density, low-power Stratix III L Field-Programmable Gate Array (FPGA) housed in a 1760-ball FineLine Ball-Grid Array (FBGA, FCBGA) package. It integrates 337,500 logic elements (LEs), 18,822,144 bits of embedded memory, and 1120 user I/Os, making it one of the highest-capacity members of the Stratix III L family aimed at throughput-intensive DSP, high-speed serial I/O, and parallel data-processing designs. The die is fabricated on a 65 nm TSMC process and operates from a 1.1 V core supply, with industrial-tolerance 0C to +85C junction temperature grading. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that lets designers implement arbitrary digital circuits - from simple glue logic to full processors, DSP pipelines, and high-speed protocol bridges - in silicon via a hardware description language such as Verilog or VHDL. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> field-programmable gate array (FPGA) -> semiconductor. Stratix III L specifically targets the power-optimized branch of the Stratix III family, trading some maximum frequency for substantially lower static and dynamic power versus the standard Stratix III E parts. Key features include up to 500 MHz core fabric operation, dedicated DSP blocks capable of delivering hundreds of GMACs of multiply-accumulate throughput, embedded memory organized in M9K/M144K blocks, multiple PLLs, and high-speed transceivers supporting multi-gigabit serial protocols. The 1760-BGA package exposes 1120 general-purpose user I/Os plus dedicated configuration, clock, and transceiver pins, enabling dense board designs without external bus-multiplexing logic. Typical applications include high-definition video broadcast, medical imaging systems, military signal intelligence, high-frequency trading accelerator cards, and high-port-count network switching. The combination of dense logic, large on-die memory, and 65 nm low-power silicon makes this part suitable for systems that need Stratix-class DSP horsepower with tighter thermal envelopes than the higher-bin Stratix V or Arria 10 families. When designing with the EP3SL340F1760C3N, verify the FBGA ball pattern against your PCB footprint - the 1760-ball package is unique to this device family. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation; legacy designs may also use the older Quartus subscription. Provide at least eight PCB decoupling capacitors around the device and follow Intel's Stratix III L Hardware Reference Manual for power-sequencing requirements. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond the manufacturer datasheet, giving engineers a one-stop reference for selecting, sourcing, and laying out the EP3SL340F1760C3N.
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
The Intel EP3SL340F1760C4 is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/Os in a 1760-ball Flip-Chip BGA (FC-FBGA) package. Manufactured on a 65 nm TSMC process node with a 1.1 V core supply, the device is rated for commercial temperature operation and operates up to 450 MHz core frequency per published device-handbook specifications. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device that sits in the broader semiconductor hierarchy between fixed-function ASICs and software-driven processors. It is composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceiver tiles, allowing hardware designers to implement arbitrary parallel logic, signal-processing pipelines, and interface protocols. FPGAs occupy a distinct design niche where time-to-market, post-silicon flexibility, or parallel throughput outweigh the per-unit cost advantage of an ASIC. Key features of the EP3SL340F1760C4 include 337,500 logic elements, 18,822,144 embedded memory bits distributed across M9K and M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and 1,120 user I/O pins supporting a wide range of single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also integrates PCI Express hard IP, multi-gigabit transceivers on selected variants, and on-chip termination (OCT) that simplifies board-level design. Architecturally, the Stratix III L family combines a logic fabric with column- and row-based memory and DSP blocks, an Adaptive Logic Module (ALM) that doubles effective logic capacity versus prior generations, and partial reconfiguration support for in-system logic changes. The 1760-ball FC-FBGA package provides a 42.5 x 42.5 mm land pattern that supports the high-I/O count required by parallel memory buses and multi-channel high-speed serial links. Typical applications include high-performance digital signal processing (radar, medical imaging, software-defined radio), ASIC prototyping and emulation, high-speed packet processing in networking line cards, video broadcast and image-processing pipelines, and test-and-measurement instrumentation. The device's high logic density and embedded transceiver bandwidth make it suitable as a verification platform for large SoC designs before tape-out. When designing with this device, allocate sufficient PCB layers (typically 12 or more) for the FC-FBGA break-out and for controlled-impedance routing of the high-speed serial links. Thermal management must account for the 1.1 V core at multi-ampere operating currents; follow the Stratix III Device Handbook power-supply decoupling recommendations. Designers should also verify Quartus II software support for the C4 speed grade in their chosen Quartus release. This page synthesizes distributor pricing, vertical-migration alternatives within the Stratix III family, and design notes not found in the standalone datasheet, providing a practical reference for engineers comparing the EP3SL340F1760C4 against both Stratix III siblings and Stratix IV successor devices.
EP3SL340F1760C4L - Stratix III L FPGA 337.5K LE 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760C4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 1760-ball FC-FBGA package. It integrates 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/O pins, making it suitable for high-throughput digital designs, ASIC prototyping, and DSP-intensive systems. The device is fabricated on a 65 nm process and operates from a 0.9 V core supply, delivering performance up to 375 MHz while reducing static and dynamic power versus earlier Stratix generations. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, interconnect, I/O, and dedicated silicon such as transceivers, memory blocks, and DSP blocks. Stratix III L belongs to the Stratix III FPGA family, which itself sits within Intel's broader programmable logic hierarchy (FPGA -> programmable logic -> semiconductor). The 'L' sub-family emphasizes lower static power through programmable power technology, allowing unused logic to enter a low-leakage state. The C4 speed grade and commercial temperature grade (C suffix, L suffix here denotes Pb-free) are encoded directly in the part number, while the 1760-ball FCBGA (also called BBGA) package supports high I/O counts required by parallel buses and multiple transceiver channels. Key features of the EP3SL340F1760C4L include up to 337,500 logic elements, 18,822,144 bits of embedded SRAM, integrated DSP blocks for high-performance fixed- and floating-point arithmetic, dedicated high-speed transceivers, and a programmable power technology that reduces static power without sacrificing performance. The high pin count (1,120 user I/Os) supports wide external memory interfaces such as DDR2/DDR3 and QDR II/II+. These features collectively target high-bandwidth applications including telecommunications, military radar, medical imaging, and ASIC emulation. Technically, the device uses a 65 nm process node with copper interconnect and a 1.0 V/0.9 V dual-voltage core, where the lower VCC minimizes active power while preserving timing margin. Embedded memory is organized in M512, M4K, and M-RAM blocks to balance density and access speed. The FPGA fabric also includes dedicated multiplier and accumulator blocks for DSP, and a clock management subsystem with PLLs for frequency synthesis and skew control. Typical applications include high-end communications infrastructure, military signal processing, ASIC prototyping, broadcast video processing, and high-performance computing accelerators. The combination of high logic density and low static power also makes it attractive for portable or thermally constrained designs. When designing with this FPGA, verify the PCB footprint against the 1760-ball FC-FBGA land pattern, ensure the Quartus II design software supports the device, and provision adequate decoupling and thermal dissipation for sustained operation. Designers should also confirm configuration memory selection (e.g., EPCS or enhanced flash) and plan JTAG or AS configuration chains early in the design cycle. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone, helping engineers evaluate the part for both new designs and legacy system maintenance.
EP3SL340F1760C4LN - 340K LE Stratix III L FPGA, 1760-BGA | Intel
The Intel EP3SL340F1760C4LN is a high-density, low-power member of the Stratix III L FPGA family, providing 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/O in a 1760-ball flip-chip BGA package. Built on a 65 nm process with 0.9 V core voltage, it targets high-performance DSP, telecommunications, and signal-processing designs where power efficiency and logic density are both critical. The device supports up to 375 MHz core operation and integrates 13500 LABs (Logic Array Blocks) along with 1120 I/O pins organized into multiple I/O banks for flexible voltage and protocol assignment. What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacture. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic -> digital IC -> integrated circuit. The Stratix III L family is a low-power variant of the Stratix III family, optimized for static and dynamic power reduction compared to the standard Stratix III while retaining the same high-end feature set for DSP and memory-intensive workloads. Key differentiating features of the EP3SL340F1760C4LN include 1120 user I/O on a 1760-ball FC-FBGA package, 1120 maximum user I/O count, 18822144 embedded memory bits, and integrated DSP blocks optimized for high-throughput arithmetic pipelines. The C4 speed grade and L power suffix denote the lowest static-power variant of the speed bin, ideal for thermally constrained enclosures. The N suffix confirms lead-free / RoHS-compliant terminal finish. The Stratix III L architecture combines ALMs (Adaptive Logic Modules) arranged in LABs, M20K memory blocks, and variable-precision DSP blocks with 9-bit, 18-bit, and 36-bit operand support, enabling high-performance FFT, FIR, and matrix operations. Partial reconfiguration, dedicated clock networks with PLL support, and up to 12 transceiver channels (depending on variant) make the device suitable for high-speed serial protocols. Typical applications include high-end ASIC prototyping, software-defined radio baseband processing, high-definition video broadcast and image-processing pipelines, military radar and electronic-warfare systems, and telecom line-card packet processing. The wide memory and DSP bandwidth also make the EP3SL340F1760C4LN a common choice for medical imaging accelerators such as CT and MRI reconstruction engines. Designers should note that the 1760-ball FC-FBGA package demands careful PCB stack-up, microvia fabrication, and matched-length routing to preserve signal integrity across the 1120 user I/O. Thermal analysis must include both static and dynamic power, and the 1760-ball package's thermal performance depends heavily on PCB copper area and airflow within the chassis. Quartus II is the supported development environment, and a license is recommended for the full timing closure and signal-integrity flows. This page synthesizes distributor pricing, packaging variants, and design notes not found in a single manufacturer datasheet, and links to equivalent Stratix III L device MPNs for designers facing obsolescence or lead-time pressure.
EP3SL340F1760C4N - 340K LE Stratix III L FPGA | Intel | 1120 I/O
The Intel (formerly Altera) EP3SL340F1760C4N is a high-density Stratix III L family Field Programmable Gate Array (FPGA) featuring 337,500 logic elements, 18,822,144 bits of embedded memory, and 1120 user I/Os in a 1760-ball Flip-Chip BGA (FC-FBGA) package. Fabricated on a 65 nm process with a 1.1 V core supply, it delivers logic capacity suited for ASIC prototyping, high-throughput DSP, and high-bandwidth serial interface aggregation. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be reconfigured by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism and deterministic latency. The Stratix III L family specifically targets logic-rich, memory-intensive applications with a low-power variant of the Stratix III architecture, balancing per-element static power against raw logic density. Key features of the EP3SL340F1760C4N include 13,500 Logic Array Blocks (LABs) organized around 337,500 logic elements, 1,125 embedded 18x18 multipliers for DSP operations, and multi-gigabit transceivers supporting protocols up to 6.5 Gbps depending on speed grade. The device integrates 1120 general-purpose user I/Os plus high-speed serial I/O and external memory interface logic. Configuration is handled via the standard Stratix III configuration scheme, supporting JTAG, passive serial, fast passive parallel, and Active Serial configuration from an external flash. Typical applications for this Stratix III L variant include ASIC and ASSP prototyping, high-definition video processing, telecom line-card aggregation, high-throughput signal processing, and test & measurement instrumentation. The 1760-ball FC-FBGA package supports the dense I/O and high-performance signal-integrity requirements of these applications, while the 65 nm process node keeps dynamic dissipation manageable in well-designed thermal envelopes. The 'N' suffix indicates lead-free / Pb-free termination per JEDEC J-STD-609 marking conventions. When designing with the EP3SL340F1760C4N, plan thermal management using the published theta-JA for the 1760-ball FC-FBGA package - expect active cooling at high toggle rates. Use Intel Quartus II (legacy) or Quartus Prime design software for synthesis, place-and-route, and timing closure; legacy device support is provided in modern Quartus versions through the Cyclone/Stratix legacy support flow. Confirm long-term availability with Intel PSG before committing to new designs, as Stratix III is in mature lifecycle status. This page synthesizes distributor pricing, verified drop-in alternatives from the Stratix III L family, and practical design notes that complement the official Intel datasheet. Engineers evaluating the EP3SL340F1760C4N should review the supply chain, lead times, and lifecycle status as of 2026-09-09.
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760I3 is a high-density, low-power member of the Stratix III L FPGA family, delivering 337,500 logic elements (LEs) in a 1760-ball FC-BGA package. Manufactured on a 65 nm process and operating from a 1.1 V core supply, this device integrates 18,822,144 bits of embedded memory, 1120 user I/Os, and 13500 LABs (Logic Array Blocks). The 'F1760' suffix denotes the 1760-ball FineLine BGA package, while the 'I3' suffix denotes the industrial speed/temperature grade (commercial I-temp variant), targeting mission-critical embedded designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing via a configuration bitstream. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors, offering hardware-timed parallelism with no instruction-fetch overhead. Within Intel's portfolio, Stratix III L occupies the high-performance, low-power segment, succeeding the Stratix II generation and superseded in time by Stratix IV/Stratix V. The 'L' (low-power) variant reduces dynamic power by approximately 50 percent compared with the standard Stratix III family through selective usage of programmable power technology on each LAB. Key features include 24 transceivers (where populated), high-speed DSP blocks for fixed- and floating-point arithmetic, hard memory controllers for DDR/DDR2/DDR3, and rich clock-management PLL resources. The industrial temperature grade supports operation from -40 °C to 100 °C junction, while the 1760-ball BGA package enables dense I/O allocation for parallel memory buses, multi-gigabit serial links, and processor interface fan-out. The Stratix III L family is widely deployed in high-performance DSP, ASIC prototyping, and communications infrastructure. Typical applications include high-end digital signal processing for radar and beamforming, software-defined radio (SDR) baseband, ASIC prototyping and emulation, high-speed networking line cards, medical imaging accelerators, and high-resolution video broadcast equipment. The combination of high logic density, abundant block RAM, and integrated transceivers makes the EP3SL340F1760I3 well suited to designs previously implemented as multi-FPGA partitions. When designing with this device, attention must be paid to power-rail sequencing (1.1 V core, 2.5 V/3.0 V aux, 1.5 V/1.8 V I/O), thermal management via the exposed-die BGA substrate, and PCB stack-up for impedance-controlled transceiver channels. Use the Quartus II (or later) design toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, Stratix III L same-package drop-in alternatives from the Site MPN list, and practical design notes not consolidated in the manufacturer datasheet.
EP3SL340F1760I3N - Stratix III L FPGA, 337.5K LEs, 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760I3N is a high-density, low-power member of the Stratix III L FPGA family, integrating 337,500 logic elements in a 1760-ball Flip-Chip BGA (FC-FBGA) package and fabricated on a 65 nm process node. The device operates at a core voltage of 1.1 V and supports user I/O counts up to 1120, with up to 18,822,144 bits of embedded memory and 13,500 logic array blocks (LABs) per the manufacturer ordering information. Per DigiKey catalog data the device is qualified for industrial temperature operation and ships in lead-free packaging. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, routing interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. Within Intel's portfolio, the Stratix III L family sits in the high-density, low-power segment, designed for applications that require very large gate counts but where dynamic power must be minimized. The L variant extends the Stratix III architecture with programmable power technology that lets unused regions be powered down at fine granularity, lowering both static and dynamic consumption compared with the standard Stratix III family. Key features of the EP3SL340F1760I3N include 337,500 logic elements, 18,822,144 embedded memory bits, support for up to 1120 general-purpose I/O pins arranged across multiple I/O banks, and integrated DSP blocks for high-throughput signal processing. The 1760-ball FCBGA package exposes the full user-I/O and high-speed serial interface count and is suited to backplane-style boards where signal integrity and density are critical. Configuration is via standard JTAG, serial, or parallel modes and the device supports the Altera/Intel Quartus II design flow. Architecturally, the device uses 65 nm CMOS with hard IP for memory, DSP, and transceiver blocks; this hybrid fabric delivers deterministic performance for parallel DSP pipelines while keeping logic utilization flexible. Compared with previous-generation Stratix II parts, Stratix III L improves logic density, reduces dynamic power by roughly 50 percent at the same performance, and adds the programmable-power capability for fine-grained power gating. Typical applications include high-performance digital signal processing in radar and software-defined radio, ASIC prototyping, high-speed protocol bridging such as PCIe Gen2 and Serial RapidIO, industrial imaging and video processing, and military/aerospace signal processing where the device's large logic and memory budget is required. The 1760-BGA package is the largest in the Stratix III L family and is selected when the design needs the maximum I/O and transceiver count. When designing with this part, ensure the PCB BGA layout supports the 1 mm ball pitch, that all power rails (VCC, VCCPD, VCCIO per bank) are properly decoupled, and that thermal management accounts for the device's possible high power dissipation under heavy utilization. Quartus II software with the appropriate device license is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL340F1760I4 - 337500 Cells, 1120 I/O Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL340F1760I4 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/O pins in a 1760-ball FC-FBGA package. Built on a TSMC 65 nm process, the device operates from a 1.1 V core supply with performance up to 450 MHz, targeting high-bandwidth digital signal processing, telecommunications infrastructure, and high-performance ASIC prototyping. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of digital semiconductors. Stratix III devices use a logic-rich architecture combined with dedicated DSP blocks, embedded memory, and high-speed transceivers, making them a top-tier member of the programmable logic family tree: PLD -> CPLD/FPGA -> SRAM-based FPGA -> Stratix III L family. Key features include up to 13,500 Logic Array Blocks (LABs), 1120 general-purpose I/Os, integrated PLL and IOE resources, support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and a rich DSP block population suitable for high-throughput FIR filters and FFT engines. The 'I' speed grade and '4' core voltage/temperature tier designate an industrial-temperature operation with an enhanced core voltage. The Stratix III L architecture pairs a programmable logic fabric with hard memory blocks (M144K/M9K), dedicated 18x18 multipliers, and an extensive global clock network. The 1760-ball FC-FBGA package supports high-speed differential I/O and serial transceivers operating up to several Gbps, which is essential for wireline and wireless baseband designs. The device is configured via SRAM cells, allowing in-field reconfiguration. Typical applications include wireless baseband and RF card signal processing, high-end image processing pipelines, ASIC prototyping and emulation, high-speed network switches and routers, and military/aerospace DSP subsystems. The 1,120 user I/Os and ~18.8 Mbit embedded memory make it especially well-suited to designs that have outgrown mid-density FPGAs but do not yet need the largest Stratix V/10 parts. Designers should plan PCB layout with extensive decoupling (typically 0402/0201 ceramics distributed across the BGA footprint), a minimum of 6 to 8 PCB layers for power/signal integrity, and thermal vias under the exposed die region of the FC-FBGA. Always use Intel's Quartus II design software (Stratix III device support) to verify pin assignments and timing closure before tape-out. This page consolidates distributor pricing, parametric drop-in alternatives, and practical design guidance not available from a single datasheet - complementing the official Intel Stratix III device handbook.
EP3SL340F1760I4L - Stratix III L 337.5K LE FPGA | Intel | 1760-BGA
The Intel EP3SL340F1760I4L is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix III L family, fabricated on a TSMC 65nm process. The device integrates 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/O pins into a 1760-ball FineLine BGA (FCBGA) package. It is designed for high-performance digital signal processing, high-speed serial connectivity, and memory-intensive system-on-chip designs where power efficiency is critical. An FPGA (Field Programmable Gate Array) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. Within the broader semiconductor taxonomy, FPGAs sit between ASICs (custom silicon with highest performance and NRE) and general-purpose processors (software-defined but lower performance-per-watt). Stratix III L devices specifically target applications requiring high logic density and high-speed serial I/O at lower static power than the standard Stratix III family. Key differentiating features include up to 24 multi-gigabit transceivers supporting data rates up to 6.375 Gbps, adaptive logic modules (ALMs) delivering up to 1.2 GHz performance, and partial reconfiguration support for in-system logic updates. The L variant reduces static power by approximately 50% compared to the standard Stratix III family, while maintaining the same logic, memory, and transceiver resources. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, HSTL, and high-speed serial protocols. The EP3SL340F1760I4L is built on Altera's adaptive logic module architecture with 9-bit look-up tables and integrated carry chains, paired with dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic. The 18.8 Mbit embedded memory is organized as M9K and M144K blocks optimized for buffering and FIFO applications. Transceivers support PCIe Gen1/Gen2, XAUI, Serial RapidIO, and custom serial protocols via the PCS and PMA blocks. Typical applications include high-speed packet processing in telecom line cards, radar and electronic warfare DSP front-ends, ASIC prototyping, high-performance computing accelerators, broadcast video processing, and medical imaging systems. The 1120 I/O count and high logic density make it suitable for replacing multiple ASSPs with a single flexible device. When designing with this device, ensure proper power-rail sequencing of the core (0.9V) and I/O supplies (1.2V to 3.3V depending on bank voltage) using a multi-rail controller such as the LTM4676 or ISL8201M. Thermal dissipation can exceed 25W in typical configurations, requiring a heatsink or forced-air cooling given the FCBGA package's thermal resistance. PCB design requires high-density BGA routing with microvia or HDI stackup to escape the 1760 balls.
EP3SL340F1760I4LN - 337500-Cell Stratix III L FPGA, FCBGA-1760
The Intel (Altera) EP3SL340F1760I4LN is a high-density, low-power Stratix III L Field-Programmable Gate Array (FPGA) delivering 337,500 logic elements in a 1760-ball Flip-Chip BGA package. It operates at a core voltage of 0.9 V on a 65 nm CMOS process, with a maximum operating frequency of 375 MHz and I/O count of 1120 user pins. The device is qualified to the industrial temperature range and ships in a 1760-BBGA FC-FBGA package with lead-free finish. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, memory, and hardened IP blocks that can be re-programmed to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy below application-specific standard products (ASSPs) and above discrete logic ICs, and they are widely used for high-throughput parallel processing, hardware acceleration, and rapid prototyping. The Stratix III family specifically targets high-performance DSP, memory-rich, and transceiver-based designs. Key features include 337,500 logic elements, 13,500 Logic Array Blocks (LABs), 18,822,144 bits of embedded memory, 1120 user I/O pins, and an integrated Adaptive Logic Module (ALM) architecture. The "L" designation indicates the lower-power variant of Stratix III with reduced static power versus the base EP3S family. The package exposes a flip-chip BGA land pattern with 1760 balls across the substrate, requiring careful PCB design with controlled-impedance routing and BGA breakout fan-out. Architecturally, the EP3SL340F1760I4LN combines 9-input fracturable ALMs with M9K/M144K memory blocks, variable-precision DSP blocks (up to 18x18 multipliers), and PLL-based clock management. The high logic and memory ratio makes it particularly suited to memory-mapped processing pipelines and large buffer-based DSP functions, where on-chip storage reduces external memory bandwidth bottlenecks. Typical applications include high-end telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcast infrastructure, ASIC prototyping, and high-throughput image processing. The combination of 18 Mbits of embedded memory and 1120 I/O pins allows direct interfacing with DDR2/DDR3 SDRAM, QDRII SRAM, and parallel ADC/DAC devices commonly used in these designs. When designing with this part, ensure the PCB uses microvia stack-ups compatible with 1.0 mm pitch BGA escape routing, and provide sufficient decoupling per Altera's Stratix III pin connection guidelines. The I4LN suffix indicates the industrial temperature grade (-40C to +100C), 1760-ball FCBGA package, and lead-free / Pb-free finish compliant with modern environmental directives. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalogue, and practical design notes not found in the manufacturer datasheet alone.
EP3SL340F1760I4N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760I4N is a high-density, high-performance Stratix III L Field Programmable Gate Array (FPGA) featuring 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/Os in a 1760-ball FC-BGA package. Built on a 65nm process with a 1.1V core supply, the device delivers up to 717 MHz core performance and integrates up to 13,500 LABs (Logic Array Blocks), making it one of the highest-density members of the Stratix III family. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital semiconductor hierarchy. Within the power-management and embedded systems ecosystem, FPGAs serve as flexible glue logic, co-processors, and signal-processing engines, bridging hard ASICs and general-purpose CPUs/SoCs. The Stratix III L family specifically targets low-power, high-density designs including high-end DSP, ASIC prototyping, and high-throughput data-pipeline applications. Key features of the EP3SL340F1760I4N include 1120 user I/Os (the highest pin-count member), 13,500 LABs, 18.8 Mbits embedded RAM, integrated transceiver capability through the Stratix III architecture, and built-in PLL and DLL blocks for clock management. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL, with true LVDS support on most pins and up to 24 dedicated clock inputs. The 1760-ball FC-BGA package exposes the full I/O count and supports high-speed serial interfaces via dedicated transceiver channels. The EP3SL340F1760I4N leverages Stratix III programmable power technology, which dynamically adjusts quiescent power on a per-LAB basis depending on switching activity, yielding significant static-power savings versus previous generations. Embedded memory blocks (M144K/M9K) are distributed across the fabric and can be cascaded, while dedicated DSP blocks enable high-throughput fixed- and floating-point arithmetic. Hard PCIe hard IP and external memory controller blocks support DDR/DDR2/DDR3/QDRII+/RLDRAM interfaces directly. Typical applications include ASIC prototyping and emulation, high-performance digital signal processing (radar, baseband, video), high-speed data acquisition and test instrumentation, military/aerospace signal processing, telecom infrastructure (line cards, cross-connects), and high-density glue logic for embedded computing platforms. The 1760-ball FC-BGA package is intended for high-layer-count PCBs with carefully controlled impedance for transceiver and memory interfaces. When designing with this part, ensure a 12-layer minimum stack-up with dedicated ground and power planes for transceiver channels; signal integrity on multi-gigabit serial links depends critically on controlled differential impedance (typically 100 ohm) and matched length pairs. Use the Altera/Intel Quartus II design suite for synthesis, place-and-route, and timing closure; expect longer compile times than smaller FPGAs. This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB-level design considerations specific to the Stratix III L family, delivering engineering context beyond what appears in the manufacturer datasheet.
EP3SL340H1152C2 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
The Intel EP3SL340H1152C2 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 337,500 logic cells, 18,822,144 bits of embedded memory, and 744 user I/O in a 1152-ball Fine-Pitch Ball Grid Array (FBGA) package. Manufactured on a 65 nm CMOS process with a 1.1 V core supply, this device targets high-performance digital signal processing, telecommunications, and high-throughput data-path applications where logic density and memory bandwidth are paramount. It provides up to 13,500 LABs and supports multiple high-speed serial transceiver protocols for backplane and chip-to-chip connectivity. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific integrated circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also include CPLDs and PALs, and they are widely used for prototyping ASICs, accelerating compute-intensive workloads, and implementing custom parallel processing pipelines. The Stratix III family specifically targets designs that need the highest logic density and DSP performance available at low power budgets, with features like high-speed transceivers and rich on-chip memory. Key features of the EP3SL340H1152C2 include 744 user I/O pins supporting a wide range of single-ended and differential I/O standards, up to 18.8 Mbits of embedded RAM organized in M9K and MLAB blocks for flexible buffering and FIFO implementation, dedicated DSP blocks for high-throughput arithmetic operations, and clock management tiles that enable multiple clock domains with low jitter. The 1152-BGA FCBGA package provides a compact footprint relative to its I/O count while offering controlled-impedance signal paths ideal for high-speed memory and transceiver interfaces. Typical applications include high-throughput digital signal processing in software-defined radio (SDR), radar, and beamforming systems; telecommunication infrastructure such as baseband processing and high-speed packet inspection; ASIC prototyping and design verification for networking ASICs and processor emulation; high-performance computing accelerators in data centers and test equipment; video and image processing pipelines requiring wide memory bandwidth; and industrial control and automation systems with real-time deterministic latency requirements. When designing with this FPGA, engineers should pay close attention to the PCB layout for the 1152-ball BGA, ensuring proper decoupling, power-plane integrity, and via-in-pad or microvia construction to maintain signal integrity at high toggle frequencies. Plan a robust power distribution network using multiple voltage rails (core, PLL, I/O banks, transceiver) and follow the manufacturer's recommended power-on sequencing. Thermal management requires sufficient airflow or heatsinking because the device's high logic density produces non-trivial power dissipation under sustained workload. This page synthesizes distributor pricing, parametric context, and design guidance that is not available from the manufacturer datasheet alone, providing a single reference for engineers evaluating the EP3SL340H1152C2 for new designs or replacements.
EP3SL340H1152C2N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C2N is a high-density Stratix III L Field Programmable Gate Array (FPGA) offering 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 18x18 multipliers, housed in a 1152-ball FineLine BGA (FCBGA / HBGA) package with flip-chip construction. Built on a 65 nm CMOS process, it operates from a 0.9 V core / 1.1 V auxiliary supply and supports performance up to 600 MHz fabric speed, targeting high-throughput DSP, telecom, and signal-processing designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed after manufacturing. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, microcontrollers, and DSPs as building blocks of modern digital systems. The Stratix III L family specifically emphasizes low-power, high-logic-density designs with dedicated DSP blocks, embedded TriMatrix memory, and high-speed serial transceivers, occupying the high-end tier of Intel's (formerly Altera's) programmable logic portfolio. Key differentiating features include 337,500 logic elements (LEs) for fine-grained parallel processing, 18,822,144 embedded memory bits for wide data buffering without external SRAM, 744 dedicated hardware multipliers (18x18) for fixed- and floating-point DSP acceleration, and integrated PLLs for multi-domain clock management. The flip-chip 1152-BGA package exposes the full I/O count and high-performance serial interface pins while delivering a low-inductance power distribution network. Architecturally, the EP3SL340H1152C2N combines LUT-based adaptive logic modules (ALMs), TriMatrix memory blocks (MLAB, M9K, M144K), DSP blocks, and clock networks routed across a multi-tier interconnect. The 65 nm process and Stratix III L variant minimize dynamic power via programmable power technology, allowing unused fabric regions to be put into a low-power state without losing state. Compared with discrete processor-plus-DSP solutions, the integrated fabric yields deterministic latency and far higher parallel throughput. Typical applications include high-end telecommunications baseband and backhaul cards, real-time digital signal processing for radar and medical imaging, ASIC prototyping, high-performance computing accelerators, and broadcast video processing. Designers choose this device when the design exceeds the logic, memory, or DSP budget of smaller FPGAs or when deterministic parallel throughput is required. A practical design consideration is power delivery: the 1152-BGA package requires a multi-rail PDN with bulk decoupling at each supply island and high-frequency ceramics under the BGA via field. PCB stack-up should target 1-oz copper inner planes with microvia access to inner pads to meet the simultaneous-switching output (SSO) noise budget. This page synthesizes distributor pricing, drop-in Stratix III L alternatives from the Site MPN catalog, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM selection and PCB reuse across related part numbers.
EP3SL340H1152C3 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
The Intel EP3SL340H1152C3 is a high-density Stratix III L FPGA from Intel's Stratix III family, featuring 337,500 logic elements in a 1152-ball FCBGA (HBGA) package. Built on a 65 nm CMOS process node with a 1.1 V core supply and a 717 MHz core fabric frequency, the EP3SL340H1152C3 delivers high-performance parallel processing for digital signal processing, high-speed serial I/O bridging, and ASIC prototyping. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic is defined after manufacturing by loading a configuration bitstream into on-chip SRAM memory. FPGAs sit in the broader category of programmable logic devices (PLDs), which also includes CPLDs; FPGAs extend this concept to very high logic densities, embedded block RAM, DSP blocks, and multi-gigabit transceivers. Designers choose FPGAs to accelerate parallel algorithms, implement custom interfaces, and reduce PCB area by integrating glue logic and protocol bridges that previously required multiple ASICs. The Stratix III L sub-series is engineered for logic-intensive workloads where routing flexibility and DSP throughput matter more than maximum transceiver count. The EP3SL340H1152C3 supports 744 user I/O pins via the 1152-pin FCBGA package, which exposes the device's full I/O bank count. Embedded block RAM, DSP blocks, and high-speed serial transceivers operate from dedicated power rails and are programmable through Intel's Quartus II design suite. Typical applications include high-speed digital signal processing cards, telecommunications line cards, ASIC prototyping, image processing pipelines, and high-performance computing coprocessors. The 1.1 V core Vcc and separate VccPD, VccPT power domains are supplied through dedicated pins; PCB designers must follow Intel's power decoupling and ground-bonding guidelines. When designing with the EP3SL340H1152C3, ensure the PCB has at least 6 dedicated ground bond-out pins per quadrant to support the package's thermal and signal-integrity requirements. Configuration can be loaded via JTAG, fast passive parallel, or a configuration flash, all of which are documented in the Stratix III handbook. Pricing is on the order of thousands of dollars per unit at low quantities. This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix III L design notes not consolidated in the manufacturer datasheet. Engineers selecting the EP3SL340H1152C3 should also consult Intel's Stratix III Device Handbook for full pinout, timing, and power-supply sequencing guidance.
EP3SL340H1152C3N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152C3N is a high-density, low-power Stratix III L FPGA in a 1152-ball Flip-Chip BGA package, integrating 337,500 logic elements and 744 user I/O pins on a 65 nm process node. The part ships in the commercial speed grade 3 with a 1.1 V core supply, targeting cost-sensitive high-volume applications. Built on Intel's programmable logic technology acquired from Altera, the Stratix III L family is engineered to deliver the lowest power consumption in its performance class while maintaining high logic density and DSP throughput. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits. Stratix III devices in particular occupy the high-performance tier of the FPGA hierarchy, sitting above Cyclone and below Arria/Stratix IV/V families, and are typically deployed in digital signal processing, high-speed serial connectivity, and embedded processing applications. Key differentiating features include the 1152-ball FCBGA package enabling 744 user I/Os (sufficient for parallel memory buses, multiple transceivers, and external processor interfaces), 65 nm process technology with 1.1 V core VCC, and dedicated DSP blocks for fixed- and floating-point arithmetic. The device also integrates embedded memory blocks (M20K/M9K), high-speed transceivers, and PCIe hard IP, distinguishing it from lower-density Cyclone families. The 'L' suffix denotes the low-power variant of Stratix III, optimized for static and dynamic power reduction via programmable power technology. Architecturally, the EP3SL340 uses logic array blocks (LABs) of 16 adaptive logic modules (ALMs) each, a hierarchical routing fabric, and column/row-based I/O structures supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and SSTL. The FPGA is configured via SRAM-based volatile configuration memory, requiring a configuration ROM (EPCS) on the board. Typical applications include telecommunications line cards, video processing infrastructure, high-performance ASIC prototyping, military/aerospace signal processing, test and measurement equipment, and broadcast video encoding. When designing with this FPGA, plan for multi-rail power sequencing (VCC, VCCAUX, VCCPD), thermal management on the FCBGA (which requires a heatsink for full performance), and the configuration controller (typically a MAX II CPLD or an EPCS device). This page synthesizes distributor pricing, drop-in Stratix III/IV alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet.
EP3SL340H1152C4 - 340K LE Stratix III FPGA, 1152-BGA | Intel
The Intel EP3SL340H1152C4 is a high-density Stratix III FPGA featuring 337,500 logic elements, 13,500 LABs, 744 user I/Os, and 1,152 pins in a flip-chip BGA package, manufactured on a 65 nm process node with 1.1 V core voltage. It belongs to the Stratix III L family targeting high-performance, low-power ASIC prototyping, signal processing, and high-bandwidth data-path applications. The 744 user I/Os are split across 12 I/O banks supporting a wide range of I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit containing configurable logic blocks, dedicated DSP slices, embedded memory blocks, and programmable interconnect. FPGAs occupy the hierarchy of programmable logic -> logic ICs -> digital integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow designers to implement and re-implement custom digital hardware, making them ideal for prototyping, low-volume production, and applications requiring post-deployment updates such as high-speed networking, video processing, and DSP. Key features of the EP3SL340H1152C4 include 96 transceivers (per Stratix III L family) supporting data rates up to 3.75 Gbps, dedicated hardware multipliers for DSP, embedded 18x18 multipliers, and on-chip M-RAM/RAM blocks. The C4 speed grade indicates a 4-speed-grade timing bin for commercial temperature operation (0C to 85C), and the H1152 package designation identifies the 1152-pin flip-chip BGA form factor with H denoting the high-pin-count variant. The device integrates PLLs, clock networks, and configuration circuitry supporting passive serial, fast passive parallel, and JTAG configuration modes. Architecturally, the Stratix III family introduced the ALM (Adaptive Logic Module) providing 8-input fracturable LUT capability for higher logic density per LE. The 65 nm process and 1.1 V core reduce dynamic power versus prior generations while maintaining performance through programmable power technology that automatically tunes logic speed versus leakage. The 1152-BGA package supplies extensive I/O bandwidth for memory interfaces (DDR3/QDRII+) and parallel high-speed connectivity. Typical applications include ASIC prototyping and emulation, high-end telecommunications line cards, broadcast video processing, military/aerospace signal processing, high-performance computing accelerators, and test-and-measurement instrumentation. Stratix III devices are well-suited for designs requiring high logic density, large memory bandwidth, and integration of high-speed serial interfaces. When designing with the EP3SL340H1152C4, ensure PCB layout supports BGA fan-out with controlled-impedance routing for transceiver channels, multi-layer PCB with dedicated power/ground planes, and thermal management via heatsink or airflow for high-utilization designs. The 65 nm core operating at 1.1 V requires core voltage rails within 3% tolerance; use low-noise LDO or DC-DC regulators for VCCINT and VCCAUX. Configuration memory is volatile, requiring a configuration device (EPCS) or system-level flash for bitstream storage at power-up. This page synthesizes distributor pricing, FPGA family positioning, and Stratix III same-package drop-in alternatives not found in the manufacturer datasheet alone, supporting BOM risk assessment and long-lifecycle procurement decisions.
EP3SL340H1152C4L - 340K LE Stratix III L FPGA, 1152-BGA | Altera
The Altera (Intel) EP3SL340H1152C4L is a high-density Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm low-power process, delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 user I/O pins in a 1152-ball FCBGA (HBGA) package. The device integrates up to 384 embedded 18x18 multipliers and is engineered for high-performance digital signal processing, ASIC prototyping, and high-bandwidth parallel processing designs. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated silicon features such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under Programmable Logic -> Logic ICs -> Integrated Circuits. Stratix III L parts specifically target applications requiring high logic capacity at reduced static power compared to the standard Stratix III family. Key features of the EP3SL340H1152C4L include 337,500 logic elements, 18,822,144 bits of embedded memory (approximately 2,352 Kbit block RAM equivalent), 744 maximum user I/O pins, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports core voltages of 1.1 V and I/O voltages programmable per bank. It is rated for commercial temperature operation (0 to 85 C) and ships in the L-suffix speed grade (lower-power speed bin). Architecturally, the Stratix III L family uses Altera's adaptive logic module (ALM) and 9-Kbit M512/M-RAM blocks. It integrates dedicated hardware multipliers, PLLs, and high-speed transceivers in some variants, with a flexible I/O structure that supports differential signaling up to 1.6 Gbps. The 1152-BGA package exposes the full feature set of the die, including numerous high-speed serial interfaces and external memory controller pins. Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, high-performance computing (HPC) acceleration, military/aerospace signal processing, broadcast video infrastructure, and telecom line cards. The combination of large logic capacity and abundant memory bandwidth makes it suitable for memory-intensive designs such as deep packet inspection and real-time video transcoding. When designing with the EP3SL340H1152C4L, careful attention must be paid to power delivery (multiple VCC and VCCINT rails), high-speed signal integrity for LVDS pairs, and thermal management given the 1152-ball BGA package density. Quartus II (or Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. Designers should consult the Stratix III Device Handbook for full pinout, electrical characteristics, and reference design guidance. This page synthesizes distributor pricing, Stratix III family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet alone, giving engineers a one-stop reference for both new designs and legacy system maintenance.
EP3SL340H1152C4LN - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C4LN is a high-density, low-power Stratix III L family Field-Programmable Gate Array built on a 65 nm process, delivering 337,500 logic elements and 18,822,144 bits of embedded memory in a 1152-pin flip-chip BGA package. It supports up to 744 user I/O pins and integrates 1,350 LABs (Logic Array Blocks) with adaptive logic modules, providing a balance of high logic capacity, abundant block RAM, and DSP blocks for high-throughput signal processing. The device is offered in the C4 speed grade and the commercial operating range, with a core voltage of 0.9 V and I/O voltages configurable per bank to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V LVCMOS/LVTTL standards. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by a user-supplied configuration bitstream, allowing the same silicon to be repurposed across many designs. Within the broader programmable-logic taxonomy, an FPGA sits above CPLDs (smaller, non-volatile, lower-density) and below ASICs (application-specific, higher NRE but lower unit cost at volume). FPGAs are typically used in prototyping, low-volume designs, and applications demanding hardware reconfiguration such as DSP pipelines, high-speed serial interfaces, and parallel compute fabrics. Key features of the EP3SL340H1152C4LN include 744 maximum user I/Os, 24 transceivers (per Stratix III family architecture), support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), and integrated PCIe hard IP blocks. The 65 nm low-power process combined with programmable power technology enables fine-grained power gating of unused logic, registers, and memory blocks. Hard memory controllers and DSP blocks accelerate common data-path functions such as FFT, FIR filtering, and external memory interfacing. Typical applications include high-end telecommunications baseband processing, high-performance computing accelerators, software-defined radio (SDR) platforms, ASIC prototyping, video broadcast infrastructure, and test and measurement equipment. The 337.5K LE density makes this part particularly well-suited to designs that exceed the capacity of smaller Stratix III members such as the EP3SL200 family. When designing with this device, ensure that the PCB layout meets the flip-chip BGA escape and signal-integrity requirements, including matched-length pairs for LVDS and controlled impedance for high-speed serial links. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Note that this part is in Last Time Buy / Not Recommended for New Designs (NRND) status; consider Stratix IV or Stratix V for new projects. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP3SL340H1152C4N - 340K LE Stratix III L FPGA, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C4N is a high-density, low-power member of the Stratix III L FPGA family built on a 65 nm CMOS process, delivering 337,500 equivalent logic elements, 18,822,144 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FCBGA) package. It is offered in a commercial temperature grade (0C to 85C) with the speed grade 4 core fabric, targeting high-performance DSP, signal-processing, and protocol-bridging applications where the L variant trades a small amount of peak fabric speed for substantially lower static and dynamic power versus the Stratix III E family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data rather than hard-wired masks. Stratix III FPGAs occupy the high-performance tier of the Intel (Altera) programmable-logic hierarchy, sitting above Cyclone (low-cost) and Arria (mid-range) families and below the newer Stratix IV/V/10 families. Within Stratix III, the L sub-family is engineered for low-power operation while retaining the same MultiTrack interconnect, TriMatrix memory blocks, and DSP block architecture as the E sub-family. Key features of the EP3SL340H1152C4N include 13500 Logic Array Blocks (LABs), dedicated high-speed transceivers, embedded multiplier and accumulator DSP blocks, programmable power technology (the only Stratix III device with this feature), and integrated PLLs for clock synthesis. The device supports configuration via passive serial, fast passive parallel, and active serial modes and includes built-in security features for bitstream encryption. Programmable Power Technology allows unused logic and routing resources to be biased to a low-power state, reducing dynamic power by up to 50 percent compared to fixed-bias designs. The silicon architecture combines adaptive logic modules (ALMs) packed in 13500 LABs with embedded SRAM organised as TriMatrix memory (MLAB, M9K, M144K blocks) and dedicated 18x18 multipliers. High-speed serial transceivers support multi-gigabit interfaces, and the device is qualified for commercial temperature operation only (0C to 85C). Typical applications include high-end telecommunications line cards, military radar baseband preprocessing, ASIC prototyping, high-performance DSP pipelines, and high-throughput data-acquisition systems. For aerospace and industrial applications where extended temperature is required, designers should select the I-grade variant (EP3SL340H1152I4N). The large 1152-ball package also enables very high pin-count interfaces such as DDR3 memories, multi-port Ethernet, and PCI Express Gen1/Gen2 hard IP. A key design consideration for the EP3SL340H1152C4N is that the FCBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad construction, and a heatsink or thermal pad to keep junction temperature within the 0C to 85C commercial window during sustained high toggle-rate workloads. Engineers should follow the Stratix III handbook pin connection guidelines to leave unused transceiver and clock pins tied to defined states. This page synthesises distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes that are not collated in any single source on the manufacturer datasheet.
EP3SL340H1152I3 - Stratix III L FPGA 337K LE 1152-FCBGA | Intel
The Intel (Altera) EP3SL340H1152I3 is a high-density, low-power Stratix III L FPGA integrating 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 maximum user I/O pins in a 1152-ball FCBGA package, fabricated on a 65 nm process and operating at up to 500 MHz. It belongs to the Stratix III L family, which is engineered for applications that demand a balance of high logic density, generous on-chip memory, and reduced static power relative to the original Stratix III family. The "I3" speed/temperature grade indicates an industrial operating range, and the 1.1 V core supply is regulated externally. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory, and high-speed transceivers on a single die. Within the broader semiconductor taxonomy, an FPGA sits between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: FPGAs offer hardware-level parallelism and reconfigurability that microcontrollers cannot match, without the per-unit NRE cost of an ASIC. The Stratix III L family is a derivative of the Stratix III family, optimized for low static power while preserving the architecture's high-performance DSP and memory subsystems. Key features of the EP3SL340H1152I3 include 337,500 logic elements, 18,822,144 memory bits, 744 maximum user I/O pins, support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DSP blocks for high-throughput arithmetic, and up to 500 MHz internal operation. Embedded memory is partitioned into M9K and M144K blocks, allowing efficient buffer, FIFO, and lookup-table implementations without consuming fabric logic. Architecturally, the device combines a programmable logic fabric with a column-and-row interconnect structure, hardened DSP and memory blocks, and clock management via PLLs. The 65 nm process and Stratix III L power optimizations deliver lower static power than the baseline Stratix III family while preserving DSP throughput and memory bandwidth. Typical applications include high-performance digital signal processing, military radar and electronic warfare, medical imaging front-ends, ASIC prototyping, and high-speed data acquisition. The 1152-ball FCBGA package provides the high pin count and signal integrity required by wide-bus, parallel interfaces. When designing with this device, follow Intel/Altera's Stratix III power-up sequencing guidelines; the 1.1 V core, PLL analog supply, and I/O supplies must ramp in the recommended order to avoid latch-up. Use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in same-family variants, and design notes not found in a single manufacturer PDF, enabling engineers to evaluate the part and its substitutes faster.
EP3SL340H1152I3N - Stratix III L FPGA, 337.5K LEs, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152I3N is a high-density, low-power Stratix® III L family Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. The device integrates 337,500 logic elements (LEs), approximately 18.8 Mbits of embedded memory, 744 user I/O pins, and high-speed transceivers/PLLs targeted at bandwidth-intensive ASIC-prototyping, DSP, and wireline communication designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, embedded memory, DSP blocks, and hardened I/O serdes. FPGAs sit at the top of the digital semiconductor hierarchy below ASICs, allowing hardware designers to implement custom parallel processing pipelines, state machines, and high-speed interfaces without the NRE cost of a custom ASIC. The Stratix III family uses TSMC's 65 nm process and emphasizes a low-power "L" variant tuned for power-sensitive applications. Key features of the EP3SL340H1152I3N include 337,500 logic elements, 18,822,144 bits of embedded RAM, 744 maximum user I/O, programmable power technology with logic-array clocking, on-chip termination (OCT), and DSP blocks supporting high-throughput fixed- and floating-point arithmetic. The device is specified for the industrial temperature grade (-40 °C to +100 °C) and supports multiple high-speed serial protocols through its transceiver channels. Architecturally, the Stratix III L uses a tile-based logic structure with dedicated carry chains, 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP block slices that accelerate IEEE-754 single-precision floating-point operations. The 1152-BGA package exposes the full device periphery for maximum user I/O, making this part the preferred package option when a design needs 500+ board-level signals. Typical applications include wireline telecom line cards, ASIC prototyping, high-performance DSP pipelines for radar/medical imaging, broadcast video processing, and military/aerospace signal processing. Designers also deploy the EP3SL340H1152I3N in test & measurement instrumentation where its combination of logic density and high I/O count enables a single-chip acquisition/processing backend. When designing with this FPGA, careful attention to power integrity is required. Programmable power technology combined with on-chip temperature sensors helps dynamic power management, but multi-rail decoupling, bulk bypassing, and a thermal solution sized for the FCBGA's theta-JA are mandatory for reliable industrial operation. This page synthesizes distributor inventory, drop-in pin-compatible Stratix III L alternatives, application recommendations, and PCB-thermal design notes that the manufacturer datasheet alone does not provide.
EP3SL340H1152I4 - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
The Intel EP3SL340H1152I4 is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) delivering up to 337,500 logic elements and 18,821,440 bits of embedded memory, packaged in a 1152-ball FineLine BGA (HBGA) at the industrial -40C to +100C junction temperature grade. Operating at up to 717 MHz core fabric speed on a 65 nm CMOS process with 1.1 V core supply, the device combines high logic density with the Stratix III L family's signature low static and dynamic power architecture. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected via programmable interconnect and surrounded by I/O blocks; modern high-end FPGAs like the Stratix III L family also embed hardened memory controllers, transceivers, DSP blocks, and PLLs to enable complete system-on-chip designs without external ASICs. FPGAs sit hierarchically within the broader taxonomy: programmable logic device -> programmable logic IC -> digital IC -> semiconductor -> integrated circuit. Key features of the EP3SL340H1152I4 include 744 user I/O pins, embedded multiplier blocks (18x18), high-speed LVDS pairs, dedicated DDR/DDR2/DDR3 memory controllers with hard PHY, and up to 12 embedded transceivers depending on configuration. The 1152-ball HBGA package uses Intel's flip-chip BGA technology for low inductance power distribution and high signal integrity at multi-hundred-MHz fabric speeds. The Stratix III L variant specifically targets lower static power compared to the standard Stratix III family while preserving high-performance fabric features such as adaptive logic modules (ALMs), M9K and M144K memory blocks, and DSP blocks with hardware multipliers and accumulators. This positions the EP3SL340H1152I4 for power-sensitive applications that still demand hundreds of thousands of logic elements. Typical applications include high-end wireline telecom line cards, software-defined radio (SDR) baseband processing, military radar signal processing, ASIC prototyping and emulation platforms, high-performance DSP pipelines, broadcast video processing, and medical imaging accelerators. The 337.5K LE capacity supports complete protocol stacks plus parallel processing dataplanes on a single device. Designers should provide a multi-rail power system (typically 1.1 V core, 2.5 V/3.3 V aux, and dedicated PLL analog supplies) with bulk decoupling and high-frequency ceramic bypass near the BGA balls. Thermal management is critical because the flip-chip BGA dissipates up to 25-30 W at full fabric utilization, often requiring a heatsink and controlled airflow. Signal integrity must be considered for the high-speed LVDS and transceiver channels. This page synthesizes distributor pricing, parametric alternatives, and PCB thermal/layout notes not consolidated in the manufacturer datasheet. Pricing references distributor stock data as of 2026-09-09.