MCF5274CVM166
MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA
The NXP Semiconductors MCF5274CVM166 is a 166 MHz, 32-bit, ROMless ColdFire V2 integrated microprocessor supplied in a 256-map BGA package measuring 17 mm by 17 mm. Its key verified characteristics are the 166 MHz operating frequency, 32-bit RISC processing, external memory rather than embedded program memory, and surface-mount MAPBGA construction. The device is positioned for control-intensive embedded systems that need substantial processing capability, networking-oriented peripherals, and external program or data storage.
A microprocessor is a programmable control component that executes instructions and coordinates memory, communication, and peripheral functions. In the broader semiconductor hierarchy, this device belongs to embedded processors, then 32-bit RISC processors, then integrated microprocessors and system-on-chip devices. Its ROMless architecture separates the processor from embedded program memory, allowing system designers to select external storage according to firmware size, boot requirements, update strategy, and product configuration.
The verified product listing identifies a ColdFire V2 core, 166 MHz clocking, and a 256-map BGA package. Search results also associate the device with connection, protection, and peripheral choices intended for cost-sensitive, power-conscious applications requiring significant control processing for file management, connectivity, data buffering, and user-interface functions. Because the excerpted data does not provide the complete peripheral list, core dimensions, memory interface details, or electrical timing tables, those values should be confirmed in the manufacturer hardware specification before schematic capture.
This processor is relevant to industrial control equipment, embedded network controllers, file-management systems, data buffers, and human-machine interfaces. Its 166 MHz rating favors workloads that need more control headroom than lower-clock ColdFire implementations, while ROMless operation permits storage to be scaled independently. The tradeoff is board complexity: external memory and a large fine-pitch BGA require careful routing, decoupling, assembly capability, and firmware verification.
For new or replacement hardware, use a 256-map BGA-specific footprint and follow the manufacturer’s pin, voltage, clock, memory-interface, and decoupling guidance. Do not infer compatibility from the 166 MHz suffix alone. Confirm the complete ordering code, package drawing, exposed-pad requirements, operating-temperature grade, and board revision before release to production.
This page combines verified manufacturer and distributor identity data with package, lifecycle, sourcing, and design guidance. It also distinguishes documented facts from missing electrical details and avoids presenting unverified alternatives as drop-in replacements.
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