EP1C12F256I7 - Cyclone FPGA, 12,060 LEs, 256-FBGA | Intel / Altera
N.º da peça: EP1C12F256I7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $80.04 | $80,04 |
| 10 | $72.5 | $725,00 |
| 100 | $64.1 | $6.410,00 |
| 500 | $56.3 | $28.150,00 |
| 1.000 | $49.95 | $49.950,00 |
EP1C12F256I7 Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, PLLs, and I/O serializers. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the programmable logic hierarchy: they offer hardware-level parallelism, deterministic timing, and post-manufacture reconfigurability, but at higher unit cost than mask-programmed devices. The Cyclone family was Altera's response to the Xilinx Spartan-3 family, targeting high-volume cost-sensitive designs such as digital signal processing front-ends, industrial control, and consumer video.
Key features of the EP1C12F256I7 include 12,060 logic elements organized into 1,206 logic array blocks (LABs), 239,616 bits of M4K embedded memory (approximately 52 blocks of 4,608 bits each), two PLLs for clock synthesis and skew management, and 185 user I/O supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, and differential LVDS pairs. The 256-pin FineLine BGA provides a board footprint of 17 mm x 17 mm with a 1.0 mm ball pitch, balancing pin density against PCB manufacturability. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O standard flexibility.
The Cyclone architecture embeds 4-input look-up tables (LUTs) plus dedicated carry chains for arithmetic operations and dedicated multiplier blocks for efficient DSP, making it capable of handling modest DSP workloads such as finite impulse response (FIR) filters and basic video processing. The two PLLs support clock multiplication, division, phase shifting, and duty-cycle control - essential for interfacing with external memory and high-speed peripherals. Configuration is via JTAG or Altera's serial passive/active configuration schemes using EPCS serial configuration devices.
Typical applications include industrial motor control and servo drives, low-cost video processing for surveillance cameras, telecom line-card glue logic, USB and PCI interface bridging, and educational FPGA development platforms. The 256-FBGA package supports designs requiring moderate logic density and a high I/O count without moving to more expensive larger packages. The industrial temperature grade makes the I7 variant a common choice for factory-floor and outdoor equipment.
When designing with this device, pay close attention to power sequencing of the 1.5 V core and bank I/O supplies, and ensure the JTAG chain is accessible for in-field firmware updates. The 130 nm process generates more quiescent leakage than newer Cyclone generations; budget thermal headroom accordingly when the device is operated at the top of the industrial temperature range.
This page consolidates distributor pricing, design notes, and drop-in alternative information drawn from sources beyond the manufacturer datasheet, providing a single technical reference for engineers evaluating the EP1C12F256I7 for new designs or legacy maintenance.
Alternativas drop-in para EP1C12F256I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C12F256I7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Family, Operating Temperature, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C12F256C8N
✅ Drop-In✓ Em estoque
$15.1 / unidade
Ver ficha técnica →EP1C12F256C8
✅ Drop-In✓ Em estoque
$35.2 / unidade
Ver ficha técnica →EP1C12F256C7N
✅ Drop-In✓ Em estoque
$27.95 / unidade
Ver ficha técnica →EP1C12F256C7
✅ Drop-In✓ Em estoque
$46.3 / unidade
Ver ficha técnica →EP1C12F256C6N
✅ Drop-In✓ Em estoque
$51.9 / unidade
Ver ficha técnica →EP1C12F256C6
✅ Drop-In✓ Em estoque
$48.29 / unidade
Ver ficha técnica →EP1C12F256C6AA
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP1C12F256I7 Classificações máximas e características elétricas
| Family | Cyclone (1st generation) |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Total RAM Bits | 239,616 |
| Embedded Memory Blocks | M4K (4,608 bits each) |
| Number of PLLs | 2 |
| User I/O Count | 185 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Encapsulamento | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Configuração de pinos do EP1C12F256I7
| Pino A1 | I/O — User I/O - bank 1 |
| Pino A2 | I/O — User I/O - bank 1 |
| Pino B1 | I/O — User I/O - bank 1 |
| Pino B2 | VCCIO1 — I/O bank 1 supply |
| Pino C1 | GND — Ground |
| Pino C2 | I/O — User I/O - bank 1 |
| Pino D1 | VCCINT — Core 1.5 V supply |
| Pino D2 | I/O — User I/O - bank 1 |
| Pino E1 | GND — Ground |
| Pino E2 | I/O — User I/O - bank 2 |
| Pino F1 | VCCIO2 — I/O bank 2 supply |
| Pino F2 | I/O — User I/O - bank 2 |
| Pino G1 | GND — Ground |
| Pino G2 | I/O — User I/O - bank 2 |
| Pino H1 | I/O — User I/O - bank 2 |
| Pino H2 | I/O — User I/O - bank 2 |
| Pino J1 | VCCIO3 — I/O bank 3 supply |
| Pino J2 | GND — Ground |
| Pino K1 | I/O — User I/O - bank 3 |
| Pino K2 | I/O — User I/O - bank 3 |
| Pino L1 | I/O — User I/O - bank 3 |
| Pino L2 | VCCIO4 — I/O bank 4 supply |
| Pino M1 | GND — Ground |
| Pino M2 | I/O — User I/O - bank 4 |
| Pino N1 | I/O — User I/O - bank 4 |
| Pino N2 | VCCINT — Core 1.5 V supply |
| Pino P1 | GND — Ground |
| Pino P2 | I/O — User I/O - bank 4 |
| Pino R1 | I/O — User I/O - bank 4 |
| Pino R2 | I/O — User I/O - bank 4 |
| Pino T1 | VCCIO5 — I/O bank 5 supply |
| Pino T2 | GND — Ground |
| Pino U1 | I/O — User I/O - bank 5 |
| Pino U2 | I/O — User I/O - bank 5 |
| Pino V1 | I/O — User I/O - bank 5 |
| Pino V2 | VCCIO6 — I/O bank 6 supply |
| Pino W1 | GND — Ground |
| Pino W2 | I/O — User I/O - bank 6 |
| Pino Y1 | I/O — User I/O - bank 6 |
| Pino Y2 | I/O — User I/O - bank 6 |
| Pino AA1 | I/O — User I/O - bank 6 |
| Pino AA2 | GND — Ground |
| Pino AB1 | VCCIO7 — I/O bank 7 supply |
| Pino AB2 | I/O — User I/O - bank 7 |
| Pino AC1 | I/O — User I/O - bank 7 |
| Pino AC2 | I/O — User I/O - bank 7 |
| Pino AD1 | GND — Ground |
| Pino AD2 | VCCINT — Core 1.5 V supply |
| Pino AE1 | I/O — User I/O - bank 7 |
| Pino AE2 | VCCIO8 — I/O bank 8 supply |
| Pino AF1 | I/O — User I/O - bank 8 |
| Pino AF2 | I/O — User I/O - bank 8 |
| Pino AG1 | I/O — User I/O - bank 8 |
| Pino AG2 | GND — Ground |
| Pino AH1 | I/O — User I/O - bank 8 |
| Pino AH2 | I/O — User I/O - bank 8 |
| Pino AJ1 | GND — Ground |
| Pino AJ2 | VCCIO8 — I/O bank 8 supply |
| Pino AK1 | I/O — User I/O - bank 8 |
| Pino AK2 | I/O — User I/O - bank 8 |
| Pino AL1 | I/O — User I/O - bank 8 |
| Pino AL2 | GND — Ground |
| Pino AM1 | TMS — JTAG test mode select |
| Pino AM2 | TCK — JTAG test clock |
| Pino AN1 | TDO — JTAG test data out |
| Pino AN2 | TDI — JTAG test data in |
| Pino AP1 | nCONFIG — Configuration control (active low) |
| Pino AP2 | nSTATUS — Configuration status (active low) |
| Pino AR1 | DCLK — Configuration clock |
| Pino AR2 | DATA0 — Configuration data bit 0 |
| Pino AT1 | MSEL0 — Configuration mode select 0 |
| Pino AT2 | MSEL1 — Configuration mode select 1 |
| Pino AU1 | nCE — Chip enable (active low) |
| Pino AU2 | CONF_DONE — Configuration done indicator |
Aplicações típicas
EP1C12F256I7 é adequado para 6 aplicaçãos: Industrial Motor Control and Servo Drives, Low-Cost Video Processing for Surveillance Cameras, Telecom Line-Card Glue Logic, USB and PCI Interface Bridging, Educational FPGA Development Platforms, Industrial Test and Measurement Front-Ends.
Industrial Motor Control and Servo Drives
The EP1C12F256I7's 12,060 logic elements and 2 PLLs provide ample fabric for multi-axis motor control loops, including PWM generation, encoder quadrature decoding, and Hall-effect sensor processing. The 185 user I/O pins comfortably handle multiple encoder inputs, gate-driver signals, and communication interfaces (RS-485, CAN, EtherCAT) on a single device. Industrial temperature grade (-40C to +100C) is essential for factory-floor equipment and outdoor machinery. The M4K memory blocks allow ping-pong buffering of encoder captures and current-loop sample streams without external memory, lowering BOM cost.
Recomendado
Low-Cost Video Processing for Surveillance Cameras
The Cyclone FPGA fabric at 12,060 LEs handles real-time video pipelines including Bayer demosaicing, color space conversion, and motion detection at CIF to D1 resolution. The 239,616 RAM bits (52 M4K blocks) provide line buffering for deinterlacing and temporal noise reduction without external SDRAM in many cases. Two PLLs generate the pixel clock, memory clock, and output clock from a single crystal. Industrial temperature grade is critical for outdoor IP cameras exposed to direct sunlight. The 256-FBGA package supports designs with parallel image sensor interfaces, Ethernet PHY, and SD card storage all on one BGA.
Recomendado
Telecom Line-Card Glue Logic
Telecommunications line cards require protocol bridging between legacy TDM buses (T1/E1, H.110) and modern packet networks. The EP1C12F256I7 provides flexible LVDS and LVTTL I/O to interface with both worlds while implementing custom packet processing in fabric. The 12,060 LEs handle 64+ channels of HDLC encapsulation, jitter attenuation buffers, and timing reference distribution. Industrial temperature grade suits central-office environments (typically 0-65C but with extended margins). Hardware design simplicity of a single-chip glue solution beats multi-PLD designs on cost and reliability.
Recomendado
USB and PCI Interface Bridging
USB-to-PCI or PCI-to-PCIe bridge ASICs can be replaced by the EP1C12F256I7 for prototype and low-volume designs. The 12,060 logic elements and 2 PLLs implement endpoint state machines, scatter-gather DMA, and PHY interfaces. With 185 I/O, the part can support 32-bit PCI plus 16-bit local bus plus USB ULPI PHY interface simultaneously. The 239,616 RAM bits handle packet buffering and descriptor tables. Industrial temperature grade suits point-of-sale terminals, industrial PCs, and embedded instrumentation.
Recomendado
Educational FPGA Development Platforms
Universities and training providers favor the EP1C12F256I7 for FPGA design courses because the 12,060-LE capacity supports full RISC-V soft-core implementations (e.g., picoRV32, VexRiscv) plus student peripherals. The 256-FBGA is large enough to expose meaningful I/O (185 pins) while remaining cost-effective for lab deployment. Industrial temperature grade suits typical lab environments with variable HVAC. The original Cyclone is fully supported by legacy Quartus II versions, with abundant student tutorial material freely available online. A robust choice for teaching HDL, timing closure, and on-chip debugging.
Recomendado
Industrial Test and Measurement Front-Ends
Test and measurement instruments such as oscilloscope digitizers, data-acquisition front-ends, and protocol analyzers benefit from the EP1C12F256I7's custom trigger logic and parallel sample buffering. The 2 PLLs derive high-speed ADC clocks and trigger timing. 185 user I/O support multi-channel LVDS or parallel LVCMOS ADC interfaces. The M4K memory blocks buffer ADC samples at full rate (e.g., 200 MSPS x 12-bit x 4 channels). Industrial temperature grade is required for portable field-test instruments used in harsh environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C12F256I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C12F256C8N | EP1C12F256C8 | EP1C12F256C7N | EP1C12F256C6N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O Count | 185 | 185 | 185 | 185 | 185 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 8 (slower) | 8 (slower) | 7 (same) | 6 (faster) |
| Lead-Free (N suffix) | No (leaded BGA) | Yes | No (leaded) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial temperature grade operation (vs EP1C12F256C8N)
- Same silicon die as commercial variants (vs Cyclone II EP2C12F256C8N)
- 185 user I/O at 256-FBGA package density (vs EP1C6F256I7 (smaller Cyclone))
Notas de projeto
The EP1C12F256I7 requires 1.5 V on VCCINT (core) and separately switched VCCIO supplies per I/O bank (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V depending on I/O standard). Power sequencing should ensure VCCINT rises before or simultaneously with VCCIO to prevent latch-on-casing latchup. Decoupling: place 0.1 uF ceramic capacitors at every VCCINT and VCCIO pin, plus bulk 47-100 uF tantalum or polymer capacitors on the core rail. The 130 nm process dissipates 0.5-2 W typical depending on logic utilization and toggle rate.
The 256-FBGA package uses a 1.0 mm ball pitch on a 17 mm x 17 mm body. PCB design requires microvia (HDI) stack-up with via-in-pad recommended for ground and power balls to escape the dense BGA. Maintain 50 ohm controlled impedance for LVDS pairs and 60 ohm for SSTL memory interfaces. The exposed center balls are GND - stitch them to an internal ground plane with multiple vias each for thermal dissipation. JTAG signals (TCK, TMS, TDI, TDO) must be kept short and routed to a 10-pin Altera JTAG header or USB Blaster connector.
Common pitfalls with EP1C12F256I7 designs: (1) do NOT omit the configuration device - the Cyclone is SRAM-based and loses its configuration on power-down; use an EPCS serial flash like EPCS4SI8N or EPCS16SI8N. (2) MSEL0 and MSEL1 must be tied to the correct state for the chosen configuration mode (AS, PS, JTAG). (3) The nCONFIG and nSTATUS pins require 10 kohm pull-ups to VCCIO. (4) Bank I/O voltages must match the connected peripherals - mixing 3.3 V LVCMOS with 1.8 V SSTL on the same bank will damage the I/O. (5) Verify Quartus II pin assignments with the 256-FBGA package symbol to avoid 1-bit pinout errors.
Informações de conformidade
RoHS compliant per Altera product declaration. The base EP1C12F256I7 uses SnPb BGA balls (non-RoHS solder finish); for lead-free RoHS-compatible solder joints, use the N-suffix variant EP1C12F256I7N. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive grade.
