EP2C35F672I8N - 33K LE Cyclone II FPGA, 672-BGA | Intel
N.º da peça: EP2C35F672I8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $151.47 | $151,47 |
| 10 | $142.5 | $1.425,00 |
| 100 | $128 | $12.800,00 |
| 500 | $115 | $57.500,00 |
| 1.000 | $98.5 | $98.500,00 |
EP2C35F672I8N Visão geral
A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be electrically programmed after PCB assembly. Within the broader silicon taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs as programmable logic devices, but uniquely offer hardware-level parallelism, sub-cycle latency, and on-the-fly reconfiguration. Cyclone II represents Altera's second-generation low-cost FPGA family, optimized for high-volume cost-sensitive designs where ASIC NRE is unjustified.
Key features of the EP2C35F672I8N include 33,216 logic elements, 35 embedded 18x18 multipliers (132 9x9 multipliers) for DSP-style arithmetic, 483,840 bits of embedded RAM arranged across M4K blocks, 475 user I/O pins, and four phase-locked loops for clock synthesis and management. The 672-BGA package provides 35x35 ball array with 1.0 mm pitch, enabling dense PCB escape routing while still allowing conventional reflow assembly.
Architecturally, the Cyclone II device uses a four-input look-up table (LUT4) logic element, true dual-port M4K memory blocks, and dedicated multiplier blocks adjacent to the logic array. The 672-BGA package supports up to 8 high-speed LVDS channels and 16 global clock networks. Configuration is loaded through passive serial (PS), fast passive parallel (FPP), or JTAG modes using the Altera Quartus design toolchain.
Typical applications span industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver-assistance prototyping, communications protocol bridging, and cost-optimized ASIC prototyping where moderate logic density and abundant I/O are required. The 475 user I/O count and 35 hardware multipliers make it well suited to parallel data acquisition and image preprocessing.
When designing with the EP2C35F672I8N, ensure the PCB layout honors the BGA escape pattern with microvia or via-in-pad technology to reach inner-layer routing. Confirm that JTAG, configuration, and decoupling pins are accessible to the programmer, and that the PLL power supply filtering follows the Cyclone II handbook reference schematic.
This page synthesizes distributor pricing, package-equivalent drop-in alternatives from the same Cyclone II family, and practical design notes not found in the manufacturer datasheet, giving the engineer a single source for cross-brand replacement decisions and reference-design companion parts.
Alternativas drop-in para EP2C35F672I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C35F672I8N (mesmo formato e footprint) — diferindo em Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C35F672I8
✅ Drop-In✓ Em estoque
$104.5 / unidade
Ver ficha técnica →EP2C35F672C8N
✅ Drop-In✓ Em estoque
$77.14 / unidade
Ver ficha técnica →EP2C35F672C7N
✅ Drop-In✓ Em estoque
$98 / unidade
Ver ficha técnica →EP2C35F672C6N
✅ Drop-In✓ Em estoque
$122.5 / unidade
Ver ficha técnica →EP2C35F672C8
✅ Drop-In✓ Em estoque
$71.85 / unidade
Ver ficha técnica →EP2C35F672C7
✅ Drop-In✓ Em estoque
$119.95 / unidade
Ver ficha técnica →EP2C35F672I8N Classificações máximas e características elétricas
| Series | Cyclone II |
| Family | Cyclone II |
| Logic Elements (LE) | 33,216 |
| Total Memory Bits | 483,840 |
| Embedded Multipliers (18x18) | 35 |
| Embedded Multipliers (9x9) | 132 |
| User I/O Count | 475 |
| Number of PLLs | 4 |
| Encapsulamento | 672-BGA (FineLine) |
| Ball Pitch | 1.0 mm |
| Process Node | 90 nm CMOS |
| Temperatura de operação | -40C to +100C (industrial) |
| Speed Grade | 8 |
| Tipo de montagem | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Modes | PS, FPP, JTAG |
| Supply Voltage Core | 1.2 V (typical) |
Guia de Configuração de Pinos do EP2C35F672I8N 672-bga (fineline)
Configuração de pinos para EP2C35F672I8N (pacote 672-bga (fineline)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2C35F672I8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2C35F672I8N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing Pipeline, Software Defined Radio (SDR) Front-End, ASIC Prototyping and Emulation, Automotive Driver Assistance Prototyping, Communications Protocol Bridging.
Industrial Motor Control
The EP2C35F672I8N fits industrial motor-control applications because its 33,216 logic elements can host multi-axis field-oriented control (FOC) state machines while the 35 dedicated 18x18 multipliers execute the Park/Clarke transforms and PI regulators in parallel. The 475 user I/O pins provide ample headroom for multi-channel PWM outputs, encoder feedback (QEP), and CAN/RS-485 comms. Industrial temperature grade -40C to +100C supports factory-floor deployment without derating. Used between the gate driver and the IGBT power stage, paired with EP2C20F256I8N as a co-processor for safety-watchdog logic.
Recomendado
Video Processing Pipeline
With 483,840 bits of embedded RAM organized in M4K blocks, the EP2C35F672I8N can buffer full-HD video lines in real time for deinterlacing, scaling, or color-space conversion. The 35 hardware multipliers accelerate 2D filter kernels (Sobel, Gaussian) and motion estimation, while 475 user I/O pins accommodate parallel ITU-R BT.656 / BT.1120 buses plus DDR memory interface. Industrial temperature grade suits outdoor digital signage and surveillance applications. Pairs naturally with EPCS configuration flash and external DDR SDRAM.
Recomendado
Software Defined Radio (SDR) Front-End
The EP2C35F672I8N's combination of 35 hardware multipliers and abundant logic elements makes it well suited to baseband DSP for narrow-band SDR prototypes, including digital down-conversion (DDC), channelization, and demodulation (PSK, QAM, FSK). The four PLLs generate the precise sampling clocks required for ADC interfacing. Industrial temperature grade enables portable field-deployable radios. Often used with high-speed ADC/DAC front-ends and paired with Cyclone II development kits.
Recomendado
ASIC Prototyping and Emulation
The 33,216 LE capacity positions EP2C35F672I8N as a mid-density ASIC prototyping platform, capable of emulating subsystems of larger ASIC designs including CPUs, DSPs, and protocol stacks. Designers partition ASIC RTL across multiple EP2C35F672I8N devices using the 475 user I/O as chip-to-chip interconnect channels. Industrial temperature grade supports bring-up in production test fixtures. Common in university and corporate ASIC bring-up labs.
Recomendado
Automotive Driver Assistance Prototyping
Although not AEC-Q100 qualified, the EP2C35F672I8N is widely used in pre-production prototyping of ADAS algorithms such as lane detection, radar pre-processing, and sensor fusion. The 475 user I/O pins accommodate multiple camera and radar sensor inputs simultaneously, while the 35 hardware multipliers handle real-time convolution and FFT operations. Engineering teams typically validate algorithms on this Cyclone II device before porting to AEC-Q100-qualified Cyclone III or Cyclone IV Auto parts.
Recomendado
Communications Protocol Bridging
The EP2C35F672I8N's 475 user I/O make it an effective bridge between legacy parallel buses and modern serial protocols such as SPI, I2C, UART, PCIe, and Ethernet. The 33,216 LE allow multiple protocol stacks to run concurrently with hardware state machines for low-latency packet forwarding. Industrial temperature grade supports telecom and industrial networking equipment. Often deployed in protocol converter and IoT gateway products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C35F672I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C35F672I8 | EP2C35F672C8N | EP2C35F672C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FineLine) | 672-BGA (FineLine) - same | 672-BGA (FineLine) - same | 672-BGA (FineLine) - same |
| Logic Elements | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE |
| Embedded RAM | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits |
| 18x18 Multipliers | 35 | 35 | 35 | 35 |
| User I/O Count | 475 | 475 | 475 | 475 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 8 | 8 | 8 | 7 (slower Fmax) |
| RoHS Compliance | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | Yes (N suffix) |
Principais diferenciais
- Industrial temperature grade vs commercial-grade same-package alternatives (vs EP2C35F672C8N)
- Pb-free RoHS-compliant terminal finish vs legacy SnPb (vs EP2C35F672I8)
- Speed grade 8 vs speed grade 7 variants (vs EP2C35F672C7N)
Notas de projeto
The 672-BGA package uses 1.0 mm ball pitch, which is at the practical limit of conventional PCB fabrication. Designers should plan for microvia or via-in-pad technology to achieve reliable inner-layer escape routing. A 4-layer or 6-layer stack-up with buried capacitance is recommended for the inner power/ground plane pair. Maintain a continuous ground plane beneath the BGA to control return-path impedance and reduce SSO noise. Estimated: signal escape assumes 0.1 mm trace/space on outer microvia layer.
Cyclone II devices require at least three separate supply rails: VCCINT (1.2 V core), VCCIO (1.5 V to 3.3 V I/O bank, bank-dependent), and VCC_PLL (1.2 V analog PLL supply). Decoupling must follow the handbook reference schematic with 0.1 uF and 10 uF combinations near every power pin. Use a ferrite bead to isolate VCC_PLL from VCCINT noise. Estimated: bulk decoupling at 1 uF per PLLs and 0.1 uF per VCCIO pin.
Match JTAG chain length and impedance to the 4-wire TMS/TCK/TDO/TDI specification. Provide a robust 4.7 kohm pull-up on TCK and TDI, and route configuration signals away from switching I/O to avoid configuration corruption during power-up. Expose JTAG and AS/PS configuration mode pins to accessible test points or header pins for in-field reprogramming. Cyclone II recommends 25 MHz MSEL settings for active serial configuration with EPCS flash devices.
Informações de conformidade
RoHS compliant per N suffix. Not AEC-Q100 qualified - choose AEC-Q100 qualified Cyclone III/IV Auto variants for automotive production. Conflict-minerals compliance per Intel program report.
