EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
N.º da peça: EP3C10E144I7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.44 | $38,44 |
| 10 | $35.2 | $352,00 |
| 100 | $30.5 | $3.050,00 |
| 500 | $27.1 | $13.550,00 |
| 1.000 | $24.75 | $24.750,00 |
EP3C10E144I7 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems.
Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly.
Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power.
Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production.
When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture.
This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.
Alternativas drop-in para EP3C10E144I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C10E144I7 (mesmo formato e footprint) — diferindo em Family, Process Technology, Package, Operating Temperature, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C10E144C8N
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →EP3C10E144C7N
✅ Drop-In✓ Em estoque
$45.2 / unidade
Ver ficha técnica →EP3C10E144I7N
✅ Drop-In✓ Em estoque
$39.92 / unidade
Ver ficha técnica →EP3C16E144I7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C10E144A7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C10E144I7 Classificações máximas e características elétricas
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 10,320 |
| Total Memory Bits | 423,936 |
| Embedded Multipliers (18x18) | 23 |
| User I/O Count | 94 |
| PLLs | 4 |
| Process Technology | 65 nm |
| Operating Voltage (Core) | 1.2 V |
| Encapsulamento | 144-pin LQFP Exposed Pad (EQFP) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial) |
| Grade | Industrial (I7) |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Status RoHS | Compliant (lead-free) |
Configuração de pinos do EP3C10E144I7
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O (bank 2) |
| Pino 14 | I/O — User I/O (bank 2) |
| Pino 15 | I/O — User I/O (bank 2) |
| Pino 16 | I/O — User I/O (bank 2) |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | I/O — User I/O (bank 2) |
| Pino 20 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 3) |
| Pino 26 | I/O — User I/O (bank 3) |
| Pino 27 | I/O — User I/O (bank 3) |
| Pino 28 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 29 | I/O — User I/O (bank 3) |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | I/O — User I/O (bank 3) |
| Pino 32 | I/O — User I/O (bank 3) |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | I/O — User I/O (bank 3) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O — User I/O (bank 4) |
| Pino 37 | I/O — User I/O (bank 4) |
| Pino 38 | I/O — User I/O (bank 4) |
| Pino 39 | I/O — User I/O (bank 4) |
| Pino 40 | I/O — User I/O (bank 4) |
| Pino 41 | I/O — User I/O (bank 4) |
| Pino 42 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 43 | I/O — User I/O (bank 4) |
| Pino 44 | I/O — User I/O (bank 4) |
| Pino 45 | I/O — User I/O (bank 4) |
| Pino 46 | I/O — User I/O (bank 4) |
| Pino 47 | I/O — User I/O (bank 5) |
| Pino 48 | I/O — User I/O (bank 5) |
| Pino 49 | I/O — User I/O (bank 5) |
| Pino 50 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 51 | I/O — User I/O (bank 5) |
| Pino 52 | I/O — User I/O (bank 5) |
| Pino 53 | I/O — User I/O (bank 5) |
| Pino 54 | I/O — User I/O (bank 5) |
| Pino 55 | I/O — User I/O (bank 5) |
| Pino 56 | GND — Ground |
| Pino 57 | I/O — User I/O (bank 6) |
| Pino 58 | I/O — User I/O (bank 6) |
| Pino 59 | I/O — User I/O (bank 6) |
| Pino 60 | I/O — User I/O (bank 6) |
| Pino 61 | I/O — User I/O (bank 6) |
| Pino 62 | I/O — User I/O (bank 6) |
| Pino 63 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 64 | I/O — User I/O (bank 6) |
| Pino 65 | I/O — User I/O (bank 6) |
| Pino 66 | I/O — User I/O (bank 6) |
| Pino 67 | I/O — User I/O (bank 6) |
| Pino 68 | I/O — User I/O (bank 7) |
| Pino 69 | I/O — User I/O (bank 7) |
| Pino 70 | I/O — User I/O (bank 7) |
| Pino 71 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 72 | I/O — User I/O (bank 7) |
| Pino 73 | I/O — User I/O (bank 7) |
| Pino 74 | I/O — User I/O (bank 7) |
| Pino 75 | I/O — User I/O (bank 7) |
| Pino 76 | I/O — User I/O (bank 7) |
| Pino 77 | I/O — User I/O (bank 7) |
| Pino 78 | GND — Ground |
| Pino 79 | I/O — User I/O (bank 8) |
| Pino 80 | I/O — User I/O (bank 8) |
| Pino 81 | I/O — User I/O (bank 8) |
| Pino 82 | I/O — User I/O (bank 8) |
| Pino 83 | I/O — User I/O (bank 8) |
| Pino 84 | I/O — User I/O (bank 8) |
| Pino 85 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 86 | I/O — User I/O (bank 8) |
| Pino 87 | I/O — User I/O (bank 8) |
| Pino 88 | I/O — User I/O (bank 8) |
| Pino 89 | I/O — User I/O (bank 8) |
| Pino 90 | I/O — User I/O (bank 8) |
| Pino 91 | VCCINT — Core voltage supply (1.2V) |
| Pino 92 | VCCINT — Core voltage supply (1.2V) |
| Pino 93 | GND — Ground |
| Pino 94 | I/O — User I/O (bank 1) |
| Pino 95 | I/O — User I/O (bank 1) |
| Pino 96 | I/O — User I/O (bank 1) |
| Pino 97 | I/O — User I/O (bank 1) |
| Pino 98 | I/O — User I/O (bank 1) |
| Pino 99 | I/O — User I/O (bank 1) |
| Pino 100 | MSEL0 — Configuration mode select 0 |
| Pino 101 | MSEL1 — Configuration mode select 1 |
| Pino 102 | MSEL2 — Configuration mode select 2 |
| Pino 103 | MSEL3 — Configuration mode select 3 |
| Pino 104 | nCONFIG — Configuration control (active-low) |
| Pino 105 | nSTATUS — Configuration status (active-low) |
| Pino 106 | CONF_DONE — Configuration done indicator |
| Pino 107 | DCLK — Configuration clock |
| Pino 108 | DATA0 — Configuration data bit 0 |
| Pino 109 | DATA1 — Configuration data bit 1 |
| Pino 110 | DATA2 — Configuration data bit 2 |
| Pino 111 | DATA3 — Configuration data bit 3 |
| Pino 112 | DATA4 — Configuration data bit 4 |
| Pino 113 | DATA5 — Configuration data bit 5 |
| Pino 114 | DATA6 — Configuration data bit 6 |
| Pino 115 | DATA7 — Configuration data bit 7 |
| Pino 116 | TCK — JTAG test clock |
| Pino 117 | TMS — JTAG test mode select |
| Pino 118 | TDI — JTAG test data in |
| Pino 119 | TDO — JTAG test data out |
| Pino 120 | nCE — Chip enable (active-low, multi-device chains) |
| Pino 121 | nCEO — Chip enable out (active-low, multi-device chains) |
| Pino 122 | CLK0 — Clock input 0 (PLL reference) |
| Pino 123 | CLK1 — Clock input 1 |
| Pino 124 | CLK2 — Clock input 2 |
| Pino 125 | CLK3 — Clock input 3 |
| Pino 126 | I/O — User I/O (bank 8) |
| Pino 127 | I/O — User I/O (bank 8) |
| Pino 128 | I/O — User I/O (bank 8) |
| Pino 129 | I/O — User I/O (bank 8) |
| Pino 130 | I/O — User I/O (bank 8) |
| Pino 131 | I/O — User I/O (bank 8) |
| Pino 132 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 133 | I/O — User I/O (bank 8) |
| Pino 134 | I/O — User I/O (bank 8) |
| Pino 135 | I/O — User I/O (bank 8) |
| Pino 136 | I/O — User I/O (bank 1) |
| Pino 137 | I/O — User I/O (bank 1) |
| Pino 138 | I/O — User I/O (bank 1) |
| Pino 139 | I/O — User I/O (bank 1) |
| Pino 140 | I/O — User I/O (bank 1) |
| Pino 141 | I/O — User I/O (bank 1) |
| Pino 142 | I/O — User I/O (bank 1) |
| Pino 143 | I/O — User I/O (bank 1) |
| Pino 144 | I/O — User I/O (bank 1) |
Aplicações típicas
EP3C10E144I7 é adequado para 7 aplicaçãos: Industrial Motor Control, Video Format Bridge / Display Controller, PCI / PCIe Protocol Bridge, Consumer Electronics - Smart Appliance Controller, Education / Development Platform / FPGA Prototyping, Test and Measurement Front-End, Communications - Telecom Interface Card.
Industrial Motor Control
The EP3C10E144I7's combination of 23 dedicated 18x18 multipliers, 94 user I/O pins, and industrial temperature rating (-40C to +100C) makes it well-suited for sensorless FOC motor controllers driving BLDC and PMSM motors up to several kW. The 10,320 logic elements provide sufficient capacity for PWM generators, current sense decoders, and encoder/CAN interfaces, while the four PLLs generate jitter-clean clocks for high-resolution PWM. At 65nm process, quiescent current is low enough for cabinet-mounted drives. Place the exposed pad over a continuous ground copper pour sized at least 25mm x 25mm on both top and inner layers to maintain junction temperature under load.
Recomendado
Video Format Bridge / Display Controller
The EP3C10E144I7 handles real-time video conversion between formats (RGB->LVDS, HDMI->MIPI, parallel->V-by-One HS) with sufficient bandwidth from its M9K memory blocks. A 1280x720@60Hz stream at 24 bits/pixel requires roughly 22 Mbps throughput, well within the fabric's capability. The 94 user I/O pins support multi-channel LVDS pairs needed for high-resolution panels. Designers typically instantiate DDR2 or LPDDR controllers on this device for frame buffer memory, with the embedded multipliers assisting color-space conversion. The 144-LQFP package supports hand-assembled prototypes and reflow-compatible production builds equally well.
Recomendado
PCI / PCIe Protocol Bridge
Use the EP3C10E144I7 to bridge legacy PCI or parallel local buses to modern serial interfaces. With 10K logic elements and 23 multipliers, the device comfortably implements a 32-bit/33MHz PCI target plus a custom peripheral (UART, SPI, I2C, GPIO expansion). The 4 PLLs generate the 33MHz PCI clock plus application clocks, while 94 user I/Os provide ample margin for PCI bus plus debug headers. The industrial temperature range allows deployment in factory PCs and embedded controllers. Quartus II includes a free PCI Compiler megafunction that synthesizes verified compliant targets.
Recomendado
Consumer Electronics - Smart Appliance Controller
The EP3C10E144I7 is well-matched to smart appliance main boards (washing machines, dishwashers, induction cooktops) where it acts as both user-interface controller (driving segment LCDs, touch keypads, buzzer PWM) and appliance controller (relay drivers, sensor I/O, motor control). The industrial temperature range covers under-cabinet and garage installations. Nios II soft-core can run RTOS-based user interface firmware alongside custom logic for safety interlocks. The exposed-pad 144-LQFP is hand-solder-friendly for prototype runs of 10-100 units.
Recomendado
Education / Development Platform / FPGA Prototyping
The EP3C10E144I7 is the standard device for Cyclone III starter kits (Terasic DE0-Nano-style boards), making it the de-facto training vehicle for first-time FPGA users. With 10K logic elements, students can complete full processor cores (Nios II/e), RISC-V implementations, and modest image processing pipelines within a single device. Quartus II Web Edition supports the part free of charge. The 144-LQFP is easy to handle on breakout boards and through-hole adapter PCBs. Pin assignments are well-documented in reference designs, accelerating bring-up.
Recomendado
Test and Measurement Front-End
The EP3C10E144I7's 94 user I/Os and embedded multipliers make it a versatile front-end for low-speed digitizers, logic analyzers, and protocol exercisers (I2C/SPI/CAN/JTAG). At 65nm, input threshold sensitivity allows direct interfacing to 3.3V and 2.5V signals without external comparators. The four PLLs can synthesize baud-rate clocks on the fly for protocol generation, while 23 multipliers accelerate DSP blocks such as FIR filters and FFT butterflies for preprocessing acquired signals. Industrial temperature rating covers lab and field deployment.
Recomendado
Communications - Telecom Interface Card
The EP3C10E144I7 implements glue logic and protocol adaptation for telecom line cards, framing E1/T1 streams, implementing HDLC controllers, and providing 8-bit parallel interfaces to legacy ASICs. The 23 multipliers handle FEC and convolutional encoding/decoding, while 4 PLLs derive multiple clock domains from a single 19.44MHz telecom reference. Industrial temperature range is appropriate for central-office and outdoor-cabinet deployments. The 144-LQFP footprint is widely accepted by telecom ODM partners.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C10E144I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C10E144C8N | EP3C10E144C7N | EP3C10E144I7N | EP3C16E144I7 | EP3C10E144A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+49%) | 10,320 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +125C (Automotive) |
| Speed Grade | I7 (8 speed) | C8 (8 speed) | C7 (7 speed, slower) | I7 | I7 | A7 (automotive, 7 speed) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 423,936 bits |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Process / Family | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III (Automotive) |
Principais diferenciais
- Industrial temperature grade with fastest I7 speed grade (vs EP3C10E144C8N / EP3C10E144C7N)
- Pin-compatible with 16K LE upgrade for design headroom (vs EP3C16E144I7)
- Lower unit cost than larger LE-count Cyclone III variants (vs EP3C16E144I7 / EP3C25E144)
Notas de projeto
The EP3C10E144I7 requires a clean 1.2V core supply (VCCINT) plus per-bank VCCIO supplies (1.2V/1.5V/1.8V/2.5V/3.0V/3.3V depending on I/O standard). Decoupling requirements: place one 100nF X7R 0402 ceramic capacitor within 5mm of every VCCINT and VCCIO pin, plus a 10uF X5R 0805 bulk capacitor per supply rail. Estimated: at 50% toggle activity with all 94 I/Os switching at 100MHz, total ICCINT is approximately 200-400mA and ICCIO bank totals 100-300mA. Use a dedicated LDO (e.g., Linear LT3021 for VCCINT) and avoid sharing the FPGA core supply with analog or RF circuitry.
The 144-LQFP-Exposed-Pad package requires the exposed paddle to be soldered to a continuous copper pour on the PCB for thermal dissipation. Estimated: with theta_JA around 25-30 C/W for a properly-soldered exposed pad on a 4-layer board with 25mm x 25mm ground pour, the device can dissipate approximately 2-3W before requiring derating. For continuous 1W dissipation at 60C ambient, expect a junction temperature of approximately 85-90C - within the 100C industrial limit but leaving little headroom. Add thermal vias (10-16 vias, 0.3mm drill) under the exposed pad stitched to inner ground planes.
Plan configuration mode pins (MSEL[3:0]) early in schematic capture. Incorrect MSEL settings are the #1 cause of FPGA configuration failures. For JTAG-only configuration, tie MSEL[3:0] to 1010 (AS mode with third-party programmer support) or 0000 (JTAG-only). The nCONFIG pin should be pulled high to VCCIO through a 10k resistor. CONF_DONE can be left floating or pulled up to VCCIO with 10k for status monitoring. Reserve a 2x5 or 1x6 0.1-inch header for the JTAG connector - keep the trace from the FPGA TDI/TDO/TMS/TCK pins to the header under 2 inches to avoid signal integrity issues.
Do not connect I/O pins directly to signals exceeding the VCCIO voltage of their bank. Mixing 5V signals into a 3.3V bank destroys the I/O cell. Verify bank assignments in Quartus II Pin Planner before PCB layout. Additionally, differential pair (LVDS) signals must be routed as 100-ohm differential pairs with matched lengths (skew under 20ps) - do not route them as single-ended traces. For Nios II designs, plan for at least one EPCS4 or EPCS16 configuration flash, plus sufficient M9K blocks for the on-chip RAM and data caches.
Group high-speed clock and global signal traces on the top layer with a continuous ground plane underneath. Keep clock traces short and use 45-degree bends (avoid 90-degree turns). Separate analog and digital grounds if the FPGA interfaces to ADCs/DACs, joining them at a single point near the FPGA. For LVDS pairs, maintain 100-ohm differential impedance using a 4-layer stackup with controlled impedance (typical: 8mil trace/8mil space on FR4 with 1oz copper). Estimated trace width for 100-ohm differential on 0.5mm pitch packages is approximately 8-10 mils.
Informações de conformidade
RoHS-compliant per distributor product pages (Heisener, DigiKey). The I7 suffix denotes industrial temperature grade; AEC-Q100 qualification is NOT applicable - select EP3C10E144A7N for automotive-grade applications.
