EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel
N.º da peça: EP3CLS100U484C8 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $548.47 | $548,47 |
| 10 | $520 | $5.200,00 |
| 100 | $472 | $47.200,00 |
| 500 | $430 | $215.000,00 |
| 1.000 | $395 | $395.000,00 |
EP3CLS100U484C8 Visão geral
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, allowing hardware re-programmability. The Cyclone III LS family sits in the Intel FPGA hierarchy as follows: FPGA -> programmable logic device -> SRAM-based FPGA -> low-power FPGA with hardware security -> Cyclone series -> Cyclone III LS, optimized for industrial, automotive, and communications applications where both low static power and IP protection are required.
Key features of the EP3CLS100U484C8 include up to 100,448 logic elements, 4,451,328 bits of embedded RAM (M9K blocks), 66 embedded 18 x 18 multipliers, four PLLs, and 278 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and integrates dedicated hard IP for PCI Express (x1, x2, x4 Gen1) and external memory interfaces for DDR/DDR2/QDRII SRAM. Maximum internal operating frequency is specified at 402 MHz by manufacturer data.
The Cyclone III LS architecture combines a fine-grained 4-input LUT fabric with dedicated routing, on-chip termination (OCT), and a security co-processor for AES-256 bitstream encryption. Compared to the original Cyclone III family, the LS variant adds configuration bitstream authentication and active tamper-detection pins, allowing secure field upgrades and protection against cloning. Static power consumption is markedly reduced versus Cyclone III, enabling fan-less industrial designs.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver-assistance ECUs, secure communications equipment, and portable medical instrumentation. Its security block also makes it suitable for payment terminals and IP-protected embedded controllers.
When designing with this FPGA, follow the Intel Cyclone III LS Device Handbook recommended decoupling scheme (typically 100 uF + 10 uF + 100 nF per power rail) and respect the 0.8 mm BGA pitch constraints by using at least 6-layer PCB stack-up with microvia-in-pad for breakout routing.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP3CLS100U484C8 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3CLS100U484C8 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, RoHS Status, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3CLS100U484C8N
✅ Drop-In✓ Em estoque
$109.4 / unidade
Ver ficha técnica →EP3CLS100U484C7N
✅ Drop-In✓ Em estoque
$412.65 / unidade
Ver ficha técnica →EP3CLS100U484C7
✅ Drop-In✓ Em estoque
$520 / unidade
Ver ficha técnica →EP3CLS100F484I7N
✅ Drop-In✓ Em estoque
$67.9 / unidade
Ver ficha técnica →EP3CLS100F484I7
✅ Drop-In✓ Em estoque
$113.6 / unidade
Ver ficha técnica →EP3CLS100F484C8N
✅ Drop-In✓ Em estoque
$115.4 / unidade
Ver ficha técnica →EP3CLS100F484C8
✅ Drop-In✓ Em estoque
$148.45 / unidade
Ver ficha técnica →EP3CLS100F484C7N
✅ Drop-In✓ Em estoque
$495.8 / unidade
Ver ficha técnica →EP3CLS100U484C8 Classificações máximas e características elétricas
| Family | Cyclone III LS |
| Logic Elements (LE) | 100,448 |
| Number of Logic Blocks / CLBs | 100,448 |
| Embedded Memory (bits) | 4,451,328 |
| Maximum User I/O | 278 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| Maximum Internal Frequency | 402 MHz |
| Embedded Multipliers (18 x 18) | 66 |
| PLLs | 4 |
| Encapsulamento | UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch) |
| Configuration Modes | PS, FPP, JTAG |
| Security Features | AES-256 bitstream encryption, JTAG protection, tamper detection |
| Temperatura de operação | Commercial (0C to +85C), part suffix C8 |
| Speed Grade | C8 (commercial, 8) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP3CLS100U484C8 ufbga-484 (u484, 19 x 19 mm, 0.8 mm pitch)
Configuração de pinos para EP3CLS100U484C8 (pacote ufbga-484 (u484, 19 x 19 mm, 0.8 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3CLS100U484C8.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3CLS100U484C8 é adequado para 6 aplicaçãos: Industrial Motor Control & Factory Automation, Video Surveillance & Image Processing, Automotive Driver-Assistance ECUs, Secure Communications Equipment, Portable Medical Instrumentation, Payment Terminals & Secure Embedded Controllers.
Industrial Motor Control & Factory Automation
The EP3CLS100U484C8 fits industrial motor control and factory automation because it combines 100K logic elements, 66 embedded 18 x 18 multipliers, and four PLLs in a single device, replacing multiple MCUs or DSPs in multi-axis servo loops. Its 278 user I/Os at 0.8 mm BGA pitch comfortably drive simultaneous quadrature encoder inputs, PWM outputs to IGBT gate drivers, and EtherCAT / PROFINET side-band signals. The 65 nm low-power process keeps the device below 0.5 W static dissipation, enabling fan-less cabinet designs at 0-85C ambient. The 402 MHz internal fabric runs closed-loop current-control state machines at sub-microsecond update rates while leaving headroom for safety logic.
Recomendado
Video Surveillance & Image Processing
The EP3CLS100U484C8 is well suited to video surveillance and image processing pipelines because its 4,451,328 bits of embedded RAM store line buffers, frame headers, and look-up tables for real-time color-space conversion. The 66 dedicated 18 x 18 hardware multipliers accelerate Sobel, Laplacian, and motion-estimation kernels without consuming logic-element resources, while the four PLLs generate the pixel clock, memory clock, and DDR2 controller clock from a single 50 MHz reference. The LVDS I/O banks support direct interfacing to CMOS image sensors and HDMI/DVI sinks, eliminating external bridge chips. AES-256 bitstream encryption prevents firmware cloning in security-camera deployments.
Recomendado
Automotive Driver-Assistance ECUs
The EP3CLS100U484C8 supports automotive driver-assistance (ADAS) electronic control units because the Cyclone III LS family integrates a hardware security co-processor with AES-256 bitstream encryption and active tamper-detection pins that satisfy OEM IP-protection requirements. Its 100K logic elements and 66 multipliers perform sensor fusion across multiple camera, radar, and lidar streams in parallel, while the four PLLs lock low-jitter clocks to CAN-FD and FlexRay transceivers. Designers pair it with industrial-temperature variants (e.g., EP3CLS100F484I7N) for underhood mounting. Note that for fully automotive-qualified AEC-Q100 designs, Cyclone IV or Cyclone V devices are typically required.
Recomendado
Secure Communications Equipment
The EP3CLS100U484C8 suits secure communications equipment because its 278 user I/Os and built-in PCIe hard IP enable direct bridging to host processors over PCI Express x1/x2/x4 Gen1, while the four PLLs generate jitter-clean clocks for SERDES-style backplanes. AES-256 bitstream encryption plus JTAG access lockout prevent reverse engineering of the radio, baseband, or crypto-acceleration IP loaded into the fabric. The 4.4 Mbit embedded RAM is partitioned to maintain packet queues and FEC tables without external SRAM. The UFBGA-484 package provides the thermal headroom needed for sustained DSP workloads at full fabric utilization.
Recomendado
Portable Medical Instrumentation
The EP3CLS100U484C8 fits portable medical instrumentation because its 65 nm low-power process delivers full FPGA functionality at sub-500 mW static dissipation, extending battery runtime in handheld ultrasound, patient monitor, and point-of-care diagnostic devices. The 100K logic elements implement front-end DSP (FIR, decimation, envelope detection) and back-end HMI rendering in one device, eliminating a separate processor. The 484-ball BGA's compact 19 x 19 mm footprint fits small enclosures, while the four PLLs synchronize to USB, Bluetooth, and display refresh clocks. Cyclone III LS security features protect HIPAA-sensitive patient data stored in external memory.
Recomendado
Payment Terminals & Secure Embedded Controllers
The EP3CLS100U484C8 is well matched to payment terminals and secure embedded controllers because its hardware AES-256 engine encrypts configuration bitstreams at load time, while active tamper-detection pins can trigger zeroization on enclosure breach. The 4.4 Mbit embedded RAM is sufficient for transaction-pipeline buffers without exposing sensitive material to external DRAM. PCI-PTS-compliant firmware fits comfortably within 100K logic elements along with TRNG, RSA/ECC acceleration, and secure-key storage state machines. The 0.8 mm UFBGA package supports compact terminal form factors, and four PLLs generate clocks for contactless (NFC) and contact (EMV) smart-card interfaces.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3CLS100U484C8 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3CLS100U484C8N | EP3CLS100U484C7N | EP3CLS100U484C7 | EP3CLS100F484I7N | EP3CLS100F484I7 | EP3CLS100F484C8N | EP3CLS100F484C8 | EP3CLS100F484C7N |
|---|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | UFBGA-484 (U484) | UFBGA-484 (U484) | UFBGA-484 (U484) | UFBGA-484 (U484) | FBGA-484 (F484) - different pinout | FBGA-484 (F484) - different pinout | FBGA-484 (F484) - different pinout | FBGA-484 (F484) - different pinout | FBGA-484 (F484) - different pinout |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 |
| Max User I/O | 278 | 278 | 278 | 278 | 278 | 278 | 278 | 278 | 278 |
| Speed Grade | C8 | C8 | C7 | C7 | I7 | I7 | C8 | C8 | C7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Non-N (original) | Yes (lead-free) | Yes (lead-free) | No | Yes (lead-free) | No | Yes (lead-free) | No | Yes (lead-free) |
Principais diferenciais
- Lower entry price than lead-free N variant in commercial channel (vs EP3CLS100U484C8N)
- U484 UFBGA package option with different ball map than F484 (vs EP3CLS100F484C8N)
- Commercial temperature grade at lowest cost point (vs EP3CLS100F484I7N)
Notas de projeto
Decouple each Cyclone III LS power rail (VCCINT 1.2V, VCCA 2.5V, VCCIO 1.2-3.3V bank-dependent, VCCPD 2.5/3.3V) with a 100 uF bulk capacitor, 10 uF ceramic, and 100 nF high-frequency bypass placed as close to the BGA balls as the layout allows. Estimated: at typical Cyclone III LS core current of approximately 250-400 mA at 100 MHz fabric activity, the 1.2V rail alone draws 0.3-0.5 W. Use a four-layer PCB with dedicated power and ground planes for return-path integrity.
The UFBGA-484 package at 0.8 mm pitch requires microvia-in-pad PCB technology for reliable breakout routing. Use at least a 6-layer stack-up (signal-GND-signal-PWR-signal-GND) and place signal vias on a 0.4-0.5 mm pitch grid. The package's 19 x 19 mm body should have a keep-out zone of at least 0.5 mm around the BGA to allow for package warpage compensation during reflow. Apply ENIG surface finish to ensure reliable solder joint formation on BGA balls.
Do not confuse the U484 UFBGA package with the F484 FBGA package - they have different ball maps and pin assignments even though both are 484-ball BGA. The 'U' prefix designates the Ultra BGA with different mechanical dimensions than the 'F' standard BGA. Mixing the two packages will result in incorrect connections. Always verify the exact package code in the device ordering information before PCB layout. The pinout table in Chapter 9 of the Cyclone III LS Device Handbook is the authoritative reference.
Estimated: under typical operation at 25C ambient with moderate fabric utilization (~30-50%), the EP3CLS100U484C8 junction-to-ambient thermal resistance theta_JA is approximately 15-20 C/W for the UFBGA-484 package with a properly designed thermal pad footprint. At 0.5 W core dissipation, junction temperature rise above ambient is approximately 8-10 C. For designs operating at industrial temperature grades or with high sustained activity, follow the thermal management guidelines in the Cyclone III LS Device Handbook and consider adding thermal vias under the package center.
Informações de conformidade
The non-N variant is not lead-free; the N suffix variant is lead-free/RoHS-compliant. AEC-Q100 not qualified - for automotive designs, consider Cyclone IV or Cyclone V families. RoHS/REACH compliance status not explicitly stated in the verified distributor data.