EP3CLS200F484C7 - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
N.º da peça: EP3CLS200F484C7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2238.17 | $2.238,17 |
| 10 | $2125 | $21.250,00 |
| 25 | $1995 | $49.875,00 |
| 100 | $1850 | $185.000,00 |
| 250 | $1720 | $430.000,00 |
EP3CLS200F484C7 Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and programmable I/O elements surrounding a central fabric. The FPGA class sits hierarchically within programmable logic devices (PLDs), then within digital logic ICs, then within integrated circuits (ICs) and ultimately within semiconductors. Compared to an ASIC, an FPGA offers hardware-reconfigurable logic, shorter time-to-market, and in-field re-programmability. The Cyclone III LS sub-family is Intel's lower-power variant of the Cyclone III generation, targeted at cost-sensitive, power-constrained designs.
Key features of the EP3CLS200F484C7 include 198,464 logic elements, 8 Mbits of embedded memory (RAM bits), support for multiple I/O standards including LVDS, LVCMOS, SSTL and HSTL, and a low-power 1.2 V core supply. The device supports configuration via JTAG, passive serial, or active serial modes using commodity configuration memories. Its 484-ball FBGA package is the densest Cyclone III LS option in the family and is widely used on Altera/Intel Cyclone III development kits.
Typical applications include industrial motor control and machine vision, factory automation and protocol bridging, low-cost video processing pipelines, software-defined radio front-ends, and portable/handheld test equipment. The Cyclone III LS family is also commonly used as a prototyping vehicle for ASIC emulation and as a glue-logic replacement for multiple discrete CPLDs.
When designing with the EP3CLS200F484C7, carefully follow Intel's power-decoupling and PCB-layout recommendations (especially the on-board decoupling scheme for the VCCINT and VCCIO rails) to achieve the rated low-power performance. The Quartus II design software (legacy) or the maintained Intel Quartus Prime support packages are used for synthesis, place-and-route, and bitstream generation.
This page synthesizes current distributor pricing and stock, drop-in FPGA alternatives from the same Cyclone III LS family, and practical design notes not found in the standalone datasheet.
Alternativas drop-in para EP3CLS200F484C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3CLS200F484C7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Logic Elements (LE), Embedded Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3CLS200F484C7N
✅ Drop-In✓ Em estoque
$1650 / unidade
Ver ficha técnica →EP3CLS200F484C8N
✅ Drop-In✓ Em estoque
$1245 / unidade
Ver ficha técnica →EP3CLS200F484I7
✅ Drop-In✓ Em estoque
$3580 / unidade
Ver ficha técnica →EP3CLS200F484I7N
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP3CLS150F484C7
✅ Drop-In✓ Em estoque
$720 / unidade
Ver ficha técnica →EP3CLS150F484C7N
✅ Drop-In✓ Em estoque
$102.75 / unidade
Ver ficha técnica →EP3CLS200F484C7 Classificações máximas e características elétricas
| Family | Cyclone III LS |
| Logic Elements (LE) | 198,464 |
| Logic Array Blocks (LABs) | 12,408 |
| Embedded Memory (RAM bits) | 8,211,456 |
| Maximum User I/Os | 226 |
| DSP Blocks | 396 (18x18 multipliers) |
| PLLs | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
| Encapsulamento | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Process Technology | CMOS, low-power |
| Temperatura de operação | 0C to +85C (commercial, C7 speed grade) |
| Configuration Method | JTAG, Passive Serial, Active Serial |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do EP3CLS200F484C7 484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch
Configuração de pinos para EP3CLS200F484C7 (pacote 484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3CLS200F484C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3CLS200F484C7 é adequado para 6 aplicaçãos: Industrial Motor Control, Factory Automation and Protocol Bridging, Software-Defined Radio Front-End, Video Processing Pipelines, ASIC Emulation and Prototyping, Portable Test and Measurement.
Industrial Motor Control
The EP3CLS200F484C7 fits industrial motor control designs because its 198,464 logic elements, 396 18x18 DSP blocks, and 226 user I/Os are sufficient to host multi-axis field-oriented control (FOC) loops, encoder interfaces, and PWM generators on a single device. The 1.2 V low-power Cyclone III LS silicon reduces thermal load in sealed IP65 enclosures where cooling is restricted. With 4 PLLs and flexible VCCIO banks, designers can mix 3.3 V TTL encoder signals with 5 V-tolerant gate-driver interfaces without external level shifters. The commercial 0C-85C temperature range covers most factory-floor environments when paired with adequate enclosure cooling.
Recomendado
Factory Automation and Protocol Bridging
In factory automation, the EP3CLS200F484C7 acts as a multi-protocol gateway bridging Ethernet/IP, PROFINET, EtherCAT, RS-485, and CAN networks on a single fabric. Its 198K LEs allow simultaneous implementation of multiple soft-CPU cores (e.g., Nios II) alongside custom logic, while 8 Mbits of embedded RAM buffers message queues. I/O bank flexibility (1.2 V to 3.3 V) supports direct interfacing with industrial transceivers. The 484-FBGA footprint is well-supported by reference designs and dev-kits from the Cyclone III LS ecosystem, accelerating time-to-market.
Recomendado
Software-Defined Radio Front-End
The EP3CLS200F484C7 is well-suited for software-defined radio (SDR) baseband and digital up/down-conversion due to its 396 DSP blocks (18x18 multipliers), 4 PLLs, and high RAM bandwidth. Designers can implement digital down-converters (DDC), FIR filters, and FFT cores on a single fabric. The low-power 1.2 V core enables battery-powered portable SDR designs. Multiple VCCIO banks support direct connection to LVDS ADC/DAC pairs without external buffering, reducing BOM and board area. The commercial temperature grade is adequate for laboratory and field-portable SDR equipment.
Recomendado
Video Processing Pipelines
For video processing, the EP3CLS200F484C7's 198K LEs and 226 I/Os support multi-channel HD video pipelines including scaling, color-space conversion, and on-screen display overlay. Embedded RAM (8 Mbits) provides line buffering for real-time HD processing. LVDS support on the F484 package enables direct connection to LVDS-based camera sensors and display panels. The Cyclone III LS low-power profile suits embedded video appliances such as industrial panel PCs and digital signage controllers.
Recomendado
ASIC Emulation and Prototyping
The EP3CLS200F484C7 is widely used as an ASIC emulation vehicle for pre-silicon verification, where its 198K LEs can host partitioned ASIC RTL with predictable timing closure. Multiple devices can be cascaded via LVDS for larger ASIC designs. The mature Quartus II / Quartus Prime toolchain supports industrial ASIC emulation flows with debug cores such as SignalTap II. The 484-FBGA footprint is compatible with multiple standard ASIC-emulation daughter-cards in the Cyclone ecosystem.
Recomendado
Portable Test and Measurement
The EP3CLS200F484C7 fits portable test-and-measurement equipment because its low-power Cyclone III LS silicon reduces battery drain in handheld oscilloscopes, logic analyzers, and field probes. The 4 PLLs and 226 I/Os support multiple high-speed ADC/DAC channels with on-chip timing alignment. 396 DSP blocks enable real-time FFT and digital filtering. The F484 BGA package integrates easily into compact handheld form factors while providing sufficient logic density for complete signal-processing chains.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3CLS200F484C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3CLS200F484C7N | EP3CLS200F484C8N | EP3CLS200F484I7 | EP3CLS200F484I7N | EP3CLS150F484C7 | EP3CLS150F484C7N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 150,848 (-24%) | 150,848 (-24%) |
| Speed Grade | C7 | C7 | C8 (faster) | I7 (industrial) | I7 (industrial) | C7 | C7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Embedded Memory (RAM bits) | 8,211,456 | 8,211,456 | 8,211,456 | 8,211,456 | 8,211,456 | 6,127,104 | 6,127,104 |
| DSP (18x18) Blocks | 396 | 396 | 396 | 396 | 396 | 320 | 320 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principais diferenciais
- Highest-density Cyclone III LS silicon in the F484 footprint (vs EP3CLS150F484C7)
- Low-power Cyclone III LS sub-family positioning (vs EP3C120F484C7 (standard Cyclone III))
- Mature ecosystem with extensive reference designs (vs Newer Intel Cyclone IV / V families)
Notas de projeto
Estimated: at 100% toggle rate on all 198K LEs and full DSP utilization, the EP3CLS200F484C7 dissipates approximately 3-5 W dynamic plus static. Designers should provide at least 4 bulk capacitors (10 uF to 100 uF) and 20+ ceramic 0.1 uF / 1 nF decoupling capacitors across VCCINT, VCCIO and VCCPD rails, placed as close as possible to the BGA balls. Follow Intel's PDN (power distribution network) guidance in the Cyclone III handbook to minimize SSN and maintain signal integrity.
The F484 484-ball FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body - escape routing requires at least 4 PCB layers with microvias (HDI stack-up recommended). Place the BGA on the top side with all decoupling on the opposite side or in inner layers to minimize via stubs. Use a continuous ground plane under the device and stitch the perimeter with GND vias to suppress EMI. Maintain symmetry of the power and ground planes to reduce ground bounce.
Do not assume C7 and C8 speed grades are interchangeable - the C8 grade passes tighter timing at the cost of higher power. Industrial (I7) and commercial (C7) variants differ in temperature screening; substituting an I7 part on a commercial-only PCB is acceptable, but substituting C7 for I7 violates the temperature spec. Verify the configuration mode (JTAG / Passive Serial / Active Serial) matches the on-board configuration memory before generating the bitstream.
Estimated: at 4 W total power dissipation and a typical 484-FBGA theta-JA of approximately 18 C/W (still air, JEDEC test conditions), the junction temperature rises roughly 72C above ambient. For commercial 0C-85C operation, ambient must remain below approximately 13C unless airflow is provided. In sealed enclosures, derate the design to 70% utilization or apply forced-air cooling to keep Tj below 85C.
Informações de conformidade
RoHS compliant per Intel product page. Not AEC-Q100 qualified (industrial temperature grade I7 is available but not automotive-qualified). Lead-free per Intel product family policy. Cross-brand equivalents (e.g., Xilinx Spartan-6 LX150) do not share the F484 footprint and require PCB redesign.
