EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
N.º da peça: EP3SL70F780C4G ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $998.54 | $998,54 |
| 10 | $970 | $9.700,00 |
| 100 | $925 | $92.500,00 |
| 500 | $880 | $440.000,00 |
| 1.000 | $835 | $835.000,00 |
EP3SL70F780C4G Visão geral
An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device containing configurable logic blocks (CLBs/LABs/ALMs), programmable interconnect, and a hierarchy of embedded memory, multipliers (DSP blocks), and high-speed serial transceivers. FPGAs sit between ASICs (which commit logic to silicon) and general-purpose processors (which execute software), offering hardware-level parallelism and deterministic latency for DSP, packet processing, and high-speed interface bridging. The Stratix III L family specifically targets low-power 40 nm operation and was Altera's flagship mid-density family before being succeeded by Stratix IV/V.
Key features of the EP3SL70F780C4G include 27,000 ALMs, 2.57 Mbit embedded RAM, dedicated 18x18 multipliers for DSP workloads, up to 488 single-ended (or 244 differential) user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL I/O standards, and eight PLLs for clock management. Configuration is supported via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes, with built-in decryption for bitstream security.
The device uses a 1.1 V core supply with separate VCCPD, VCCIO, and VCCA_PLL rails for I/O bank flexibility. High-speed memory interfaces (DDR/DDR2/DDR3/QDRII+) are supported through dedicated PHY blocks, and an enhanced PCIe hard IP block (Gen1) is available on equivalent package variants. Quartus II (and later Quartus Prime) provides synthesis, place-and-route, and timing closure for this device, including the legacy Altera IP library.
Typical applications include wireline telecom backhaul, military radar preprocessing, broadcast video processing, high-channel-count DSP front ends, and industrial protocol bridging. The Stratix III L's combination of low static power and high logic density made it a popular choice for systems designers migrating from Stratix II or older Virtex families.
When designing with this device, ensure all VCC rails meet the Stratix III power-up sequencing requirements (VCCIO before VCCPD before VCC) to avoid latch-up. Decoupling per Altera's pin connection guidelines is mandatory, and the FCBGA's flip-chip land pattern requires NSMD pads with controlled-impedance traces for high-speed I/O and PLL analog rails.
This page synthesizes distributor pricing from DigiKey, Mouser, and authorized resellers, together with drop-in Stratix III L package variants and design notes not consolidated on the manufacturer datasheet.
Alternativas drop-in para EP3SL70F780C4G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL70F780C4G (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Series, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SL70F780C4
✅ Drop-In✓ Em estoque
$745.32 / unidade
Ver ficha técnica →EP3SL70F780C3G
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →EP3SL70F780C2G
✅ Drop-In✓ Em estoque
$1185 / unidade
Ver ficha técnica →EP3SL70F780C4N
✅ Drop-In✓ Em estoque
$1210 / unidade
Ver ficha técnica →EP3SL50F780C4G
✅ Drop-In✓ Em estoque
$499.4 / unidade
Ver ficha técnica →EP3SL70F780C4G Classificações máximas e características elétricas
| Family | Stratix III L |
| Logic Elements (LE) | 67,500 |
| Adaptive Logic Modules (ALM) | 27,000 |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) |
| Maximum User I/O | 488 |
| Encapsulamento | 780-ball FCBGA (Flip-Chip BGA) |
| Operating Supply Voltage (Core) | 1.1 V |
| Speed Grade | C4 (commercial) |
| Faixa de temperatura de operação | 0C to +85C (Commercial) |
| Tipo de montagem | Surface Mount (SMD/SMT) |
| Process Node | 40 nm TSMC low-power |
| Number of PLLs | 8 |
| Configuration Modes | PS, FPP, AS, JTAG |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do EP3SL70F780C4G
| Pino A1 | IO — General-purpose user I/O (bank 1) |
| Pino A2 | IO — General-purpose user I/O (bank 1) |
| Pino A3 | VCCIO1 — I/O bank 1 supply voltage |
| Pino B1 | IO — General-purpose user I/O (bank 1) |
| Pino B2 | IO — General-purpose user I/O (bank 1) |
| Pino B3 | GND — Ground |
Aplicações típicas
EP3SL70F780C4G é adequado para 6 aplicaçãos: Wireline Telecom Backhaul, Military Radar Preprocessing, Broadcast Video Processing, Industrial Protocol Bridging, Test & Measurement Instrumentation, Medical Imaging Front End.
Wireline Telecom Backhaul
The EP3SL70F780C4G's 67,500 logic elements, 2.57 Mbit embedded memory, and 488 I/Os make it well suited for wireline telecom backhaul and aggregation line cards where high logic density and parallel packet processing are required. The device's eight PLLs and DDR2/DDR3 PHY blocks support clock synthesis for multi-channel OTN/framing engines. Compared with an ASIC, the FPGA reduces NRE cost and allows in-field protocol updates across OTU2/OTU4 and Ethernet backhaul standards.
Recomendado
Military Radar Preprocessing
The EP3SL70F780C4G's dedicated 18x18 multipliers and high-throughput embedded RAM sustain real-time radar preprocessing such as pulse compression, moving target indication (MTI), and FFT engines. Its commercial 0-85C operating range suits ground- and ship-based installations; engineers can migrate to the industrial I-grade variant for harsher environments. The 488 I/Os expose multiple LVDS channels to ADC and DAC converters at the antenna interface.
Recomendado
Broadcast Video Processing
The EP3SL70F780C4G integrates well into broadcast video routers, format converters, and contribution encoders where the combination of 2.57 Mbit embedded memory and 488 I/Os sustains multi-channel SDI/HDMI/DisplayPort processing. Its LVDS-capable I/Os connect directly to HD-SDI deserializers, while the high logic count handles scaling, de-interlacing, and color-space conversion in real time. The C4 speed grade ensures deterministic frame-buffer latency for broadcast-grade output.
Recomendado
Industrial Protocol Bridging
The EP3SL70F780C4G bridges industrial protocols such as PROFINET, EtherCAT, Modbus TCP, and SERCOS III in factory automation gateways. Its 488 I/Os support multiple isolated RS-485, CAN, and Ethernet ports in parallel, while on-chip RAM buffers protocol translation tables. The C4 commercial speed grade fits indoor cabinet ambient temperatures, and the FCBGA package offers robust mechanical stability for vibration-prone industrial enclosures.
Recomendado
Test & Measurement Instrumentation
The EP3SL70F780C4G's high logic count and abundant DSP multipliers make it ideal for arbitrary waveform generators, logic analyzers, and protocol testers. 488 I/Os expose dense parallel test points to DUTs, and 2.57 Mbit embedded memory captures long waveform records without external DRAM in many cases. The eight PLLs generate low-jitter clocks required for high-speed serial test interfaces.
Recomendado
Medical Imaging Front End
The EP3SL70F780C4G is suitable for medical imaging front ends such as ultrasound beamformers, CT preprocessing, and MRI reconstruction engines where 18x18 DSP multipliers and high-bandwidth on-chip memory accelerate convolution and back-projection kernels. The 488 LVDS-capable I/Os connect directly to multi-channel ADC arrays; its deterministic latency is critical for real-time beamforming. Commercial 0-85C range suits cart-based medical systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL70F780C4G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SL70F780C4 | EP3SL70F780C3G | EP3SL70F780C2G | EP3SL70F780C4N | EP3SL50F780C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | ~50,000 (lower density) |
| Embedded Memory | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | 2.57 Mbit | ~2.0 Mbit (lower) |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C4 | C3 (slower) | C2 (slowest) | C4 | C4 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS Compliant | Yes | No (SnPb lead finish) | Yes | Yes | Yes (lead-free, non-halogen-free) | Yes |
Principais diferenciais
- Pin-for-pin identical to non-RoHS variant for legacy reorders (vs EP3SL70F780C4)
- Higher logic density than the EP3SL50F780C4G in the same package (vs EP3SL50F780C4G)
- Faster speed grade than C3/C2 variants (vs EP3SL70F780C3G)
Notas de projeto
Estimated: at full utilization of 67,500 LEs at 1.1 V core and 488 active LVCMOS25 I/Os, the EP3SL70F780C4G can dissipate 4-6 W. Designers should budget for at least 1 oz copper inner layers plus thermal vias under the FCBGA thermal balls to keep junction temperature within the 0C to +85C commercial range. Source: Stratix III power estimation spreadsheet, Altera AN 499.
Use NSMD (non-solder-mask-defined) BGA pads with 0.4-0.5 mm pitch for the FCBGA-780 package per the Stratix III pin connection guidelines. Match differential pair trace impedance to 100 ohm +/- 10% and length-match within 150 mils for LVDS channels. Decoupling: 0.1 uF X7R per VCC ball group, 10 uF bulk per rail, 4.7 uF near PLL analog balls.
Do not omit the Stratix III power-up sequence (VCCIO >= VCCPD >= VCC). Reverse sequencing can latch the I/O banks. Configuration mode pins MSEL[3..0] must be tied to VCCPD or GND per the configuration scheme selected. Pull CONFIG_DONE high with 1-10 kohm and use the nCONFIG/nSTATUS handshake correctly for multi-device JTAG chains.
For DDR2/DDR3 interfaces, route DQS strobe pairs first with length-matched byte lanes within +/- 25 mils. Use Stratix III external memory interface (EMIF) PHY constraints in Quartus II timing analyzer to validate setup/hold margins. Source: External Memory Interface Handbook, Stratix III volume.
Informações de conformidade
RoHS-compliant lead-free ('G' suffix) per Intel/Altera ordering information. Last-time-buy status means future orders may not be replenished; consider EP3SL70F780C4N (lead-free, non-halogen-free) or migration to Stratix IV/V for active lifecycle.