P3A1604UKAZ - 4-Bit Dual-Supply Level Translator 40Mbps | NXP
N.º da peça: P3A1604UKAZ ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.31 | $2,31 |
| 10 | $2.12 | $21,20 |
| 100 | $1.86 | $186,00 |
| 500 | $1.62 | $810,00 |
| 1.000 | $1.45 | $1.450,00 |
P3A1604UKAZ Visão geral
A voltage level translator (also called a level shifter or translating transceiver) is an interface IC that lets digital devices running at different supply rails communicate safely. In the system hierarchy, it sits in the signal-interface layer between an SoC or MCU and its peripherals, bridging advanced low-voltage process nodes to legacy 1.8 V, 2.5 V, or 3.3 V logic without damaging either side.
Key differentiating features include auto direction sensing, which eliminates the DIR control pin required by conventional transceivers - a major benefit for shared bidirectional buses such as I2C and I3C where direction changes dynamically. The wide 0.72 V VCCA floor supports cutting-edge 0.8 V and 1.0 V core-domain SoCs. Four independent channels with up to 40 Mbps throughput cover both slow open-drain buses and fast push-pull SPI lines in one package.
Architecturally, the P3A1604UK uses a dual-supply translating transceiver topology in which each channel senses the driving side automatically and reproduces the logic level on the opposite rail. This makes it suitable for mixed-voltage point-to-point and multidrop links between modern ASICs fabricated on advanced nodes and peripheral ICs still powered from higher rails.
Typical applications include I3C sensor buses in smartphones and wearables, I2C/SMBus management links in servers, SPI connections between low-voltage MCUs and 3.3 V flash or displays, and portable battery-powered systems where the tiny WLCSP footprint and low power consumption matter.
Design consideration: because the WLCSP ball pitch is extremely fine, PCB land pattern accuracy and solder-mask design must follow the manufacturer datasheet recommendations precisely; verify VCCA never exceeds VCCB-side sequencing constraints during power-up.
This page synthesizes distributor pricing, lifecycle data, and application guidance not consolidated in the manufacturer datasheet.
Alternativas drop-in para P3A1604UKAZ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
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| Função | Voltage Level Translator (Translating Transceiver) |
| Bits / Channels | 4-bit (4 channels) |
| Circuits | 1 |
| Direction Control | Bidirectional, auto direction sensing |
| Maximum Data Rate | 40 Mbps |
| VCCA Supply Range (Side A) | 0.72 V to 1.98 V |
| VCCB Supply Range (Side B) | 1.62 V to 3.63 V |
| Supported Protocols | I3C, I2C, SMBus, SPI |
| Encapsulamento | 12-WLCSP (1.06 mm x 1.41 mm) |
| Tipo de montagem | Surface Mount (WLCSP ball grid) |
| Packaging | Tape & Reel (T/R suffix) |
Guia de Configuração de Pinos do P3A1604UKAZ 12-wlcsp (1.06 mm x 1.41 mm)
Configuração de pinos para P3A1604UKAZ (pacote 12-wlcsp (1.06 mm x 1.41 mm)). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para P3A1604UKAZ.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P3A1604UKAZ é adequado para 6 aplicaçãos: I3C Sensor Bus in Smartphones and Wearables, Server SMBus / IPMB Management Links, SPI Links Between Low-Voltage MCUs and 3.3 V Peripherals, Automotive Body and Gateway ECU Mixed-Voltage Buses, Industrial IoT Sensor Nodes, Consumer Audio and Display Accessory Boards.
I3C Sensor Bus in Smartphones and Wearables
Modern smartphone and wearable SoCs are fabricated on advanced process nodes with core and I/O rails at or below 1.0 V, while many sensor ICs and PMIC peripherals still operate at 1.8 V or 3.3 V. The P3A1604UKAZ fits this gap exactly: its VCCA range of 0.72 V to 1.98 V covers the newest SoC I/O rails, and its VCCB range of 1.62 V to 3.63 V bridges to standard sensor supplies. Because I3C is a dynamically bidirectional bus, the auto direction sensing feature eliminates any need for host-controlled direction switching on the SDA line, and the 40 Mbps capability exceeds I3C SDR data rates. The 1.06 x 1.41 mm WLCSP occupies negligible board area in handset layouts. Place the translator close to the SoC and keep I3C trace stubs short to preserve signal integrity at bus speeds.
Recomendado
Server SMBus / IPMB Management Links
Server baseboards, BMC designs, and power-supply management rely heavily on SMBus (a 3.3 V derivative of I2C) to talk to hot-swap controllers, EEPROMs, and PMBus devices. Newer management ASICs and BMC SoCs increasingly use sub-1.2 V I/O, creating a level mismatch with the 3.3 V SMBus backplane. The P3A1604UKAZ translates cleanly between these domains: VCCA down to 0.72 V handles the management silicon, and VCCB up to 3.63 V handles the SMBus side with margin. Auto direction sensing is essential here because SMBus transactions reverse direction every byte, and a DIR-controlled translator would add firmware burden and failure modes. The four channels also allow translating SMBDAT/SMBCLK pairs of two independent buses with a single package, reducing BOM line items in dense server boards.
Recomendado
SPI Links Between Low-Voltage MCUs and 3.3 V Peripherals
SPI flash memory, displays, and ADCs commonly run at 3.0 V or 3.3 V, while next-generation MCUs and FPGAs operate their I/O at 1.2 V to 1.8 V. The P3A1604UKAZ provides four translated channels - exactly matching SPI's MOSI, MISO, SCLK, and CS signal count - so one device handles a complete SPI link. Its 40 Mbps capability comfortably supports typical SPI clock rates of 10 to 40 MHz. Although SPI is point-to-point, auto direction sensing means the same part can be reused in a shared-bus design without redesign, giving layout and BOM flexibility across product variants. The tiny WLCSP also lets the translator sit directly under or beside a fine-pitch BGA MCU, keeping translated trace lengths short and preserving setup/hold timing margins on high-speed SPI clocks.
Recomendado
Automotive Body and Gateway ECU Mixed-Voltage Buses
Automotive gateway ECUs pair high-performance MCUs (often 1.2 V to 1.8 V I/O) with 3.3 V or 5 V-tolerant sensors, LIN transceivers, and EEPROM devices. The P3A1604UKAZ's wide VCCB range up to 3.63 V interfaces the 3.3 V legacy domain, while VCCA down to 0.72 V covers the newest MCU nodes. Auto direction sensing suits shared diagnostic and configuration buses that reverse direction during service operations. In gateway applications the four channels can translate an I2C diagnostic bus plus two status lines simultaneously. Note that designers should confirm the operating temperature grade and AEC qualification status of the exact ordering code in the NXP datasheet before automotive release, and follow the WLCSP land-pattern rules to withstand board flex in under-hood-adjacent environments.
Recomendado
Industrial IoT Sensor Nodes
Industrial IoT nodes combine energy-harvesting or coin-cell power with mixed-voltage silicon: a sub-1.2 V MCU or wireless SoC plus 1.8 V to 3.3 V sensor and memory devices. The P3A1604UKAZ's low VCCA floor of 0.72 V supports aggressively scaled-down supply rails used to save power, while its VCCB side keeps standard 3.3 V peripherals in circuit. Auto direction sensing supports I2C sensor buses common in these nodes, and the 40 Mbps rating provides headroom for high-rate data paths such as SPI-connected ADCs in vibration or acoustic monitoring. The WLCSP's 1.06 x 1.41 mm footprint suits compact node form factors. Because every microwatt matters in battery designs, verify quiescent and dynamic current figures in the NXP datasheet when budgeting node lifetime.
Recomendado
Consumer Audio and Display Accessory Boards
Consumer audio accessories and display daughter boards frequently mix a 1.8 V host interface with 3.3 V codecs, touch controllers, and EEPROM configuration memory. The P3A1604UKAZ translates I2C control buses between these domains without host-side direction management, since auto direction sensing follows the bus master dynamically. Its four-channel count covers SDA/SCL plus two auxiliary enable or interrupt lines, letting a single package manage the full control plane of an accessory board. The 40 Mbps data rate adds future headroom for I3C-based peripheral discovery being adopted in newer smartphone accessory ecosystems. Board designers should follow NXP's WLCSP assembly guidance strictly, as the fine ball pitch demands precise stencil design and reflow profiles to avoid bridging in high-volume accessory manufacturing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P3A1604UKAZ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto |
|---|---|
| Package | 12-WLCSP (1.06 x 1.41 mm) |
| Brand | NXP Semiconductors |
| Bits / Channels | 4 |
| VCCA Range | 0.72 V to 1.98 V |
| VCCB Range | 1.62 V to 3.63 V |
| Max Data Rate | 40 Mbps |
| Direction Control | Auto direction sensing |
| Protocols | I3C, I2C, SMBus, SPI |
Principais diferenciais
- Ultra-low 0.72 V VCCA floor (vs Legacy 4-bit translators with 1.2 V or 1.65 V low-side minimum)
- Auto direction sensing (vs DIR-pin-controlled transceivers)
- Smallest-in-class WLCSP footprint (vs SOIC-8/TSSOP-12/16 4-bit level shifters)
Notas de projeto
The P3A1604UKAZ uses a 12-ball WLCSP measuring only 1.06 x 1.41 mm, so the land pattern and solder-mask opening tolerances are the primary assembly risk. Follow the NXP datasheet land-pattern recommendation exactly, use a solder-mask-defined (SMD) or non-SMD pad as specified, and verify stencil aperture design with your assembly house. Route translated traces with short, direct paths and keep VCCA/VCCB decoupling capacitors (typically 100 nF per rail) within 1-2 mm of the balls. Confirm the exact ball map and decoupling values in the official P3A1604UK datasheet PDF before layout release.
Power both rails within their rated windows: VCCA 0.72 V to 1.98 V and VCCB 1.62 V to 3.63 V. Because VCCA can legitimately be lower than VCCB by a wide margin, check the datasheet power-up sequencing section for any constraint on rail ramp order and add a pull-up or reset supervisor if sequencing is undefined in your system. During brownout, ensure both rails collapse predictably to avoid latch-up or partial logic levels on the bus. Measure actual rail tolerances including load transient droop before finalizing the design.
Auto direction sensing depends on each channel detecting the driving side; excessive bus capacitance, strong pull-ups, or slow edges can cause direction-detection ambiguity on shared buses like I2C and I3C. Keep bus capacitance within the limits stated in the datasheet, size I2C pull-up resistors appropriately for the rail voltages on each side, and avoid stub topologies. On SPI channels, keep clock-to-data skew low by length-matching translated traces. Bench-validate direction switching at your maximum bus frequency and worst-case capacitive loading.
Informações de conformidade
Compliance data (RoHS/REACH/lead-free/halogen-free) was not stated in the provided verified web data and must be confirmed from the NXP product page or datasheet before release. AEC-Q100 applicability not stated for this part number.
