PIC16F18426-E/JQ - 8-Bit 32MHz 28KB Flash XLP MCU | Microchip
N.º da peça: PIC16F18426-E/JQ ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.85 | $1,85 |
| 10 | $1.68 | $16,80 |
| 100 | $1.52 | $152,00 |
| 500 | $1.37 | $685,00 |
| 1.000 | $1.2 | $1.200,00 |
PIC16F18426-E/JQ Visão geral
An 8-bit microcontroller (MCU) is a compact computing engine that integrates a CPU, RAM, program memory, and peripherals on a single silicon die. PIC microcontrollers from Microchip use a modified Harvard RISC architecture optimized for deterministic real-time control. Within the broader taxonomy, the PIC16F18426 sits as an 8-bit MCU -> microcontroller -> embedded controller -> semiconductor IC. XLP variants add power-saving modes (sleep currents in the nanoamp range) suited to battery-powered end equipment.
Key features of the PIC16F18426 include 28 KB Flash with device-level data EEPROM emulation, 2 KB SRAM, a 12-bit ADCC supporting automated averaging and filtering, hardware limit timers, a Zero-Cross Detect (ZCD) module, an on-chip temperature indicator, a Fixed Voltage Reference (FVR), and Core Independent Peripherals (CIPs) that offload tasks from the CPU. The integrated CWG simplifies complementary PWM generation for half-bridge and full-bridge power stages.
Operating from 1.8 V to 5.5 V, the PIC16F18426 supports industrial temperature ranges (-40C to +125C), nanopower sleep modes, and rich interrupt-driven I/O. The 16-UQFN package footprint is well suited to compact IoT nodes, sensor conditioning, and consumer appliances where board area is constrained and pin count above 14 is acceptable.
Typical applications include IoT sensor nodes, battery-powered remote controls, LED lighting controllers, low-power wireless companion MCUs, small appliance controls, and safety-critical embedded systems. The combination of XLP sleep currents, integrated analog, and Functional Safety features makes the device especially attractive for portable and always-on designs. When designing with this MCU, use Microchip's MPLAB X IDE with XC8 compiler and ensure decoupling capacitors are placed within 3 mm of the VDD pin to maintain ADC accuracy in mixed-signal layouts.
Alternativas drop-in para PIC16F18426-E/JQ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F18426-E/JQ (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, Data EEPROM, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F18425-I/JQ
✅ Drop-In✓ Em estoque
$1.55 / unidade
Ver ficha técnica →PIC16F18426-I/JQ
✅ Drop-In✓ Em estoque
$1.28 / unidade
Ver ficha técnica →PIC16F18424-I/JQ
✅ Drop-In✓ Em estoque
$1.2 / unidade
Ver ficha técnica →PIC16F18425-E/JQ
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F18426-E/JQ Classificações máximas e características elétricas
| Core Architecture | 8-bit PIC16 RISC (modified Harvard) |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data SRAM | 2 KB |
| Data EEPROM | 256 bytes (Flash-emulated) |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC with computation |
| DAC | 5-bit DAC |
| PWM Channels | 2 (10-bit) |
| Comparator | Yes |
| Encapsulamento | 16-UQFN (4x4 mm) with exposed pad |
| Temperatura de operação | -40 C to +125 C (E suffix) |
| Communication | EUSART, SPI, I2C |
| Special Features | XLP low-power, CWG, CIPs, ZCD, FVR, temperature indicator |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F18426-E/JQ
| Pino 1 | RA5 — GPIO / ADC input / IOC |
| Pino 2 | RA4 — GPIO / ADC input / IOC |
| Pino 3 | RA3 — GPIO / MCLR (input only) |
| Pino 4 | RA2 — GPIO / DAC output / comparator input |
| Pino 5 | RA1 — GPIO / ICSPCLK / ADC input |
| Pino 6 | RA0 — GPIO / ICSPDAT / ADC input |
| Pino 7 | VSS — Ground reference |
| Pino 8 | RB7 — GPIO / EUSART1 RX / ADC input |
| Pino 9 | RB6 — GPIO / EUSART1 TX / ADC input |
| Pino 10 | RB5 — GPIO / PWM output / ADC input |
| Pino 11 | RB4 — GPIO / PWM output / ADC input |
| Pino 12 | RB3 — GPIO / I2C SCL / ADC input |
| Pino 13 | RB2 — GPIO / I2C SDA / ADC input |
| Pino 14 | RB1 — GPIO / SPI SCK / ADC input |
| Pino 15 | RB0 — GPIO / SPI SDI / IOC |
| Pino 16 | VDD — Positive supply (1.8 V to 5.5 V) |
Aplicações típicas
PIC16F18426-E/JQ é adequado para 7 aplicaçãos: Battery-Powered IoT Sensor Nodes, Low-Power Remote Controls, LED Lighting and Smart Lighting Controllers, Small Appliance Control Boards, Functional Safety and Safety-Critical Embedded Systems, Consumer Electronics and Wearables, Industrial Sensor Transmitters and Data Loggers.
Battery-Powered IoT Sensor Nodes
The PIC16F18426-E/JQ is purpose-built for IoT sensor nodes that spend most of their lifetime in deep sleep and wake briefly to measure and transmit. Its XLP technology delivers nanoamp-level sleep currents while retaining RAM, allowing wake intervals of seconds to minutes on a single coin cell. The integrated 12-bit ADCC handles thermistor, battery-voltage, and environmental sensors without an external ADC, and the 5-bit DAC plus comparator support analog signal conditioning. At 1.85 USD qty-1 and 1.20 USD qty-1000, the device fits sub-5 USD node BOMs.
Recomendado
Low-Power Remote Controls
Handheld remote controls demand multi-year battery life, low BOM cost, and reliable IR or sub-GHz transmit. The PIC16F18426-E/JQ's XLP sleep currents below 100 nA extend coin-cell life past the 5-year mark, while the 32 MHz core and 28 KB Flash accommodate IR protocols (RC5, NEC, SIRC) or proprietary sub-GHz stacks. The 16-UQFN (4x4) footprint fits inside thin plastic enclosures, and the 5-bit DAC plus CWG can drive an IR LED directly with shaped PWM for improved EMI performance.
Recomendado
LED Lighting and Smart Lighting Controllers
Smart LED drivers require PWM generation, dimming curves, and temperature foldback without an external controller. The PIC16F18426-E/JQ provides two 10-bit PWM channels, the CWG for complementary drive of half-bridge FET stages, and the 12-bit ADCC for closed-loop current sensing through a shunt. Its 1.8-5.5 V operating range accepts direct Li-ion and 3.3 V logic rails, and XLP idle modes minimize standby power when the lamp is off but the switch remains connected.
Recomendado
Small Appliance Control Boards
Small kitchen and home appliances - coffee machines, blenders, induction cooktops - need a compact MCU with motor or heater control and safety supervision. The PIC16F18426-E/JQ's CWG and complementary PWM simplify BLDC and half-bridge heater drive, while the on-chip comparator supports zero-cross detection for triac-based AC loads. The -40 to +125 C operating temperature handles the heat of enclosed kitchen environments, and the Functional Safety (FuSa) features enable IEC 60730 Class B compliance for white goods.
Recomendado
Functional Safety and Safety-Critical Embedded Systems
The PIC16F18426-E/JQ's Functional Safety (FuSa) certification path makes it suitable for safety-critical embedded subsystems such as sensor supervision, redundant watchdog logic, and fail-safe actuator control. With IEC 61508 documentation packages available from Microchip, the device can be deployed in SIL-rated industrial sub-systems, automotive sub-systems, and medical accessory boards. The CRC, windowed WWDT, and memory self-test features support Class B diagnostic coverage.
Recomendado
Consumer Electronics and Wearables
Wearable devices such as fitness bands, hearables, and smart watches need an MCU that consumes minimal active current and integrates capacitive-touch-friendly peripherals. The PIC16F18426-E/JQ's Core Independent Peripherals (CIPs) handle capacitive touch sensing and LCD drive in hardware, freeing the CPU to sleep. The 16-UQFN (4x4 mm) package fits inside slim wearable form factors, and the 2 KB SRAM supports BLE stack command buffering with an external radio co-processor.
Recomendado
Industrial Sensor Transmitters and Data Loggers
Industrial 4-20 mA sensor transmitters, data loggers, and remote telemetry units benefit from the PIC16F18426-E/JQ's 12-bit ADCC with computation, hardware averaging, and oversampling - all without CPU intervention. The wide 1.8-5.5 V supply accepts 24 V loop power through an LDO or shunt regulator, and the 32 MHz core runs Modbus RTU, IO-Link device stacks, or SD card file systems. The -40 to +125 C rating ensures operation in unconditioned factory cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F18426-E/JQ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F18425-I/JQ | PIC16F18426-I/JQ | PIC16F18424-I/JQ |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-UQFN (4x4 mm) | 16-UQFN (4x4 mm) - same | 16-UQFN (4x4 mm) - same | 16-UQFN (4x4 mm) - same |
| Flash Memory | 28 KB | 14 KB (-50%) | 28 KB (same) | 7 KB (-75%) |
| SRAM | 2 KB | 1 KB (-50%) | 2 KB (same) | 512 B (-75%) |
| CPU Speed | 32 MHz | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| ADC | 12-bit ADCC | 12-bit ADCC (same) | 12-bit ADCC (same) | 12-bit ADCC (same) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Supply Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes |
Principais diferenciais
- Functional Safety (FuSa) certified silicon (vs PIC16F18324)
- 12-bit ADCC with computation (vs PIC16F18424-I/JQ)
- Extended -40C to +125C operating range (vs PIC16F18426-I/JQ)
- Core Independent Peripherals (CIPs) offload the CPU (vs PIC16F18324)
Notas de projeto
Place a 100 nF decoupling capacitor within 3 mm of the VDD pin and a bulk 1-10 uF tantalum or ceramic capacitor on the same rail to handle peak current transients during ADCC acquisition and PWM switching. The PIC16F18426-E/JQ datasheet recommends the 100 nF cap close to VDD; the bulk cap may be shared with other ICs if voltage drops are within 50 mV. Estimated: at 32 MHz active current of about 1.5 mA plus ADC and PWM duty, peak transients stay well below 10 mA, so a 1 uF bulk is sufficient in most designs.
The 16-UQFN package uses an exposed thermal pad that MUST be soldered to a continuous ground copper pour on the top layer with at least 8 thermal vias to the inner ground plane. Without the pad soldered, junction-to-ambient thermal resistance rises above 150 C/W, and at 32 MHz active current plus output drive, junction temperature can exceed 100 C in enclosed housings. Microchip's package land pattern drawing recommends a 2.0 mm x 2.0 mm pad array.
Keep analog signal traces (RA0/RA1/RA2) at least 5 mm away from PWM and digital switching traces (RB5/RB6/RB7) to preserve ADC SNR. Use a ground moat around the analog section if the design mixes 12-bit ADCC inputs with high-current PWM outputs driving motors or LEDs. This separation typically improves effective ENOB by 1-2 bits.
Do not float the MCLR pin - even though the PIC16F18426 supports internal weak pull-ups, leaving MCLR disconnected causes intermittent resets on noisy rails. Tie MCLR to VDD through a 10 kohm resistor with a 100 nF cap to ground for noise filtering. Failure to follow this guidance is the most common cause of PIC MCU brown-out behavior in field deployments.
If using the EUSART or SPI peripherals with high baud rates above 1 Mbps, keep trace lengths below 25 mm and use a 33 ohm series resistor at the driver pin to dampen reflections. The 16-UQFN package has minimal internal die capacitance, so external damping is necessary for signal integrity at clock rates beyond the microcontroller's own 32 MHz core.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. The E suffix denotes the extended industrial temperature grade -40C to +125C. IEC 60730 Class B (Functional Safety) software and hardware documentation packages are available from Microchip; AEC-Q100 is not separately listed for this part but the E temperature grade supports automotive under-hood prototyping.
