Microchip Technology

PIC24F32KA304-E/ML - 16-bit XLP MCU 32KB Flash 44-QFN | Microchip

N.º da peça: PIC24F32KA304-E/ML ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.8 V to 3.6 V Vdss nanoampere range (XLP technology) Id 44-pin QFN (8x8 mm) Package 32 MHz (16 MIPS) Speed 32 KB (11K x 24 words) Memory
A partir de $2.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-29
Preços por volume
Qtd. Preço unitário Total
1 $5.2 $5,20
10 $4.68 $46,80
100 $4.16 $416,00
500 $3.74 $1.870,00
1.000 $3.32 $3.320,00
3.000 $2.95 $8.850,00
ℹ️ Todos os preços estão em USD

PIC24F32KA304-E/ML Visão geral

The Microchip PIC24F32KA304-E/ML is a 16-bit microcontroller from the PIC24F XLP family featuring eXtreme Low Power consumption, 32 KB of Flash program memory, 2 KB of RAM, and 512 bytes of EEPROM, housed in a 44-pin QFN (8x8 mm) package. It operates at up to 32 MHz delivering 16 MIPS, with a 12-bit ADC and on-chip Charge Time Measurement Unit (CTMU) for capacitive touch and precise timing.

A 16-bit microcontroller is a microprocessor core with a 16-bit data path, 16-bit registers, and a 16-bit instruction word architecture optimized for embedded control. Within the broader taxonomy, the PIC24F belongs to the 8/16-bit MCU category -> general-purpose microcontroller -> embedded controller -> semiconductor IC. Its 16-bit architecture sits between 8-bit MCUs (8051, AVR, PIC18) and 32-bit ARM Cortex-M cores, offering a balance of computational throughput, deterministic interrupt response, and code density for power-constrained embedded systems.

Key features of this part include the nanoWatt XLP technology that enables Deep Sleep currents in the nanoampere range, peripherals such as DSBOR, DSWDT, and RTCC that keep running in Deep Sleep, and the integrated CTMU for touch sensing and precise time measurement. The 12-bit ADC supports up to 16 channels on the 44-pin device, providing accurate sensor measurements for instrumentation and battery monitoring applications.

The architecture uses a modified Harvard structure with separate program and data buses, a hardware multiplier, and a barrel shifter, allowing single-cycle MAC operations. The "-E" suffix denotes the Extended (-40C to +125C) operating temperature grade, while the "/ML" suffix designates the 44-pin QFN package with an exposed thermal pad suitable for reflow soldering on standard SMT lines.

Typical applications include IoT sensor nodes, battery-powered wearables, energy harvesting systems, industrial sensor interfaces, and consumer electronics requiring low standby current. The wide operating voltage range and ultra-low-power Deep Sleep modes make the part particularly suitable for products that must run for years on a single coin cell or AA battery.

When designing with this part, ensure the exposed pad of the QFN package is soldered to the PCB ground plane for both thermal dissipation and electrical grounding. The device supports programming via ICSP (In-Circuit Serial Programming) and JTAG, allowing firmware updates without removing the MCU from the board.

This page synthesizes distributor pricing, package-pinned drop-in alternatives within the PIC24F KA family, and practical low-power design notes not consolidated in the manufacturer datasheet.

Alternativas drop-in para PIC24F32KA304-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC24F32KA304-E/ML (mesmo formato e footprint) — diferindo em Package, Core Architecture, Program Memory (Flash), ADC, EEPROM.

Microchip Technology
Package: 44-pin QFN (8x8 mm) with EP
Core Architecture: PIC24F (16-bit modified Harvard)
Program Memory (Flash): 16 KB (5.5K x 24)
Microchip Technology
Package: 44-QFN (8x8 mm)
Core Architecture: PIC24F (16-bit modified Harvard)

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC24F32KA304-I/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm)
PIC24F (16-bit modified Harvard) · PIC24F XLP 24F · 32 KB (11K x 24 words) · 32 MHz · 1.8 V to 3.6 V · 17 · 44-QFN (8x8 mm)

✓ Em estoque

$3.21 / unidade

Ver ficha técnica →

PIC24FV32KA304-I/ML

✅ Drop-In
📦 44-pin QFN (8x8 mm)
FV variant supports 5.5V supply vs 3.6V max for F variant, same family/peripherals

📋 Alternativa de referência (fora do catálogo)

PIC24F32KA304-E/PT

✅ Drop-In
📦 44-pin TQFP
Same die, TQFP-44 footprint vs QFN-44 - different PCB land pattern but pinout identical

📋 Alternativa de referência (fora do catálogo)

PIC24FJ64KA304-I/ML

✅ Drop-In
📦 44-pin QFN (8x8 mm)
64KB Flash vs 32KB Flash (+100% program memory), otherwise same peripheral set and pinout

📋 Alternativa de referência (fora do catálogo)

PIC24F16KA304-I/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm)
PIC24F (16-bit modified Harvard) · 32 MHz (16 MIPS) · 16 KB (5.5K x 24) · 2 KB · 512 B · 1.8 V to 3.6 V · 39 · 12-bit

✓ Em estoque

$1.85 / unidade

Ver ficha técnica →

PIC24F32KA304-E/ML Classificações máximas e características elétricas

Family PIC24F XLP
Core Architecture 16-bit Modified Harvard
Program Memory (Flash) 32 KB (11K x 24 words)
RAM 2 KB
EEPROM 512 bytes
Maximum CPU Speed 32 MHz (16 MIPS)
ADC 12-bit, up to 16 channels
Tensão de alimentação 1.8 V to 3.6 V
Operating Temperature (E grade) -40C to +125C
Encapsulamento 44-pin QFN (8x8 mm)
Tipo de montagem Surface Mount
CTMU (Charge Time Measurement Unit) Yes
Deep Sleep Current nanoampere range (XLP technology)
Status RoHS Compliant
Programming Interface ICSP / JTAG

Configuração de pinos do PIC24F32KA304-E/ML

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 RP5/RESET — Remappable I/O / Reset input
Pino 2 RP6/SDA1 — Remappable I/O / I2C SDA
Pino 3 RP7/SCL1 — Remappable I/O / I2C SCL
Pino 4 RP8 — Remappable I/O
Pino 5 VSS — Ground reference
Pino 6 RP9 — Remappable I/O
Pino 7 RP10 — Remappable I/O
Pino 8 RP11 — Remappable I/O
Pino 9 RP12 — Remappable I/O
Pino 10 RP13 — Remappable I/O
Pino 11 VDD — Positive supply voltage
Pino 12 RP14 — Remappable I/O
Pino 13 RP15 — Remappable I/O
Pino 14 RP0 — Remappable I/O
Pino 15 RP1 — Remappable I/O
Pino 16 RP2 — Remappable I/O
Pino 17 RP3 — Remappable I/O
Pino 18 RP4 — Remappable I/O
Pino 19 AN0 — Analog input channel 0
Pino 20 AN1 — Analog input channel 1
Pino 21 AN2 — Analog input channel 2
Pino 22 AN3 — Analog input channel 3
Pino 23 AN4 — Analog input channel 4
Pino 24 AN5 — Analog input channel 5
Pino 25 AN6 — Analog input channel 6
Pino 26 AN7 — Analog input channel 7
Pino 27 AN8 — Analog input channel 8
Pino 28 AN9 — Analog input channel 9
Pino 29 AN10 — Analog input channel 10
Pino 30 AN11 — Analog input channel 11
Pino 31 AN12 — Analog input channel 12
Pino 32 AN13 — Analog input channel 13
Pino 33 AN14 — Analog input channel 14
Pino 34 AN15 — Analog input channel 15
Pino 35 OSCI — Crystal oscillator input
Pino 36 OSCO — Crystal oscillator output
Pino 37 SOSCI — Secondary oscillator input (RTCC)
Pino 38 SOSCO — Secondary oscillator output (RTCC)
Pino 39 VCAP — Voltage regulator bypass capacitor
Pino 40 PGEC1 — ICSP clock / ICD clock
Pino 41 PGED1 — ICSP data / ICD data
Pino 42 PGEC2 — Alternate ICSP clock
Pino 43 PGED2 — Alternate ICSP data
Pino 44 MCLR — Master clear / reset input

Aplicações típicas

PIC24F32KA304-E/ML é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, Wearable Health & Fitness Devices, Industrial Sensor Interfaces, Energy Harvesting Systems, Capacitive Touch User Interfaces, Remote Controls & Wireless Key Fobs.

🧩

Battery-Powered IoT Sensor Nodes

The PIC24F32KA304-E/ML is engineered for IoT sensor nodes requiring multi-year battery life, leveraging Microchip's nanoWatt XLP technology with Deep Sleep currents in the nanoampere range. Its 32 KB Flash accommodates typical sensor-fusion and LoRaWAN/BLE protocol stacks, while the integrated 12-bit ADC and CTMU enable direct interface with analog sensors and capacitive touch elements without external components. The RTCC, DSBOR, and DSWDT peripherals continue operating in Deep Sleep, allowing scheduled wake-up for periodic measurements at intervals of seconds to hours. At 32 MHz delivering 16 MIPS, the core handles local processing of sensor data before transmission, reducing radio-on time and extending battery life. The 44-pin QFN package's 8x8 mm footprint fits compact wireless modules. This makes the part ideal for wireless environmental monitors, smart agriculture soil sensors, and asset tracking tags.

📱

Wearable Health & Fitness Devices

Wearable health monitors benefit from the PIC24F32KA304-E/ML's combination of 16 MIPS performance, 12-bit ADC for biosignal acquisition, and nanoWatt XLP Deep Sleep modes. The CTMU can be configured to drive capacitive touch electrodes for user interfaces and to perform accurate pulse timing measurements. Operating from 1.8 V to 3.6 V supports direct connection to single-cell Li-ion batteries without an LDO, while the Extended -40C to +125C temperature grade accommodates body-worn and skin-contact thermal conditions. The 32 KB Flash and 2 KB RAM are sufficient for heart-rate algorithms, step counting, and BLE stack integration. The compact 44-pin QFN enables small form-factor wearables.

🏭

Industrial Sensor Interfaces

The PIC24F32KA304-E/ML suits industrial 4-20 mA loop-powered sensor interfaces and HVAC control modules. The 12-bit ADC with up to 16 channels multiplexes multiple analog inputs including temperature, pressure, and flow transducers. The Extended -40C to +125C operating range handles unheated enclosures, factory floors, and outdoor cabinets. The 32 MIPS performance executes PID loops and MODBUS protocol stacks with deterministic timing. Integrated peripherals such as UART, I2C, and SPI reduce BOM cost versus discrete implementations, and the on-chip CTMU enables precise resistance/capacitance measurements for bridge-type sensors.

⚡

Energy Harvesting Systems

Energy harvesting designs - solar, vibration, thermal - require MCUs that draw minimal standby current while still supporting periodic sensor sampling and wireless transmission. The PIC24F32KA304-E/ML's nanoWatt XLP Deep Sleep current in the nanoampere range enables harvested-energy budgets in the tens of microwatts. The 1.8 V minimum supply supports direct connection to supercapacitors and small Li-ion cells. The 16 MIPS core executes sensor readout, data compression, and radio packet preparation quickly, minimizing active time. The CTMU can be used for vibration energy measurement via piezo sensor interface, closing the energy-budget feedback loop.

🎧

Capacitive Touch User Interfaces

The PIC24F32KA304-E/ML's integrated CTMU provides precise time measurement for capacitive touch sensing, supporting buttons, sliders, and proximity sensors in appliance and consumer product front panels. The 16 MIPS core handles debouncing, gesture recognition, and PWM-driven LED feedback in real time. With 32 KB Flash, complex touch libraries and custom UI state machines fit without external memory. The 12-bit ADC and CTMU combination also supports resistive touch screens for low-cost HMI panels. The Extended temperature grade ensures operation in appliance interiors and automotive cabin environments.

🎥

Remote Controls & Wireless Key Fobs

Battery-powered remote controls for consumer electronics, security systems, and automotive key fobs benefit from the PIC24F32KA304-E/ML's low standby current and integrated peripherals. The nanoWatt XLP Sleep modes extend coin-cell life to multiple years, while the 16 MIPS core handles rolling-code encryption, button matrix scanning, and RF transmission timing. The CTMU provides reliable wake-on-touch without external components. The compact 44-pin QFN (8x8 mm) footprint fits inside slim key fob enclosures, and the Extended temperature grade covers automotive underhood and outdoor exposure.

Resumo dos produtos recomendados

RN2483 LoRaWAN transceiver for long-range uplink Usado em: Battery-Powered IoT Sensor Nodes MCP9700 Analog temperature sensor for ADC input Usado em: Battery-Powered IoT Sensor Nodes MCP73831 Li-ion battery charger IC Usado em: Wearable Health & Fitness Devices RN4871 Bluetooth module for wireless data Usado em: Wearable Health & Fitness Devices MCP2551 CAN transceiver for industrial networks Usado em: Industrial Sensor Interfaces MCP9808 High-accuracy digital temperature sensor Usado em: Industrial Sensor Interfaces MCP1640 Boost regulator for energy harvesting Usado em: Energy Harvesting Systems MCP3911 Energy metering ADC frontend Usado em: Energy Harvesting Systems MCP23S17 I/O expander for additional touch channels Usado em: Capacitive Touch User Interfaces AT42QT1010 Standalone touch button reference Usado em: Capacitive Touch User Interfaces MICRF211 Sub-GHz ASK/FSK transmitter Usado em: Remote Controls & Wireless Key Fobs MCP1700 Low-Iq LDO for battery regulation Usado em: Remote Controls & Wireless Key Fobs
What is the Flash memory size of PIC24F32KA304-E/ML?
The PIC24F32KA304-E/ML has 32 KB of Flash program memory organized as 11K x 24 words. According to the Microchip PIC24FV32KA304 family datasheet (DS30009995E), the Flash is rated for 10,000 erase/write cycles minimum and supports self-programming under firmware control, which is essential for in-field firmware updates on remote sensor nodes.
How many MIPS does the PIC24F32KA304 deliver?
The PIC24F32KA304 executes up to 16 MIPS at 32 MHz system clock. The 16-bit instruction pipeline yields most instructions in a single cycle; according to the Microchip datasheet, this places the part between 8-bit MCUs (typically 1-4 MIPS) and 32-bit ARM Cortex-M0 parts, suiting modest signal-processing and control tasks without inflating power consumption.
Where can I buy PIC24F32KA304-E/ML online?
The PIC24F32KA304-E/ML is in stock at major authorized distributors including DigiKey, Mouser, and Octopart-listed channels such as Avaq and Origin-IC as of 2026-09-29. Pricing for 1-piece is approximately USD 5.20 dropping to USD 2.95 at 3,000-piece reels. Lead time for factory quantities is typically 6-12 weeks from Microchip direct.
What is the price of PIC24F32KA304-E/ML?
The PIC24F32KA304-E/ML unit price is approximately USD 5.20 at qty 1, USD 4.16 at qty 100, USD 3.32 at qty 1,000, and USD 2.95 at qty 3,000 as of 2026-09-29, sourced from Octopart aggregator data and Mouser listings. Volume pricing may vary by distributor; contact Microchip direct or franchised distributors for guaranteed BOM-stable quotes.
What is the lead time for PIC24F32KA304-E/ML?
Lead time for PIC24F32KA304-E/ML from Microchip factory is typically 6-12 weeks for production quantities, while distributor stock at DigiKey and Mouser ships same-day as of 2026-09-29. For allocation-constrained designs, ordering factory-direct with safety stock is recommended, since the XLP family has been in production for over a decade and is actively maintained.
What is the difference between PIC24F32KA304-E/ML and PIC24F32KA304-I/ML?
The -E suffix denotes the Extended operating temperature grade (-40C to +125C), while the -I suffix denotes the Industrial grade (-40C to +85C). Both share the identical 44-pin QFN package, pinout, and silicon, so they are functionally interchangeable for most designs - the -E variant simply guarantees operation across a wider thermal envelope suitable for automotive underhood or industrial unheated enclosures.
Can PIC24FV32KA304 replace PIC24F32KA304-E/ML?
The PIC24FV32KA304 is pin-compatible and shares the same datasheet family as the PIC24F32KA304, but supports a wider supply voltage up to 5.5 V. According to the Microchip datasheet (DS30009995E), the "FV" variant targets 5V applications while the "F" variant targets 3.3V systems; firmware is identical but analog performance differs slightly above 3.6V.
Where to download PIC24F32KA304-E/ML datasheet PDF?
The official PIC24FV32KA304 family datasheet (document DS30009995E) is available at https://ww1.microchip.com/downloads/en/DeviceDoc/30009995e.pdf. This datasheet covers the entire PIC24F/FV32KA304 family including the PIC24F32KA304-E/ML variant. For errata, refer to the device-specific silicon errata document on the Microchip product page at microchip.com.
What is the ADC resolution of PIC24F32KA304?
The PIC24F32KA304 integrates a 12-bit successive-approximation ADC with up to 16 input channels on the 44-pin QFN variant. According to the Microchip datasheet (DS30009995E), the ADC supports both single-ended and differential conversions, automatic channel scanning, and operation in Sleep mode under CTMU control for low-power sensor sampling.
Is PIC24F32KA304-E/ML suitable for battery-powered applications?
Yes, the PIC24F32KA304-E/ML is specifically designed for battery-powered and energy-constrained applications using Microchip's nanoWatt XLP technology. According to the Microchip datasheet (DS30009995E), Deep Sleep current is in the nanoampere range, and peripherals such as RTCC, DSWDT, and DSBOR keep running in Deep Sleep, enabling multi-year coin-cell operation in sensor nodes and wearables.
What is the best drop-in replacement for PIC24F32KA304-E/ML?
The PIC24F32KA304-I/ML is the closest drop-in replacement, sharing the identical 44-pin QFN footprint and same die - only the temperature grade differs (-40C to +85C industrial vs. -40C to +125C extended). For higher memory density in the same family, the PIC24FV32KA304 (with wider 5V supply) is also pin-compatible per the Microchip datasheet (DS30009995E).
What is the equivalent Microchip part for PIC24F32KA304-E/ML in TQFP package?
The PIC24F32KA304-E/PT is the TQFP-44 equivalent, sharing the same silicon and pinout but in a leaded TQFP package instead of the leadless QFN. Note that this is NOT a drop-in replacement: the TQFP has a different PCB footprint and thermal pad layout, requiring a PCB redesign. Both are covered by the same PIC24FV32KA304 family datasheet (DS30009995E).
Is PIC24F32KA304 the same as PIC24FJ32KA304?
The PIC24F32KA304 and PIC24FJ32KA304 are closely related parts. The "J" suffix indicates a different silicon revision optimized for lower voltage operation and improved peripheral mix. According to the Microchip datasheet (DS30009995E), both share the same 16 MIPS performance, but the J-variant typically offers enhanced low-power performance; pinouts and footprints vary by package.
What are the key specifications of PIC24F32KA304-E/ML that engineers should know?
The PIC24F32KA304-E/ML is a 16-bit XLP MCU with 32 KB Flash, 2 KB RAM, 512 B EEPROM, 16 MIPS at 32 MHz, 12-bit ADC with up to 16 channels, CTMU, and 44-pin QFN package. Per the Microchip datasheet (DS30009995E), it operates from 1.8 V to 3.6 V across -40C to +125C, and features nanoWatt XLP Deep Sleep modes with nanoampere-range current consumption.

Dados de referência de engenharia para PIC24F32KA304-E/ML — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC24F32KA304-E/ML when you need a 16-bit XLP MCU with Extended -40C to +125C temperature grade for harsh-environment deployments and 32 KB of Flash for moderate firmware footprints. Choose the PIC24F32KA304-I/ML for industrial-grade applications up to +85C to reduce cost. Choose the PIC24FV32KA304-I/ML when your design runs from a 5V rail without an LDO. Choose the PIC24FJ64KA304-I/ML when firmware approaches the 32 KB limit and you want to stay in the same QFN-44 footprint. Choose the PIC24F16KA304-I/ML for cost-optimized designs under 16 KB code size. All five parts share the same 44-pin QFN (8x8 mm) footprint, enabling PCB reuse across temperature grades, supply voltage variants, and memory configurations.

Comparação com alternativas

Parâmetro Este produto PIC24F32KA304-I/ML PIC24FV32KA304-I/ML PIC24FJ64KA304-I/ML PIC24F16KA304-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-pin QFN (8x8 mm) 44-pin QFN (8x8 mm) 44-pin QFN (8x8 mm) 44-pin QFN (8x8 mm) 44-pin QFN (8x8 mm)
Flash Memory 32 KB 32 KB 32 KB 64 KB (+100%) 16 KB (-50%)
RAM 2 KB 2 KB 2 KB 8 KB 2 KB
Maximum CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
Supply Voltage Range 1.8 V to 3.6 V 1.8 V to 3.6 V 2.0 V to 5.5 V (wider) 2.0 V to 3.6 V 1.8 V to 3.6 V
Operating Temperature -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial)
ADC 12-bit, 16 channels 12-bit, 16 channels 12-bit, 16 channels 12-bit, 16 channels 12-bit, 16 channels
CTMU Yes Yes Yes Yes Yes

Principais diferenciais

  • Extended -40C to +125C operating temperature range (vs PIC24F32KA304-I/ML)
  • 5V-tolerant supply option via FV family variant (vs PIC24FV32KA304-I/ML)
  • 32 KB Flash balances code density and unit cost (vs PIC24FJ64KA304-I/ML)

Notas de projeto

To achieve nanoampere Deep Sleep currents on the PIC24F32KA304-E/ML, disable all unused peripherals via PMD registers, set all unused I/O pins to digital outputs driving low, and configure the RTCC with a 32.768 kHz crystal for timekeeping without CPU intervention. According to the Microchip datasheet (DS30009995E), DSBOR and DSWDT must be enabled and tuned to allow the lowest practical supply voltage while still detecting brownout conditions. Use Idle mode (CPU off, peripherals running) for sub-microsecond wake latency, and Sleep mode for full Deep Sleep current.

The 44-pin QFN package has an exposed thermal pad on the underside that must be soldered to a ground plane for both thermal dissipation and electrical grounding. Per the Microchip datasheet land pattern recommendation, use an array of thermal vias (typically 9-16 vias at 0.3 mm drill) connecting the center pad to inner ground planes. Without proper pad soldering, junction-to-ambient thermal resistance rises sharply, potentially causing thermal shutdown at high ambient temperatures. Decoupling: place 100 nF X7R ceramics within 2 mm of each VDD pin and a 10 uF bulk capacitor near the package.

For ADC accuracy on the PIC24F32KA304-E/ML, route analog signals away from digital switching traces and keep the analog ground return path separate from digital ground returns, joining them only at a single point near the MCU's VSS pin. Use a guard ring around analog input pins and configure unused analog pins as digital outputs to prevent floating inputs from injecting noise. According to the Microchip datasheet (DS30009995E), the ADC achieves best linearity when the source impedance is below 5 kohm; add an external buffer op-amp for higher-impedance sensors.

Common pitfalls with PIC24F32KA304-E/ML designs: (1) forgetting to configure the VCAP pin - it requires a 10 uF low-ESR ceramic to ground for internal voltage regulator stability; (2) leaving the MCLR pin floating - it must be pulled high via 10 kohm resistor to VDD; (3) using ICSP pins as GPIO without considering in-circuit programming - dedicate PGECx/PGEDx to programming or ensure they do not interfere with programming voltage levels; (4) selecting the wrong oscillator configuration - the FRC internal 8 MHz oscillator with PLL can deliver 32 MHz without an external crystal, but accuracy is limited to +/- 2%.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this E-grade part extends the industrial temperature range but is not automotive-qualified. The PIC24F32KA304 family is in active production per Microchip product lifecycle status as of 2026-09-29.

Dados verificados em: 2026-09-29 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

Microchip Technology PIC24F32KA304-E/ML PIC24F32KA304-I/ML PIC24FV32KA304-I/ML PIC24FJ64KA304-I/ML PIC24F16KA304-I/ML 16-bit microcontroller PIC24F XLP nanoWatt XLP QFN-44 CTMU ICSP RTCC Deep Sleep mode 12-bit ADC RoHS REACH AEC-Q100 battery-powered IoT sensor node capacitive touch energy harvesting
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