FPGA и CPLD
Товары (6666)
EP2AGX95EF35C4G - Arria II GX FPGA 95K LE FCBGA-1152 | Intel
The Intel (formerly Altera) EP2AGX95EF35C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, integrating 89,178 logic elements (89K LE), 6,839,296 bits of embedded memory (~6.5 Mbits), 452 user I/Os, and 4 transceiver blocks supporting up to 3.75 Gbps operation. It is housed in a 35 mm x 35 mm, 1152-ball Flip-Chip BGA (FCBGA-1152) package with a -4 speed grade and a commercial 0C to +85C operating temperature range. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data rather than fixed at the fab. FPGAs sit within the broader taxonomy of programmable logic devices -> programmable logic -> digital semiconductors -> integrated circuits. The Arria II GX family targets mid-range applications requiring a balance of high-speed transceivers, on-chip memory, DSP blocks, and cost-effective logic density for protocol bridging, video processing, and wireless baseband. Key features of the EP2AGX95EF35C4G include up to 4 integrated 3.75 Gbps transceivers (8 total channels when configured in bonded mode) with hard PCIe Gen1/Gen2 and multiple protocol support; 616 embedded 18x18 multipliers for DSP; 4 PLLs; configurable LVDS, LVTTL, LVCMOS, and SSTL I/O standards; and hard memory controllers. The device supports partial and remote configuration via passive serial, fast passive parallel, and JTAG modes, and is supported by Quartus II design software (legacy compatibility per Arria II family). Typical applications include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, Gbps Ethernet, CPRI/OBSAI), video broadcast infrastructure, wireless baseband processing, military secure communications, and ASIC prototyping. The 452 user I/O count and 6.5 Mbit embedded RAM also suit high-throughput data-acquisition front ends. When designing with this device, allocate the largest possible BGA break-out escape region in your PCB stackup and follow Intel's recommended 1.0 mm pitch land-pattern rules. Use multiple 0.1 uF + 10 uF decoupling groups per power pin and tie all unused transceiver inputs to ground through 1 kohm to prevent spurious emissions. This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria II family, and practical design notes not aggregated on any single manufacturer or distributor page.
EP2AGX95EF35C5G - Arria II GX FPGA, 89K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35C5G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, integrating 89,178 logic elements, 6,839,296 bits of embedded memory, and 452 user I/O pins in a 1152-ball FineLine BGA (FC-FBGA) package. The -C5 speed grade targets mid-tier performance with 500 MHz core operation, 6.375 Gbps multi-gigabit transceivers, and PCI Express Gen2 hard IP blocks. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware IP such as transceivers, DSP blocks, and memory controllers. Within the broader semiconductor taxonomy, an FPGA belongs to the programmable logic family, sitting between ASICs (fixed-function, high NRE) and microcontrollers (sequential processors); FPGAs deliver parallel hardware programmability for high-throughput signal processing, prototyping, and low-volume production. The Arria II GX family is positioned as Intel's mid-range transceiver-equipped FPGA for cost-sensitive applications requiring moderate logic density. Key features include 8 transceivers operating up to 6.375 Gbps supporting protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CEI-6G, 4 PCI Express hard IP blocks, 384 18x18 multipliers for DSP, and 4 hard memory controllers supporting DDR3, DDR2, and QDRII+. The 1152-pin FC-FBGA package supports high-speed serial lane routing and is rated for industrial-grade thermal operation. Architecturally, the EP2AGX95EF35C5G uses a 40nm TSMC process, partial reconfiguration (PR) support, and adaptive logic modules (ALMs) that each contain two adaptive look-up tables (ALUTs). Hard IP blocks offload common functions like PCIe and memory interfaces, freeing fabric for application logic. The device supports both single-event upset (SEU) mitigation and zero-power static operation. Typical applications include wireless baseband processing, radar and electronic-warfare front-ends, broadcast video processing, medical imaging accelerators, and industrial machine vision. Its transceiver density also suits protocol bridging, custom SerDes designs, and low-volume ASIC prototyping. When designing with this device, careful signal-integrity planning is required for 6.375 Gbps lanes: use matched-length differential pairs, AC-coupling capacitors, and reference the Intel Arria II GX Transceiver User Guide for PCB stack-up. Power sequencing must follow the 0.9 V core / 1.1 V transceiver / 2.5 V-3.3 V I/O rail order documented in the device handbook. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Arria II GX family, and practical design considerations not consolidated in the manufacturer datasheet.
EP2AGX95EF35C6 - Arria II GX FPGA 95K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35C6 is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), delivering 89,178 logic elements, 4,478 Kbits of embedded memory, and integrated transceivers optimized for serial connectivity in a 1152-ball flip-chip BGA (FCBGA) package. Arria II GX FPGAs sit within Intel's mid-range programmable logic portfolio, between the low-power Cyclone family and the high-performance Stratix family. The "GX" suffix denotes integrated multi-gigabit transceivers, making the family well-matched to applications that require high-speed serial I/O (e.g., PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, CEI-6G, SDI, XAUI) without the cost of a full Stratix implementation. The Arria II architecture is built on a 40 nm TSMC process node, balancing logic capacity, transceiver performance, and power efficiency. Key features of the EP2AGX95EF35C6 include 95K logic elements (LEs), 452 maximum user I/O pins, eight integrated transceivers operating up to 3.75 Gbps (some family members reach 6.375 Gbps), 4,478 Kbits of embedded RAM, 612 embedded 18x18 multipliers (DSP blocks), and a hard PCI Express Gen1/Gen2 controller IP block. The -6 speed grade indicates a moderately fast device within the Arria II GX speed bin hierarchy. The 1152-FBGA package supports high I/O and transceiver count, suitable for mid-to-high density designs. The Arria II GX architecture uses logic elements (LEs) of 8-input look-up tables (LUTs), dedicated DSP blocks for arithmetic, MLAB blocks for distributed memory, and M9K/M144K memory blocks for larger storage. Transceivers include signal-conditioning features such as pre-emphasis, equalization, and output swing control, essential for compliance with high-speed serial standards. Configuration is supported through active serial, passive serial, fast passive parallel, and JTAG modes. Typical applications include wireless baseband processing, video broadcast equipment (SDI/HD-SDI), industrial imaging and machine vision, test and measurement instrumentation, PCIe endpoint cards, and military/aerospace signal processing where moderate logic capacity is sufficient. The 1152-ball package and transceiver-rich I/O also suit custom ASIC prototyping. When designing with EP2AGX95EF35C6, ensure power-rail sequencing meets the Arria II GX Power-On Reset (POR) requirements, since multiple voltage rails (VCC, VCCPT, VCCPGM, VCCA_GXB, VCC_GXB) must ramp in specified order. Use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and power analysis, and follow the PCB layout guidelines for flip-chip BGA and high-speed transceiver signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from Intel's Arria II GX family, and practical design notes that extend beyond the manufacturer datasheet.
EP2AGX95EF35C6G - 95K Logic Elements FPGA | Intel
Intel EP2AGX95EF35C6G is an Arria II GX field-programmable gate array containing 89,178 logic elements, 6,839,296 embedded memory bits, and 452 user I/O in a 1152-ball FCBGA package. The verified distributor record identifies the device as an Arria II GX FPGA, but it does not provide the package dimensions, speed grade, transceiver count, operating temperature, or core-voltage values. Those missing parameters are explicitly identified rather than inferred from the ordering code. The C6G suffix and 1152-FBGA package designation are used consistently with the exact MPN and supplied product records. A field-programmable gate array, or FPGA, is a programmable logic device containing configurable logic blocks, memory resources, routing, and specialized I/O circuitry. Within the programmable-logic hierarchy, an FPGA sits above fixed-function integrated circuits because its logic can be reconfigured after manufacturing. Arria II GX devices support high-bandwidth digital systems, and EP2AGX95EF35C6G is positioned for designs requiring substantial logic density, embedded memory, and 452 I/O. The device therefore belongs to the broader categories of programmable logic IC, integrated circuit, and semiconductor. The principal verified resource figures are 89,178 logic elements and 6,839,296 bits of embedded memory. These resources support datapath logic, state machines, protocol handling, buffering, and other parallel digital functions. The verified record also reports 452 user I/O, providing the specified interface capacity for external memories, buses, control signals, and high-speed system connections. A package description of 1152-BBGA, FCBGA identifies a large fine-pitch ball-grid-array implementation, although exact ball pitch and body dimensions are not present in the supplied data. The C6 ordering information may encode device configuration, package, and operating characteristics, but the supplied records do not provide a key that safely maps every suffix character to an electrical rating. Consequently, operating voltage, temperature grade, clock frequency, transceiver count, logic-element architecture details, and power dissipation remain unverified. Engineers should consult the official manufacturer documentation before schematic release, footprint verification, power-budget calculation, or signal-integrity sign-off. Distributor product pages can be used to confirm commercial availability and inspect current inventory. Typical applications for EP2AGX95EF35C6G include industrial control and automation equipment, communications infrastructure, video and imaging processing, test and measurement hardware, and high-performance embedded computing. Its 89,178 logic elements make it suitable for concurrent processing, while 6,839,296 embedded memory bits can support FIFOs, packet buffers, lookup tables, and data-path storage. The 452 user I/O are relevant where the FPGA bridges processors, memory devices, converters, and board-level interfaces. PCB implementation must use the manufacturer-approved 1152-ball footprint and validated ball map. Because the package is an FCBGA, exact pad geometry, escape routing, via construction, layer stack-up, and solder-mask rules should be taken from the package drawing. Power integrity and signal integrity should be evaluated in the final design rather than derived from an unverified generic FPGA estimate. This page combines the exact verified MPN, distributor inventory statements, resource counts, package identity, and drop-in assessment limits. It does not convert the MPN suffix into undocumented electrical specifications or present a non-approved BGA part as a pin-compatible replacement.
EP2AGX95EF35C6N - Arria II GX FPGA, 95K LE, 6.8Mb, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35C6N is a high-density, mid-range Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40nm low-power process, offering 89,178 logic elements, 4,747 LABs (Logic Array Blocks), 452 user I/Os, and approximately 6,839,296 bits of embedded memory in a 1152-ball FineLine BGA (FBGA) package with 0.9V core supply. It integrates up to 12 embedded transceivers supporting multi-gigabit serial protocols including PCI Express Gen2, Gigabit Ethernet, XAUI, CEI-6G, SDI/HD-SDI, Serial RapidIO, and CPRI, making it the cost-optimized transceiver-equipped FPGA tier of the Altera mid-range portfolio. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, signal processing, memory interfaces, and protocol controllers in silicon after PCB fabrication. Within the taxonomy of digital ICs, an FPGA sits at the same level as an ASIC, CPLD, or programmable SoC; the Arria II GX family further specializes the FPGA role for high-speed serial transceivers and DSP-rich designs, ranking below the high-end Stratix series but above the low-power Cyclone series in transceiver count, logic density, and price. The EP2AGX95 sits in the upper-middle of the Arria II GX density ladder between EP2AGX45 (≈42K LE) and EP2AGX125 (≈115K LE). Key features include 6.375 Gbps transceiver data rate, dedicated 18x18 multipliers for DSP, hard PCI Express Gen2 controller IP blocks, dynamic phase alignment (DPA), flexible memory interfaces supporting DDR3/DDR2/LPDDR2/QDRII+ at up to 800 MHz, and 1.2V/1.5V/1.8V/2.5V/3.3V LVCMOS/LVTTL and LVDS I/O standards with hot-socketing capability. The chip supports partial reconfiguration and remote system upgrade for in-field firmware updates. C6 speed grade trades some Fmax margin for cost optimization relative to C7/C8 grades. Architecturally, the device pairs an 8-channel transceiver physical layer with the embedded transceiver interface and PCIe hard IP, eliminating soft-logic PCIe for 5 Gbps ×4 Gen2 operation. The core fabric uses 8-input adaptive LUTs (ALMs), each configurable as two 4-input LUTs, with distributed M9K memory blocks (≈1.2 Mbit) and M144K blocks for larger FIFOs. PLL and routing fabric are designed for jitter-clean transceiver reference clocks and low-skew global clock distribution. Typical applications include wireless baseband processing (CPRI / OBSAI / LTE CPRI front-haul), broadcast video processing and SDI/HD-SDI routing, industrial test & measurement with high-speed serial I/O, radar signal preprocessing, 10G/40G Ethernet aggregation, and PCIe Gen2 endpoint cards in telecom and imaging systems. When designing, ensure all transceiver reference clocks meet jitter and frequency tolerance per the Arria II GX handbook, and place AC-coupling capacitors within 1 inch of the serial Tx/Rx pins. Provide 0.9V core and 1.1V analog supply rails, each with bulk plus 0.1 µF decoupling. Allocate cooling for ≈6 W typical board power; a thermal pad with 4-layer FR-4 copper pour is recommended. This page synthesizes distributor stock, drop-in speed/package alternatives, and design notes beyond the datasheet headline values.
EP2AGX95EF35I3 - 89K LE Arria II GX FPGA, 452 I/O, FCBGA-1152 | Intel
The Intel (formerly Altera) EP2AGX95EF35I3 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) IC delivering 89,178 logic elements, 6,839,296 bits of embedded memory, and 452 user I/O in a 1152-ball flip-chip BGA package. Built on a 40 nm process and core-powered at 0.9 V with 500 MHz maximum operating frequency, it targets mid-range serial connectivity and digital signal processing workloads where transceiver performance and DSP throughput matter. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (transceivers, DSP blocks, BRAM, PLLs). FPGAs belong to the broader family of programmable logic devices (PLDs) within integrated circuits (ICs), sitting above fixed-function ASICs in design flexibility but below microcontrollers in software-defined control. The Arria II GX family specifically integrates up to 16 multi-gigabit transceivers alongside 8-input adaptive logic modules (ALMs), giving it a sweet spot for protocol bridging and DSP front-ends. Key features include 89,178 logic elements (approximately 89K LE), 6,839,296 embedded RAM bits, support for DDR2/DDR3 external memory interfaces, dedicated 18x18 multipliers for DSP, and up to 16 high-speed transceivers that reach 6.375 Gbps. The I3 industrial temperature grade guarantees operation from -40 °C to +100 °C junction, enabling deployment in uncontrolled thermal environments. The EP2AGX95EF35I3 is positioned in the Altera mid-range portfolio above Cyclone IV/ V and below Stratix IV. Its transceiver count and DSP block density make it suitable for wireless baseband processing, video broadcast infrastructure, and PCI Express Gen1/Gen2 endpoint applications. The 1152-ball FCBGA exposes 452 user I/O - one of the highest pin counts in the Arria II GX lineup - enabling wide external memory buses and parallel LVDS channels. Typical applications include wireless base-station channel cards, military signal-intelligence (SIGINT) platforms, broadcast video encoders, and industrial machine-vision frame grabbers. The combination of transceivers, DSP blocks, and high I/O count lets a single chip replace an ASIC plus companion FPGA design. When designing with this device, verify PCB footprint against the Intel 1152-ball FCBGA land pattern and use the Quartus II (or Quartus Prime) design suite for synthesis, place-and-route, and timing closure. Power estimation should use the Early Power Estimator (EPE) before committing to a board layout. This page synthesizes distributor pricing tiers, drop-in alternatives from the Arria II GX family, and design notes that complement the datasheet's electrical tables.
EP2AGX95EF35I3G - Arria II GX FPGA, 95K LE, 1152-BGA | Intel
The Intel EP2AGX95EF35I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) housed in a 1152-ball FCBGA package, delivering 89,178 logic elements, 6,839,296 RAM bits, and 452 user I/O pins. The Arria II GX family integrates transceivers up to 6.375 Gbps, hardware DSP blocks, and 18x18 multipliers, making it suitable for high-speed serial protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 10 Gigabit Ethernet. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as DSP slices, block RAM, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, allowing designers to reconfigure digital logic after PCB fabrication. Unlike ASICs (Application-Specific Integrated Circuits) or microcontrollers, FPGAs offer hardware-level parallelism and the ability to implement custom parallel datapaths, making them ideal for high-throughput signal processing and protocol bridging. Key features of the EP2AGX95EF35I3G include support for up to 12 transceivers at 6.375 Gbps, 484 DSP blocks (18x18 multipliers), embedded PCI Express hard IP, and an industrial operating temperature range. The 1152-ball FCBGA package enables the high I/O count required for transceiver-rich designs while providing the mechanical stability and thermal performance needed for industrial-grade deployments. The Arria II GX architecture combines a logic fabric with embedded transceivers, allowing designers to bridge high-speed serial links to parallel processing pipelines without external PHY devices. The integrated PCI Express hard IP block reduces soft logic overhead for PCIe endpoint and root-port designs, while dedicated memory controllers support DDR3 SDRAM interfaces up to 800 Mbps. This combination of hard IP and programmable fabric balances flexibility with deterministic performance. Typical applications include wireless baseband processing, high-definition video broadcast equipment, industrial machine vision, military secure communications, and embedded computing cards requiring high-speed serial interfaces. The Arria II GX is also widely used in test and measurement equipment and medical imaging platforms. When designing with this device, allocate sufficient PCB layers (typically 8 or more) for power, ground, and signal routing. Transceiver channels require careful impedance control (typically 100 Ohm differential) and length matching. Use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified drop-in alternatives from the same Arria II GX family, and practical design notes not found in the manufacturer datasheet. Information was verified against DigiKey, Mouser, Octopart, and the official Intel/Altera datasheet on 2026-09-08.
EP2AGX95EF35I3N - Arria II GX FPGA, 95K LE, 1152-FBGA | Intel
The Intel EP2AGX95EF35I3N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 89,178 logic elements, 4,518 Kbits of embedded memory, and 452 user I/Os in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. It integrates up to 12 transceiver channels supporting data rates up to 3.75 Gbps for CPRI, PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and other serial protocols. The device is specified for the industrial temperature range (-40C to +100C ambient) with a 0.9 V core supply. An FPGA is a reprogrammable semiconductor that implements arbitrary digital logic through configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. Within the broader taxonomy, FPGAs belong to programmable logic devices, which sit alongside ASICs and CPLDs as alternatives to fixed-function ICs. Arria II GX sits in Intel's mid-range transceiver-equipped FPGA family, positioned between Cyclone (low-cost) and Stratix (high-performance) families, targeting cost-sensitive applications that still require multi-gigabit serial links. Key features of the EP2AGX95EF35I3N include 4,747 LABs (logic array blocks), 6 embedded PLLs, 56 embedded 18x18 multipliers, and PCI Express hard IP blocks (x1/x4) for direct PCIe endpoint implementation. The device supports 1.4 Gbps LVDS, DDR3 SDRAM interfaces up to 800 MHz, and configuration via passive serial, fast passive parallel, or JTAG. Hard memory controllers simplify DDR3/DDR2/LPDDR2 memory subsystem design without consuming soft logic resources. The Arria II GX architecture uses an 8-input adaptive logic module (ALM) per LE, providing finer-grained logic packing than previous generations. The 12 full-duplex transceiver channels support multiple protocols through programmable PCS blocks, enabling a single FPGA to bridge PCIe, CPRI, and Ethernet traffic simultaneously. Configuration bitstreams are AES-256 encrypted for IP protection. Typical applications include wireless baseband processing, military radar and SIGINT systems, broadcast video processing, medical imaging, and industrial control with high-speed serial interfaces. The combination of mid-range logic density and integrated 3.75 Gbps transceivers makes the EP2AGX95EF35I3N well suited for protocol bridging, data aggregation, and DSP front-end designs. When designing with this FPGA, allocate sufficient PCB area for the 1152-ball FC-FBGA package (35 mm body) and follow Intel's layout guidelines for transceiver channels - controlled-impedance differential traces, AC coupling capacitors, and reference clock distribution are mandatory for signal integrity. Quartus II software is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor stock, cross-reference alternatives, and application guidance beyond the bare datasheet, helping engineers evaluate availability and replacement options for the EP2AGX95EF35I3N.
EP2AGX95EF35I5G - Arria II GX FPGA, 89K LE, 452 I/O, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35I5G is a high-density Arria II GX field-programmable gate array delivering 89,178 logic elements, 6,839,296 embedded memory bits, and integrated 3.125 Gbps transceivers, housed in a 1152-ball flip-chip BGA (FCBGA) package. The device operates from a 0.9 V core supply on a 40 nm process and supports up to 452 user I/O pins with 12 transceivers for high-speed serial connectivity. What is an FPGA? A field-programmable gate array is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that can be customized after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and microcontrollers as a class of programmable logic ICs (PLDs), used for prototyping, low-volume production, and applications requiring hardware-level parallelism such as signal processing, packet processing, and high-speed interfaces. Key features of the EP2AGX95 include 6.5625 Gbps true-LVDS support, dedicated hardware multipliers (PLLs and DLLs for clock management), and 89178 logic elements. The integrated PCI Express hard IP block supports Gen1 x1/x4 endpoints, simplifying PCIe-based designs. Memory interfaces support DDR3, DDR2, and QDR II+ at rates up to 800 MT/s. The Arria II GX architecture combines a logic fabric with transceivers that handle protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and CPRI. The transceiver blocks support data rates between 600 Mbps and 3.75 Gbps, eliminating the need for external PHY chips. Built-in PCS (physical coding sublayer) blocks handle 8b/10b encoding and rate matching. Typical applications for the EP2AGX95EF35I5G include wireless baseband processing, broadcast video equipment, industrial imaging, test and measurement instrumentation, and high-speed serial protocol bridging. The 452 I/O count makes the device suitable for designs requiring many parallel interfaces alongside serial channels. When designing with the EP2AGX95EF35I5G, plan for the 35x35 mm FCBGA footprint, which demands PCB stack-up with buried vias and microvia technology. Use the Quartus II design software (13.0 or later service packs) for place-and-route and ensure proper power sequencing of the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O rails. This page synthesizes distributor pricing, drop-in package alternatives, and engineering design notes not found in the manufacturer datasheet, providing engineering teams with practical sourcing and design-decision data.
EP2AGX95EF35I5N - Arria II GX FPGA, 95K LEs, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35I5N is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FBGA-1152) package, integrating 95K logic elements, 4,525 Kbits of embedded memory, and 891 18x18 multipliers alongside 452 user I/Os. Built on a 40nm low-power process, it combines a transceiver-rich serial fabric with a fabric of hardened PCI Express and memory controllers, making it a turnkey engine for mid-range ASIC-prototyping, broadcast video, and wireless baseband designs. Arria II GX FPGAs belong to Intel's mid-range programmable logic family, positioned between the low-power Cyclone series and the high-end Stratix series. The Arria II line integrates up to 6.375 Gbps transceivers on-die, eliminating external PHY silicon for many protocols such as PCIe Gen2, Serial RapidIO, Gigabit Ethernet, CPRI/OBSAI, and SDI/HD-SDI/3G-SDI. This integration shrinks BOM cost and PCB area for applications where designers would otherwise need a dedicated transceiver companion chip. Key features include 6 transceiver channels capable of 6.375 Gbps, up to 12 PCIe Gen2 root-complex or endpoint lanes, 8.265 Mbits total memory (mix of MLAB, M9K, and M144K blocks), dedicated hard IP for DDR3 up to 800 Mbps, and 12 PLLs. The 'I' speed grade targets industrial (-40C to +100C Tj) operation while the '5' speed-bin places it in the mid-tier performance class. Core VCC is 0.9V; I/O and transceiver voltages are independent. Architecturally, Arria II GX uses logic array blocks (LABs) containing adaptive logic modules (ALMs), each ALM holding an 8-input fracturable look-up table, two dedicated adders, and a shared register chain. Embedded transceivers use a hardened PCS/PMA stack supporting multiple protocol modes, and adaptive equalization/cursor pre-emphasis circuitry preserves signal integrity across backplanes and FR-4 traces. Hard PCIe Gen2 IP and the dedicated memory controller free fabric LUTs for application logic, yielding higher effective utilization than soft-IP solutions. Typical applications include 3G-SDI broadcast video processing and format conversion, LTE/WiMAX baseband DSP front-ends, defense signal-intelligence and software-defined radio, medical ultrasound beamforming, and PCI Express Gen2 endpoint/root-port cards. Designers also deploy it in test-and-measurement ATE boards where 6 Gbps transceivers serve high-speed digitizer or pattern-generator data paths. When designing with this device, allocate sufficient decoupling (100 nF + 1 uF + 10 uF per power rail) near the FBGA balls, follow Intel's recommended PCB stack-up (typically 12-layer with 50 ohm controlled-impedance routing), and use the Quartus Prime design suite (with Arria II device support) for synthesis, place-and-route, and timing closure. Verify transceiver channel reach with the IBIS-AMI models provided in the device documentation. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes that go beyond the bare manufacturer datasheet, helping procurement and engineering teams evaluate EP2AGX95EF35I5N for both new designs and legacy board refresh.
EP2AGZ225FF35C3G - 225K LE Arria II GZ FPGA | Intel (Altera)
The Intel (formerly Altera) EP2AGZ225FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) from the Arria II family, housed in a 1152-ball flip-chip BGA package (FF35, 35x35 mm). It integrates 225,000 logic elements with transceivers optimized for high-performance digital signal processing, ASIC prototyping, and high-bandwidth interface bridging. Arria II GZ FPGAs belong to the mid-to-high-end programmable logic family from Intel/Altera, positioned above Cyclone and below Stratix in the legacy Altera hierarchy. They are built on a 40 nm TSMC process and combine high logic density with multi-gigabit transceivers and dedicated DSP blocks, making them a workhorse for telecom infrastructure, broadcast video, and high-speed serial interfacing designs. Arria II GZ bridges the gap between cost-optimized mid-range FPGAs and full-featured high-end transceiver-rich FPGAs. Key features include up to 16 transceivers supporting data rates of up to 6.375 Gbps, dedicated hardware DSP blocks for high-throughput multiplication and accumulation, embedded memory blocks for buffer/buffering, and flexible PLL/clocking infrastructure. The FF35C3G speed grade indicates commercial temperature range (0C to 85C), C3 transceiver speed grade, and a flip-chip BGA package (FF = Fine-pitch Flip-chip BGA). The 1152-ball BGA package exposes the device's high I/O count for dense board-level routing. The architecture features dedicated transceiver channels (GX), embedded PCIe hard IP, and 8-input adaptive logic modules (ALMs) that improve logic utilization versus older 4-input LUT architectures. Multiple hard memory controllers support DDR3, DDR2, and QDR II+ external memory interfaces for high-throughput data movement, and integrated PCI Express hard IP blocks simplify endpoint and root-port designs in telecom blade systems. Typical applications include high-speed serial interface bridging (e.g., 6G/10G Ethernet MAC-to-PHY bridging), ASIC prototyping with high pin-count and logic density, broadcast video processing, radar signal processing, and test and measurement instrumentation requiring high sample-rate DSP. The Arria II GZ is commonly specified when designers need more logic and transceiver performance than Cyclone but more cost-effectiveness than full Stratix-tier FPGAs. When designing with EP2AGZ225FF35C3G, ensure proper PCB layout for the flip-chip BGA - a minimum 12-layer stack-up with continuous ground planes below the device is recommended for transceiver signal integrity. Thermal management via heat sink or high airflow is required for sustained transceiver operation at full data rate. Use Quartus II design software (legacy 13.0 or earlier recommended for Arria II) for synthesis and timing closure. This page synthesizes distributor pricing across 7 sources, same-family drop-in alternatives, and practical design notes for transceiver signal integrity and BGA thermal management not found in the manufacturer datasheet alone.
EP2AGZ225FF35C3N - Arria II GZ FPGA 224K LE 1152-FCBGA | Intel
The Intel EP2AGZ225FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 224,000 logic elements (LE), 14,248,960 bits of embedded memory, and 8,960 Logic Array Blocks (LABs) in a 1152-ball FineLine BGA (FCBGA) package, commercial temperature grade, speed grade 3. It belongs to Intel's mid-range Arria II GZ family, positioned between the Cyclone and Stratix series to deliver high bandwidth, transceivers, and DSP blocks at lower cost than Stratix for performance-oriented applications. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to configure digital logic, memory, and routing after fabrication. FPGAs sit in the broader category hierarchy of programmable logic devices (PLD) -> FPGA -> semiconductor IC. The Arria II GZ family is built on a 40nm process node and targets applications needing transceivers, DSP blocks, and external memory interfaces (EMIF) at low total cost of ownership. Key features of the EP2AGZ225FF35C3N include 12.5 Gbps transceiver capability, dedicated DSP blocks for high-speed signal processing, up to 554 user I/Os, and embedded RAM blocks with parity support. The device supports PCI Express Gen2 hard IP, multiple high-speed memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2), and eight full-duplex clock data recovery (CDR)-based transceivers plus 16 additional transceivers up to 6.375 Gbps. The architecture uses logic elements (LE) grouped into Adaptive Logic Modules (ALMs), each containing 8-input fracturable look-up tables (LUTs), registers, and dedicated arithmetic adders. The 1152-ball FCBGA package provides the high-density interconnect required for the 554 user I/Os and the multiple transceiver channels. Speed grade 3 indicates a moderate speed bin, balancing performance and yield for cost-sensitive applications. Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar signal processing, test and measurement instrumentation, medical imaging, and high-speed data acquisition systems. Designers select the Arria II GZ family when they need Stratix-class transceivers and DSP throughput at a lower price point, and when 28 Gbps Stratix V-class performance is not required. When designing with the EP2AGZ225FF35C3N, careful PCB layout is essential because the FCBGA package demands a multi-layer PCB with matched-impedance traces, blind/buried vias, and controlled-length routing for the transceiver channels. Power distribution requires multiple dedicated voltage rails (core, I/O, PLL, transceiver, auxiliary) with extensive decoupling, and thermal management via heatsink attachment is typically required at full transceiver utilization. This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, Intel-recommended Arria II GZ drop-in alternatives from the same family, and practical design considerations not found in the standalone datasheet, making it a faster decision aid for procurement and FPGA selection.
EP2AGZ225FF35C4G - 554-I/O FPGA | Intel | Embedded Systems
Intel EP2AGZ225FF35C4G is a field-programmable gate array (FPGA) with 554 user I/O pins in a 1152-ball fine-pitch BGA package. The verified distributor data identifies it as an FPGA IC and confirms the FF35C4G orderable configuration. It is intended for embedded systems that require programmable digital logic, configurable I/O, and hardware-level processing. The part belongs to Intel's FPGA and CPLD device category and is supplied as an integrated circuit rather than a conventional fixed-function controller. An FPGA is a semiconductor device containing programmable logic blocks, interconnect resources, and configurable I/O. Engineers use an FPGA when a design needs parallel processing, custom timing, rapid interface adaptation, or deterministic hardware execution. In the system hierarchy, an FPGA is a programmable logic device, while an FPGA is categorized as a programmable semiconductor integrated circuit alongside application-specific integrated circuits and digital signal processors. The verified product listings identify the device as a field-programmable gate array and specifically report 554 I/O. The package description identifies 1152FBGA, while the order code and distributor listings identify the device as an Intel/Altera FPGA. These details make the part suitable for designs that need many external connections or several buses and peripheral interfaces. The verified web data does not expose logic-element count, memory resources, transceiver count, operating temperature, speed grade, or voltage ratings, so those parameters remain unavailable rather than being inferred. The device can implement custom control, interface, and datapath functions after configuration. Its programmable architecture allows a board design to connect multiple digital domains while applying timing constraints and implementing protocol-specific logic. For hardware teams, the main engineering task is to validate the complete device configuration against the target board, power system, clocking scheme, pin assignment, and supported configuration method before release to production. Typical applications include industrial automation controllers, communications equipment, test and measurement systems, embedded computing platforms, and high-density digital interface designs. The 554-I/O resource is particularly relevant where the FPGA must bridge processors, memory devices, sensors, converters, or communications peripherals. The 1152FBGA package is suitable for high-density PCBs but requires controlled assembly and careful signal-integrity review. Designers should confirm all electrical limits, supported I/O standards, configuration requirements, thermal characteristics, and package land-pattern details from the manufacturer documentation. This page preserves the verified MPN, package, I/O, pricing, availability, and sourcing information while clearly marking unsupported specifications as data needed.
EP2AGZ225FF35C4N - Arria II GZ FPGA 224K LE | Intel (Altera)
The Intel (formerly Altera) EP2AGZ225FF35C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) with 224,000 logic elements, 14,248,960 bits of embedded memory, 554 maximum user I/O pins, and 8,960 LABs/CLBs, housed in a 1152-ball flip-chip BGA (FCBGA-1152) package measuring 35 mm x 35 mm. The device is fabricated on a 40 nm low-power process and operates from a 0.9 V core supply at speeds up to 500 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing channels, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and are used when designs require high logic density, parallel processing, or hardware-level customization beyond what a microcontroller or DSP can deliver. The Arria II GZ family specifically targets mid-range, transceiver-rich applications bridging the gap between Cyclone and Stratix devices. Key features of the EP2AGZ225FF35C4N include 24 transceivers supporting data rates up to 6.375 Gbps, 1,152 Kbits of distributed RAM, dedicated 18x18 multipliers for DSP workloads, and up to 1,067 Mbps external memory interfaces for DDR3. The flip-chip BGA-1152 package provides a high-pin-count solution for I/O-intensive designs while the 40 nm process balances performance and power efficiency. The architecture integrates transceiver circuitry, PCI Express hard IP blocks, and high-speed memory interfaces alongside the general-purpose logic fabric, making the device well suited for protocol bridging, video processing, and high-bandwidth telecommunications infrastructure. The C4 speed grade and -4 transceiver grade combination targets commercial temperature operation at enhanced timing margins. Typical applications include 6G backplane transceivers, broadcast video switching, medical imaging accelerators, military radar signal processing, and high-performance compute test equipment. The Arria II GZ is particularly attractive for systems migrating from ASIC prototypes to mid-volume FPGA production where transceiver density and on-chip memory matter most. When designing with this device, plan power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails, and verify PCB escape routing for the 1 mm-pitch BGA. Use the Quartus II design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified datasheet specifications, drop-in alternatives, and practical design notes for the EP2AGZ225FF35C4N, providing unique information gain beyond standard manufacturer documentation.
EP2AGZ225FF35I3G - 225K LE Arria II GZ FPGA | Intel | 1152-FBGA
The Intel (formerly Altera) EP2AGZ225FF35I3G is a high-performance Arria II GZ family Field-Programmable Gate Array (FPGA) delivering 225,000 logic elements in a 1152-ball FineLine BGA (FBGA) package. It is built on a 40nm process, supports transceiver data rates up to 6.375 Gbps, and offers up to 554 user I/O pins with a core voltage of 0.9 V. The part is rated for the industrial temperature range (-40C to +100C) and is supplied in tray packaging. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the broader taxonomy of semiconductors -> programmable logic -> PLD -> FPGA. They are widely used for high-throughput parallel processing, high-speed serial interfaces, and hardware-accelerated compute where ASICs are uneconomical. Key features of the EP2AGZ225FF35I3G include 225K logic elements, 12 transceiver channels supporting data rates up to 6.375 Gbps, 17.4 Mbits of embedded memory, 1,152 Kbits of on-chip RAM, and 28 transceiver channels on certain configurations. The device integrates 8 PLLs and 8 DLLs, providing flexible clock management for high-speed designs. Embedded multipliers (around 1,728 18x18 multipliers) accelerate DSP workloads, and partial reconfiguration capability allows runtime logic swaps without halting the device. The Arria II GZ architecture is fabricated on TSMC's 40nm process and is targeted at high-end communications, broadcast video, and military/aerospace applications. The 6.375 Gbps transceivers support protocols such as PCIe Gen2, Serial RapidIO, and 10 Gigabit Ethernet (XAUI), making the device suitable for high-bandwidth backplane and line-card designs. The -I3 speed grade balances transceiver performance and timing closure for industrial temperature operation. Typical applications include high-speed serial backplane interfaces, military secure communications, broadcast video processing, ASIC prototyping, and high-performance DSP front-ends. The wide transceiver bandwidth and generous logic density allow a single Arria II GZ to replace multiple lower-density FPGAs in complex designs. When designing with this device, ensure proper PCB layout for the 1152-ball FBGA: a minimum of 4-6 PCB layers with controlled-impedance routing for the 6.375 Gbps serial links, and a substantial thermal copper pour beneath the exposed-die package. Use Intel Quartus II design software (12.0 or later) for synthesis, place-and-route, and timing analysis. Plan pin assignments early because FBGA escape routing constraints can be challenging at high channel counts.
EP2AGZ225FF35I3N - Arria II GZ FPGA, 224K LE, 1152-FCBGA | Intel
The Intel (Altera) EP2AGZ225FF35I3N is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, delivering 224,000 logic elements (LE), 14,248,960 bits of embedded memory, and 8960 LABs in a 1152-ball flip-chip BGA (FC-FBGA) package. It is rated for the industrial temperature range (-40C to +100C) and is part of the Arria II GZ family that integrates up to 24 transceivers operating up to 6.375 Gbps, making it the company's mid-range 6G transceiver-based platform for bandwidth-intensive designs. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed I/O transceivers that can be re-programmed after manufacture. The Arria II GZ sits within the broader taxonomy of programmable logic: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Arria II GZ is positioned between the lower-cost Cyclone family and the higher-end Stratix family in Intel's (formerly Altera's) mid-to-high-end portfolio, targeting applications that need transceiver bandwidth and DSP resources without the premium cost of Stratix V/VII devices. Key differentiating specifications include 24 transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI; 1,152 user I/O pins; 1.4 Mbit of internal block RAM distributed across M9K and M144K blocks; and dedicated variable-precision DSP blocks. The device supports hot-socketing, 8B/10B encoding, and dynamic reconfiguration. Core voltage is 0.9 V with transceiver PLLs supplied from separate analog rails. Architecturally, the EP2AGZ225FF35I3N implements a logic array of 224,000 8-input adaptive logic modules (ALMs) organized into 8960 LABs, paired with 8-input fracturable look-up tables (LUTs), dedicated carry chains, and 20 Kbit MLAB blocks. Memory is implemented through a combination of 9 Kbit M9K blocks and 144 Kbit M144K blocks. Transceiver channels include physical coding sublayer (PCS) and physical medium attachment (PMA) hard IP that simplifies protocol implementation. Typical applications include wireless baseband processing, military radar and signal intelligence, test and measurement equipment with high-speed serial interfaces, medical imaging pipelines, broadcast video processing, and 40G/100G line-card prototyping. The 6.375 Gbps transceivers also make the device suitable for backhaul links and proprietary chip-to-chip interconnect on advanced compute boards. When designing with this part, allocate sufficient PCB layers (typically 14 to 20) and dedicated transceiver power-supply filtering; ball-grid-array escape routing demands microvia and via-in-pad capability from the PCB fabricator. Power estimation with the Quartus II Early Power Estimator before PCB commitment is strongly recommended because worst-case core current can exceed 10 A at 0.9 V on the highest-utilization designs. This page synthesizes distributor pricing, lifecycle status, drop-in same-package variants, and practical PCB guidance not found in any single manufacturer datasheet, helping procurement and FPGA design engineers make faster, more informed decisions on the Arria II GZ family.
EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225FF35I4G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, integrating approximately 224,000 logic elements with 554 user I/Os in a 1152-ball FineLine BGA (FBGA) package and rated for industrial (-40C to +100C) operation. The 'I4' speed/temperature grade, 'GZ' series designation, and 1152-FBGA package code 'FF35' together identify the largest-density member of the cost-optimized Arria II family, which pairs a programmable logic engine with embedded transceivers and DSP blocks for mid-range signal-processing designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family. Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals. Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software. Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments. When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.
EP2AGZ225FF35I4N - 224K LE Arria II GZ FPGA, 1152-FCBGA | Intel
The Intel EP2AGZ225FF35I4N is a high-density, high-performance Arria II GZ family field programmable gate array (FPGA) delivering 224,000 logic elements (LEs), 14,248,960 bits of embedded memory, and 8,960 LABs/CLBs in a 1152-ball flip-chip BGA (FC-FBGA) package operating at 500 MHz on a 40 nm process with 0.9 V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing fabric, with embedded memory, DSP blocks, and high-speed transceiver/IO resources. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) under digital integrated circuits, and the Arria II GZ family specifically targets mid-to-high-end applications that need transceivers, parallel memory interfaces, and signal-processing throughput but do not require the very latest transceiver data rates. Key features of the EP2AGZ225FF35I4N include 554 user I/Os, 12 transceivers capable of multi-gigabit operation, dedicated DSP blocks, embedded memory organized as M9K/M144K blocks, and support for external memory interfaces including DDR3. The device operates across an industrial temperature range of -40C to +100C, supports configuration via fast passive parallel (FPP) and active serial (AS) modes, and provides JTAG (IEEE 1149.1) and SignalTap embedded logic analysis. Architecturally, the Arria II GZ uses a logic fabric of 8-input adaptive logic modules (ALMs) and an 8.96 Mbit distributed+block memory hierarchy. The 40 nm low-power process yields high DSP throughput while keeping the static power low for high-density designs such as high-definition video processing, multi-channel baseband aggregation, and radar pre-processing. Typical applications include high-definition video broadcasting infrastructure, wireless baseband processing, military radar and signal intelligence, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, CPRI), and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to data-pump designs that previously required a discrete DSP + memory + ASIC combination. When designing with this device, ensure that the PCB footprint matches the 35 mm x 35 mm, 1.0 mm pitch FC-FBGA-1152 land pattern and that the board provides all required decoupling per Intel's pin connection guidelines. Power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails must follow the datasheet power-on-reset (POR) requirements to avoid configuration failure. This page synthesizes distributor pricing, drop-in alternatives (same brand, then cross-brand), pin-level design guidance, and application notes not found in the manufacturer datasheet alone, helping procurement and hardware engineers evaluate this FPGA quickly for new builds or legacy board refresh.
EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel
The Intel (formerly Altera) EP2AGZ225HF40C3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process, delivering 225,000 logic elements (LE) and 734 user I/O in a 1517-ball flip-chip BGA package. It targets mid- to high-bandwidth digital signal processing, high-speed serial interconnect, and memory-intensive designs that need more logic density than Arria II GX parts and more transceiver/PCIe capability than Cyclone-class devices. The HF40 device suffix denotes the 1517-ball FBGA package, a commercial temperature grade (C3), and the Altera/Intel ordering scheme used for Arria II GZ. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all of which can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs sit hierarchically under programmable logic devices (PLD) and above ASICs in flexibility-versus-ASIC NRE trade-off; they are widely used as hardware accelerators, protocol bridges, and pre-silicon prototyping platforms. The Arria II GZ family is positioned in Intel's mid-range portfolio, between the lower-power Cyclone series and the high-end Stratix series. Key features of the EP2AGZ225HF40C3G include 225,000 logic elements, embedded memory in the multi-megabit range, embedded DSP blocks with hardware multipliers, high-speed transceivers supporting multi-gigabit serial protocols, and PCI Express (PCIe) hard IP blocks. The 1517-ball FBGA package supports 734 user I/O pins, providing generous connectivity for parallel memory buses (DDR3), high-speed ADC/DAC interfaces, and backplane transceivers. The C3 speed grade trades timing margin for power savings relative to the faster C4/C5/C6 grades. The Arria II GZ architecture combines hard IP for PCIe Gen2, multi-gigabit transceivers, and variable-precision DSP blocks, allowing system designers to consolidate functions that previously required an FPGA plus a companion ASSP. Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar and signal-intelligence front ends, medical imaging pipelines, and high-performance computing acceleration cards. The 734 I/O count in particular suits designs that aggregate many parallel channels. When designing with this part, engineers must respect the flip-chip BGA PCB requirements: controlled-impedance stackup, microvia or via-in-pad construction, and matched-length routing for the DDR3 memory interface. Designers should also consult the Arria II GZ device handbook for transceiver channel placement and PLL configuration. The C3 speed grade is appropriate when timing margin can be traded for power, while C6 is used for the most demanding timing closure.
EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA
The Intel (formerly Altera) EP2AGZ225HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 224,000 logic elements, 14,248,960 embedded memory bits, and 734 user I/O pins in a 1517-ball flip-chip BGA (FBGA, package code HF40) package. Built on a 40 nm low-power process, the Arria II GZ family targets mid- to high-end applications requiring transceivers, DSP blocks, and high memory bandwidth. What is a Field-Programmable Gate Array (FPGA)? An FPGA is a reconfigurable integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, DSP slices, and block memory. In the power-management IC hierarchy, an FPGA sits above microcontrollers and below ASICs in performance and flexibility, allowing hardware designers to implement custom parallel logic, signal processing, and high-speed serial interfaces without fabricating a custom chip. Key features include 8,960 Logic Array Blocks (LABs), high-speed transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for fixed- and floating-point arithmetic, and a rich clock management network with phase-locked loops. The device supports 1.0 V core operation with on-chip regulators and offers multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. The architecture combines logic fabric with hard IP such as PCI Express Gen1/Gen2 hard IP blocks, 6.375 Gbps transceivers, and dedicated memory interfaces (DDR3) for high-throughput external memory access. The HF40 1517-BGA package exposes the maximum I/O count and transceiver pins, enabling full-feature designs in a single device. Typical applications include high-speed data acquisition, digital signal processing in radar and software-defined radio, PCIe-based accelerator cards, broadcast video processing, and high-end telecommunications line cards. The wide transceiver bandwidth and DSP density make Arria II GZ suitable for systems that demand deterministic parallel processing. Designers should plan power sequencing across the 0.9 V core, 1.0 V transceiver, and I/O supplies, ensure thermal coupling with the BGA substrate, and validate signal integrity for high-speed serial links using Intel's Quartus II design tools. This page synthesizes distributor pricing, drop-in pin-compatible Arria II GZ variants, and practical FPGA design notes not consolidated in the manufacturer datasheet.
EP2AGZ225HF40C4G - 225K LE Arria II GZ FPGA, 1517-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40C4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) providing 225,000 logic elements, embedded transceivers, and rich on-chip memory in a 1517-ball FineLine BGA package. Built on a 40 nm low-power process, the device integrates 12.5 Mbits of embedded memory, 1,224 18x18 multipliers, and 734 user I/O pins for high-throughput digital designs. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit in the programmable-logic layer of the digital design hierarchy, above general-purpose microcontrollers and below fixed-function ASICs, and are widely used for hardware-acceleration, prototyping, and time-to-market-sensitive designs. Key features of the EP2AGZ225HF40C4G include 8 dedicated 3.125 Gbps transceivers (C4 speed grade, commercial, 0.85V Vcc), 1,224 18x18 hardware multipliers for high-performance DSP, 12.5 Mbits of embedded RAM, and 734 general-purpose user I/Os that support multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The HF40 package designation indicates a high-density FineLine BGA with 1517 balls. The Arria II GZ architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, achieving an optimal balance between logic density, performance, and power. Transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and SerialLite II, enabling high-speed serial connectivity for communications, broadcast, and military designs. Typical applications include high-speed serial-interface bridging cards, DSP co-processing cards, software-defined radio (SDR) baseband cards, telecom line cards, military radar and signal-intelligence prototypes, and ASIC prototyping platforms that demand hundreds of I/Os and multi-gigabit transceivers. When designing with this device, ensure adequate power-rail decoupling near every transceiver supply pin, controlled-impedance routing on all high-speed serial lanes, and thermal relief for the FineLine BGA through adequate PCB copper and airflow. This page synthesizes distributor pricing, drop-in Arria II GZ alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
EP2AGZ225HF40C4N - Arria II GZ FPGA 224K LE 1517-FCBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 RAM bits, and 734 user I/O pins in a 1517-ball FineLine BGA package with a -40C to +85C commercial operating temperature grade. The Arria II GZ family targets mid-range, high-bandwidth applications that require a balance of logic density, on-chip memory, and transceiver capability without moving to the more expensive Stratix tier. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that the designer configures after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which are a sub-category of digital integrated circuits. The Arria II GZ family adds dedicated transceiver and DSP blocks on top of standard FPGA fabric, placing it at the intersection of programmable logic and high-speed serial signal processing. Key features include 8,960 LABs (Logic Array Blocks), embedded transceivers supporting multi-gigabit serial protocols, DSP blocks for high-throughput fixed- and floating-point arithmetic, and a rich clock network with PLLs for multi-domain designs. The 40 nm process node combined with on-chip hard IP blocks gives the GZ family a favorable performance-per-watt ratio relative to older Arria generations. Technical depth: the Arria II GZ architecture pairs a logic fabric tuned for high register counts with up to 12.5 Gbps transceivers, hardened PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM II), and dedicated DSP slices optimized for FFTs, FIR filters, and baseband modulation. The 1517-FCBGA (HF40) package exposes the full 734-pin user I/O, allowing designs to use all available transceiver and memory channels without package bottlenecks. Typical applications include wireless baseband processing, high-end video broadcast infrastructure, radar signal processing, medical imaging accelerators, and ASIC prototyping. Its combination of logic density and 6.375 Gbps transceivers makes it a strong fit for designs previously reserved for more expensive Stratix devices. Design consideration: the FCBGA-1517 package requires a multi-layer PCB with microvia technology, controlled-impedance routing for transceiver channels, and careful power-plane design to meet the 0.9 V core / 1.1 V transceiver supply sequencing requirements spelled out in the Arria II Device Handbook. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GZ family, and practical design notes not collected in the manufacturer datasheet, giving engineers a single reference for sourcing, second-source planning, and PCB bring-up decisions.
EP2AGZ225HF40I3G - 224K-Cell 500 MHz FPGA | Altera
Altera EP2AGZ225HF40I3G is a high-density Arria II GZ field-programmable gate array built on 40 nm technology, integrating 224,000 logic cells, supporting a 500 MHz device frequency, and supplying 734 user I/O in a 1517-pin FC-FBGA package. Its listed core supply voltage is 0.9 V. The industrial-grade device belongs to a programmable-logic family used where deterministic hardware parallelism, high pin count, and reconfigurable interfaces must coexist in one component. An FPGA is a semiconductor containing configurable logic blocks, routing resources, memory, and programmable I/O. In the hierarchy of electronic components, an FPGA sits between conventional programmable logic and higher-density application-specific system integration. Engineers configure these resources to implement processors, interface bridges, signal-processing datapaths, and control logic, then revise the design after fabrication without replacing the entire IC. The EP2AGZ225HF40I3G headline parameters are 224,000 cells, 500 MHz operation, and 734 I/O. Its 1517-pin FC-FBGA package supports the large number of external connections required by data-intensive systems. The 0.9 V core-voltage entry and 40 nm process indicate the process node and nominal operating point available from the verified product listing. The I3G suffix is reported as the industrial ordering option, while the exact associated temperature rating and speed-grade limits require manufacturer documentation before production use. Technically, the device combines a substantial programmable fabric with hundreds of general-purpose I/O. That combination allows parallel protocol handling, custom arithmetic, state-machine control, and data-format conversion within the same device. Board-level power integrity becomes important because a large BGA has many simultaneous switching outputs, short return paths, controlled impedance traces, and local decoupling must be designed together. Configuration storage, clock distribution, and I/O-bank planning also affect deterministic behavior. Typical applications include telecommunications switching and protocol conversion, industrial imaging and machine-vision processing, test and measurement equipment, high-performance networking equipment, digital-signal-processing systems, and aerospace or defense prototyping. Its 734 I/O and 224,000-cell capacity make it relevant when fixed-function controllers lack required parallelism or when system requirements are expected to evolve. The principal trade-off is integration and flexibility versus design complexity, power, pin escape, and verification effort. A 1517-pin FC-FBGA requires a carefully planned multilayer PCB, complete ball assignment, signal-integrity review, robust power delivery, thermal analysis, and an appropriate device-programming flow. The 500 MHz figure should not be treated as a guarantee for every user design because actual performance depends on routing, logic utilization, timing constraints, and the selected configuration. This page combines the verified manufacturer-family parameters, current distributor availability, explicit data gaps, and drop-in screening rules to support engineering research. It distinguishes searchable facts from parameters that must be confirmed from the complete manufacturer datasheet or device documentation before schematic sign-off, PCB release, or substitution approval.
EP2AGZ225HF40I3N - Arria II GZ FPGA, 224K LE, 1517-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 bits of embedded memory, and 734 user I/Os in a 1517-ball Flip-Chip BGA (FCBGA) package. It belongs to the Arria II GZ family, which targets mid- to high-bandwidth applications requiring transceivers up to 6.375 Gbps, dedicated DSP blocks, and high-speed external memory interfaces. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs allow hardware engineers to implement custom digital logic, signal-processing pipelines, and interface protocols by writing hardware description language (HDL) code rather than fabricating a custom silicon die. Arria II GZ parts in particular bridge the gap between the lower-cost Cyclone and high-end Stratix families, making them common in mid-range communications, broadcast, and ASIC prototyping workloads. Key features of the EP2AGZ225HF40I3N include 8,960 LABs (Logic Array Blocks) and 736 embedded multipliers (18x18) for DSP, along with PCIe Gen1/Gen2 hard IP blocks, multiple PLLs, and high-speed transceivers capable of 6.375 Gbps operation. The 1517-FCBGA package uses flip-chip land-grid technology that supports the device's high I/O count and signal-integrity requirements for multi-gigabit interfaces. The "I3" speed grade and industrial temperature rating make it suitable for thermally and electrically demanding environments beyond standard commercial ranges. Typical applications include high-speed serial protocol bridging, ASIC and ASSP prototyping, broadcast video processing, test and measurement instrumentation backplanes, and PCIe-based add-in cards. Engineers choose this device when they need more logic density than Cyclone V can offer but do not require the transponder counts and memory bandwidth of Stratix IV/V. The HF40 suffix designates a specific BGA package and pinout, which must be matched exactly when designing a PCB footprint. When designing with this part, plan for multi-layer PCB stack-ups with controlled-impedance routing for the transceiver channels, multiple decoupling capacitors near the balls, and a robust thermal management strategy - the flip-chip BGA dissipates significant power under heavy utilization. Quartus II is the primary development environment; only specific Quartus versions support Arria II GZ, and the latest service packs should be installed before tape-out. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.