FPGA и CPLD
Товары (6666)
EP2SGX60EF1152C4K - 60K LEs Stratix II GX FPGA, 1152-BGA | Altera
The Intel (formerly Altera) EP2SGX60EF1152C4K is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 534 user I/Os, 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, all housed in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device is fabricated on a 90 nm process and operates from a 1.2 V core supply with up to 732.1 MHz internal performance. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, DSP blocks, and high-speed transceivers that can be rewired after manufacturing. FPGAs sit at the top of the digital IC hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically extends this hierarchy with embedded transceivers, allowing single-chip implementation of multi-gigabit serial interfaces that previously required companion PHY chips. Key features of the EP2SGX60EF1152C4K include 3022 Logic Array Blocks (LABs), 3,024 Kbit (2,544,192 bits) of TriMatrix embedded memory, up to 252 embedded 18x18 multipliers, dedicated DDR2 memory interfaces, and up to 12 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and CEI-6G protocols. The device is rated for commercial (0C to 85C) ambient operating conditions. The architecture uses Altera's adaptive logic module (ALM) combined with a hierarchical routing network, delivering up to 732.1 MHz fabric performance. The 1.2 V core supply and 90 nm CMOS process provide a balance of high logic density and low dynamic power, while the embedded transceiver blocks (6.375 Gbps) eliminate the need for external PHY silicon for high-speed serial links. The -C4 speed grade places this part in the mid-range performance tier of the family. Typical applications include high-end telecommunications line cards, military radar and signal-intelligence platforms, broadcast video processing, ASIC prototyping, and PCI Express Gen1/Gen2 endpoint or root-complex designs. Engineers commonly use the EP2SGX60EF1152C4K as a system-on-chip integration device where multiple protocol bridges, DSP pipelines, and a soft processor core coexist. When designing with the EP2SGX60EF1152C4K, plan power sequencing carefully - the core (VCC), analog (VCCA), and I/O banks (VCCIO) require specific ramp rates. Use the Quartus II design software (Altera) or Quartus Prime (Intel FPGA) for synthesis, place-and-route, and SignalTap II logic analysis. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60EF1152C4N - Stratix II GX 60K FPGA, 1152-BGA | Altera
The Altera (Intel) EP2SGX60EF1152C4N is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 60,440 logic elements, 534 user I/O pins, and 2,544,192 bits of embedded memory in a 1152-ball FineLine BGA (FBGA-1152) package. The device is built on a 1.2V / 90nm CMOS process and includes up to 12 high-speed transceivers supporting multi-gigabit serial I/O for backplane and chip-to-chip links. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically alongside ASICs and CPLDs as user-customizable digital logic devices, and high-density FPGAs like the Stratix II GX add embedded transceivers, DSP blocks, and large memory arrays to support system-on-chip (SoC) integration in communications, broadcast, and high-performance computing. Key features of the EP2SGX60EF1152C4N include 60,440 logic elements, 3,022 LABs (Logic Array Blocks), 254 I/O standards supported, and a maximum user I/O count of 534 pins. The integrated transceivers operate at up to 6.375 Gbps per channel and support PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and other serial protocols. The 1152-pin FBGA package uses a 35x35 mm substrate with 1.0 mm ball pitch and supports -40C to +85C commercial-grade operation (the 'C' suffix). The Stratix II GX architecture uses an adaptive logic module (ALM) that delivers up to 1.88x the logic capacity and 1.5x the memory bandwidth of the original Stratix family. The device's high-speed I/O bank structure supports single-ended standards (LVTTL, LVCMOS, PCI, PCI-X) and differential standards (LVDS, LVPECL, HyperTransport) via dedicated true-LVDS pins, with on-chip termination resistors for signal-integrity optimization. Typical applications include 10G/40G optical transport platforms, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO switch fabrics, software-defined radio (SDR) baseband processing, and high-end ASIC prototyping. The combination of dense logic and integrated transceivers makes it particularly suitable for wireline and wireless infrastructure line cards. When designing with the EP2SGX60EF1152C4N, pay close attention to the FPGA's 25W typical power dissipation budget and provide a thermal solution sized for at least 15-20W steady-state load. Use the Altera Quartus II design suite (versions 7.2 through 13.0sp1) for synthesis and place-and-route, and consult the Stratix II GX pin connection guidelines for the 1152-BGA package before laying out the PCB. This page synthesizes verified distributor pricing, drop-in and parametric-equivalent alternatives, and practical Quartus II design considerations not consolidated in any single manufacturer document, giving engineering buyers a faster procurement and design-start workflow.
EP2SGX60EF1152C5 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152C5 is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 3,022 LABs/CLBs, and 2,544,192 bits of embedded RAM in a 1,152-ball FineLine BGA package (35 x 35 mm). It integrates up to 534 user I/Os, 717 MHz internal operation, and high-speed transceivers optimized for serial connectivity, making it suitable for prototyping and production in communication, video-processing, and high-performance DSP systems. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the IC hierarchy between CPLDs and structured ASICs. It uses a matrix of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric, augmented with hardened blocks such as transceivers, DSP slices, and block RAM. Stratix II GX family members are designed for high-speed serial I/O and embedded-transceiver-rich applications where general-purpose FPGAs lack the bandwidth. Key specifications include 60,440 logic elements, 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (approximately 311 kbyte), 484 pins in a 1152-ball BGA, and a core supply of 1.15 V to 1.25 V. The device also integrates up to 20 transceivers and supports high-performance parallel I/O standards including LVDS, LVPECL, HSTL, and SSTL for memory and backplane interfaces. Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric paired with TriMatrix embedded memory that supports true dual-port, simple dual-port, and single-port modes with parity and ECC options. A network of dedicated high-speed serial transceivers handles multi-gigabit links, while the surrounding periphery offers programmable I/O banks supporting single-ended and differential signaling. This combination allows designers to consolidate what would otherwise be a discrete ASSP plus glue logic onto a single programmable device. Typical applications include high-speed serial backplane bridging, wireless baseband prototyping, video broadcast infrastructure, ASIC prototyping/emulation, and high-performance DSP co-processing. The combination of high logic density and transceiver-rich I/O is well suited to telecom line cards, test and measurement equipment front-ends, and defense signal-processing platforms. When designing with this device, plan the PCB for a high-layer-count stack-up to fan out the 1,152-ball BGA, and ensure that the 1.15 V to 1.25 V core rail is decoupled with low-impedance ceramic capacitors close to the package. This page synthesizes distributor pricing, drop-in Stratix II GX alternatives, and design notes not found in the manufacturer datasheet.
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel EP2SGX60EF1152C5N is a high-density Stratix II GX Field Programmable Gate Array delivering 60,440 logic elements and 2,544,192 bits of embedded memory in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. It integrates 534 user I/Os and supports up to 609.76 MHz core operation on a 90 nm process with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined by a user-loaded configuration bitstream rather than hard-wired at the fab. Stratix II GX belongs to the FPGA -> programmable logic -> semiconductor hierarchy and was designed to combine high-density general-purpose logic with embedded transceivers for serial connectivity. Key features include 3022 Logic Array Blocks (LABs), embedded 18x18 multipliers (typically 144 DSP blocks for the device family), high-speed serial transceivers supporting multi-gigabit rates, and Phase-Locked Loops (PLLs) for clock management. The FC-FBGA-1152 package uses flip-chip land-grid array construction that maximizes I/O density while minimizing electrical parasitics. The 90 nm CMOS process with copper interconnect and 1.2 V core enables high toggle rates and aggressive integration, while the -5 speed grade denotes the mid-tier core performance bin. The Stratix II GX architecture pairs embedded transceivers with PCI Express hard IP blocks, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI directly from the silicon. Typical applications include high-speed serial interface bridges, ASIC prototyping, telecom line-card glue logic, military/aerospace signal processing, and broadcast video infrastructure. The -5 commercial speed grade is appropriate for laboratory and production designs where lower power and predictable timing closure are priorities. Designers should plan for the 1152-ball FC-FBGA land pattern (35 mm or 40 mm body, depending on revision) and provide at least 6 PCB signal layers for break-out, plus dedicated ground/power planes for the 1.2 V core and 3.3 V/2.5 V/1.8 V I/O banks. Use the Quartus II design tool (or later Cyclone/Arria-compatible software where supported) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in speed-grade and package alternatives, and practical design notes that supplement the manufacturer datasheet.
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
The Intel (formerly Altera) EP2SGX60EF1152I3 is a high-performance Stratix II GX Field-Programmable Gate Array (FPGA) with 60,440 logic elements, integrated transceivers, and embedded memory, housed in a 1152-ball FineLine BGA package. It is part of the Stratix II GX family, which combines a logic-rich adaptive logic module (ALM) fabric with multi-gigabit transceivers targeting high-bandwidth serial I/O applications. The device operates at a maximum internal frequency of 717 MHz, with a propagation delay of approximately 2.99 ns per combinational logic block. A Stratix II GX FPGA belongs to the high-end FPGA family within the programmable logic device (PLD) hierarchy. Stratix II GX -> FPGA -> Programmable Logic Device -> Logic IC -> Integrated Circuit -> Semiconductor. The "GX" suffix denotes integrated multi-gigabit transceivers supporting protocols such as PCIe, Serial RapidIO, XAUI, CEI-6G, and SONET/SDH, eliminating the need for external PHY chips on many line cards. The "EF" infix indicates Enhanced Configuration (EPC) support, enabling fast parallel configuration via external memory devices for sub-100 ms boot. Key features include 60,440 equivalent logic elements, approximately 2.5 Mbit of embedded memory, dedicated DSP blocks for high-speed multiplication, up to 12 multi-gigabit transceivers (per Stratix II GX family), and PLL-based clock management. The -I3 speed grade and industrial temperature range (-40C to +100C) make this part suitable for harsh-environment deployment in telecom, military, and industrial systems. The architecture uses 90 nm CMOS process technology with adaptive logic modules (ALMs) that each contain a fracturable 8-input look-up table (LUT), two dedicated adders, and dedicated register chains, enabling higher effective logic density than 4-input LUT architectures. TriMatrix embedded memory blocks (M512, M4K, M-RAM) support single-port, dual-port, and FIFO configurations with byte-enable parity protection. Typical applications include 10G Ethernet line cards, PCIe Gen1/Gen2 endpoint and root-complex designs, SONET/SDH framer/mapper ASICs, Radar signal processing front-ends, and high-speed serial protocol bridging. The integrated transceivers save bill-of-materials cost and PCB area versus equivalent LUT-fabric-only FPGAs paired with external PHYs. When designing with this device, ensure proper power-sequencing of the analog transceiver supply (VCCH) versus the digital core supply (VCCINT) to avoid latch-up, and follow the Stratix II GX pin connection guidelines for unused transceiver pins. PCB layout requires impedance-controlled 100-ohm differential traces for the high-speed serial links, and a minimum 4-layer stackup with continuous ground planes is recommended. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that complement the manufacturer datasheet.
EP2SGX60EF1152I3N - Stratix II GX FPGA, 60K LEs, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152I3N is a high-density Field-Programmable Gate Array from the Stratix II GX family, integrating 60,440 logic elements (LEs), 60,440 configurable logic blocks, and embedded transceivers in a 1152-ball FineLine BGA package. It is fabricated on a 90nm process technology, operates at a core voltage of 1.2V, and supports a maximum internal clock frequency of 717 MHz (with marketing frequency up to 816.9 MHz noted by some distributors). A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that engineers configure after manufacturing to implement custom digital circuits. Within the broader taxonomy, an FPGA sits under programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically adds multi-gigabit transceivers and is positioned for high-speed serial I/O, digital signal processing (DSP), and embedded processing applications. Key features of the EP2SGX60EF1152I3N include 2,544,192 bits of embedded memory (M4K/M512/RAM blocks), dedicated DSP blocks for high-throughput arithmetic, up to 12 embedded transceivers supporting multi-gigabit serial protocols, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and Phase-Locked Loops (PLLs) for clock management. It also offers configurable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on the user I/O pins. Architecturally, Stratix II GX uses the ALM (Adaptive Logic Module) which combines the benefits of LUT-based and product-term logic, allowing more efficient packing of logic. The 90nm process delivers favorable performance-per-watt compared with earlier 130nm Stratix devices. The 1152-pin FC-FBGA package measures 35 x 35 mm with 1 mm ball pitch (some vendor listings also describe 23 x 23 mm or 484-ball variants of the same family depending on density/option). Typical applications include high-speed serial connectivity (backplane, XAUI, PCI Express, Serial RapidIO), high-performance DSP for wireless baseband or video processing, prototype ASIC development, military/aerospace signal processing, and high-end test and measurement equipment. The industrial temperature grade (I3N = -40C to +100C junction, with some sources citing -40C to +85C ambient) makes it suitable for harsher environments. When designing with this device, use the Quartus II development suite (compatible with Stratix II GX) for synthesis, place-and-route, and timing closure. Plan PCB layout carefully for the FC-FBGA - it requires microvia or via-in-pad technology and controlled-impedance routing for the high-speed transceiver channels. Power-rail sequencing is recommended because the device uses multiple supply voltages (1.2V core, 2.5V/3.3V I/O, PLL analog). This page synthesizes distributor pricing, drop-in same-family and same-package alternatives, and practical Stratix II GX design notes not found in the manufacturer datasheet alone.
EP2SGX60EF1152I4 - Stratix II GX FPGA 60K LEs, 1152-BGA | Intel
The Intel (Altera) EP2SGX60EF1152I4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 60440 logic cells in a 1152-ball flip-chip BGA package. Built on a 90nm process node, the part is rated for industrial temperature operation and targets high-speed serial I/O and DSP-heavy designs where transceiver-rich FPGA fabric is required. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs as the dominant family; the Stratix II GX series in particular adds hardened multi-gigabit transceivers (MGTs) for serial protocols, bridging programmable logic and physical-layer (PHY) silicon. FPGAs occupy the same tier as ASSPs/ASICs in system design but offer faster time-to-market and field re-programmability. The EP2SGX60EF1152I4 integrates 3,022 Logic Array Blocks (LABs), 534 user I/O pins, and dedicated DSP blocks optimized for high-throughput arithmetic. Its on-chip transceivers operate in the multi-gigabit range, supporting protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Embedded memory totalling approximately 2.5 Mb is distributed across True-Dual-Port and Simple-Dual-Port RAM blocks, allowing wide data-path designs without external SRAM. Architecturally, Stratix II GX uses an adaptive logic module (ALM) based fabric that improves effective logic utilization versus traditional 4-LUT architectures. The device's 1.2V core supply, combined with 90nm CMOS technology, yields a favorable logic-performance-to-power ratio for its generation. Hardened PCIe and SERDES blocks reduce soft-IP overhead and free fabric for application logic. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, software-defined radio (SDR) baseband processing, and test & measurement instrumentation. Its industrial temperature grade and high pin count make it well suited to line-card designs in wired communications. When designing in the EP2SGX60EF1152I4, plan power-rail sequencing carefully and use the manufacturer's reference PCB footprint for the FC-FBGA-1152 package; BGA escape routing benefits from buried vias and microvia stack-ups. Confirm transceiver reference-clock jitter compliance with the Stratix II GX Device Handbook before final layout. This page synthesizes distributor availability data, drop-in variants from the Stratix II GX family, and engineering design notes that go beyond the datasheet to support sourcing and second-source decisions for long-lifecycle programs.
EP2SGX60EF1152I4N - 60,440-LCell FPGA, 717 MHz | Intel
Intel EP2SGX60EF1152I4N is a high-density Stratix II GX field-programmable gate array with 60,440 logic cells, 2,544,192 bits of embedded memory, 534 I/O pins, and a 717 MHz internal frequency, supplied in a 1,152-ball FBGA package. The part belongs to the FPGA and CPLD category within programmable logic semiconductors and is designed for configurable digital processing, interface bridging, and high-speed system control. An FPGA, or field-programmable gate array, is an integrated circuit containing programmable logic elements, routing resources, and configurable I/O. Its architecture can be reprogrammed after manufacturing, unlike an application-specific integrated circuit. FPGAs occupy the programmable-logic branch of digital semiconductors and are commonly used for parallel processing, protocol implementation, signal processing, and adaptable interface hardware. The device is identified as a member of the Stratix II GX family. Verified data gives 60,440 logic cells, 2,544,192 bits of memory, 534 I/O, a 717 MHz internal frequency, a 1.2 V supply, and 1,152-ball FBGA packaging. These characteristics make the component suitable for systems requiring substantial programmable logic capacity and a large number of external connections. The GX family positioning also supports communications-oriented designs, although the supplied data does not enumerate individual transceiver parameters. The FPGA architecture combines programmable logic with embedded memory and configurable I/O. The exact logic-element architecture, process technology, transceiver count, phase-locked-loop count, maximum user I/O frequency, and supported memory interface speeds are not provided in the verified web data. Engineers should therefore consult the manufacturer datasheet and associated device handbook before selecting the part for timing closure, power estimation, configuration, or signal-integrity analysis. Typical applications include communications equipment, industrial automation, test and measurement systems, video and image processing, and custom interface controllers. The 534 I/O count is useful when many external devices, buses, sensors, or converters must be connected. The 60,440 logic cells provide capacity for parallel datapaths, protocol handling, and state-machine-rich control logic, while the 717 MHz internal-frequency figure provides a reference point for architecture planning. A critical design consideration is PCB implementation. A 1,152-ball FBGA requires controlled impedance routing, appropriate via construction, layer-stack planning, clean power distribution, and extensive signal-integrity verification. The supplied sources do not include a verified ball map, package drawing document, timing model, power data, or configuration details, so those items must be obtained from the manufacturer documentation before schematic release. This page consolidates distributor specifications, family identity, package information, sourcing context, and drop-in-selection constraints. Exact stock, quantity pricing, lifecycle classification, pinout, transceiver resources, and device-grade details remain subject to manufacturer documentation and current distributor confirmation.
EP2SGX60EF1152I5 - Stratix II GX FPGA 60K LEs 1152-BGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152I5 is a Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 logic elements, 2544192 bits of embedded memory, and high-speed serial transceivers in a 1152-ball flip-chip BGA package. Built on a 90 nm CMOS process and operating from a 1.15 V core supply, the device is rated for industrial temperature operation (-40 °C to +85 °C) and supports a maximum clock frequency of 622.08 MHz with on-chip PLLs and routing fabrics tuned for high-performance DSP and serial-link designs. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that engineers can re-program in the field to implement arbitrary digital logic, signal processing, or interface functions. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and PALs in density and capability, and below ASICs in per-unit cost but above ASICs in flexibility and time-to-market. The Stratix II family in particular added adaptive logic modules (ALMs), on-chip transceivers, and DSP blocks to address high-speed serial, video, and baseband applications. Key features of the EP2SGX60EF1152I5 include 60,440 logic elements organized into ALMs, up to 2,544,192 bits of embedded RAM, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, multi-gigabit transceivers for serial I/O, and a comprehensive clock management network. The device supports a wide variety of I/O standards through configurable LVDS/CMOS drivers and exposes the configuration logic through JTAG and passive/active serial modes. Architecturally, the Stratix II GX uses a row-based ALM layout with TriMatrix embedded memory blocks, MLAB (memory logic array blocks), and embedded transceivers that can be clocked independently of the core fabric. The 90 nm CMOS process enables a transistor budget that supports 60K logic elements plus hardened transceiver and DSP silicon on a single die, while the flip-chip BGA1152 package provides the necessary pin density for transceiver signals, DDR memory interfaces, and parallel I/O buses. Typical applications for this device include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom line cards, test and measurement instrumentation, video broadcast and image processing pipelines, and prototyping of ASIC-class datapaths. The combination of DSP blocks and multi-gigabit transceivers makes the part especially well suited to designs that need both bulk DSP throughput and chip-to-chip serial links. When designing with this FPGA, engineers should plan for the 1152-ball BGA power distribution network, decoupling strategy, and JTAG configuration chain early in the PCB layout. The industrial temperature grade and 1.15 V core supply place strict requirements on regulator accuracy and thermal dissipation, particularly when the transceiver and DSP blocks are operating at full utilization. This page synthesizes distributor pricing, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet, with information current as of 2026-09-09.
EP2SGX60EF1152I5N - 60K Logic Cells FPGA | Intel | Industrial
Intel EP2SGX60EF1152I5N is a high-performance Stratix II GX field-programmable gate array with 60,440 logic cells, a 1.2 V core supply, and a 1 mm-pitch 1152-ball BGA package. Verified sources identify the device as an industrial-temperature FPGA built on 90 nm CMOS technology, with reported internal frequencies ranging from 609.76 MHz to 717 MHz. The package is described variously as 1152-pin FC-FBGA, 1152-ball PBGA, or a 23 x 23 mm FBGA-style package; engineers should confirm the exact ordering code drawing before fabrication. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, routing resources, and input/output structures. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside complex programmable logic devices, and is used when designers need hardware-level parallelism, rapid design changes, or high-speed digital signal processing. The principal verified feature of EP2SGX60EF1152I5N is its 60,440-cell Stratix II GX architecture. The device uses 90 nm CMOS technology and is specified for industrial temperature operation. The part is listed as a 1.2 V FPGA, while the verified package data indicates a 1 mm terminal pitch and 1152 ball terminals. These characteristics make it relevant to high-density digital systems where programmable logic and transceiver-oriented integration are required. The Stratix II GX family is intended for demanding logic, signal-processing, and communications-oriented designs. A 60,440-cell array can support substantial combinational and sequential logic, while the reported 609.76 MHz to 717 MHz internal frequency indicates the performance class expected from this family. The exact frequency value can vary with the source and design context, so timing closure should be performed using the manufacturer timing model and the selected configuration. Typical applications include industrial communications equipment, networking hardware, image-processing systems, and high-speed test or instrumentation equipment. Its BGA package supports dense board-level interconnect, while the industrial temperature grade is suitable for controlled industrial environments. The part may also be considered for legacy or existing designs that already use Stratix II GX silicon. Designers should verify the complete ball map, power rails, configuration interface, signal-integrity constraints, and thermal solution from the manufacturer documentation. The verified data does not provide sufficient detail for every electrical, timing, or mechanical parameter, so missing values must not be inferred from family-level assumptions. This page consolidates exact verified specifications, sourcing information, and clearly marked data gaps for engineering review.
EP2SGX60EF1162I4N - 60K LEs Stratix II GX FPGA, 1162-BGA | Altera
The Altera EP2SGX60EF1162I4N is a high-density Stratix II GX FPGA delivering 60,440 equivalent logic elements, 2,544,192 RAM bits, and 534 user I/Os in a 1162-ball FineLine BGA package. Built on a 90 nm process with embedded transceivers, it integrates up to 20 high-speed serial transceivers supporting data rates from 600 Mbps to 6.375 Gbps, making it a member of Altera's transceiver-based FPGA family for serial connectivity and DSP-intensive designs. What is a Stratix II GX FPGA? The Stratix II GX family is an enhanced version of the Stratix II architecture that adds multi-gigabit transceivers (MGTs) directly on-die. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that implements arbitrary digital logic via programmable logic elements, embedded multipliers, block RAM, and a programmable interconnect. Stratix II GX sits in Altera's high-performance transceiver-enabled FPGA hierarchy above Cyclone and below Stratix IV, targeting applications that combine high logic density with multi-gigabit serial I/O. Key features include 12 dedicated DSP blocks with 252 (18x18) multipliers, four embedded PLLs, 16 global clock networks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports both enhanced and fast passive (FPP) configuration schemes and is offered in industrial temperature grade (-40C to +100C junction), denoted by the I4 speed-grade suffix. The EP2SGX60EF1162I4N uses a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards including LVDS, LVPECL, and HSTL. The 1162-ball FineLine BGA package has dimensions of 35 mm x 35 mm with 1.0 mm pitch, suitable for high-density PCB designs where signal integrity for multi-gigabit traces is critical. Typical applications include 10 Gbps optical transport, SONET/SDH framer designs, PCI Express endpoint or root complex implementations, serial RapidIO switching fabric, broadcast video processing, and high-end DSP co-processing cards. The device's combination of logic density and transceiver count makes it well suited to wire-speed packet processing in line cards. When designing with this FPGA, pay close attention to transceiver reference clock routing, PCB stackup for 6 Gbps signals, and thermal management for the 1.0 mm pitch BGA. Power estimation should use Altera's PowerPlay early estimator before Quartus place-and-route to validate thermal envelope. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes drawn from the Altera Stratix II GX device handbook that you will not find in the marketing brief alone.
EP2SGX60EFI1152 - Stratix II GX FPGA | Intel
Intel EP2SGX60EFI1152 is a mature Enhanced Configuration (EPC) Stratix II GX field-programmable gate array associated with 2,544,192 configuration-related memory bits, 60,440 logic elements, 534 user I/O, and a 1,152-ball FineLine BGA package. The verified search results identify the part as an Altera/Intel FPGA and describe EP2SGX60 as part of the Stratix II GX family. The target ordering code is the 1,152-ball package variant, but exact speed grade, temperature grade, package dimensions, and absolute device characteristics are not established by the supplied excerpts. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing, memory, and I/O resources whose configuration can be changed after manufacture. Within the broader hierarchy, the EP2SGX60EFI1152 is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor component. Its programmable architecture allows one hardware platform to implement interfaces, protocol bridges, signal processing, control logic, and other digital systems while supporting design changes through configuration rather than a new mask set. The highlighted device resources are 60,440 logic elements, 534 user I/O, and a 1,152-ball package. These values indicate a high-density device intended for designs requiring substantial parallel processing and wide external connectivity. The Enhanced Configuration designation in the supplied search results also indicates configuration-device relevance, although the exact supported configuration modes and electrical interfaces require confirmation from the full manufacturer datasheet. The Stratix II GX family combines programmable logic with application-oriented connectivity for communications, industrial, test, and embedded systems. The 534 I/O resources can support multiple buses, memory interfaces, control paths, and communications links when implemented with suitable board-level signal integrity and power distribution. The large package provides a dense interconnection interface, but also makes escape routing, decoupling placement, thermal analysis, and solder-joint inspection important engineering tasks. Typical applications include communications equipment, industrial automation, test and measurement hardware, video or imaging processing, embedded computing, and high-speed interface aggregation. The 60,440 logic elements make the device appropriate for logic-intensive designs, while 534 user I/O can support extensive external control and data paths. Designers should verify transceiver capability, clocking resources, configuration requirements, supported I/O standards, and package ball assignments against the authoritative datasheet before layout or production release. A key trade-off is that the 1,152-ball package is a high-density BGA implementation rather than a small surface-mount package. Engineers should use the manufacturer’s recommended power planes, high-frequency decoupling, controlled-impedance routing, and thermal strategy. Because the supplied web excerpts do not establish all operating limits, missing values must be confirmed rather than inferred. This page provides exact verified identification, resource and I/O values, source URLs, commercial context, application guidance, and clearly marked data gaps. It is intended to help engineers locate the datasheet and avoid treating an unverified package claim as a substitute for pinout or electrical validation.
EP2SGX60F1508 - Stratix II GX FPGA, 60K LEs, 6.375Gbps XCVR | Altera
The Altera (now Intel) EP2SGX60F1508 is a Stratix II GX family field-programmable gate array (FPGA) with embedded 6.375 Gbps transceivers, housed in a 1508-pin FineLine BGA (FBGA) package. It integrates 60,440 logic elements (LEs), 2.5 Mbits of embedded memory organized in TriMatrix blocks, and a 36x36 DSP block array delivering up to 384 GMACs of DSP performance, plus embedded high-speed transceivers organized in groups. What is an FPGA with embedded transceivers? An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device built around an array of configurable logic blocks, embedded memory, and routing resources that the user programs via HDL (VHDL/Verilog) and synthesis. Stratix II GX is the transceiver-augmented variant of the Stratix II family, adding multi-gigabit transceivers (MGTs) for serial protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G. Within the broader taxonomy, EP2SGX60F1508 sits in the hierarchy: FPGA -> programmable logic device -> logic IC -> semiconductor. These FPGAs replace fixed-function ASICs in low-to-medium volume designs by offering hardware-level parallelism plus serial-link capability on a single die. Key features include 12 transceivers capable of 6.375 Gbps data rate, support for PCI Express x1/x4/x8 hard IP, an adaptive equalization receiver (CTLE + DFE), and 4 phase-locked loops (PLLs) plus 8 transmit PLLs dedicated to clocking the serial channels. The device also exposes 8 global clock networks, 4 regional clock networks per quadrant, and 16 dedicated clock pins. Hard IP blocks include embedded PCI Express, Serial RapidIO, and the GXB transceiver interface logic. The architecture is built on a 90nm CMOS process with 1.2V core operation, leveraging Altera's adaptive logic module (ALM) structure that contains eight 4-input look-up tables (4-LUTs) per ALM, giving improved logic packing efficiency over the prior Stratix generation. The transceiver blocks support multiple serial protocols through a programmable PCS layer. Typical applications include high-speed serial interface prototyping, PCIe Gen1/Gen2 endpoint or root-port designs, telecom backplane aggregation, video broadcast routing, and ASIC prototyping for protocols requiring 6.375 Gbps links. The wide transceiver count is the dominant value proposition versus general-purpose FPGAs of equivalent logic density. When designing with EP2SGX60F1508, ensure the PCB has matched 100-ohm differential routing for all transceiver pairs with skew under 1 ps to preserve eye margin. The 1508-pin FBGA requires a multilayer PCB with microvia stack-ups because the 1.0mm pitch cannot be reliably fan-routed with through-hole vias on standard 4-layer boards. This page synthesizes distributor stock, same-family Stratix II GX drop-in alternatives, and design notes (transceiver layout, power-rail sequencing) that the manufacturer datasheet alone does not consolidate for engineers evaluating this mature part.
EP2SGX60F780 - Stratix II GX FPGA 60K LE | Altera
The Altera (now Intel) EP2SGX60F780 is a Stratix II GX Field Programmable Gate Array (FPGA) from the 780-pin FBGA package family, integrating 60,440 logic elements and 2,544,192 bits of embedded memory on a 90 nm process node. The device features high-speed serial transceivers supporting multi-gigabit serial interfaces, hardened PHY IP for protocols such as PCI Express and serial RapidIO, and dedicated DSP blocks for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O cells that can be customized by the designer after manufacturing. FPGAs belong to the broader family of programmable logic devices (PLDs), alongside CPLDs and structured ASICs, and serve as the highest-density, highest-performance option in this category. Stratix II GX is a derivative of the Stratix II family that adds multi-gigabit transceivers for serial connectivity, making it a hybrid programmable-logic-plus-serdes platform used in communications, video, and high-performance computing subsystems. Key features of the EP2SGX60F780 include embedded transceiver channels that handle rates from 600 Mbps to 6.375 Gbps, adaptive equalization and pre-emphasis on the physical media, on-chip termination, and a hard PCI Express x1/x4 IP core. The device supports up to 12 transceiver channels per device in the high-density variants and integrates 384 18x18 multipliers in the DSP block array. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes, with built-in encryption using AES for secure bitstream loading. Architecturally, Stratix II GX employs the ALM (Adaptive Logic Module) as its basic logic element, replacing the older 4-input LUT of Stratix with an 8-input fractured LUT structure that delivers up to 25% higher performance and 2x the density per area. The transceiver physical media attachment (PMA) layer is hardened silicon, while the physical coding sublayer (PCS) is implemented in soft logic, enabling flexible protocol customization. The 780-pin FBGA package delivers high pin density for memory-rich and transceiver-rich designs while maintaining signal integrity at multi-gigabit rates. Typical applications for the EP2SGX60F780 include 10G Ethernet switching and bridging, PCI Express endpoint and root-complex designs, baseband processing in wireless infrastructure, HD-SDI video broadcast equipment, and storage area networking using serial RapidIO. The combination of logic capacity, transceiver bandwidth, and DSP throughput makes it well-suited for line-card designs, protocol bridges, and high-speed image processing pipelines. When designing with this device, plan thermal management carefully: Stratix II GX FPGAs can dissipate 10-25 W in the 780-BGA depending on transceiver utilization and clock rates. A multilayer PCB with adequate copper area and thermal vias under the exposed die pad is required. Quartus II software is used for synthesis, place-and-route, and timing closure, with transceiver toolkit support for PMA/PCS bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance that the manufacturer datasheet alone does not provide, giving procurement and engineering teams a single decision-ready reference.
EP2SGX60FF1152 - Stratix II GX FPGA 60K LE 1152-BGA | Altera
The Altera (now Intel) EP2SGX60FF1152 is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) with embedded transceivers, integrating 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 1152-ball FineLine BGA package. The device combines a 90 nm CMOS logic fabric with up to 3.125 Gbps embedded transceivers, making it well suited for high-speed serial I/O, digital signal processing, and communications infrastructure designs. The FF1152 package uses a 1.0 mm ball pitch and includes 364 user I/O pins for system connectivity. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic and routing interconnects are configured by the end user after manufacturing. FPGAs occupy a tier of programmable logic that includes CPLDs (smaller, non-volatile) at the low end, FPGAs (volatile SRAM-based, high density) in the middle, and Structured ASICs / HardCopy at the high end. Stratix II GX devices specifically target high-bandwidth serial connectivity by integrating multi-gigabit transceivers directly on die, eliminating the need for external PHY chips. Key features of the EP2SGX60FF1152 include 12 embedded transceivers operating up to 3.125 Gbps, 16 DSP blocks totaling 192 18x18 multipliers for high-throughput signal processing, and dedicated hardware for source-synchronous interfaces including DDR/DDR2/QDR memory controllers. The device supports up to 4 PLLs and supports JTAG-based configuration via the IEEE 1149.1 standard. The architecture is built on a 90 nm SRAM-based fabric with 8-input adaptive logic modules (ALMs) — twice the density of the previous Stratix generation. Each ALM contains two combinational adaptive LUTs and two registers, providing flexible logic mapping. The memory subsystem consists of TriMatrix embedded SRAM blocks (M512, M4K, M-RAM) configurable as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO. The chip integrates 16 full-duplex transceiver channels grouped into four banks, each with dedicated clock data recovery and serializer/deserializer logic. Typical applications include 10 Gb Ethernet network interface cards, SONET/SDH framer/mapper devices, wireless baseband processing, high-definition video broadcast equipment, and PCI Express endpoint cards. The FF1152 package's large pin count also suits high-density prototyping of ASIC and Structured ASIC designs. A critical design consideration is power supply sequencing — Stratix II GX devices require multiple voltage rails (VCCINT, VCCIO, VCCA, VCCR, VCCT, VCC_PLL) brought up in a specific order to avoid device damage. Designers should also budget for the device's high transient current during configuration, typically requiring high-frequency decoupling within 50 mils of every power pin. This page synthesizes distributor pricing, drop-in package alternatives, parametric comparison, and PCB design notes for engineers sourcing or qualifying the EP2SGX60FF1152, supplementing the manufacturer's datasheet with practical cross-reference data.
EP2SGX90EF1152C3 - Stratix II GX FPGA 90K LE 1152-FBGA | Intel
The Intel EP2SGX90EF1152C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits (4.5 Mbit), 558 user I/Os, and 4,548 LABs/CLBs, packaged in a 1152-ball FineLine BGA (FBGA). Built on a 90 nm process, the EP2SGX90 integrates up to 12 transceivers operating at 6.375 Gbps, dedicated DSP blocks, and TriMatrix memory blocks for high-performance signal processing. An FPGA is a semiconductor integrated circuit that can be programmed and reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) along with CPLDs; modern high-end FPGAs like the Stratix II GX family also embed hard IP such as multi-gigabit transceivers, PLLs, and DSP multipliers, making them functionally closer to a System-on-Chip than a simple gate array. The Stratix II GX architecture introduced ALM (Adaptive Logic Module) blocks, an improvement over the classic 4-input LUT architecture used in earlier Stratix devices, enabling tighter logic packing and faster timing closure. Key features of the EP2SGX90EF1152C3 include 4 PLLs, 12 multi-gigabit transceivers (3.125-6.375 Gbps), embedded DSP blocks (approximately 384 18x18 multipliers), and 4.5 Mbit of on-chip RAM. The 1152-FBGA package supports 558 user I/Os, enabling high-bandwidth parallel interfaces alongside serial links. The device operates from a 1.2 V core supply with separate VCCPD, VCCA, and VCCP supplies for I/O and analog blocks. Typical applications include high-speed serial backplane aggregation, telecom line cards, video broadcast infrastructure, military signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes this device well-suited to applications that would otherwise require a discrete SERDES plus a large FPGA. Designers should provide clean, decoupled supply rails for VCCINT (1.2 V), VCCPD, VCCA, and VCCP, follow Altera/Intel reference design layout guidelines for the FBGA-1152 package, and validate transceiver channel performance against the IBIS-AMI models in the Quartus II design suite. The C3 speed grade offers typical commercial operating performance.
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
The Intel EP2SGX90EF1152C3ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 90,960 logic elements backed by 4,520,448 bits of embedded memory and 558 user I/O pins in a 1152-ball FineLine BGA (FBGA) package. It integrates up to 12 transceivers (per family spec) capable of multi-gigabit serial I/O for backplane and chip-to-chip links, making it a workhorse for wired communication, broadcast video, and high-speed instrumentation. The 'C3' speed grade combined with the commercial-extended temperature suffix ('ES') targets -40 C to +100 C operation, while the 'E' denotes enhanced 1.5 V core VCC. An FPGA is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, in contrast to ASICs whose function is fixed at tape-out. Stratix II GX sits in the hierarchy: programmable logic device -> FPGA -> high-speed-transceiver-equipped FPGA -> Altera Stratix II GX family, designed for prototyping, low-volume production, and designs that benefit from hardware-level parallelism combined with 6.375 Gbps class serial links. Key features include 4,520,448 bits of embedded RAM (approximately 4.5 Mbit, distributed + block), dedicated DSP blocks for fixed/floating-point arithmetic, 12 high-speed transceivers with embedded CDR, support for PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet hard IP, and a robust clock management network with PLLs covering the device edge and core. The 1152-BBGA package exposes 558 user I/O across 24 user-I/O banks, providing flexible single-ended and differential signaling for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Typical applications include 10 Gbps-class data aggregation switches, broadcast video format converters, radar and software-defined radio digital front-ends, ASIC prototyping for communications SoCs, and PCIe Gen1 endpoint cards. The transceiver-rich architecture also suits test-and-measurement chassis that aggregate many Gbps lanes into a single FPGA for real-time DSP.
EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
The Intel EP2SGX90EF1152C3N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs/CLBs, 4,520,448 bits of embedded memory, and 558 user I/Os, housed in a 1152-ball FC-FBGA package. Built on a 90nm process technology, the device operates at a core voltage of 1.2V and supports transceiver performance up to 816.9 MHz, making it suitable for high-speed serial connectivity and DSP-intensive workloads. The "EF" speed grade designation indicates the device's place in Stratix II GX timing closure, while the C3 commercial temperature grade and the "N" lead-free suffix confirm RoHS-compliant operation from 0C to +85C. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP such as transceivers, block RAM, and DSP blocks. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs - offering ASIC-class parallelism and throughput while preserving full post-production reprogrammability. Stratix II GX is Intel's (formerly Altera's) high-end transceiver-equipped family, positioned for serial connectivity, video processing, and communications infrastructure where parallel DSP and high I/O count are required. Key features of the EP2SGX90EF1152C3N include up to 12 transceivers supporting SERDES rates commonly used in the Stratix II GX family, dedicated embedded multiplier blocks for DSP, distributed and block RAM, and on-chip PLLs. The 1152-ball flip-chip BGA package provides the high-pin-count escape routing required to bring 558 user I/Os off-die while supporting the high-power transceivers. A rich configuration options set (Fast Passive Parallel, Active Serial, JTAG) makes the part deployable in production and in-field update scenarios. Typical applications include 10G/1G Ethernet line cards, wireless baseband processing, broadcast video routers, high-speed serial protocol bridging (PCI Express, Serial RapidIO, XAUI), and military/aerospace signal processing. The high logic density combined with embedded transceivers allows single-chip implementation of multi-channel data-path designs that previously required an FPGA plus an external PHY. When designing with this device, pay close attention to transceiver reference-clock jitter, PCB stack-up for BGA escape, and power-rail sequencing on the 1.2V core. Thermal management is critical because the FC-FBGA package concentrates heat from the transceiver channels. Use the Quartus II design software (or its supported successors) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package variants, and design considerations that go beyond the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP2SGX90EF1152C3N.
EP2SGX90EF1152C4 - 90,960-Cell Stratix II GX FPGA
Altera EP2SGX90EF1152C4 is a high-density Stratix II GX field-programmable gate array with 90,960 logic cells, 558 user I/O, and a 1.2 V core supply specification, housed in a 1152-ball FC-FBGA package. The device is implemented using 90 nm CMOS technology and is intended for high-speed, logic-intensive embedded and communications systems. The verified search data identifies 4,548 LABs, a maximum frequency value of 732.1 MHz, and a 1152-pin package designated FC-FBGA, FBGA-1152, or 1152-BBGA in distributor listings. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic, interconnect, memory, and I/O resources. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are used to implement digital processing, interface bridging, control, and protocol functions. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The Stratix II GX family adds high-speed transceiver-oriented functionality to the programmable-logic architecture, while the exact transceiver count and electrical characteristics must be confirmed from the complete manufacturer documentation. The principal verified features are 90,960 cells, 558 I/O, 1.2 V technology supply, 90 nm process technology, and 1152-ball surface-mount packaging. The reported maximum frequency is 732.1 MHz in one source and 717 MHz in another source; therefore, the discrepancy is retained rather than reconciled by assumption. The device also appears in verified distributor data as a field-programmable gate array with 4,548 LABs. Its large logic capacity makes it suitable for parallel datapaths, multi-channel interface aggregation, and systems requiring configurable control and processing blocks. The architecture combines programmable logic fabric with package-level I/O resources and is designed for high-density digital implementation. The 90 nm process supports a substantial logic-cell count while the 1.2 V supply designation provides a defined electrical boundary for system power planning. The available search results confirm the device family, cell count, process technology, frequency figures, and package type, but do not provide complete transceiver specifications, configuration-memory details, operating-temperature grades, or absolute maximum ratings. Typical applications include communications infrastructure, industrial automation, high-speed test equipment, and embedded systems that require configurable digital processing. The 558 I/O resources support multiple parallel interfaces, while the 90,960-cell capacity can accommodate large state machines, protocol-processing logic, and data-path functions. The FC-FBGA package requires careful ball mapping, controlled-impedance routing, and thorough signal-integrity review during PCB design. Designers should obtain the complete manufacturer datasheet and verify the target speed grade, I/O bank restrictions, transceiver configuration, power sequencing, thermal limits, and package ball assignments before release. Because the supplied data contains conflicting frequency values and omits several device specifications, those parameters are not inferred. Pricing and stock should be confirmed with the distributor at the time of purchase, as availability may change rapidly. This page synthesizes verified distributor and manufacturer-oriented search results, preserves conflicting frequency figures, identifies the confirmed Stratix II GX architecture and 1152-ball package, and provides application and sourcing context beyond a single catalog listing. It does not replace the manufacturer datasheet or a formal PCB-level qualification.
EP2SGX90EF1152C4ES - Stratix II GX 90K LE FPGA, 558 I/O, 1152-FBGA
The Intel (formerly Altera) EP2SGX90EF1152C4ES is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,448 bits of embedded RAM, and up to 558 user I/O pins, fabricated on a 90 nm process and supplied from a 1.2 V core rail. The device is housed in a 1152-ball flip-chip FineLine BGA (FC-FBGA) package and is rated for the commercial-extended temperature range. It also integrates dedicated multi-gigabit transceivers and embedded multipliers targeting high-throughput signal-processing pipelines. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, and DSP pipelines on a silicon fabric that is configured after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs trade raw per-gate efficiency for design flexibility and rapid time-to-market, and they are commonly used for prototyping, low-volume production, and applications where standards or algorithms evolve frequently. Key features of the EP2SGX90EF1152C4ES include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks for high-speed multiply-accumulate operations, dedicated serializer/deserializer (SERDES) channels supporting multi-gigabit serial protocols, and 558 user I/O pins compliant with multiple single-ended and differential I/O standards. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, and includes on-chip PLLs for clock management. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with embedded transceivers capable of multi-gigabit serial interfaces such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 90 nm process node and dedicated hard IP blocks deliver deterministic latency for serial connectivity, while the TriMatrix memory subsystem allows wide, high-throughput on-chip data buffers for packet processing and DSP. Typical applications for this part include high-speed serial interface bridging, telecommunications backplane aggregation, military and aerospace signal processing, industrial imaging pipelines, ASIC prototyping, and test and measurement instrumentation. The wide I/O count and embedded multi-gigabit transceivers make it particularly well-suited to designs that require both rich parallel connectivity and high-speed serial links on a single device. When designing with this FPGA, ensure that the 1152-ball FC-FBGA land pattern and ball-attach process match the manufacturer's recommended reflow profile, and that the PCB stack-up provides sufficient microvia and via-in-pad capacity for the BGA escape routing. Power-rail sequencing and decoupling must follow the Stratix II GX pin connection guidelines, and the device requires a configuration device or JTAG programmer for first-time bitstream load. This page synthesizes distributor stock levels, drop-in alternatives from the same Stratix II GX family, and practical design notes that complement the manufacturer datasheet for the EP2SGX90EF1152C4ES.
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX90EF1152C4N is a high-density Stratix II GX family field-programmable gate array (FPGA) with 90,960 logic elements (LE), 4,520,448 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 1152-ball fine-pitch BGA (FC-FBGA / FBGA-1152) package. It operates across a 1.2 V core supply with multiple I/O bank voltages and supports up to 558 user I/O pins, with 4,548 LABs arranged to deliver high logic density for DSP- and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and routing interconnects. In the wider hierarchy, FPGAs sit above microcontrollers and ASICs in reconfigurability, and below ASICs in performance-per-watt. The Stratix II GX family is positioned as a transceiver-rich, DSP-capable platform used in telecom, video processing, and high-speed serial-link designs. Key features of the EP2SGX90EF1152C4N include 90,960 logic elements, 4.5 Mbit embedded memory, embedded DSP blocks for high-throughput signal processing, and up to 20 full-duplex CDR-based transceivers reaching 6.375 Gbps per channel. The 1152-ball FC-FBGA package supports high pin counts for parallel and serial I/O simultaneously, and the C4 speed grade balances Fmax and timing closure across industrial temperature ranges. The device is built on a 90 nm process node with a 1.2 V core. The Stratix II GX architecture uses adaptive logic modules (ALMs) rather than older 4-input LUTs, with each ALM capable of implementing any 7-input function or multiple smaller functions for finer logic packing. Embedded transceivers support CPRI, OBSAI, Serial RapidIO, PCIe, and custom serial protocols up to 6.375 Gbps, while the dedicated DSP blocks deliver up to 18x18-bit signed multiplication per cycle. TriMatrix memory blocks (MLABs, M512, M4K, M-RAM) are interleaved across the fabric to optimize both small and large memory buffering. Typical applications include high-end telecom baseband and packet processing, broadcast video bridge and router designs, high-speed serial protocol test equipment, defense and aerospace signal processing, and PCI Express endpoint/root port cards. Designers also use this device for ASIC prototyping due to its high LE count and abundant I/O bandwidth. Engineering trade-offs to consider include the 90 nm power profile (higher static leakage versus newer 40/28/20 nm Stratix IV/V/A10 families), the large 1152-ball BGA which demands 8+ layer PCB with controlled-impedance routing, and the C4 speed grade's timing margin relative to C5 or I-grade variants.
EP2SGX90EF1152C5 - Stratix II GX FPGA 90K LEs 1152-FBGA | Intel
The Intel (Altera) EP2SGX90EF1152C5 is a high-density, high-performance Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 embedded 18x18 multipliers into a 1152-ball FineLine BGA (FCBGA) package measuring 35 mm x 35 mm. The device combines a 90 nm logic fabric with up to 20 transceivers capable of multi-gigabit serial I/O, making it a long-standing reference design for high-bandwidth wireline and embedded compute systems. A Field Programmable Gate Array (FPGA) is a programmable logic device built from configurable logic blocks, programmable interconnects, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the wider taxonomy of programmable logic devices, alongside CPLDs, and are widely used as application-specific accelerators in place of fixed-function ASICs. The Stratix II GX family, specifically, adds embedded transceivers that distinguish it from general-purpose Stratix II devices for serial connectivity. Key differentiating specifications include 4,520,448 total RAM bits, 558 dedicated 18x18 multipliers for DSP workloads, integrated multi-gigabit transceivers, and a core voltage range of 1.15 V to 1.25 V. The 1152-ball FCBGA package supports the high I/O count required by parallel memory buses and multi-channel serial links simultaneously. Combined with 90 nm process technology, the device balances logic density with low-jitter transceiver performance. Architecturally, the Stratix II GX uses an ALM-based logic fabric with adaptive look-up tables, dedicated on-chip memory blocks, and embedded transceivers capable of rates commonly used in 2005-2010 generation telecom and storage backplanes. The 558 embedded multipliers enable high-throughput DSP pipelines without consuming general logic, while 4.5 Mbits of RAM are distributed across TriMatrix memory blocks for flexible buffering. Typical applications include high-speed serial backplane aggregation, telecom line cards, broadcast video processing, military secure communications, and ASIC prototyping. The combination of logic density and integrated transceivers also makes it suitable for software-defined radio front-ends and test equipment requiring parallel DSP. When designing with this FPGA, allocate sufficient decoupling across VCCINT, VCCA, and transceiver supply rails, and follow Intel/Altera's pinout guidelines for the 1152-ball FCBGA. Designers should also confirm Quartus II support versions match the device before board bring-up. This page synthesizes distributor stock, drop-in Stratix II GX alternatives, and design guidance that the manufacturer datasheet alone does not provide in a single view.
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
The Intel (Altera) EP2SGX90EF1152C5ES is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 90 nm process, the Stratix II GX family integrates up to 20 transceiver channels operating at 6.375 Gbps, making this device a drop-in solution for high-speed serial I/O, embedded processing, and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that allows engineers to implement arbitrary digital logic using configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): unlike microcontrollers they execute logic in hardware rather than software, and unlike ASICs they can be re-programmed in the field. Stratix II GX belongs to Altera's high-end FPGA taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and was the industry's first 90 nm FPGA with embedded transceivers. Key features of the EP2SGX90EF1152C5ES include 12 embedded transceiver blocks supporting CPRI, OBSAI, Serial RapidIO, PCI Express, and Gigabit Ethernet protocols, 384 (18x18) multipliers for DSP workloads, an on-chip 36-block RAM architecture totalling approximately 4.5 Mbits, and a hard PCI Express x1/x4 endpoint block. The 1152-FBGA package exposes 558 user I/Os and supports hot-socketing for in-system reprogramming without board power-down. Architecturally the device pairs an adaptive logic module (ALM) based core fabric with a row-and-column interconnect, enabling high utilisation at clock rates up to 450 MHz internally. The Stratix II GX transceiver macros embed clock-data recovery (CDR), serializer/deserializer (SERDES), and pre-emphasis/equalisation blocks that replace external PHY silicon. The 'C5' speed grade reflects a commercial temperature range (0C to +85C) with the timing closure typical of mid-tier speed bins. Typical applications include 4G base-station baseband processing, radar and electronic-warfare front-ends, high-resolution medical imaging pipelines, high-end broadcast video routing, and ASIC prototyping for networking line cards. The combination of embedded multi-gigabit transceivers and DSP blocks makes the EP2SGX90EF1152C5ES particularly well suited to designs where parallel DSP plus serial backplane connectivity must coexist on a single device. When designing with this FPGA, plan the power-decoupling network carefully: Stratix II GX devices can draw transient currents exceeding 20 A during configuration. Use a multi-rail power-supply architecture (typically 1.2 V core, 2.5 V/3.3 V I/O, 1.2 V PLL, and 1.2 V transceiver analog) and follow Altera's recommended power-up/-down sequencing. Quartus II software with Service Pack 2 or later is required to compile designs targeting this device. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not collected in any single manufacturer document.
EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel
The Intel (formerly Altera) EP2SGX90EF1152C5N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 90,960 logic elements, 4,548 logic array blocks, and 4,520,448 bits of embedded RAM, housed in a 1152-ball FC-FBGA package. The device integrates up to 12 transceivers supporting data rates up to 6.375 Gbps, making it well suited for high-speed serial I/O applications such as backplanes, chip-to-chip links, and proprietary serial protocols. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and belong to the integrated circuits (IC) family, with variants including SRAM-based, flash-based, and antifuse-based architectures. Modern high-end FPGAs such as the Stratix II GX family integrate hard IP cores (transceivers, DSP blocks, memory interfaces) alongside general-purpose fabric, allowing one device to replace multiple discrete components on a board. Key features of the EP2SGX90EF1152C5N include 558 user I/Os, support for DDR/DDR2/QDRII memory interfaces, dedicated DSP blocks for high-throughput arithmetic, and a 1.2 V core supply with 90 nm process technology. The part operates over the commercial temperature range (0C to +85C) and is offered in a -5 speed grade. The 1152-ball flip-chip BGA package enables high pin density while supporting the high-speed signal integrity required by multi-gigabit transceivers. The Stratix II GX architecture employs an adaptive logic module (ALM) structure that improves logic efficiency versus prior 4-input LUT architectures, delivering higher effective logic capacity per die area. The integrated transceivers incorporate built-in clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, XAUI, and CEI-6G without external PHY devices. Typical applications include high-speed serial backplane interfaces, telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, and protocol bridging ASIC prototyping. The combination of logic density and integrated multi-gigabit transceivers lets designers consolidate what would otherwise be a discrete ASSP plus FPGA solution onto a single device. When designing with this part, pay close attention to power supply sequencing, PCB BGA fanout, and signal-integrity constraints on the transceiver channels. Reference designs and the Stratix II GX Device Handbook should be consulted for transceiver channel routing, decoupling strategies, and JTAG configuration circuit requirements. Designers should also note that the EP2SGX90 family is in its mature product lifecycle and may require sourcing through distribution channels. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, comprehensive reference for sourcing and designing with the EP2SGX90EF1152C5N.