FPGA и CPLD
Товары (6666)
EP3CLS200F780C7 - 198K LE Cyclone III LS FPGA | Intel / Altera
The Intel / Altera EP3CLS200F780C7 is a high-density, low-power Field Programmable Gate Array (FPGA) from the Cyclone III LS family, delivering 198,464 logic elements in a 780-ball FineLine BGA (FBGA-780) package. It integrates 7.83 Mbit of embedded memory, 429 user I/Os, and operates across an industrial temperature range from 0C to +70C with a 1.15 V to 1.25 V core supply. The device is fabricated on a low-power CMOS process and is rated for up to 450 MHz internal operation. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, an FPGA's logic and routing can be redefined after manufacture via a configuration bitstream loaded into on-chip SRAM. In the broader taxonomy, FPGAs sit between microcontrollers (fixed instruction sets, software-defined behavior) and ASICs (fixed hardware, optimized for a single function), offering hardware-timed parallelism for DSP, video, communications, and protocol bridging. The Cyclone III LS family specifically targets cost- and power-sensitive applications with hardening features such as on-chip termination and dedicated memory interfaces. Key features include 198,464 logic elements (LEs), 413 Kbit of distributed embedded memory per the standard Cyclone III block, 8 embedded memory blocks per logic array block group, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) via dedicated PHY, and dedicated hardware multipliers for DSP. The 780-ball FBGA package with 1 mm pitch and 29 mm x 29 mm body allows high I/O count while remaining manageable for mid-density PCB manufacturing. The Cyclone III LS architecture combines an SRAM-based lookup table fabric with embedded 18x18 multipliers, dual-purpose registers on every I/O pin, and per-channel PLLs that synthesize multiple clock domains from a single reference. Configuration is loaded from a serial NOR flash, JTAG, or via a passive serial / parallel interface. The on-chip memory controller hard IP supports DDR, DDR2, QDRII, and RLDRAM II, removing the need for an external PHY in many designs. Typical applications include industrial motor control, video processing and display controllers, telecom baseband preprocessing, software-defined radio front ends, and low-cost ASIC prototyping. The Cyclone III LS family is widely used in cost-optimized designs where Cyclone V silicon is overkill but microcontroller throughput is insufficient. When designing with the EP3CLS200F780C7, ensure adequate decoupling on every VCCINT and VCCA rail (100 nF plus 10 uF bulk), maintain signal integrity on high-speed LVDS pairs with matched-length routing, and respect JTAG chain topology when multi-device configuration is required. Quartus II software (version 13.0sp2 and later 13.x service packs) is the recommended design environment and is still required for legacy Cyclone III LS bitstream generation. This page synthesizes distributor pricing, drop-in pin-compatible alternatives in the FBGA-780 footprint, and practical design notes not aggregated in the manufacturer datasheet. Cross-references are drawn from DigiKey, Mouser, and Octopart listings verified as of 2026-09-09.
EP3CLS200F780C7N - 198K LE Cyclone III LS FPGA 780-BGA | Altera
The Altera (now Intel) EP3CLS200F780C7N is a low-power Cyclone® III LS family field-programmable gate array (FPGA) delivering 198,464 logic elements, 7,829 Kbit of embedded memory, and 413 (18x18) multipliers in a 780-ball fine-pitch BGA package. Per the Cyclone III LS Device Data Sheet, this Cyclone III LS variant adds dedicated cryptographic and tamper-protection hardware to the mainstream Cyclone III architecture for security-sensitive applications. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip memory and DSP resources that the designer programs after manufacture. FPGAs sit hierarchically between ASICs (lower unit cost, higher NRE) and microcontrollers (lower flexibility, lower performance). The Cyclone III LS family is the low-power, security-enhanced successor to Cyclone II within Altera's mid-range portfolio, and it targets applications that need a balance of logic density, DSP throughput, and predictable power consumption. Key features of the EP3CLS200F780C7N include 198,464 logic elements, 7,829 Kbit embedded RAM, 4 PLLs, 413 (18x18) hardware multipliers, and 20 global clock networks. The 780-BGA package exposes the maximum I/O count for this die (up to 429 user I/Os depending on configuration scheme), and the -7 speed grade places this part in the mid-speed bin of the family. Core supply is 1.2 V with separate VCCPD and VCCIO banks for I/O standards. The Cyclone III LS architecture pairs the established Cyclone III logic fabric with on-die AES, SHA, and key-storage blocks together with JTAG tamper detection. This combination lets designers implement encryption, secure boot, and IP protection without external secure-elements, which is why the LS variant is widely deployed in industrial control, secure communications, and military/aerospace platforms that demand both high logic density and supply-chain assurance. Typical applications include industrial motor control and factory automation, secure communications baseband, military and aerospace signal processing, video surveillance, and portable test and measurement equipment. The 198K-LE density tier positions this part above the Cyclone III LS EP3CLS100 and below the EP3CLS200 (same density) in larger packages, giving designers a common RTL target across board variants. When designing with this device, pay close attention to the configuration scheme (AS, PS, JTAG, or FPP) because it changes which balls carry user I/O versus configuration pins. Use Quartus II (or the current Intel Quartus Prime Cyclone III support package) for synthesis, place-and-route, and power estimation, and follow Altera's PCB layout guidelines for fine-pitch BGA fan-out. This page consolidates distributor pricing, same-die drop-in alternatives in alternative packages, and practical design notes that go beyond the manufacturer's datasheet table.
EP3CLS200F780C8 - Cyclone III LS FPGA, 198K LE, 780-BGA | Altera
The Altera (Intel Programmable Solutions Group) EP3CLS200F780C8 is a Cyclone III LS low-power Field-Programmable Gate Array delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O in a 780-ball FineLine BGA (FBGA-780) package at 29 x 29 mm with 1 mm pitch. The device operates from a 1.2 V core supply, is fabricated on a 60 nm TSMC CMOS process, and is specified for commercial temperature grades. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O are configured by loading a user-defined bitstream into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below ASICs, and offer the highest logic density and richest DSP/memory capability for parallel processing. The Cyclone III LS family is Altera's low-power FPGA line, engineered to balance logic density with static and dynamic power reduction features such as programmable power technology and hot-socketing. Key features of the EP3CLS200F780C8 include four phase-locked loops (PLLs) for clock management, embedded multiplier blocks supporting DSP operations up to 18 x 18 bits, 8 Mb of distributed plus block RAM, and dedicated high-speed serial interfaces absent on this fabric variant. The 'C8' speed grade targets an internal logic performance near 400 MHz depending on routing and design style. The 'LS' suffix denotes the Cyclone III LS sub-family, sharing the Cyclone III architecture with low-power enhancements. Typical applications include industrial motor control, video processing pipelines, prototyping bridges, telecom line cards, and medium-density data acquisition front-ends. The 780-BGA package provides the largest pin count in the Cyclone III LS portfolio, enabling wide parallel buses and many LVDS pairs. When designing with this part, allocate I/O banks carefully against the 1.2 V core and banked I/O supply rails, and plan JTAG configuration via the dedicated configuration pins. This page synthesizes distributor stock, same-family drop-in alternatives, and PCB-level design guidance not compiled in the bare manufacturer datasheet.
EP3CLS200F780C8ES - 198K LE Cyclone III LS FPGA | Intel
The Intel (formerly Altera) EP3CLS200F780C8ES is a low-power, high-volume Cyclone III LS Field-Programmable Gate Array (FPGA) with 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 maximum user I/Os, housed in a 780-ball FineLine BGA (FBGA-780) package. Built on a 65 nm TSMC low-power process, it operates from a 1.2 V core supply and delivers industrial-grade performance at typical logic-clock frequencies up to 402 MHz. The device integrates 12404 logic array blocks (LABs), 396 embedded multipliers (18x18), and four phase-locked loops (PLLs) for clock management. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (LBs / LABs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA is a type of programmable logic that sits between fixed-function ASICs and microcontrollers: unlike an ASIC it is post-fabrication reconfigurable, and unlike an MCU it achieves deterministic parallel logic execution rather than sequential firmware. The Cyclone III family specifically targets cost-sensitive, high-volume applications where power, density, and I/O count matter more than the highest possible clock speed. Key features include hot-socketing support, on-chip termination (OCT) with calibrated impedance, support for LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards, and an extended industrial junction temperature range. The Cyclone III LS sub-family adds design-security features including configuration bitstream encryption via AES and a robust JTAG-driven configuration chain that makes it suitable for safety-sensitive and IP-protected systems. The 780-ball FBGA package uses Intel's lead-free, RoHS-compliant FineLine BGA ball pitch to maximize board-level routability while keeping the footprint compact for the device's logic capacity. Typical applications include industrial motor control, video surveillance and machine-vision pipelines, telecommunications line cards, factory automation, military/aerospace ground systems, and medical imaging front-ends. The combination of 8.2 Mbits of block RAM and 396 DSP blocks is particularly well suited to high-throughput signal processing in mid-range DSP and video-broadcast equipment. Compared with the non-LS Cyclone III variants, the LS sub-family offers enhanced security and reliability features demanded by defense and industrial-control customers. When designing with this device, plan for a multi-rail power architecture (1.2 V core plus PLL analog and I/O banks) and follow Intel's published power-up sequencing guidelines to keep the configuration logic in a defined state. Use the Quartus II / Quartus Prime design toolchain for synthesis, place-and-route, and timing closure; the device is supported up to Quartus Prime 21.1 and Intel recommends migrating to newer Cyclone 10 LP or Cyclone V parts for new designs. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams evaluate the EP3CLS200F780C8ES for production or migration paths.
EP3CLS200F780C8N - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
The Intel EP3CLS200F780C8N is a low-power Cyclone III LS family Field Programmable Gate Array (FPGA) delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA (FBGA-780) package. The device is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply, with the C8 speed grade denoting a commercial temperature range and an 8 ns internal timing spec. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs and below ASICs - and allow hardware designers to implement arbitrary digital logic, custom processors, and parallel datapaths that can be reconfigured in the field. The Cyclone III LS family is the low-power, security-enhanced variant of Cyclone III, adding features such as bitstream encryption and configuration CRC for tamper-resistant designs. Key features of the EP3CLS200F780C8N include 198,464 logic elements, 8,211,456 bits of embedded SRAM (approximately 1,008 Kbytes), 413 maximum user I/O pins, four phase-locked loops (PLLs), and dedicated hardware multipliers for DSP workloads. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with on-chip termination for high-speed memory interfaces. Configuration can be loaded via JTAG, passive serial, or via a configuration flash, and the LS variant supports AES-128 bitstream decryption with tamper detection. The Cyclone III LS architecture combines a fine-grained logic fabric with columnar M9K block RAM tiles and 18x18 hardware multipliers, enabling efficient implementation of DSP pipelines, video processing, and embedded microcontrollers (Nios II soft-core). The 65 nm process and low-static-power design keep typical quiescent draw below 1 W even at high logic utilization, while the 780-FBGA package provides ample signal integrity margin for DDR2/DDR3 memory interfaces. Typical applications include industrial motor control, factory automation, video surveillance and image processing, automotive infotainment and driver-assist prototypes, medical imaging equipment, and software-defined radio baseband processing. The combination of high logic density and embedded multipliers makes it well-suited for parallel DSP algorithms such as FFTs, FIR filters, and forward error correction. When designing with the EP3CLS200F780C8N, ensure that all power rails (VCCINT, VCCA, VCCD_PLL, and bank I/O supplies) are decoupled with 100 nF and bulk capacitors placed close to the balls as recommended in the Intel hardware design guidelines. The configuration scheme must be selected early in the design cycle, since JTAG-only configurations cannot self-boot without an external flash. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet - including a parameter-by-parameter comparison against other Cyclone III and Cyclone IV devices and explicit guidance on selecting the correct speed/temperature grade for your application.
EP3CLS200F780I7 - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3CLS200F780I7 is a high-density, low-power Cyclone III LS Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package with industrial temperature grade (I7). The device integrates 198,464 logic elements, 8,475 Kbits of embedded memory, and 396 embedded 18x18 multipliers, delivering programmable logic capacity suitable for cost-sensitive digital signal processing, video bridging, motor control, and industrial protocol bridging. Core supply is 1.15 V to 1.25 V with support for multiple I/O standards including LVDS, LVTTL, and LVCMOS. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. After manufacture, the designer defines the digital function by loading a configuration bitstream into on-chip SRAM, making FPGAs ideal for prototyping, low-volume production, parallel DSP, and designs requiring frequent hardware revision. Cyclone III LS sits inside Intel's Cyclone III family hierarchy (Cyclone III -> Cyclone family -> low-cost FPGA -> FPGA -> programmable logic -> semiconductor), offering the lowest static power in the family while preserving the family's high logic density and DSP throughput. Key features of the EP3CLS200F780I7 include 4 phase-locked loops (PLLs), up to 429 user I/O pins, and dedicated hardware multipliers for DSP blocks. The LS variant reduces static power compared to the standard Cyclone III device through optimized process tuning, while retaining the same logic capacity and I/O bandwidth. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes for flexible design loading across production lines and field updates. The 780-pin FBGA package provides dense interconnect for high I/O-count designs, with lanes capable of supporting LVDS signaling for chip-to-chip high-speed links. Each LAB (Logic Array Block) groups 16 logic elements and is the basic building block of the Cyclone III LS fabric. The device targets applications where low static power, deterministic timing, and large logic capacity must be balanced with industrial-grade temperature operation. Typical applications include industrial motor and servo control, video processing and image buffering, automotive driver-assistance prototyping, telecommunications line-card glue logic, and software-defined radio front-ends. Designers select this device when deterministic latency, parallel DSP throughput, and flexible I/O standards are required. When designing with the EP3CLS200F780I7, ensure proper decoupling with 100 nF ceramic capacitors placed close to each power pin, follow Intel's recommended FPGA PCB layout guidelines for BGA fanout and ground stitching, and verify the Quartus II design software version supports the device family revision. Industrial temperature grade ensures operation from -40 C to +85 C ambient. This page synthesizes distributor inventory and pricing, drop-in alternatives sourced from the same Cyclone III LS family, application reference designs, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS200F780I7N - Cyclone III LS FPGA 198K LE | Intel | 780-FBGA
The Intel (formerly Altera) EP3CLS200F780I7N is a Cyclone III LS Field-Programmable Gate Array built on a low-power 65 nm CMOS process, delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA (FBGA-780) package. Speed grade -7, industrial temperature range (-40 °C to +100 °C junction), and core operation at 1.15 V to 1.25 V. The device integrates up to four PLLs, 425 18x18 multipliers, and Cyclone III LS series features that harden the device against single-event upsets for reliable operation in harsh environments. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the top of the programmable logic hierarchy - above CPLDs, PALs, and discrete glue logic - and serve as the prototypical "software-defined hardware" platform. The Cyclone III LS family specifically targets low-power, high-volume, reliability-sensitive applications and is positioned below Cyclone IV/V/10 in Intel's portfolio while above the original Cyclone series in capability. Key features include 198,464 logic elements (LEs), 8,211,456 RAM bits organized in M9K blocks, 425 18x18 hardware multipliers for DSP, four general-purpose PLLs, 413 maximum user I/O, 8 clock networks per quadrant, and the Cyclone III LS soft-error mitigation IP. The silicon also supports hot-socketing, partial reconfiguration, and configuration via passive serial, fast passive parallel, and JTAG modes. Compared with the non-LS Cyclone III EP3C120 in the same FBGA-780, the LS variant adds parity checking on internal memory and SEU-aware configuration scrubbing. From an architecture perspective, the EP3CLS200F780I7N leverages Intel's 65 nm TSMC process with copper interconnect and low-k dielectric, combining a four-input look-up table (LUT) logic element with dedicated carry chains, embedded memory blocks, and DSP blocks that each contain four 18x18 multipliers. The device achieves a maximum internal clock frequency of approximately 437.5 MHz (per published Cyclone III LS datasheet speed-grade tables) and is supported by Intel Quartus Prime (legacy Quartus II) design software for synthesis, place-and-route, and bitstream generation. Typical applications include industrial motor control, factory automation programmable logic controllers, low-cost ASIC prototyping, software-defined radio front-ends, video processing pipelines, machine vision interfaces, military/aerospace subsystems requiring SEU tolerance, and portable medical instrumentation. Designers also use the EP3CLS200 in telecom line cards, test-and-measurement chassis, and embedded vision modules where moderate logic density meets cost constraints. When designing with this device, carefully plan the power distribution network (PDN): a minimum of four PCB layers is recommended with continuous GND and 1.2 V planes, plus bulk decoupling within 25 mm of every VCCINT pin. The FBGA-780 land pattern requires 1.0 mm pitch with NSMD (non-solder-mask-defined) pads; follow Intel's package manufacturing guidelines to avoid tombstoning. Configuration scheme selection (AS vs. PS vs. JTAG) should be locked in early because it dictates the EPCS/EPCQ companion flash device. This page consolidates distributor stock levels, verified drop-in replacements in the same FBGA-780 footprint, and practical layout notes not found in a single datasheet - giving design engineers and buyers an actionable reference for Cyclone III LS device selection.
EP3CLS200F780I8N - 198K LE Cyclone III LS FPGA, 780-FBGA | Altera
The Altera (now Intel) EP3CLS200F780I8N is a high-density, low-power Field Programmable Gate Array (FPGA) from the Cyclone® III LS family, fabricated on a 65 nm CMOS process and supplied in a 780-ball FineLine BGA (FBGA) package. It integrates 198,464 logic elements, 8,211,456 bits of embedded memory, and 4 multiplies-per-18x18 DSP blocks architecture, operating at a core voltage of 1.2 V with a maximum internal clock frequency up to 402 MHz. The device carries the industrial temperature grade (-40 °C to +100 °C) and is offered in speed grade 8 with Pb-free / RoHS-compliant FBGA packaging. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and ASICs (which are fixed-function), and they allow hardware-level parallelism for DSP, packet processing, and interface bridging. The Cyclone III LS family is positioned as a low-power, security-enhanced variant of the Cyclone III series aimed at industrial, communications, and automotive-assist designs. The EP3CLS200F780I8N features 8 input/output banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVCMOS, SSTL, HSTL), up to 16 global clock networks, and 8 PLLs for fine-grained clock management. The device also includes dedicated hardware for CRC, bit-stream encryption, and JTAG-based configuration, which collectively support design-security requirements common in industrial-control and defense-adjacent systems. Architecturally, the part uses an SRAM-based configuration cell (volatile, requiring an external configuration flash or controller), 4-wire serial or parallel configuration interfaces, and supports passive/active serial and JTAG modes. Embedded multipliers and block RAM are arranged in columns to deliver predictable DSP performance for FIR filters, FFTs, and baseband signal processing. Typical applications include industrial motor control, factory-automation protocols (EtherCAT, PROFINET, Modbus bridging), medical imaging front-end preprocessing, telecom line-card glue logic, broadcast video processing, and avionics/ruggedized video links. Designers frequently pair the EP3CLS200F780I8N with external DDR2/DDR3 SDRAM, Ethernet PHYs, and high-speed ADC/DAC components. Design consideration: route all global clock and PLL supply pins (VCC_PLL, VCCA_PLL) with dedicated ferrite-bead-isolated power islands and place configuration-mode pull-up resistors per the Cyclone III LS handbook. Avoid using the same bank for both 2.5 V LVCMOS and 3.3 V LVTTL signalling without a level-shifter because the I/O bank VCCIO must be common. This page synthesizes distributor pricing, drop-in same-brand package variants, and practical design notes for the EP3CLS200F780I8N not consolidated on the manufacturer product brief.
EP3CLS70F484C7 - Cyclone III LS FPGA 70K LE | Altera | 484-FBGA
The Altera (Intel) EP3CLS70F484C7 is a Cyclone III LS family Field Programmable Gate Array (FPGA) with 70,208 logic elements, 2.93 Mbit embedded memory, and 278 18x18 multipliers, housed in a 484-pin FineLine BGA package. It operates from a 1.15 V to 1.25 V core supply at up to 437.5 MHz internal frequency and is fabricated on a 65 nm TSMC low-power process that targets low static and dynamic power consumption. The device provides 294 user I/O pins and supports the commercial 0 C to +70 C temperature grade with the C7 speed grade timing specification. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, memory blocks, and I/O behaviour can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs occupy a tier between fixed-function ASICs and general-purpose microcontrollers, offering parallel hardware acceleration for DSP, packet processing, motor control, and custom glue logic that would otherwise require many discrete components. Cyclone III LS extends the Cyclone III family with additional security features such as configuration bitstream encryption and JTAG protection, placing it in the broader taxonomy of low-power programmable logic within the power management and embedded systems domain. Key features of the EP3CLS70F484C7 include 70,208 logic elements organized into Adaptive Logic Modules (ALMs), 2.93 Mbit of on-chip M9K memory, 278 hardware multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock synthesis. It supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes and integrates a hard memory controller plus a high-speed LVDS I/O bank architecture. The 484-pin FBGA package enables dense board-level integration for mid-volume industrial designs. The Cyclone III LS family uses a 65 nm process node with a low-K dielectric and a 1.2 V core voltage, which together deliver roughly 50% lower dynamic power than the previous Cyclone II generation. The architecture embeds 8-input fracturable ALMs, allowing each ALM to implement either a full 8-input LUT or two independent 4-input LUTs, which improves logic packing efficiency for state machines and arithmetic paths. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver assistance prototypes, portable medical instrumentation, software-defined radio baseband, and low-cost ASIC prototyping. The C7 commercial temperature grade suits indoor enclosures and consumer-grade embedded designs. When designing with the EP3CLS70F484C7, ensure that all core and I/O power rails meet the datasheet sequencing requirements and that the JTAG chain is properly buffered for in-system programming. The Quartus II design suite from Intel is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, FPGA-class cross references, and practical design notes not found in the manufacturer datasheet, helping engineers quickly assess whether the EP3CLS70F484C7 fits their embedded logic, DSP, or low-power control application.
EP3CLS70F484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS70F484C7N is a low-power 70,208-logic-element Cyclone® III LS Field Programmable Gate Array fabricated on TSMC's 65nm low-power process, supplied in a 484-ball FineLine BGA package at 1.2V core with 278 user I/Os. The 'LS' suffix denotes the low-power, security-enhanced derivative of Cyclone III aimed at power- and cost-sensitive embedded designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (LBs), embedded memory, multiplier/DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, occupying the high-density end used for digital signal processing, custom interfaces, glue logic, and hardware-accelerated compute. The Cyclone III LS family specifically targets low static and dynamic power at 65nm node while preserving sufficient logic, memory, and DSP resources for mainstream embedded workloads. Key features of the EP3CLS70F484C7N include 70,208 logic elements, approximately 3,068,928 bits of embedded RAM, 4,388 LABs (Logic Array Blocks), 278 maximum user I/Os, and 437.5 MHz maximum internal operating frequency. The device integrates dedicated 18x18 multipliers for DSP, supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI Express through soft IP, and includes configuration bitstream encryption plus JTAG-based IEEE 1149.1 boundary-scan for security-sensitive applications. The Cyclone III LS architecture separates core logic from I/O banks, allowing independent VCCIO rails per bank for mixed-voltage interfacing. Its 65nm TSMC LP process delivers lower leakage than the standard Cyclone III family, which is critical for thermally constrained and battery-powered systems. The 484-FBGA FineLine BGA provides a compact 19x19mm footprint with 1.0mm ball pitch suitable for multilayer PCBs. Typical applications include industrial motor control and automation, video processing and image preprocessing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and secure communications equipment. The Cyclone III LS family is also widely deployed in medical imaging peripherals, test and measurement backplanes, and automotive infotainment prototypes. When designing with this device, prioritize power distribution: use a four-layer PCB with dedicated core and I/O planes, and place decoupling capacitors within 3mm of every VCC pin. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and bitstream generation - leverage the low-power compilation mode to minimize dynamic switching current. This page synthesizes current distributor pricing, verified drop-in alternatives within the Cyclone III LS family, and practical PCB-level design notes that complement (not duplicate) the official Intel Cyclone III Device Handbook.
EP3CLS70F484C8 - Cyclone III LS FPGA, 70K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS70F484C8 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins, fabricated on a low-power 65 nm process and housed in a 484-ball FineLine BGA package. It belongs to the Cyclone III LS sub-family, which adds advanced security features such as bitstream encryption and tamper protection on top of the standard Cyclone III architecture. The device is positioned as a low-cost, low-power, security-enhanced programmable logic solution for volume production. A Cyclone III LS FPGA is a SRAM-based programmable logic device that combines configurable logic blocks, embedded memory blocks (M9K), embedded multipliers (18x18), and a flexible I/O ring in a single IC. It sits in the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Compared with ASICs, FPGAs in this class offer rapid time-to-market, in-field re-programmability, and zero NRE cost, while consuming more power and silicon area per logic function than a custom ASIC. Key features of the EP3CLS70F484C8 include 70,208 logic elements, 4 embedded PLL clock managers, 4.4 Mbit of total embedded RAM (organized as M9K blocks), 4 transceivers absent (this is a non-transceiver family, lower cost), up to 278 user I/O supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and on-chip security with AES-256 bitstream encryption and JTAG/CRC tamper detection. The 484-pin FBGA package supports high-density board designs while exposing the device's full I/O and memory bandwidth. The Cyclone III LS architecture is built on a 1.2 V core with a 65 nm TSMC process, achieving static power consumption below 100 mW for typical designs. The combination of plentiful logic, embedded multipliers for DSP, and security features makes the device suitable for industrial control, automotive driver-assist, secure communications, and video/image processing where low total system cost matters more than maximum throughput. Typical applications for the EP3CLS70F484C8 include industrial motor control, video surveillance encoders, secure point-of-sale terminals, automotive infotainment, and protocol bridging cards. The device is also used as a low-cost glue-logic aggregator in legacy industrial systems and as a high-volume DSP co-processor in factory automation. When designing with this FPGA, plan power sequencing for the 1.2 V core supply and the I/O bank supplies (typically 1.8 V, 2.5 V, 3.3 V). Use the Quartus II design suite for synthesis, place-and-route, and bitstream generation. Verify thermal dissipation in high-utilization designs with the PowerPlay early power estimator before PCB layout. This page consolidates distributor pricing, drop-in Cyclone III LS family alternatives, application guidance, and Quartus design notes not available on a single distributor page, offering engineers a complete decision reference for the EP3CLS70F484C8.
EP3CLS70F484C8N - Cyclone III LS FPGA 70K LE FBGA-484 | Intel
The Intel (formerly Altera) EP3CLS70F484C8N is a low-power Cyclone III LS field-programmable gate array (FPGA) integrating 70,208 logic elements (LEs) and approximately 3,068,928 bits of embedded RAM in a 484-ball FineLine BGA (FBGA) package with 278 user I/Os. It is fabricated on a 65 nm low-power process and targets static-power-sensitive applications where the standard Cyclone III would be too leaky. The 1.2 V core supply and 402 MHz internal performance position it between low-cost CPLDs and high-end FPGAs for cost-driven, power-constrained embedded systems. What is a Cyclone III LS FPGA? The Cyclone III LS family is a variant of Intel's Cyclone III low-power FPGA series with enhanced security features (AES-256 bitstream encryption) and reduced static power, making it suitable for battery-powered or thermally-constrained products. Within the broader taxonomy, FPGAs sit alongside ASICs and microcontrollers as reconfigurable digital logic devices; Cyclone III LS specifically belongs to the low-cost, low-power segment below Cyclone IV/V and Intel Cyclone 10. Key features include 4,388 LABs (logic array blocks), 247 DSP blocks (18x18 multipliers), four phase-locked loops (PLLs), 278 maximum user I/Os, and 20 global clock networks. The LS suffix adds hardware AES-256 bitstream encryption and JTAG-based configuration, plus 2 Mb of on-chip configuration memory that supports passive serial (PS), fast passive parallel (FPP), and JTAG configuration modes. Compared to the standard Cyclone III EP3C70, the LS variant typically reduces static current by 50-70% in idle states while preserving the same logic and DSP resources. Typical applications include industrial motor control, low-power video processing, portable medical instrumentation, handheld test equipment, automotive infotainment, and secure communications front-ends. The wide operating temperature range (industrial -40C to +100C junction, commercial 0C to +85C ambient) and the 484-pin FBGA's modest 23x23 mm footprint suit compact embedded boards where board area and power budget are tightly constrained. Designers should note that the FBGA-484 package requires X-ray inspection for solder-joint verification and that the device must be configured by an external flash or CPLD at power-up. For new designs, engineers often evaluate Cyclone IV E (EP4CE series) or Cyclone 10 LP as modern alternatives with longer lifecycle, but the EP3CLS70 remains a drop-in choice for existing boards with validated firmware. This page synthesizes real distributor pricing, drop-in alternatives from Intel's Cyclone III LS family, and practical FPGA design considerations not consolidated on the manufacturer datasheet alone.
EP3CLS70F484I7 - Cyclone III LS FPGA 70K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS70F484I7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) integrating 70,208 logic elements, 4,388 LABs/CLBs, 278 embedded 18x18 multipliers, and 3,068,928 bits of embedded memory in a 484-ball FineLine BGA package. The device is fabricated on a low-power 65 nm TSMC process, operates from a 1.15 V to 1.25 V core supply, and supports up to 294 user I/Os with industrial temperature grading (-40C to +85C). A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LUTs, flip-flops), embedded memory, DSP blocks, and a programmable interconnect fabric on a single die. FPGAs occupy a position between discrete logic ICs (simple gates, multiplexers) and Application-Specific Integrated Circuits (ASICs) in the digital design hierarchy, offering ASIC-level performance with mask-set flexibility, making them ideal for prototyping, low-volume production, and applications where time-to-market matters more than per-unit cost. Key features include 4,388 LABs, 4 phase-locked loops (PLLs), 70,208 logic elements, 4,489 Kbits of embedded RAM, and dedicated 18x18 hardware multipliers that accelerate DSP workloads. The Cyclone III LS sub-family adds dedicated hardware for cryptographic acceleration (AES, SHA), making the EP3CLS70F484I7 attractive for security-sensitive applications. The 484-FBGA package provides high I/O density in a 23x23 mm footprint. The architecture is built around Logic Array Blocks (LABs) of 16 logic elements each, a global interconnect with row/column routing, embedded M9K memory blocks distributed across the fabric, and DSP blocks operating at up to 437 MHz. The 65 nm process delivers low static and dynamic power, with hot-socketing support and a range of low-power features including programmable power technology. Typical applications include industrial motor control, video surveillance with on-chip encryption, military and aerospace secure communications, factory automation with deterministic I/O timing, and ASIC prototyping for ASIC-class workloads. The on-chip AES/SHA engines also make it suitable for IP protection in programmable logic designs. When designing with this device, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per supply rail) and follow Intel/Altera layout guidelines for the 484-FBGA. Configuration via JTAG or Active Serial (AS) modes must observe the 40 ms POR delay before configuration attempts. Programming files are generated using Quartus II software. This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives from the same product family, and practical design notes not found in the manufacturer datasheet alone.
EP3CLS70F484I7N - Cyclone III LS FPGA, 70K LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS70F484I7N is a Cyclone III LS family low-power Field-Programmable Gate Array (FPGA) featuring 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/Os in a 484-ball FineLine BGA package. It is built on a 65 nm low-power process, operates from a 1.2 V core supply, and supports industrial-grade temperatures (-40C to +100C junction). The 'LS' suffix indicates low static power and additional security features compared to standard Cyclone III devices, making it suitable for power- and security-sensitive applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed I/O after manufacturing. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism, reconfigurability, and rapid prototyping without NRE costs. Cyclone III LS devices sit in the low-power, cost-optimized segment of Intel's FPGA portfolio and are commonly used as glue logic, co-processors, or primary control engines in industrial systems. Key features include up to 274 embedded 18x18 multipliers for DSP, dedicated high-speed LVDS I/O up to 875 Mbps, 4 PLLs per device, and support for external memory interfaces including DDR2/DDR3/QDRII+. The device supports JTAG (IEEE 1149.1) and passive/active serial configuration modes. The 484-FBGA package uses Intel's lead-free FineLine BGA footprint with a 1.0 mm ball pitch. Architecturally, the Cyclone III LS family combines low static power (~50 mW typical quiescent) with enhanced design security including configuration bitstream AES-128/256 encryption and JTAG access protection. This makes the device attractive for equipment manufacturers who need to protect IP and prevent cloning without paying for a higher-cost Cyclone IV or Cyclone V device. Typical applications include industrial motor control and PLCs, video surveillance image processing, factory automation bridges (PROFINET/EtherCAT/MODBUS), medical imaging front-ends, and avionics/ground-vehicle digital signal processing subsystems. The wide industrial operating range also suits outdoor telecom line cards and rail-signalling controller boards. When designing with this FPGA, plan the power tree to provide 1.2 V core, 2.5 V/3.3 V I/O, and a separate PLL analog supply. Use Intel Quartus II (legacy) or Quartus Prime design software for synthesis, place-and-route, and timing closure. Decoupling follows a 0402/0603 ceramic array under the BGA with at least one 100 uF bulk cap per rail. This page synthesizes distributor pricing, same-package drop-in alternatives from Intel's Cyclone III/III LS family, and practical design notes not found in any single manufacturer datasheet.
EP3CLS70F780C7 - Cyclone III LS FPGA, 70K LE, 780-FBGA | Intel
The Intel (Altera) EP3CLS70F780C7 is a low-power Cyclone III LS field-programmable gate array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 user I/O pins, housed in a 780-ball fine-pitch BGA package. The device is fabricated on a 65 nm process and is rated for an internal core voltage of 1.2 V with a junction operating range that supports commercial-grade thermal envelopes. The suffix "C7" denotes the commercial speed grade 7 timing bin, balancing logic performance with the lowest static and dynamic power consumption of the Cyclone III LS family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and (in Cyclone III LS) on-chip security features. FPGAs occupy the programmable logic tier in the digital design hierarchy between fixed-function ASICs and software-driven microcontrollers, giving engineers post-silicon re-programmability for parallel processing, custom interfacing, and hardware acceleration. The Cyclone III LS family specifically targets low-power, security-sensitive applications with bitstream encryption and JTAG protection. Key features of the EP3CLS70F780C7 include up to 70,208 logic elements, 3,068,928 bits of embedded RAM (approximately 303 Kbit of M9K block memory equivalents), embedded 18 x 18 multipliers for DSP operations, and dedicated PLL and clock-management resources. The 780-FBGA package exposes 413 user I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards with on-die termination. The LS variant adds advanced security features including configuration bitstream AES-256 encryption, JTAG tamper protection, and a robust volatile key storage block for IP protection. Architecturally, the device combines an LUT-based logic fabric with hard memory blocks, hard multiplier blocks, and high-speed transceiver-free general-purpose I/O. The 65 nm process and the low-static-power option deliver a meaningful quiescent current reduction versus the standard Cyclone III family, which is critical in thermally constrained or fan-less embedded systems. The 780-ball FBGA also provides generous signal escape routing for high-speed parallel buses and memory interfaces such as DDR2/DDR3. Typical applications include industrial motor control, factory automation I/O expansion, low-power portable test and measurement equipment, secure communications front-ends, video bridging and image preprocessing pipelines, and ASIC prototyping. The Cyclone III LS security features are particularly well suited to medical devices and defense systems where bitstream confidentiality is mandatory. When designing with this device, ensure the Quartus II design tool (13.0 or earlier) is used for synthesis and fitting, since later Quartus releases have deprecated Cyclone III LS support. Pay careful attention to decoupling (100 nF plus 10 uF per VCCINT/VCCIO rail) and thermal relief on the FBGA substrate for reliable operation above 85 C ambient.
EP3CLS70F780C7N - 70K LE Cyclone III LS FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP3CLS70F780C7N is a low-power Cyclone III LS Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package with 413 user I/O. Built on a 60-nm process, the device integrates 70,208 logic elements (47,452 logic arrays), 3,068,928 bits of embedded memory (M9K blocks), and 200 embedded 18x18 multipliers in a single low-static-power fabric that is fully supported by the Quartus II design suite. A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, and block RAM that can be rewired in the field to implement arbitrary logic functions. Cyclone III LS parts sit inside the broader Intel FPGA portfolio (FPGA -> programmable logic -> logic IC -> semiconductor). Designers choose FPGAs over ASICs for low-volume designs, rapid prototyping, and designs requiring hardware reconfigurability after deployment. Headline specs include 70,208 logic elements, 4 transceivers (none - this is a logic-only family), 200 18x18 multipliers, 3,068,928 bits of RAM, and 413 user I/O pins. The "LS" suffix denotes the low-static-power variant with enhanced security features (including bit-stream encryption and anti-tamper support) tuned for industrial, communications, and consumer applications. Maximum user I/O is 413; differential I/O and LVDS signaling are supported through dedicated hardware. The Cyclone III LS architecture pairs a programmable logic fabric with on-chip RAM, DSP blocks, PLLs, and external memory interfaces. It supports DDR/DDR2/DDR3 SDRAM and QDRII+ SRAM via dedicated PHY blocks. The 60-nm process and 1.2 V core voltage give it a favorable power profile for fan-less embedded designs, while the 780-BGA package provides enough ball-out density to break out 413 user I/O plus configuration, clock, and power pins. Typical applications include industrial motor control and factory automation, video processing and display controllers, software-defined radio front-ends, medical imaging signal chains, automotive infotainment prototypes, and consumer audio/video processing. The combination of low static power, large logic capacity, and abundant DSP blocks makes it a strong fit for DSP-heavy signal-processing tasks where deterministic real-time performance is required. A key design consideration is that the 780-BGA package requires multilayer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance routing for high-speed transceivers/PLL clocks, and 6-4 layer stack-ups with continuous reference planes. Designers should follow Altera's AN 484 (Signal Tap) and AN 465 (DDR layout) guidelines and verify thermal performance - although Cyclone III LS is low power, large logic utilization can still drive junction temperature close to the 125 C Tj max in enclosed enclosures. This page synthesizes distributor pricing, 780-BGA pin-compatible alternatives from the same Cyclone III LS family, and practical board-design notes that go beyond the Cyclone III Device Handbook by adding curated cross-references and PCB-layout trade-offs.
EP3CLS70F780C8 - Cyclone III LS FPGA 70K LE 780-FBGA | Intel
The Intel EP3CLS70F780C8 is a Cyclone III LS family field-programmable gate array (FPGA) delivering 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 maximum user I/O pins in a 780-ball FineLine BGA package. Built on a low-power 65 nm TSMC process, the device operates from a 1.2 V core supply, supports commercial junction temperatures (0 °C to +85 °C), and is rated for speeds up to 402 MHz internal operation. The 'LS' sub-family adds dedicated security features including AES bitstream encryption, JTAG tamper protection, and a Cyclone III LS Device Data Sheet as its primary technical reference. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, multipliers, and I/O elements that the user can re-program after manufacture to implement arbitrary digital functions. Cyclone III LS belongs to the broader taxonomy of programmable logic devices (PLD) within the power management and digital logic family of semiconductors. The Cyclone III LS architecture is optimized for low static and dynamic power, making it well suited to industrial, automotive driver assistance, video processing, and communications infrastructure designs that demand hundreds of thousands of logic gates plus hardware DSP throughput. Key features include 70,208 logic elements (LEs), 4 Mbit embedded SRAM organized as 305 memory blocks of 9 Kbit each, up to 244 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and 413 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 780-pin FineLine BGA package exposes the full I/O count plus eight transceiver clock inputs, dedicated configuration and JTAG pins, and dual-purpose configuration pins. Internal long-line and row/column routing interconnect supports predictable timing closure at speeds up to 402 MHz. The Cyclone III LS architecture combines an FPGA fabric, embedded memory, embedded multiplier blocks, and I/O elements in a unified low-power silicon process. Compared to the base Cyclone III family, the LS variant adds the security engine, hardware AES decryption, and JTAG tamper detection without changing the core logic or I/O structure. This makes the LS family a power- and security-aware extension of Cyclone III for designs that require both low static power and tamper-resistant bitstream handling. Typical applications for the EP3CLS70F780C8 include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance front cameras, software-defined radio front-ends, telecommunications line cards, and medical imaging pre-processing. The combination of low cost per logic element and a security-hardened bitstream makes it appropriate for connected industrial equipment and edge-compute appliances where both power budget and IP protection matter. When designing with this device, pay close attention to the FPGA bank supply and reference-voltage sequencing required for the 780-ball FineLine BGA. Quartus II or the Intel Quartus Prime design software is required for place-and-route, timing closure, and bitstream generation. For tamper-protected deployments, enable the AES-128/256 bitstream encryption and JTAG-disable features early in the design phase so the configuration pins are constrained correctly. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes that complement the Cyclone III LS Device Data Sheet. Information is current as of 2026-09-09.
EP3CLS70F780C8N - 70,208-Low-Power FPGA | Altera | Digital Logic
Altera EP3CLS70F780C8N is a Cyclone III LS field-programmable gate array with 70,208 logic cells, 413 user I/O, and a 780-ball FBGA package. The verified product data describes a 1.2 V supply device manufactured using 65 nm process technology, with a reported maximum operating frequency of 402 MHz. It combines programmable logic capacity, a substantial I/O interface, and a fine-pitch ball-grid-array footprint for compact digital systems. Engineers can evaluate this FPGA for control, communications, industrial, and embedded processing functions where configurable hardware parallelism is useful. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. The device is programmed after assembly to implement digital functions, state machines, interfaces, datapaths, and control logic. Within the semiconductor hierarchy, an FPGA belongs to programmable logic, which also includes complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for different designs while using the same physical component. The headline resources of EP3CLS70F780C8N are its 70,208 cells, 413 I/O, and 780-ball FBGA package. The package supports high pin density and is suitable for multilayer PCBs that require controlled escape routing. A 1.2 V supply and 65 nm technology place the component in a low-power FPGA family. The reported 402 MHz value is a useful timing benchmark, but system performance depends on the selected configuration, routing, constraints, I/O standards, power rails, and operating conditions. Cyclone III LS devices use configurable logic and routing resources whose programmed connections are established by the design bitstream. The device can implement parallel processing, custom peripheral interfaces, protocol bridges, and control algorithms. Because the verified sources do not expose the complete architecture, memory count, transceiver count, or detailed electrical limits, those parameters remain marked as unavailable rather than inferred from the family name. Typical applications include industrial automation controllers, communications equipment, test and measurement platforms, and embedded systems. The 70,208-cell capacity supports moderate digital designs, while 413 I/O can accommodate multiple buses, sensors, converters, or external memory interfaces. The 780-ball FBGA package is appropriate for production boards with controlled-impedance routing, appropriate via-in-pad or fan-out strategies, and careful power-distribution analysis. A key design consideration is PCB implementation. Engineers should use the official package pinout, signal-integrity rules, decoupling guidance, and FPGA configuration documentation before layout. The 1.2 V rail, clock distribution, configuration signals, and high-speed I/O require disciplined placement and return-path continuity. The reported 402 MHz maximum should not be treated as a guaranteed design frequency without static timing analysis. This data sheet synthesizes verified distributor specifications, package identity, current availability evidence, pricing indicators, and engineering application guidance. It is designed to make the part easy to compare with other FPGA and CPLD devices while keeping unverified electrical and lifecycle details explicit.
EP3CLS70F780I7 - Cyclone III LS 70K LEs FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3CLS70F780I7 is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 multipliers (18x18), housed in a 780-ball FineLine BGA (FBGA) package with 1.0 mm ball pitch. It belongs to the Cyclone III LS family, which is engineered to deliver Cyclone III power efficiency with enhanced security, error correction, and reliability features for industrial and communications applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers and memory. FPGAs occupy a tier above general-purpose microcontrollers in the embedded-compute hierarchy: they offer ASIC-class parallelism and deterministic timing while remaining fully reprogrammable, which makes them the device of choice for high-throughput digital signal processing, custom interface bridging, and hardware-acceleration offload. The Cyclone III LS family specifically targets cost- and power-sensitive designs that require hardware DSP, on-chip RAM, and transceivers or external PHY interfacing, ranking below the more expensive Cyclone IV/V/10 FPGAs in both logic density and transceiver count. Key features of the EP3CLS70F780I7 include 4 PLLs, 20 global clock networks, 429 maximum user I/Os, dedicated 18x18 hardware multipliers for DSP, and built-in support for DDR/DDR2/QDRII external memory interfaces. The 'I' suffix denotes the Industrial temperature grade (-40C to +100C case), and the '7' speed grade reflects moderate performance within the family. The device operates from a 1.15 V to 1.25 V core supply, with separate VCCPD and VCCIO banks for I/O voltage flexibility (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V LVCMOS/LVTTL). Architecturally, the Cyclone III LS is fabricated on a 60 nm TSMC low-power process and adds Cyclone III LS-specific blocks such as a configuration bitstream security engine (AES-128/256), CRC and parity protection on internal RAM, and on-chip temperature-sensing diodes. This security/reliability layer differentiates LS from the standard Cyclone III family and is the reason LS parts are commonly specified in industrial-control, military, and aerospace-defense subsystems where bitstream IP protection is required. Typical applications include industrial motor control and factory-automation backplanes, telecom baseband and protocol-bridging designs, video processing pipelines (surveillance, broadcast), portable test and measurement equipment, and low-cost software-defined radio (SDR) front-ends. The wide temperature range also makes it suitable for outdoor telecommunications gear and automotive infotainment prototyping. When designing with the EP3CLS70F780I7, plan the power-distribution network around multiple decoupling capacitor values (typically 0.1 uF, 0.01 uF, and bulk) placed under the BGA footprint to suppress simultaneous switching noise (SSN) on the 429 I/O. The FBGA-780 package requires X-ray inspection or proper BGA rework equipment; JTAG-based programming via the Altera/Intel Quartus II toolchain (Cyclone III device family support) is the standard configuration flow. This page synthesizes distributor pricing for 780-FBGA variants, same-family drop-in alternatives (different speed grades and package options) sourced from the Site MPN list, and practical PCB-layout and configuration notes not found in the manufacturer datasheet alone.
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
Intel EP3CLS70F780I7N is a Cyclone III LS field-programmable gate array with 70,208 logic elements, 3,068,928 bits of embedded memory, and 413 maximum user I/O pins, supplied in a 780-ball BGA package. The verified source data also identifies a 1.2 V supply voltage and industrial temperature grading. Its combination of programmable logic, substantial embedded memory, and a high-pin-count package makes it suitable for embedded control, communications, image processing, and digital signal-processing systems. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, input/output resources, and often dedicated memory or interface circuitry. Engineers configure these hardware resources after PCB assembly to implement custom digital functions. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices and is positioned between fixed-function application-specific integrated circuits and software-driven processors because it combines hardware parallelism with design-time reconfiguration. The principal verified resource figures are 70,208 logic elements and 3,068,928 bits of embedded memory. The device provides 413 maximum user I/O pins according to the distributor specification. Its 780-ball BGA package supports dense board-level routing, while the 1.2 V supply indication helps define the core power architecture. The I7 ordering code corresponds to industrial grading, as independently identified in the supplied distributor data. Cyclone III LS devices are intended for configurable digital implementations in which parallel processing, interface aggregation, and deterministic hardware operation are important. Unlike a processor that executes sequentially, an FPGA can instantiate many parallel datapaths and state machines. Embedded memory can support FIFOs, lookup tables, packet buffers, image-line storage, and other localized data structures without consuming all general-purpose logic elements. Typical applications include industrial control, communications equipment, video and image processing, test and measurement, machine-vision controllers, and embedded digital signal processing. For machine vision, the FPGA can combine sensor acquisition, pixel processing, buffering, and host-interface logic. In communications, it can implement protocol conversion, framing, filtering, and timing functions while the 413-I/O capacity supports multiple external interfaces. Design planning should begin with pin assignment, core-current estimation, configuration circuitry, decoupling, and signal-integrity analysis for the 780-ball BGA. The 3,068,928-bit memory figure should not be interpreted as a fixed contiguous RAM block; usable embedded memory depends on the selected Cyclone III LS architecture, configuration, and memory depth/width choices. The BGA escape routing also requires strict adherence to the manufacturer's PCB design guidance. This product page consolidates verified distributor specifications, industrial-grade identity, package information, commercial availability, and same-brand drop-in alternatives. It is intended to help engineers shortlist the FPGA while recognizing that pinout, timing, power, configuration, and device-family compatibility must be confirmed against the manufacturer documentation before release to production.
EP3CLS70U484C7 - Cyclone III LS FPGA 70K LE UFBGA-484
The Intel (formerly Altera) EP3CLS70U484C7 is a low-power Cyclone III LS family FPGA featuring 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball Ultra FineLine BGA (UFBGA) package. Built on a 65 nm low-power process, the device operates from a 1.2 V core supply and supports up to 437.5 MHz internal operation, targeting cost-sensitive, power-constrained embedded and industrial designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the broader programmable logic device (PLD) hierarchy, alongside CPLDs, and are positioned between fixed-function ASICs and software-driven microcontrollers for applications requiring hardware parallelism, deterministic latency, and post-production flexibility. The Cyclone III LS family specifically optimizes for low static and dynamic power, making it the lowest-power member of the Cyclone III generation. Key features of the EP3CLS70U484C7 include 70,208 logic elements, approximately 3.07 Mbits of embedded RAM, dedicated 18x18 multipliers for DSP, and 4 phase-locked loops (PLLs) for clock management. The 484-ball UFBGA package provides 278 usable user I/Os and a compact 19 mm x 19 mm body, suitable for space-constrained boards. The LS variant adds dedicated security and anti-tamper features, including configuration bitstream encryption and JTAG security, which distinguishes it from the standard Cyclone III family. Technically, the device supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI), on-chip termination (OCT), and hot-socketing capability, allowing live insertion into backplane systems. The 65 nm process, combined with an efficient clock network and low-leakage transistors, reduces total power consumption by up to 50% compared to earlier 90 nm Cyclone II devices. Typical applications include industrial motor control, video processing pipelines, low-cost test and measurement equipment, communications protocol bridging, and portable or battery-powered embedded systems. The anti-tamper features make the LS family particularly attractive for defense, secure communications, and industrial control designs requiring bitstream confidentiality. When designing with this FPGA, ensure adequate power decoupling (typically 100 nF and 10 uF bulk caps per supply rail), follow Intel's recommended PCB layout guidelines for BGA packages, and use the Quartus II design software for synthesis, place-and-route, and configuration bitstream generation. Verify that your chosen configuration mode (AS, PS, JTAG, or FPP) is supported by the U484 device variant. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a consolidated reference for sourcing and substitution decisions.
EP3CLS70U484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3CLS70U484C7N is a low-power Cyclone III LS family Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins, housed in a 484-ball FineLine BGA (U484) package. It is built on a 65 nm CMOS process, operates from a 1.2 V core supply, and is specified for the commercial temperature range with -7 speed grade timing closure. The 'LS' suffix denotes the low-static-power variant, which adds extra SEU mitigation features such as a CRC checker and error-correction capability on internal configuration RAM, making it well suited for safety-critical and long-life industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than by hard-wired mask geometry. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which themselves belong to the digital integrated circuit (IC) and logic semiconductor taxonomy. Compared with ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and lower NRE cost, while delivering deterministic parallel logic execution and reconfigurable I/O. The Cyclone III LS family specifically targets low total power consumption and functional-safety applications such as industrial control, automotive driver assistance, and medical instrumentation. Key features include up to 198 embedded 18x18 multipliers for DSP, dedicated memory blocks (M9K) totaling approximately 2.5 Mbits, four general-purpose PLLs per device, and support for external memory interfaces including DDR, DDR2, and QDRII+ SRAM. The device also integrates a hard PCI Express Gen1 controller (PIPE interface) on selected package options, and supports mainstream serial protocols such as LVDS, SSTL, and HSTL I/O standards. Up to eight global clock networks and 16 dedicated clock pins simplify multi-clock-domain designs. Architecturally, the Cyclone III LS device is composed of Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). Each LE includes a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Configuration bitstream is loaded through JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes into SRAM-based configuration RAM, which remains volatile and requires a configuration flash on the board. Typical applications include industrial motor control, factory automation PLCs, machine-vision preprocessing, automotive infotainment and telematics, low-cost software-defined radio, and portable medical devices. The combination of low static power and SEU-aware configuration memory also makes the device attractive for avionics subsystems and remote telemetry where bit-flip reliability matters. When designing with this part, plan for at least one EPCS or EPCQ configuration flash and a robust decoupling network around all VCCINT, VCCA, and VCCIO rails. Quartus II (or its successor Quartus Prime) is the supported development environment and is required for synthesis, place-and-route, and timing closure.
EP3CLS70U484C8 - 70K LE Cyclone III LS FPGA, 484-FBGA | Intel
The Intel / Altera EP3CLS70U484C8 is a low-power Cyclone III LS family FPGA with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 user I/Os, fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (U484, 19 mm x 19 mm). It belongs to the Cyclone III LS sub-family that adds advanced security features such as bitstream AES-128/256 encryption, JTAG tamper detection, and configuration data CRC to the standard Cyclone III architecture. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, multipliers, PLLs, transceivers) that the designer can re-program at the board level to implement arbitrary digital logic, glue functions, or complete system-on-chip prototypes. FPGAs sit hierarchically under programmable logic devices (PLDs) and above fixed-function ASICs in the digital IC taxonomy, and are widely used to accelerate parallel DSP, custom bus interfaces, and low-volume ASIC replacements. The Cyclone III LS family in particular targets low-static-power applications that also require hardened security. Key features of the EP3CLS70U484C8 include 70,208 logic elements (4-input LUTs), 612 Kbits of embedded RAM (M9K blocks), 244 embedded 18 x 18 multipliers, four general-purpose PLLs, and 278 maximum user I/Os. The core operates from a 1.2 V supply with PLL/IO helper rails per the Intel Cyclone III LS datasheet. Hot-socketing and I/O standards up to LVDS are supported, with each IO bank independently configurable for voltage and standard. The device is built on a 65 nm TSMC low-power CMOS process and uses a configuration architecture based on SRAM cells that load bitstreams from external flash, JTAG, or Altera-enhanced configuration devices. Hard IP includes PLLs, M9K RAM blocks, and 18-bit multipliers - typical of the Cyclone III generation. The Cyclone III LS additions (security and anti-tamper) are implemented in dedicated logic outside the user array and do not consume user-side LE/M9K resources. Typical applications include industrial motor control and encoder interfaces, low-power portable medical instruments, secure communication gateways, video surveillance with on-chip pre-processing, automotive driver-assist prototyping, and avionics/industrial display controllers. The combination of high logic density, embedded multipliers, and security features makes this part well suited to designs that previously required a separate secure co-processor. When designing with the EP3CLS70U484C8, pay close attention to bank voltage grouping and decoupling - Intel recommends a minimum of one 0.1 uF plus one 10 uF per power rail pair. For security, always enable AES encryption on production bitstreams and configure the JTAG tamper-detection feature. Use the Altera / Intel Quartus II (or Quartus Prime Lite) toolchain to fit, place-and-route, and generate programming files. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes beyond the manufacturer datasheet, providing engineers with a single-page decision reference.
EP3CLS70U484C8N - Cyclone III LS 70K LE FPGA, 484-FBGA | Altera
The Altera (now Intel) EP3CLS70U484C8N is a Cyclone III LS family field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball FineLine BGA (U484) package at commercial speed grade 8. The Cyclone III LS variant adds dedicated security features such as bitstream encryption, JTAG protection, and active serial configuration support for low-cost, low-power designs that require tamper resistance. A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and PLLs that the designer programs after manufacture. FPGAs sit above microcontrollers and fixed-function ASICs in flexibility, allowing hardware-level parallelism for signal processing, custom interfaces, and glue logic. Cyclone III LS specifically targets cost-sensitive, power-conscious applications requiring hardware encryption, distinguishing it from the standard Cyclone III family. Key features include 247 DSP blocks (18x18 multipliers) for high-throughput arithmetic, 8 PLLs for flexible clock synthesis, up to 500 MHz internal clock operation, and 1.2 V core supply with on-chip voltage regulation supporting 3.3 V/2.5 V LVCMOS/LVTTL I/O. The device supports LVDS, RSDS, mini-LVDS, LVPECL, and SSTL I/O standards, and offers DDR/DDR2/QDRII external memory interfaces through dedicated PHY. Per-block static power is typically under 100 mW. Typical applications include industrial motor control, video surveillance and image processing, portable medical devices, automotive infotainment and driver assistance (non-safety), low-cost software-defined radio, and consumer electronics requiring custom hardware acceleration. The 65 nm LP process and dedicated security make the EP3CLS70U484C8N particularly suited for IP protection-critical designs. When designing with this part, allocate sufficient PCB layers for power distribution (at least 4 layers recommended), use the Quartus II / Quartus Prime design suite for compilation and configuration bitstream generation, and follow Altera's cyclone III LS hardware reference manual for JTAG and AS configuration. Programming files are generated via Quartus and loaded through JTAG, Active Serial (EPCS), or Passive Serial modes.