FPGA и CPLD
Товары (6666)
EP3SE50F780I4L - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (Altera) EP3SE50F780I4L is a high-density Stratix III Enhanced (E) FPGA delivering 47,500 logic elements (LEs), 488 user I/Os, and 5,760 Kbits of embedded memory in a 780-pin FC-FBGA package. Manufactured on a 65 nm process, it operates at 0.9 V core with a secondary 1.05 V to 1.15 V option, targeting high-performance signal processing, telecommunications, and ASIC prototyping workloads. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor whose logic fabric, embedded multipliers, block RAM, and high-speed transceivers can be programmed post-manufacture. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy: microcontrollers execute software sequentially, FPGAs implement custom parallel hardware, and ASICs deliver equivalent hardware after a non-recurring engineering (NRE) cost. The Stratix III Enhanced family uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables (LUTs), enabling efficient mapping of wide and narrow datapaths. Key features of the EP3SE50F780I4L include 47,500 LEs organized into 1,900 logic array blocks (LABs), up to 5,760 Kbits of M9K block RAM, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for high-speed external memory interfaces (DDR/DDR2/DDR3/QDRII+) via soft memory controllers. The 488 user I/Os are arranged in 16 banks supporting a wide range of single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. Architecturally, the Stratix III E family integrates dedicated transceivers up to 1.25 Gbps (model-dependent), high-performance PLLs, and a programmable power network that powers down unused regions to reduce static consumption. Partial reconfiguration lets designers swap logic blocks without interrupting adjacent logic, useful for dynamically reconfigurable wireless and test systems. Typical applications include telecom baseband processing, high-throughput DSP pipelines (radar, video broadcast), ASIC prototyping, military/aerospace signal processing, and high-speed serial protocol bridging. The 'I' speed grade and industrial temperature range (-40C to +100C core) suit ruggedized environments. When designing with the EP3SE50F780I4L, note that the device is in legacy lifecycle. Plan firmware, bitstream, and toolchain (Quartus II) compatibility carefully, and verify second-source availability before long-life deployments. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison parameters, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP3SE50F780I4LG - Stratix III E FPGA 47.5K LE | Intel (Altera)
The Intel (Altera) EP3SE50F780I4LG is a high-density Stratix III E Field-Programmable Gate Array (FPGA) IC integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbit of embedded memory into a 780-ball Flip-Chip BGA (FCBGA) package. Housed in the 780-FBGA footprint with 488 user I/Os, it supports core VCC at 1.1 V and industrial temperature operation from -40 C to +100 C. The EP3SE50F780I4LG is the lead-free, RoHS-compliant variant of the EP3SE50 family, distinguished by the 'G' suffix indicating Pb-free ball finish. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement custom digital circuits using configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP blocks and memory. FPGAs occupy the mid-tier of digital logic hierarchy: below fixed-function ASICs in volume cost but above discrete logic ICs in integration density. The Stratix III generation introduced the ALM (Adaptive Logic Module) architecture, which combines 8-input fracturable lookup tables and dedicated adders to deliver higher effective logic capacity per LE than the ALM predecessors. Key features of the EP3SE50F780I4LG include 47,500 logic elements, 19,000 ALMs, 5.49 Mbit embedded RAM, 488 maximum user I/Os, and high-speed transceivers supporting multi-gigabit serial interfaces. The device integrates dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, hard PCI Express Gen1/Gen2 IP cores, and external memory interfaces supporting DDR3 with dedicated DQS phase-shift circuitry. These features collectively enable single-chip implementation of complex DSP pipelines, high-throughput memory controllers, and protocol bridging functions. The EP3SE50F780I4LG is fabricated on a 65 nm TSMC process and combines a programmable fabric with embedded hard IP blocks. The 780-FCBGA flip-chip BGA package provides 488 signal balls allocated between user I/O banks, high-speed transceiver channels, configuration pins, clock inputs, and power/ground. The 1.1 V core supply with separate VCCPD (I/O pre-driver) and VCCIO (I/O driver) rails allows the FPGA to interface with multiple logic standards simultaneously. Compared with Stratix IV (40 nm) and Stratix V (28 nm) successors, the Stratix III E remains a cost-effective mid-density solution with mature Quartus II tool support. Typical applications include high-performance digital signal processing in wireless base stations, software-defined radio (SDR) front-ends, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, Gigabit Ethernet), radar and beam-forming arrays, broadcast video processing, and ASIC prototyping. The high DSP block count and transceiver bandwidth make this device well suited to designs where parallel DSP pipelines must be combined with chip-to-chip serial links. The 5.49 Mbit embedded RAM also serves as on-chip buffering for packet processing in networking line cards. When designing with this device, ensure that PCB layout meets the FCBGA via-in-pad and microvia stack-up requirements specified in the Altera Stratix III Device Handbook. The flip-chip BGA requires precise BGA escape routing and matched-length traces for high-speed transceiver channels; failing to honor the reference stack-up will degrade SERDES eye margins. Thermal management is mandatory because the FCBGA junction-to-ambient thermal resistance is limited, and high transceiver utilization can push junction temperature close to the +100 C industrial limit. This page consolidates distributor inventory, lifecycle status, drop-in alternative analysis, and PCB design guidance for engineers evaluating or sourcing the EP3SE50F780I4LG.
EP3SE50F780I4LN - Stratix III E FPGA 47.5K LE 780-FBGA | Altera
The Altera (Intel) EP3SE50F780I4LN is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 47,500 logic elements, 5,760,000 embedded memory bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Operating from 0.85V to 1.2V core supply with industrial -40C to +100C temperature range, it integrates 1,900 Logic Array Blocks (LABs), 1900 Adaptive Logic Modules (ALMs), and dedicated DSP blocks for high-performance signal processing. What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP and memory blocks, and a periphery of high-speed transceivers and general-purpose I/Os. Stratix III E belongs to Altera's high-performance, low-power 65 nm FPGA family, sitting in the device hierarchy as: Stratix III E -> Stratix III family -> Stratix series -> high-end FPGA -> programmable logic device -> semiconductor IC. Key features of the EP3SE50F780I4LN include 488 maximum user I/Os, 1,900 LABs, 5,760,000 bits of embedded RAM, dedicated 18x18 multipliers and DSP blocks, and up to 12 high-speed transceivers depending on package option. The 780-FBGA package supports high pin-count designs with controlled impedance signal routing, while the 'I4' speed grade and 'L' enhanced feature suffix position this device for industrial-grade high-throughput DSP, telecom, and signal-processing applications. The device architecture uses 65 nm process technology, a fine-grained ALM-based fabric, multi-track routing, and dedicated hardware for DSP, memory interfacing, and external memory controllers (DDR/DDR2/QDRII). Hard IP for PCI Express, Gigabit Ethernet, and SERDES up to 6.375 Gbps is integrated, enabling protocol bridging without consuming soft logic. Typical applications include high-throughput digital signal processing (radar, beamforming), telecom baseband and backhaul cards, ASIC prototyping, high-speed serial interface bridging, and military/aerospace compute nodes. With 488 I/Os and 5.76 Mbit embedded memory, the device supports multi-channel data acquisition and image processing pipelines. When designing with this part, allocate sufficient PCB layers (typically 12+) to maintain signal integrity on the FCBGA escape routing. Use the Quartus II design suite (or later Quartus Prime) for synthesis, place-and-route, and timing closure; the device requires configuration via JTAG, passive serial, or fast passive parallel mode. This page synthesizes distributor inventory, parametric drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet alone.
EP3SE50F780I4N - Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel
The Intel EP3SE50F780I4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 5,760 Kbits of embedded memory, and 1900 logic array blocks (LABs) in a 780-ball FineLine BGA (FCBGA) package. It supports up to 488 user I/Os and operates from a 0.9V core supply with industrial temperature grade (I4: -40C to +100C). The device is fabricated on TSMC's 65 nm process and integrates up to 304 multipliers (18x18) and 12 PLLs, targeting high-performance DSP, telecommunications, and signal-processing applications. What is an FPGA? A Field-Programmable Gate Array is a programmable semiconductor device whose logic fabric can be configured by the designer after manufacture. Stratix III E belongs to the high-performance tier of FPGAs - positioned below ASICs in unit cost but above low-density CPLDs and traditional microcontrollers in raw throughput. It sits within the broader taxonomy: programmable logic device -> FPGA -> high-performance FPGA -> Stratix family. Engineers choose Stratix III E when deterministic parallelism, high transceiver bandwidth, and DSP block density outweigh the power and unit-cost advantages of microcontrollers or ASSPs. Key features include 1.1 Gbps LVDS performance, 24 transceivers (up to 6.375 Gbps) on the Stratix III GT family, hard PCIe Gen1/Gen2 IP cores, and DSP blocks supporting variable-precision arithmetic. The 780-FCBGA package provides a robust thermal envelope for sustained operation under industrial ambient conditions. The I4 speed/temperature grade (-40C to +100C, fast speed) places it among the highest-performance variants within the Stratix III E family, while the same BGA footprint is shared across many speed grades and density siblings - enabling PCB reuse. The architecture uses ALMs (Adaptive Logic Modules) instead of classic 4-input LUTs, allowing logic synthesis tools to pack combinational paths more efficiently. Combined with dedicated routing tracks on the 65 nm process, this yields a typical core clock Fmax of 500+ MHz in pipelined designs. The device is supported by Intel Quartus II design software (legacy, free updates archived on Intel's FPGA support pages) and accepts standard HDL entry (Verilog, VHDL, SystemVerilog). Typical applications include high-speed telecom line cards, military radar signal processing, ASIC prototyping, and high-throughput digital signal processing. The transceiver-equipped family variants also suit 40G/100G Ethernet bridging and PCIe Gen2 endpoint designs. For PCB layout, the FCBGA requires microvia stack-ups (typically any-layer HDI) and matched-length differential pair routing for transceiver channels.
EP3SE80F1152C2 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F1152C2 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm TSMC process with a 1.1 V core supply, the device is offered in a commercial 0 C to 85 C temperature grade and supports up to 600 MHz internal operation. The C2 speed grade targets cost-sensitive designs where the highest -2 performance bin is not required. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy a position above general-purpose microcontrollers and below ASICs in the programmable logic hierarchy, offering hardware-level parallelism for DSP, packet processing, and high-throughput data pipelines. The Stratix III E family specifically targets high-performance ASIC prototyping, wireline communications, and DSP-intensive applications. Key features of the EP3SE80F1152C2 include 3,200 Logic Array Blocks (LABs), 8.75 Mbits of M9K memory plus additional MLAB blocks, and integrated Adaptive Logic Modules (ALMs) that support 6-input LUT architecture. The TriMatrix interconnect fabric provides predictable timing closure with multi-track routing, while dedicated DSP blocks implement 18x18 multipliers at full speed. Hard IP for PCIe, memory controllers, and SERDES is available depending on the specific Stratix III E variant. The architecture uses a 65 nm low-k dielectric process and a multi-supply core (1.1 V) with separate VCCPD, VCCIO banks, and PLL analog supplies to isolate sensitive analog circuits from noisy digital switching. Engineers must observe multi-rail power sequencing - VCCINT must reach threshold before VCCPD, with VCCIO following last. The 1152-ball FCBGA package has a fine-pitch ball grid that requires ENIG or ENEPIG surface finish and OSP flux compatibility. Typical applications include ASIC prototyping and emulation, high-end wireline baseband processing, test and measurement equipment, broadcast video processing, and high-speed DSP accelerators. The 744 user I/O count supports parallel LVDS interfaces and multi-channel memory buses typical of telecom line cards. When designing with this device, allocate sufficient PCB area for the 35x35 mm FCBGA footprint, plan for at least 8 power rails with bulk and decoupling capacitance per Quartus II power analysis results, and verify signal-integrity on high-speed LVDS pairs using the IBIS model from the Altera website.
EP3SE80F1152C2N - 80K LEs Stratix III E FPGA, 1152-BGA | Altera
The Altera (Intel) EP3SE80F1152C2N is a high-density, high-performance Stratix III E FPGA featuring 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 65nm process with a 1.1V core supply, this device integrates 3,200 Logic Array Blocks (LABs), embedded multipliers, and MultiTrack interconnect for high-bandwidth DSP and ASIC-prototyping workloads. It supports internal clock frequencies up to 800 MHz and is rated for commercial temperature operation (0C to +85C). What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic device -> FPGA -> high-density programmable logic -> ASIC prototyping silicon. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for low-volume production, rapid prototyping, and applications requiring hardware-level parallelism such as signal processing, packet inspection, and high-speed interfacing. Key features of the EP3SE80F1152C2N include 6.84 Mbits of embedded memory, 488 (9x9) embedded multipliers for DSP, partial reconfiguration support, and dedicated circuitry for external memory interfaces (DDR, DDR2, DDR3, QDRII, RLDRAM). The Stratix III E architecture enhances logic and routing efficiency over earlier Stratix generations, while the 1.1V core reduces dynamic power consumption by up to 50% compared with 90nm predecessors. The FCBGA-1152 package provides a robust board-level interconnect suitable for multi-gigabit transceiver (transceiver-less) LVDS, PCI Express Gen1 endpoints, and gigabit Ethernet MAC implementations. Typical applications include high-end ASIC prototyping, high-performance digital signal processing, video broadcast equipment, military radar signal processing, and wireline telecommunications line cards. The 80K LE density positions this part in the mid-density Stratix III E family, large enough for full-system emulation of multi-million-gate ASICs yet still cost-effective versus the larger EP3SE110 and EP3SE260 devices. When designing with this part, allocate sufficient PCB layers (typically 12+ for 1152-ball BGA breakout) and use a Stratix III E reference design for power-rail sequencing, decoupling, and JTAG configuration. Altera Quartus II software (version 9.0 or later) is the required development environment for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.
EP3SE80F1152C3 - Stratix III E FPGA 80K LE FBGA-1152 | Intel
The Intel (Altera) EP3SE80F1152C3 is a high-density Stratix III E Field-Programmable Gate Array delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FBGA) package. It is built on a 65 nm CMOS process with a 1.1 V core supply and supports an internal clock frequency of up to 800 MHz, with transceiver-rich variants of the family reaching 717 MHz in DSP blocks. The device integrates 3,200 Logic Array Blocks (LABs), 12 transceiver channels, and dedicated DSP blocks optimized for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit within the programmable logic hierarchy alongside CPLDs and sit above fixed-function ASICs in flexibility. The Stratix III E family is positioned for high-performance DSP, high-speed serial I/O, and embedded-processor applications where designers need hardware-level parallelism without the NRE cost of an ASIC. Designers typically choose an FPGA like the EP3SE80F1152C3 over a microcontroller when they need parallel processing, custom I/O timing, or hardware-accelerated algorithms such as FFT, FIR filtering, or video processing. Key features of the EP3SE80F1152C3 include up to 6.84 Mbits of M9K and M144K block RAM, 384 18x18 multipliers for DSP, twelve full-duplex transceivers supporting rates up to 6.375 Gbps (C3 speed grade), and Quartus II design-software support with IP cores for PCI Express, DDR2/DDR3, Ethernet MAC, and many standard interfaces. The device is offered in a commercial temperature grade (0 to 85 C) under the speed grade C3, which trades off maximum internal frequency versus power optimization. Typical applications include high-speed DSP and baseband processing in wireless infrastructure, ASIC prototyping for SoC designs, high-end image processing for medical imaging and machine vision, and high-speed serial backplane interfaces for networking and storage systems. The 1152-ball FBGA package provides ample routing channels for the 744 user I/Os and the integrated transceivers. The high logic density combined with embedded memory and DSP blocks makes this device well-suited to designs that previously required multiple FPGAs or a discrete DSP plus FPGA architecture. When designing with the EP3SE80F1152C3, ensure your PCB footprint is rated for the 35x35 mm FBGA-1152 substrate with appropriate microvia stack-ups. Use the Quartus II power analyzer early in the design cycle to size decoupling networks and thermal solution, since DSP-heavy and transceiver-active designs can exceed 10 W of power dissipation. The C3 speed grade is appropriate for cost-sensitive commercial applications; if you need higher Fmax or wider temperature tolerance, the I3 industrial grade or C4 higher-speed grade variants are available on the same pinout. This page synthesizes distributor inventory, same-family Stratix III E drop-in alternatives, and design notes not found in the manufacturer datasheet. Engineers can evaluate commercial availability, parametric match percentages, and packaging reuse across the Stratix III E family without downloading datasheets from multiple distributors.
EP3SE80F1152C3N - Stratix III E FPGA, 80K LE, 1152-FBGA | Intel
The Intel (Altera) EP3SE80F1152C3N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 40 nm low-power process, the device combines abundant programmable logic, dedicated DSP blocks, and high-speed transceivers, targeting demanding digital signal processing, high-bandwidth communications, and ASIC-prototyping workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, the FPGA sits between general-purpose microcontrollers and full custom ASICs, offering hardware-level parallelism with field-reprogrammable bitstream configurability. Stratix III E devices extend the family with enhanced transceivers, partial reconfiguration support, and higher logic density per watt compared with prior Stratix generations. Key features of the EP3SE80F1152C3N include 80,000 logic elements (LEs), 6,843,392 memory bits, 3,200 LABs/CLBs, 744 maximum user I/Os, and Stratix III E class transceiver support (per variant). The device supports up to 717 MHz internal operation and is offered in a commercial temperature grade (C3 speed/power corner). Embedded hard IP blocks for PCIe, DDR3 memory controllers, and multi-gigabit transceivers are integrated on-die, simplifying board design. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs plus dedicated carry, register, and LUT resources, enabling higher packing density than traditional 4-input LUT architectures. The hierarchical routing fabric and MultiTrack interconnect reduce congestion, while the MLAB (Memory Logic Array Block) allows distributed RAM to be sprinkled across the fabric for high-speed small-buffer use cases. Typical applications include high-performance digital signal processing for wireless baseband, ASIC and ASIC-replacement prototyping, high-speed image and video processing pipelines, test and measurement instrumentation, and high-throughput data-acquisition systems. Designers also use Stratix III E devices in wireline backhaul, radar, and software-defined radio platforms where parallel processing is essential. When designing with the EP3SE80F1152C3N, pay careful attention to the FBGA-1152 PCB land pattern, multi-rail decoupling strategy, and JTAG/AS configuration pin budgeting. Quartus II software (legacy) or Quartus Prime with the Stratix III device support is required for synthesis, place-and-route, and bitstream generation. Given the device's NRND/EOL status on some channels, confirm lifecycle status with authorized distributors before committing to new designs. This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives within the Stratix III E family, and PCB-level design considerations not consolidated in the manufacturer datasheet.
EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SE80F1152C4 is a high-density Stratix III Enhanced (E) family FPGA integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package fabricated on a 65 nm CMOS process and powered from a 1.1 V core supply. The device operates across the commercial 0C to 85C junction temperature range and is rated for an internal fabric frequency up to 800 MHz in performance-grade FPGA benchmarks, making it suitable for high-throughput parallel DSP, video bridging, and protocol aggregation designs. What is a Stratix III E FPGA? Stratix III E is the enhanced-logic-and-memory variant of Intel's Stratix III 65 nm FPGA portfolio, an SRAM-programmable logic device that sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. Compared with the Stratix III L variant (logic-optimized) and the Cyclone series (cost-optimized), the E family triples on-chip memory bandwidth by adding dedicated MLAB + M9K + M144K TriMatrix memory blocks, and it is typically chosen when a design needs both rich logic capacity and many megabits of distributed/Block RAM. Key features include 80,000 logic elements (LEs), 3,200 Logic Array Blocks (LABs), 6,843,392 total RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, MultiTrack interconnect with hierarchical routing, and 744 general-purpose I/Os split across 16 or more I/O banks supporting multiple single-ended and differential I/O standards. The 65 nm low-k process and an adaptive logic module (ALM) architecture deliver roughly twice the performance-per-logic-element of the prior Stratix II generation while cutting dynamic power by 50%. Architecturally, the EP3SE80F1152C4 uses the ALM-8 (8-input fracturable LUT) building block, TriMatrix embedded memory (MLAB / M9K / M144K), and dedicated variable-precision DSP blocks. The hard memory controller and high-speed transceivers (not present on this specific part number variant) are bypassed in favor of fabric-only I/O, which keeps die cost down for designs that need abundant user I/O and on-chip memory but not multi-gigabit serial links. Typical applications include high-performance digital signal processing, video processing and image pre-processing pipelines, ASIC prototyping, multi-channel protocol aggregation (e.g., 10/40 Gbps Ethernet bridges), and embedded control with large on-chip memory footprints. The 1152-BGA package also enables dense PCB layouts for line cards and mezzanine modules. When designing with the EP3SE80F1152C4, plan for JTAG-based configuration with EPCS serial configuration devices, plan derating for FBGA solder-joint reliability under thermal cycling, and validate signal-integrity on the 744 I/Os with the Quartus II SignalTap and TimeQuest timing analyzer tool flow. The device is in active production but is now positioned as a mature-node FPGA; lead times should be confirmed with authorized distributors.
EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera
The Altera (now Intel FPGA) EP3SE80F1152C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package. Built on a 65 nm TSMC process with a 0.9 V core supply, it combines high-performance logic fabric with rich DSP and memory resources and supports DDR3/QDRII+/RLDRAM II external memory interfaces for bandwidth-intensive designs. An FPGA (Field Programmable Gate Array) is a programmable logic class of integrated circuit that allows designers to implement arbitrary digital logic through configuration of an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader taxonomy, FPGAs sit at the top of programmable-logic devices (PLD > CPLD > FPGA) and are widely used for hardware acceleration, digital signal processing, and high-speed interface bridging. The Stratix III E family is the enhanced-logic-memory variant of Stratix III, optimized for memory-intensive and DSP-heavy applications. Key features include 3200 LABs (Logic Array Blocks), 488 embedded 18x18 multipliers, 608 M9K memory blocks, up to 12 transceiver channels, and Quartus II / Qsys design-flow support. The device operates over the commercial 0C to +85C junction range (C4 speed grade) and integrates hard PCIe, hard memory controllers, and SERDES blocks that reduce external component count. The 1152-ball FC-FBGA package provides high pin density and signal integrity for multi-Gbps serial links. Typical applications include high-performance digital signal processing (radar, medical imaging), ASIC prototyping, high-speed networking line cards, video broadcast infrastructure, and test & measurement equipment. The device's combination of abundant memory and DSP blocks makes it well suited to multi-channel baseband processing and protocol bridging. When designing with this part, ensure PCB layout supports the flip-chip BGA with proper microvia stack-up, decoupling follows the Stratix III power distribution network guidelines, and configuration is supplied through one of the supported modes (AS, AP, PS, FPP, JTAG).
EP3SE80F1152C4LN - 80K LE Stratix III E FPGA, 744 I/O, FBGA-1152
The Intel EP3SE80F1152C4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3200 LABs/CLBs, and 6,843,392 bits of embedded memory in a 1152-ball FineLine BGA (FBGA-1152) package. Per the Altera/Intel datasheet, this device is rated for 744 user I/Os and supports a core clock performance envelope up to 717 MHz. The die is fabricated on a CMOS process and integrates hard intellectual-property blocks such as transceivers, DSP blocks, and embedded memory that together make the part a workhorse for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device that combines configurable logic blocks (LBs), programmable interconnect, and dedicated silicon IP such as block RAM, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and custom ASICs: FPGAs offer the highest logic density and the highest serial I/O bandwidth, and unlike ASICs they can be reconfigured in the field, trading per-unit cost for design flexibility, time-to-market, and post-deployment updates. Key specifications include 80,000 logic elements, 3200 LABs, 488 user I/Os (note: distributor listings cite 744 I/O; see validation note), 6,843,392 embedded memory bits, and a 717 MHz internal operating frequency. The device is lead-free and ships in a 1152-ball FCBGA at industrial-grade temperature range. Hard IP blocks including high-speed transceivers and DSP slices are tightly coupled to the logic fabric, enabling sustained multi-gigabit serial and parallel DSP workloads without consuming fabric resources. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) along with 9-kbit internal memory blocks, variable-precision DSP blocks, and a multi-gigabit transceiver subsystem. The device is optimized for ASIC prototyping, high-performance DSP pipelines, and protocol bridging; designers typically pair the FPGA with external DDR3/QDR memory controllers instantiated in the fabric. Configuration is handled via Altera's Quartus II design suite with JTAG, passive serial, or fast passive parallel modes. Typical applications include high-end telecommunications baseband processing, ASIC prototyping and emulation, high-speed data-acquisition front ends, broadcast video infrastructure, and test & measurement instrumentation. The 1152-ball package is chosen when the design demands the maximum available I/O count from this family, particularly for parallel DDR memory interfaces and many LVDS channels. When designing with this device, plan power-rail sequencing carefully - Stratix III E requires a monotonic 1.1 V core ramp and a separately managed 2.5 V/3.0 V aux rail; consult the Stratix III E Hardware Reference Manual for the sequencing diagram. Pinout work must use the Altera Pin Planner against the FBGA-1152 footprint, and signal-integrity simulations are strongly recommended for LVDS and DDR3 edges above 533 MHz. This page synthesizes distributor pricing, FPGA-tier drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet - a curated layer on top of the official Altera/Intel Stratix III E documentation.
EP3SE80F1152C4N - 80K Cell Stratix III E FPGA | Intel / Altera
The Intel (formerly Altera) EP3SE80F1152C4N is a Stratix III E family Field Programmable Gate Array (FPGA) offering 80,000 logic elements, 3,200 LABs (Logic Array Blocks), and 6,843,392 bits of embedded memory, housed in a 1152-ball FC-FBGA package with 744 user I/Os. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a unique position in the digital IC hierarchy: programmable logic device (PLD) -> FPGA -> high-density programmable logic, enabling hardware reconfiguration that ASICs cannot match. Stratix III E is engineered for high-performance, power-optimized applications such as DSP, baseband processing, and high-throughput data pipelines. Key features include 717 MHz maximum internal operating frequency, 1.1 V core supply, integrated DSP blocks for high-throughput arithmetic, 12 transceivers supporting multi-gigabit serial I/O, and a low-power FPGA fabric optimized for power efficiency. The 1152-ball FC-FBGA package provides 744 user I/Os, making it ideal for high-pin-count designs requiring dense signal fan-out. Architecturally, Stratix III E uses a 65 nm process and combines hard DSP blocks, M9K/M144K block RAM, and dedicated memory interfaces (DDR2/DDR3/QDRII/RLDRAM) on a programmable interconnect fabric. The C4 speed grade and industrial temperature grading make this part suitable for demanding signal-processing applications. Typical applications include telecom baseband processing, high-performance digital signal processing, ASIC prototyping, test and measurement instrumentation, and high-speed serial interface aggregation. The device integrates transceivers up to 6.375 Gbps depending on configuration. When designing with the EP3SE80F1152C4N, ensure the PCB layout follows Intel/Altera's recommended power plane stacking, decoupling capacitor guidelines, and JTAG chain configuration to fully leverage the Stratix III architecture's signal integrity. This page synthesizes distributor pricing, drop-in Stratix III E alternatives within the same 1152-FBGA footprint, and practical FPGA design notes that complement the manufacturer datasheet.
EP3SE80F1152I3 - Stratix III E 80K LE FPGA, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F1152I3 is a high-performance Stratix III E Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3,200 LABs/CLBs, and 6,843,392 bits of embedded RAM in a 1152-ball FineLine BGA (FCBGA) package. Built on a 65 nm process node and supplied at a 1.0 V core, it provides 744 user I/O pins and operates with a maximum internal frequency of 500 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and on-chip memory that can be re-programmed to implement arbitrary digital logic after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> digital logic ICs -> integrated circuits. Stratix III E series parts are positioned as high-density, performance-oriented members of Altera's (now Intel's) programmable logic portfolio, with the E variant tuned for digital signal processing and high-speed parallel interfaces. Key features of the EP3SE80F1152I3 include 80,000 logic elements distributed across 3,200 LABs, dedicated DSP blocks, TriMatrix embedded memory totaling 6,843,392 bits, and 744 user I/O pins supporting multiple I/O standards. The part is offered in the -I3 industrial speed grade, indicating the third-fastest industrial temperature and timing bin, and is specified for an operating temperature range of 0C to 85C with a 1.0 V core supply and supporting I/O voltages typically ranging from 1.2 V to 3.3 V. From an architectural standpoint, the device leverages Altera's adaptive logic module (ALM) and MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process with embedded memory and DSP blocks enables efficient implementation of high-throughput datapaths such as video processing, communications baseband, and protocol bridging, while the FCBGA-1152 package provides the pin density needed for the 744 I/O channels and the multi-gigabit transceiver interfaces typical of Stratix III E designs. Typical applications include high-speed digital signal processing in telecommunications equipment, ASIC prototyping, high-performance computing accelerators, broadcast video processing, and high-bandwidth serial protocol interfaces. Industrial-grade temperature operation also suits factory automation controllers and medical imaging back-end pipelines. Designers should plan PCB layout for the FCBGA-1152 package using a multi-layer PCB with controlled-impedance routing for high-speed I/O and adequate thermal vias under the package to manage power dissipation. Use the Quartus II design software for synthesis, place-and-route, and timing closure, and verify pin assignments and I/O standard support against the device handbook. This page synthesizes distributor inventory and pricing, drop-in Stratix III E alternatives, and practical design considerations that go beyond the manufacturer handbook. All data is anchored to distributor and manufacturer sources current as of 2026-09-09.
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
The Intel EP3SE80F1152I3N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 80,000 logic elements, 3,200 Logic Array Blocks (LABs), and 6,843,392 bits of embedded memory in a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). It provides 744 user I/O pins, supports a core voltage of 1.1 V with 1.2 V/3.3 V auxiliary supplies, and is offered in the industrial -40 °C to +100 °C temperature range. The device is positioned as a mid-density member of the Stratix III E family, targeting high-performance digital signal processing, high-speed serial interconnect, and parallel processing applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic circuits by configuring an array of configurable logic blocks (CLBs), embedded multipliers, memory blocks, and high-speed transceivers, interconnected by a programmable routing fabric. FPGAs occupy a tier in the semiconductor hierarchy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, providing hardware-level performance with software-level reconfigurability. The Stratix III E family specifically enhances DSP capability and transceiver bandwidth versus the baseline Stratix III series. Key features include 500 MHz maximum internal clock frequency, integrated adaptive logic modules (ALMs), dedicated DSP blocks, up to 12 embedded transceivers depending on package, and support for external memory interfaces including DDR3, QDR II+, and RLDRAM II. The device also offers enhanced security via configuration bitstream encryption with AES, and supports partial reconfiguration for in-system logic updates. The 1152-ball FCBGA package provides a compact 35 mm × 35 mm footprint suitable for high-density PCB designs with multiple ground/power balls for low-impedance power delivery. The EP3SE80F1152I3N utilizes a low-power 65 nm process with enhanced power management features including programmable power technology that allows unused blocks to enter a low-quiescent state. Combined with 8-input fracturable ALMs and dedicated hardware multipliers, the device achieves an optimal performance-per-watt ratio for DSP-intensive designs such as baseband processing, video transcoding, and high-speed data acquisition. Typical applications include Software Defined Radio (SDR), high-performance computing accelerators, test and measurement equipment, medical imaging systems, military radar, and high-end broadcast video processing. The high logic density combined with rich DSP and memory resources makes the device particularly well-suited for multi-channel processing systems where multiple parallel data paths must be implemented in a single device. When designing with this FPGA, ensure proper power sequencing (1.1 V core before 2.5 V/3.3 V I/O), use at least 8 decoupling capacitors per power rail, and follow Altera's recommended PCB layout guidelines for FCBGA packages including microvia/stacked-via construction for breakout. Configuration via JTAG or a configuration device (EPCS/EPCQ) should also be planned early in the design cycle. This page synthesizes distributor pricing, same-brand Stratix III E drop-in alternatives, and practical design notes for engineers considering the EP3SE80F1152I3N for high-density programmable logic designs.
EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)
The Intel (Altera) EP3SE80F1152I4 is a Stratix® III E family Field-Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. Manufactured on a 65 nm CMOS process and supplied from a 1.1 V core rail, the device targets high-performance digital signal processing, high-bandwidth bridging, and ASIC-prototype workloads. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines a sea of configurable logic blocks, dedicated hardware multipliers, embedded memory blocks, and high-speed serial transceivers on a single die. FPGAs belong to the broader programmable logic family (alongside CPLDs) and are widely used as flexible alternatives to ASICs because the same silicon can be reconfigured for different designs. Stratix III E devices specifically emphasize enhanced logic capacity and DSP throughput for telecom, defense, and high-performance computing systems. Key features of the EP3SE80F1152I4 include 3,200 Logic Array Blocks (LABs), 80,000 logic elements, 6,843,392 bits of RAM, 744 user I/Os, and an internal operating frequency up to 800 MHz. The 'I' speed grade and '4' device-grade indicator denote an industrial temperature range of -40 °C to +100 °C junction (per the Stratix III nomenclature). The 1152-ball FCBGA package supports vertical migration across Stratix III E densities (EP3SE50, EP3SE80, EP3SE110, EP3SE260) sharing the same 1152-ball footprint. Architecturally, the Stratix III E uses Altera's Adaptive Logic Module (ALM) and TriMatrix memory blocks, with dedicated DSP blocks delivering up to 600 MHz performance and high-speed transceivers for multi-gigabit serial links. The 65 nm process with 1.1 V core supply balances high performance against dynamic power, and the device supports JTAG IEEE Std 1149.1 boundary-scan test for production board test. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom line cards, high-end video broadcast equipment, military radar and signal-intelligence systems, and PCIe Gen1/Gen2 endpoint or root-port designs. The large logic capacity and abundant I/O make it well suited to designs requiring wide parallel data buses or multiple high-speed serial channels. When designing with this FPGA, verify that your Quartus II design software supports the EP3SE80F1152I4 device variant and that the PCB footprint matches the 1152-ball FCBGA land pattern. Confirm pin assignment against the Stratix III device handbook and account for the industrial temperature grade when selecting cooling solutions for harsh environments. Stratix III devices are now in legacy lifecycle status with Intel, so for new designs consider Stratix V, Cyclone V, or Agilex 7 as successors.
EP3SE80F1152I4L - Stratix III E FPGA 80K LE 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F1152I4L is a high-density Stratix® III E family FPGA featuring 80,000 logic elements, 3,200 LABs, 744 user I/Os, and 6,843,392 bits of embedded memory, built on a 65nm process and housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The 'I4' speed grade targets industrial temperature operation and the 'L' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory, transceivers, and DSP blocks. Stratix III E FPGAs sit at the upper end of the Stratix III family, engineered for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging. Positioned within the broader hierarchy, FPGAs belong to programmable logic devices (PLDs), which in turn fall under the umbrella of digital integrated circuits and semiconductors. Key features include 744 user I/O pins, 6,843,392 bits of on-chip RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for high-throughput arithmetic, and integrated high-speed transceivers capable of operation up to 375 MHz core logic frequency. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, allowing direct interface to DDR/DDR2 memory and a wide range of parallel peripherals. The FC-FBGA package offers flip-chip interconnect for superior electrical and thermal performance compared to wire-bond packages at this pin count. The EP3SE80F1152I4L uses TSMC's 65nm low-power process node and a 0.9V core supply. Its adaptive logic module (ALM) architecture combines 8-input fracturable look-up tables with dedicated registers, providing efficient mapping for both arithmetic-intensive and control-dominated designs. On-chip PLLs provide flexible clock synthesis and skew management for multi-domain designs. Typical applications include high-speed data acquisition, ASIC prototyping, telecom baseband processing, video processing pipelines, military and aerospace signal processing, and high-end industrial control. Its logic capacity and memory bandwidth make it well suited for protocol bridging between PCIe, Gigabit Ethernet, and DDR memory subsystems. When designing with this device, plan power sequencing for the 0.9V core and 1.2V/3.3V auxiliary rails carefully, and ensure the PCB accommodates the 35mm × 35mm FC-FBGA footprint with microvia stack-up for the 1.0mm pitch ball array. Thermal management via the exposed die flip-chip attach is mandatory at sustained high utilization. This page synthesizes distributor inventory, pin-compatible drop-in alternatives within the Stratix III E family, and practical design notes not aggregated in the manufacturer datasheet.
EP3SE80F1152I4LN - Stratix III E FPGA 80K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE80F1152I4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) with 80,000 logic elements, 6,843,392 bits of embedded memory, 744 embedded multipliers (18x18), and a maximum operating frequency of 500 MHz, housed in a 1152-ball FineLine BGA (FC-FBGA) package with industrial-grade temperature range. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) -> integrated circuit (IC) -> semiconductor that allows hardware designers to configure digital logic blocks, interconnect, and I/O via a hardware description language after manufacture. FPGAs occupy a unique position between general-purpose microcontrollers and fixed-function ASICs: they offer massively parallel DSP performance, reconfigurable I/O protocols, and hardware-level latency, making them ideal for data-path-heavy workloads that CPUs handle inefficiently. Key features of the EP3SE80F1152I4LN include 8 transceivers, 488 user I/O pins, 1.1 V core voltage, 0.9 V supply option, 65 nm process technology, and four PLLs plus 48 global clocks for high-speed timing distribution. The I4 speed grade indicates an industrial temperature screening (-40C to +100C junction) with mid-tier performance placement. Architecturally, the Stratix III E family uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), embedded DSP blocks for fixed/floating-point math, and TriMatrix embedded memory supporting single-port, simple dual-port, and true dual-port modes. Partial reconfiguration is supported, allowing portions of the fabric to be reprogrammed while the rest continues operating. Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, wireline telecom line cards, broadcast video processing, and military/aerospace signal processing systems. The 1152-ball FBGA exposes enough I/O and transceiver bandwidth to drive multi-gigabit serial links. When designing with this part, plan power sequencing for the 1.1 V core (VCCINT) and 0.9 V analog supply separately, and verify signal integrity on the multi-row BGA escape. The Stratix III E is in production with mature Quartus II tooling, though newer designs should consider Cyclone V or Stratix 10 for lower power. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Stratix III E family, and practical design notes not consolidated in the manufacturer datasheet, providing unique selection and procurement guidance.
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
The Intel EP3SE80F1152I4N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FCBGA) package. Built on a 65 nm CMOS process, it supports core logic operation at 1.1 V and I/O voltages across multiple banks, with a maximum internal clock frequency of 450 MHz. The device is offered in the industrial temperature grade (-40C to +100C junction), identified by the "I4" speed/temperature code. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, transceivers, and PLLs. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs as the most flexible digital implementation medium: an FPGA can emulate any digital function up to its resource budget and is typically selected when ASIC NRE costs cannot be justified or when time-to-market is critical. The Stratix III E family targets high-performance digital signal processing, high-speed serial connectivity, and embedded processor applications. Key features of the EP3SE80F1152I4N include 80,000 logic elements, 6,843,392 embedded memory bits organized as M9K/M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and high-speed transceivers supporting multi-gigabit serial protocols. The 1152-ball FCBGA package uses flip-chip interconnect to the substrate, providing superior electrical performance and thermal dissipation versus wire-bond equivalents. The architecture integrates hard IP such as PCI Express hard IP blocks, external memory interfaces (DDR/DDR2/QDRII), and multiple PLLs for clock management. Compared with earlier Stratix generations, Stratix III E devices introduce a programmable power technology that reduces dynamic power while preserving performance, addressing one of the historic disadvantages of high-density FPGAs in power-constrained systems. Typical applications include high-speed DSP pipelines (radar, software-defined radio, medical imaging), protocol bridging and packet processing in telecom/networking line cards, ASIC prototyping and emulation, and high-bandwidth data acquisition systems. The 744 user I/Os and 1.1 V core make it particularly well-suited to systems requiring parallel high-speed interfaces combined with on-chip processing. Designers should note that FCBGA packages require controlled-impedance PCB stackups, microvia or via-in-pad technology, and X-ray inspection of solder joints. Power estimation should be performed using the Quartus II PowerPlay early power estimator before logic synthesis to size voltage regulator rails and thermal solution correctly. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not aggregated on any single distributor page.
EP3SE80F780C2 - 80K LE Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F780C2 is a high-density Stratix III E field-programmable gate array (FPGA) with 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/Os, fabricated on a 65 nm process with a 1.1 V core supply and housed in a 780-ball flip-chip BGA (FC-FBGA) package. It belongs to the low-power, enhanced-logic Stratix III E family, with 3,200 logic array blocks (LABs) and 320 DSP blocks for high-throughput signal processing. A Stratix III E FPGA is a programmable logic device that combines a high-performance adaptive logic module (ALM) fabric, embedded memory (M9K and M144K blocks), embedded DSP blocks, transceivers, and rich clocking on a single die, allowing designers to implement complete system-on-chip solutions. Stratix III E sits below Stratix IV/V and above Cyclone families in the Altera/Intel FPGA hierarchy, targeting mid-range high-performance designs in communications, video processing, and digital signal processing where logic density and DSP throughput matter more than cost-per-unit. The 'E' suffix denotes the enhanced-logic / DSP-optimized variant without embedded transceivers. Key features include 80,000 logic elements (LEs), 6,843,392 embedded RAM bits, 488 user I/Os, and 320 DSP blocks. The device operates at a maximum core clock of 600 MHz and uses the Cyclone/Stratix-style configuration scheme with on-chip encryption support. The 780-ball FC-FBGA package exposes a wide pin budget for parallel external interfaces such as DDR2/DDR3 memory controllers, parallel LVDS buses, and high-speed control planes. The 65 nm low-power process, combined with programmable power technology that allows unused logic, memory, and DSP regions to be powered down, enables the device to fit into thermal envelopes that older 90 nm and 130 nm FPGAs of comparable density could not. On-chip termination, multi-standard I/O support (LVDS, LVPECL, HSTL, SSTL), and up to 12 phase-locked loops (PLLs) provide flexible clock and interface synthesis directly on the die. Typical applications include high-speed digital signal processing (radar, sonar, beamforming), wired/wireless communication line cards, video broadcast and image processing pipelines, ASIC prototyping/emulation, and industrial motion control. The 488 user I/Os are particularly suited to parallel memory buses and high-channel-count data acquisition front ends. When designing with this device, ensure the Quartus II design tool supports the EP3SE80 device variant and that the PCB land pattern follows Intel's 780-ball FC-FBGA 1.0 mm-pitch footprint. Designers should also plan thermal management carefully because BGA packages dissipate heat primarily through the PCB and any attached heatsink. This page synthesizes distributor pricing, same-package same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers evaluate pin-compatible drop-in parts and make informed sourcing decisions.
EP3SE80F780C2N - Stratix III E FPGA, 80K LE, 780-FCBGA | Intel / Altera
The Intel (formerly Altera) EP3SE80F780C2N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) built on a 65 nm process, delivering 80,000 logic elements (LE), 6,843,392 bits of embedded memory, and 488 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. Operating at 1.1 V core with 0.9 V auxiliary supply, the device provides up to 600 MHz fabric operation and supports integrated transceivers, DSP blocks, and 3200 Logic Array Blocks (LABs) for high-performance parallel computing. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), distinct from ASICs because they can be reconfigured in the field after manufacture. Stratix III E belongs to the high-performance tier of FPGAs optimized for DSP, signal processing, and communications infrastructure. Key features of the EP3SE80F780C2N include 80K logic elements, 488 user I/Os, 6.84 Mbits of embedded memory (M9K/M144K blocks), 384 18x18 multipliers, integrated transceiver capability, and 3200 LABs. The 65 nm low-power process enables lower static power consumption versus prior Stratix generations, while the 780-ball FCBGA package offers high I/O density with flip-chip thermal performance. The architecture combines Adaptive Logic Modules (ALMs), tri-matrix memory blocks, and DSP blocks for high-bandwidth parallel arithmetic. Memory interfaces up to DDR3 and high-speed serial transceivers enable line-card, baseband, and high-performance DSP designs. The C2 speed grade balances performance and power for industrial and communications applications. Typical applications include high-speed networking line cards, baseband processing in wireless infrastructure, DSP acceleration in test and measurement equipment, ASIC prototyping, and high-speed serial protocol bridging. The 488 I/Os and abundant logic support multi-channel parallel interfaces. When designing with this device, ensure the PCB has matched-impedance routing for transceiver lanes and adequate via-in-pad or microvia technology for the FC-FBGA breakout. Thermal management via heatsink or airflow is essential at full transceiver utilization due to the flip-chip power density. This page synthesizes distributor pricing, Stratix III E cross-reference alternatives, and practical PCB layout guidance not found in the manufacturer datasheet alone.
EP3SE80F780C3 - Stratix III E FPGA, 80K LE, 780-FBGA | Altera
The Altera (Intel) EP3SE80F780C3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Fabricated on a 65 nm TSMC low-power process, it operates from a 1.1 V core supply and supports internal clock frequencies up to 500 MHz, making it a flagship device for high-throughput DSP, serial connectivity, and embedded processing subsystems. An FPGA (Field Programmable Gate Array) is a programmable semiconductor containing an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory, high-speed transceivers, and a programmable interconnect fabric. FPGAs sit between microcontrollers and ASICs in the silicon hierarchy: microcontroller -> microprocessor -> programmable logic -> FPGA -> ASIC. They are selected when designers need hardware-level parallelism and deterministic latency but cannot justify the NRE cost of a custom ASIC, and they are widely used in telecommunications infrastructure, high-performance computing, test and measurement, and aerospace/defense applications. The EP3SE80F780C3 integrates 3,200 Logic Array Blocks, up to 1,440 Kbits of MLAB memory, 270 embedded 18x18 multipliers, and Stratix III's signature Programmable Power Technology that dynamically lowers supply voltage on quiescent logic tiles. Hard IP blocks include PCI Express Gen1/Gen2 endpoints, multi-gigabit transceivers (per package variant), external memory interfaces supporting DDR/DDR2/QDRII, and dedicated PLL/DLL clock management. Designers target the device with Altera's Quartus II design suite, which provides IP cores, timing analysis, and the PowerPlay power optimization flow. Typical applications span high-speed serial protocol bridging, digital video broadcast head-ends, software-defined radio baseband processing, military radar front-end preprocessing, ASIC prototyping, and high-end medical imaging pipelines. Its 488 user I/O pins and abundant vertical migration paths within the Stratix III E family also make it a strong fit for production systems that previously used multiple smaller FPGAs to reach equivalent logic density. When designing with the EP3SE80F780C3, allocate sufficient PCB layers (typically 12+ layers with dedicated power and ground planes) to route the 780-ball FineLine BGA at 1.0 mm pitch, follow Altera's Stratix III pin connection guidelines for unused transceiver and clock pins, and use the Quartus II Early Power Estimator before board layout to validate thermal budgets. Stratix III E devices are also NRND - confirm lifetime-buy options with Intel/Altera before starting new designs. This page consolidates distributor pricing, drop-in vertical-migration alternatives within the Stratix III E family, and practical Quartus II design notes not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and bring-up decisions.
EP3SE80F780C3N - Stratix III 80K LE FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE80F780C3N is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix III family, integrating 80,000 logic elements, 3200 Logic Array Blocks (LABs), and 488 user I/Os in a 780-pin FineLine Ball-Grid Array (FBGA-780) package. Built on a 40 nm TSMC process, this device targets performance-critical applications requiring transceiver-rich I/O, on-chip memory, and DSP blocks at commercial 0°C to 85°C operating temperature. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs) that can be reconfigured by the designer after manufacture. FPGAs sit between general-purpose microcontrollers (sequential, software-defined) and Application-Specific Integrated Circuits (ASICs) (fixed-function, high-volume) in the programmable-logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. They are widely used for hardware acceleration, high-speed signal processing, and prototyping ASICs. Key features include up to 488 user I/Os, embedded TriMatrix memory blocks, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and support for high-speed external memory interfaces including DDR3. The 'C3' speed grade places this device in the mid-tier performance bin, and 'N' suffix indicates lead-free / Pb-free assembly. Internal logic-array frequency is rated to 800 MHz in this family, and fabric performance scales with design and routing constraints. Typical applications include high-speed networking line cards, wireless baseband processing, military radar and electronic-warfare signal chains, medical imaging accelerators, ASIC prototyping, and high-performance computing offload engines. The large logic capacity and abundant I/O make it well suited to data-path-heavy designs that would otherwise require multiple smaller FPGAs. When designing with this part, plan power-rail sequencing carefully - Stratix III requires multiple supply rails (VCC, VCCPD, VCCPT, VCCA, VCCH, VCCL) with strict monotonic-ramp requirements. Use the Quartus II PowerPlay early-power estimator before PCB layout to avoid thermal redesigns late in the cycle. JTAG, MSEL, and configuration-pin planning should follow the Stratix III Handbook reference schematics verbatim for first-pass board success.
EP3SE80F780C4 - Stratix III E 80K LE FPGA, 488 I/O, FCBGA-780 | Altera
The Altera (Intel) EP3SE80F780C4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) housed in a 780-pin FC-FBGA (FCBGA-780) package. Built on a 65 nm process, the EP3SE80F780C4 integrates 80,000 logic elements, 6,843,392 RAM bits (~6.5 Mbit), 488 user I/Os, and 3,200 LABs/CLBs, with a core voltage of 1.1 V and maximum operating frequency support up to 450 MHz. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic through configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the highest flexibility tier of the programmable logic taxonomy: programmable logic → programmable logic device → semiconductor IC. Stratix III devices added Altera's Programmable Power Technology, allowing unused logic blocks to consume less power while active blocks run at full speed, addressing the historical ASIC-vs-FPGA trade-off. Key features of the EP3SE80F780C4 include 80,000 logic elements, 488 user I/Os (largest I/O count in the Stratix III E family 780-package options), 6.5 Mbit embedded memory, and selectable core voltage for low-power operation. The device supports up to 8 PLLs and multiple high-speed I/O standards including LVDS, making it suitable for high-throughput parallel interfaces. Operating temperature grade is commercial (0C to +85C), denoted by the C4 speed/temperature code. The architecture uses a tiered interconnect (HyperFlex-equivalent not present in Stratix III) combined with DSP blocks and TriMatrix on-chip memory to deliver high DSP throughput. Programmable Power Technology combined with selectable core voltage (1.1 V nominal, optionally 0.9 V for lower power) gives the lowest static power in its class for 65 nm high-performance FPGAs. Typical applications include high-performance digital signal processing, telecom baseband and packet processing, ASIC prototyping, high-end test and measurement instrumentation, broadcast video processing, and high-bandwidth data acquisition systems. The 488 I/O count supports wide parallel buses, multi-channel LVDS interfaces, and memory-rich designs. When designing with this FPGA, pay close attention to the large BGA thermal envelope and PCB stack-up requirements - 780-pin FC-FBGA requires microvia stack-up and controlled-impedance routing. Use Altera/Intel Quartus II software with the Stratix III device support to compile, simulate, and configure the device via JTAG or active serial configuration schemes. This page synthesizes distributor pricing, same-family Altera/Intel drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SE80F780C4L - 80K LE Stratix III E FPGA 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE80F780C4L is a Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package, fabricated on a 65 nm process node and supplied at 0.9 V core. It delivers 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 maximum user I/O pins, with a maximum internal clock frequency of 375 MHz. The 780-FCBGA package exposes 24 full-duplex transcever lanes operating up to 6.375 Gbps for high-speed serial connectivity. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all of which an engineer can reconfigure after manufacture to implement any digital circuit. FPGAs sit hierarchically between general-purpose microcontrollers (fixed architecture, software-driven) and application-specific integrated circuits (ASICs, fixed function), offering hardware-level parallelism and the ability to ship a generic silicon platform that is customized per end-product. The Stratix III E family targets high-performance, high-bandwidth applications such as wireline telecom, high-end DSP, and ASIC prototyping. Key differentiating features include 3200 Logic Array Blocks (LABs), 4 phase-locked loops (PLLs), 8.34375 Gbps maximum transceiver data rate, 488 user I/Os, and hard memory controllers. The device also integrates dedicated DSP blocks, high-speed transcevers, and the Adaptive Logic Module (ALM) architecture, which delivers roughly twice the logic capacity per LUT compared with the prior Stratix II generation. This combination of logic density and high-speed serial I/O targets throughput-intensive designs. Architecturally, the Stratix III E ALM is an 8-input adaptive structure that can be split into smaller LUTs, providing superior logic packing versus fixed 4-input LUTs. The transceiver tiles support multiple protocol Physical Coding Sublayers (PCS) including PCI Express Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and SDI, removing the need for external PHY chips. The 65 nm process and 0.9 V core supply minimize dynamic power, while programmable power-rail gating lets unused logic cut quiescent draw, enabling the E family to hit higher performance at lower watts than Stratix II. Typical applications include high-speed serial protocol bridging (PCIe, XAUI, SRIO), ASIC and SoC prototyping, telecommunications line cards, military radar signal processing, broadcast video processing, and high-performance DSP accelerators. The 488 I/O pins and 24 transceiver channels also suit it to multi-port packet processors. Designers building high-throughput parallel pipelines benefit from the combination of ALM logic density, embedded RAM, and hard DSP blocks. Designers using this part must observe Stratix III E power-on sequencing (1.0 V, then VCCPD, then VCCAUX, then core VCC), ensure transceiver reference-clock jitter meets the protocol requirement, and respect FPGA-JTAG configuration timing during board bring-up. The device ships in the C4 (commercial, speed grade 4, enhanced power) variant with the C4L suffix denoting a lead-free / RoHS-compliant FC-FBGA package. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix III E family and pin-compatible cross-brand FPGAs, and practical design notes that go beyond what the manufacturer datasheet alone provides.