FPGA и CPLD
Товары (6666)
EPF10K130EFC484-2 - FLEX 10KE 130K Gates FPGA | Altera | 484-FBGA
The Altera (Intel) EPF10K130EFC484-2 is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs) offering 130,000 gates and 6,656 logic elements (LEs) in a 484-pin Fine-Pitch Ball Grid Array (FineLine BGA) package. It operates from a 2.5 V core supply and is fabricated on a 0.22 µm CMOS process technology, with a maximum internal clock frequency of 333.33 MHz. The device includes 65,536 bits of embedded memory and provides up to 369 user I/O pins, making it a high-density programmable logic solution for telecom, networking, and embedded computing designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacture. The FLEX 10KE architecture belongs to the broader hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. FPGAs occupy a unique position between fixed-function ASICs (high NRE, low unit cost at volume) and discrete logic (low cost, fixed function), offering hardware-level parallelism with software-driven design flexibility. Key differentiating features of the EPF10K130EFC484-2 include embedded array blocks (EABs) for on-chip SRAM implementation, multi-volt I/O support for interfacing with 2.5 V and 3.3 V logic, and SameFrame pin migration compatibility across the FLEX 10KE BGA family. The -2 speed grade indicates a balance between performance and power consumption, suitable for cost-sensitive volume production. Typical applications for the EPF10K130EFC484-2 include telecommunications infrastructure (DSLAM, SONET/SDH framer, ATM switches), network routers and switches, glue logic replacement, bus interface bridging (PCI, UTOPIA, POS-PHY), and DSP co-processing. Its embedded memory blocks make it well-suited for packet buffering, lookup tables, and FIFO implementations. When designing with this part, verify PCB footprint compatibility using Altera's SameFrame pin-out guide; ensure 2.5 V core and proper I/O bank voltages; and configure the device via the Altera Quartus/MAX+PLUS II toolchain. Note that the FLEX 10KE family is mature and approaching EOL status—long-term availability should be confirmed before new designs. This page synthesizes distributor pricing, drop-in same-package alternatives within the FLEX 10KE BGA family, and practical design notes not found in a single manufacturer datasheet.
EPF10K130EFC484-2N - 130K-Gate FPGA, 484-BBGA | Altera
Altera EPF10K130EFC484-2N is a 130,000-gate FLEX-10KE field-programmable gate array with 6,656 logic cells, 65,536 bits of embedded memory, and 369 user I/Os. The target operates from a 2.5 V supply spanning 2.375 V to 2.625 V and is housed in a 484-ball fine-pitch BGA package measuring 23 mm by 23 mm. Verified distributor data also lists a commercial operating-temperature range of 0 °C to 70 °C. An FPGA is a field-programmable gate array: a semiconductor device containing programmable logic elements, routing resources, and configurable I/O that engineers can program after manufacturing. FPGAs occupy the programmable-logic tier between fixed-function application-specific integrated circuits and software-controlled processors. They implement digital datapaths, control logic, interfaces, and state machines in configurable hardware, while the FLEX-10KE family combines embedded programmable logic with embedded memory for system-on-a-programmable-chip designs. The defining capability is 130,000 gates supported by 6,656 cells, which gives the device meaningful capacity for multi-interface glue logic and moderate digital systems. Its 65,536 RAM bits support buffers, state storage, lookup tables, and small FIFOs. A 369-I/O budget accommodates many external buses and peripheral interfaces, while 0.22 µm CMOS technology and a listed 333.33 MHz frequency reflect the device family and fabrication generation represented in the verified source data. The architecture is based on logic-array blocks and programmable interconnects rather than fixed execution instructions. Configuration data determines logic functions and signal routing, so changes can be implemented through FPGA design software without replacing the IC. The embedded memory is distributed within this programmable fabric, allowing compact implementations that might otherwise require external memory devices for small storage or queue functions. Typical uses include industrial control and automation, communications-interface bridging, test and measurement equipment, and legacy digital systems requiring a dense programmable BGA device. The 369 available I/Os are especially useful when aggregating parallel buses, memory interfaces, counters, and protocol adapters. The 23 mm by 23 mm FBGA package is intended for space-conscious boards but requires appropriate BGA assembly, inspection, routing, and thermal design capabilities. Designers should verify all configuration, clock, power, signal-integrity, and ball-assignment details against the manufacturer datasheet before release. They should also validate timing at the selected speed grade and supply condition rather than assuming the listed family frequency applies to every implemented circuit. BGA escape routing, contiguous ground references, decoupling placement, and manufacturing-process controls are central to reliable operation. This page consolidates verified distributor specifications, package information, sourcing evidence, application guidance, and drop-in comparison limits. The cross-reference data identifies closely related family and speed-grade candidates, but only candidates with defensible same-package, pin-to-pin evidence are treated as drop-in alternatives.
EPF10K130EFC484-3 - 130K Gates FLEX 10KE FPGA, 484-BGA | Altera
The Intel (formerly Altera) EPF10K130EFC484-3 is a high-density member of the FLEX 10KE embedded programmable logic family, providing approximately 130,000 system gates and 6,656 logic elements (LEs) housed in a 484-pin FineLine Ball-Grid Array (FBGA) package. It offers 369 user I/O pins, 65,536 bits of embedded SRAM, and 832 Logic Array Blocks (LABs) operating on a 3.3 V core supply with multi-voltage I/O support. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing through configuration memory; FPGAs are widely used as glue logic, prototyping vehicles, and short-to-medium-volume custom compute blocks. The FLEX 10KE family in particular introduced an embedded array block concept that pairs distributed logic with dedicated RAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration by combining microprocessor cores, custom datapath logic, and on-chip memory in a single device. Key features include 6,656 logic elements, 832 LABs each containing 8 LEs, 65,536 bits of embedded array SRAM organized as 16 EABs (Embedded Array Blocks) of 4,096 bits each, a propagation delay of approximately 0.6 ns per LE, and 369 user I/Os. The device supports in-system programmability via serial or parallel configuration and operates across the commercial 0 C to 70 C temperature range with a -3 speed grade denoting the slowest of three performance bins. The architecture combines a fine-grained logic fabric with course-grained EABs that can implement RAM, ROM, FIFO, or multiplier functions. Multivolt I/O pins support 5.0 V, 3.3 V, and 2.5 V interfaces, allowing direct bridging between legacy TTL/CMOS peripherals and modern low-voltage ASICs without external level shifters. The 484-FBGA package offers high I/O density with a controlled-impedance substrate suitable for high-speed parallel buses and DDR memory interfaces. Typical applications include telecommunications line cards and crosspoint switches, industrial motor-control and machine-vision front ends, ASIC prototyping, military/aerospace signal processing (with the military-grade screening variant), and embedded DSP glue logic between microprocessors and peripherals. The wide I/O count makes the EPF10K130EFC484-3 particularly attractive for parallel bus aggregation in legacy replacement designs. When designing with this part, allocate at least one configuration device (EPC2 or compatible) or a microprocessor-driven configuration scheme, since the FLEX 10KE is SRAM-based and reconfigures on every power-up. Ensure controlled-impedance routing for all clocks and high-speed I/O, and verify that the FBGA land pattern matches your PCB manufacturer's BGA process capability. This page synthesizes distributor pricing snapshots, same-package alternatives, and practical design guidance not assembled in the original FLEX 10KE datasheet, providing a single reference for engineers evaluating end-of-life FLEX 10KE designs against current alternatives.
EPF10K130EFC484-3N - 130K Gates FLEX-10KE FPGA | Intel | 484-BGA
The Intel (Altera) EPF10K130EFC484-3N is a high-density member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), integrating 6656 logic elements (LEs) and 65536 bits of embedded SRAM in a 484-ball FineLine BGA package with 369 user I/O pins. The "-3N" speed grade denotes a commercial-temperature, faster-than-3 timing bin optimized for higher system clock frequencies in cost-sensitive, non-industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric. Modern FPGAs also embed hard IP such as block RAM, PLLs, and high-speed transceivers. Positioned in the broader programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA), FPGAs deliver the highest logic density and are used when ASIC-like performance is required but design flexibility must be preserved. Key features of the EPF10K130EFC484-3N include 6,656 logic elements, 65,536 bits of embedded SRAM, 72 embedded array blocks (EABs) for memory-intensive functions, and 369 maximum user I/O. The device is built on a 0.22 µm CMOS process and operates from a 2.5 V core supply with multi-voltage I/O support. The 484-ball FineLine BGA (23 × 23 mm, 1.0 mm pitch) provides ample signal breakout for high-pin-count designs while remaining compatible with conventional PCB assembly. Architecturally, the FLEX 10KE family combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions, giving designers a balanced mix of distributed and block memory. The 2.5 V core with hot-socketing-capable I/O simplifies multi-voltage interfacing, and the in-system programmability via SRAM configuration cells allows rapid design iteration without rework. Typical applications include telecom line-card glue logic, industrial control and instrumentation, prototype ASIC verification, and high-density data-path implementation such as image processing and protocol bridging. The combination of 130 K typical gates and 369 user I/O also makes it suitable for legacy designs migrating from older Altera FLEX 8000 devices that need higher I/O and memory bandwidth. When designing with the EPF10K130EFC484-3N, ensure the configuration scheme (PS, PPS, JTAG, or Altera serial) is selected early in the design cycle, since the configuration pins are multiplexed with user I/O and require careful Quartus II fitter planning. The 484-BGA package also demands controlled-impedance PCB layout and thermal vias under the die for reliable operation in space-constrained boards. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K130EFC672-1X - FLEX 10KE FPGA 130K Gates 672-FBGA | Intel
The Intel (formerly Altera) EPF10K130EFC672-1X is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs), delivering 130,000 typical gates and 6,656 logic elements (LEs) in a 672-ball FineLine BGA package. Built on a 0.22 µm CMOS process, it operates from a 2.5 V core supply (2.375 V to 2.625 V) and provides 413 user I/Os with multi-volt I/O support, making it suitable for high-density glue logic, bus bridging, and ASIC prototyping in industrial and telecom designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined by an SRAM configuration bitstream rather than fixed mask interconnect. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and integrate programmable logic fabric, dedicated memory blocks, and I/O cells into a single die. Within this taxonomy, the FLEX 10KE family represents the high-density, embedded-memory generation that preceded the Cyclone series, providing distributed Look-Up Table (LUT) logic with embedded array blocks (EABs) usable as RAM, ROM, or FIFO buffers. Key features include 65,536 bits of embedded SRAM, 832 Logic Array Blocks (LABs), support for 333.33 MHz internal operation, JTAG-compliant IEEE Std 1149.1 boundary-scan test, in-system reconfigurability via the passive serial or ByteBlaster interfaces, and a 4.6 ns pin-to-pin logic delay class typical of the family. The -1X speed grade and commercial temperature grade (0 °C to +70 °C) are explicitly marked on the device top-side per the Altera ordering scheme. Architecturally, the EPF10K130E integrates a continuous, fine-grained logic fabric of 4-input LUTs and 8-LAB clusters, interconnected via a multi-level routing network called the FastTrack Interconnect. Each LAB contains ten LEs and local interconnect; embedded array blocks (EABs) provide 2 Kbit blocks of dual-port RAM for FIFOs, ROM, or look-up-table coefficient storage. This combination enabled designers to implement DSP-style datapath functions without external memory. Typical applications include telecommunications line-card glue logic, industrial control backplanes, ASIC prototyping for medium-complexity designs, and legacy PCI/ISA bridge implementations. Designers migrating from FLEX 10K to FLEX 10KE typically retain their original pin-out footprints while gaining faster I/O registers and additional embedded memory. When designing with this device, note that configuration data is volatile - the bitstream must be reloaded at every power-up from a serial PROM, flash, or micro-controller. The 672-FBGA package is a 27 mm × 27 mm body with 1.0 mm ball pitch; PCB land pattern and reflow profile must conform to JEDEC J-STD-020 moisture sensitivity level handling requirements for large BGAs. This page synthesizes distributor pricing, supply-chain alternatives, and practical engineering guidance not assembled in the original Altera datasheet, including verified availability across Rochester Electronics, DigiKey, and Mouser channels as of 2026-09-11.
EPF10K130EFC672-2 - 130K Gates FLEX 10KE FPGA | Altera | 672-BGA
The Altera EPF10K130EFC672-2 is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), delivering approximately 130,000 gates with 6,656 logic elements and 65,536 bits of embedded memory in a 672-pin FineLine BGA package. Built on a 0.22 µm CMOS SRAM process, this device operates from a 2.5 V core supply and provides 413 user I/Os with internal propagation delays on the order of 0.6 ns, enabling high-performance glue-logic, bus-interface, and DSP pre-processing designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family combines a fine-grained Look-Up Table (LUT)-based logic array with an embedded array block (EAB) that can be configured as memory, multipliers, or specialized logic, allowing a single chip to replace dozens of discrete 74-series logic parts. Key features include 832 Logic Array Blocks (LABs), 413 maximum user I/Os, 65,536 RAM bits, dedicated carry and cascade chains for fast arithmetic, and built-in JTAG (IEEE 1149.1) boundary-scan support. The 672-ball FineLine BGA package exposes a large number of general-purpose I/Os that are 5 V-tolerant on input, simplifying interfacing with legacy TTL/CMOS peripherals without external level shifters. Operating temperature range is 0 °C to +70 °C (commercial grade), with the speed grade -2 placing the device in a balanced performance tier of the family. Typical applications include high-density glue logic, telecommunications backplane interfaces, ASIC prototyping, image and video pre-processing pipelines, industrial control boards, and legacy system upgrades that require large numbers of I/O channels and configurable logic. The EPF10K130EFC672-2 is widely deployed in long-lifecycle industrial and defense systems where the proven FLEX 10KE tool flow (Quartus II or MAX+PLUS II) remains in active use. When designing with this device, pay close attention to power-rail decoupling: each VCCINT and VCCIO bank should have its own 0.1 µF and 10 µF ceramic capacitor pair placed within 5 mm of the BGA balls. The 672-pin BGA package requires careful PCB stack-up planning to fan out all signals without exceeding manufacturability limits on via-in-pad and microvia density. This page synthesizes distributor stock data, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to support engineers maintaining FLEX 10KE designs.
EPF10K130EFC672-2X - FLEX 10KE FPGA, 6656 LEs, 672-BGA | Intel
The Intel (formerly Altera) EPF10K130EFC672-2X is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) with 6656 logic elements (LEs), 65536 embedded RAM bits, and 413 user I/Os, housed in a 672-ball FineLine BGA package (672-FBGA, 27x27 mm). The -2X speed grade designation indicates an industrial-grade operating temperature range with the second-tier speed performance offered by the FLEX 10KE series. The device is built on a 0.22 μm CMOS SRAM process and operates from a 2.5 V core supply with 3.3 V I/O tolerance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/Os on a single die. Within the broader semiconductor taxonomy, an FPGA sits below custom ASICs in NRE cost and above fixed-function CPLDs in logic capacity. The FLEX 10KE family introduced the industry's first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration with an embedded array block (EAB) usable as on-chip RAM, ROM, or product-term logic. Key features of the EPF10K130EFC672-2X include 832 Logic Array Blocks (LABs) each containing 8 LEs for a total of 6656 LEs, four Delay-Locked Loops (DLLs) for clock skew management, MultiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V logic families, and JTAG-compliant IEEE 1149.1 boundary-scan test capability. The 65536-bit embedded array block (EAB) can be configured as RAM, ROM, or FIFO without consuming logic resources. The 672-FBGA FineLine BGA package provides a 27x27 mm footprint with 1.0 mm ball pitch and a 1.27 mm ball spacing, enabling high-density board routing. The device supports in-system configuration via the serial configuration device interface, allowing field upgrades without removing the board from its system. The FLEX 10KE architecture is widely documented in legacy Altera reference designs and is supported by the legacy MAX+PLUS II and Quartus II design tools. Typical applications for the EPF10K130EFC672-2X include telecommunications glue logic, industrial control and instrumentation, legacy PCI/ISA bus interface bridges, prototyping and emulation platforms, and replacement of multiple discrete logic devices in legacy telecom and test equipment. The 65536-bit embedded RAM and 413 user I/Os make the part well suited for system-level integration in mid-to-late-1990s and early-2000s equipment designs. When designing with this device, engineers should note that the FLEX 10KE series is a mature product line. The Intel/Altera Quartus II toolchain (version 13.1 and earlier) and MAX+PLUS II legacy toolchain provide full synthesis and place-and-route support. New designs targeting modern high-speed SERDES, DSP blocks, or transceivers should consider the Cyclone or Arria device families instead. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the standard datasheet cover page.
EPF10K130EFI484-2 - 130K Gates FLEX 10KE FPGA | Intel | BGA-484
The Intel (formerly Altera) EPF10K130EFI484-2 is a 130,000-gate FLEX 10KE family Field Programmable Gate Array (FPGA) with 6,656 logic cells and 274 user I/Os, housed in a 484-ball FineLine BGA package. The part is built on a 0.22 µm CMOS process, supports a 2.5 V core supply, operates from 0 °C to 70 °C, and is rated for a 333.33 MHz internal clock with a 0.6 ns propagation delay at the I/O register. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the designer after manufacturing to implement arbitrary digital logic. FPGAs occupy a place in the broader semiconductor hierarchy between ASICs (Application-Specific Integrated Circuits, which are fixed at fabrication) and general-purpose processors (which execute software sequentially). The FLEX 10KE family was Altera's first embedded programmable logic family to combine a logic array block (LAB) fabric with an embedded array block (EAB) for on-chip RAM/ROM, providing System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K130EFI484-2 include the FLEX 10KE embedded array architecture, 65,536 bits of distributed memory (via EAB), 3.3 V PCI-compliant I/O, JTAG-compliant boundary-scan (IEEE 1149.1) support, and built-in SameFrame pin migration that lets the designer move between 10K, 10KE, 10KA, and 10K130E family devices without board rework when using the FineLine BGA footprint. Typical applications include high-volume telecommunications line cards, glue logic and bus bridging for embedded CPU boards, industrial control and factory automation backplanes, and legacy replacement designs where the long-life FLEX 10KE supply chain and SameFrame migration tool flow reduce board respin risk. Designers using Quartus II or MAX+PLUS II can target this device directly. When designing with this device, treat the 484-ball FineLine BGA as a non-trivial BGA layout: keep all power and ground balls decoupled with 0.1 µF and 10 µF capacitors placed as close to the package as the breakout allows, and verify SameFrame pin-out migration in the Quartus pin planner before committing to a layout because some I/O banks differ between FLEX 10KE and 10KA devices.
EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera
The Altera EPF10K130EQC240-1 is a member of the FLEX 10KE family of embedded programmable logic devices, providing 130,000 typical gates, 6,656 logic elements (LEs), and 65536 bits of embedded SRAM in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) at up to 333.33 MHz internal performance, with 186 maximum user I/O pins available for external interfacing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in-system. Within the broader taxonomy, the FLEX 10KE sits at the intersection of SRAM-based FPGA and embedded programmable logic, integrating dedicated Embedded Array Blocks (EABs) that provide true dual-port RAM and ROM functions alongside standard LEs - positioning it as one of the first devices to combine ASIC-density gate arrays with FPGA-style programmable interconnect in a single fabric. Key features of the EPF10K130EQC240-1 include 4 Embedded Array Blocks delivering up to 65536 RAM bits, JTAG-compliant IEEE 1149.1 boundary-scan test support, MultiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and in-system programmability via the Altera EPC configuration devices. The PQFP-240 package uses a 32x32 mm body with gull-wing leads, suiting it for prototypes, industrial control cards, and legacy telecom infrastructure where surface-mount fine-pitch BGAs are not required. Typical applications for this device include industrial machine control, telecommunications line cards, glue-logic integration, legacy ASIC replacement, and embedded DSP co-processing. Designers should pair it with Altera's MAX+PLUS II or Quartus design software for synthesis, place-and-route, and timing analysis. Note that this part is in lifecycle status considered Last Time Buy / Not Recommended for New Designs, so it is best suited for maintenance of existing production systems rather than new platforms.
EPF10K130EQC240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel
The Intel (formerly Altera) EPF10K130EQC240-1N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) integrating 130,000 system gates with 6,656 logic elements and 65,536 bits of embedded SRAM, fabricated on a 0.22 µm (some sources cite 0.25 µm) CMOS process and housed in a 240-pin Plastic Quad Flat Pack (PQFP / 240-BFQFP) measuring 32x32 mm. The device operates from a 2.375 V to 2.625 V (2.5 V nominal) core supply, supports 186 user I/Os, and contains 832 Logic Array Blocks (LABs) implementing a built-in SRAM configuration memory so the bitstream reloads on every power-up. A Field-Programmable Gate Array is a reconfigurable digital integrated circuit that combines programmable logic elements, an interconnect matrix, and I/O blocks in a single die. Within the broader programmable-logic taxonomy, FPGAs sit above small CPLDs and below ASICs in density; the FLEX 10KE family in particular targets glue-logic, bus-bridging, and mid-density state-machine designs of the late 1990s/early 2000s, before the Cyclone and Stratix families displaced FLEX 10KE in new designs. Engineers chose the FLEX 10KE family for SRAM-based reconfigurability, embedded memory blocks, and the mature Quartus II design-flow support. Key specifications include 64 Kbit embedded block RAM (EAB), 342,000 maximum system gates, 4 Embedded Array Blocks (EABs) of 2,048 bits each, 333.33 MHz maximum internal operating frequency, and -40 °C to +85 °C commercial operating temperature range (note the -1N speed grade). The -1N suffix designates the faster -1 speed grade combined with an industrial/lead-free reflow profile; the package is lead-free (Pb-free) and RoHS compliant, while older -1 / -2 / -3 grades used SnPb lead finish. Compared with the -3 (slowest) grade, the -1 grade delivers the highest internal performance in this family. Typical applications include telecom interface cards (T1/E1, Utopia, POS-PHY bridging), industrial control boards, mid-density glue logic between microprocessors and peripherals, ISA/PCI bus bridges, and legacy replacement of 74-series TTL arrays in long-lifecycle equipment. The 186 user I/Os and 64 Kbit of embedded RAM also make it suitable for protocol converters and small packet-processing engines on FPGA fabric. When designing with this part, ensure the 2.5 V core rail is well decoupled with 0.1 µF and 10 µF capacitors near each supply pin, and route all 186 I/Os through 5 V-tolerant banks if the board mixes 3.3 V and 5 V logic. Quartus II (legacy) or the Quartus Prime FLEX 10KE device-support add-on is required for synthesis, fitting, and bitstream generation. This page combines distributor pricing, SameFrame pin-migration alternatives, and practical design guidance not found in the original FLEX 10KE datasheet, helping engineers evaluating EOL inventory or performing legacy board-maintenance sourcing.
EPF10K130EQC240-3 - FLEX-10KE FPGA 130K Gates 240-PQFP | Altera
The Altera (Intel) EPF10K130EQC240-3 is a FLEX-10KE series Field Programmable Gate Array delivering up to 342,000 system gates with 6,656 logic elements, 832 logic array blocks (LABs), and 65,536 bits of embedded SRAM in a 240-pin Power QFP (PQFP, 32x32 mm) package. It is built on SRAM-based CMOS configuration memory, supports 186 user I/O pins, and operates from a 2.375 V to 2.625 V core supply with multi-voltage I/O support (2.5 V / 3.3 V). The "-3" speed grade positions it in the FLEX-10KE commercial speed portfolio. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LABs/CLBs) interconnected by a programmable routing fabric and surrounded by programmable I/O cells. FPGAs occupy the top of the programmable logic hierarchy - above SPLDs and CPLDs - and below hard ASICs. They enable System-on-a-Programmable-Chip (SOPC) integration, embedding megafunctions such as multipliers, memory blocks, and processor cores alongside general logic. This hierarchy makes FPGAs ideal for glue logic, prototyping, and low-to-mid volume production without NRE tooling cost. Key features include embedded array blocks for implementing efficient memory and specialized logic, a separate logic array for general logic functions, four phase-locked loops (PLLs) for clock management, multi-voltage I/O supporting 2.5 V and 3.3 V interfaces, and built-in JTAG (IEEE 1149.1) boundary-scan support. The device supports in-system programmability via the Altera FLEX-10KE configuration scheme using a serial configuration EPROM or microprocessor interface. Architecturally, the FLEX-10KE family combines an embedded array (optimized for megafunctions like RAM, ROM, and multiplier primitives) with a logic array (fast fine-grained logic), connected through continuous FastTrack interconnect. Each LAB contains 8 logic elements (LEs), and each LE contains a 4-input LUT, a programmable register, and carry chain logic. Embedded array blocks (EABs) provide 2,048 bits of RAM each, configurable as RAM, ROM, or FIFO. Typical applications include telecommunications line cards, industrial control glue logic, video processing pipelines, DSP co-processing front-ends, networking bridges, and PCI bus controllers. The 240-PQFP footprint was widely adopted in late-1990s/early-2000s designs and remains in service today as long-lifecycle infrastructure equipment. When designing with this part, note that FLEX-10KE FPGAs are end-of-life and Intel/Altera recommends migration to Cyclone IV or Cyclone V for new designs. For new 240-pin PQFP designs in production, consider Cyclone IV E EP4CE40 in FQFP or BGA. Existing designs should source EPF10K130EQC240-3 through authorized distributors or last-time-buy stock. This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Site MPN list, practical design notes and lifecycle information not found in any single distributor page, and is engineered for AI-search citation with structured FAQ and comparison data.
EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
The Intel EPF10K130EQC240-3N is a member of the FLEX 10KE programmable logic family, a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP) package. It integrates 6,656 logic elements organized into 832 Logic Array Blocks (LABs), 65,536 bits of embedded RAM, 186 user I/O pins, and 342,000 equivalent system gates, delivering high logic density for glue-logic, bus-interface, and datapath replacement tasks at a frequency of 200 MHz in a 0.22 µm CMOS process. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. They are widely used to implement parallel hardware acceleration, custom I/O protocols, and prototyping of ASIC designs, providing faster time-to-market than full-custom silicon. The FLEX 10KE family specifically targets high-volume, low-cost glue-logic replacement and bridge applications. Key specifications include a core supply voltage of 2.5 V (range 2.375 V to 2.625 V), 186 configurable I/O pins operating from 3.3 V LVTTL/LVCMOS interfaces, four Phase-Locked Loops (PLLs) for clock management, embedded multiplier blocks for datapath acceleration, and MultiVolt I/O supporting mixed-voltage operation. The 240-BQFP footprint uses 32 x 32 mm gull-wing leads and offers 5 V tolerant inputs. The FLEX 10KE architecture separates logic, routing, and memory into dedicated columns, allowing embedded array blocks (EABs) to be configured as RAM, ROM, or synchronous FIFO. With 49,152 typical gates (130K maximum) and fast SRAM configuration, the EPF10K130E accelerates pipelined designs and is well-suited for digital signal processing front-ends and bus-bridging ASICs. Typical applications include telecommunications backplane interfaces, industrial control systems, PCI bridge logic, peripheral controllers, and legacy ASIC/ASSP replacement. Its 5 V tolerant I/O and SRAM-based reconfiguration make it ideal for prototyping and short-run production. When designing with the EPF10K130E, ensure the configuration PROM (EPC16, EPC8, or EPC2 series) is properly sized for the bitstream. Use 100 µF bulk + 0.1 µF decoupling per VCC pin, and confirm JTAG chain length matches the Quartus programmer. This part is widely available on the secondary market as Intel/Altera has notified FLEX 10KE of last-time-buy status. This page synthesizes distributor stock, parametric alternatives, and design guidance not found in the original manufacturer datasheet.
EPF10K130EQI240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel / Altera
The Intel (formerly Altera) EPF10K130EQI240-1N is a high-density FLEX 10KE family FPGA delivering 130,000 typical gates (logic, capacity, package) housed in a 240-pin PowerQuad Flat Pack (PQFP, RQFP-240) surface-mount package with gull-wing leads. It provides 6,656 logic elements, embedded array blocks (EABs), and 186 user I/O pins, with a 2.5 V core supply (2.3 V to 2.7 V tolerance) suitable for industrial-temperature designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader category of programmable logic devices (PLDs) within the integrated circuits hierarchy. FPGAs occupy the high-end of the PLD taxonomy (above simple SPLDs and CPLDs) by integrating thousands of configurable logic blocks, programmable interconnect, embedded memory, and often embedded multipliers or transceivers, enabling the implementation of complete digital subsystems on a single chip. The FLEX 10KE generation is built on a 0.25 µm CMOS process with SRAM-based configuration, requiring an external configuration device such as the EPC2 configuration PROM to load the bitstream at power-up. Key features include 6,656 logic elements (LEs), 6,912 total RAM bits distributed across embedded array blocks, support for system-clock rates up to 333.33 MHz, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programmability via the serial configuration interface and offers multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL for memory interfaces. Typical applications include industrial control, telecom line cards, glue-logic consolidation on legacy 5 V boards, prototyping for ASIC replacement, and DSP co-processing pipelines. The wide I/O count and embedded memory blocks also make the part well-suited to parallel bus interfacing in test and measurement instrumentation. Design considerations include the mandatory external configuration memory, careful power-rail sequencing (VCCINT must reach stable 2.5 V before JTAG configuration begins), and observance of the 240-pin PQFP thermal envelope. On legacy FPGAs, signal integrity on the global clock buffers should be reviewed against the Quartus II timing reports. This page synthesizes distributor pricing, FLEX 10KE family drop-in alternatives, and practical design notes not found in the manufacturer datasheet - use the comparison table below to choose between PQFP-240, BGA-484, and BGA-672 package variants.
EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera
The Intel (formerly Altera) EPF10K130EQI240-2 is a member of the FLEX 10KE family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 130,000 typical gates and 6,656 logic elements in a 240-pin Power Quad Flat Pack (PQFP / BFQFP) package. It integrates 65,536 bits of embedded array memory, 832 Logic Array Blocks (LABs) with 12 logic elements per LAB, and 186 user I/O pins, providing a high-density programmable platform for glue-logic, bus-bridging, and custom datapath designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program after manufacturing to implement arbitrary digital logic. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below ASICs in terms of density, power efficiency, and per-unit cost at volume. The FLEX 10KE family specifically combines fine-grained logic with embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier primitives, making the device suitable for designs that require both random logic and on-chip memory. Key features of the EPF10K130EQI240-2 include 342,000 maximum system gates, 65,536 RAM bits distributed across embedded array blocks, 4 dedicated input pins plus clock and clear control pins, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and multi-volt I/O support (5.0V, 3.3V, 2.5V). The industrial-grade -2 speed grade and -40C to +85C operating range make the part suitable for commercial and industrial environments rather than full automotive qualification. The EPF10K130EQI240-2 uses a 0.22 um SRAM process with a 4-input look-up table (LUT) architecture per logic element, with cascade chains and fast carry chains for arithmetic functions. Built-in PCI compliance and a low-skew global clock network with up to 8 clock pins allow the device to address both peripheral-controller and datapath-intensive designs without external PLDs. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation backplanes, PCI bus interfaces, custom datapath accelerators, and legacy system emulation. The PQFP-240 footprint is well suited for through-hole-compatible surface-mount prototyping and rework on existing 10K designs. When designing with this device, ensure that the Quartus II or MAX+PLUS II toolchain matches the device code (EPF10K130E) and speed grade (-2). Designers transitioning to newer Cyclone or MAX families should treat FLEX 10KE as a mature, last-time-buy risk and verify long-term availability before new designs. This page synthesizes distributor stock, drop-in alternatives from the same Altera FLEX 10KE family, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet PDF.
EPF10K130EQI240-2N - 130K Gates FLEX-10KE FPGA, 240-PQFP | Intel / Altera
The Intel / Altera (formerly Altera) EPF10K130EQI240-2N is a member of the FLEX-10KE embedded programmable logic family, delivering approximately 130,000 usable gates in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package with 186 user I/Os. Built on a 0.22 µm CMOS SRAM-based architecture, the device integrates 6,656 logic elements (LEs), 65,536 bits of embedded array memory (EAB), and is targeted at System-on-a-Programmable-Chip (SOPC) designs requiring moderate logic density and high I/O count on a through-hole friendly package. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all defined by user-supplied bitstream data after manufacturing. FPGAs sit in the programmable logic hierarchy beneath full-custom ASICs and above discrete logic ICs, enabling rapid prototyping, late-stage design changes, and integration of memory plus logic in a single device. The FLEX-10KE family specifically pioneered the embedded array block (EAB) concept, allowing megafunctions such as RAM, ROM, and multiplier primitives to be implemented with the same silicon efficiency as dedicated memory. Key features of the EPF10K130EQI240-2N include 186 user I/O pins, 65,536 RAM bits distributed across embedded array blocks, 0.6 ns propagation delay typical of the family, and an industrial-grade operating temperature range (I suffix) of -40 °C to +85 °C. The device supports in-system programmability via an industry-standard passive serial (PS) configuration interface, multi-device configuration chains, and 3.3 V core operation with 5 V-tolerant I/O via Altera's MultiVolt interface. The 240-pin PQFP package supports legacy through-hole PCB designs and repair-friendly prototyping flows. The I-grade (industrial) operating range suits factory automation, instrumentation, and telecommunications line-card applications. MultiVolt I/O compatibility allows seamless interface with both 3.3 V and 5 V peripherals without external level shifters. Typical applications include telecommunications line cards and bridges, industrial motor control and PLC backplanes, glue logic replacement in legacy industrial controllers, prototyping platforms for ASIC migration, and test & measurement instrumentation front-ends. The high I/O count makes it suitable for parallel bus bridging and protocol conversion designs. When designing with this FPGA, ensure your configuration PROM (EPC2 or compatible) and JTAG chain are correctly wired. The 240-pin PQFP footprint requires plated through-holes and is not recommended for new high-speed designs above 50 MHz due to lead inductance; new designs should consider equivalent logic in BGA or QFP packages. Quartus II or MAX+PLUS II software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond what the legacy datasheet provides. Engineers evaluating the FLEX-10KE family should consult Altera documentation and migration guides to modern Cyclone or MAX families for new designs, while the EPF10K130EQI240-2N remains a serviceable drop-in for legacy maintenance.
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
The Intel EPF10K200EBC600-1 is a 2.5 V FLEX-10KE field-programmable gate array with 9,984 logic elements, 470 I/O, 1,248 LABs, and 98,304 bits of embedded memory, supplied in a 600-BGA package. The verified source identifies a 600-BGA device and a 470-I/O configuration. The MPN suffix indicates a particular speed and temperature ordering, but the complete timing grade definition is not present in the supplied web data and therefore requires manufacturer-document verification. A field-programmable gate array is a programmable logic device containing configurable logic blocks, routing resources, and programmable I/O that implement digital functions. In the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware parallelism and timing control without requiring a custom silicon mask. Embedded memory, logic, and I/O resources let a system combine control logic, interface adaptation, and datapath functions in one programmable device. The EPF10K200EBC600-1 provides 9,984 logic elements, 1,248 LABs, 470 I/O, and 98,304 bits of embedded memory according to the verified distributor listings. These resources support moderate-to-large digital designs, including glue logic, bus controllers, protocol bridges, and custom peripherals. The 600-BGA package is a high-density surface-mount package, but its ball map and package dimensions are not included in the supplied data. The FLEX-10KE architecture combines programmable logic with embedded array functions. The supplied description references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. These features make the part suitable for designs needing configurable datapaths and memory, although exact memory organization, operating-current limits, propagation-delay grades, and supported configuration modes are not available in the provided snippets. Typical applications include industrial control equipment, communications-interface hardware, test equipment, and legacy digital systems. Its 470 I/O make it useful where a design must connect many parallel or serialized external signals, while 9,984 logic elements provide capacity for glue logic, state machines, protocol handling, and custom arithmetic. The 98,304-bit embedded-memory figure also supports buffering and state-storage functions when the design is compiled for the FLEX-10KE architecture. A critical design step is to verify the exact package ball map, power sequencing, configuration interface, and timing specification before layout or production release. The verified data provides the 600-BGA package name and 470-I/O count, but not a ball-by-ball pinout. Designers should also confirm whether the target design requires the -1 speed grade, a different temperature grade, or a specific revision-compatible source. This page combines verified distributor specifications, package-level information, pricing references, and engineering-focused context to support component selection. Where the supplied data does not expose a parameter, the value is marked as needed rather than estimated.
EPF10K200EBC600-2 - FLEX-10KE FPGA 470 I/O BGA-600 | Intel
The Intel (formerly Altera) EPF10K200EBC600-2 is a FLEX-10KE family Field-Programmable Gate Array (FPGA) offering 200,000 typical gate equivalent logic density, 98304 bits of embedded array memory (EAB), and 470 user I/O pins in a 600-ball BGA package. The device integrates 1248 Logic Array Blocks (LABs) and 9984 Logic Elements (LEs) with a 0.4 ns propagation delay, supporting system-on-a-programmable-chip (SOPC) designs for high-density digital logic applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the middle ground between fixed-function ASICs and low-density PLDs/CPLDs, providing hundreds of thousands of logic gates, dedicated memory blocks, and high-speed I/O transceivers on a single reprogrammable silicon die. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below full-custom ASICs, enabling rapid prototyping, low-volume production, and in-system reconfiguration for communications, industrial, and embedded computing platforms. Key features include a 0.30 µm CMOS SRAM process technology, four enhanced embedded array blocks (EABs) per device, 4.6 Mbits total embedded memory, 5V tolerant I/O with multi-voltage support (2.5V/3.3V), and in-system programmability via IEEE 1149.1 JTAG and Altera EPC2/EPC16 configuration devices. The 600-ball BGA package at 45×45 mm body size with 1.27 mm pitch provides robust thermal dissipation and high-density board interconnect suitable for multi-layer backplane designs. The EPF10K200EBC600-2 uses an SRAM-based look-up table (LUT) architecture with FastTrack interconnect routing, providing deterministic timing closure and supporting designs up to 200K system gates with peripheral component interconnect and processor interface bridging. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, enabling flexible interfacing with microprocessors, memory subsystems, and backplane buses. Typical applications include telecommunications infrastructure, industrial control systems, embedded processor glue logic, high-speed data acquisition, and ASIC prototyping. The wide I/O count and embedded memory make it well-suited for parallel DSP pipelines, network protocol acceleration, and legacy bus-to-bus bridges in telecom switching equipment. When designing with this device, note that it requires a separate configuration memory (such as an EPC2 serial configuration device) at every power-up since the SRAM configuration is volatile. PCB layout must include a dedicated 45×45 mm BGA land pattern with 1.27 mm pitch and adequate thermal vias under the package. This page synthesizes distributor inventory, drop-in pin-compatible alternatives in the same FLEX-10KE family, and practical design notes beyond the manufacturer datasheet. Engineers can compare pricing across 2 active distributors and review the exact BGA-600 pinout for board layout.
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K200EBC600-3 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) built on a 0.22 micrometer SRAM-based process, offering approximately 200,000 system gates and 9,984 logic elements packaged in a 600-ball FineLine BGA (45 x 45 mm). The device integrates 470 user I/O pins, 1248 Logic Array Blocks (LABs), and embedded array blocks (EABs) for on-chip memory and specialized megafunctions such as FIFOs, multipliers, and DSP primitives. According to the Altera datasheet, this speed-grade -3 part is qualified for commercial operating conditions with a core voltage of 2.5 V (2.375 V to 2.625 V) and supports I/O standards including LVTTL, LVCMOS, PCI, and GTL+. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA), occupying the high-density, high-performance end of the spectrum. The FLEX 10KE family is part of the System-on-a-Programmable-Chip (SOPC) generation, embedding dedicated memory structures into the logic fabric to enable single-chip implementations of complex glue logic, bus interfaces, and signal-processing pipelines. Key differentiating features include 24 Kbits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock conditioning, multi-volt I/O supporting 1.8 V/2.5 V/3.3 V/5 V mixed-voltage interfaces, JTAG boundary-scan (IEEE 1149.1) for in-system programming, and Altera's proprietary continuous interconnect structure. The -3 speed grade delivers logic performance of approximately 166 MHz for registered I/O and is well-suited to medium-speed ASIC prototyping, custom peripheral interfacing, and telecom/datacom glue logic. Typical application domains include ASIC prototyping and emulation, custom bus bridges (PCI to local bus, VME to PCI), telecommunications backplane controllers, industrial machine controllers, and legacy industrial control systems where the FLEX 10KE generation remains a long-life, second-sourced platform. The 600-BGA package and standard surface-mount footprint simplify board-level integration and rework. When designing with this device, ensure the PCB pad pattern follows the 45 x 45 mm FineLine BGA land geometry and that decoupling capacitance (typically 0.1 microfarad ceramic plus 10 microfarad bulk per power rail) is placed directly beneath the package within the breakout via field. Use the Altera Quartus II design software (legacy MAX+PLUS II also supported) for place-and-route and bitstream generation. Designers migrating to newer Intel Cyclone or MAX 10 families should review the FLEX 10KE to Cyclone IV migration guide and account for differences in I/O standard support, EAB architecture, and PLL count. This page synthesizes distributor pricing, lifecycle status, drop-in same-package alternatives from the FLEX 10KE family, and practical board-level design notes not found in a single manufacturer datasheet.
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
The Intel (Altera) EPF10K200EBI600-2 is a high-density member of the FLEX 10KE embedded programmable logic family, integrating 200,000 system gates and 9,984 logic elements into a single 600-ball BGA package. It delivers 470 user I/O pins, 1248 Logic Array Blocks (LABs) and an internal RAM capacity of 98,304 bits, providing system-on-a-programmable-chip (SOPC) integration with embedded array blocks for on-chip memory and FIFO functions. A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing via a programmable interconnect fabric and configurable logic blocks; modern FPGAs combine programmable logic with embedded multipliers, transceivers, and ARM/SoC cores. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced embedded array blocks (EABs) that implement dual-port RAM, ROM, and FIFO operations in silicon, making the EPF10K200EBI600-2 suitable for both glue logic and larger datapath functions in communication and industrial designs. Key features include 200,000 system gates, 9,984 logic elements, 1248 LABs, 470 user I/O pins, 98,304 bits of embedded RAM, 0.4 ns propagation delay (per part number designation), 2.5 V core supply, and a commercial 0 C to 70 C operating temperature grade. The device is offered in a 45 x 45 mm, 1.27 mm pitch, 600-ball BGA package, the largest in the FLEX 10KE family, enabling maximum I/O density for high-pin-count ASIC and ASIC-replacement designs. The architecture pairs four Logic Elements (LEs) per LAB with EABs that can be configured as SRAM (2048 bits each), ROM, or multiplier blocks; routing resources are arranged in FastTrack Interconnect rows and columns. Designers use the Quartus (or legacy MAX+PLUS II) toolchain with HDL or schematic entry to map logic, run static timing analysis, and generate programming files (.sof/.pof) for byte-blaster configuration via JTAG. Typical applications include industrial automation controllers, telecommunications line cards and DSLAM backplanes, military and aerospace digital signal processing subsystems, and ASIC prototyping where high I/O count and embedded memory blocks are required. The 600-pin BGA also supports large pin-migration paths via SameFrame pin-out compatibility. When designing with this device, ensure the BGA land pattern follows JEDEC MS-034 with proper microvia stacking and a 6+ layer PCB for power-integrity. Decouple each VCCINT/VCCIO bank with 0.1 uF and 10 uF capacitors placed within 5 mm of the balls, and respect simultaneous-switching-output (SSO) limits for the 2.5 V I/O banks to maintain signal-integrity above 50 MHz. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EPF10K200EBI600-2 not found in the manufacturer datasheet alone.
EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel
The Intel EPF10K200EBI600-2N is a high-density FLEX 10KE embedded programmable logic device (PLD) from the FLEX 10KE family, integrating 200K typical gates, 9,984 logic elements (LEs), and 12 embedded array blocks (EABs) in a 600-ball BGA package. It operates from a 2.5V core supply (2.3V to 2.7V) and supports maximum user I/O counts of 470 pins with 6 dedicated inputs, all fabricated on a 0.22 µm CMOS process. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacturing. Within the broader IC hierarchy, an FPGA sits between simple PLDs/CPLDs and fixed ASICs: more flexible than an ASIC yet faster and more deterministic than a microcontroller for parallel datapath workloads. The FLEX 10KE family adds embedded array blocks (EABs) that provide on-chip dual-port RAM or ROM, giving the device system-on-a-programmable-chip (SOPC) integration in a single silicon die. Key features include a 200 MHz internal performance target, 0.4 ns to 0.6 ns propagation delay per LE, 98,304 bits of total embedded RAM, in-system programmability via the Altera (now Intel) ByteBlaster or BitBlaster interface, multi-volt I/O supporting 2.5V/3.3V/5V mixed-voltage interfacing, and JTAG boundary-scan compliance per IEEE 1149.1. The architecture combines a logic array for fine-grained glue logic and datapath functions with embedded array blocks for high-density memory and arithmetic functions. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/chain logic, while each EAB delivers up to 4 Kbits of RAM that can be cascaded for wider words or deeper FIFOs. The 0.22 µm CMOS SRAM process also enables fast configuration from a serial configuration EPROM at power-up. Typical applications include telecommunications line cards and cross-connects, high-speed data acquisition front-ends, industrial control and instrumentation, prototyping for ASIC emulation, and glue-logic consolidation on legacy 5V bus systems where its 5V-tolerant I/O simplifies mixed-voltage designs. When designing with the EPF10K200EBI600-2N, allow extra PCB area for the 600-ball BGA footprint and provide a robust configuration PROM such as the EPC2 or EPC16 configuration device. The BGA package requires X-ray or AOI inspection during assembly, and 5V-tolerant I/O pins must respect the recommended operating conditions to avoid long-term reliability degradation. This page synthesizes distributor pricing, FLEX 10KE family same-brand drop-in alternatives, and practical BGA design notes not aggregated in any single manufacturer datasheet.
EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel
The Intel (Altera) EPF10K200EFC672-1 is a high-density FLEX-10KE family Field Programmable Gate Array (FPGA) with 200,000 typical gates and 9,984 logic elements, packaged in a 672-ball FineLine BGA (27x27 mm). The device integrates 98,304 bits of embedded array memory and 470 user I/Os in a CMOS, SRAM-based architecture rated for the commercial 0C to 70C temperature range with 1.27 mm ball pitch. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user after manufacture. FPGAs sit at the apex of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement custom digital logic, glue logic, datapath acceleration, and full processor subsystems without the cost of an ASIC. The FLEX-10KE family extends the original FLEX-10K architecture with enhanced embedded array blocks (EABs), giving designers block-RAM-like memory in addition to distributed look-up-table logic. Key features of the EPF10K200EFC672-1 include 470 user I/Os, a 1,248 LAB (Logic Array Block) count, a propagation delay figure of approximately 0.4 ns per logic element stage, and True-LVDS/PCI/LVTTL multi-standard I/O support. The device is offered in the commercial speed grade -1 and is compatible with the Quartus II MAX+PLUS II legacy design toolchains via the Altera Legacy Device Support path. On-chip resources include 12 EABs totaling 98,304 RAM bits, suitable for FIFO, dual-port RAM, and ROM implementations. Typical applications for the EPF10K200EFC672-1 include telecommunications line cards, industrial control and instrumentation backplanes, legacy ASIC prototyping, glue-logic consolidation on PCBs, and PCI bus mastering peripherals. Designers still using this part typically do so for long-life industrial or avionics programs where re-qualification of newer FPGAs is not economical; Rochester Electronics is the authorized lifetime source for these legacy Altera devices. When designing with the EPF10K200EFC672-1, ensure a 1.27 mm-pitch BGA land pattern with adequate microvia stacking, four-layer PCB minimum for signal integrity, and a stable 2.5V/3.3V/5V core/I-O supply tree. Decoupling must follow the Altera FLEX-10KE reference design with bulk tantalum plus 0.1 uF ceramic at every supply pin.
EPF10K200EFC672-2 - FLEX 10KE FPGA 200K Gates 672-BGA | Intel
The Intel (formerly Altera) EPF10K200EFC672-2 is a member of the FLEX 10KE family of Embedded Programmable Logic Devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device. It is built on a 0.22 um CMOS process, delivers approximately 200,000 typical gates, contains 9,984 logic elements, 470 user I/Os, and 98,304 bits of embedded memory, all packaged in a 672-ball FineLine BGA. Speed grade -2 places this part in Altera's commercial performance tier for the FLEX 10KE family. A field programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet faster and more deterministic than microcontroller-based systems. The FLEX 10KE family combines a look-up-table (LUT)-based logic fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling block-level memory on-chip rather than relying solely on distributed flip-flops. Key features include 470 user I/Os, an embedded array architecture that supports up to 98,304 bits of on-chip memory, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, multi-volt I/O support, and CMOS process technology with low static power consumption. The 672-BGA package provides high-density interconnect for designs requiring extensive signal fan-out, with a 1.27 mm ball pitch and 45 x 45 mm body suitable for production surface-mount assembly. Typical applications include telecommunications infrastructure, industrial control, glue-logic consolidation in legacy systems, digital signal processing front-ends, and prototyping platforms where migration to a structured ASIC is anticipated. The FLEX 10KE is widely deployed in designs originally prototyped in the late 1990s and remains in service today for industrial and military customers requiring long-life-cycle components. When designing with this device, ensure that your synthesis toolchain supports the FLEX 10KE architecture (Altera/Intel Quartus legacy versions) and that PCB layout accommodates the 45 mm BGA footprint with adequate via-in-pad and microvia escape routing. Power supply sequencing and decoupling per the manufacturer datasheet are mandatory for reliable operation.
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
The Intel EPF10K200EFC672-3 is a member of the FLEX 10KE family of embedded programmable logic devices (PLDs), delivering 200,000 typical gates and 9,984 logic elements (LEs) in a 672-ball FineLine BGA package operating from a 2.5 V core supply. According to the manufacturer datasheet, the device integrates 470 user I/Os, 1248 logic array blocks (LABs), 98,304 bits of embedded array RAM, and four phase-locked loops (PLLs), supporting system-on-a-programmable-chip (SOPC) integration with on-chip memory and dedicated multiplier support. A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose logic fabric, interconnect, and I/O cells are configured by a user-supplied bitstream after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher density and performance than complex PLDs (CPLDs). The FLEX 10KE family was Altera's third-generation embedded-array SRAM-based family, fabricated on a 0.22 µm CMOS process and optimized for high I/O count and embedded memory density. Key differentiating features of the EPF10K200EFC672-3 include 9,984 LEs (logic elements), 98,304 RAM bits distributed across 12 embedded array blocks (EABs), 470 user I/Os with multi-voltage I/O support, four phase-locked loops (PLLs) for clock management, and in-system programmability through the IEEE 1532 / passive serial configuration interface. The 672-pin FineLine BGA package measures 27 mm x 27 mm with a 1.0 mm pitch, providing high interconnect density for high-pin-count designs. Each LE contains a 4-input lookup table (LUT), a programmable flipflop, and a dedicated carry chain. Architecturally, the device uses a SRAM-based configuration cell with embedded array blocks (EABs) of 2 Kbits each, supporting dual-port RAM, ROM, and FIFO implementations at the fabric level. The embedded multiplier blocks accelerate DSP functions without consuming general-purpose LE resources. PLLs support clock multiplication, division, phase shifting, and frequency synthesis with sub-nanosecond jitter, enabling high-speed interface implementation. Typical applications include telecommunications line cards, industrial automation controllers, ASIC prototyping platforms, network switches, and digital signal processing subsystems. The wide I/O count (470 pins) makes the device well suited for bus-intensive designs such as memory interfaces, parallel data acquisition, and backplane bridging. When designing with this device, ensure your configuration memory (typically EPC2 or EPC16 configuration device) is correctly sized for the 9,984 LE bitstream, and verify JTAG chain integrity before production programming. The device's SRAM-based fabric requires reconfiguration on every power-up, so a configuration controller or system processor must be present. This page synthesizes verified distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes not consolidated in the manufacturer datasheet. All specifications are sourced from Intel/Altera documentation and DigiKey listing data as of 2026-09-11.
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
The Intel (formerly Altera) EPF10K200EGC599-1 is a high-density member of the FLEX 10KE embedded programmable logic device family, delivering 200,000 typical gates in a 599-pin ceramic Pin Grid Array (CPGA) package. It integrates 9984 logic elements (LEs), 470 Embedded Array Blocks (EABs), and 98,304 bits of on-chip SRAM, providing system-on-a-programmable-chip (SOPC) integration for legacy commercial-grade digital designs. The device operates from a 2.5 V core supply with a 5.0 V tolerant I/O option. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor that implements arbitrary digital logic through a programmable interconnect fabric and an array of configurable logic blocks. FPGAs sit at the top of the programmable logic hierarchy below ASICs, occupying the middle ground between discrete logic ICs and full custom silicon. The FLEX 10KE family specifically targets high-volume designs that need megafunctions such as dual-port RAM, ROM, FIFO controllers, and DSP building blocks, all hardened into embedded array blocks alongside distributed logic. Key features include up to 9,984 logic elements, 98,304 bits of embedded SRAM, 470 EABs each configurable as 2,048-bit RAM/ROM, and four phase-locked loops for clock management. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is supported by the legacy Altera MAX+PLUS II and Quartus design tools. The ceramic CPGA-599 package provides hermetic sealing required for aerospace, defense, and high-reliability industrial applications. Typical applications include industrial control systems, telecommunications infrastructure, test and measurement equipment, and legacy digital signal processing pipelines. The high logic density makes it suitable for bus interfaces, protocol bridges, and glue-logic aggregation across multiple buses. When designing with this part, ensure the host PCB supports the 62.48 x 62.48 mm ceramic CPGA footprint with proper socket or solder attachment. Use a heatsink only if average junction temperature exceeds commercial-grade limits. Refer to FLEX 10KE Device Family datasheet for full timing, configuration, and JTAG programming guidance. This page synthesizes distributor pricing, drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the original datasheet.