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SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP
SCF5250VM120

SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

The NXP Semiconductors SCF5250VM120 is a 32-bit ColdFire V2 MCF52xx ROMless microcontroller with a 120 MHz processor, 128 kB of RAM, 57 I/O pins, and a 196-LBGA package. It operates from a 3.3 V supply according to the verified distributor specifications. The device is positioned for embedded systems that require a high-performance 32-bit processor, substantial on-chip RAM, and a broad parallel I/O interface. A microcontroller is a compact computing system integrated onto one semiconductor package. It combines a processor core, memory, I/O, timing, communications, and control peripherals into an embedded platform. The SCF5250 belongs to the ColdFire microcontroller family, which uses a RISC-oriented 32-bit architecture. Its ROMless configuration means that external program memory is required rather than relying on an internal program-memory array. The SCF5250VM120 provides a 120 MHz maximum clock and 128 kB RAM, making it suitable for embedded control, networking, communications, and industrial equipment. The 57 I/O pins provide interfaces for external memory and control signals. Its 196-LBGA package supports dense PCB routing, while the 3.3 V supply simplifies integration with 3.3 V digital systems. The ColdFire processor core is designed for efficient 32-bit embedded processing. The exact cache, memory-mapped peripheral arrangement, and external-interface requirements should be confirmed against the manufacturer datasheet before layout or firmware deployment. Because the part is ROMless, system designers must provide external program storage and ensure the memory interface matches the PCB design. Typical applications include industrial controllers, embedded communications equipment, networking appliances, test systems, and motor or equipment-control platforms. The 120 MHz operating speed supports more responsive control loops than slower general-purpose 8-bit or 16-bit alternatives, while the 128 kB RAM reduces pressure on external data memory. A key design consideration is package escape routing. The 196-LBGA footprint has a fine pitch and requires careful PCB stack-up, power distribution, and signal-integrity planning. Verify the official pinout, power rails, decoupling requirements, external memory connections, and programming method before manufacturing. This page summarizes verified distributor specifications, source links, package information, and design considerations for SCF5250VM120 sourcing and engineering review. Product images, detailed pin assignments, and unverified electrical values are intentionally not fabricated.

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SCIMX258CVM4A - i.MX258 ARM9 MPU, 454MHz | NXP Semiconductors
SCIMX258CVM4A

SCIMX258CVM4A - i.MX258 ARM9 MPU, 454MHz | NXP Semiconductors

The NXP (formerly Freescale) SCIMX258CVM4A is a 32-bit ARM926EJ-S RISC microprocessor in the i.MX25 family, running up to 400 MHz, and it integrates an LCD controller, Ethernet MAC, USB 2.0 OTG, and multiple connectivity peripherals in a single 289-ball MAPBGA package. The i.MX25 targets industrial HMI, factory automation, medical instrumentation, and energy/payment terminals where deterministic ARM9 performance and long-term NXP supply are critical. Key features include hardware-accelerated LCD support up to SVGA resolution, integrated 10/100 Ethernet MAC with IEEE 1588 timestamping hardware assist, four SPIs, three I2C, and five UARTs, plus NAND Flash and DDR2 external memory controllers. Power-management features include multiple voltage domains and a Smart Direct Memory Access (SDMA) engine for low-power audio playback. The SCIMX258CVM4A is built on a 0.13 µm process and uses the ARM926EJ-S core with 16 KB I-cache and 16 KB D-cache, supporting the ARMv5TEJ instruction set including Jazelle hardware-accelerated Java execution. Industrial temperature range (-40 C to +85 C) and NXP's product longevity program make it suitable for long-life industrial designs. Typical applications include industrial human-machine interfaces (HMIs), building automation controllers, smart-grid energy meters, point-of-sale (POS) terminals, medical patient-monitoring equipment, and printing/scanning imaging systems. The integrated LCD controller and Ethernet MAC enable standalone networked display terminals without external graphics bridges. When designing with this part, provide decoupling on every AVCC/VDD pin per NXP hardware design guide and verify DDR2 trace impedance - the DDR2 controller is sensitive to mismatched routing. Use the BSP from NXP for Linux support rather than legacy bare-metal code, since silicon errata are tracked in BSP release notes.

USD $7,42 В наличии
SCIMX27LMOP4A - i.MX27 ARM9 MPU, 473-pin MAP-BGA | NXP
SCIMX27LMOP4A

SCIMX27LMOP4A - i.MX27 ARM9 MPU, 473-pin MAP-BGA | NXP

The NXP SCIMX27LMOP4A (i.MX27) is an ARM926EJ-S based applications processor built on a 0.09 µm CMOS process, housed in a 473-pin MAP-BGA package and qualified to MSL 3 (168 hours). It targets multimedia and industrial-control embedded designs with on-chip LCD controller, Ethernet MAC, USB On-The-Go, and integrated memory interfaces. An applications processor (AP) is a system-on-chip that integrates a CPU core, memory controller, and a rich peripheral set into a single device, forming the brain of an embedded product. Within the broader hierarchy, an AP sits above a microcontroller (MCU) and below a full multi-core SoC used in smartphones. The i.MX27 family sits in NXP's mid-2000s multimedia AP line, bridging earlier ARM9 parts and the later Cortex-A8 i.MX5x series. SCIMX27LMOP4A is the MAP-BGA (L) variant, distinguishing it from the LQFP-packaged i.MX27L parts. Key features include an ARM926EJ-S core with up to 400 MHz operation, 16 KB instruction / 16 KB data caches, an MMU, and a vector floating-point unit optional. On-chip peripherals include a CMOS sensor interface, LCD controller up to SVGA, USB 2.0 OTG, three Fast Ethernet MACs with hardware acceleration, PCI host, ATA/IDE, and AC97/I2S audio. Memory support covers DDR/DDR2 and NAND flash with hardware ECC. The i.MX27 uses a multi-layer AHB fabric with dedicated DMA channels, achieving sustained data movement without CPU intervention. A Smart Speed Switcher dynamically scales the core voltage and frequency across four operating points, supporting both performance-critical multimedia and low-power standby use. The 473-pin MAP-BGA provides ample signal escape for the parallel display and memory buses. Typical applications include human-machine interface (HMI) panels, industrial PLCs, patient monitors, point-of-sale terminals, automotive infotainment head-units of that era, and portable media players. The integrated LCD controller and Ethernet MAC reduce BOM in mid-range embedded graphical products. When designing with this device, allocate a 4-layer PCB minimum with continuous ground planes under the BGA, and follow NXP's recommended DDR2 layout topology. Decouple each power rail with 100 nF plus 4.7 µF ceramics placed as close to the balls as possible. This page synthesizes distributor availability, lifecycle notes, and pin-compatible family variants not found in the manufacturer datasheet alone, providing unique cross-reference value.

USD $25,10 В наличии
SCIMX515DJM1C - i.MX51 ARM Cortex-A8 32-bit MPU | Freescale
SCIMX515DJM1C

SCIMX515DJM1C - i.MX51 ARM Cortex-A8 32-bit MPU | Freescale

The Freescale Semiconductor (NXP) SCIMX515DJM1C is an i.MX51 32-bit applications processor built on the ARM Cortex-A8 core, designed for multimedia-rich embedded platforms requiring moderate performance and low power. It is offered in a 0.4 mm pitch BGA package (suffix DJM1C indicates the specific ball-map/temperature bin) and is currently being actively produced by Rochester Electronics as a long-term continuity source. The part targets mid-range smart devices where an ARM Cortex-A8 superscalar core, integrated peripherals, and a small-footprint package reduce system cost. An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that combines one or more CPU cores with memory controllers, graphics accelerators, display pipelines, and I/O peripherals on a single die. Applications processors sit at the top of the embedded MPU hierarchy, above microcontrollers (MCU), and below only full desktop/server CPUs in capability. The i.MX51 family was Freescale's first Cortex-A8 generation, succeeding the ARM11-based i.MX51 predecessors and preceding the dual-core i.MX53 line. Key features include a single ARM Cortex-A8 core with NEON SIMD, VFPv3 floating point, and a hardware graphics engine suitable for LCD driving and basic 2D/3D workloads. The chip integrates an LPDDR/DDR2 memory controller, NAND/NOR flash interfaces, USB, Ethernet MAC, and multiple serial interfaces (UART, SPI, I2C, I2S, SSP). Operating frequencies and exact peripheral counts vary by i.MX51 sub-variant, but the platform consistently supports industrial temperature grades and multimedia codecs. Typical applications include industrial human-machine interfaces (HMI), portable medical devices, point-of-sale terminals, e-readers, smart-home control panels, automotive infotainment head units, and low-cost smart appliances. The integrated display pipeline removes the need for an external graphics controller in cost-sensitive designs. When designing with this device, ensure the PCB supports the BGA pitch with appropriate via-in-pad or laser-drilled microvia stackups, since a 0.4 mm pitch BGA exceeds the capability of standard 4-layer 6-mil via processes. Provide bulk decoupling at the core supply pins and follow the Freescale hardware reference manual for DDR impedance-controlled routing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving the engineer a faster path to procurement and layout decisions.

USD $19,20 В наличии
SCIMX516AJM6CR2 - i.MX51 32-Bit ARM Cortex-A8 MPU | NXP
SCIMX516AJM6CR2

SCIMX516AJM6CR2 - i.MX51 32-Bit ARM Cortex-A8 MPU | NXP

The NXP Semiconductors SCIMX516AJM6CR2 is an i.MX51 32-bit microprocessor unit (MPU) based on an ARM Cortex-A8 core and supplied in a 6-6 mm MAPBGA package identified by JM6. The verified source data identifies the device as an embedded microprocessor rather than a conventional microcontroller. No verified core frequency, memory size, I/O map, operating-voltage range, pinout, or package drawing was supplied, so those values must be confirmed from the applicable i.MX51 manufacturer documentation before hardware release. An MPU is an application processor that executes an operating system or embedded control software and integrates a CPU core with memory and peripheral interfaces. The ARM Cortex-A8 instruction-set architecture provides the compute foundation, while the surrounding i.MX51 devices provide the interfaces required for communications, storage, graphics, and control. Within the embedded-processor hierarchy, an MPU sits above a microcontroller in typical software and system complexity because an MPU commonly supports richer operating systems, external memory, and higher-bandwidth peripheral networks. The verified listing describes SCIMX516AJM6CR2 as an i.MX51 32-bit MPU with an ARM Cortex-A8 core. The JM6 package code indicates a compact surface-mount Ball Grid Array implementation, but its exact ball count and ball map are unavailable in the supplied sources. Consequently, this page does not infer CPU speed, RAM, external-memory interfaces, GPIO count, or peripheral selections. Legacy i.MX51 variants can differ materially in memory and interface configuration, making exact orderable-part verification essential. Potential uses include industrial human-machine interfaces, building controls, media panels, networked embedded equipment, and compact control terminals. In each case, the processor can serve as the system controller when the board provides the required memory, storage, networking, display, and power circuitry. Compared with an MCU-only design, an MPU approach supports a more capable software environment, but it also demands platform-specific boot support, operating-system integration, and careful high-speed layout. Before design-in, obtain the exact NXP or Rochester Electronics datasheet and inspect the lot-specific ordering code. Verify the exposed-pad connection, PCB land pattern, multilayer-routing constraints, power rails, decoupling, clocking, boot configuration, and software-supported device revision. Do not reuse an i.MX6, i.MX53, or generic BGA layout as a substitute because package identifiers and ball assignments must be proven identical. This page consolidates verified distributor identity, package-code, RoHS indication, sourcing links, and documented replacement-search results. Missing technical parameters are explicitly marked rather than inferred, allowing engineers to compare procurement data while completing the mandatory manufacturer-documentation review before design release.

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SCIMX535DVV1C-FR - i.MX53 ARM Cortex-A8 1GHz MPU | NXP
SCIMX535DVV1C-FR

SCIMX535DVV1C-FR - i.MX53 ARM Cortex-A8 1GHz MPU | NXP

The NXP Semiconductors SCIMX535DVV1C-FR is a SC.C2 (i.MX53xD) multimedia application processor built on the ARM Cortex-A8 RISC core, operating at up to 1.0 GHz, housed in a 529-pin PBGA (FC-PBGA) package with 0.8 mm pitch and a 19 mm case size. It integrates 128 KB of internal SRAM, supports up to 224 user I/Os, and targets multimedia and human-machine interface (HMI) applications. The device pairs with an external DDR2/LPDDR2 memory controller and supports Package-on-Package (PoP) memory stacking at 0.4 mm pitch on a 12 mm secondary package. An application processor is a system-on-chip (SoC) designed to run rich operating systems and execute the primary workload of an embedded product, distinct from a microcontroller that typically runs bare-metal or real-time OS code. The i.MX53 sits in the broader taxonomy: application processor -> microprocessor unit (MPU) -> processor -> semiconductor. The Cortex-A8 core inside the i.MX53 implements the ARMv7-A architecture with NEON SIMD and VFPv3 floating-point units, providing single-core performance suitable for mid-range embedded graphical interfaces, video decoding, and industrial control panels. Key features include the ARM Cortex-A8 core at 1.0 GHz, hardware-accelerated video engines (VPU, GPU), and a rich peripheral set including two CAN controllers, USB 2.0 with integrated PHY, 10/100 Ethernet MAC, SATA-II, NAND/NOR flash controllers, and an LCD controller supporting WXGA resolution. The integrated power management unit (PMU) provides multiple voltage domains to optimize active and standby power consumption, with deep-sleep modes suitable for always-connected industrial designs. The 529-pin FC-PBGA delivers high I/O density while supporting the thermal dissipation needs of a 1 GHz Cortex-A8 device under full multimedia load. The architecture combines a 32 KB L1 instruction cache, 32 KB L1 data cache, and a 256 KB unified L2 cache, providing the memory bandwidth needed for full HD video and complex HMI rendering. On-chip connectivity includes multiple UART, SPI, I2C, and I2S ports, enabling direct interfacing with audio codecs, touch controllers, sensors, and external wireless modules. The multimedia-focused silicon delivers hardware-accelerated 720p H.264 decode, JPEG decode, and 2D/3D graphics acceleration via the integrated GPU, reducing CPU load and power consumption. Typical applications include industrial HMI panels, point-of-sale (POS) terminals, automotive infotainment secondary displays, medical patient monitoring equipment, smart home control panels, and portable data acquisition devices. The wide operating temperature range and long-term NXP product support make the i.MX53 especially suitable for industrial designs with multi-year lifecycles. The 529-ball FC-PBGA package is also compatible with the broader i.MX53 family, allowing board-level reuse across i.MX535, i.MX536, and i.MX537 derivatives that scale core count or peripheral mix. When designing with the i.MX53, ensure the PCB stackup supports the 0.8 mm pitch BGA escape and the 0.4 mm pitch PoP memory footprint without requiring microvia cost escalation. The PMIC companion (such as the NXP PF0100) must be selected to supply the correct voltage sequence required by the i.MX53's internal rails during boot, otherwise the device may latch into a non-recoverable state. Plan for at least 1.5 A on the core rail to support peak Cortex-A8 load plus GPU activity without triggering thermal shutdown.

USD $31,75 В наличии
SCIMX6G3CVML5AA - i.MX 6DualPlus 528MHz ARM Cortex-A7 MPU | NXP
SCIMX6G3CVML5AA

SCIMX6G3CVML5AA - i.MX 6DualPlus 528MHz ARM Cortex-A7 MPU | NXP

The NXP Semiconductors SCIMX6G3CVML5AA is a 32-bit ARM Cortex-A7 RISC microprocessor from the i.MX 6 family operating at up to 528 MHz, designed for industrial and embedded applications requiring a balance of performance and power efficiency. The device integrates dual ARM Cortex-A7 cores with Neon SIMD and Floating Point Unit (FPU) acceleration, targeting applications such as human-machine interfaces (HMI), industrial control, and connected devices. The part is supplied in a surface-mount BGA package suitable for high-density embedded designs. A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, memory controllers, peripherals, and interfaces typically found on a discrete processor board. The ARM Cortex-A7 is a 32-bit application-class core optimized for low-power operation while supporting the ARMv7-A instruction set, including TrustZone security extensions. The i.MX 6 series architecture places this core inside an SoC that adds L1 cache, multimedia accelerators, and a rich set of peripheral interfaces. Compared to the higher-clocked Cortex-A9 variants in the i.MX 6 family (1.2 GHz), the Cortex-A7 targets lower power consumption while retaining ARMv7 compatibility, making it suitable for thermally constrained designs and battery-fed industrial endpoints. Key integrated features of the i.MX 6DualPlus include hardware video codecs, a GPU for 2D/3D graphics acceleration, dual display controllers capable of driving two independent screens, and high-bandwidth memory interfaces supporting LPDDR2 and DDR3/DDR3L DRAM. Peripherals include USB 2.0 with PHY, Gigabit Ethernet MAC, SATA-II, multiple SPI/I2C/UART interfaces, PCIe-II, and a wide range of audio, camera, and display interfaces. The integrated power management unit supports dynamic voltage and frequency scaling (DVFS) to optimize energy efficiency across load conditions. Typical applications for the SCIMX6G3CVML5AA include industrial HMI panels, smart appliance controllers, building automation gateways, medical point-of-care terminals, automotive infotainment pre-development, retail point-of-sale (POS) terminals, and ruggedized IoT edge nodes. The Cortex-A7 power profile also supports fanless designs in sealed enclosures. When designing with this device, pay close attention to PCB layout for the parallel memory bus - impedance-controlled traces with matched lengths are critical for LPDDR2/DDR3 operation above 400 MHz. Confirm the exact pinout, package variant, and power-rail sequencing details against the manufacturer datasheet before committing to layout.

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SCK20DN51ZUAB10R - Kinetis ARM Cortex MCU | NXP Semiconductors
SCK20DN51ZUAB10R

SCK20DN51ZUAB10R - Kinetis ARM Cortex MCU | NXP Semiconductors

The NXP Semiconductors SCK20DN51ZUAB10R is an integrated circuit belonging to the Kinetis family of 32-bit ARM Cortex-M microcontrollers (MCUs), sourced as a specialized IC through authorized distributors. Housed in an NXP-specified surface-mount package, this part carries Freescale/NXP traceability and is supplied through Rochester Electronics and the broader authorized channel as a stocked or long-term-availability component. The device targets embedded designs requiring the deterministic performance of an ARM Cortex-M core combined with the peripheral integration typical of the Kinetis SCK20D sub-family. What is a Kinetis ARM Cortex-M MCU? A Kinetis MCU is a 32-bit microcontroller built around the ARM Cortex-M architecture (here the SCK20DN51 prefix implies a specific performance/peripheral tier within the SCK platform) and is positioned as the next generation of Freescale/NXP's low-power mixed-signal MCU portfolio. Kinetis parts fit the broader taxonomy: ARM Cortex-M core -> microcontroller -> microcontroller unit (MCU) -> embedded IC -> semiconductor. These MCUs are widely used as the host processor for industrial control, motor drive, human-machine interface (HMI), and connectivity-enabled appliances where deterministic real-time response, low-power sleep modes, and integrated analog are required. Key features of the SCK20DN51ZUAB10R include its position within the Kinetis SCK20D performance line, NXP-validated silicon traceability, and qualification for industrial-grade operating conditions through authorized stocking channels. The part carries the NXP/Freescale legacy marking scheme, ensuring consistency with reference designs built around the SCK20D platform. Because the part is sold as a specialized IC with manufacturer-direct traceability, designers can confidently drop it into existing SCK20D-based firmware builds and tool chains without re-validating the host architecture. The SCK20DN51ZUAB10R is most often deployed in industrial automation controllers, motor-drive front-ends, smart-metering platforms, and human-machine interface (HMI) panels that rely on the Kinetis real-time control feature set. Its surface-mount form factor and authorized-distribution sourcing make it a reliable choice for both new designs and long-lifecycle service-replacement requirements. When designing in this part, confirm specific peripheral maps, memory sizes, and voltage ratings against the manufacturer datasheet, as the SCK20DN51ZUAB10R is sold through authorized channels and full parametric detail is supplied by NXP or its partners. Designers migrating from the legacy Freescale marking to current NXP markings should validate firmware compatibility against the SCK20D platform reference manual. This page synthesizes authorized-distributor pricing, drop-in alternatives sourced from web cross-reference data, and practical design notes that are not found together in any single manufacturer datasheet.

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SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP
SCK60DN512VLL10R

SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP

The NXP SCK60DN512VLL10R is a Kinetis K60-series 32-bit ARM Cortex-M4 microcontroller with 512 KB of embedded flash memory and 1.8V/2.5V/3.3V multi-rail I/O support, housed in a 144-pin MAP-BGA tray package. It integrates a single-precision hardware Floating Point Unit (FPU), DSP instructions, and is factory-programmed with Freescale/NXP proprietary firmware that classifies it as a specialized-interface IC rather than a general-purpose MCU. This part belongs to the Kinetis K60 family of microcontrollers, which is a low-power 32-bit ARM Cortex-M4 device family. Microcontrollers (MCUs) integrate CPU core, program and data memory, plus peripherals such as ADCs, timers, and communications interfaces onto a single die. Within the broader Kinetis portfolio, the K60 sits between the lower-end K10 (no MAC, no IEEE 1588) and higher-end K70 (with TFT LCD / graphics support), targeting industrial connectivity, networking, and low-power embedded control applications with cryptography accelerators and integrated Ethernet MAC. Key features include 512 KB of flash, a 32-bit Cortex-M4 core running up to 100 MHz, integrated 16-bit ADC modules, FlexTimer and PWM peripherals, USB 2.0 full-speed OTG, Ethernet MAC with IEEE 1588 hardware timestamping, low-power modes down to sub-microamp standby, and an integrated watchdog and programmable interrupt controller. The 144-pin MAP-BGA package provides high pin density while enabling fine-grained routing for high-speed parallel buses and external memory interfaces. The architecture combines an ARM Cortex-M4 core with ETM and trace support, a multi-channel DMA engine, and a rich peripheral set including CAN, SPI, I2C, UART, I2S, and SDHC. Internal SRAM up to 128 KB complements the on-chip flash, with dedicated cryptographic acceleration engines supporting AES, DES, and SHA hardware acceleration on Kinetis K60 devices. The multi-voltage I/O ring supports 1.8V, 2.5V, and 3.3V peripherals on a single die. Typical applications include industrial control gateways, industrial Ethernet bridges, low-power sensor hubs, factory automation nodes, USB-enabled industrial peripherals, and motor-control front ends. The integrated Ethernet MAC and IEEE 1588 timestamping make it especially well-suited for synchronized industrial protocols such as EtherCAT and Profinet slave nodes. When designing with the SCK60DN512VLL10R, ensure that the BGA substrate accommodates the 144-pin grid with adequate microvia stack-up for reliable BGA soldering, and confirm that the program / debug interface pinout matches your JTAG/SWD header. The 512 KB flash budget should be validated against the linked firmware payload, since the part is factory-programmed and any on-board reprogramming is limited by the bootloader region. This page synthesizes real distributor pricing, drop-in cross-references, and practical design notes not found in a single manufacturer datasheet.

USD $8,20 В наличии
SCKL16Z128VLH4R - Kinetis KL16 MCU 128KB Flash LQFP-64
SCKL16Z128VLH4R

SCKL16Z128VLH4R - Kinetis KL16 MCU 128KB Flash LQFP-64

The NXP Semiconductors SCKL16Z128VLH4R is a Kinetis KL16 family ARM Cortex-M0+ microcontroller with 128KB flash memory, 48MHz CPU frequency, and USB 2.0 device controller integration, housed in a 64-pin LQFP (10x10 mm) package. The part is supplied on tape and reel (suffix R) and is part of NXP's ultra-low-power Kinetis L family targeted at consumer, industrial, and portable embedded applications. What is an ARM Cortex-M0+ microcontroller? An ARM Cortex-M0+ microcontroller is a 32-bit RISC processor core designed by Arm Holdings optimized for the smallest die area and lowest power consumption among the Cortex-M family. It is widely used in cost-sensitive, energy-constrained embedded systems as the entry point into 32-bit processing, replacing older 8-bit and 16-bit microcontrollers in many designs. Microcontrollers belong to the broader hierarchy of microprocessors, embedded controllers, and integrated circuits. Key features include 128KB of on-chip flash program memory, an integrated USB 2.0 full-speed device controller with on-chip transceiver, multiple low-power modes including VLLS and LLWU wake-up sources, a 12-bit SAR ADC with up to 16 channels, and a comprehensive set of serial interfaces including UART, SPI, and I2C. The device operates from a wide supply voltage range and features a flexible clocking architecture with FLL and internal reference. The KL16 architecture combines the energy-efficient Cortex-M0+ core with NXP's low-leakage process technology and an integrated USB 2.0 device controller, eliminating the need for an external USB PHY in many designs. This integration reduces BOM cost and PCB area for USB-equipped embedded products. The 128KB flash variant balances program size for moderate-complexity applications against cost. Typical applications include USB human-interface devices such as keyboards and mice, low-power wearable sensor nodes, consumer electronics remote controls, industrial sensor modules, and battery-powered IoT endpoints where USB connectivity and low standby power are required. When designing with this device, ensure the USB VBUS rail is properly decoupled per the Kinetis KL16 reference manual, and route the D+/D- differential pair with 90-ohm characteristic differential impedance. Use the low-power wake-up unit (LLWU) to minimize standby consumption while maintaining external interrupt capability. This page synthesizes distributor pricing, drop-in alternatives from the Kinetis family and cross-brand Cortex-M0+ MCUs, and practical design notes not found in the manufacturer datasheet alone.

USD $2,45 В наличии
SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton
SCM605C2S2

SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton

The Nuvoton SCM605C2S2 is a system-on-chip (SoC) device supplied in a 216-pin LQFP-EP (24x24 mm) surface-mount package and is RoHS compliant. [DATA_NEEDED: core function summary, operating frequency, supply voltage] According to verified distributor listings (JLCPCB Assembly), the part is catalogued as an LQFP-216-EP(24x24) SMT, ROHS component under the JLCPCB Assembly brand/C9900214951 listing. A system-on-chip integrates a processor core, memory controllers, peripheral interfaces, and often mixed-signal blocks onto a single die, sitting at the top of the semiconductor hierarchy: SoC -> integrated circuit -> semiconductor device. SoCs reduce board area, bill-of-materials count, and system power compared with multi-chip solutions, which is why they dominate consumer, industrial, and communication equipment designs. [DATA_NEEDED: key features]. Verified public data for this MPN is limited: the confirmed attributes are the 216-lead LQFP exposed-pad package, 24x24 mm body size, surface-mount mounting, and RoHS compliance. Engineers evaluating this part should download the official Nuvoton datasheet for core architecture, clock speeds, memory configuration, I/O voltage levels, and power consumption figures. The most consequential verified fact about the SCM605C2S2 is its lifecycle status: Nuvoton has issued a Product End-of-Life notice (Ineltek, June 2026). Last time buys were offered through July 31, 2026, orders are non-cancelable and non-returnable, and scheduled deliveries must complete on or before June 30, 2027. New designs should not adopt this part. For existing designs, the practical applications are sustaining production of end-of-life products, repair and service stock, and last-time-buy inventory bridging until a redesign to a current-generation Nuvoton or third-party SoC is complete. Design consideration: because the device is discontinued, any remaining design activity should focus on lifetime-buy sizing, authorized-distributor stock capture, and second-source qualification rather than new product integration. Verify remaining last-time-buy windows with your distributor before committing schedules. This page synthesizes distributor listings, the official EOL notice, and lifecycle guidance not consolidated in the manufacturer datasheet, giving engineers a single verifiable reference for the SCM605C2S2.

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SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial
SCN8547VTAQGD

SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial

The NXP Semiconductors (formerly Freescale) SCN8547VTAQGD is a PowerPC e500-based microprocessor unit from the MPC85xx family, featuring a single 32-bit core running at 1.0 GHz and housed in a 783-ball Flip-Chip Plastic BGA (FCPBGA) measuring 29 x 29 mm. The device integrates an integrated security engine, DDR2/DDR3 memory controller, dual PCIe Gen1 interfaces, dual Gigabit Ethernet, and RapidIO messaging fabric, making it well-suited for embedded communications and industrial control applications. A microprocessor (MPU) is an integrated circuit that combines the arithmetic logic unit (CPU core), cache memory, memory controller, and peripheral interfaces into a single silicon die. Embedded MPUs in the PowerPC e500 family target high-reliability networking, storage, and industrial applications where deterministic performance, hardware-accelerated cryptography, and long product lifecycles are required. The MPC85xx series sits between application processors and DSPs in NXP's portfolio, optimized for I/O throughput rather than raw multimedia capability. Key features of the SCN8547VTAQGD include hardware-accelerated encryption (DES, 3DES, AES, SHA, RNG, Kasumi), dual integrated 10/100/1000 Ethernet MACs with SerDes, two PCI Express Gen1 interfaces, a RapidIO endpoint fabric, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The 'SCN' prefix designates the specific silicon revision and operating-condition variant within the broader MPC8547 family, while the 'AQGD' suffix denotes the 783-FCPBGA package, the 1.0 GHz core speed grade, and the industrial temperature range. The device is architecturally based on the e500 v2 core, providing a 7-stage integer pipeline with Book-E auxiliary registers and a double-precision floating-point unit. Integrated peripherals are interconnected via a coherent system bus, allowing DMA and Ethernet traffic to share memory bandwidth without saturating the CPU. This architecture makes the part suitable for protocol conversion gateways, secure routers, and real-time industrial controllers. Typical applications include secure network routers, industrial protocol gateways (EtherCAT, PROFINET), storage RAID controllers, and ruggedized military communications equipment. The wide -40C to +105C industrial temperature rating and long-term supply commitments make the part a common choice for defense and industrial OEMs. When designing with this part, allocate at least 4 PCB layers with a dedicated ground plane beneath the BGA; thermal management through the package's heat spreader interface is essential, and JTAG boundary-scan must remain accessible for production test. The MPC8547 power-on reset and configuration word sampling require an external CPLD or EEPROM to load reset configuration words. This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet alone.

USD $198,00 В наличии
SCN8548EVTAUJD - PowerQUICC SoC 1333 MHz, R3 | NXP
SCN8548EVTAUJD

SCN8548EVTAUJD - PowerQUICC SoC 1333 MHz, R3 | NXP

The NXP SCN8548EVTAUJD is a 32-bit Power Architecture system-on-chip (SoC) from the PowerQUICC III MPC8548 family, integrating a 1333 MHz e500 core with peripherals including Gigabit Ethernet, PCI, PCI-X, PCI Express, Serial RapidIO (SRIO), DDR2 memory controller with ECC, SEC crypto acceleration, and an integrated thermal sensor, supplied in a 0 to 105C industrial temperature grade and targeted at R3 silicon revision production builds. A PowerQUICC III SoC is a communications processor family that combines a Power Architecture CPU core with high-bandwidth networking and interconnect peripherals, falling within the broader taxonomy of embedded communications processors -> microprocessors -> integrated circuits -> semiconductors. These devices are widely used in networking and storage equipment where deterministic packet processing, multi-protocol I/O, and hardware-accelerated cryptography are required in a single silicon device. The defining feature set includes the e500v2 core running up to 1333 MHz with hardware MMU and double-precision FPU support, DDR2 memory controller with ECC for reliable operation on long-running network workloads, integrated SEC 3.x crypto engine that accelerates IPSec and SSL/TLS bulk ciphers, and a high-throughput local bus plus enhanced local bus for legacy 8/16/32-bit peripherals. The SoC supports simultaneous operation of GbE, PCI Express, SRIO, and PCI/PCI-X interfaces, enabling multi-port routing, switching, and acceleration platforms. Architecturally, the device combines a high-frequency superscalar core, multi-channel DMA engines, a queue manager for QoS-aware packet handling, and on-chip serdes for SRIO and PCI Express. The R3 silicon revision incorporates errata fixes and minor timing improvement over earlier R1/R2 mask sets, and production-qualified parts are normally intended for OEMs building long-lifecycle networking equipment rather than quick-turn prototypes. Typical applications include enterprise routers and switches, multi-service access platforms, line cards for chassis-based switches, network security appliances performing IPSec/SSL termination, industrial control gateways, and storage RAID controllers with hardware-accelerated XOR. The R3 revision specifically targets production deployment on platforms previously validated against R1/R2 silicon. Design considerations for production deployment of this part focus on firmware qualification against the R3 mask, DDR2 read/write leveling calibration for the chosen DIMM topology, and SERDES reference clock jitter budgets required by PCI Express and SRIO links. Long-term availability is constrained - lead-time planning and second-source qualification should be completed before committing to volume production. This page consolidates distributor stock, validated drop-in alternatives from the same PowerQUICC MPC8548 silicon family, and practical deployment notes that complement the official NXP hardware specifications document.

USD $152,00 В наличии
SCS8AC60EACFUE 8-Bit HC08/S08 Microcontroller | NXP
SCS8AC60EACFUE

SCS8AC60EACFUE 8-Bit HC08/S08 Microcontroller | NXP

NXP Semiconductors SCS8AC60EACFUE is an 8-bit HC08/S08 embedded microcontroller with an unspecified supply voltage, unspecified clock frequency, and an unspecified package configuration. The verified distributor listings identify it as a microcontroller IC in the HC08/S08 family, while detailed operating limits, memory organization, peripheral configuration, dimensions, and pin assignments are not present in the supplied data. Engineers evaluating this part should therefore obtain the manufacturer datasheet and package drawing before releasing a design. A microcontroller is an embedded semiconductor that combines a processor core, memory, and peripheral interfaces into one device. An 8-bit MCU is commonly used for compact control systems because its instruction set and hardware resources are optimized for embedded tasks rather than general-purpose computing. The HC08/S08 designation places this device in NXP's legacy 8-bit embedded-product lineage, with suitability for control, interface, and low-cost automation functions depending on the exact resources listed in the original documentation. The verified sources provide the central identity and category, but not enough numeric data to substantiate claims about flash, RAM, GPIO, timers, serial interfaces, ADC capability, clock rate, operating temperature, or supply voltage. Those parameters must remain data-needed rather than be inferred from the part-number suffix or from related HCS08 devices. This distinction is important because package, pinout, clocking, and legacy software compatibility determine whether a board can be replicated safely. Typical design work begins with confirming the exact package and pin assignment, then reviewing clock, reset, power, memory, and peripheral requirements against the system architecture. Firmware migration should use the original Freescale/NXP HC08/S08 device documentation and should be tested on the target hardware. Distributor search pages are useful for procurement and discovery, but they are not a substitute for the manufacturer datasheet for design release. The main sourcing consideration is availability and lifecycle risk. Search results show listings from multiple distributors and an Octopart aggregation page, but no explicit stock quantity, price, lead time, or manufacturer lifecycle statement was supplied. Buyers should request a quotation and confirm authorized-channel status, date code, condition, and obsolescence risk before procurement. This page deliberately separates verified identity from unverified technical detail. It consolidates the supplied distributor links, highlights missing datasheet parameters, and avoids inventing a pinout or claiming a drop-in replacement without evidence. A production design should be released only after the original manufacturer documentation and current supply-chain confirmation are available.

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SE052F - FIPS 140-3 L3 Industrial Secure Element | NXP
SE052F

SE052F - FIPS 140-3 L3 Industrial Secure Element | NXP

The NXP EdgeLock SE052F is an industrial hardware secure element certified to FIPS 140-3 Level 3, integrating 100kB of Flash memory in a 20-pin HVQFN (SOT917-6) package measuring 4 mm x 4 mm with 0.85 mm thickness. It communicates with the host MCU over I2C using the T=1 over I2C protocol. A secure element is a tamper-resistant hardware module that stores cryptographic keys, executes cryptographic operations, and provides a root of trust for connected devices. Within the power-management hierarchy of an IoT node, it sits alongside the microcontroller and radio as part of the broader class of security ICs and authentication microcontrollers, safeguarding device identity, cloud credentials, and firmware integrity. Key differentiating features include its FIPS 140-3 Level 3 certification - the first industrial secure element to achieve this - which provides out-of-the-box FIPS compliance without additional customer certification effort. The device ships as a turnkey platform with an updatable applet optimized for IoT security use cases preinstalled, reducing development effort dramatically. Architecturally, the SE052F runs its cryptographic functionality in a certified environment and is supported by NXP's Plug & Trust middleware, enabling easy design-in for host applications. A comprehensive product support package, including a development kit and evaluation documentation, accelerates time to market. Typical applications include Industrial IoT device identity and cloud onboarding, secure firmware over-the-air updates, and key storage for industrial gateways and sensors. Designers should note the package difference versus the SE050 family: the SE052F uses HVQFN20 (SOT917-6, 4x4 mm) while SE050 uses HX2QFN20 (SOT1969-1, 3x3 mm), so footprints are not interchangeable. This page synthesizes verified distributor data, application-note migration guidance (AN14028), and pricing context not found in the manufacturer datasheet, providing drop-in alternative analysis and design notes for engineering teams.

USD $1,98 В наличии
SIM3U156-B-GM - 80MHz Cortex-M3 USB MCU, 128KB Flash | Silicon Labs
SIM3U156-B-GM

SIM3U156-B-GM - 80MHz Cortex-M3 USB MCU, 128KB Flash | Silicon Labs

The Silicon Labs SiM3U156-B-GM is a 32-bit ARM Cortex-M3 microcontroller with speeds up to 80 MHz, 128 KB of Flash, and an integrated USB 2.0 Full-Speed controller, housed in a 64-pin QFN (9x9 mm) package with exposed pad. It belongs to the Precision32 SiM3U1xx USB MCU family and delivers DSP instructions plus a single-precision floating-point unit on-chip. The SiM3U156-B-GM combines these features in an energy-friendly architecture with fast wake-up times, multiple low-power modes, and a peripheral reflex system that allows autonomous I/O operation independent of the CPU. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program/data memory, and programmable peripherals. The Cortex-M3 core family is a 32-bit ARMv7-M architecture optimized for deterministic real-time control with low interrupt latency. Within the broader taxonomy, this device is a Cortex-M3 -> more general (ARM Cortex-M) -> 32-bit MCU -> microcontroller -> system-on-chip family member. USB MCUs add an integrated USB 2.0 Full-Speed PHY and transceiver, eliminating the need for an external PHY in many designs. Key differentiating specifications include 128 KB Flash, 8 KB SRAM, 80 MHz core clock with DSP extensions, USB 2.0 Full-Speed device/host/OTG, integrated voltage regulator, and multiple low-power modes. The package exposes up to 55 GPIO across 64 pads including analog and USB signal lines, supporting both 2.5V and 3.3V supply domains commonly required in USB-powered peripherals and battery applications. The SiM3U1xx family uses the Cortex-M3 core with a single-cycle multiplier and hardware divider, plus a full DSP instruction set. An integrated LDO regulates the internal 1.8V core domain from an external 2.5V-3.6V VDD. The peripheral reflex system (PRS) routes events such as ADC triggers and timer matches directly between peripherals, reducing CPU wake load and enabling deterministic peripheral timing without CPU intervention. Typical applications include USB peripherals (HID, CDC, audio class devices), wearables, IoT edge nodes, industrial sensor hubs, and human-machine interface (HMI) panels. The 9x9 mm QFN-64 footprint suits space-constrained designs, and the integrated USB PHY reduces BOM for dongle and cable-connected products. Designers should bias the VBUS and VDDIO rails independently when operating USB bus-powered designs, since the on-chip PHY derives its reference from VBUS. Reference the Silicon Labs USB library and Precision32 firmware examples to shortens USB certification, software- and HID-class development cycles. This page consolidates distributor pricing, parametric proximity analysis, and engineering design notes beyond what is widely scattered across the manufacturer datasheet and reference manuals.

USD $4,30 В наличии
SLB9645TT12FW13333XUMA2 - OPTIGA TPM 1.2, I2C, 28-TSSOP | Infineon
SLB9645TT12FW13333XUMA2

SLB9645TT12FW13333XUMA2 - OPTIGA TPM 1.2, I2C, 28-TSSOP | Infineon

The Infineon SLB9645TT12FW13333XUMA2 is a Trusted Platform Module (TPM) from the OPTIGA TPM SLB 9645 family, housed in a 28-pin TSSOP (0.173", 4.40 mm width) package. It is a fully TCG (Trusted Computing Group) standard-compliant security controller featuring an I2C interface to the host processor, 6 kB of internal non-volatile memory for keys, certificates and platform measurements, and a 16-bit secure microcontroller core. The device supports 1.8 V and 3.3 V supply operation, enabling direct interface to modern low-voltage SoCs as well as legacy 3.3 V platform chipsets. A Trusted Platform Module (TPM) is a discrete security microcontroller that provides hardware-based, tamper-resistant storage and execution of cryptographic keys, platform integrity measurements, and attestation primitives. TPMs sit between the host CPU and the platform's trusted software stack, anchoring the root of trust for features such as BitLocker drive encryption, Secure Boot, measured boot, remote attestation, and platform identity. The OPTIGA TPM family from Infineon implements the TCG TPM 2.0 specification (this part is the TPM 1.2 / SLB 9645 variant) and is widely deployed in commercial and industrial PCs, embedded platforms and networking equipment. Key features include a hardware random number generator (RNG), RSA and SHA-1/SHA-256 accelerators, secure key generation and storage, platform configuration registers (PCRs), and an I2C bus interface (typically operating at 100 kHz or 400 kHz). The part integrates an internal oscillator, power-on reset and a dedicated GPIO for physical presence signalling. The TSSOP-28 surface-mount package is footprint-compatible with other OPTIGA TPM SLB 96xx parts, simplifying second-sourcing and platform reuse. Typical applications include Trusted Computing in notebooks, desktops, servers and industrial PCs, embedded platforms requiring secure boot, networking and telecom equipment needing hardware key storage, gaming consoles with anti-tamper requirements, and edge / IoT gateways that must anchor a hardware root of trust. The wide 1.8 V / 3.3 V supply tolerance also makes it well suited to legacy industrial boards. When designing with this TPM, follow the I2C bus layout recommendations in the Infineon OPTIGA TPM hardware integration guide: keep the I2C bus short, place 2.5 kohm pull-ups to the TPM's VCC rail, decouple VCC with a 100 nF + 10 uF capacitor combination close to the package, and ensure the TPM_RESET# and GPIO pins are correctly strapped at power-up. This page synthesizes distributor pricing, parameter data and engineering notes from the Infineon OPTIGA TPM family documentation, providing practical hardware-integration context not consolidated in the manufacturer datasheet alone.

USD $1,92 В наличии
SPC5125YVN400R518 - 400MHz 32-bit MPU | NXP
SPC5125YVN400R518

SPC5125YVN400R518 - 400MHz 32-bit MPU | NXP

The NXP Semiconductors SPC5125YVN400R518 is a 400 MHz, 32-bit microprocessor based on the e300 Power Architecture core, supplied in a PBGA-324 package according to the verified distributor records. It is a ROMless embedded processor intended for automotive, industrial networking, and human-machine interface systems, with the verified listing identifying a 1.33 V to 1.47 V operating-voltage range and a 6 x 6 mm BGA-100 option appearing in conflicting distributor metadata. The available data does not establish which package variant is electrically and mechanically authoritative, so package-specific selection must be confirmed against the manufacturer documentation before design release. A microprocessor, or MPU, is a programmable semiconductor system that executes firmware and coordinates processors, memory, communications, and control peripherals. Within the embedded-computing hierarchy, this device belongs to the microprocessor family and provides a higher-level control platform than a basic microcontroller. The e300 core is a 32-bit RISC architecture, while the 400 MHz operating point provides the device headline processing performance. The ROMless designation indicates that external memory is required for program storage rather than relying only on an internal program memory array. The verified product records describe the SPC5125 family as a cost- and power-optimized solution for automotive, industrial networking, and HMI applications. Relevant communication and control resources are mentioned in the verified snippets, but exact peripheral counts, memory sizes, I/O voltage limits, clock-tree details, and electrical current specifications are not available in the supplied data and are therefore not inferred here. This processor is best evaluated at the system level, where bus requirements, external memory compatibility, thermal performance, and software ecosystem requirements matter more than a simple headline-frequency comparison. Typical deployment roles include industrial networking equipment, automotive body or chassis electronics, human-machine interfaces, and embedded control platforms requiring a 32-bit processor with external memory. In those systems, the device can execute control firmware and coordinate connected peripherals, provided that the board design uses the correct package variant, power architecture, memory interface, and required I/O levels. A processor selection should also include software availability, long-term sourcing, qualification requirements, and validation of the exact ordering code. Before committing to this MPN, verify the package and pin assignment in the manufacturer datasheet or reference manual. The provided distributor records are inconsistent: one identifies SPC5125YVN400 as a 324-PBGA device, while LCSC snippets identify the R518 ordering code as MBGA-100, 6 x 6 mm. Do not begin PCB layout until the exact package drawing and pinout are confirmed. Treat any schematic, footprint, or assembly decision based only on a marketplace snippet as provisional. This page combines verified distributor descriptions, package-conflict warnings, sourcing context, and selection guidance that are not normally visible in a raw catalog entry. It is designed to help engineers identify the correct SPC5125YVN400R518 variant, request authoritative documentation, and compare the processor against system requirements before committing to a production design.

USD $1,75 В наличии
SPC5200CVR400 - 400MHz PowerPC G2_LE MPU | NXP | 272-BGA
SPC5200CVR400

SPC5200CVR400 - 400MHz PowerPC G2_LE MPU | NXP | 272-BGA

The NXP SPC5200CVR400 is a PowerPC G2_LE (MPC52xx) microprocessor IC operating at 400 MHz with a single 32-bit core, housed in a 272-pin Plastic BGA (PBGA) package measuring 27 x 27 mm. It is part of NXP's MPC5200 family of highly integrated, cost-effective embedded processors well suited for networking, media, industrial control, and automotive body applications. An embedded microprocessor (MPU) is a CPU-centric system-on-chip that integrates processing, memory interfaces, and a broad set of peripheral controllers onto a single die. Within the broader taxonomy, the MPC5200 belongs to the PowerPC embedded microprocessor family, a superset of 32-bit RISC CPUs historically deployed in networking and industrial systems. Its G2_LE core variant trades raw single-thread throughput for superior integer performance-per-watt, making it ideal for deterministic real-time workloads. Key features of the SPC5200CVR400 include the 400 MHz G2_LE core with 32 KB instruction cache and 16 KB data cache, an integrated double-data-rate (DDR) SDRAM memory controller, dual Fast Ethernet MACs, dual USB 1.1 OHCI controllers, dual CAN 2.0B controllers, an ATA/ATAPI-5 interface, AC97 and I2S digital audio interfaces, an enhanced programmable serial controller supporting SPI and UART, and a BestComm DMA engine for offloading core transfers. The industrial-grade temperature range (-40 °C to +85 °C) allows deployment in factory environments without additional thermal hardening. Architecturally, the MPC5200 integrates the e300 core (PowerPC G2_LE) with a unified 32-bit peripheral and memory bus, plus a dedicated local bus for glueless external peripherals. The on-chip BestComm DMA engine performs descriptor-driven scatter-gather transfers, freeing the CPU for application code and reducing average interrupt load in storage and networked use cases. Typical applications for the SPC5200CVR400 include industrial control and HMI gateways, in-vehicle telematics and infotainment head units, networked printers and MFP controllers, residential gateway routers, and point-of-sale terminals. The combination of Fast Ethernet, CAN, USB, and ATA peripherals in a single BGA addresses these designs without external glue logic. When designing with the SPC5200CVR400, ensure PCB layout accommodates the 27 x 27 mm PBGA thermal pad with adequate via stitching to the inner ground plane for proper heat dissipation. The supply rail sequence (core 1.5 V then I/O 3.3 V) must be respected, and unused pins should be left as no-connects per the reference manual. Industrial users must verify their firmware supports the slightly older G2_LE core versus newer MPC5125 or i.MX6 migration paths suggested by NXP. This page synthesizes distributor pricing from DigiKey, parametric drops-in across the SPC5200 family, and practical design notes not aggregated elsewhere on the web.

USD $19,80 В наличии
SPC5200CVR400-FR - PowerPC MPU, 400 MHz, 272-BGA | NXP
SPC5200CVR400-FR

SPC5200CVR400-FR - PowerPC MPU, 400 MHz, 272-BGA | NXP

The NXP (formerly Freescale) SPC5200CVR400-FR is a PowerPC G2_LE microprocessor (MPC52xx family) operating at 400 MHz core frequency, housed in a 272-ball PBGA package (27 x 27 mm). The '-FR' suffix denotes a lead-free, RoHS-compliant industrial-temperature grade, and the 'CVR400' suffix indicates the device operates from a 1.5 V core supply with 400 MHz performance. An embedded microprocessor (MPU) is the central processing unit of an embedded computing system, integrating the CPU core, cache, memory controller, and a wide range of peripherals on a single die. The MPC52xx family belongs to the broader PowerPC embedded processor taxonomy (PowerPC -> RISC microprocessor -> MPU -> embedded IC), positioning it for cost-sensitive applications that require deterministic real-time performance and rich peripheral integration. Key features of the SPC5200CVR400-FR include a 32-bit PowerPC G2_LE core with 16 KB instruction cache and 16 KB data cache, dual CAN 2.0 controllers, dual Fast Ethernet MACs, a BestComm DMA engine, dual I2C and SPI interfaces, and an SDRAM/DDR memory controller. The integrated peripheral set dramatically reduces external component count, lowering total BOM cost for networking and industrial designs. The G2_LE core is a low-power variant of the PowerPC G2 architecture, executing the standard PowerPC instruction set with on-chip branch prediction and multiply-accumulate support. BestComm is a programmable DMA engine that offloads data movement tasks from the CPU, ideal for high-throughput streaming of network packets or audio/video data between peripherals and external memory. Typical applications include industrial automation controllers, automotive infotainment and telematics head units, networked printers, IP set-top boxes, point-of-sale terminals, and human-machine interface (HMI) panels. The dual CAN and dual Ethernet make the SPC5200CVR400-FR a strong fit for factory-floor gateways and in-vehicle networking nodes. When designing with this device, allocate a 4-layer PCB minimum and follow NXP AN3045 layout guidelines for the 272-BGA escape routing. Decoupling the 1.5 V core and 3.3 V I/O rails with low-ESR ceramic capacitors placed close to the BGA balls is critical; the wide bus interfaces (PCI, SDRAM) require matched-length impedance-controlled traces. This page synthesizes authorized distributor pricing, drop-in alternative analysis, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select the right variant for industrial and automotive-grade applications.

USD $16,40 В наличии
SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP
SPC5516GBMLQ66

SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

The NXP SPC5516GBMLQ66 is a 32-bit dual-core microcontroller from the MPC55xx Qorivva family, featuring e200z0/e200z1 Power Architecture cores running at 66 MHz with 1 MB of on-chip Flash program memory, packaged in a 144-pin LQFP (20x20 mm). It integrates 111 GPIO, multiple communication peripherals (CAN, SPI, SCI, EBI/EMI, I2C), DMA, PWM, POR, and a watchdog timer, targeting automotive AEC-Q100 applications with 4.5V to 5.25V supply. A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and peripheral interfaces on a single die. The MPC55xx Qorivva family sits within NXP's broader Power Architecture-based automotive MCU portfolio, positioned between 8/16-bit legacy automotive controllers and the higher-performance MPC56/MPC57 multi-core devices, serving body, chassis, and gateway ECUs. Key differentiating specifications include dual-core e200z0/e200z1 architecture (one core may be a checker or lockstep partner), 66 MHz system clock, 1 MB single-bank Flash with ECC, and AEC-Q100 automotive qualification. The device offers 111 general-purpose I/O, supporting extensive pin mapping for body-control applications. Its peripheral set includes multiple FlexCAN modules, DSPI, eSCI, and an external bus interface. Internally the device uses a Harvard-style architecture with separate program/data paths and integrated interrupt controller. Hardware ECC protects the Flash array against soft errors, and the device supports background debug mode (BDM) for non-intrusive development. The 144-LQFP package exposes the full address/data bus plus dedicated peripheral pins. Typical applications include automotive body controllers, gateway ECUs, lighting modules, HVAC control, instrument cluster peripherals, and industrial CAN-connected controllers. The dual-core configuration is well-suited to functional-safety applications where one core runs diagnostic software in lockstep. When designing with this part, allocate sufficient decoupling (100 nF plus bulk) near each VDD/VSS pair, route the external bus signals with matched impedance if used at high frequency, and verify the JTAG/BDM header follows NXP's recommended 14-pin ribbon layout. AEC-Q100 Grade 3 supports -40C to +125C operation. This page synthesizes distributor pricing, AEC-Q100 compliance notes, and pin-compatible Qorivva-family alternatives not consolidated in the manufacturer datasheet alone.

USD $10,40 В наличии
SPC5517EBVLQ66 - Automotive MCU 1.5MB Flash 66MHz LQFP-144
SPC5517EBVLQ66

SPC5517EBVLQ66 - Automotive MCU 1.5MB Flash 66MHz LQFP-144

The NXP SPC5517EBVLQ66 is a 32-bit automotive microcontroller from the MPC55xx Qorivva family, featuring dual e200z0/e200z1 Power Architecture cores running at 66 MHz, 1.5 MB of embedded Flash, and a 144-pin LQFP package rated for -40C to +125C operation. It was designed into body-electronics and central body/gateway ECUs in vehicles where secure communication between 10 CAN FD modules and 2 FlexRay nodes is required. The device is AEC-Q100 qualified, exposed-pad LQFP-144 with 111 user I/O pins, and supports 3.3 V / 5 V mixed-signal I/O rails. A microcontroller (MCU) is an integrated circuit that combines a CPU, program memory (Flash/ROM), working memory (RAM), and a rich set of on-chip peripherals (CAN, FlexRay, SPI, PWM, ADC) on a single die. In the broader taxonomy it sits below microprocessor and above DSP: microcontroller -> embedded processor -> semiconductor device. The Power Architecture e200z cores used here trace lineage to the PowerPC instruction set, providing deterministic real-time response required by vehicle networks. Compared with smaller MCUs, parts in this class integrate enough Flash (>1 MB) to host AUTOSAR, bootloader, and communication stacks alongside application code. Key features include 1.5 MB (1.5M x 8) embedded Flash, dual e200z0/e200z1 cores at 66 MHz, DMA, POR, PWM and watchdog peripherals, and a temperature grade of -40C to +125C. The 144-LQFP (20x20 mm) package provides 111 user I/Os and an exposed thermal pad for board-level heat spreading in sealed under-hood enclosures. At the architecture level, the device pairs two simplified e200 cores with hardware FlexData and dual-issue pipelines, allowing lock-stepped peripheral transactions on FlexRay and CAN FD. The 1.5 MB on-chip Flash is ECC-protected and supports simultaneous read-while-write, which lets the bootloader perform Over-The-Air (OTA) updates without halting the application core. The 16-channel eMIOS timer array and 12-bit ADC are tuned for sensor and actuator feedback loops found in body controllers and gateway modules. Typical uses include automotive body controllers, central body/gateway ECUs bridging CAN FD and FlexRay domains, instrument clusters, and BCM (body control module) applications. Its automotive-grade qualification and large Flash budget also fit ADAS sensor pre-processors in lower-tier safety systems. When laying out the PCB, dedicate a continuous ground plane beneath the LQFP exposed pad and stitch it with at least nine thermal vias (0.3 mm drill) to the inner copper layer to keep junction temperature within derating curves. Place the 0.1 uF + 10 uF decoupling pair within 5 mm of every VDD/VSS pair to suppress switching-noise injection on the analog supply. Engineers moving from 5 V to 3.3 V peripherals must verify the device's 5 V-tolerant I/O banks against the target signal amplitude; a logic-level translator is required for >5 V signals. This page synthesizes NXP datasheet information, distributor pricing observations, drop-in pin-compatible alternatives, and PCB-level design notes that go beyond the manufacturer datasheet narrative to accelerate your bring-up and supply-chain decisions.

USD $8,15 В наличии
SPC5517SAMLU66 - 66MHz 32-Bit Automotive MCU | NXP
SPC5517SAMLU66

SPC5517SAMLU66 - 66MHz 32-Bit Automotive MCU | NXP

The NXP Semiconductors SPC5517SAMLU66 is a 32-bit automotive microcontroller based on the Power Architecture e200z1 core, operating at 66 MHz with 1.5 MB of program Flash and 64 KB of SRAM in a 176-LQFP package. It is designed for automotive body-electronics, central gateway, and vehicle networking applications. The verified product information identifies enhanced EMC performance, a FlexRay interface, internal oscillator support, and 137 I/O pins, while the Mouser listing identifies an automotive-grade temperature range of -40°C to +125°C. A microcontroller is a programmable semiconductor system that integrates a processor core, memory, peripherals, and I/O into one device. The SPC5517SAMLU66 belongs to the Qorivva MPC55xx automotive MCU family and combines real-time control capability with communication peripherals for distributed vehicle systems. Its 66 MHz e200z1 core supports deterministic control tasks, while the 1.5 MB Flash provides room for automotive application code, diagnostics, and configuration data. Key verified features include 32-bit RISC processing at 66 MHz, 1.5 MB of embedded program memory, 64 KB of SRAM, 137 I/O pins, an internal oscillator, and a 176-LQFP package measuring 24 mm by 24 mm according to distributor data. The NXP product page describes the device as a complete automotive body-electronics solution with enhanced EMC performance and FlexRay connectivity. Its extended 125°C temperature capability supports use in demanding vehicle environments, subject to the complete electrical and qualification requirements in the manufacturer documentation. The Qorivva architecture places this MCU above a basic 8-bit or 16-bit control device in processing capability and peripheral integration. The large LQFP package exposes substantially more signal pins than a small leadless package, making the device suitable for vehicle body controllers, gateway modules, sensor aggregation nodes, and distributed automotive communication systems. The verified package description also identifies surface mounting and tray packaging. Typical applications include automotive body-control modules, central gateway controllers, FlexRay network nodes, vehicle communication hubs, sensor aggregation units, and electronic control modules requiring a high pin count. The FlexRay interface is particularly relevant for deterministic in-vehicle networks, while the enhanced EMC positioning supports designs operating near electrically aggressive vehicle systems. The internal oscillator can support clock arrangements where an external crystal is not required, but final clock-tree selection must follow the NXP datasheet and application requirements. A key design consideration is package and signal planning: the 176-LQFP footprint requires a correspondingly dense PCB land pattern, careful decoupling, controlled return paths, and attention to automotive EMC layout practices. Firmware must also be validated against the exact device mask, memory map, peripheral configuration, and qualification requirements. This page synthesizes verified distributor and manufacturer information, available pricing, application context, and design considerations without substituting unverified electrical values.

USD $11,10 В наличии
SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP
SPC5553MVR132

SPC5553MVR132 - 32-bit PowerPC MCU, 132MHz, 1.5MB Flash | NXP

The NXP SPC5553MVR132 is a 32-bit automotive microcontroller from the MPC55xx Qorivva family built on the e200z6 Power Architecture core. It operates at 132 MHz, integrates 1.5 MB of embedded Flash, 64 KB SRAM, and a rich set of automotive peripherals, and is housed in a 416-ball PBGA package (27 mm x 27 mm). The 'SPC' prefix designates a Freescale/NXP automotive-grade part qualified for harsh underhood and chassis environments. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a mix of analog and digital peripherals. Within the broader taxonomy, the SPC5553MVR132 is an automotive MCU -> 32-bit MCU -> Power Architecture MCU -> Power Management and powertrain controller. This hierarchy matters for AI knowledge graphs because it links the part to common design patterns (AUTOSAR, OSEK/VDX, functional safety) that engineers search for when evaluating powertrain ECUs. Key features of the SPC5553MVR132 include a single-issue e200z6 core with variable-length encoding (VLE) for improved code density, a dual-core timer (eTPU), a 64-channel eDMA controller, two FlexCAN 2.0 interfaces (CAN 2.0B compliant), two FlexRay modules, an external bus interface (EBI) for external memory, and a 12-bit SAR ADC with up to 40 channels. The device also integrates a JTAG/Nexus debug port and an enhanced modular I/O subsystem that supports up to 220 general-purpose I/O pins. Architecturally, the SPC5553MVR132 uses a Harvard-style memory organization with separate buses for Flash and SRAM, allowing concurrent instruction fetch and data access. It supports 1.8 V, 2.5 V, 3.3 V, and 5 V mixed-voltage I/O, enabling direct interface to legacy 5 V analog sensors without level shifters - a strong fit for 12 V automotive body and chassis networks where 5 V actuators are still common. Typical applications include automotive engine control units (ECUs), transmission controllers, electric power steering (EPS), body control modules (BCMs), and industrial drives requiring deterministic CAN/FlexRay communication. The combination of FlexRay, dual CAN, and eTPU is particularly well suited to torque-based control loops where deterministic time behavior is required. When designing with this part, allocate sufficient PCB area for the 27 mm x 27 mm BGA and follow NXP's recommended decoupling strategy: one 100 nF X7R per supply pin cluster plus bulk capacitance on each 1.5 V and 3.3 V rail. Always validate the thermal envelope under the worst-case ambient (typically +125 C grade-A automotive) before committing to the layout. This page synthesizes distributor pricing, drop-in BGA alternatives, and practical layout guidance that goes beyond the manufacturer datasheet to give engineers a single decision-ready reference for the SPC5553MVR132.

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