EP3SL70F484C4LN - Stratix III L FPGA 67.5K LE | Intel | 484-FBGA
Артикул: EP3SL70F484C4LN ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $460 | $4.600,00 |
| 100 | $432 | $43.200,00 |
| 500 | $405 | $202.500,00 |
| 1.000 | $380 | $380.000,00 |
EP3SL70F484C4LN Обзор
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic hierarchy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. Unlike fixed-function ASICs, FPGAs implement arbitrary digital logic through configurable logic elements (LEs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers, all wired via programmable routing. The Stratix III L family specifically targets logic-dense, low-power designs where TDP budgets matter, making it a tier between the original Stratix III and the later Stratix IV/IV GX families.
Key features include 67,500 logic elements (LEs), 2,699,264 embedded memory bits organized as M9K/M144K blocks, up to 12 transceiver channels in related variants, dedicated DSP blocks for high-throughput arithmetic, and 296 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL). The 484-ball FBGA package supports high-density board routing while keeping the die-to-PCB inductance low for 375 MHz operation. The device is offered in the C4 speed grade (commercial, -4) with the L suffix indicating a low-power static power sub-variant and the N suffix indicating a lead-free, RoHS-compliant finish.
From an architectural standpoint, the Stratix III L uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), enabling higher logic density per LE than prior Stratix generations. The Programmable Power Technology allows unused logic to enter a near-zero static power state, which is the defining feature of the L suffix versus the standard Stratix III.
Typical applications include telecom baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition front-ends, and broadcast video routing fabrics. Its logic and memory balance also suits high-performance medical imaging pre-processing and radar front-end signal conditioning.
When designing with the EP3SL70F484C4LN, use the Quartus II design suite (version 13.0 or earlier; later Quartus versions require legacy device support). Decoupling requires bulk 0.1 uF + 10 uF capacitors near every VCC/VCCIO/G pin group, and the 484-FBGA land pattern demands 4-layer minimum PCB stack-up with via-in-pad recommended for full BGA fanout.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для EP3SL70F484C4LN — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3SL70F484C4LN (тот же форм-фактор и посадочное место) — отличается по Speed Grade, Package, Operating Temperature, Family, Core Voltage.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3SL70F484C4L
✅ Прямая замена✓ В наличии
$985 / шт.
Открыть даташит →EP3SL70F484C4G
✅ Прямая замена✓ В наличии
$1485 / шт.
Открыть даташит →EP3SL70F484C4
✅ Прямая замена✓ В наличии
$780 / шт.
Открыть даташит →EP3SL70F484C3
✅ Прямая замена✓ В наличии
$810 / шт.
Открыть даташит →EP3SL70F484C3G
✅ Прямая замена✓ В наличии
$985 / шт.
Открыть даташит →EP3SL70F484C2N
✅ Прямая замена✓ В наличии
$149.5 / шт.
Открыть даташит →EP3SL70F484C4LN Максимальные параметры и электрические характеристики
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III L |
| Logic Elements (LEs) | 67,500 |
| Embedded Memory Bits | 2,699,264 bits |
| Logic Array Blocks (LABs) | 2,700 |
| User I/Os | 296 |
| Maximum Internal Clock Frequency | 375 MHz |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Корпус | 484-ball FC-FBGA |
| Speed Grade | C4 (commercial, -4) |
| Рабочая температура | 0C to +85C (commercial) |
| Тип монтажа | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
| Low-Power Variant | Yes (L suffix, Programmable Power Technology) |
Руководство по цоколевке EP3SL70F484C4LN в корпусе 484-ball fc-fbga
Цоколевка для EP3SL70F484C4LN (корпус 484-ball fc-fbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP3SL70F484C4LN.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP3SL70F484C4LN подходит для 6 применениеs: Telecom Baseband Processing, ASIC Prototyping, Military/Aerospace Signal Processing, High-Speed Data Acquisition Front-End, Broadcast Video Routing, Medical Imaging Pre-Processing.
Telecom Baseband Processing
The EP3SL70F484C4LN fits telecom baseband line-card designs where 67,500 LEs and 2.7 Mbit of embedded memory handle packet header parsing, queue management, and traffic shaping at line rates up to 375 MHz. The L suffix enables Programmable Power Technology that powers down idle LABs between bursts, reducing TDP by 30-50% versus non-L Stratix III variants. Designers route 296 I/Os to SRIO/SerDes companion PHYs and external TCAM classifiers; the 484-FBGA footprint supports via-in-pad PCB stack-up for clean signal integrity on LVDS buses.
Рекомендуется
ASIC Prototyping
Engineers use the EP3SL70F484C4LN as an ASIC prototype vehicle for mid-complexity SoCs with up to 1-2 million gates of synthesized logic. The 67.5K LEs map to roughly 1.5 M ASIC gates, while 2.7 Mbit of true-dual-port memory models on-chip SRAM blocks. The 484-FBGA footprint exposes 296 I/Os for connecting to prototype daughter cards that mimic final-ASIC pad-out. Quartus II DesignPartitions let the team split the design across multiple EP3SL70 devices for gate-blow-out prototyping, with C4 speed grade providing timing margin for full ASIC workloads.
Рекомендуется
Military/Aerospace Signal Processing
The EP3SL70F484C4LN is well-suited to military and aerospace signal processing applications including radar front-end conditioning, electronic-warfare (EW) demodulation, and secure-comm baseband. Its 296 I/Os support parallel ADC/DAC interfaces at LVDS rates up to 1 Gbps per pair, while embedded DSP blocks accelerate FFT and FIR kernels without consuming logic resources. Industrial-grade variant EP3SL70F484I4LN extends operation to -40C/+100C for outdoor and avionics use. The 484-FBGA package withstands high-shock/vibration environments per IPC-9701 standards.
Рекомендуется
High-Speed Data Acquisition Front-End
Data acquisition systems use the EP3SL70F484C4LN as the FPGA processing element that aggregates high-speed ADC channels, performs real-time DSP (decimation, filtering, triggering), and forwards results to host CPUs via PCIe. The 67.5K LEs can simultaneously host 8+ parallel FIR filter chains, while M144K memory blocks buffer samples between ADC bursts. The 484-FBGA footprint enables compact multi-channel DAQ boards where multiple ADCs connect via sub-LVDS to the FPGA's 296 I/Os. Industrial users choose I4 temperature grade for outdoor instrumentation.
Рекомендуется
Broadcast Video Routing
Broadcast studios and outside-broadcast (OB) trucks deploy the EP3SL70F484C4LN in video routing switchers and format converters handling SDI, HDMI, and DisplayPort streams. The 67.5K LEs implement multi-channel scalers and color-space converters, while the 2.7 Mbit of embedded memory acts as line-buffer storage for deinterlacing and frame-rate conversion. The 296 I/Os accept LVDS/SLVS streams from multiple video PHYs simultaneously. The C4 speed grade's lower power suits thermally-constrained OB truck rack units.
Рекомендуется
Medical Imaging Pre-Processing
The EP3SL70F484C4LN accelerates pre-processing stages in medical imaging systems including CT scanners, MRI receivers, and ultrasound beamformers. Its DSP blocks compute image-reconstruction kernels (back-projection, FFT) at real-time rates, while embedded memory buffers raw scan-line data. The 296 I/Os accept high-speed LVDS data from parallel ADC arrays. Designers choose EP3SL70F484I4LN for medical-grade temperature compliance. Medical OEMs appreciate the Stratix III L family's mature IEC 62304 documentation trail.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3SL70F484C4LN — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3SL70F484C4L | EP3SL70F484C4G | EP3SL70F484C4 | EP3SL70F484C3 | EP3SL70F484C3G | EP3SL70F484C2N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LEs) | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 (commercial, slowest) | C4 | C4 | C4 | C3 (faster) | C3 (faster) | C2 (fastest) |
| Low-Power (L) Variant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lead-Free (N) Finish | Yes (RoHS) | No (SnPb) | Yes (RoHS) | No | No | Yes (RoHS) | Yes (RoHS) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Ключевые отличия
- Lead-free RoHS-compliant finish with low-power variant (против EP3SL70F484C4L)
- Lowest-power C4 commercial speed grade available (против EP3SL70F484C2N)
- Stratix III L family with Programmable Power Technology (против Standard Stratix III EP3S70F484C4N)
Заметки по проектированию
The EP3SL70F484C4LN requires multiple supply rails: VCC (0.9 V core), VCCIO (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V depending on I/O standard), VCCAUX (2.5 V), VCCPD (3.0 V or 3.3 V for configuration). Decoupling requires a minimum of one 0.1 uF X7R ceramic per VCC/GND pair plus bulk 10 uF-100 uF tantalum or polymer caps near each supply pin group. The L variant's Programmable Power Technology can cut static current by 30-50% in designs with bursty activity; engage it in Quartus II Advanced Power Optimization settings.
The 484-FBGA package uses 1.0 mm ball pitch on a 23 mm x 23 mm substrate, demanding 4-layer minimum PCB stack-up with microvia-in-pad (VIP) technology for inner-row BGA fanout. Standard through-via fanout will not fit between balls at 1.0 mm pitch. Maintain continuous reference planes under the BGA to provide low-impedance returns for LVDS/SSTL signals, and use 50 ohm controlled impedance traces for high-speed LVDS pairs.
Configuration mode selection (MSEL pins) must be set correctly for AS (active serial, EPCS flash), PS (passive serial, external host), JTAG, or Fast Passive Parallel modes; incorrect MSEL settings cause configuration failures. The DCLK pin must never be left floating - tie it to GND if unused to prevent noise injection. For C4 commercial parts operating at 375 MHz, do not exceed 0.9 V +/- 5% on VCC; C4 parts have tighter voltage tolerance than C2/C3 grades.
The 484-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with proper PCB thermal vias and copper pours. At typical Stratix III L power dissipation of 4-6 W under load, expect 60-90 C junction temperature rise above ambient. For reliable operation across the 0C to +85C commercial range, ambient should not exceed 35 C in air-cooled chassis without airflow. Industrial I4 variants support -40C to +100C operation.
Информация о соответствии
RoHS compliant per N suffix in MPN. Intel/Altera follows EICC-GeSI Conflict-Free Smelter Program. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; for automotive use, consider Cyclone V GT or Arria V automotive variants.