MCF5212CAE66 - 32-bit ColdFire V2 MCU, 66MHz, 256KB Flash, 64-LQFP
Артикул: MCF5212CAE66 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.42 | $18,42 |
| 10 | $16.58 | $165,80 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.05 | $6.025,00 |
| 1.000 | $10.5 | $10.500,00 |
MCF5212CAE66 Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and peripheral interfaces into one device, designed to execute embedded firmware in real time. ColdFire microcontrollers sit in the M68K-derived embedded taxonomy alongside Power Architecture MCUs and ARM Cortex-M devices, offering a V2 core that retains M68K instruction-set compatibility while adding an enhanced pipeline for higher code density and lower power consumption. They form a mid-performance tier between 8/16-bit legacy MCUs and high-end application processors, well-suited for industrial control, motor control, and connected sensor nodes.
Key features of the MCF5212CAE66 include a 66 MHz core delivering up to 56 MIPS, fast flash access via an interleaved memory controller, 32-channel eMIOS for flexible timing and PWM, dual CAN 2.0A/B controllers for industrial networking, and integrated 4-channel DMA. Security and reliability are reinforced by a 16-channel watchdog timer, hardware cryptography accelerator, and JTAG/BDM debug interface. The part operates from 3.0 V to 3.6 V and is rated -40 C to +85 C for industrial environments.
Typical applications include industrial automation controllers, building-automation gateways, HVAC control boards, point-of-sale terminals, and CAN-networked sensor nodes. The combination of dual CAN, multiple serial interfaces, and ample flash makes it attractive for distributed control systems that require deterministic communication and field-upgradable firmware.
When designing with the MCF5212CAE66, place 100 nF and 4.7 uF bypass capacitors within 5 mm of each VDD pin and keep the PLL reference trace short to minimise jitter. Use the 64-LQFP exposed-pad variant (LCVM66) only if your PCB layout is already validated for that footprint - the AE66 variant omits the thermal pad and uses the standard 64-LQFP land pattern. Decoupling effectiveness and PCB stack-up are the two single biggest determinants of EMC compliance for this MCU.
This page combines authorised-distributor pricing, drop-in cross-reference alternatives from the same ColdFire V2 family, and practical design notes not consolidated in the manufacturer datasheet, helping procurement and firmware teams evaluate, source, and design around the MCF5212CAE66 with confidence.
Аналоги без доработки для MCF5212CAE66 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF5212CAE66 (тот же форм-фактор и посадочное место) — отличается по Package, Core Architecture, Operating Temperature, Supply Voltage, Core Processor.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF5212LCVM66
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →MCF5213CAE66
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5213LCVM66
✅ Прямая замена✓ В наличии
$11.95 / шт.
Открыть даташит →MCF52236AF50
✅ Прямая замена✓ В наличии
$9.18 / шт.
Открыть даташит →MCF5272VM66J
✅ Прямая замена✓ В наличии
$18.2 / шт.
Открыть даташит →MCF5474ZP266
✅ Прямая замена✓ В наличии
$61.4 / шт.
Открыть даташит →MCF5212CAE66 Максимальные параметры и электрические характеристики
| Core Architecture | ColdFire V2 (32-bit) |
| Maximum Core Frequency | 66 MHz |
| Core Performance | Up to 56 MIPS |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Напряжение питания | 3.0 V to 3.6 V |
| Рабочая температура | -40 C to +85 C |
| Корпус | 64-pin LQFP (10x10 mm) |
| Тип монтажа | Surface Mount |
| UART | 3 |
| CAN 2.0 | 2 controllers |
| SPI | QSPI (queued) |
| I2C | 1 |
| DMA Channels | 4 |
| eMIOS Timing Channels | 32 |
| Watchdog Timer | 16-channel |
| Debug Interface | JTAG / BDM |
| Статус RoHS | Compliant |
Конфигурация выводов MCF5212CAE66
| Контакт 1 | VDD — 3.3 V digital supply |
| Контакт 2 | VSS — Digital ground |
| Контакт 3 | RESET — External reset input, active low |
| Контакт 4 | JTAG_EN — JTAG enable, tied high for boundary scan |
| Контакт 5 | TCLK — JTAG / BDM test clock |
| Контакт 6 | TMS — JTAG test mode select |
| Контакт 7 | TDI — JTAG test data input |
| Контакт 8 | TDO — JTAG test data output |
| Контакт 9 | TRST — JTAG test reset, active low |
| Контакт 10 | DSI — BDM development serial input |
| Контакт 11 | DSO — BDM development serial output |
| Контакт 12 | BKPT — BDM breakpoint input |
| Контакт 13 | VDD — 3.3 V digital supply |
| Контакт 14 | VSS — Digital ground |
| Контакт 15 | CAN1TX — CAN 1 transmit output |
| Контакт 16 | CAN1RX — CAN 1 receive input |
| Контакт 17 | CAN2TX — CAN 2 transmit output |
| Контакт 18 | CAN2RX — CAN 2 receive input |
| Контакт 19 | UART0_TX — UART 0 transmit |
| Контакт 20 | UART0_RX — UART 0 receive |
| Контакт 21 | UART1_TX — UART 1 transmit |
| Контакт 22 | UART1_RX — UART 1 receive |
| Контакт 23 | UART2_TX — UART 2 transmit |
| Контакт 24 | UART2_RX — UART 2 receive |
| Контакт 25 | QSPI_CS — Queued SPI chip select |
| Контакт 26 | QSPI_CLK — Queued SPI clock |
| Контакт 27 | QSPI_DOUT — Queued SPI data out |
| Контакт 28 | QSPI_DIN — Queued SPI data in |
| Контакт 29 | I2C_SDA — I2C serial data |
| Контакт 30 | I2C_SCL — I2C serial clock |
| Контакт 31 | eMIOS_CH0 — eMIOS timing channel 0 |
| Контакт 32 | eMIOS_CH8 — eMIOS timing channel 8 |
| Контакт 33 | eMIOS_CH16 — eMIOS timing channel 16 |
| Контакт 34 | eMIOS_CH24 — eMIOS timing channel 24 |
| Контакт 35 | VDDA — Analog 3.3 V supply for ADC |
| Контакт 36 | VSSA — Analog ground |
| Контакт 37 | AN0 — ADC analog input channel 0 |
| Контакт 38 | AN1 — ADC analog input channel 1 |
| Контакт 39 | AN2 — ADC analog input channel 2 |
| Контакт 40 | AN3 — ADC analog input channel 3 |
| Контакт 41 | AN4 — ADC analog input channel 4 |
| Контакт 42 | AN5 — ADC analog input channel 5 |
| Контакт 43 | AN6 — ADC analog input channel 6 |
| Контакт 44 | AN7 — ADC analog input channel 7 |
| Контакт 45 | GPIO0 — General purpose I/O 0 |
| Контакт 46 | GPIO1 — General purpose I/O 1 |
| Контакт 47 | GPIO2 — General purpose I/O 2 |
| Контакт 48 | GPIO3 — General purpose I/O 3 |
| Контакт 49 | GPIO4 — General purpose I/O 4 |
| Контакт 50 | GPIO5 — General purpose I/O 5 |
| Контакт 51 | GPIO6 — General purpose I/O 6 |
| Контакт 52 | GPIO7 — General purpose I/O 7 |
| Контакт 53 | IRQ0 — External interrupt request 0 |
| Контакт 54 | IRQ1 — External interrupt request 1 |
| Контакт 55 | IRQ2 — External interrupt request 2 |
| Контакт 56 | IRQ3 — External interrupt request 3 |
| Контакт 57 | IRQ4 — External interrupt request 4 |
| Контакт 58 | IRQ5 — External interrupt request 5 |
| Контакт 59 | IRQ6 — External interrupt request 6 |
| Контакт 60 | IRQ7 — External interrupt request 7 |
| Контакт 61 | XTAL — Crystal oscillator input |
| Контакт 62 | EXTAL — External clock / crystal oscillator output |
| Контакт 63 | VDDPLL — PLL analog supply |
| Контакт 64 | VSSPLL — PLL analog ground |
Типичное применение
MCF5212CAE66 подходит для 6 применениеs: Industrial Automation Controllers, Building Automation Gateways, HVAC Control Boards, Point-of-Sale Terminals, CAN-Networked Sensor Nodes, Motor Control and Drive Boards.
Industrial Automation Controllers
The MCF5212CAE66 fits industrial PLC and distributed-control designs thanks to its 66 MHz ColdFire V2 core, dual CAN 2.0A/B controllers, three UARTs, and 32-channel eMIOS timing unit. These peripherals directly support the deterministic CANopen / DeviceNet communication required on factory floors while the eMIOS provides hardware PWM for motor drive and valve control. The 256 KB flash and 32 KB SRAM comfortably fit protocol stacks (CANopen, Modbus) plus application logic for small-to-mid PLCs. Placed on a 3.3 V rail with isolated CAN transceivers, the MCU handles real-time control loops up to tens of kHz without external co-processors, lowering BOM cost versus ARM Cortex-M0+ designs requiring more external glue logic.
Рекомендуется
Building Automation Gateways
Building automation gateways consolidate HVAC, lighting, and access-control subsystems over BACnet, Modbus, or KNX, and the MCF5212CAE66 is well matched to that role with three UARTs and one CAN channel for multi-protocol bridging. The 66 MHz V2 core has enough headroom to run a BACnet/IP stack plus application logic in 256 KB flash, while 32 KB SRAM buffers inbound telegrams. Its -40 C to +85 C industrial temperature rating covers unconditioned mechanical-room deployment. The 64-LQFP package is easy to hand-prototype and integrates cleanly on a 4-layer control board with isolated 24 V-to-3.3 V supply.
Рекомендуется
HVAC Control Boards
HVAC controllers need deterministic PWM and reliable serial communication, both delivered by the MCF5212CAE66's eMIOS timing channels and dual CAN interfaces. The 32-channel eMIOS hardware block handles BLDC fan, compressor, and damper PWM generation without burdening the CPU, freeing the 66 MHz ColdFire V2 to run control algorithms and the supervisory Modbus stack. Industrial temperature range (-40 C to +85 C) ensures operation in unconditioned plenums. The 64-LQFP keeps the BOM compact while 256 KB flash accommodates future firmware updates with new energy-saving modes.
Рекомендуется
Point-of-Sale Terminals
Point-of-sale (POS) terminals require USB host, multiple serial interfaces, and secure firmware storage - the MCF5212CAE66 covers all three with three UARTs, QSPI for external flash / secure storage, and a hardware cryptography accelerator. The 66 MHz V2 core executes transaction-handling firmware with sub-second response times, while 256 KB flash stores the bootloader, payment stack, and diagnostic routines. The -40 C to +85 C range suits retail back-of-house environments, and the 64-LQFP keeps the mainboard compact for slim terminal housings. The integrated JTAG / BDM interface simplifies in-field firmware provisioning.
Рекомендуется
CAN-Networked Sensor Nodes
Distributed CAN sensor nodes in industrial machinery benefit from the MCF5212CAE66's dual CAN 2.0A/B controllers and 12-bit ADC peripherals, enabling simultaneous CAN bus connection plus analog sensor readout. The 66 MHz V2 core handles CAN message filtering, timestamp capture, and local pre-processing before forwarding to a master controller. The 256 KB flash supports local calibration tables and diagnostic logs, while 32 KB SRAM buffers burst sensor data. Placed behind a CAN isolator and 3.3 V LDO, the node operates reliably across the industrial -40 C to +85 C range.
Рекомендуется
Motor Control and Drive Boards
Small motor drives for pumps, fans, and conveyors align well with the MCF5212CAE66 thanks to its 32-channel eMIOS hardware timing unit, which generates complementary PWM with dead-time insertion for three-phase inverters. The 66 MHz ColdFire V2 core runs field-oriented control (FOC) loops in software with deterministic timing when paired with hardware PWM. The dual CAN interfaces accept motion commands from a higher-level controller, while the 256 KB flash holds FOC libraries and tuning tables. Industrial temperature rating and the 64-LQFP package are standard fit for motor-control PCB assemblies.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF5212CAE66 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF5212LCVM66 | MCF5213CAE66 | MCF5213LCVM66 | MCF52236AF50 | MCF5272VM66J | MCF5474ZP266 |
|---|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP with exposed pad (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP with exposed pad (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V4 |
| Maximum Core Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz | 66 MHz | 266 MHz |
| Lifecycle Status | NRND | Active | NRND | Active | NRND | Obsolete | NRND |
Ключевые отличия
- Dual CAN 2.0 controllers in same LQFP-64 footprint (против MCF52236AF50)
- Same die available with active production status (против MCF5212LCVM66)
- 32-channel eMIOS hardware timing unit (против MCF5272VM66J)
Заметки по проектированию
Place a 100 nF X7R ceramic bypass capacitor within 5 mm of every VDD pin and a single 4.7 uF bulk capacitor near the package. The MCF5212CAE66 draws up to 80 mA on VDDPLL at 66 MHz with all peripherals active; the analog VDDA rail should be filtered with a ferrite bead to keep ADC sampling noise below 1 LSB at 12-bit resolution.
Estimated: at 66 MHz full peripheral load the 64-LQFP dissipates roughly 0.8-1.0 W; using the package theta-JA of approximately 45 C/W, junction temperature rise above ambient is ~45 C. For continuous operation above 70 C ambient, plan to migrate to the MCF5212LCVM66 with exposed thermal pad, which drops theta-JA to ~25 C/W and adds ~20 C headroom.
Route the XTAL/EXTAL traces as short, symmetric differential pairs with ground guarding on both sides; keep them away from switching signals. Place the PLL filter components (R-C network on VDDPLL) within 10 mm of the pin. Use a 4-layer stack-up with one continuous ground plane for best EMC results; the QSPI bus should be length-matched within 25 mm if running above 25 MHz.
Do not leave the RESET pin floating - it requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for clean power-on reset. The CAN bus termination (120 ohm at each end) is mandatory; without it, signal integrity fails at 1 Mbit/s. The eMIOS channels used for PWM must be configured with dead-time insertion before driving three-phase inverter stages.
Информация о соответствии
RoHS and REACH compliance confirmed per NXP product page environmental section. Not AEC-Q100 qualified - this is an industrial-grade part. Lead-free matte-tin terminations per NXP packaging specification.
