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10AS032H2F35E1HG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA
10AS032H2F35E1HG

10AS032H2F35E1HG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA

The Intel 10AS032H2F35E1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a Dual ARM Cortex-A9 MPCore with CoreSight hard processor system and 320,000 logic elements of programmable fabric in a 1152-ball FCBGA package (35x35 mm). It is specified for an industrial operating temperature grade and supports transceiver rates up to 1.5 GHz, making it suitable for compute-intensive embedded designs. A SoC FPGA is a single silicon device that combines a general-purpose processor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with FPGA programmable logic on the same die. The Arria 10 SX family specifically pairs dual Cortex-A9 cores with mid-range Arria 10 FPGA fabric, occupying the middle ground between Cyclone V / Cyclone 10 cost-optimized SoCs and Stratix 10 high-end SoCs. The hard processor system runs an operating system (typically Linux, VxWorks, or RTOS) while the FPGA fabric accelerates custom dataplanes, DSP, or interface logic. This heterogeneous compute architecture is widely used in industrial, defense, and broadcast systems where deterministic hardware acceleration must coexist with rich software stacks. Key features of the 10AS032H2F35E1HG include 384 user I/Os, on-chip HPS peripherals (EMAC, USB, CAN, SD/MMC, NAND), 20 transceiver channels, hardened memory controllers, and partial reconfiguration support. The 1152-ball FCBGA package uses Intel's flip-chip land-grid-array technology and exposes high-speed serial links, external memory interfaces, and HPS I/O simultaneously. Industrial temperature screening allows deployment in -40C to +100C ambient environments per the Arria 10 industrial-grade datasheet. The device is fabricated on TSMC's 20 nm process, delivering a favorable power/performance ratio versus older 28 nm Stratix V SoCs. The HPS boots from QSPI/NAND flash and configures the FPGA fabric via the on-chip configuration subsystem. Designers can partition workloads between software (HPS) and hardware (FPGA fabric) using Intel's Quartus Prime toolchain with Qsys / Platform Designer for system integration. Common DSP blocks (variable-precision DSP) handle fixed- and floating-point math up to ~1.5 GHz. Typical applications include industrial machine vision, motor control and drives, software-defined radio, test and measurement equipment, medical imaging, and broadcast video processing. The combination of HPS running Linux and FPGA fabric implementing deterministic interfaces (EtherCAT, Profinet, Camera Link) is a common pattern in Industry 4.0 platforms. The HPS also simplifies board bring-up by offloading housekeeping tasks (network stacks, file systems, web UIs) from the FPGA fabric. When designing with the 10AS032H2F35E1HG, allocate PCB layers for transceiver routing (typically 100-ohm differential with skew matching) and for DDR3/4 external memory, which requires strict length matching. Thermal design must consider both HPS and FPGA fabric power; the FCBGA requires a heatsink and thermal interface material for typical workloads above 10 W. Pin-compatible Arria 10 SX variants exist in the same 1152-ball FCBGA package, enabling BOM flexibility. This page synthesizes distributor pricing, drop-in package alternatives, and practical design considerations not found on a single distributor page.

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10AS032H2F35E2LG - Arria 10 SX 320K LE SoC FPGA | Altera / Intel
10AS032H2F35E2LG

10AS032H2F35E2LG - Arria 10 SX 320K LE SoC FPGA | Altera / Intel

The Altera (now Intel) 10AS032H2F35E2LG is a member of the Arria 10 SX family of System-on-Chip (SoC) FPGAs, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace alongside 320K logic elements (LEs) of programmable fabric, packaged in a 1152-ball FineLine BGA (FCBGA) measuring 35x35 mm. The Arria 10 SX 320 device is built on TSMC's 20 nm process, delivers up to 1.5 GHz core fabric performance, and combines hardened memory controllers, high-speed serial transceivers, and DSP blocks optimized for mid-range wireless, broadcast, and defense applications. What is an SoC FPGA? An SoC FPGA is a hybrid device that tightly couples a general-purpose applications processor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with traditional FPGA programmable logic on a single die. Compared to a discrete FPGA + external CPU implementation, an SoC FPGA reduces board area, simplifies PCB layout, enables lower-latency interconnects between software and hardware, and offers a unified power/clock domain. The Arria 10 SX family sits in the mid- to high-performance tier of Intel's SoC FPGA portfolio, between Cyclone V/10 and the high-end Stratix 10 SoC family. Key features include 320K adaptive logic modules (ALMs), approximately 19.4 Mb of on-chip M20K memory, hard memory controllers supporting DDR4, DDR3, LPDDR3, and QDRIV, integrated PCIe Gen2/Gen3 hard IP blocks, and up to 24 transceivers supporting rates up to 12.5 Gbps. The hard processor system runs at up to 1.5 GHz (typical) with 32 KB I-cache and 32 KB D-cache per core, NEON media engine, and a rich set of peripherals including EMAC, USB 2.0 OTG, NAND flash controller, SPI, I2C, and UART. The FPGA fabric is hardened with variable-precision DSP blocks (up to 1,518) implementing IEEE 754 single-precision floating point. Architecturally, the Arria 10 SX uses a coherent ARM Cortex-A9 cluster connected via a 125 MHz ARM NIC-301 interconnect to the FPGA fabric on-chip. Designers boot Linux, VxWorks, or bare-metal applications on the HPS while accelerating custom logic, signal processing, and high-throughput data movement in the FPGA. The 1152-ball FCBGA (F35) package exposes the full I/O count including HPS dedicated pins, high-speed LVDS pairs, and transceiver channels for line-card, backplane, and baseband designs. Typical applications include wireless baseband processing (LTE small cells, microwave backhaul), broadcast video encoding/decoding, radar and electronic-warfare signal chains, industrial machine vision, and embedded defense platforms requiring both deterministic real-time hardware and a Linux-capable processor. The combination of ARM Cortex-A9 software ecosystem and 320K LE fabric makes the part well suited to mid-complexity designs where a discrete processor would bottleneck data movement. When designing with the 10AS032H2F35E2LG, ensure a multilayer PCB with at least 12 layers and controlled-impedance routing for transceivers and DDR interfaces. Thermal management is critical: at maximum fabric utilization the device can dissipate up to approximately 35 W, requiring a heatsink with at least 100 LFM airflow. Configure boot mode, MSEL, and pin multiplexing through the Quartus Prime toolchain. This page synthesizes distributor pricing, package-level alternatives from the same Arria 10 SX family, and practical design guidance not found in the manufacturer datasheet alone, helping engineers shorten sourcing and design-in cycles.

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10AS032H2F35E2SG - Arria 10 SX 320K LE SoC FPGA | Intel
10AS032H2F35E2SG

10AS032H2F35E2SG - Arria 10 SX 320K LE SoC FPGA | Intel

The Intel (Altera) 10AS032H2F35E2SG is a high-performance Arria 10 SX SoC FPGA integrating a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug, 320K logic elements, and 1.5 GHz core performance in a 1152-pin FCBGA (Flip-Chip BGA) package measuring 35x35 mm. It is the industrial-grade, speed-grade H2 variant of the 10AS032 family with extended (E2) temperature support, optimized for mid-range SoC FPGA designs requiring both programmable logic and a hard processor subsystem. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a traditional FPGA fabric with a hard processor system (HPS) on a single die, in the hierarchy FPGA -> programmable logic device -> semiconductor IC. The Arria 10 SX extends this by integrating ARM Cortex-A9 cores with tightly coupled peripherals, reducing BOM count and board area compared to a discrete CPU + FPGA design while retaining the FPGA's parallel processing flexibility for DSP, video pipelines, and custom accelerators. Key features of the 10AS032 include 320K logic elements (LEs), transceivers supporting multi-gigabit serial I/O, on-chip memory, variable-precision DSP blocks, and hard memory controllers. The integrated HPS provides the standard ARM Cortex-A9 debug, interrupt, and memory subsystem, supporting Linux and RTOS deployments. Hard IP for PCI Express Gen2/Gen3, memory interfaces (DDR3/DDR4 with hard controllers), and partial reconfiguration further accelerate time-to-market. The device's 20 nm process technology balances performance-per-watt with high logic density, making it well-suited for throughput-oriented embedded systems. The Arria 10 architecture includes hardened floating-point DSP blocks, which deliver up to ~1.5 TFLOPs DSP performance per device (per Intel Arria 10 device overview), enabling DSP-intensive workloads without consuming general fabric resources. Typical applications include Software Defined Radio (SDR), video broadcasting and image processing, industrial motor control, PCIe-based accelerator cards, and military/aerospace signal processing. The SoC integration suits applications needing both an OS-managed application layer and a deterministic, parallel datapath in the FPGA fabric. When designing with this device, ensure the PCB incorporates sufficient decoupling for the FCBGA's high-speed transceivers and proper thermal management for the 35x35 mm package. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. Verify that the chosen temperature grade (E2) matches the deployment environment's ambient range. This page consolidates distributor pricing, drop-in same-package alternatives from the Arria 10 SX family, and practical design notes that complement the official datasheet for engineers evaluating the 10AS032H2F35E2SG.

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10AS032H2F35I1HG - Arria 10 SX SoC, 320K LE, 1152-FBGA | Altera
10AS032H2F35I1HG

10AS032H2F35I1HG - Arria 10 SX SoC, 320K LE, 1152-FBGA | Altera

The Altera (Intel Programmable Solutions Group) 10AS032H2F35I1HG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace alongside 320K logic elements of programmable fabric. Housed in a 1152-ball Flip-Chip BGA (FCBGA) package measuring 35 mm x 35 mm, this industrial-temperature-grade device combines a 1.5 GHz capable HPS subsystem with hardened memory controllers, PCIe Gen2/Gen3, and 24 transceiver channels. The H2 speed grade and F35 package code designate a mid-performance silicon revision in the 35 mm FCBGA variant, with the I1 indicating industrial temperature range (-40C to +100C) and H suffix denoting hard-copy / pre-tested device variants commonly used in production. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a heterogeneous compute device that fuses a general-purpose applications processor subsystem with programmable logic on a single die. The Arria 10 SX series specifically targets mid-range applications that benefit from deterministic hardware acceleration in the FPGA fabric while running operating systems such as Linux or real-time operating systems on the ARM cores. Within the broader semiconductor taxonomy, SoC FPGAs occupy a unique position above standalone FPGAs and below Application-Specific Standard Products (ASSPs), offering a balance between flexibility and performance per watt. Key features include a hard dual-core ARM Cortex-A9 MPCore subsystem with NEON media engine, single- and double-precision floating-point units, CoreSight debug and trace, and a rich set of peripherals (USB, Ethernet, NAND/NOR flash controllers, DDR3/4 memory interfaces with ECC). The programmable logic delivers up to 320K logic elements, approximately 1.6 Mbits of embedded memory (M20K blocks), and 384 user I/Os with support for multiple I/O standards including LVDS and high-speed serial transceivers up to 12.5 Gbps. The integrated hard memory controllers support DDR4 up to 1600 MHz. Typical applications include industrial machine vision and inspection systems, motor control and industrial drive electronics, software-defined radio baseband processing, broadcast video processing, military and aerospace signal processing, and medical imaging pre-processing. The industrial temperature grade and FCBGA package make it well-suited for harsh-environment deployments. Design considerations include proper power management for the HPS subsystem, careful PCB layout for high-speed transceivers, thermal management for the large FCBGA package, and configuration scheme planning (typically using a QSPI flash or SD card for the HPS bootloader). This page synthesizes distributor availability, parametric alternatives, and practical design guidance not consolidated in the manufacturer datasheet.

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10AS032H2F35I2LG - Arria 10 SX SoC FPGA, 320K LE | Intel/Altera
10AS032H2F35I2LG

10AS032H2F35I2LG - Arria 10 SX SoC FPGA, 320K LE | Intel/Altera

The Intel/Altera 10AS032H2F35I2LG is an Arria 10 SX family System-on-Chip (SoC) FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, alongside 320K programmable logic elements and 1.5 GHz maximum logic performance, housed in a 1152-ball flip-chip BGA (35x35 mm F35 package). An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a hard ASIC processor subsystem with reconfigurable FPGA fabric on a single die. Within the broader taxonomy it sits as a programmable logic device -> FPGA -> SoC FPGA -> embedded computing platform, allowing deterministic hardware acceleration alongside a full operating-system-capable application processor. Key features include 320K logic elements, 1.5 GHz core fabric performance, integrated dual ARM Cortex-A9 cores with CoreSight, industrial temperature grade, and the high-pin-count FCBGA-1152 package that supports high-speed serial transceivers and abundant external memory interfaces. The part is part of Altera's Arria 10 SX mid-range SoC FPGA portfolio targeting compute-intensive embedded designs. The Arria 10 architecture uses TSMC's 20 nm process with a heterogeneous fabric combining adaptive logic modules (ALMs), M20K on-chip SRAM blocks, variable-precision DSP blocks. The hard processor subsystem removes the latency and area penalty of soft CPU cores and includes caches, ECC, and coherent interconnect to FPGA fabric, simplifying Linux/RTOS deployment alongside custom accelerators. Typical applications include industrial machine vision, software-defined radio, motor control and industrial drives, military/aerospace signal processing, and high-performance embedded computing platforms. The dual 1.5 GHz Cortex-A9 cores also suit low-latency deterministic control loops paired with FPGA-side sensor fusion. When designing with this device, ensure your PCB accommodates the 35x35 mm BGA with appropriate microvia stack-up and matched-length routing for DDR3/4 and high-speed serial links. Thermal management must consider both ARM core and FPGA fabric power; Intel/Altera's PowerPlay early power estimator is the recommended starting point. This page synthesizes distributor pricing, drop-in OPN alternatives, and practical design guidance for the 10AS032H2F35I2LG - information not consolidated on any single distributor or manufacturer page.

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10AS032H2F35I2SG - Arria 10 SX 320K LE SoC FPGA 1.5GHz | Altera
10AS032H2F35I2SG

10AS032H2F35I2SG - Arria 10 SX 320K LE SoC FPGA 1.5GHz | Altera

The Altera 10AS032H2F35I2SG is a high-performance Arria 10 SX System-on-Chip FPGA integrating dual ARM Cortex-A9 MPCore processors with CoreSight debug technology alongside 320K logic elements, housed in a 1152-ball FCBGA (F35, 35x35 mm) package. The H2 speed grade and -40C to +100C industrial temperature rating make this SoC FPGA suitable for harsh-environment embedded compute. The hard processor system (HPS) combines application-class Cortex-A9 cores with the FPGA fabric, enabling hardware-accelerated signal processing and software programmability on a single die. An SoC FPGA is an integrated circuit that combines a processor subsystem (typically ARM Cortex-A or Cortex-M) with programmable logic on the same silicon. The processor subsystem handles control-plane tasks, operating systems, and network stacks, while the FPGA fabric accelerates data-plane workloads such as DSP, packet processing, and custom I/O protocols. This heterogeneous architecture reduces board area, lowers power versus discrete processor-plus-FPGA designs, and tightens hardware/software coupling by eliminating inter-chip buses. Key features of the 10AS032H2F35I2SG include the integrated dual-core ARM Cortex-A9 MPCore with CoreSight, support for high-speed serial transceivers, on-chip memory, and DSP blocks optimized for floating-point and fixed-point arithmetic. The Arria 10 family uses TSMC's 20nm process, achieving a favorable performance-per-watt ratio versus prior 28nm Stratix and Arria V devices. The H2 speed grade is typically the highest bin within the family, allowing the highest core clock frequencies and tightest timing margins at the cost of higher unit price. Typical applications include wireless baseband processing, software-defined radio, radar signal processing, industrial machine vision, high-performance embedded computing, and protocol bridging. The 1.5GHz core clock combined with the FPGA fabric enables line-rate processing of multi-gigabit data streams while the HPS runs a Linux or RTOS control stack. Designers can partition algorithms in hardware for throughput-critical paths and software for flexibility. When designing with this device, ensure the PCB has a 35x35 mm land pattern with microvia-in-pad capability for the FCBGA. Reference Altera's Arria 10 SoC development kit schematics for DDR3/DDR4 memory interface routing. Quartus Prime software is required for synthesis, place-and-route, and HPS configuration. Note that the HPS and FPGA fabric must be configured together; review the Arria 10 HPS boot flow before committing to pinout. This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet alone.

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10AS032H3F34E2LG - Arria 10 SX SoC FPGA 320K LE | Intel
10AS032H3F34E2LG

10AS032H3F34E2LG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel 10AS032H3F34E2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and an Arria 10 FPGA fabric of 320K logic elements, housed in a 1152-pin FCBGA (35x35 mm) package. The H3 speed grade targets mid-range performance, while the F34 package code identifies the 35x35 mm 1152-ball FineLine BGA with flip-chip interconnect and lead-free compliance. The E2 suffix indicates an industrial temperature grade. An SoC FPGA (System-on-Chip FPGA) is a heterogeneous computing device that combines a general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on a single die. The SoC sits in the broader hierarchy: SoC FPGA -> FPGA -> programmable logic -> semiconductor IC. The hard processor system executes an operating system and manages peripherals, while the FPGA fabric accelerates parallel workloads such as DSP pipelines, custom interfaces, and high-bandwidth data movement. Key features include 320K logic elements for parallel processing, dual ARM Cortex-A9 cores running up to 1.5 GHz with CoreSight debug, integrated multi-port memory controllers, high-speed serial transceivers, and variable-precision DSP blocks. The 1152-pin FCBGA package exposes the full I/O and transceiver capability of the Arria 10 SX die. The Arria 10 architecture uses a 20 nm process with adaptive logic modules (ALMs), 20K adaptive LUTs per ALM pair, and hard memory controller blocks. The integrated HPS provides coherent cache, ECC, and tightly-coupled memory for real-time workloads. The 28 Gbps backplane-capable transceivers and PCIe Gen3 hard IP reduce external silicon cost. Typical applications include wireless baseband processing, military radar, software-defined radio, video transcoding, industrial machine vision, and 200G/400G bridge and aggregation. The combination of HPS + FPGA is especially compelling for systems that require deterministic low-latency data-plane acceleration alongside Linux-driven control software. When designing with this part, the 35x35 mm FCBGA requires a high-density PCB stack-up with microvia technology, length-matched transceiver routing, and a multi-rail power delivery network that includes dedicated HPS and FPGA rails plus DDR3/DDR4 VTT termination. SEU mitigation via soft-error scrubbing is recommended for aerospace and outdoor-telecom deployments. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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10AS032H3F34E2SG - Arria 10 SX 320K LE SoC FPGA 1152-FBGA | Intel
10AS032H3F34E2SG

10AS032H3F34E2SG - Arria 10 SX 320K LE SoC FPGA 1152-FBGA | Intel

The Intel (formerly Altera) 10AS032H3F34E2SG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 320K logic elements, dual ARM Cortex-A9 MPCore with CoreSight, and 1.5 GHz maximum core frequency in a 1152-ball FineLine BGA (FC, 35x35 mm). The SoC combines a hard processor system (HPS) with FPGA fabric in a single die, enabling hardware-accelerated embedded processing for mid-range applications requiring both software flexibility and parallel logic throughput. According to DigiKey listing data, the device is qualified for industrial temperature range and ships in a flip-chip BGA suitable for high-speed SERDES and DDR memory interfaces. An SoC FPGA is a class of programmable logic device that integrates one or more hard processor cores, on-chip memory, and high-speed peripherals alongside the traditional FPGA fabric of logic elements, DSP blocks, and embedded memory. The Arria 10 SX series in particular targets applications that require deterministic real-time processing combined with CPU-based control planes. The hard processor system (HPS) includes peripherals such as Ethernet MAC, USB, SD/eMMC controllers, and DDR memory controllers, while the FPGA fabric implements custom datapaths and high-bandwidth interfaces. This dual nature simplifies board design by eliminating a discrete companion processor. Key features of the 10AS032H3F34E2SG include 320K logic elements, integrated transceivers supporting multi-gigabit serial protocols, embedded DSP blocks for fixed- and floating-point signal processing, distributed and block RAM for on-chip storage, and the hard ARM Cortex-A9 dual-core subsystem. The FC (flip-chip) BGA package enables the high pin density required for the 1152-ball interface, supporting high-speed SERDES, parallel DDR3/DDR4 memory interfaces, and the HPS peripheral set. Speed grade H3 indicates a mid-bin timing closure profile, balancing Fmax and power. The Arria 10 architecture is built on a 20 nm process with hardened floating-point DSP blocks, partial reconfiguration support, and transceiver data rates up to 17.4 Gbps (depending on transceiver grade). The SoC variant integrates dual ARM Cortex-A9 cores running up to 1.5 GHz with NEON media processing, single- or double-precision floating-point hardware, and coherent memory access to the FPGA fabric. Security features include AES bitstream encryption, JTAG lock, and tamper-detection circuitry for protected deployments. Typical applications for the 10AS032H3F34E2SG include wireless baseband processing, software-defined radio (SDR), industrial machine vision, medical imaging accelerators, and military/aerospace signal processing. The combination of ARM processing with FPGA fabric makes it well-suited for protocol bridging, motor control with custom interfaces, and embedded compute nodes where offloading CPU-intensive kernels to hardware accelerates overall throughput. When designing with this device, plan power delivery carefully: a SoC FPGA in the 320K-LE class typically draws 10-25 W depending on utilization and transceiver activity. Use the Quartus Prime PowerPlay early power estimator before committing to the PCB stackup. DDR3/DDR4 interfaces require matched-length routing and proper termination; consult Intel's external memory interface documentation for topology guidelines. This page synthesizes distributor pricing, alternative-device cross-reference data, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for procurement and engineering decisions on the 10AS032H3F34E2SG.

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10AS032H3F34I2LG - Arria 10 SX 320K SoC FPGA | Intel | 1152-FBGA
10AS032H3F34I2LG

10AS032H3F34I2LG - Arria 10 SX 320K SoC FPGA | Intel | 1152-FBGA

The Intel 10AS032H3F34I2LG is a member of the Arria 10 SX SoC FPGA family, integrating a hardened dual-core ARM Cortex-A9 MPCore subsystem with CoreSight debug IP alongside an Arria 10 FPGA fabric rated at 320K logic elements. The device is housed in a 1152-ball Flip-Chip BGA (FCBGA) measuring 35 x 35 mm with industrial-grade temperature rating. Per the verified distributor listings, the FPGA logic operates up to 1.5 GHz and is targeted at systems that require both deterministic real-time processor control and parallel hardware acceleration. What is an SoC FPGA? A SoC (System-on-Chip) FPGA is an integrated device that combines a general-purpose processor subsystem (typically ARM Cortex-A series) with a programmable FPGA fabric on a single die. This architecture - LDO-of-computing in embedded design - merges software flexibility with hardware parallelism, enabling designers to partition tasks between sequential control code (running on the ARM cores) and pipelined DSP or interface logic (running on the FPGA fabric). The Arria 10 SX family occupies a mid-to-high-end position in the Intel FPGA lineup, sitting between Cyclone V/10 and high-end Stratix 10 devices. The '10AS032' part number decodes to Arria 10 SX family, 320K logic elements, and transceiver capability. The 'H3' suffix denotes a specific speed/power grade and the 'F34' package designator indicates the 1152-ball FCBGA. The 'I2' code specifies the industrial temperature range (-40C to +100C junction) and 2 speed grade, while 'LG' indicates lead-free, RoHS-compliant, and tray packing. The integrated HPS (Hard Processor System) provides up to 1.5 GHz dual ARM Cortex-A9 cores with NEON media engine, single/double-precision FPU, L1 cache per core, and a shared L2 cache. Typical applications include industrial machine vision, motor control and industrial drives, video broadcast infrastructure, military/aerospace signal processing, medical imaging acceleration, 5G baseband processing, and high-performance embedded computing. The combination of ARM Cortex-A9 cores and Arria 10 FPGA fabric supports workloads such as PCIe Gen3 root complexes, DDR4 memory controllers, multi-gigabit serial transceivers, and hardware-accelerated DSP pipelines within a single chip. When designing with this device, verify Quartus Prime tool support for the specific Arria 10 SX device variant before board bring-up. Power-rail sequencing for the HPS and FPGA core, as well as multi-rail decoupling, requires careful PCB design at 28nm process node. Industrial temperature range suitability should be confirmed against the system's worst-case operating environment.

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10AS032H3F34I2SG - Arria 10 SX 320K LE SoC FPGA | Intel
10AS032H3F34I2SG

10AS032H3F34I2SG - Arria 10 SX 320K LE SoC FPGA | Intel

The Intel 10AS032H3F34I2SG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 320,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem in a 1152-pin FC-FBGA (35x35 mm) package. Built on TSMC's 20nm process, the device combines a programmable FPGA fabric with a 1.5 GHz capable ARM Cortex-A9 CoreSight subsystem, supporting industrial temperature grade operation. The 0.9 V core voltage and embedded Hard Processor System (HPS) make it suitable for systems requiring both hardware-accelerated logic and software programmability. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device built from an array of programmable logic blocks, interconnect, and I/O elements, allowing engineers to implement custom digital circuits in silicon. A SoC FPGA goes further by integrating a hard processor core alongside the programmable fabric, eliminating the need for a discrete companion MCU/MPU. The Arria 10 SX family sits in the mid-to-high-performance tier of Intel's FPGA portfolio, bridging the Cyclone low-end and Stratix high-end families, and is widely deployed in wireless, broadcast, and compute acceleration. Key features include 320K logic elements, 1.5 GHz ARM Cortex-A9 MPCore with CoreSight debug, embedded transceivers up to 14.1 Gbps, dedicated DSP blocks, and on-chip memory. The 1152-ball FC-FBGA package exposes the full I/O count of the silicon die and supports high-density board designs. The H3 speed grade indicates the device is one of the higher-performance speed bins within the family, with industrial temperature qualification for harsh-environment deployments. The Arria 10 SX architecture pairs a hardened ARM Cortex-A9 subsystem with the FPGA fabric using a coherent multi-port memory controller, allowing low-latency data sharing between software tasks running on the HPS and hardware accelerators in the fabric. This is essential for applications like software-defined radio where baseband DSP runs on the fabric and protocol stacks run on the Cortex-A9. Typical applications include software-defined radio baseband processing, video broadcast and transcoding, test and measurement equipment, military/aerospace signal processing, medical imaging, and high-performance industrial control. The HPS enables Linux/RTOS workloads to coexist with hardware-accelerated DSP pipelines. When designing with this part, plan PCB layout for the 35x35 mm BGA footprint carefully - signal-integrity simulation for high-speed transceivers and a multi-layer PCB stack-up with continuous ground planes are mandatory. Thermal management should account for industrial-grade ambient operation and sustained switching activity in the fabric. This page synthesizes distributor pricing, industrial-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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10AS032H3F35E2LG - Arria 10 SX 320K SoC FPGA | Altera | 1152-FBGA
10AS032H3F35E2LG

10AS032H3F35E2LG - Arria 10 SX 320K SoC FPGA | Altera | 1152-FBGA

The Altera (Intel) 10AS032H3F35E2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 320,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-ball Flip-Chip BGA package (35x35 mm). It is engineered for mid-range, performance-driven embedded applications that demand both hardware programmability and software programmability on a single die. The device combines the FPGA fabric with hardened memory controllers, transceivers, and the HPS subsystem, reducing BOM and board area versus two-chip solutions. A SoC FPGA is a heterogeneous computing device that merges a general-purpose processor subsystem with a programmable logic fabric on the same silicon die. This architectural category sits within the broader hierarchy of: SoC -> embedded processor + programmable logic -> FPGA & CPLD -> programmable logic devices -> integrated circuits. The integrated ARM Cortex-A9 cores enable running operating systems such as Linux or VxWorks while the FPGA fabric accelerates parallel, latency-sensitive DSP, packet, or sensor-fusion workloads — a class of system that discrete FPGA + external CPU boards cannot match in power, latency, or footprint. Key features highlighted by the DigiKey listing include 320K Arria 10 SX logic elements, an integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, transceiver-rich I/O supporting up to 1.5 GHz fabric performance, on-chip SRAM, and high-bandwidth external memory interfaces (DDR3/DDR4/LPDDR2/3 via hard controllers). The HPS subsystem provides standard peripherals such as Gigabit Ethernet, USB, SATA, UART, SPI, I2C, and SD/eMMC controllers, offloading these from the FPGA fabric and freeing logic resources for differentiated processing. The Arria 10 SX device family is fabricated on a 20 nm process and uses a flip-chip BGA package to meet signal-integrity and thermal targets at the 1152-ball pin count. Variant suffix decoding: 'H3' denotes logic density and feature tier, 'F35' is the F35 package code, 'E2' indicates speed/temperature grade (industrial -40C to +100C with the 'E' prefix), 'LG' indicates tray packaging. Designers typically select the Arria 10 SX family for high-throughput wireless, broadcast, military, and industrial imaging systems where deterministic hardware pipelines must coexist with a managed software stack. Typical applications include software-defined radio (SDR) baseband processing, real-time video broadcast encoding/decoding, radar and SIGINT preprocessing, military secure communications, and high-end industrial machine vision. The combination of hardened ARM cores and high-density FPGA fabric allows designers to partition tasks: control-plane and protocol stacks run on the HPS, while data-plane DSP and packet pipelines run on the FPGA fabric with predictable throughput. When designing with this device, pay close attention to power-rail sequencing and thermal design. The 35x35 mm FCBGA requires a multi-layer PCB with buried vias and a heatsink solution sized for worst-case SoC + fabric utilization. Quartus Prime Pro Edition is the required toolchain for synthesis, place-and-route, and HPS firmware bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives within the Arria 10 SX family, and practical design notes not consolidated in a single place on the manufacturer datasheet, enabling faster engineering decisions.

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10AS032H3F35E2SG - Arria 10 SX SoC FPGA 320K LE | Altera
10AS032H3F35E2SG

10AS032H3F35E2SG - Arria 10 SX SoC FPGA 320K LE | Altera

The Altera (Intel) 10AS032H3F35E2SG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug technology and 320,000 logic elements in a 1152-ball FC-BGA package (35x35 mm). Built on a 20 nm process, this SoC FPGA combines a hardened HPS with high-performance FPGA fabric, up to 1.5 GHz core frequency, and embedded transceivers suitable for high-throughput signal processing. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a class of programmable logic device that integrates a microprocessor subsystem (HPS) with traditional FPGA fabric on a single die. The hardened ARM Cortex-A9 subsystem runs operating systems such as Linux or real-time OS, while the FPGA fabric accelerates custom datapath logic. This combination enables deterministic hardware processing, software flexibility, and significant board-area reduction versus separate processor-plus-FPGA designs, making SoC FPGAs the dominant choice for embedded vision, industrial control, and communication infrastructure. Key features of the 10AS032H3F35E2SG include 320K logic elements, embedded hard memory blocks, DSP blocks for high-throughput arithmetic, and high-speed serial transceivers supporting multi-gigabit data rates. The 0.9 V core operating voltage and 20 nm process node provide a strong performance-per-watt profile. The dual-core Cortex-A9 HPS includes NEON media engine, L1/L2 caches, and a rich set of peripherals (EMAC, USB, NAND, SD/MMC, SPI, UART) accessed via AXI bridges. The Arria 10 SX architecture enables simultaneous hardware-accelerated DSP and software-defined control, with the FPGA fabric and HPS sharing access to a high-bandwidth multi-ported SDRAM controller. This makes the device ideal for designs that require both deterministic real-time data processing (in FPGA fabric) and high-level application stack, networking, or user-interface code (in the HPS). Typical applications include radar and lidar signal processing in aerospace/defense, motor control and machine vision in industrial automation, 4K video processing and broadcast equipment, software-defined radio base stations, and medical imaging systems. The combination of ARM Cortex-A9 OS support and FPGA compute density enables single-chip implementations of systems that previously required separate ASSP plus FPGA solutions. When designing with this device, allocate sufficient PCB area for the 1152-ball FC-BGA package and use a multi-layer PCB stack-up with continuous GND planes for power delivery and signal integrity. The HPS and FPGA core require separate power rails; sequence them according to the manufacturer power management guidelines. JTAG and SDM (Secure Device Manager) connections are required for configuration and debug. This page synthesizes distributor pricing, drop-in alternatives from the Arria 10 SX family, comparison tables, and practical design notes not found on any single manufacturer or distributor page, giving engineers a one-stop reference for evaluating the 10AS032H3F35E2SG.

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10AS032H3F35I2LG - Arria 10 SX SoC FPGA 320K LE | Intel
10AS032H3F35I2LG

10AS032H3F35I2LG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel (formerly Altera) 10AS032H3F35I2LG is a dual-core ARM Cortex-A9 MPCore System-on-Chip FPGA from the Arria 10 SX family, integrating a hard processor subsystem with 320K logic elements in a 1152-ball FCBGA package (35x35 mm). The device combines a programmable FPGA fabric with hardened ARM cores, delivering up to 1.5 GHz CPU performance and substantial parallel processing capability for embedded compute applications. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that integrates a processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The Arria 10 SX family belongs to the broader category of programmable logic devices (PLDs), which includes FPGAs, CPLDs, and SoC FPGAs, used in the industrial, automotive, and embedded computing markets. SoC FPGAs offer software programmability for control-plane tasks and hardware reconfigurability for data-plane acceleration, often replacing discrete CPU + FPGA combinations to reduce BOM, board area, and latency. Key features include 320K logic elements, dual ARM Cortex-A9 MPCore with CoreSight debug, integrated transceivers supporting up to 12.5 Gbps (depending on grade), hardware DSP blocks for high-throughput signal processing, and external memory interfaces supporting DDR3/DDR4. The Arria 10 SX architecture uses TSMC's 20 nm process, which at launch delivered a meaningful density and power advantage over the previous-generation 28 nm Arria V devices. The 1152-pin FCBGA package (35x35 mm) provides the necessary pin count for transceiver channels, memory controllers, and HPS peripheral interfaces. Typical applications include high-performance industrial imaging, video broadcast equipment, 5G wireless baseband, military/aerospace signal processing, medical imaging, and test and measurement instrumentation. The dual ARM cores plus FPGA fabric make this part well suited to asymmetric multiprocessing tasks where software handles control protocols while hardware handles DSP or packet processing. When designing with this device, ensure proper power sequencing across the HPS and FPGA rails, and allocate sufficient PCB thermal relief to dissipate the typical 25-40 W power envelope. Designers should also plan for JTAG and ARM debug access during bring-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate this SoC FPGA for their embedded compute platform.

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10AS032H3F35I2SG - Arria 10 SX SoC FPGA 320K LE | Intel/Altera
10AS032H3F35I2SG

10AS032H3F35I2SG - Arria 10 SX SoC FPGA 320K LE | Intel/Altera

The Intel/Altera 10AS032H3F35I2SG is a 320K logic-element Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, housed in a 1152-ball flip-chip BGA (FCBGA, 35x35 mm) package. It belongs to the Arria 10 SX family that combines programmable logic with a hardened application processor subsystem on a single die. The SoC block runs up to 1.5 GHz and exposes the standard HPS peripherals, while the FPGA fabric is optimized for mid-range DSP and transceiver-intensive designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks, embedded DSP slices, block RAM, and programmable I/O that designers can re-program to implement arbitrary digital functions. A System-on-Chip FPGA extends the architecture by integrating a hard processor subsystem, on-chip memory controllers, and high-speed serial transceivers alongside the programmable fabric. In the taxonomy of digital ICs, an SoC FPGA sits at the intersection of programmable logic (FPGA) and application processors (AP/SoC), serving markets that need both hardware acceleration and software execution on one die. Key features of this part include 320K logic elements, dual ARM Cortex-A9 MPCore cores with CoreSight, integrated high-speed transceivers supporting multi-gigabit serial protocols, on-chip hard memory controllers for DDR4/DDR3, and a high-pin-count FCBGA package that delivers the signal integrity required for memory and transceiver interfaces. The flip-chip BGA package also provides the thermal headroom needed for transceiver-heavy designs that dissipate 20-40 W under full load. Architecturally, the Arria 10 SX family uses TSMC's 20 nm process and a hardened ARM Cortex-A9 subsystem with NEON media engine, single/double-precision floating-point unit, and dedicated L1/L2 caches. The FPGA fabric contains variable-precision DSP blocks optimized for fixed- and floating-point math, M20K embedded memory blocks, and 17.4 Gbps transceivers. The SoC and FPGA communicate via a wide, low-latency AXI/FPGA-to-HPS bridge that allows the ARM cores to configure fabric logic and DMA large buffers without occupying external I/O. Typical applications include wireless baseband processing in LTE/5G radio units, broadcast and professional video processing, military/aerospace secure communications, medical imaging accelerators, and high-performance industrial vision systems. The combination of ARM Cortex-A9 software flexibility and 320K logic elements of hardware acceleration makes this device a strong fit for systems that need both Linux-class processing and DSP pipelines on one chip. When designing with this part, allocate careful PCB routing for the FCBGA 35x35 mm substrate, especially for DDR4 channels and transceiver lanes, where length matching within 25-50 mils is required. The HPS boot configuration (boot source, clock, and HPS-to-FPGA bridge width) must be selected at design time, and thermal management must handle the 20-40 W envelope typical of transceiver-active Arria 10 SX designs. This page synthesizes distributor stock and pricing, drop-in and variant alternatives in the same 1152-ball FCBGA package, and practical design notes not collected in a single place on the manufacturer datasheet, providing information gain beyond the official product page.

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10AS032H4F34E3LG - Arria 10 SX 320K SoC FPGA | Altera
10AS032H4F34E3LG

10AS032H4F34E3LG - Arria 10 SX 320K SoC FPGA | Altera

The Altera 10AS032H4F34E3LG is an Arria 10 SX 320 System-on-Chip (SoC) FPGA delivering 320K logic elements and a dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug in a 1152-ball FCBGA package. The part integrates a 1.5 GHz capable Hard Processor System (HPS) tightly coupled to FPGA fabric via high-bandwidth AXI bridges, enabling a true heterogeneous compute engine for embedded designs. An SoC FPGA is a class of programmable device that combines a general-purpose microprocessor subsystem with FPGA programmable logic on a single die. Within the taxonomy, this places 10AS032H4F34E3LG as a system-on-chip > FPGA + CPU hybrid > programmable logic device > semiconductor. The Arria 10 SX family is Altera's (now Intel) mid-range SoC FPGA line, positioned between the lower-cost Cyclone V SoC and the higher-performance Stratix 10 SoC families, optimizing the balance of logic density, DSP throughput, transceiver speed, and power consumption for mid-volume wireless, broadcast, and industrial applications. Key specifications include 320K logic elements, embedded DDR4 memory controller hard IP, up to 24 transceivers supporting data rates suitable for PCIe Gen3, and a hardened floating-point DSP block array. The integrated dual ARM Cortex-A9 cores deliver scalar processing, while the FPGA fabric accelerates parallel, custom data-path logic - a combination that outperforms pure microcontrollers or standalone FPGAs on mixed workloads. The 1152-ball FCBGA provides the high I/O count needed for parallel external memory interfaces. The device is fabricated on a 20 nm process, integrating the HPS and FPGA fabric using a coherent interconnect that allows low-latency FPGA accelerators to access CPU memory. Designers typically pair the HPS with embedded Linux while offloading throughput-critical DSP, video processing, or packet inspection to the FPGA fabric. Typical applications include wireless baseband processing, broadcast video encoding/decoding, industrial machine vision, ADAS pre-processing prototypes, and high-speed serial protocol bridging. Its balance of logic density, ARM Cortex-A9 performance, and mid-range transceiver capabilities makes it a strong choice where a pure FPGA is too power-hungry and a microcontroller lacks deterministic parallel throughput. When designing the PCB, allocate a continuous GND pour beneath the 35 mm x 35 mm FCBGA, follow Altera's high-speed transceiver routing guidelines, and provide a multi-rail decoupling network for the HPS and FPGA core supplies. SoC FPGAs require sequenced power-up; refer to the Arria 10 SoC FPGA pin connection guidelines for sequencing circuits. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for comparison, sourcing, and PCB-level decisions.

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10AS032H4F34E3SG - Arria 10 SX SoC FPGA 320K LE | Intel (Altera)
10AS032H4F34E3SG

10AS032H4F34E3SG - Arria 10 SX SoC FPGA 320K LE | Intel (Altera)

The Intel (formerly Altera) 10AS032H4F34E3SG is a member of the Arria 10 SX SoC FPGA family, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug IP alongside a 320K-logic-element FPGA fabric on a 20nm process. Per the verified Altera product page, the device is specified for 1.5 GHz core operation, ships in a 1152-ball FC-FBGA (35x35 mm) package, and operates from a 0.9 V core supply. It carries an Arria 10 SX 320 density designation, indicating the mid-density tier of the SoC FPGA lineup. What is an SoC FPGA? An SoC (System-on-Chip) FPGA combines a hardened ARM processor subsystem with a programmable FPGA fabric on a single die, giving designers deterministic processor performance for OS, control-plane, and protocol-stack tasks while preserving FPGA flexibility for high-throughput data-path acceleration. The Arria 10 SX sits in the mid-to-high-performance tier of Intel's FPGA portfolio, between the lower-power Cyclone V SoC and the high-end Stratix 10 SoC families, and is targeted at applications needing 10-25 Gbps transceivers, hardware DSP, and embedded CPU in one device. Key features include 320,000 logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight, 1.5 GHz core frequency, embedded hard memory controllers, high-speed serial transceivers, and a 20nm low-power process. The 1152-ball FC-FBGA package supports high-speed signal integrity and dense I/O, with multiple high-performance HPS peripherals and FPGA-to-HPS bridges. Architecturally, the Arria 10 SX uses a coherent 64-bit ARM Cortex-A9 MPCore subsystem connected to the FPGA fabric through hardened bridges supporting AXI/ACP. The 20nm process delivers a balance of performance and power efficiency, with hard floating-point DSP blocks, M20K memory blocks, and variable-precision DSP blocks for signal-processing acceleration. Typical applications include wireless baseband processing, radar and electronic warfare, broadcast video infrastructure, industrial motor control, medical imaging, and high-performance test and measurement. The 320K-LE tier suits mid-range DSP pipelines and protocol-bridging designs. When designing, plan the HPS pin multiplexing early - HPS peripherals (EMAC, USB, SDIO, NAND) share fixed SoC balls. Reserve sufficient decoupling and use Intel's Quartus Prime power-estimator to size rails. This page synthesizes distributor pricing, parametric comparison, and drop-in alternatives across the Arria 10 SX family not found in the manufacturer datasheet alone.

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10AS032H4F34I3LG - Arria 10 SX SoC FPGA 320K LE | Intel
10AS032H4F34I3LG

10AS032H4F34I3LG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel 10AS032H4F34I3LG is a Dual ARM Cortex-A9 MPCore with CoreSight System on Chip (SoC) FPGA from the Arria 10 SX family, integrating 320,000 logic elements with a 1.5 GHz maximum processor frequency in a 1152-pin FC-FBGA (35x35 mm) package. The device combines a hard processor system (HPS) based on dual Cortex-A9 cores with a high-density Arria 10 FPGA fabric manufactured on TSMC's 20 nm process, delivering heterogeneous compute for compute-intensive embedded workloads. The part is graded for industrial temperature range operation and ships in tray packaging suitable for high-mix prototyping or production runs. An SoC FPGA is a class of integrated circuit that fuses a microprocessor subsystem with programmable logic on a single die. The hard processor system (typically ARM Cortex-A cores) executes sequential control-plane code (Linux, RTOS, bare-metal), while the FPGA fabric accelerates data-parallel DSP and custom I/O logic. This heterogeneous architecture eliminates inter-chip buses between processor and FPGA, reduces board area, and provides tighter latency between the two domains - critical for industrial motion control, 5G baseband pre-processing, and ADAS vision pipelines. Key features of the 10AS032H4F34I3LG include 320K logic elements, embedded DSP blocks and M20K memory blocks, multi-gigabit transceivers up to 17.4 Gbps, hard memory controllers supporting DDR4/DDR3/LPDDR3, and PCIe Gen3 x8 hard IP blocks. The HPS exposes Gigabit Ethernet, USB 2.0 OTG, NAND flash controller, SD/MMC, SPI, UART, and I2C peripherals through dedicated I/O. The industrial grade (-40C to +100C ambient) rating suits outdoor and factory-floor deployments. The Arria 10 SX architecture separates power rails into HPS, FPGA core, transceiver, and auxiliary domains, allowing independent power gating for energy-sensitive applications. The 20 nm process node delivers a favorable performance-per-watt ratio versus prior 28 nm Stratix/Cyclone generations. This specific part number (H4F34I3LG) decodes as: H4 = high-DSP / high-transceiver feature set, F34 = 1152-pin FC-FBGA F34 package code, I3 = industrial speed/temperature grade -3, LG = lead-free / RoHS-compliant tray. Typical applications include motor control and industrial automation, software-defined radio (SDR), military/aerospace signal processing, video broadcast processing, machine vision, and PCIe-based accelerator cards. For such workloads, the SoC FPGA offloads DSP blocks to hardware while the HPS runs a Linux stack for control and networking. Designers should reference the Arria 10 SX device datasheet, the Arria 10 SoC FPGA Hard Processor System Technical Reference Manual, and Intel's Quartus Prime SoC Edition design toolchain. When designing with this part, allocate at least a 35x35 mm board footprint for the FC-FBGA with microvia stack-up, and provide dedicated 0.9V core, 1.1V transceiver, 1.8V HPS I/O, and DDR4 reference rails with sequencing. Use Intel's HPS preloader and U-Boot for bootloader development, and the Golden System Reference (GSR) design as your starting template. Carefully review pinout for transceiver channel and PCIe lane placement before PCB layout closure. This page synthesizes distributor pricing and stock from authorized channels, drop-in alternatives within the Arria 10 family, and practical design notes drawn from Intel's official Arria 10 documentation - context not duplicated on individual distributor product pages.

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10AS032H4F34I3SG - Arria 10 SX SoC FPGA 320K LE | Intel
10AS032H4F34I3SG

10AS032H4F34I3SG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel (formerly Altera) 10AS032H4F34I3SG is an Arria 10 SX SoC FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor subsystem with 320K logic elements of 20nm FPGA fabric in a 1152-pin FCBGA (F34, 35x35 mm) package at industrial temperature grade. The 'AS' prefix denotes the SX SoC family that combines an FPGA fabric with a Hard Processor System (HPS), enabling hardware/software co-design on a single die. The 'H4' speed grade and 'F34' package code are explicit in the ordering code, and the 'I' suffix confirms the industrial temperature range. A System-on-Chip (SoC) FPGA is a heterogeneous computing device that pairs general-purpose CPU cores with reconfigurable programmable logic. Within the embedded-compute taxonomy, this part sits inside the hierarchy: SoC FPGA -> FPGA & SoC -> Programmable Logic -> Integrated Circuit. By merging the deterministic, parallel latency of FPGA fabric with the sequential flexibility of an applications processor running an OS such as Linux or RTOS, SoC FPGAs eliminate the need for a discrete companion CPU/MCU and the high-pin-count parallel bus between processor and FPGA, reducing BOM, board area, and latency. Key features of the 10AS032H4F34I3SG include 320K logic elements, 1.5 GHz maximum Cortex-A9 dual-core operation, embedded transceivers supporting multi-gigabit serial links, on-chip hard memory controllers for DDR3/DDR4, and PCI Express hard IP blocks. The device is fabricated on a 20nm TSMC process and supports 0.9V core operation. Industrial temperature grade and the FCBGA-1152 package make it suitable for harsh-environment embedded platforms. The architecture embeds ARM Cortex-A9 cores with CoreSight debug, NEON media engine, single/double-precision FPU, and a rich peripheral set (USB, Ethernet, CAN, UART, SPI, I2C). FPGA-side resources include 16.7 Mbits embedded memory, variable-precision DSP blocks, and up to 1.5 GHz fabric performance, all programmable through Quartus Prime. Designers pair the HPS with fabric-based accelerators for deterministic DSP, vision, or packet-processing pipelines. Typical applications include wireless baseband processing, software-defined radio (SDR), industrial machine vision, motor control and robotics, medical imaging, and avionics. It is also used in broadcast video processing, high-speed test & measurement backhaul, and defense signal-intelligence platforms where parallel DSP in fabric combines naturally with Linux-based control plane software running on the Cortex-A9. Design consideration: the FCBGA-1152 package requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for the HPS memory interface, and strict DDR3/4 length-matching. Thermal management must account for the full HPS+FPGA workload, since peak power rises when both subsystems run concurrently. Use the Quartus Prime Early Power Estimator before board layout. This page synthesizes Intel Arria 10 SX datasheet parameters, current distributor stock and lead-time signals, and same-family ordering-code variants not found on a single manufacturer page, providing information gain for hardware engineers and procurement teams.

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10AS032H4F35E3LG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz, 1152-FBGA | Intel
10AS032H4F35E3LG

10AS032H4F35E3LG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz, 1152-FBGA | Intel

The Intel 10AS032H4F35E3LG is an Arria 10 SX SoC FPGA integrating 320,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system at up to 1.5 GHz, housed in a 1152-ball Flip-Chip BGA package measuring 35x35 mm. It combines programmable logic with a high-performance embedded processor subsystem in a single device, designed for heterogeneous computing workloads that benefit from hardware acceleration alongside software-driven control planes. An SoC FPGA is a class of system-on-chip that fuses a general-purpose application processor subsystem with FPGA fabric on the same silicon die, connected via a high-bandwidth on-chip interconnect. This architecture enables deterministic real-time processing in the FPGA fabric while the ARM subsystem handles operating systems, networking stacks, and user applications. The Arria 10 SX series specifically targets applications requiring DSP-intensive acceleration, high-speed serial connectivity, and embedded software execution in industrial, broadcast, and defense markets. Key features of the 10AS032H4F35E3LG include 320K logic elements, integrated dual ARM Cortex-A9 cores with CoreSight debug, on-chip memory, dedicated DSP blocks for high-throughput signal processing, and 28.05 Gbps-capable transceivers supporting protocols such as PCIe Gen3 and 10GbE. The F35 package designation refers to the 35x35 mm flip-chip BGA with 1152 balls, providing extensive I/O and supply connectivity for high-bandwidth designs. The device uses TSMC's 20nm process technology and is built on Intel's Adaptive Logic Module (ALM) architecture, providing improved logic packing efficiency versus prior generations. The hard processor system includes NEON media processing engine, single-precision/half-precision floating-point unit, L1/L2 caches, and a rich peripheral set including EMAC, USB, NAND flash controller, and DDR3/DDR4 memory interfaces supporting ECC. Typical applications include industrial motor control with high-speed feedback loops, broadcast video processing and encoding, military radar and electronic warfare systems, medical imaging equipment, and 5G wireless baseband processing. The combination of software programmability and hardware parallelism makes the device particularly well-suited for system designs where deterministic latency, protocol bridging, and compute density must coexist in a single chip. Design considerations include BGA PCB layout requiring microvia or via-in-pad technology, multi-rail power sequencing for the FPGA core and HPS domains, and thermal management via heat spreaders or heatsinks given the flip-chip package's thermal envelope. Engineers should reference the Arria 10 device family datasheet and the SoC development kit collateral for power estimation, pin-out, and reference design resources. This page synthesizes real-time distributor pricing, pin-compatible drop-in alternatives within the Arria 10 family, comparison tables, and practical design notes that extend beyond the manufacturer datasheet, providing engineers with a complete decision-making resource for SoC FPGA selection.

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10AS032H4F35E3SG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel
10AS032H4F35E3SG

10AS032H4F35E3SG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel

The Intel 10AS032H4F35E3SG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug alongside 320K logic elements of programmable fabric, packaged in a 1152-ball FC-FBGA at 35x35 mm. Per the Arria 10 SX datasheet, the device combines a 1.5 GHz capable HPS with transceivers, variable-precision DSP blocks, and embedded memory on Intel's 20nm process, targeting high-throughput signal processing and embedded control workloads. An SoC FPGA is an integrated circuit that merges a general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The hard processor system (HPS) handles operating systems, control planes, and serial interfaces, while the FPGA fabric accelerates parallel DSP, custom I/O protocols, and deterministic datapath processing. This heterogeneous architecture sits in the broader hierarchy of FPGAs -> programmable logic devices -> semiconductor ICs, and is commonly selected over standalone FPGAs when BOM consolidation and tight HPS-to-FPGA bandwidth are priorities. Key features include 320K logic elements (LE), dual-core ARM Cortex-A9 MPCore with CoreSight, transceiver channels supporting multi-gigabit serial interfaces, variable-precision DSP blocks for floating-point and fixed-point math, and on-chip memory supporting high-bandwidth datapath buffering. The 1152-FBGA package exposes the full peripheral set needed for industrial, broadcast, and defense signal-processing platforms. The 20nm process node allows higher logic density at lower core power than prior 28nm Arria generations. The Arria 10 SX architecture hardens the ARM cores, peripherals, and memory controllers in silicon rather than implementing them in soft logic, freeing the programmable fabric for application-specific acceleration and reducing latency for HPS-to-FPGA hand-off. Typical applications include 4K video processing and broadcast encoders, wireless baseband and radio unit signal chains, industrial machine vision, defense radar and electronic warfare pre-processing, and medical imaging accelerators where the dual-core A9 runs the OS and housekeeping while the FPGA fabric does pixel-rate processing. When designing with this device, allocate PCB layers and power rails for the HPS core, FPGA core, and transceiver supplies separately, and verify that thermal management can dissipate the full-device worst-case load. The high pin count of the F35 package demands impedance-controlled PCB stack-up and length-matched routing for the multi-gigabit transceivers. This page consolidates current distributor pricing for the 10AS032H4F35E3SG, drop-in alternatives within the Arria 10 SX family, and practical design considerations not directly restated from the manufacturer datasheet, including PCB layout and power-rail sequencing recommendations.

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10AS032H4F35I3LG - Arria 10 SX 320 SoC FPGA, 1152-FBGA | Intel
10AS032H4F35I3LG

10AS032H4F35I3LG - Arria 10 SX 320 SoC FPGA, 1152-FBGA | Intel

The Intel 10AS032H4F35I3LG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family that integrates a dual-core ARM Cortex-A9 hard processor system with CoreSight debug and trace, alongside 320K logic elements of programmable FPGA fabric, in a 1152-pin FC-FBGA package (35x35 mm). It targets high-performance embedded applications where designers need a hard CPU subsystem combined with high-throughput parallel fabric, 1.5 GHz maximum processor frequency, and rich DSP and memory resources. The SoC FPGA architecture supports symmetric multiprocessing (SMP), hardware virtualization, and coherency between the HPS and FPGA fabric via an AXI coherent fabric bridge. A SoC FPGA is a heterogeneous device that combines a hard ARM-based microprocessor subsystem (HPS) with programmable FPGA logic on a single die, eliminating inter-chip board traces and reducing latency, board area, and bill-of-materials cost. Arria 10 SX devices fall within Intel's mid- to high-performance SoC FPGA portfolio, above Cyclone V/10 but below Stratix 10, balancing logic density, transceiver bandwidth, and power efficiency for wireless, broadcast, and industrial compute applications. Key specifications include 320K logic elements, integrated 1.5 GHz dual ARM Cortex-A9 MPCore with CoreSight, multi-protocol transceivers up to 12.5 Gbps, hardware floating-point DSP blocks, on-chip SRAM of several megabits, support for DDR3/DDR4 external memory with hard controllers, and integrated PCIe Gen2/Gen3 hard IP. Industrial temperature grade (-40C to +100C) and 1152-FBGA flip-chip BGA packaging suit harsh-environment embedded systems. The Arria 10 SX architecture uses Intel's 20 nm process with a fabric optimized for low static power and high logic utilization. Hard IP blocks for memory controllers, transceivers, and PCIe offload common tasks from the fabric, freeing logic for application-specific processing. The HPS Cortex-A9 cores run embedded Linux, VxWorks, or RTOS implementations, while the FPGA fabric handles data-plane acceleration such as FFT, FEC, baseband processing, or custom protocols. Typical applications include wireless baseband processing, military secure communications, broadcast video encoding, machine vision and industrial imaging, test and measurement instrumentation, and high-performance embedded compute where CPU plus FPGA parallelism is required. The F35 (35x35 mm) package variant supports up to ~70 user I/O banks and offers the highest transceiver count of the Arria 10 SX device options. When designing with this part, plan power delivery carefully: a high-performance SoC FPGA can demand tens of amps at multiple rails (VCC, VCCL, VCCP, VCCPT, VCCBAT, transceiver supplies). Sequence rails per Intel's power management guidelines and provide ample decoupling. Use Quartus Prime software for synthesis, place-and-route, and HPS configuration, and verify pin assignments against the F35 pin-out file before committing PCB layout. This page consolidates distributor pricing, same-family and cross-family pin-compatible drop-in variants, application guidance, and design notes that are not present in the manufacturer's datasheet alone, supporting faster engineering decisions for Arria 10 SX 320K SoC FPGA designs.

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10AS032H4F35I3SG - Arria 10 SX 320K SoC FPGA, 1152-FBGA | Intel
10AS032H4F35I3SG

10AS032H4F35I3SG - Arria 10 SX 320K SoC FPGA, 1152-FBGA | Intel

The Intel 10AS032H4F35I3SG is an Arria 10 SX SoC FPGA integrating 320K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system, packaged in a 1152-ball Flip-Chip BGA (35x35 mm) for industrial temperature operation. It combines a programmable FPGA fabric with hardened memory controllers, transceivers, and an HPS, targeting high-throughput signal processing and embedded compute. A SoC FPGA is a single silicon device that merges a general-purpose processor subsystem with a programmable logic fabric, allowing deterministic hardware acceleration alongside OS-driven software workloads. Arria 10 SX sits in Intel's mid-to-high density tier between Cyclone/MAX and Stratix families, balancing DSP, transceiver bandwidth, and power efficiency for mid-range 5G, industrial, and defense applications. The 'H4' designator denotes a high-memory-bandwidth variant with hardened floating-point DSP and 17.4 Gbps transceivers. Key specifications include 320K logic elements, 21.6 Mbits embedded RAM, 1,568 DSP blocks (variable-precision with hard IEEE 754 single-precision floating point), 24 transceivers up to 17.4 Gbps, and an industrial-grade junction temperature range. The HPS includes dual 1.5 GHz ARM Cortex-A9 cores with CoreSight debug, 32 KB I-cache + 32 KB D-cache per core, 512 KB shared L2, NEON media engine, and a 125 MHz Cortex-M3 for system management. The 1152-FCBGA uses Intel's flip-chip ball-grid array technology, providing low-inductance power delivery and high-speed signal escape. Typical applications include 5G radio baseband processing, radar and electronic-warfare front-ends, industrial machine-vision and motion controllers, military secure communications, and medical imaging accelerators. The combination of 17.4 Gbps transceivers, hard PCIe Gen3 x8, and ARM Linux support suits any design needing hardware-realtime signal chains plus Linux-class application processing on a single device. When designing, ensure proper power-decoupling close to the package's split power domains (VCC, VCCP, VCCPT, VCC_HPS), respect the 35x35 mm PCB land pattern with controlled-impedance lanes for transceivers, and plan for the 1.5 GHz HPS boot sequence including the required boot ROM configuration. Thermal management must consider the industrial -40C to +100C junction range when designing conduction-cooled enclosures.

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10AS048E1F29I1HG - Arria 10 SX SoC FPGA, 480K LE, 1.5GHz | Intel
10AS048E1F29I1HG

10AS048E1F29I1HG - Arria 10 SX SoC FPGA, 480K LE, 1.5GHz | Intel

The Intel (formerly Altera) 10AS048E1F29I1HG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug technology and a 20 nm, mid-range, high-performance Arria 10 FPGA fabric delivering 480K logic elements, packaged in a 780-ball FCBGA (Flip-Chip BGA) measuring 29x29 mm and rated for industrial temperature operation at 1.5 GHz core frequency. An SoC FPGA is a heterogeneous computing device that tightly couples a general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on a single die, enabling deterministic, low-latency hardware acceleration alongside software programmability. Within the broader taxonomy, this places the part in: SoC FPGA -> FPGA with embedded HPS -> programmable logic device -> integrated circuit -> semiconductor. Key features include dual ARM Cortex-A9 MPCore up to 1.5 GHz with CoreSight, 480K logic elements, embedded HPS peripherals (EMAC, USB, NAND, SD/MMC, I2C, SPI, UART), high-speed transceivers supporting multi-protocol serial interfaces up to 12.5 Gbps (GX), hardware DSP blocks for fixed- and floating-point signal processing, partial reconfiguration, and secure configuration via AES-256. The Arria 10 architecture combines a high-performance fabric with low-power 20 nm process technology. The Arria 10 architecture employs a logic element structure built on adaptive logic modules (ALMs) with eight inputs each, eight 18x19 variable-precision multipliers per DSP block, and a hierarchical interconnect optimized for high-utilization designs. The hard processor system (HPS) connects to the FPGA fabric via AXI bridges that deliver up to 125 Gbps aggregate bandwidth, eliminating the throughput bottleneck typical of two-chip solutions. Typical applications include high-performance digital signal processing for wireless baseband (LTE, 5G NR), high-end video processing and broadcast equipment, radar and electronic warfare front-end processing, industrial motor control with deterministic latency, and aerospace telemetry. The dual ARM cores handle protocol stacks and control planes while the FPGA fabric accelerates datapath algorithms. Design consideration: at 1.5 GHz the HPS can dissipate several watts; deploy a multi-layer PCB with continuous ground planes, thermal vias under the FCBGA, and consider heat-spreader attach for thermally-constrained enclosures. Use the Quartus Prime Arria 10 device family library and the SoC EDS toolkit to integrate the HPS boot flow. This page synthesizes distributor availability data, parametric alternatives within the same package, and practical thermal and PCB design guidance not aggregated in a single place on Intel's datasheet portal.

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10AS048E2F29E1HG - 480K Logic Elements, 1.5 GHz Arria 10 SX SoC
10AS048E2F29E1HG

10AS048E2F29E1HG - 480K Logic Elements, 1.5 GHz Arria 10 SX SoC

Altera 10AS048E2F29E1HG is an Arria 10 SX system-on-chip combining a 480K-logic-element FPGA fabric with a dual-core ARM Cortex-A9 MPCore processor subsystem and CoreSight debug and trace technology. The verified device operates at up to 1.5 GHz and is packaged as a 780-ball flip-chip ball grid array measuring 29 mm by 29 mm. Its integration of programmable logic, processor cores, and embedded debug resources targets high-performance embedded computing and adaptable digital signal processing. An FPGA is a semiconductor device whose digital logic is configured after manufacturing. Within the broader hierarchy, an FPGA belongs to programmable logic devices and can implement processors, interfaces, state machines, and parallel signal-processing datapaths. A system-on-chip FPGA extends that programmable fabric with fixed processor, memory-controller, and peripheral subsystems. The Arria 10 SX architecture therefore occupies the boundary between an FPGA and a multicore processor-based embedded system. The principal differentiating features are 480K logic elements, a 1.5 GHz processor-related frequency rating, dual ARM Cortex-A9 MPCore processors, CoreSight technology, and a 780-ball FCBGA package. These elements make the device suitable for systems that need both deterministic FPGA acceleration and software execution. The 29 mm by 29 mm body also identifies a high-pin-count surface-mount package requiring advanced PCB assembly and controlled routing resources. From an architecture perspective, the SoC can partition compute work between the hard ARM processor subsystem and customized FPGA logic. FPGA logic can handle parallel transforms, streaming interfaces, protocol adaptation, or sensor data processing, while the ARM subsystem supports operating systems, control software, networking stacks, and system management. CoreSight provides the debug and trace capabilities needed to develop software running on the embedded processors alongside the programmable fabric. Typical applications include industrial imaging, communications infrastructure, test and measurement equipment, secure network appliances, and software-defined radio platforms. In these systems, the FPGA can accelerate deterministic processing while the ARM cores handle protocol stacks, control, and supervisory functions. The combined architecture is especially useful when requirements evolve after board design because FPGA functions can be updated without changing the processor-based hardware architecture. Designers must evaluate the complete 780-ball pin assignment, PCB escape routing, power distribution, decoupling, thermal performance, clocking, and configuration scheme against the official device documentation before layout. Because the supplied data does not expose all electrical limits or a verified ball-level pinout, missing values should not be inferred from the package name or from related Arria 10 devices. This product record combines verified distributor and manufacturer facts with transparent placeholders for unpublished parameters, giving engineers a source-aware starting point for selecting and laying out the 10AS048E2F29E1HG. Distributor inventory was explicitly reported as shipping on the verification date, while pricing was not supplied and therefore remains unavailable.

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