FPGA & CPLD
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M2S010-TQG144 - SmartFusion2 SoC FPGA 12K LE 166MHz | Microchip
The Microchip Technology M2S010-TQG144 is a SmartFusion2 System-on-Chip (SoC) FPGA integrating a 166 MHz ARM Cortex-M3 hard processor subsystem with a flash-based FPGA fabric of approximately 12,000 logic elements (10K logic modules / 12KLEs), housed in a 144-pin TQFP package (20x20 mm). The device combines deterministic FPGA logic, an embedded microcontroller, and advanced security features on a single low-power 65 nm process die, targeting secure connectivity, industrial control, and general-purpose I/O expansion designs. A SmartFusion2 SoC FPGA is a heterogeneous computing device that fuses a hard ARM Cortex-M3 processor core, on-chip SRAM and eNVM, debug peripherals, and a reprogrammable FPGA fabric in one package. This integration removes the inter-chip communication latency of a discrete MCU-plus-FPGA design and simplifies the PCB by collapsing what would otherwise be a multi-chip system onto a single 144-TQFP footprint. M2S010 sits at the low-density end of the SmartFusion2 family, with larger siblings (M2S025, M2S050, M2S060, M2S150) scaling up logic and memory. Key features of M2S010-TQG144 include 12KLEs / 12084 cells of flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 subsystem, on-chip 512 KB eNVM and 64 KB SRAM, embedded DDR controllers, multiple high-speed serial transceivers, and hardware cryptographic accelerators for AES, SHA, and ECC. The device operates from a 1.2 V core supply and supports industrial temperature grades, with low static and dynamic power consumption enabled by flash-based non-volatile configuration cells. Typical applications include industrial motor control, secure IoT edge nodes, communications bridging, system management controllers, and PCI Express endpoint designs. The integrated ARM Cortex-M3 allows designers to host control-plane firmware on-chip while the FPGA fabric handles high-bandwidth data-plane logic, data acquisition, or custom peripheral glue logic.
M2S025-VFG400I - SmartFusion2 SoC FPGA, 25K LE, Cortex-M3 | Microchip
The Microchip Technology M2S025-VFG400I is a SmartFusion2 System-on-Chip (SoC) FPGA integrating a 25K-logic-element flash-based FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem running at 166 MHz, housed in a 400-ball VFBGA (17x17 mm) package. Built on a low-power 65 nm flash process, the device delivers approximately 27,696 logic cells, embedded SRAM, DSP blocks, and high-speed serial transceivers while embedding the deterministic ARM Cortex-M3 processor alongside programmable analog. A System-on-Chip (SoC) FPGA is an integrated device that combines a programmable logic fabric with one or more fixed processor cores and, in many families, programmable analog. The hierarchy places SoC FPGA under FPGA & CPLD and alongside conventional microcontroller units. SmartFusion2 specifically integrates a flash FPGA, a deterministic Cortex-M3 hard processor, and an analog compute engine, allowing designers to consolidate what previously required a microcontroller, an FPGA, and a separate ADC-plus-front-end chip onto a single die. Key features of the M2S025 include 43 kbits of embedded SRAM, dedicated DSP blocks, multi-standard SERDES, on-chip user flash, hard Cortex-M3 with 1.6 DMIPS/MHz core performance, and integrated analog-to-digital converters. The -I suffix indicates an industrial temperature grade of -40C to +100C, and the device operates from a 1.2 V core supply with separate PLL and I/O banks. Architecturally, SmartFusion2 uses a 4-input LUT fabric with built-in fracturable DSP and dedicated high-speed SERDES blocks for protocols like PCIe Gen2 and SGMII. The hard Cortex-M3 subsystem includes tightly-coupled SRAM, mpu, and an AHB-Lite matrix that exposes the FPGA fabric as memory-mapped peripherals, providing deterministic real-time interrupt response for industrial control. Typical applications include industrial motor control and motor drive stages, secure communications, general-purpose I/O expansion for industrial PCs and embedded boards, portable instrumentation, and avionics-grade embedded control. Because the M2S025 integrates both programmable analog and digital fabric, it is particularly well suited to mixed-signal acquisition designs. When using the M2S025, plan the PCB layout around the 1 mm pitch BGA with matched-length routing for SERDES lanes and dedicated decoupling per bank. Use Libero SoC design software for place-and-route, and verify pinout against DS0115 since pin tables have been split from the main datasheet.
M2S060TS-FGG484 - SmartFusion2 SoC FPGA 60K LE ARM Cortex-M3 | Microchip
The Microchip Technology M2S060TS-FGG484 is a SmartFusion2 System-on-Chip (SoC) FPGA that integrates an ARM Cortex-M3 hard processor subsystem with 60K logic element (LE) FPGA fabric in a 484-pin FPBGA (FGG484) 23x23 mm package. The device operates at up to 166 MHz on the MCU subsystem and is fabricated on a 65 nm low-power process node with 1.2 V core operation. A SmartFusion2 SoC FPGA is a heterogeneous platform that combines a deterministic microcontroller subsystem with programmable logic on a single die. The Cortex-M3 subsystem includes embedded SRAM, real-time clock, and a complete peripheral set, while the FPGA fabric provides flexible custom logic, DSP blocks, and high-speed SERDES. This integration eliminates inter-chip buses, reduces board area, and provides hardware-software co-design capability for safety-critical and mixed-signal designs. Key features include 60K logic elements (56.5K LEs per Mouser listing), embedded ARM Cortex-M3 with up to 166 MHz operation, 484-pin FPBGA package with 23x23 mm body, 65 nm flash-based process technology, integrated PCIe and Gigabit Ethernet hardening, and low-power operation suitable for industrial and secure applications. The device is rated for extended industrial temperature ranges and includes hardware cryptographic accelerators for secure boot, AES, and RSA. Architecturally, the SoC combines a flash-based FPGA fabric (no external configuration PROM required) with a hardened MCU subsystem, providing instant-on behavior and deterministic interrupt latency. SERDES lanes support up to 1 Gbps data communication, and the device integrates 4 MB of user flash and 64 KB of eNVM for secure key storage. Typical applications include industrial control and motor drives, secure communications gateways, PCIe endpoint bridging, video/image processing, IoT edge nodes, and avionics system management. The SmartFusion2 family's low power and security features make it suitable for defense, medical, and industrial automation designs. When designing with the M2S060TS-FGG484, observe the device's maximum supported I/O toggle rate and derate accordingly for industrial temperature operation. Plan PCB layout to keep SERDES lane lengths matched within the tolerance specified in the datasheet, and provide adequate decoupling for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary). This page synthesizes distributor pricing, drop-in SmartFusion2 alternatives, and practical PCB design notes not found in the manufacturer datasheet.
M4A5-64/32-7JI - ispMACH 4A 64-Macrocell 5V CPLD | Lattice
The Lattice Semiconductor M4A5-64/32-7JI is a 64-macrocell, 32-user-I/O member of the ispMACH 4A family of high-performance E2CMOS 5-V in-system programmable complex programmable logic devices (CPLDs), supplied in a 44-pin Plastic Leaded Chip Carrier (PLCC) package with surface-mount J-leads. It offers 2.5K usable gates, 7.5 ns typical propagation delay (tpd), and an internal operating frequency up to 125 MHz, making it one of the fastest 5-V CPLDs of its generation. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell blocks with a central interconnect matrix, providing deterministic, single-clock-cycle logic with predictable timing. CPLDs sit below FPGAs in the programmable logic hierarchy: they offer fewer gates than FPGAs but provide instant-on operation, superior pin-to-pin timing consistency, and robust 5-V I/O tolerance, which is why they remain preferred for glue logic, bus interfacing, and power-sequencing tasks. Key features include 100% pin-out retention, 100% macrocell utilization, in-system programmability via IEEE 1532 / JTAG, four 36-input PAL blocks with 16 macrocells each, and a global routing pool that delivers fast, predictable signal propagation. The 5-V tolerant I/Os simplify interfacing to legacy TTL/CMOS buses without level shifters. The ispMACH 4A architecture uses Lattice's E2CMOS process with non-volatile storage of the configuration, so the device powers up in a known functional state with no external boot PROM. The four-block, single-pool interconnect fabric delivers uniform 7.5 ns pin-to-pin delays across all I/O combinations. Typical applications include address decoding and bus interfacing in 5-V industrial controllers, glue logic between microprocessors and peripherals, power-supply sequencing logic, and legacy system upgrades that require drop-in 5-V programmable logic with JTAG in-field reprogrammability. When designing with the M4A5-64/32-7JI, observe the 4.75 V to 5.25 V supply range and place 0.1 uF decoupling capacitors adjacent to every VCC pin. Because the part is in-system programmable, expose TDI, TDO, TMS, and TCK to a JTAG header for field updates. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes for engineers migrating away from the obsolete original Lattice part number.
M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
The Microchip Technology (formerly Microsemi) M7AFS600-1FG256 is a Fusion family mixed-signal FPGA offering 600K system gates, an embedded ARM CoreMP7 soft processor core, and 1.5V core operation, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package. The device is fabricated on a 130nm flash-based process and provides 110592 bits of embedded flash configuration memory on-chip. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, allowing designers to implement custom digital circuits without fabricating an ASIC. Within the programmable logic hierarchy, the Fusion family occupies the mixed-signal FPGA tier, adding analog peripherals such as on-chip flash memory, analog-to-digital conversion, and power-management support to standard digital fabric, positioning it as an alternative to mixed-signal ASIC or discrete analog-plus-FPGA solutions. Key features of the M7AFS600-1FG256 include 600K system gates of flash-based programmable logic, an integrated ARM CoreMP7 32-bit processor core, 119 user I/O pins available in the 256-ball package, and core supply voltage of 1.5V (valid operating range 1.425V to 1.575V per distributor data). Flash-based configuration means the device is inherently single-chip, non-volatile, and instant-on at power-up, unlike SRAM FPGAs that require external configuration memory. The Fusion architecture integrates programmable analog blocks supporting power management, smart battery charging, clock generation and management, and motor control functions that previously required discrete analog components. The ARM CoreMP7 core allows embedded software to coexist with hardware logic, reducing bill-of-materials complexity in embedded control designs. The 130nm flash process provides live-at-power-up behavior and non-volatile storage of the design bitstream. Typical applications include industrial power-supply supervision and sequencing, motor control drives, battery-management systems, embedded controllers combining MCU and FPGA roles, and space-constrained systems where a single-chip non-volatile FPGA eliminates external boot devices. A key design consideration is supply-chain lead time: Mouser lists this part as non-stocked with a 16-week lead time, so production planning should secure stock early or evaluate the industrial-temperature M7AFS600-1FG256I variant. Power budgeting should account for the 1.5V core rail plus I/O bank rails. This page synthesizes verified distributor pricing, drop-in alternatives within the same 256-ball footprint, and practical sourcing and design notes not consolidated in the manufacturer datasheet.
M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip
The Microchip (formerly Actel/Microsemi) M7AFS600-1FG256I is a Fusion mixed-signal field programmable gate array (FPGA) delivering 600K system gates with an optional ARM CoreMP7 processor, 119 user I/O, and 256-LBGA packaging in an industrial -40C to +85C temperature grade. It is fabricated on an advanced 130-nm, 7-layer metal flash-based CMOS process. A mixed-signal FPGA is a programmable logic device that combines flash-based digital fabric with configurable analog peripherals, large flash memory blocks, and clock generation circuitry on a single monolithic die. Unlike SRAM FPGAs, flash-based FPGAs are nonvolatile, retaining their configuration when powered off, which places them in the power management and single-chip embedded control hierarchy alongside MCUs and SoCs. Key differentiating features include live at power-up (LAPU) operation for instant-on behavior, up to 350 MHz system performance, integrated configurable analog blocks (ADC, voltage/temperature monitors), and secure nonvolatile flash programming that eliminates the external boot configuration device required by SRAM FPGAs. Technically, the device integrates a 7-layer-metal flash fabric, embedded flash memory blocks, comprehensive clock conditioning circuitry (CCCs with PLLs), and analog peripherals such as a progressive-resolution ADC, making it a genuine single-chip solution for mixed-signal board-level integration. The ARM CoreMP7 soft/hard processor option enables embedded control within the programmable fabric. Typical applications include industrial control and automation, power supply and energy monitoring, medical instrumentation, and test equipment, where combining analog measurement with programmable digital logic reduces BOM count and board area. Design consideration: verify power sequencing and analog reference layout early - the mixed-signal nature demands clean analog ground partitioning unlike pure digital FPGAs. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FG484 - Fusion FPGA 600K Gates 484-BGA | Microchip
The Microchip Technology (formerly Microsemi) M7AFS600-1FG484 is a Flash-based Fusion Field Programmable Gate Array (FPGA) with 600K system gates, an embedded ARM CoreMP7 processor, and 172 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch. An FPGA is a programmable logic device that allows designers to configure digital logic circuits after manufacturing. Unlike SRAM-based FPGAs that lose their configuration at power-off, the Fusion family uses a 130-nm, 7-layer metal Flash-based CMOS process, making it a nonvolatile FPGA that retains its program when powered off and is Live at Power-Up (LAPU). This eliminates the external configuration PROM required by SRAM FPGAs and improves system security and boot time. Key features of the M7AFS600-1FG484 include the ARM CoreMP7 soft processor core running up to the 1282.05 MHz listed operating frequency figure for the -1 speed grade, Flash-based nonvolatile configuration, and a rich mixed-signal capability set typical of the Fusion family (configurable analog blocks including ADCs, voltage/temperature monitoring, and clock management resources). The 484-FBGA surface-mount package supports high-I/O-count system-on-chip integration. Architecture-wise, the device combines programmable fabric, embedded Flash memory, and system peripherals on a single die at the 130-nm node with a 1.5V core supply, enabling single-chip embedded control with custom logic acceleration. Typical applications include industrial automation and control, secure embedded systems, aerospace/defense subsystem prototyping, medical instrumentation, and power/sensor management where in-system reprogrammability and instant-on behavior matter. When designing with this device, plan power sequencing and bank I/O standards early, and reserve adequate decoupling for the 1.5V core rail. This page synthesizes distributor pricing data, drop-in alternatives within the same 484-BGA footprint, and practical design guidance not found in the manufacturer datasheet.
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) M7AFS600-1FG484I is a Fusion mixed-signal Flash FPGA with 600,000 system gates, 172 user I/Os, and 110,592 tiles of programmable logic, housed in a 484-ball Fine-Pitch Ball Grid Array (484 FBGA, 23 x 23 x 2.44 mm) with industrial-grade -40C to +85C (I) temperature rating and 1 speed grade. A Fusion FPGA is a Flash-based, nonvolatile field programmable gate array that integrates programmable logic, embedded flash configuration memory, and mixed-signal peripherals into a single chip. Within the power management hierarchy, the Fusion family occupies the system-on-chip tier below full ASSPs: FPGA fabric plus optional ARM CoreMP7 soft/hard processor support, making it a complete programmable system-on-chip (SoC) rather than a pure digital FPGA. Key features include a nonvolatile Flash-based 130-nm, 7-layer-metal CMOS process that retains its configuration when powered off, and Live at Power-Up (LAPU) operation so the device is functional within microseconds of power application. Unlike SRAM FPGAs, no external boot flash or bitstream loading delay is required. The integrated analog peripherals (voltage/temperature monitoring ADC, user flash memory blocks) support complete single-chip system monitoring and control designs. Technical depth: the M7AFS600 fabric provides roughly 110,592 logic elements organized into versatile logic blocks, supported by embedded SRAM and flash memory blocks. The ARM CoreMP7 processor option enables embedded control alongside the fabric. Supply is a nominal 1.5V core (CMOS logic family), with industrial (I) qualification covering -40C to +85C operation per distributor listings. Typical applications include industrial automation and control, power supply and backplane monitoring, aerospace and defense control electronics, and single-chip embedded systems that previously required separate FPGA plus supervisor plus ADC components. Design consideration: because this is a Flash-based FPGA with 1.5V core supply, verify power-rail sequencing and mixed-voltage I/O bank constraints early in the design; the 484 FBGA requires a carefully planned via-in-pad escape strategy on at least an 8-layer board. This page synthesizes distributor pricing, drop-in alternatives within the M7 Fusion family, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
The Microchip Technology (Actel/Microsemi) M7AFS600-1FGG256 is a Fusion mixed-signal FPGA with 600K system gates, an embedded 32-bit ARM CoreMP7 processor, and 110592 fabric elements, housed in a 256-ball FBGA (FGG256, 17x17 mm) package on a -1 speed grade. A mixed-signal FPGA is a field-programmable gate array that integrates configurable digital logic fabric with analog peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable SoC -> programmable logic device -> semiconductor), Fusion devices from Actel, later Microsemi and now Microchip Technology, were pioneering because they combined flash-based fabric with ADC, RTC, and POR analog blocks, removing external analog components from many embedded designs. Key features of the M7AFS600 include the hard-wired ARM CoreMP7 processor running at high frequency from the 130nm flash process, flash-based nonvolatile configuration (no external boot PROM required and instant-on operation), and integration of analog peripherals such as a multi-channel ADC and programmable low-dropout regulators. The -1 speed grade and commercial temperature variant (0C to +70C) make this suffix cost-optimized for standard embedded applications. Architecturally, the Fusion family is built on Actel's proven flash-based ProASIC3 fabric augmented with analog I/O, giving designers single-chip system management, power sequencing supervision, and fan control alongside custom logic. The 256-ball FGG256 footprint with 17x17 mm ball grid array suits two-layer routing of high-logic-density designs in compact form factors. Typical applications include embedded system controllers, power-supply and board-level health monitoring, industrial automation interfaces, and portable instrumentation where one chip must replace an MCU plus supervisor plus analog front end. Design consideration: flash-based Fusion fabric is live-at-power-up; verify power-rail sequencing for the 1.5V core and 3.3V I/O domains, and confirm the ARM CoreMP7 clock plan against the -1 speed grade timing derating. This page synthesizes distributor availability from Mouser, DigiKey, Octopart, and LCSC, drop-in alternatives from the same Microchip Fusion/ProASIC3 families, and practical design guidance not consolidated in the manufacturer datasheet.
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
The Microchip Technology M7AFS600-1FGG256I is a Flash-based mixed-signal FPGA from the Actel Fusion family, offering 600K system gates, an embedded ARM Cortex-M7 class CoreMP7 processor, 119 user I/O, and a 1.5V core supply, housed in a 256-ball FineGrid FBGA package with industrial temperature rating (-40C to +85C). A mixed-signal FPGA is a field-programmable gate array that integrates configurable logic fabric with analog peripherals and a hard processor core on a single die. Within the power-management hierarchy, the Fusion family combines FPGA fabric, programmable analog (ADC, voltage monitors, comparators), and the ARM CoreMP7 soft-attached processor, replacing an FPGA-plus-MCU-plus-analog-IC multi-chip solution with one nonvolatile device. Key features include the advanced 130-nm, 7-layer-metal flash-based CMOS process, nonvolatile configuration that retains the program when powered off, and Live at Power-Up (LAPU) operation, meaning the device is functional immediately when power is applied. System performance reaches up to 350 MHz, and the flash cells eliminate the external configuration PROM required by SRAM FPGAs. Technically, the fabric is organized with Versatile Tiles and supports the CoreMP7 ARM processor at up to 100 MHz. The analog subsystem integrates a 12-bit ADC, programmable gain amplifiers, temperature and voltage monitors, and programmable current sources, enabling true single-chip system management. The speed grade -1 and the industrial I suffix make this variant suited to extended-temperature embedded control designs. Typical applications include power-supply and board-level system management, industrial control, portable instrumentation, and embedded motor control, where integration of analog monitoring, sequencing, and processor logic reduces board area and BOM count. Design-wise, confirm that 119 I/O meet your pin budget and plan power rails for the 1.5V core and 3.3V I/O banks before locking the pinout in Libero SoC. This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FGG484 - Fusion FPGA 600K Gates | Microchip Technology
The Microchip Technology M7AFS600-1FGG484 is a Fusion® Field Programmable Gate Array (FPGA) with 600K system gates, 172 user I/Os, and 110592 bits of RAM, housed in a 484-pin FBGA package. It operates at a maximum frequency of 1282.05 MHz and is fabricated using 130nm technology with a 1.5V core supply. This device integrates an ARM CoreMP7 soft processor, making it a mixed-signal FPGA suitable for system-on-chip applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. FPGAs are part of the programmable logic device family, which also includes CPLDs and SoC FPGAs. They offer flexibility for prototyping, low-volume production, and applications requiring reconfigurable hardware. The Fusion family specifically combines FPGA fabric with analog blocks, including ADC, DAC, and voltage monitors, enabling mixed-signal designs on a single chip. Key features of the M7AFS600-1FGG484 include 600K system gates, 172 user I/Os, and 110592 bits of embedded RAM. The device supports multiple I/O standards and includes programmable phase-locked loops (PLLs) for clock management. Its 130nm process technology balances performance and power, while the 1.5V core voltage reduces dynamic power consumption. The FBGA-484 package provides a compact footprint with excellent thermal and electrical characteristics. Technically, the Fusion FPGA integrates analog peripherals such as a 12-bit ADC, analog comparators, and voltage regulators, which are not commonly found in standard FPGAs. This integration reduces board space and system cost by eliminating external analog components. The ARM CoreMP7 soft processor can be instantiated in the FPGA fabric to run embedded software, enabling true system-on-chip designs. The device also supports secure programming and has an on-chip security feature to prevent unauthorized readback. Typical applications include industrial control, medical devices, automotive electronics, and communication systems. In industrial control, the M7AFS600-1FGG484 can handle motor control, sensor interfacing, and real-time processing. In medical devices, its analog integration is ideal for patient monitoring and diagnostic equipment. The device's low power and small form factor make it suitable for portable and battery-powered applications. When designing with this FPGA, consider the 1.5V core supply and the need for multiple power rails. Proper decoupling and power sequencing are essential for reliable operation. The device requires configuration at power-up, either from an external SPI flash or via JTAG. Ensure adequate thermal management, as the FBGA package can dissipate significant heat under high utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the M7AFS600-1FGG484.
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
The Microchip Technology M7AFS600-1FGG484I is a Fusion mixed-signal FPGA with 600K system gates, 172 user I/Os, and 110592 bits of total RAM, housed in a 484-ball FBGA package (23x23 mm) rated for -40C to +85C operation from a 1.5V core supply. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices, above CPLDs in capacity, and the Microchip (formerly Microsemi/Actel) Fusion family is distinctive because it integrates analog peripherals, flash-based configuration, and hard ARM CoreMP7 processing into a single mixed-signal programmable platform. Key features of the M7AFS600-1FGG484I include the embedded ARM CoreMP7 microprocessor hard core running at up to 1.28205 GHz nominal family rating, 600K system gates of flash-based logic, 172 user I/Os, and an industrial temperature range of -40C to +85C. The flash-based Fusion fabric retains configuration in non-volatile memory, eliminating the external boot flash and configuration controller required by SRAM FPGAs and improving system security and time-to-first-bit. Technically, the device is fabricated in a 130nm process with a 1.5V core supply (1.425V to 1.575V operating window). The M7 speed grade in the suffix denotes the fastest commercial timing grade of the Fusion family, supporting maximum operating frequencies around 1.28205 GHz for logic paths per distributor parametric data. The FBGA-484 package offers a dense 1.0 mm ball pitch surface-mount footprint for high-IO industrial designs. Typical applications include industrial automation and motor control, avionics and defense systems requiring single-chip secure programmable logic, and instrumentation where on-chip analog plus ARM processing reduces BOM count. Design consideration: verify 16-week manufacturer lead time in production planning and budget core voltage at 1.5V within the 1.425V to 1.575V tolerance band. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-2FG256 - Fusion FPGA, ARM CoreMP7, 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) M7AFS600-2FG256 is a Fusion mixed-signal field programmable gate array (FPGA) with an embedded ARM CoreMP7 processor, 600,000 system gates, 119 user I/O, and 110592 bits of on-chip flash RAM, housed in a 256-ball LBGA (FG256) package measuring 17x17x1.7 mm. Fabricated on a 130 nm flash-based process with a 1.5V core supply, speed grade -2. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that the designer programs to implement custom digital circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above CPLDs in density and below ASICs in unit cost efficiency. The Fusion family from Actel (now Microchip) is unique in combining flash-based FPGA fabric, an ARM hard core, and mixed-signal analog peripherals in a single chip, eliminating the need for external configuration devices. Key features of the M7AFS600-2FG256 include the ARM7-class CoreMP7 hard processor running system logic, 600K system gates of flash-based fabric, 119 available user I/O in the 256-ball FG256 footprint, and non-volatile flash configuration that makes the device instantly operational at power-up with no external boot PROM. Flash programming technology also provides inherent resistance to configuration data corruption and single-event effects compared to SRAM FPGAs. Technically, the Fusion fabric is built on Actel's proven flash-switch architecture at the 130 nm node, combining look-up-table logic, embedded flash RAM blocks, and analog conditioning blocks. The -2 speed grade defines the timing bin for worst-case propagation delays, and the 1.5V core keeps dynamic power moderate while supporting 3.3V I/O signaling. Typical applications include industrial automation and motor control, power supply monitoring and management, portable instrumentation, aerospace and defense subsystems, and medical equipment where mixed-signal integration and instant-on behavior are required. A key design consideration: the FG256 (17x17 mm) package offers fewer I/O than the FG484 variant, so verify that 119 I/O satisfies your pin budget before layout freeze. This page synthesizes verified distributor listings, drop-in alternatives from the Microchip Fusion family, pricing tiers, and practical design guidance not found in the manufacturer datasheet.
M7AFS600-2FG256I - 600K Gate Fusion FPGA | Microchip
The Microchip Technology M7AFS600-2FG256I is a 600K system-gate Fusion mixed-signal field-programmable gate array (FPGA) housed in a 256-ball LBGA package with 119 user I/O and 110,592 logic elements. It operates from a 1.5 V core supply and supports a maximum system performance of 350 MHz. This flash-based, nonvolatile CMOS FPGA is built on an advanced 130-nm, 7-layer-metal process and is capable of live-at-power-up (LAPU) operation. Fusion FPGAs integrate configurable analog front ends, large flash memory blocks, clock generation and management circuits, and high-performance programmable logic on a monolithic device. They form a family within the broader class of field-programmable gate arrays—devices whose logic fabric can be reconfigured in the field to implement custom digital and analog functions. The integrated analog capability is a differentiator when compared with FPGA families that require external analog components and ADC/DAC interfaces. Key features include 600,000 system gates, 119 user I/O pins, 110,592 logic elements, and nonvolatile flash configuration that retains its program when power is off. The -2 speed grade provides a balanced maximum frequency for cost-sensitive designs, while the I suffix denotes the industrial temperature range. The device also supports live at power-up, which eliminates the external boot device and reduces system complexity. Technically, the Fusion architecture combines an FPGA fabric with a 10-bit ADC, analog comparators, and high-voltage I/O support, enabling mixed-signal designs in a single package. The flash-based configuration cells provide instant-on capability and enhanced security over SRAM-based FPGAs. On-chip clock conditioning circuits support PLLs and clock switching for robust timing management. Typical applications include power management and sequencing in server and telecom systems, motor control in industrial drives, smart battery charging, clock generation and management, aerospace/defense signal processing, and medical instrumentation. The integrated analog block and large flash memory make the M7AFS600-2FG256I especially suitable for system management and monitoring. When designing with this device, pay careful attention to supply decoupling on the 1.5 V core and ensure the 1.5 V supply rise time and sequencing meet the requirements for flash programming. Using the on-chip analog blocks for voltage and temperature monitoring can reduce external component count. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a complete decision-making resource for engineers sourcing the M7AFS600-2FG256I.
M7AFS600-2FG484 - Fusion 600K Gate FPGA, 172 I/O | Microsemi
The Microsemi (now Microchip Technology) M7AFS600-2FG484 is a Fusion mixed-signal FPGA delivering 600K system gates with 172 user I/Os and 110592 bits of core logic resources, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.5V core supply. A Fusion FPGA is a field-programmable gate array that integrates programmable fabric with mixed-signal peripherals, flash-based configuration, and ARM processor capability in a single device. Within the power management hierarchy of system design, FPGAs occupy the customizable digital logic layer between fixed-function ASSPs and full ASIC implementations, offering hardware-level parallelism with field upgradability. Key features include the embedded ARM CoreMP7 32-bit processor, 130nm flash-based fabric technology that eliminates external configuration PROMs, and speed grade 2 performance. DigiKey lists this part with 172 I/O and 110592 core cells, and the datasheet references 1470.59 MHz system-level timing capability. The flash-based fabric provides instant-on configuration and inherent immunity to configuration data corruption from radiation or power interruptions, a key advantage over SRAM FPGAs. The M7AFS600 architecture combines the ProASIC3-class fabric with analog peripherals including voltage and current monitoring via on-chip analog-to-digital converters, enabling power-supply supervision and thermal management without external circuitry. Security features include flash lock and AES-based bitstream protection for design IP protection. Typical applications include industrial automation controllers, military and aerospace subsystems, medical instrumentation, power-line monitoring, and communications infrastructure requiring configurable logic plus analog system health monitoring. A key design consideration: the FG484 (standard) versus FGG484 (Pb-free) suffix must match your soldering profile, and the -2 speed grade is slower than grade 1 parts but lower power; verify timing closure in Libero IDE for grade 2. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
The Microchip Technology M7AFS600-2FG484I is a Fusion family flash-based FPGA delivering 600,000 system gates, 110,592 D-type flip-flop logic elements, and 172 user I/Os in a 484-ball Fine-Pitch BGA (1.0 mm pitch) package. It operates from a 1.5V core supply and carries the industrial-grade temperature designation. A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip nonvolatile flash memory cells rather than an external configuration PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs occupy the same role as SRAM FPGAs but offer instant-on behavior and higher configuration security because no bitstream is loaded externally at power-up. Key features include the nonvolatile flash fabric that retains the program when powered off, Live at Power-Up (LAPU) operation so the design is active within microseconds of power application, and an advanced 130-nm, 7-layer-metal flash-based CMOS process. The device also supports an optional ARM CoreMP7 soft processor, allowing embedded control and user logic to coexist on one chip. Architecturally, the M7AFS600 fabric combines VersaTiles - fine-grained logic tiles usable as look-up tables or D flip-flops - with dedicated block RAM and flash configuration storage. The 130-nm process balances density, static power, and flash-cell endurance, while the 1.5V core supply limits dynamic dissipation. The -2 speed grade supports internal fabric clocking in the hundreds of MHz range; the exact maximum fabric frequency for this speed grade should be confirmed in the manufacturer datasheet. Typical applications include industrial control and automation, embedded system controllers, secure or tamper-resistant designs where configuration data must remain private, aerospace and defense sub-systems benefiting from instant-on behavior, and bridge/interfacing logic between processors and custom peripherals. When designing with this device, plan the power tree around the 1.5V core plus separate I/O bank rails, and use Microchip (Microsemi) Libero SoC tools for synthesis and programming - the toolchain is family-specific and not compatible with other FPGA vendors' software. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and practical design notes not found in a single manufacturer datasheet.
M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
The Microchip Technology (Microsemi) M7AFS600-2FGG256 is a Fusion mixed-signal FPGA with 600K system gates, an embedded ARM CoreMP7 soft/hard processor subsystem, 119 user I/Os, and 110592 bits of dedicated logic resources, housed in a 256-ball FBGA (LBGA, 17x17 mm) package. Fabricated on a 130 nm flash-based process, it operates from a nominal 1.5 V core supply (1.425 V to 1.575 V) across a commercial 0C to +70C temperature range. A Fusion FPGA is a field programmable gate array that integrates programmable logic with configurable analog blocks, flash-based configuration memory, and an ARM processor core in a single device. FPGAs sit within the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> embedded system IC), enabling designers to implement custom digital logic and soft peripherals without ASIC mask costs. Key features include the ARM CoreMP7 processor running at up to 100 MHz for embedded control, flash-based nonvolatile configuration that eliminates external boot PROMs and simplifies security, 119 user I/Os for board-level connectivity, and support for mixed-signal integration unique to the Fusion family. The -2 speed grade balances performance with cost for mid-range designs. Technically, the device uses a sea-of-modules fabric with VersaTile logic elements, embedded SRAM blocks for FIFO and memory functions, and the Fusion analog subsystem that supports voltage, current, and temperature monitoring from on-chip rack circuits. The flash configuration cell technology provides instant-on operation and high resistance to configuration readback attacks compared with SRAM FPGAs. Typical applications include industrial automation controllers, embedded system-on-chip prototyping, power-supply management and telemetry, and defense or instrumentation systems requiring single-chip mixed-signal integration. The 256-FBGA footprint suits space-constrained boards needing high I/O density. Design consideration: the commercial temperature range (0C to +70C) limits use in harsh environments; select the I-suffix variant for -40C to +100C operation. Verify 1.5V core rail sequencing against the power-up specification. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
The Microchip Technology M7AFS600-2FGG256I is a Fusion mixed-signal FPGA with 600,000 system gates, 119 user I/O, and an optional ARM CoreMP7 processor support, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package with 1.0 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks connected by programmable interconnects that designers reconfigure after manufacturing. The Fusion family extends this concept into the mixed-signal domain by integrating programmable analog peripherals and flash-based configuration memory onto one die, positioning it above simple CPLDs and alongside full SoC solutions in the programmable-logic hierarchy. Key features include nonvolatile flash-based configuration that retains the program when powered off and enables Live at Power-Up (LAPU) operation, a 130-nm seven-layer-metal flash-based CMOS process, and single-chip integration that removes external configuration PROMs from the bill of materials. The device supports 350 MHz system performance and can host the ARM CoreMP7 soft processor for embedded control. Architecturally, the Fusion fabric combines flash switch technology with programmable analog blocks such as voltage, temperature, and current monitoring channels, allowing analog supervisory functions and digital logic to reside on one die. This reduces board area and improves system reliability versus discrete MCU-plus-CPLD solutions. Typical applications include industrial automation and motor control, power-supply supervision and telemetry, portable instrumentation, and aerospace/defense systems requiring instant-on, high-reliability programmable logic. A key design consideration is the 1.5 V core supply: sequence the power rails and provide adequate decoupling near the FBGA balls, since flash-programming and core currents concentrate on dedicated power balls. This page synthesizes distributor pricing, same-family drop-in speed-grade and temperature-grade alternatives, and practical design notes not consolidated in the manufacturer datasheet.
M7AFS600-2FGG484 - Fusion FPGA 600K Gates | Microchip Technology
The Microchip Technology M7AFS600-2FGG484 is a Fusion Field Programmable Gate Array (FPGA) from the Fusion family, offering 600K system gates and 110,592 bits of flash memory. It operates at a core voltage of 1.5V and is housed in a 484-pin FBGA package with a 1mm pitch. This device integrates programmable analog, flash memory, and FPGA fabric, making it a versatile mixed-signal solution. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing. FPGAs consist of configurable logic blocks, programmable interconnects, and I/O blocks, allowing designers to implement custom digital logic. The Fusion family adds flash memory and analog blocks, enabling system-on-chip integration for mixed-signal applications. Key features include 172 user I/Os, a maximum operating frequency of 1470.59 MHz, and 130nm process technology. The device supports 1.5V core voltage and includes embedded flash memory for non-volatile storage. The Fusion architecture provides a unique combination of FPGA flexibility with analog and memory resources, reducing board space and system cost. Technically, the M7AFS600-2FGG484 integrates a 32-bit ARM Cortex-M3 (CoreMP7) soft processor, programmable analog blocks (including ADCs, DACs, and comparators), and flash memory. This allows designers to implement complete mixed-signal systems on a single device. The 484-pin FBGA package provides ample I/O for complex designs. Typical applications include motor control, power management, industrial automation, and medical devices. The integrated analog and flash memory make it ideal for applications requiring precise analog monitoring and non-volatile data storage. The 172 I/Os support a wide range of interfaces. When designing with this device, consider the 1.5V core supply and the need for proper decoupling. The flash memory can be programmed in-system, enabling field updates. The analog blocks require careful layout to minimize noise. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M7AFS600-2FGG484.
M7AFS600-2FGG484I - 600K-Gate Fusion FPGA, 172 I/O | Microchip
The Microchip Technology (Microsemi) M7AFS600-2FGG484I is a Fusion mixed-signal FPGA from the Fusion family with 600K system gates, 172 user I/O, and a 1.5V core supply, housed in a 484-ball FBGA (484-BGA) package with 1.0 mm ball pitch. It integrates an ARM CoreMP7 soft-capable processor architecture support, flash-based configuration fabric built on 130nm technology, and an industrial operating temperature range of -40C to +85C, making it suitable for space-constrained embedded control and mixed-signal system integration. A Fusion FPGA is a flash-based field programmable gate array that combines programmable logic fabric with mixed-signal peripherals such as analog-to-digital conversion, voltage/temperature monitoring, and RTC functionality on a single die. Within the system hierarchy, FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware parallelism with in-field reconfigurability. The Fusion family was originally developed by Actel, later Microsemi, and is now sold under the Microchip Technology brand. Key differentiating features include nonvolatile flash programming (no external configuration PROM required at power-up, instant-on operation), live probe/debug capability, and integrated analog subsystem blocks that reduce external component count. The -2 speed grade supports system frequencies up to 1470.59 MHz internal equivalent timing as listed by distributors, and the 484-FBGA footprint provides generous routing escape for the 172 I/O. Technically, the device uses 130nm flash-based fabrication with 110592 bits of distributed resource as reported by DigiKey listing data, plus embedded blocks suitable for soft ARM CoreMP7 processor instantiation. The M7 prefix denotes the military/extended temperature screening variant of the AFS600 Fusion device; the I suffix denotes the industrial -40C to +85C range. Typical applications include industrial automation controllers, medical instrumentation, communications line cards, avionics interfaces, and test equipment, where single-chip integration of logic, analog monitoring, and processing lowers BOM cost and board area. When designing with this part, plan power sequencing around the 1.5V core and 3.3V I/O banks, and verify FBGA reflow profiles per the manufacturer packaging data. This page synthesizes distributor pricing, same-brand drop-in alternatives, and design notes not found in a single manufacturer datasheet.
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
The Microchip (Microsemi/Actel) M7AFS600-FG256 is a Fusion family mixed-signal FPGA with 600K system gates, 119 user I/O, and 110592 D-type flip-flops, housed in a 256-ball LBGA (FBGA, 17x17x1.7 mm) package operating at a 1.5 V core supply. It integrates an ARM CoreMP7 processor, Flash-based fabric, and analog peripherals such as ADC blocks on a 130 nm process. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. Within the programmable-logic hierarchy, the Fusion family sits in the mixed-signal FPGA class: unlike standard FPGAs, it adds analog building blocks (ADCs, voltage/temperature monitoring) and Flash-based configuration storage, making it a system-on-chip-style power management and control platform. Key features include the embedded ARM CoreMP7 32-bit processor core for soft-control functions, 600K system gates of programmable fabric, 119 user I/O pins brought out on the 256-ball substrate, and integrated analog mixed-signal capability that offloads external supervisory components. Flash-based configuration means the device is instant-on, non-volatile, and inherently more secure against bitstream interception than SRAM FPGAs. Technically, the device is fabricated on a 130 nm Flash process with a 1.5 V core operating supply. The commercial-grade M7AFS600-FG256 is rated for 0 C to +70 C operation; the industrial -40 C to +85 C variant carries the -I suffix (e.g., M7AFS600-FG256I). Per Microsemi documentation, all devices within the same package are pin compatible, which simplifies family migration. Typical applications include power-supply management and board-level monitoring, industrial control and motor supervision, portable instrumentation, and embedded systems requiring an instant-on processor plus FPGA fabric in one die. Design consideration: budget the 1.5 V core rail carefully with adequate decoupling, and verify that the 119 available I/O meet your bank voltage requirements before finalizing the 256-ball footprint. This page synthesizes distributor pricing (as of 2026-09-02), drop-in alternatives within the Fusion/ProASIC3 FG256 ecosystem, and practical design notes not found in the manufacturer datasheet.
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
The Microchip Technology M7AFS600-FG256I is a Fusion mixed-signal FPGA offering 600K system gates, 119 user I/O, and an embedded ARM CoreMP7 processor, housed in a 256-ball FBGA package rated for industrial temperatures of -40C to +85C with a 1.5V core supply. A mixed-signal FPGA is a field-programmable gate array that integrates configurable analog circuitry, flash memory, and programmable digital logic on a single monolithic die. Within the power-management hierarchy of programmable logic devices, Fusion occupies the system-on-chip tier, sitting above pure-digital FPGA families like ProASIC3 by adding analog peripherals and embedded flash. This makes it a predecessor concept to today's mixed-signal programmable SoCs. Key features include flash-based programmable logic that is instant-on and non-volatile (no external configuration PROM required), integrated analog peripherals for monitoring and control, comprehensive on-chip clock generation and management circuitry, and the ARM CoreMP7 soft processor for embedded control. The 130nm flash technology gives the device high design security compared to SRAM FPGAs. Technically, the Fusion family combines large flash memory blocks with the programmable fabric, allowing designers to store firmware and data on-chip. The 119 available I/O support multiple standards, and the industrial-grade M7AFS600-FG256I variant is qualified across the -40C to +85C range, with SMD/SMT mounting in a square LBGA ball-grid-array footprint. Typical applications include industrial control systems, power-supply supervision and telemetry, embedded system integration, and portable instrumentation where analog sensing plus digital control must coexist on one device. A key design consideration is the 1.5V core supply, which requires a clean, regulated power rail and proper decoupling across the 256-ball package. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip
The Microchip Technology M7AFS600-FG484 is a Fusion mixed-signal field programmable gate array (FPGA) offering 600K system gates, an embedded ARM CoreMP7 processor, 172 user I/Os, and 110592 VersaTiles in a 484-ball FBGA (FG484) package operating from a 1.5V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that designers configure after manufacturing, sitting within the hierarchy of programmable logic between CPLDs and full ASIC implementations. The Fusion family is unique in being a mixed-signal FPGA platform: it integrates flash-based FPGA fabric with configurable analog blocks, making it an alternative to costly mixed-signal ASIC designs. Key features of the M7AFS600-FG484 include 600K system gates of flash-based fabric, an ARM CoreMP7 soft processor core for embedded control, 172 user I/Os for system interfacing, and 130nm flash technology that retains configuration data in non-volatile memory, eliminating the need for external configuration flash and providing instant-on operation. Technically, the Fusion architecture combines the ProASIC3-style flash fabric with analog peripherals such as the Analog Compute Engine (ACE), RTC, and PLL support, enabling single-chip system management. The 484-ball FBGA measures 23x23x2.44 mm and uses surface-mount assembly. With a maximum operating frequency around 1098.9 MHz per distributor listings, the device targets control-plane and mixed-signal integration tasks. Typical applications include embedded system control, industrial automation, power and fan management, portable instrumentation, and space-constrained mixed-signal designs that benefit from on-chip analog monitoring combined with programmable logic. When designing with this device, note the commercial temperature range of 0C to +70C: for extended-temperature environments, the FG484I variants rated -40C to +100C are the appropriate choice. This page synthesizes distributor pricing, drop-in alternatives within the Fusion family, and practical design notes not found in any single manufacturer datasheet.
M7AFS600-FG484I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
The Microchip Technology (Microsemi) M7AFS600-FG484I is a Fusion family mixed-signal FPGA offering 600K system gates, up to 172 user I/Os, 110592 bits of embedded Flash configuration memory, and a maximum operating frequency of 1098.9 MHz, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA/FG484) package with industrial temperature rating (I suffix). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and reconfigurable interconnects that engineers configure in the field, sitting within the broader hierarchy of programmable logic devices: FPGA -> programmable logic IC -> programmable semiconductor. The Fusion family is unusual because it integrates true mixed-signal capability - analog front ends, Flash-based configuration, and digital fabric - on a single 130nm die, reducing board-level component count. Key features include the embedded ARM CoreMP7 soft-capable processor support, Flash-based configuration that is inherently live-at-power-up and resistant to configuration-data theft, 1.5V core supply, and industrial-grade temperature qualification. The 484-ball FBGA exposes the full 172-I/O capability, supporting broad system interconnect in compact footprints. Architecturally, the M7AFS600 is built on 130nm Flash process technology, combining a 600K-gate fabric with embedded analog peripherals. Flash configuration removes the external configuration PROM required by SRAM FPGAs, improving board space, security, and boot behavior. The 1098.9 MHz maximum operating frequency supports high-throughput datapaths and interface bridging. Typical applications include industrial control and automation, instrumentation and test equipment, secure embedded systems, motor drive interfaces, and mixed-signal bridging where analog inputs and FPGA logic must coexist in one device. Design consideration: ball-grid-array packages require controlled-impedance multilayer PCBs; plan power integrity for the 1.5V core rail early, and verify X-ray inspection capability for rework. This page synthesizes distributor pricing, drop-in same-package alternatives, application guidance, and design notes not found in the manufacturer datasheet, with pricing data as of 2026-09-02.