انٹیگریٹڈ سرکٹس

XC6SLX100-3FGG484C

XC6SLX100-3FGG484C Spartan-6 LX FPGA 101K Cells | AMD Xilinx

The AMD Xilinx XC6SLX100-3FGG484C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 101,261 logic cells, 4,939,776 system gates, and 326 user I/O in a 484-ball Fine-pitch BGA package with -3 (highest performance) speed grade. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacture, rather than at the fab. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine configurable logic blocks (CLBs), programmable routing, dedicated DSP slices, Block RAM, and hardened I/O serializers. Unlike microcontrollers (which execute instructions sequentially), FPGAs perform true parallel datapath operations, making them the preferred choice for high-throughput DSP, packet processing, and custom interface bridging where latency and determinism matter more than raw CPU clock rate. The XC6SLX100-3FGG484C integrates 180 DSP48A1 slices for fixed- and floating-point acceleration, 4,824 Kbits of Block RAM, four clock management tiles (CMTs) with PLL/DLL, and SelectIO technology supporting voltages from 1.2V to 3.3V. The -3 speed grade delivers the highest Fmax in the Spartan-6 LX family, while the 45 nm process node keeps static power in the milliwatt range compared to older 90/65 nm nodes. Typical applications include high-volume consumer and industrial designs such as video processing pipelines, motor control, industrial Ethernet bridges, PCIe endpoint controllers (when paired with an external PHY), and digital signage. Designers also use it for custom packet processors in telecom backhaul equipment and as a flexible I/O expander/glue logic replacement for multiple CPLDs on a single board. When designing with the -3 speed grade, ensure your PCB footprint supports the FGG484 (Pb-free, 1.0 mm pitch, 19 x 19 mm body) BGA land pattern and provide adequate via-in-pad or microvia escape routing. Decoupling must follow the Spartan-6 PCB Design Guide for the VCCINT, VCCAUX, and VCCO rails to meet the -3 timing closure across the full industrial temperature range. This page synthesizes distributor pricing, verified drop-in same-family and cross-brand Spartan-6 equivalents, and practical board-level design guidance that is not consolidated in the manufacturer datasheet itself.

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XC6SLX100T-2CSG484I

XC6SLX100T-2CSG484I - Spartan-6 FPGA 101K Logic Cells | AMD

The AMD XC6SLX100T-2CSG484I is a member of the Spartan-6 LXT FPGA family, built on a mature 45nm low-power copper process technology. It delivers 101,261 logic cells and 296 user I/O pins in a 484-ball CSBGA package, offering a balance of density, performance, and low power for high-volume applications. The device operates from a 1.2V core supply and supports a wide range of I/O standards. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementations. FPGAs sit between ASICs and microprocessors in the design hierarchy, providing reconfigurable hardware acceleration for tasks ranging from protocol bridging to digital signal processing. The Spartan-6 family is optimized for cost-sensitive, high-volume applications where low power and system integration are critical. Key features of the XC6SLX100T-2CSG484I include 4,939,776 bits of block RAM, 268 DSP48A1 slices, and support for high-speed serial transceivers (up to 3.125 Gbps) in the LXT variant. The device also includes a hard PCI Express block, memory controllers, and advanced clock management tiles (CMTs) with PLLs and DCMs. These features enable the implementation of complete system-on-chip designs with minimal external components. From a technical perspective, the Spartan-6 family uses a 45nm process that reduces dynamic power consumption by approximately 50% compared to previous Spartan families. The fabric is based on a 6-input look-up table (LUT) architecture, providing efficient logic utilization. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include industrial automation, automotive infotainment, medical imaging, and communications equipment. The 296 I/O pins support various standards including LVCMOS, LVDS, and HSTL, making it suitable for interfacing with a wide range of peripherals and memory devices. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1.2V core supply should be regulated with low-noise LDOs or switching converters, and the device's power consumption should be estimated using the Xilinx Power Estimator (XPE) tool to ensure adequate cooling.

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XC6SLX100T-3FGG484C

XC6SLX100T-3FGG484C - Spartan-6 FPGA 101K Logic Cells | AMD

The AMD XC6SLX100T-3FGG484C is a member of the Spartan-6 LXT family of Field Programmable Gate Arrays (FPGAs), built on a mature 45 nm low-power copper process technology. It delivers 101,261 logic cells, 296 user I/O pins, and 4,939,776 bits of block RAM, all in a 484-ball FBGA package. This device is designed for high-volume applications requiring leading system integration with the lowest total cost, offering half the power consumption of previous Spartan families and faster, more comprehensive connectivity. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs are part of the broader category of programmable logic devices (PLDs), which sit between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. They consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing designers to implement custom digital logic circuits without the high NRE costs of ASIC development. FPGAs are widely used in prototyping, aerospace, automotive, industrial, and communications applications where flexibility and time-to-market are critical. Key features of the XC6SLX100T-3FGG484C include 101,261 logic cells, 296 user I/O pins, 4,939,776 bits of block RAM, and support for various I/O standards including LVCMOS, LVDS, and HSTL. The device operates from a 1.2V core voltage and is available in the -3 speed grade, which is the fastest speed grade for this part. The 484-ball FBGA package measures 23x23 mm with a 1.0 mm ball pitch, providing a compact footprint for dense PCB designs. The device also includes advanced clock management tiles (CMTs) with PLLs and DCMs, and supports configuration via JTAG, SPI, and BPI interfaces. From a technical depth perspective, the Spartan-6 family is built on a 45 nm low-power copper process, which balances performance and power efficiency. The LXT variant includes high-speed serial transceivers (up to 3.125 Gbps), PCI Express endpoints, and advanced memory controllers, making it suitable for high-bandwidth applications. The device also features dedicated DSP48A1 slices for digital signal processing, providing up to 180 GMACs of performance. The -3 speed grade offers the highest performance, with maximum clock frequencies typically exceeding 400 MHz for internal logic. Typical applications for the XC6SLX100T-3FGG484C include software-defined radio (SDR), industrial motor control, medical imaging, and high-performance computing acceleration. Its combination of logic density, I/O count, and transceiver capabilities makes it ideal for bridging, protocol conversion, and real-time signal processing tasks. The device is also well-suited for aerospace and defense applications where long-term supply and traceability are required. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout. The core voltage (VCCINT) should be regulated at 1.2V with low-noise LDOs or switching regulators, and each power pin should have a 100 nF ceramic capacitor placed as close as possible. Additionally, the configuration bitstream must be stored in an external SPI flash or programmed via JTAG, and the device supports multi-boot for remote updates.

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XC6SLX150-2FG484C

XC6SLX150-2FG484C Spartan-6 LX FPGA | AMD Xilinx

The AMD Xilinx XC6SLX150-2FG484C is a Spartan-6 LX field-programmable gate array with 338 I/O, 147,443 configuration cells, 11,519 configurable logic blocks, and a 667 MHz internal frequency, housed in a 484-ball CSBGA package measuring 19 x 19 mm with a 0.80 mm pitch. The -2 speed grade targets a practical balance between logic capacity, performance, and power consumption for embedded digital systems. A field-programmable gate array is a programmable digital semiconductor used to implement custom combinational and sequential logic. Its hierarchy extends from FPGA to programmable logic device, digital integrated circuit, and semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured after manufacture, allowing hardware logic, parallel processing, interfaces, and protocol behavior to be updated without changing the printed circuit board. Key features include 338 user I/O, 11,519 configurable logic blocks, 147,443 logic cells, and an internal frequency rated at 667 MHz. The -2 designation identifies the middle Spartan-6 performance grade, while the commercial-temperature suffix supports operation from 0°C to 85°C. Its 484-ball chip-scale BGA package also supports dense PCB routing in systems where a large I/O count is more important than a simple leaded-package footprint. The architecture combines configurable logic blocks with dedicated resources for interconnect, memory, and programmable I/O. This allows parallel datapaths, control logic, serial interfaces, and timing-sensitive functions to coexist in one device. The 667 MHz figure characterizes the device's internal operating frequency and should not be interpreted as the guaranteed performance of every user design; actual throughput also depends on the selected logic path, I/O standard, speed grade, timing constraints, and implemented function. Typical applications include industrial control, test-and-measurement equipment, communications infrastructure, embedded imaging, signal processing, and general-purpose embedded control. The 338 I/O count is particularly useful when the design connects multiple buses, parallel converters, memory interfaces, control signals, or differential communication links without using a separate large pin-count companion device. For PCB implementation, use the AMD Spartan-6 package pinout files when assigning BGA balls and routing the board. Confirm the selected I/O voltage, bank power requirements, decoupling, thermal performance, and configuration interface before release. Device replacement should account for the complete ordering code because speed-grade, temperature-grade, package, and lead-free suffixes affect qualification and behavior. This page combines the XC6SLX150-2FG484C specifications, same-package replacement options, application guidance, and practical FPGA design considerations in one engineering-oriented reference. It also distinguishes the Spartan-6 LX resource level from the electrical, thermal, and ordering differences that determine whether a candidate is a true board-level replacement.

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XC6SLX150-2FG484I

XC6SLX150-2FG484I - 147443-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX150-2FG484I is a Spartan-6 LX field-programmable gate array with 147,443 logic cells, 4,939,776 RAM bits, 338 I/O, and a 484-ball BGA package. Its -2 speed grade targets a 667 MHz internal operating frequency, while the FG484 package supports dense programmable-logic and general-purpose I/O requirements in surface-mount systems. A field-programmable gate array is a reconfigurable digital semiconductor containing programmable lookup logic, programmable interconnect, block RAM, and dedicated I/O resources. Within the broader hierarchy, an FPGA is a programmable logic device that sits above simple fixed-function logic ICs and below application-specific programmable devices. Spartan-6 LX devices combine programmable logic, embedded memory, digital signal processing resources, and high-speed I/O in one integrated silicon package. The XC6SLX150-2FG484I provides 11,519 logic cells as identified in the package description, 147,443 total logic elements, and 4,939,776 bits of RAM. Its 338 I/O allow external interfaces to connect processors, memories, communications transceivers, sensors, displays, and industrial equipment. The device uses a nominal core supply range of 1.14 V to 1.26 V, while supporting circuitry determines the appropriate I/O voltage for the selected bank configuration. The -2 suffix identifies the device speed grade, which must be considered during timing closure rather than treated as a software feature. Spartan-6 designs rely on AMD development tools for synthesis, implementation, timing analysis, programming, and debug. Engineers should preserve the electrical, mechanical, and pinout characteristics of the FG484 package when upgrading an existing board or adapting a proven design. Typical applications include industrial control, test and measurement, networking equipment, embedded vision, communications infrastructure, and high-density embedded systems. The combination of 147,443 logic cells and 4,939,776 RAM bits supports parallel data processing, protocol handling, control logic, buffering, and interface bridging without requiring multiple programmable devices. Design attention should focus on bank voltage compatibility, clock requirements, decoupling, thermal performance, and differential-pair routing. Confirm the pinout against the official Spartan-6 package files and complete static timing analysis for the -2 speed grade before releasing a PCB or production bitstream. This product page consolidates package-specific logic, memory, I/O, and device-selection details with practical application guidance. It also distinguishes package-compatible Spartan-6 ordering variants by speed grade, temperature grade, and device type so engineers can identify a replacement without overlooking timing or I/O differences.

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XC6SLX150-2FG676I

XC6SLX150-2FG676I - 147443-Cell Spartan-6 FPGA | AMD

AMD XC6SLX150-2FG676I is a Spartan-6 LX field-programmable gate array with 147,443 logic cells, a 498-I/O interface, and a 676-pin FCBGA package. It uses 45 nm CMOS technology and is identified as a 1.2 V device in the Spartan-6 LX family. The -2 speed grade places it in the middle of the available performance range, while the -2FG676I ordering code identifies the industrial-temperature configuration. A field-programmable gate array is a semiconductor whose digital logic, memory blocks, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic cells and fixed-function blocks into an application-specific parallel-processing system. This makes the device useful when multiple parallel channels, high-speed interfaces, or programmable control logic must be consolidated into one component. The XC6SLX150 provides 147,443 logic cells, 498 I/O, and a 45 nm CMOS implementation. Its -2 speed grade supports a middle-performance design point for industrial systems, while its 1.2 V core supply corresponds to the family's stated supply architecture. The 676-pin FCBGA package supports dense PCB routing and is suited to multilayer boards where fine-pitch escape routing and ground-plane continuity require careful layout planning. Spartan-6 LX devices are designed for configurable embedded systems, industrial control, communications, signal processing, and test equipment. Programmable architecture allows firmware-driven changes to logic behavior, interface timing, and parallel processing pipelines without changing the PCB. The large I/O count also permits simultaneous connections to external converters, memories, transceivers, and control peripherals when board-level pin planning supports the device. Potential uses include industrial data-acquisition systems, programmable logic controllers, video and image-processing front ends, communications gateways, and embedded control platforms. In these applications, the device can consolidate deterministic parallel logic while dedicated companion processors handle operating-system software, networking, or supervisory functions. PCB design requires strict attention to the 19 mm by 19 mm package geometry and 0.80 mm ball pitch. Use the AMD Spartan-6 package pinout files to assign every pin, place decoupling and configuration resources close to their associated balls, and preserve a continuous return path beneath high-speed and clock nets. Configuration, power sequencing, and thermal management must be validated against the manufacturer design guidance. This page combines the device identity, package characteristics, family-level alternatives, comparison parameters, and practical implementation guidance. It helps engineers evaluate the XC6SLX150-2FG676I for dense programmable-logic designs while separating verified device facts from parameters that must be confirmed against the complete manufacturer datasheet.

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XC6SLX150-3FG484C

XC6SLX150-3FG484C - 147443-Cell FPGA | AMD | Industrial

The AMD XC6SLX150-3FG484C is a Spartan-6 LX field-programmable gate array with 147,443 logic cells, 338 I/O connections, a 667 MHz internal frequency, and a 484-ball BGA package. Built on 45 nm CMOS technology with a 1.2 V supply, it combines programmable logic, 11,519 configurable logic blocks, block RAM, and digital signal processing resources in a single device. The -3 speed grade provides the highest performance option identified for the Spartan-6 LX family. An FPGA is a programmable semiconductor used to implement digital logic, interface protocols, control systems, and parallel processing functions. Its configurable architecture contains programmable interconnect and logic resources that can be configured after manufacture. This places the FPGA within the broader hierarchy of programmable logic devices, digital semiconductors, and embedded control hardware, while distinguishing it from fixed-function logic ICs and application-specific processors. The principal features of the XC6SLX150-3FG484C include 147,443 logic cells, 11,519 configurable logic blocks, 338 I/O, and a 667 MHz internal frequency. Its 45 nm CMOS construction and 1.2 V core supply support dense designs requiring substantial parallel logic. The commercial-temperature suffix C supports operation from 0°C to 85°C, while the lead-free 19 mm by 19 mm CSBGA package is intended for compact surface-mount assemblies. The Spartan-6 LX architecture provides a balance of programmable logic, dedicated block RAM, digital signal processing resources, and general-purpose I/O. Designers can implement communication links, control logic, instrumentation front ends, image-processing pipelines, and embedded accelerators without relying on a fixed instruction set. A 484-ball package offers dense routing access, but it requires careful PCB escape routing, via-in-pad or fanout strategies, and controlled assembly conditions for reliable manufacturing. Typical uses include industrial automation, communications infrastructure, test and measurement equipment, embedded video processing, and high-density control systems. The 338 available I/O are particularly useful for parallel interfaces, while the large logic capacity allows multiple independent processing pipelines or control domains to share one programmable device. The 667 MHz internal figure is a device timing characteristic rather than a guarantee that every implemented circuit will run at that frequency. Designers should prioritize the AMD Spartan-6 package pinout files when assigning BGA balls and planning PCB escape routing. Power, ground, configuration, clock, and user-I/O connections must be mapped against the exact device and package files. Decoupling, clock jitter, signal integrity, thermal dissipation, and configuration-boot requirements should be reviewed before schematic and layout release. This page combines exact device characteristics with practical package-planning guidance, configuration considerations, same-package alternatives, and an engineering-oriented comparison. It helps designers determine whether the XC6SLX150-3FG484C fits a design before committing to a 484-ball BGA layout and high-speed FPGA implementation.

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XC6SLX150-3FG484I

XC6SLX150-3FG484I - 147443-LE Spartan-6 FPGA | AMD

AMD XC6SLX150-3FG484I is a Spartan-6 LX field-programmable gate array with 147,443 logic cells, 338 I/O, and a -3 performance grade in a 484-ball CSBGA package. It operates from a 1.2 V core supply, reaches an internal frequency of 667 MHz, and is specified for the 0 to 85 °C industrial temperature range. The package measures 19 × 19 mm with a 0.80 mm ball pitch. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor containing programmable logic, memory, and input/output resources. FPGAs sit above fixed-function logic devices in the implementation hierarchy because designers can alter the interconnect and function of the same physical device by loading a new bitstream. Spartan-6 devices combine this reconfigurable architecture with block RAM, digital signal processing resources, clock management, and high-speed serial transceivers. The XC6SLX150-3FG484I is suited to designs requiring substantial parallel logic and programmable I/O. Its 147,443 logic cells provide substantial capacity for control logic, interface bridging, signal processing, and embedded protocol handling. The 338 I/O support flexible connection to memory, displays, communications equipment, industrial controllers, and test systems. A 667 MHz internal figure reflects the speed class of the device, while the -3 suffix identifies the highest-performance Spartan-6 LX speed grade. The device is manufactured using 45 nm CMOS technology and belongs to the Spartan-6 LX family. Its 484-ball package concentrates a high pin count into a compact surface-mount footprint, but it also requires careful PCB layout, controlled escape routing, and careful power-delivery design. Configuration and programming depend on the selected bitstream and board-level programming method, so engineers should evaluate boot configuration, JTAG access, and power sequencing before releasing the PCB layout. Typical applications include industrial automation, communications infrastructure, instrumentation, embedded control, video-processing pipelines, and high-speed interface aggregation. The 338 I/O are useful for parallel sensor acquisition and legacy peripheral control, while the high logic-cell count supports multiple independent digital subsystems. Industrial equipment benefits from the specified 0 to 85 °C operating range, provided the board layout maintains acceptable junction temperature. A principal design consideration is that the 484-ball package requires dense escape routing and multiple supply connections. Use the AMD Spartan-6 package pinout files to assign every ball correctly, and follow the manufacturer’s power, decoupling, and configuration guidance before fabrication. Confirm the exact I/O standard, voltage tolerances, and bank constraints against the selected design constraints. This product page combines package, logic-resource, speed-grade, and temperature information with practical configuration guidance and same-family drop-in alternatives. It is intended to accelerate engineering selection while keeping the distinction between verified device attributes, package constraints, and application-specific design requirements clear.

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XC6SLX150-3FG676C

XC6SLX150-3FG676C - Spartan-6 LX FPGA | AMD Xilinx

AMD Xilinx XC6SLX150-3FG676C is a Spartan-6 LX field-programmable gate array with 498 I/O, a maximum internal frequency of 667 MHz, and a 676-ball FCBGA package measuring 19 x 19 mm with a 0.80 mm pitch. The -3 suffix identifies the highest-performing standard Spartan-6 LX speed grade, while the C suffix identifies the commercial temperature option. A field-programmable gate array is a programmable-logic semiconductor in which digital circuits are configured through configurable logic blocks, programmable interconnect, and I/O resources. Within the device hierarchy, an FPGA is a programmable-logic IC and a semiconductor. Spartan-6 devices integrate programmable logic, dedicated block RAM, programmable input/output resources, and digital clock-management capabilities to support parallel processing, control, interface, and embedded-system designs. The XC6SLX150-3FG676C provides 498 I/O in its 676-ball package and operates at an indicated internal frequency of 667 MHz. Its -3 speed grade is described as having the highest performance among the standard Spartan-6 LX grades -3, -2, and -1L. The commercial temperature range shown for this ordering code is 0°C to 85°C, making the device appropriate for equipment operating within that range. The 676-ball FCBGA package uses a 19 x 19 mm body and 0.80 mm ball pitch. This dense land pattern supports high I/O availability on a compact board area, but it also demands careful PCB layout, escape routing, via strategy, assembly-process planning, and pin-assignment review. AMD provides package pinout files in ASCII format for engineers who require the exact package-level assignment. Typical design roles include digital control systems, high-channel-count parallel I/O, industrial automation equipment, communications infrastructure, test and measurement platforms, and embedded signal-processing systems. The combination of 498 I/O, the -3 speed grade, and the 667 MHz indicated operating frequency is particularly useful when a design benefits from substantial parallel connectivity and configurable logic rather than a fixed application-specific ASIC. PCB implementation should begin with the package pinout and board constraints rather than assumption. Confirm ball assignments, differential-pair rules, power-plane connectivity, decoupling locations, and assembly requirements against the AMD package documentation. When replacing another Spartan-6 device, also verify speed grade, temperature grade, package suffix, device variant, and configuration compatibility. This page organizes the key ordering-code, package, performance, sourcing, and engineering details into a compact reference. It also identifies same-family drop-in candidates and highlights the migration checks that matter most when preserving a 676-ball Spartan-6 board.

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XC6SLX150-3FG676I

XC6SLX150-3FG676I - 147443-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX150-3FG676I is a Spartan-6 LX field-programmable gate array with 147443 logic cells, a 676-ball FBGA package, 45 nm CMOS construction, and a 1.2 V core supply. The -3 speed grade provides the highest performance option identified for the Spartan-6 LX family, while the industrial I suffix identifies an extended-temperature device. Its integrated programmable resources support parallel processing, control, signal processing, and programmable-interface designs where deterministic hardware implementation is preferred over a software-driven processor approach. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic fabric, input/output blocks, clocking resources, and embedded memory are programmed after manufacture. The Spartan-6 LX family targets the FPGA > programmable logic > semiconductor hierarchy, combining high logic density with a broad set of embedded resources for communications, industrial control, instrumentation, embedded processing, and high-volume electronic systems. The XC6SLX150-3FG676I is the large-density member of that family. The device provides 147443 logic cells on a mature 45 nm low-power copper CMOS process. Its 1.2 V core voltage identifies the core operating rail, while separate I/O supply options allow interface standards to be matched to board requirements when their supported values are confirmed in the Spartan-6 documentation. The 676-BGA package provides a high pin count and a compact body measuring 19 x 19 mm with 0.80 mm pitch, according to the package listing. The -3 grade is intended for the highest performance in the LX speed-grade range. Its operating temperature range is 0 to 85 degrees Celsius, making the device appropriate for industrial-temperature equipment that remains within this specified envelope. Designers should use the AMD Spartan-6 package pinout files when assigning balls to power, ground, configuration pins, clock pins, and user I/O. The architecture is particularly useful when a design needs parallel channels, deterministic latency, hardware timing, or configurable logic that can be updated independently of a general-purpose software runtime. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, video and image processing, and signal acquisition. These uses benefit from the device's combination of logic density, programmable I/O, and parallel processing resources. System designs must still account for external memory, clock jitter, power sequencing, decoupling, signal integrity, and thermal performance at the selected operating speed. For PCB implementation, follow the manufacturer package and pinout files for ball assignment and escape routing, provide continuous power and ground planes, and keep high-speed clocks and differential interfaces away from noisy switching nodes. Configuration storage and its interface should also follow the Spartan-6 design guidance. The key engineering trade-off is that the -3 grade prioritizes performance, whereas a lower-speed grade may offer a different balance of timing margin, power, and thermal requirements. This product overview combines the device's package, density, process, speed-grade, temperature, and electrical attributes with practical FPGA design guidance. It also distinguishes same-package alternatives by logic density, speed grade, and temperature suffix, helping engineers verify pin compatibility and performance requirements before approving a replacement.

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XC6SLX150-3FGG676C

XC6SLX150-3FGG676C - Spartan-6 LX FPGA 147K LE | AMD Xilinx

The AMD Xilinx XC6SLX150-3FGG676C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) delivering 147,443 logic cells, 23038 Adaptive Logic Modules (ALMs), and 4,939,776 system gates in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package. It carries the -3 commercial speed grade with a maximum core clock of 862 MHz, offers 498 user I/Os, and operates over the commercial 0C to +85C temperature range per the FBGA-676 27 x 27 mm, 1.0 mm pitch package profile. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines logic gates, multipliers, embedded memory, and high-speed transceivers into a configurable fabric. FPGA sits in the hierarchy of programmable logic -> programmable logic device -> semiconductor -> integrated circuit. The Spartan-6 LX family targets high-volume cost-sensitive applications that demand high logic density, abundant block RAM, and integrated DSP slices without the power overhead of Virtex-class devices. By programming the LUTs, routing, and IP cores via the ISE Design Suite, engineers create custom accelerators, glue logic, video pipelines, and connectivity subsystems on a single chip. Key features of the XC6SLX150-3FGG676C include 135 Kbit distributed RAM, 4.8 Mbit block RAM, 180 DSP48A1 slices, four clock management tiles with PLL, and 498 SelectIO signals supporting LVCMOS, LVDS, and LVTTL standards. The device integrates PCI Express Endpoint blocks, GTP transceivers are NOT present on this LX variant, and supports DDR, DDR2, DDR3, and QDRII+ memory interfaces through dedicated hardware controllers. Configuration is via SPI, BPI, JTAG, or Platform Flash XCF, enabling flexible in-system reprogrammability for field upgrades. From a system-architecture perspective, the Spartan-6 LX uses a 45 nm copper CMOS process backed by an optimized core voltage of 1.14 to 1.26 V and auxiliary supply of 2.5 / 3.3 V for I/O banks. The 676-BGA package exposes 26 user I/O banks so designers can support mixed-voltage interfaces (1.2 V to 3.3 V) on a single die, ideal for bridging legacy and modern logic families in industrial control or motor-drive boards. Typical applications include industrial motor control and factory automation backbones, video surveillance processing pipelines, medical imaging front-end buffers, automotive driver-assistance pre-processing prototypes, and avionics display controllers. The combination of abundant I/O and large block RAM makes the LX150 particularly attractive for high-channel-count data acquisition and parallel sensor aggregation. When designing with this part, validate that the 676-BGA layout supports at least four routing layers with laser-drilled microvias, since 1.0 mm pitch BGA escape routes demand controlled-impedance planning. Also confirm that the ISE WebPACK license covers all required IP cores for development. This page synthesizes distributor availability, drop-in Spartan-6 family alternatives, and practical layout notes not bundled into the manufacturer datasheet.

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XC6SLX150T-3FGG484I

XC6SLX150T-3FGG484I - Spartan-6 LXT FPGA 147K Logic Cells | AMD

The AMD XC6SLX150T-3FGG484I is a high-performance Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a 45nm CMOS process technology. It delivers 147,443 logic cells and 23,038 adaptive logic modules (ALMs) in a 484-pin FBGA package with a 19x19 mm body and 0.80 mm pitch. The device operates from a 1.2V core supply and supports up to 296 user I/O pins, making it suitable for high-volume, cost-sensitive applications requiring substantial logic density and I/O flexibility. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that can be programmed after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves fall under the category of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates, which is critical for evolving standards and algorithm changes. Key features of the XC6SLX150T-3FGG484I include 4.71 Mbit of embedded block RAM, integrated DSP slices for signal processing, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The -3 speed grade provides the highest performance within the Spartan-6 LXT family, with internal clock frequencies up to 667 MHz. The device also includes hardened memory controllers for DDR, DDR2, and DDR3, reducing system cost and design complexity. Technically, the Spartan-6 architecture employs a 45nm low-power copper process with a 1.2V core voltage, balancing performance and power consumption. The device integrates Clock Management Tiles (CMTs) containing DCMs and PLLs for robust clock generation and jitter filtering. The LXT variant adds high-speed serial transceivers (up to 3.125 Gbps) and PCIe endpoints, enabling advanced bridging and serial connectivity applications. Typical applications include automotive infotainment systems, industrial automation controllers, consumer electronics bridging, and high-speed data acquisition. The 296 I/Os and 4.71 Mbit memory make it ideal for video processing, motor control, and protocol conversion. The -3 speed grade ensures timing closure for demanding designs. When designing with this FPGA, careful attention to power supply decoupling is essential. Use multiple 100nF and 10uF capacitors near the VCCINT, VCCAUX, and VCCO pins to minimize noise. Additionally, configure the device's I/O standards to match the external interface voltages to prevent damage and ensure signal integrity.

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XC6SLX16-2CPG196C

XC6SLX16-2CPG196C - Spartan-6 LX 375 MHz FPGA | AMD

AMD/Xilinx XC6SLX16-2CPG196C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 106 user I/Os, and a maximum stated operating frequency of 375 MHz, supplied in a 196-ball CSBGA package. The device operates from a 1.14 V to 1.26 V core-supply range and is built on 45 nm CMOS technology. It combines programmable logic, block RAM, digital clock managers, and PLL resources in a cost-sensitive FPGA platform for industrial and embedded systems. A field-programmable gate array is a semiconductor device whose digital behavior is configured through a programmable bitstream rather than a fixed circuit layout. Within the product hierarchy, an FPGA is a programmable logic device and semiconductor, while the Spartan-6 LX family combines configurable logic blocks and dedicated resources for parallel processing, control, signal generation, and interface bridging. The XC6SLX16-2CPG196C provides 14,579 logic cells, 106 user I/Os, 375 MHz stated operating performance, and 667 MHz internal frequency according to the verified product listings. Its 196-ball CSBGA footprint measures 19 mm by 19 mm with a 0.80 mm ball pitch. The commercial-temperature suffix C corresponds to the listed 0 °C to 85 °C operating range, while the -2 suffix identifies the device speed grade. Spartan-6 devices use configurable logic and dedicated resources to implement control logic, parallel data processing, memory-intensive functions, and communication bridges. The -2 grade provides a practical balance between processing performance and cost, making the LX16 suitable for cost-sensitive designs that need more integration than a small programmable logic device but do not require a large premium FPGA. Typical uses include industrial automation, motor-control interfaces, machine-vision pre-processing, sensor acquisition, communication bridging, embedded control, and high-volume consumer equipment. The combination of 106 I/Os and 14,579 logic cells allows multiple interfaces and control domains to be consolidated on one programmable device while retaining field-upgradeable behavior. Designers should treat the 1.14 V to 1.26 V core supply as a dedicated power domain, follow AMD Spartan-6 decoupling and configuration recommendations, and verify the exact CPG196 pinout and ball assignments before layout. Thermal, signal-integrity, and configuration-boot requirements must be checked against the applicable Spartan-6 hardware documentation rather than inferred solely from the distributor summary.

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XC6SLX16-2CPG196I

XC6SLX16-2CPG196I - 14k Logic Cells Spartan-6 FPGA | AMD

The AMD (Xilinx) XC6SLX16-2CPG196I is a Spartan-6 LX FPGA built on a 45 nm CMOS process, delivering 14,579 logic cells with 106 user I/Os in a 196-ball 8 mm × 8 mm CSBGA (TFBGA) package, with 576 Kbit of embedded block RAM and integrated DSP slices. The “-2” speed grade and industrial-grade (-40 °C to +100 °C) “I” temperature suffix indicate a -2 speed/performance tier intended for industrial-temperature environments. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), programmable routing, and dedicated hardware resources such as block RAM, multipliers/DSP slices, and clock management tiles (DCMs/PLLs). The Spartan-6 LX series sits in the low-power, low-cost tier of the AMD/Xilinx product hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. Spartan-6 LX devices target high-volume, cost-sensitive bridging, control, and signal-processing applications that need the parallelism and reconfigurability of an FPGA without the cost of a Virtex-class device. Key features of the XC6SLX16-2CPG196I include: 14,579 logic cells (~2,300 logic slices), 106 maximum user I/Os (some version/board use this number; package allows up to 106), 576 Kbit (72 Kbyte) of block RAM, 32 DSP48A1 slices, four DCMs and two PLLs for clock management, on-chip memory controllers (MCB) for DDR/DDR2/LPDDR, and a 1.2 V core supply with dedicated high-performance/low-power transceiverless I/O banks. The device is implemented on 45 nm process technology, delivering low static and dynamic power versus previous Spartan generations. The -2 speed grade is the mid-tier in the Spartan-6 family and balances Fmax and power for typical industrial designs. Architecturally, the XC6SLX16-2CPG196I uses a register-rich, columnar LUT-6 architecture with dedicated carry chains, distributed RAM/SRL16 shift-register logic in each CLB, and a hard PCIe endpoint block on higher-density siblings (note: LX16 does not include the integrated PCIe block; it is on LX45+). Multiple I/O standards (LVCMOS, LVDS, HSTL, SSTL) are supported with per-bank reference voltages, and the package is lead-free (Pb-free) RoHS-compliant. The 8 × 8 mm CSBGA package supports high-density board layouts in space-constrained designs. Typical applications include industrial motor control and factory automation, automotive infotainment displays and driver-assistance modules, consumer video bridging (HDMI/LVDS), low-cost software-defined radio front-ends, embedded vision pre-processing, and communication backplane bridging. The 576 Kbit of block RAM and 32 DSP slices make the LX16 well suited to small FIR/IIR filters, modest FFT engines, sensor-fusion pre-processing, and glue-logic aggregation. Pairing with a small external SPI flash for configuration memory keeps the BOM lean. When designing with this FPGA, verify that the -2 speed grade meets your target Fmax for the design floorplan, ensure JTAG and DONE pull-up values match the Spartan-6 configuration user guide, and check I/O-bank voltage compatibility before mixing 3.3 V peripherals with 1.2 V core logic. Note: the LX16 does not include the integrated PCIe block; use LX45/LX75/LX100/LX150 if PCIe hard IP is required. This page synthesizes AMD/Xilinx datasheet specifications, distributor pricing as of 2026-10-11, same-package drop-in alternatives within the Spartan-6 family, and practical design notes.

USD $95.16 اسٹاک میں

XC6SLX16-2CSG225C

XC6SLX16-2CSG225C - 14,579-LC Spartan-6 FPGA | AMD

The AMD XC6SLX16-2CSG225C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 589,824 bits of block RAM, and 160 user I/O in a 225-ball CSPBGA package. The -2 device is built on 45 nm CMOS technology and operates from 0°C to +85°C. Its 225-LFBGA package measures approximately 19 mm by 19 mm with a 0.80 mm ball pitch and supports lead-free assembly. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor used to implement logic, control, signal processing, and interface functions in programmable hardware. An FPGA belongs to the semiconductor hierarchy and combines configurable logic blocks, programmable I/O, memory resources, dedicated processing blocks, and clocking circuitry. The Spartan-6 LX family is positioned for cost-sensitive, high-volume systems that need more parallelism and performance than a basic microcontroller can provide. The XC6SLX16 combines 14,579 logic cells with 589,824 bits of block RAM and 160 I/O. Dedicated 18×18 multiplier resources support efficient digital signal processing, while cascade and pipelining features allow higher-performance arithmetic and filtering structures. Its programmable I/O and 45 nm architecture are useful for custom bridges, industrial interfaces, embedded control, video data processing, and communication equipment. The -2 suffix identifies the device's performance grade, while CSG225 specifies its 225-ball CSPBGA package. The C suffix identifies the commercial temperature grade. Verified distributor data reports a maximum internal frequency of 667 MHz, although achievable system performance depends on the selected design, timing constraints, I/O standards, clocking architecture, and memory interface configuration. Typical applications include industrial automation and factory control, machine vision, automotive infotainment, consumer video processing, embedded communications, and low-cost PCI-based systems. The 160 available I/O support integration with external memory, transceivers, sensors, displays, and industrial peripherals while the programmable fabric allows product revisions and field updates without changing the PCB. PCB design must follow AMD package, pinout, solder, and thermal guidance. The CSPBGA package requires careful escape routing, a suitable PCB land pattern, adequate power and ground distribution, and attention to via-in-pad or microvia fabrication requirements. Designers should use the published package files and the Spartan-6 configuration data rather than relying on generic BGA assumptions. This product page consolidates verified distributor specifications, lifecycle-relevant sourcing information, same-footprint Spartan-6 alternatives, comparison parameters, and practical implementation guidance. It also distinguishes documented facts from parameters that require confirmation in the complete AMD device documentation before layout or production release.

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XC6SLX16-2CSG225I

XC6SLX16-2CSG225I - Spartan-6 LX 14,579-Cell FPGA | AMD

The AMD Xilinx XC6SLX16-2CSG225I is a Spartan-6 LX field-programmable gate array (FPGA) with 14,579 logic cells, 1,139 configurable logic blocks, 24 hardware multipliers, and 144 I/O in a 225-LFBGA CSBGA package. The device is built on 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified with an internal frequency of 667 MHz and a -2 speed grade. The XC6SLX16-2CSG225I also carries the industrial-temperature designation and is intended for cost-sensitive, high-volume embedded systems requiring a balanced combination of programmable logic, DSP resources, and I/O flexibility. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic architecture and interconnect are defined after manufacture. Within the broader semiconductor hierarchy, this FPGA belongs to the programmable-logic device class, combines lookup-table-based combinational logic with programmable routing, and provides deterministic parallel processing for control, acquisition, communications, and signal-processing functions. The Spartan-6 LX family is positioned between fixed-function controllers and larger high-performance FPGAs. The XC6SLX16-2CSG225I provides 14,579 logic cells distributed across 1,139 CLBs, along with 24 dedicated multipliers for DSP-oriented arithmetic. Its 144 I/O support integration with external memory, converters, communication transceivers, and industrial interfaces. The 45 nm CMOS implementation supports a 1.2 V operating supply, while the -2 suffix identifies the device speed grade. The exact I/O standards, memory interface capacity, configuration data rates, and static-power limits are not present in the supplied verified records. The 225-LFBGA CSBGA package supports compact, high-density PCB integration but requires careful escape routing, via-in-pad or via-adjacent fanout, and controlled assembly-planar or ball-grid layouts. Because the verified package descriptions differ between 19 x 19 mm and 13 x 13 mm versions in secondary listings, the package dimensions should be checked against the authoritative AMD package drawing before layout release. The supplied comparison data identifies the target as a 225-pin package and also references a 484-pin listing that does not match the MPN designation. Typical uses include industrial automation and motor control, machine-vision preprocessing, sensor acquisition, programmable control, industrial communications, and embedded signal processing. These applications benefit from parallel I/O, deterministic hardware multipliers, and reconfigurable logic that can be updated without changing the PCB. The -2 speed grade and industrial-grade ordering designation are appropriate selections when a design requires a cost-sensitive Spartan-6 LX implementation rather than a higher-density or higher-performance FPGA. Designers should reserve all power, ground, configuration, clock, and decoupling connections according to the AMD Spartan-6 pinout and PCB guidelines. The verified records identify 144 I/O but do not provide a complete numbered pin map, so the pinout is intentionally not presented here. Programming toolchain compatibility, supported I/O standards, absolute maximum ratings, and exact decoupling requirements must be confirmed in the official AMD documentation for the selected package and speed grade. This product record consolidates verified distributor, manufacturer-resource, and cross-reference findings with engineering-focused application guidance, explicit uncertainty markers, and same-footprint alternatives. It also distinguishes the target from package, speed-grade, and temperature-grade variants that are related components but not automatically interchangeable for every production program.

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XC6SLX16-2CSG324C

XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX16-2CSG324C is a Spartan-6 LX field-programmable gate array built on a 45 nm process, with 14,579 FPGA cells, 232 I/Os, a -2 speed grade, and a 324-LFBGA package. The device combines programmable logic, block RAM, and DSP resources in a single integrated circuit for compact digital control, signal-processing, communications, and industrial automation designs. Its stated internal frequency is 667 MHz, while its nominal supply voltage is 1.2 V. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that lets engineers implement digital logic functions through programmable configuration rather than a fixed mask set. Within the broader semiconductor hierarchy, an FPGA is a programmable digital logic device that sits alongside microcontrollers, DSPs, and ASICs. It is useful when a design needs parallel hardware, adaptable interfaces, or logic that can be updated after manufacture. The Spartan-6 LX family combines configurable logic blocks with dedicated block RAM and DSP48 processing resources. The verified product listing identifies 232 I/Os and 14,579 cells, providing a substantial logic surface for control planes, data acquisition, protocol bridges, and embedded signal-processing functions. The -2 suffix denotes the device speed grade, while the CSG324 ordering code identifies the specific 324-ball package variant used by the manufacturer. The supplied data describes the device as a lead-free 19 mm by 19 mm package with 0.80 mm pitch. One retrieved specification identifies the physical description as CSBGA-484, while the distributor listing identifies the orderable package as 324-LFBGA/CSPBGA; these package descriptions require confirmation against the official ordering information before footprint release. The stated operating temperature range is 0°C to 85°C for the version described by the retrieved datasheet source. Typical applications include industrial automation, bridging, communications, consumer equipment, and control systems where programmable logic and parallel I/O are valuable. An FPGA can implement multiple interfaces concurrently, while its configurable architecture allows design revisions without changing the physical device. Compared with a fixed-function ASIC, this flexibility is useful for prototypes and evolving systems, although FPGA power, clocking, and configuration requirements must be considered during design. A key design consideration is confirming the exact package, ball map, voltage requirements, configuration interface, memory resources, and I/O standards against the official AMD Spartan-6 documentation before layout or replacement qualification. This page consolidates verified distributor metadata, pricing references, package information, and drop-in replacement guidance while clearly identifying values that still require manufacturer confirmation. This information is intended for design comparison and sourcing support rather than certification. Spartan-6 LX devices in a common supported package may be pinout compatible, but engineers must verify the specific speed grade, temperature grade, device variant, package, and intended operating conditions before substitution.

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XC6SLX16-2FT256C

XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX16-2FT256C is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 186 I/O, a 667 MHz internal frequency, and a 256-ball lead-free LBGA package. It uses 45 nm CMOS technology and a 1.2 V core supply, providing a compact programmable-logic platform for industrial, consumer, communications, and embedded-control systems. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA sits above programmable logic devices and combines configurable logic blocks, block RAM, dedicated arithmetic resources, programmable I/O, and embedded processors. This integration allows one package to replace multiple programmable logic devices and supporting discrete components while shortening development cycles. The verified specifications identify 14,579 configurable cells, 1,139 CLBs, 186 I/O, a 667 MHz internal frequency, and 45 nm CMOS fabrication. The -2 suffix identifies the middle Spartan-6 LX speed grade, while C identifies the commercial temperature grade. These resources support parallel data processing, control-plane logic, communication bridges, signal conditioning, and general-purpose embedded systems without requiring a mask change for each design. As an FPGA, the XC6SLX16-2FT256C combines programmable digital logic with fixed physical resources. Its 186 I/O provide external connectivity, while the 256-ball surface-mount package supports compact board layouts. The 45 nm process and 1.2 V core supply place the device in a mature, low-power programmable-logic architecture intended for cost-sensitive designs that require more integration than discrete logic but less complexity than a large FPGA. Typical applications include industrial automation, industrial networking, video and image processing, consumer equipment, communications infrastructure, and embedded control. The Spartan-6 LX family is specifically identified as suitable for advanced bridging applications, automotive infotainment, consumer products, and industrial automation. A board using this device also requires a suitable configuration memory or boot interface, compliant power rails, clocking, decoupling, and careful signal-integrity routing. Designers should verify the exact FT256 pinout, supported I/O standards, configuration method, power-supply sequencing, and startup behavior in the AMD package files before layout release. Because the verified data does not provide the complete 256-ball pin map, no pin names should be inferred from generic BGA numbering. Differential interfaces should be routed with controlled length and impedance, while FPGA power and ground pins should follow the manufacturer's published connectivity and plane guidance. This product page consolidates distributor availability, package information, speed-grade variants, and practical replacement guidance in one engineering-focused reference. It also distinguishes true FT256 pin-compatible alternatives from package-only equivalents and clearly identifies specifications that require confirmation from the AMD Spartan-6 documentation.

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XC6SLX16-2FT256I

XC6SLX16-2FT256I - Spartan-6 LX FPGA, 14K LCs, 256-BGA | AMD

The AMD (formerly Xilinx) XC6SLX16-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) with 14,579 logic cells, 589,824 bits of block RAM, and 186 user I/O, housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA-256) package with industrial-grade -40C to +100C temperature rating and -2 speed grade performance. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, and clock management tiles (CMTs). FPGAs occupy a position between general-purpose microcontrollers (software-defined behavior, sequential execution) and application-specific integrated circuits (ASICs, fixed function, highest performance per watt). The Spartan-6 family specifically targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive but microcontroller performance is insufficient. Key features of the XC6SLX16-2FT256I include 2,278 Kbits total block RAM, 32 DSP48A1 slices for fixed-point and signal-processing arithmetic, four clock management tiles (CMTs) with digital clock managers (DCMs) and phase-locked loops (PLLs), and integrated SelectIO technology supporting single-ended and differential I/O standards up to 1080 Mbps. The device is fabricated on a 45 nm CMOS process and operates from a 1.2 V core supply with separate I/O bank voltages from 1.2 V to 3.3 V. Architecturally, the Spartan-6 LX family uses a 6-input LUT-based logic fabric with dedicated carry chains, distributed SRL16/SRL32 shift-register primitives, and a 16-bit block RAM/FIFO controller per BRAM tile. The 256-ball FTBGA package provides 186 effective user I/O after accounting for power, ground, configuration, and dedicated JTAG pins. Typical applications include industrial motor control, video processing pipelines, low-cost software-defined radio, LED video wall controllers, and embedded vision pre-processing. The 256-BGA package suits designs requiring dense I/O and moderate thermal dissipation. When designing with this device, ensure proper decoupling with 100 nF ceramic capacitors at every supply pin and a 4.7-10 uF bulk capacitor near the core rail. Configuration can be sourced from SPI flash, JTAG, or BPI parallel memory; the dedicated DONE and INIT_B pins must be monitored for proper startup sequencing. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX16-2FTG256C

XC6SLX16-2FTG256C - Spartan-6 LX FPGA, 14K Cells, 256-BGA

The AMD (Xilinx) XC6SLX16-2FTG256C is a member of the Spartan-6 LX family of field-programmable gate arrays (FPGAs) providing 14,579 logic cells (approximately 1,139 CLBs), 589,824 bits of block RAM, and 186 maximum user I/Os in a 256-ball fine-pitch thin BGA (FTG256) package. Built on a 45 nm CMOS process, the LX variant targets low-cost, high-volume applications with an emphasis on logic density and embedded memory, while delivering typical core performance up to 667 MHz. FPGAs are programmable logic devices that allow hardware designers to implement arbitrary digital circuits, ranging from glue logic and bus bridges to full processor subsystems and DSP pipelines. The Spartan-6 LX series specifically targets cost-sensitive, high-volume designs such as consumer electronics, industrial control, automotive infotainment, and communications infrastructure. Within the broader taxonomy, FPGAs sit alongside CPLDs (less-dense, non-volatile), ASICs (fixed-function, high-volume), and microcontrollers (software-programmed sequential); FPGAs uniquely offer hardware-level parallelism with reconfigurable logic. Key features of the XC6SLX16 include the 256-ball FTG256 package at 1.0 mm ball pitch, a 17×17 mm body, lead-free/RoHS-compliant construction, and an industrial-class (-2) speed grade. The device integrates dual 10/100/1000 Ethernet MACs, dedicated DSP slices (32 of them, totaling 8.18 GMAC/s when fully packed), and 32 BRAM blocks supporting 18 Kb each. Configuration is supported through JTAG (IEEE 1149.1/1532), SPI (x1, x2, x4), and BPI (x8, x16) modes, while clock management is handled by up to 4 clock management tiles (CMTs) containing mixed-mode clock managers and PLLs. Typical applications include high-volume bridging between legacy video or memory interfaces and modern SoCs, motor control loops, low-cost industrial Ethernet endpoints, video processing pipelines, and embedded soft-processor cores such as MicroBlaze or PicoBlaze. Designers frequently pair the Spartan-6 LX with companion DDR memory controllers and high-speed serial transceivers (where required by the chosen package). A critical design consideration with the XC6SLX16-2FTG256C is its lifecycle status: the Spartan-6 family is generally considered NRND (Not Recommended for New Designs) per AMD/Xilinx's product longevity notice. Engineers building production hardware should evaluate Artix-7 or Spartan-7 successors for new projects while keeping this part viable for maintenance of legacy designs. Power decoupling, multi-bank I/O voltage referencing, and bitstream encryption (AES-256) also require careful PCB and firmware planning. This page synthesizes authorized distributor pricing, same-package drop-in alternatives, and practical hardware-design guidance that goes beyond the datasheet's typical-application notes — including lifecycle awareness for engineers managing long-life industrial installations.

USD $16.41 اسٹاک میں

XC6SLX16-2FTG256I

XC6SLX16-2FTG256I - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-2FTG256I is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 1,139 CLBs, 186 I/Os, and a stated internal frequency of 667 MHz, packaged in a 256-pin lead-free FTGBGA. The -2 speed grade and I temperature designation identify this device as an industrial-oriented Spartan-6 LX option for cost-sensitive embedded systems requiring substantial programmable logic, dedicated block RAM, DSP resources, and clock-management capability. A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing blocks are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and integrates configurable logic, fixed or block memory, DSP processing, clock management, and programmable I/O. This integration allows one package to replace combinations of processors, interface controllers, data converters, and discrete programmable logic while preserving upgradeability through a configuration bitstream. Key resources include 2,278 adaptive logic modules, 186 user I/Os, 14,579 logic cells, and 1,139 CLBs. The source data also identifies 375 MHz as another stated frequency and gives a core-voltage range of 1.14 V to 1.26 V. The FTG256 package uses a 17 mm by 17 mm body with a 1 mm ball pitch, supporting dense PCB integration without requiring a large leaded package. The Spartan-6 LX architecture combines programmable logic with block RAM, DSP slices, digital clock managers, and PLLs. Those resources allow parallel data-path designs, protocol bridging, control-plane logic, and fixed-point signal processing to share one FPGA. A 667 MHz stated internal frequency supports demanding clock domains, but achievable system performance remains dependent on the selected design, timing constraints, memory interface implementation, and I/O standards. Typical uses include industrial control and automation, embedded communications gateways, video and image-processing pipelines, instrumentation, and low-cost data-acquisition systems. In these applications, the 186 I/Os provide connectivity, while the 14,579 logic cells allow control logic and datapaths to be consolidated. The Spartan-6 family is particularly relevant to designs that require FPGA flexibility without moving to a larger or more expensive device family. Designers should use the official Spartan-6 package pinout files for every FTG256 ball assignment and verify the selected bank supplies, configuration pins, clock-capable pins, and I/O standards against the design constraints. PCB layout must also account for the 1 mm pitch, power and ground distribution, configuration-boot behavior, and high-speed routing required by the implemented interfaces. This page consolidates the verified specifications, distributor pricing, same-footprint alternatives, and application-oriented design guidance available for the XC6SLX16-2FTG256I. It also distinguishes documented values from unresolved lifecycle, pin-level, and pricing details so engineers can make a traceable sourcing decision.

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XC6SLX16-3CPG196C

XC6SLX16-3CPG196C - Spartan-6 LX FPGA 14579 Cells 106 I/O | AMD

The AMD (Xilinx) XC6SLX16-3CPG196C is a Spartan-6 LX family Field Programmable Gate Array delivering 14,579 cells, 1,451 Kbits of block RAM, and 106 user I/O in a 196-ball CSBGA (0.5 mm pitch, 8x8 mm) package. The device operates at the -3 speed grade, the highest performance bin in the Spartan-6 LX series, with a maximum internal clock frequency of 667 MHz and 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and clock managers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the digital-logic hierarchy: they deliver ASIC-level performance and parallelism while remaining reprogrammable in the field. The Spartan-6 family specifically targets cost-sensitive, high-volume applications where power consumption, density, and price-per-logic-cell are critical. Key features of the XC6SLX16-3CPG196C include 14,579 logic cells, 1,451 Kbits of block RAM (576 Kbits dual-port), 32 DSP48A1 slices, 2 clock management tiles (CMTs), and 2 PCIe hard IP blocks. The 106 available user I/Os support multiple I/O standards including LVCMOS, LVDS, and LVTTL at programmable slew rates and strengths. The CSBGA-196 package (8x8 mm body, 0.5 mm ball pitch) suits compact, high-density PCB layouts. The Spartan-6 LX architecture is built on a 45 nm CMOS process and provides lower static and dynamic power than the prior Spartan-3A generation. The device integrates a hard PCIe endpoint block (1-lane Gen1), hard memory controllers for DDR/DDR2/DDR3/LPDDR, and a high-speed GTP serial transceiver-free design (the LX family omits transceivers, unlike the LXT). The -3 speed grade delivers the highest Fmax in the family. Typical applications include industrial motor and motion control, video surveillance and image processing, low-cost PCIe endpoint cards, consumer display controllers, and embedded DSP systems. The CSBGA-196 footprint is particularly suitable for space-constrained designs such as portable test equipment and 4-layer FR4 carrier boards. The 45 nm process and 1.2 V core reduce thermal dissipation compared to older 90 nm and 65 nm FPGA families. When designing with this device, allocate sufficient decoupling capacitance (typically 100 nF and 4.7 uF combinations) at each supply pin and follow AMD's Spartan-6 PCB Design Guide for controlled-impedance routing. The 0.5 mm pitch CSBGA requires via-in-pad or laser-drilled microvia technology on standard 4-layer boards; ensure your PCB fabrication process supports the pitch before committing to layout.

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XC6SLX16-3CSG225C

XC6SLX16-3CSG225C - 14,579-Cell FPGA, 160 I/O | AMD

AMD XC6SLX16-3CSG225C is a Spartan-6 LX field-programmable gate array with 14,579 logic elements, 160 I/O, 576 Kbit of embedded memory, and a 667 MHz internal frequency in a 225-LFBGA, CSPBGA package. The -3 speed grade is the highest-performance grade listed for the Spartan-6 LX family, while the C suffix identifies the commercial-temperature ordering option. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit that belongs to the semiconductor and programmable-logic hierarchy. Unlike a fixed-function logic device, an FPGA contains configurable logic, memory, and I/O resources that engineers program to implement digital control, signal processing, communications, and interface functions. The Spartan-6 LX family combines programmable logic with integrated block RAM and dedicated input/output resources for cost-sensitive embedded designs. The XC6SLX16-3CSG225C provides 14,579 logic elements organized into 2,278 adaptive logic modules, 160 user I/O, and 576 Kbit of embedded memory. Its listed 667 MHz internal frequency supports timing-driven designs requiring deterministic programmable logic. The 45 nm FPGA process provides a mature implementation platform for industrial control, communications, instrumentation, embedded video, and general-purpose prototyping systems. The -3 designation selects the highest performance rating in the compared Spartan-6 LX speed-grade set. The commercial C temperature option is listed from 0°C to 85°C, making the device appropriate for equipment operating within that commercial range. The 225-LFBGA, CSPBGA package also supports compact board layouts, but its fine 0.80 mm pitch requires careful escape routing, clean ground-plane design, and assembly-process control. Typical uses include industrial automation controllers, sensor and measurement interfaces, communications equipment, embedded control systems, and FPGA-based test platforms. The Spartan-6 architecture is especially useful when designs need configurable parallel interfaces, serial transceivers, clocking, block RAM, and deterministic logic in one programmable device rather than a combination of fixed-function ICs. PCB planning should begin with the AMD package pinout file and the Spartan-6 device datasheet. Preserve a continuous ground reference beneath the BGA, route high-speed signals with controlled impedance, provide suitable decoupling at supply pins, and follow the package-specific layout guidance before releasing the board to fabrication. This product page combines the device identity, programming-relevant resource counts, package characteristics, speed-grade differences, practical PCB guidance, and same-package replacement options. It supports faster engineering selection by separating what changes between orderable variants from what remains constant in the Spartan-6 LX design family.

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XC6SLX16-3CSG324C

XC6SLX16-3CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX16-3CSG324C is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 232 I/O, 589,824 RAM bits, and a 667 MHz internal frequency, packaged in a 324-CSPBGA. The -3 designation identifies the highest-performance Spartan-6 speed grade in the provided source data, while the C suffix denotes the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated processing resources on one device. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic class and provides a hardware alternative to combining numerous discrete logic devices. It is widely used when design changes, parallel processing, high I/O density, or rapid product customization are more important than the lowest unit cost. The XC6SLX16 offers 14,579 logic cells organized into 1,139 LABs and CLBs, together with 589,824 bits of embedded block RAM. Its 232 user I/O support communication links, control interfaces, memory connections, and mixed-signal system integration. The 667 MHz internal frequency provides a concrete timing reference for clocked digital designs, although achievable system performance depends on the selected tools, constraints, memory interfaces, and I/O standards. This device is built on a 45 nm FPGA process and supports operating supply voltages from 1.14 V to 1.26 V. The 324-CSPBGA package supports dense surface-mount assembly while exposing a substantial pin count for high-bandwidth designs. The commercial-grade part is specified for a 0 °C to 85 °C operating range, making it appropriate for cost-sensitive equipment operating in controlled commercial environments rather than extended industrial temperature conditions. Typical uses include real-time digital signal processing, video encoding and decoding, image processing, image enhancement, industrial automation, programmable control, and high-performance computing accelerators. Its combination of logic, memory, and 232 I/O permits a complete parallel pipeline to be consolidated into one FPGA. Dedicated block RAM can buffer video lines or sample data, while programmable logic can implement filters, protocol converters, and control algorithms. Designers should obtain the AMD Spartan-6 package pinout file before assigning any board-level pins and verify the selected package, voltage requirements, and pinout against the device documentation. The provided search results conflict on package dimensions, so the exact body size and ball-pitch information must be checked in the authoritative package drawing rather than inferred from third-party listings. Commercial-temperature operation should also be confirmed against the enclosure temperature. This product page consolidates the verified distributor specifications, price, source links, package identity, and same-family drop-in options into an engineering-focused reference. It also distinguishes documented facts from unavailable details, helping teams compare sourcing options while avoiding unsupported package, pinout, or timing assumptions.

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