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XC6SLX4-3TQG144C - 3840-LE Spartan-6 FPGA | AMD
XC6SLX4-3TQG144C

XC6SLX4-3TQG144C - 3840-LE Spartan-6 FPGA | AMD

The AMD XC6SLX4-3TQG144C is a Spartan-6 LX field-programmable gate array with 3,840 logic elements, 102 I/Os, 216 Kb block RAM, and 8 DSP slices in a 144-pin TQFP package. Its -3 designation identifies the high-performance Spartan-6 speed grade, while the final C indicates the supplied commercial temperature class. The device targets compact control, interface, communications, and embedded-processing systems requiring programmable logic density in a conventional surface-mount package. A field-programmable gate array is a semiconductor whose configurable logic, memory, and I/O blocks implement a digital design after manufacture. An FPGA belongs to the programmable-logic-device hierarchy, combining parallel logic fabric, block random-access memory, dedicated digital signal processing resources, and programmable input/output. The Spartan-6 LX family is positioned for low-cost embedded designs where integration and design flexibility matter more than the very high resource density of larger FPGAs. Verified listings identify 3,840 logic elements, 102 I/Os, 216 Kb of block RAM, 8 DSP slices, and 300 configurable logic blocks. These resources permit parallel datapaths, control-state machines, protocol handling, and small-buffer-based embedded systems in one device. The TQFP-144 package also supports conventional PCB assembly, although its fine-pitch leads require careful inspection and layout. One distributor search result describes a 3840-LE FPGA and one comparison result reports a maximum FPGA frequency of 862 MHz, but timing qualification must be checked against the specific design and operating conditions. The XC6SLX4-3TQG144C is commonly selected for industrial controls, data acquisition, communications, embedded vision, and compact instrument-control systems. Its 102 I/Os provide substantial board-level connectivity, while block RAM supports buffering and lookup functions. The 8 DSP slices can accelerate multiply-accumulate operations without consuming only general-purpose fabric, although system performance still depends on routing, clocking, and timing closure. For a new design, verify the exact pinout, recommended power rails, configuration interface, clock requirements, and supported I/O standards in the AMD Spartan-6 documentation before layout. Do not treat a same-package device as a substitute without checking bitstream compatibility, configuration behavior, timing, temperature grade, and all bank-level constraints. The listed inventory and pricing should be checked with authorized distributors before purchase. This page combines distributor information, package identification, application guidance, and replacement considerations that are not contained in a single distributor listing. Pricing and stock status are time-sensitive, and the current verified commercial signal is the listed starting price of $6.6231 from LCSC as of 2026-10-22.

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XC6SLX4-3TQG144I - 3840-LC Spartan-6 FPGA | AMD
XC6SLX4-3TQG144I

XC6SLX4-3TQG144I - 3840-LC Spartan-6 FPGA | AMD

The AMD XC6SLX4-3TQG144I is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 102 user I/Os, 221,184 bits of embedded memory, and a maximum operating frequency of 862 MHz, housed in a 144-pin LQFP package measuring 20 x 20 mm. The -3 designation identifies the performance grade, while the I suffix identifies the industrial temperature option. The device is fabricated using 45 nm low-power process technology and is intended for cost-sensitive, low-power designs requiring a compact FPGA implementation. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after fabrication. The Spartan-6 LX FPGA family belongs to the hierarchy of FPGA, programmable logic device, digital semiconductor, and embedded programmable logic. Unlike a fixed-function application-specific integrated circuit, an FPGA supports design changes, parallel signal processing, hardware acceleration, and interface adaptation without requiring a new silicon mask. The XC6SLX4-3TQG144I provides 600 adaptive logic modules, 3,840 logic cells, 102 user I/Os, and 221,184 bits of block RAM. Its 862 MHz maximum frequency supports demanding control logic, communication interfaces, and parallel data-processing functions. The 144-LQFP package provides a large pin count relative to smaller FPGA packages, allowing more external memory, transceiver, control, and general-purpose I/O connections. Pb and Pb-free package options are available within the family, although the exact ordering-code status of this MPN should be confirmed with AMD. The device combines configurable logic, block RAM, dedicated digital clocking resources, programmable I/O, and on-chip support features within one integrated package. Its -3 speed grade is intended to provide higher timing performance than lower-numbered Spartan-6 speed grades. Because an FPGA is a programmable digital device, final performance also depends on placement, routing, clocking, I/O standards, memory interfaces, and the selected tool version; the 862 MHz figure should therefore not be interpreted as a guaranteed operating frequency for every design. Typical uses include industrial control, networking equipment, embedded instrumentation, video interfaces, sensor processing, and communications bridges. Its 102 I/Os make it suitable for designs needing substantial external connectivity, while 221,184 bits of embedded RAM can support buffering, packet handling, data acquisition, and general-purpose state storage. The 20 x 20 mm LQFP footprint is also practical for boards that cannot accommodate very dense BGA packages. A key design consideration is the device's relatively low logic-cell count compared with larger Spartan-6 devices. Designs requiring multiple high-speed interfaces, large frame buffers, or substantial parallel processing may need a larger FPGA. Engineers should also verify speed-grade timing against the slowest clock domain and use the AMD Spartan-6 package pinout files when assigning all 144 package pins. This product page consolidates verified distributor specifications, a complete same-package alternative set, practical application guidance, and design cautions that are not presented together in a single manufacturer datasheet. It is intended to accelerate component selection while preserving traceability to the provided manufacturer and distributor sources.

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XC6SLX4-L1CSG225I - 3,840-Cell Spartan-6 LX FPGA | AMD
XC6SLX4-L1CSG225I

XC6SLX4-L1CSG225I - 3,840-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX4-L1CSG225I is an industrial-grade Spartan-6 LX field-programmable gate array with 3,840 logic cells, 132 user I/Os, 221,184 RAM bits, and a 1.0 V core in a 225-ball CSBGA package. The device combines programmable logic, block RAM, and DSP resources in a single surface-mount FPGA. A field-programmable gate array is a semiconductor whose digital logic, memory, and signal-processing functions are configured after manufacture. The Spartan-6 LX family occupies the programmable-logic portion of the broader FPGA hierarchy, where an FPGA sits above simple programmable logic devices and provides configurable parallel processing, dedicated block RAM, and DSP arithmetic. This combination makes the device suitable for control, acquisition, communication, and embedded signal-processing systems requiring deterministic hardware implementation. The XC6SLX4-L1CSG225I provides 300 configurable logic blocks, 132 user I/Os, 216 Kb of block RAM, 8 DSP slices, and 16 18-by-18 multipliers according to its published product information. The L1 speed designation identifies a lower-power performance option, while the trailing I identifies the industrial-temperature grade. These features allow parallel control logic, sampling pipelines, protocol conversion, and fixed-point multiplication to be consolidated without relying on a separate processor for every real-time function. The CSG225 package exposes 225 terminals in a compact surface-mount land pattern. Its 132 user I/Os support connections to external sensors, converters, memory devices, communication transceivers, and industrial interfaces. Designers should use the AMD Spartan-6 package pinout file for authoritative ball assignments, power configuration, and PCB land-pattern details before routing a board. Typical uses include industrial automation, programmable logic controllers, motor-control systems, sensor-data acquisition, and protocol conversion. For these applications, the L1 device provides a practical balance between logic density, memory, DSP capability, and power efficiency. Configuration should be planned with the manufacturer's configuration guidance so the FPGA receives a valid bitstream at power-up. PCB design should preserve clean power distribution to the 1.0 V core and associated supply rails, provide decoupling close to the device, and route sensitive inputs away from high-speed outputs. Thermal performance depends on the board, copper area, airflow, and total switching activity, so an enclosure-level estimate is more meaningful than package size alone. Use the AMD package files and Spartan-6 documentation to validate every connection. This product page combines the exact XC6SLX4-L1CSG225I identifiers with practical selection guidance, verified resource counts, package considerations, and engineering-focused design notes. It helps teams distinguish the low-power industrial device from other Spartan-6 LX speed and package options before committing a board to the CSG225 footprint.

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XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2CSG484C

XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2CSG484C is a Spartan-6 LX family field-programmable gate array (FPGA) with 43,661 logic cells, 3,411 Configurable Logic Blocks (CLBs/LABs), 2,138,112 bits of embedded block RAM (approximately 261 Kib), and 320 user I/O, housed in a 484-ball chip-scale BGA (CSBGA, 19 mm x 19 mm, 0.8 mm pitch). The device operates from a 1.2 V core supply (1.14 V to 1.26 V) with internal performance characterized up to 500 MHz. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect fabric, and embedded memory/DSP/IO resources that the user can program post-manufacturing. In the power-management hierarchy, an FPGA sits above microcontrollers and ASICs in flexibility, providing parallel hardware acceleration for digital signal processing, glue logic, and high-IO bridging. The Spartan-6 LX family targets cost-sensitive, high-volume applications such as consumer, automotive infotainment, and industrial automation, balancing density with low power and low unit cost. Key features include built-in 45 nm CMOS process technology, integrated hard IP blocks (PCI Express, GTP transceivers on LXT variants, dedicated DSP48A1 slices), on-chip block RAM, and 45 nm process low-power sleep modes. The -2 speed grade offers balanced performance versus power, while the commercial temperature grade (0 to +85 C) suits indoor and controlled-environment designs. Architecturally, the XC6SLX45 leverages the Spartan-6 LUT-based logic fabric combined with hard DSP slices, dedicated memory blocks, and high-performance SelectIO technology. The 320 user I/O support up to 18 single-ended standards or multiple differential pairs, enabling bridge and connectivity designs. The device is configured via JTAG, Slave Serial, SPI, or BPI flash interfaces, with bitstream encryption available for IP protection. Typical applications include automotive infotainment, consumer video/display bridging, industrial motor control, communication infrastructure glue logic, and high-density DSP pre-processing. The wide IO count and ample block RAM make this device especially suitable for multi-protocol bridging and parallel data acquisition. Designers should note that the 484-ball CSBGA package requires careful PCB layout with microvia technology for reliable assembly. The 1.2 V core supply must use low-noise LDO regulation with adequate bulk capacitance, and all IO banks may require independent reference voltages depending on the standards used. This page synthesizes distributor pricing, drop-in Spartan-6 alternatives, application notes, and practical design considerations that are not found in the manufacturer datasheet alone.

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XC6SLX45-2FG484C - 45K Logic Cell Spartan-6 FPGA | AMD
XC6SLX45-2FG484C

XC6SLX45-2FG484C - 45K Logic Cell Spartan-6 FPGA | AMD

The AMD/Xilinx XC6SLX45-2FG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 43,661 logic elements, 6,822 adaptive logic modules, 2.04 Mbit of embedded memory, and 316 I/O sites in a 484-pin lead-free FBGA package. The -2 speed grade is positioned for general-purpose programmable-logic applications, while the commercial-temperature suffix C supports operation from 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic device, an adaptive computing component, and a semiconductor. It offers more flexibility than a fixed-function application-specific integrated circuit while providing deterministic parallel hardware for control, signal processing, interface bridging, and data acquisition. The XC6SLX45-2FG484C provides 43,661 logic elements organized into 6,822 adaptive logic modules, together with 2.04 Mbit of embedded block RAM. Its listed internal frequency is 500 MHz. These resources support parallel datapaths, state machines, protocol interfaces, and control logic without relying on a CPU for every real-time operation. The device also provides 316 available I/O sites according to the distributor data. The -2 suffix identifies the Spartan-6 performance grade, while -3 devices provide a higher performance grade and -1L provides a lower-power-oriented option within the same family. The target operates from a listed 1.2 V supply. Its 45 nm CMOS construction and embedded-memory architecture allow multiple independent processing blocks to run concurrently, making deterministic throughput preferable to sequential software execution for time-critical control paths. Typical uses include industrial automation, industrial networking, embedded control, instrumentation, consumer bridging, and automotive infotainment. The 316 I/O sites provide substantial connectivity for external memory, control signals, communications transceivers, and mixed-signal interfaces. The commercial 0°C to 85°C range is appropriate for indoor commercial and industrial equipment, while extended-temperature or automotive requirements should be checked against the exact selected ordering code. Designers should verify the precise 484-ball footprint, pin assignments, exposed-pad connection, supported I/O standards, and memory interface compatibility in the AMD/Xilinx package data. The target designation in the verified results is also inconsistent, with some distributors listing FGG484C while the requested MPN and comparison sources use FG484C; the physical ball map and bill of materials should therefore be confirmed against the manufacturer documentation before layout release or procurement. This page combines verified source specifications, commercial availability information, package details, comparison data, and practical replacement guidance. It also distinguishes confirmed same-package drop-in options from cross-reference leads that require additional package and temperature verification, helping engineers make a more reliable sourcing and design decision.

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XC6SLX45-2FG484I - 43,661-Cell Spartan-6 FPGA | Xilinx
XC6SLX45-2FG484I

XC6SLX45-2FG484I - 43,661-Cell Spartan-6 FPGA | Xilinx

Xilinx XC6SLX45-2FG484I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 316 I/O, a listed internal frequency of 500 MHz, 45 nm CMOS technology, and a 1.2 V operating supply in a 484-BBGA package. It combines programmable logic, embedded block RAM, and digital signal processing resources for cost-sensitive embedded systems requiring substantial parallel processing. A field-programmable gate array is a programmable digital integrated circuit whose logic, memory, and signal-processing functions are configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor and reconfigurable digital logic device. The Spartan-6 LX family balances programmable logic capacity with cost-sensitive integration, making devices in this family suitable for embedded control, communications, industrial, medical, and test systems. Verified listing data identifies 43,661 logic cells, 316 I/O, 500 MHz internal frequency, 45 nm CMOS fabrication, and a 1.2 V supply for this device. It belongs to the Spartan-6 speed-grade portfolio, where the -2 suffix identifies the performance grade and the industrial I suffix identifies the extended-temperature qualification. Other verified details include the 484-BBGA surface-mount package and a lead-free package designation. The Spartan-6 architecture provides a large fabric of configurable logic and dedicated DSP and memory resources, allowing multiple data-processing paths to execute in parallel. The 316 available I/O support interfaces to external memories, converters, communications transceivers, and control peripherals. The -2 speed grade should be selected when the design requires a balance between processing capability and cost rather than the higher performance offered by a -3 grade. Typical uses include industrial automation controllers, communications equipment, medical signal-processing systems, network interface controllers, and embedded test platforms. Its 316 I/O are particularly useful for designs requiring multiple external interfaces, while its 43,661 logic cells support parallel datapaths, protocol engines, control logic, and fixed-function accelerator blocks within one programmable device. The primary design consideration is package and temperature-grade continuity. XC6SLX45-2FG484I must be checked against the exact 484-ball land pattern and the industrial temperature range before substitution. Designers should also validate timing with the appropriate Xilinx timing tools and verify that the selected speed grade satisfies the system clock and I/O requirements without changing the PCB footprint. This page consolidates verified distributor specifications, same-family drop-in alternatives, application guidance, and design cautions. It distinguishes electrically similar device variants from genuinely interchangeable industrial-temperature replacements and identifies where additional manufacturer documentation is required before a procurement or redesign decision.

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XC6SLX45-2FG676I - 45K Logic Cell Spartan-6 LX FPGA | AMD
XC6SLX45-2FG676I

XC6SLX45-2FG676I - 45K Logic Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX45-2FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 358 I/O, and 676-ball BGA packaging, manufactured using 45 nm CMOS technology. The device operates from a 1.2 V core supply and belongs to the Spartan-6 LX FPGA family, combining programmable logic blocks, block RAM, DSP resources, and programmable I/O in one device. It is identified by the -2 speed grade and I industrial-temperature suffix. A field-programmable gate array is a semiconductor device whose digital logic, memory, signal processing, and input/output functions are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic device, a configurable semiconductor, and an application-specific integrated circuit. This architecture allows one physical design to implement multiple control, interface, signal-processing, or communication functions without changing the PCB. The verified listing identifies the XC6SLX45-2FG676I as a 45 nm CMOS Spartan-6 LX FPGA with 43,661 cells, 358 I/O, and a 676-BGA package. The -2 ordering code denotes the specified device speed grade, while the I suffix identifies the industrial temperature grade. The 676-ball package provides a large, high-density connection interface for designs requiring extensive external connectivity. Spartan-6 LX devices are suitable when designers need deterministic programmable logic and parallel I/O rather than the compute density of a processor. The 358 I/O listed for this device can support external memories, data buses, control signals, high-speed interfaces, and general-purpose digital peripherals. The exact clock, I/O-standard, and performance ratings for this ordering code must be confirmed in the AMD Spartan-6 documentation before final sign-off. Typical applications include industrial automation, video and image processing, communications infrastructure, instrumentation, embedded control, data acquisition, and interface bridging. The large 676-ball BGA also makes the device appropriate for dense boards where minimizing package count and supporting many parallel connections are priorities. A critical design consideration is that a BGA package requires careful PCB escape routing, layer-stackup control, via strategy, and assembly-process planning. Designers must also verify pin compatibility, supported I/O standards, configuration requirements, power sequencing, and operating-temperature limits before treating any substitute as a true drop-in replacement. This page combines verified distributor data, order-code details, a same-footprint comparison, and practical implementation guidance to help engineers evaluate the XC6SLX45-2FG676I for both new designs and controlled replacement programs.

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XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2FGG484C

XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) integrating 43,661 logic cells, 2,138,112 system gate equivalents, and 316 user I/O pins in a 484-ball fine-pitch BGA package (FGG484). It is offered in the -2 commercial speed grade with a 1.14 V to 1.26 V core supply. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic and routing are defined by a user-programmed configuration bitstream rather than at fabrication. FPGAs occupy the wider hierarchy of programmable logic devices (PLD) -> reconfigurable logic -> parallel processing accelerators -> digital integrated circuits (IC). The Spartan-6 family specifically targets cost-sensitive, high-volume embedded designs where power efficiency and integrated peripherals matter more than the absolute performance of a Virtex-class device. Key features of the XC6SLX45 include 2,011 Kbit of block RAM, 58 DSP48A1 slices running up to 390 MHz, four clock management tiles (CMTs) each containing two DCMs and one PLL, and SelectIO technology supporting I/O voltages from 1.2 V to 3.3 V on a per-bank basis. The device also exposes an integrated hard Endpoint block for PCI Express Gen1 in the LXT variant, plus a 10/100/1000 Ethernet MAC. The FGG484 package, measuring 23 x 23 mm with 1.0 mm pitch, is pin-compatible across all Spartan-6 LX/LXT devices with this ball-out. Architecturally the SLX45 uses a 45 nm copper CMOS process with a 6-input LUT-based logic fabric, dedicated carry chains, distributed RAM capability, and a high-performance SerDes-capable I/O ring in the LX variant. Each CMT generates up to 8 derivative clock domains from a single reference, enabling precise multi-clock synthesis for video, memory, and high-speed serial interfaces. Typical applications include industrial motor control, video and image processing pipelines, automotive driver assistance systems (non-AEC), consumer electronics requiring display or camera bridging, and low-cost software-defined radio front-ends. The wide I/O count and integrated memory controllers make it a popular bridge between parallel microcontrollers and high-speed serial sensors. When designing the power tree, ensure a four-rail supply (1.2 V Vccint, 2.5 V Vccaux, 1.8 V-3.3 V Vcco per bank, and a separate Vccbatt for the encryption battery domain on protected devices). Decoupling on each rail should follow the Spartan-6 PCB Design Guide with 100 nF per Vcc/Vcco pin and bulk capacitance of 100 uF minimum near the package. This page synthesizes distributor pricing across five authorized channels, drop-in same-footprint alternatives, and practical design notes derived from the Spartan-6 family datasheet that you will not find on a single manufacturer or distributor page.

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XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2FGG484I

XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 316 user I/O pins in a 484-ball fine-pitch BGA package. Built on a 45 nm low-power copper CMOS process, the -2 speed grade targets an industrial operating temperature range (-40C to +100C for the I suffix), and supports DDR3, LVDS, and 3.3V I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as block RAM, DSP slices, and clock management tiles. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: they are slower and more power-hungry than purpose-built ASICs but offer complete hardware re-programmability, making them ideal for prototyping, low-volume production, and designs requiring hardware acceleration. The Spartan-6 LX family is positioned as a cost-optimized, high-volume family aimed at bridging, motor control, video processing, and embedded DSP applications. Key features of the XC6SLX45 include 6,822 logic slices (each containing four 6-input LUTs and eight flip-flops), 58 DSP48A1 slices for fixed- and floating-point math, 12 clock management tiles (CMTs) with PLL and DCM blocks, and integrated hard IP for PCI Express and GTP serial transceivers on the LXT sub-family. The device supports up to 800 Mbps LVDS, 1,066 Mbps DDR3 memory interfaces, and offers 16 dedicated multiplier lines and SelectIO technology for flexible I/O standard support. The architecture uses a hierarchical routing fabric with 3-fine-tolerant ASIC-class clock networks, making timing closure predictable. The 45 nm process yields roughly half the static power of prior Spartan generations. Built-in security features include AES-256 bitstream encryption and Device DNA for IP protection, supporting secure field upgrades in deployed systems. Typical applications include industrial machine vision, motor and motion control, automotive infotainment bridging, video surveillance and broadcast equipment, low-cost software-defined radio, and high-volume consumer products needing DSP pipelines. The 316 user I/Os and abundant block RAM make it well-suited for multi-channel data acquisition systems. The -2 speed grade balances performance and power for cost-sensitive industrial designs that do not require the fastest -3 grade. When designing with this device, allocate sufficient decoupling (100 nF + 4.7 uF per VCCIO/VCCAUX rail), use 1.0 mm-pitch BGA fanout with microvia stacks, and route the 484-ball FBGA substrate with a symmetrical thermal copper pour to keep junction temperature within industrial limits. The design should use the Xilinx ISE Design Suite or Vivado for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package-level cross-references, and practical design notes not found in a single manufacturer datasheet.

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XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
XC6SLX45-2FGG676C

XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG676C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 358 user I/Os in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a mature 45 nm low-power copper process, the LX family targets high-volume, power-conscious applications and is offered in -3N, -2, and -1L speed grades with the -2 grade used here delivering a balance of performance and power. The FGG676 package measures 27 x 27 mm with 1.0 mm ball spacing and supports extended I/O count required for parallel memory buses, video pipelines, and industrial control fabrics. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families. Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs. Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities. Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family. When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.

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XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
XC6SLX45-2FGG676I

XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD

The AMD Xilinx XC6SLX45-2FGG676I is a Spartan-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells (43661 cells), 3,411 configurable logic blocks (CLBs), 358 user I/Os, and 2,088 Kbit of block RAM, housed in a 676-ball fine-pitch BGA (FBGA) package. The device is fabricated on a low-power 45 nm CMOS process and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems. Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C. The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs. Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive. When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug. This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.

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XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484C

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484C is a 45 nm CMOS Spartan-6 LX field-programmable gate array with 43,661 logic cells, 316 I/O, and a 500 MHz internal frequency, packaged in a 15 mm by 15 mm, 0.80 mm-pitch 484-BBGA. The -3 suffix identifies the highest-performance Spartan-6 speed grade, while the C suffix identifies the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, joining CPLDs as a reconfigurable implementation of digital functions. The Spartan-6 LX family combines configurable logic, block RAM, dedicated processing resources, and general-purpose I/O in one device, making it suitable for parallel data acquisition, embedded control, interface bridging, and industrial automation. Key features include 43,661 configurable logic elements, 316 I/O, 2.04 Mbit of embedded memory, 6,822 adaptive logic modules, and 500 MHz internal frequency. The device uses 45 nm CMOS technology and a nominal 1.2 V supply. Its 484-BBGA package provides a compact 15 mm by 15 mm footprint with a 0.80 mm ball pitch, enabling dense PCB layouts when the BGA routing and assembly requirements are properly controlled. The Spartan-6 architecture provides a practical balance between programmable logic capacity, memory, I/O, and implementation cost. The -3 grade is intended to provide stronger timing performance than the lower -2 and -1L speed grades, although system-level timing still depends on the selected clocking, I/O standards, speed grade, and device utilization. The commercial-grade part is intended for environments where the listed 0 °C to 85 °C operating range is sufficient. Typical uses include industrial automation controllers, data-acquisition systems, video and image processing, communications infrastructure, embedded signal processing, and general-purpose bridging between parallel buses or proprietary peripherals. The large I/O count supports designs requiring numerous external connections, while the internal logic and memory resources allow multiple functions to be consolidated into one programmable device. The primary design constraint is the 484-BBGA package. A PCB redesign is generally unavoidable when moving from a leaded package, and reliable assembly requires suitable pad geometry, via-in-pad or via-away routing, adequate solder mask definition, and careful power and ground-plane distribution. Differential and high-speed interface constraints must also be checked against the appropriate Xilinx Spartan-6 package and pinout files before layout signoff. This page consolidates the verified catalog and cross-reference information, compares pin-compatible same-family options, and highlights BGA implementation considerations. It is intended to support engineering selection and procurement review without treating family variants as interchangeable unless their speed grade, temperature class, package, and device resources have been checked.

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XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484I

XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484I is a Spartan-6 LX field-programmable gate array with 316 I/O, a 500 MHz internal frequency, and a 484-BBGA package measuring 15 x 15 mm with 0.80 mm ball pitch. It is identified as the -3 speed grade, which is the highest-performance speed grade in the Spartan-6 LX family, and the industrial-temperature suffix I indicates a component intended for industrial operating conditions. A field-programmable gate array is a programmable logic device in which digital functions are implemented through configurable logic blocks and programmable interconnect. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic and below programmable SoC implementations. The Spartan-6 LX family combines programmable logic, block RAM, DSP resources, clocking, and general-purpose I/O in a single device for applications requiring adaptable hardware functionality. The verified key specifications for XC6SLX45-3FG484I include 316 I/O, a 500 MHz internal frequency, and 484-BBGA packaging. The package is specified as a 15 x 15 mm lead-free MO-275 arrangement with a 0.80 mm pitch and 324 balls according to the available detailed listing. These figures position the device as a high-pin-count Spartan-6 option for designs requiring extensive board-level connectivity while retaining a relatively compact package. The -3 designation identifies the highest-performance Spartan-6 speed option listed in the verified data. This distinction is important in clocked digital systems because speed-grade differences affect achievable timing performance and should be checked against the selected clocking, I/O, and memory interfaces. The I suffix identifies the industrial-temperature version, while related C-suffix parts provide a distinct commercial-temperature choice. Typical uses include industrial control, communications equipment, embedded processing, test and measurement, and signal-processing systems that benefit from parallel programmable logic. Its 316 available I/O can support external memory, data converters, communication transceivers, control signals, and parallel buses, subject to the exact bank voltage, pin, and timing constraints defined by the manufacturer documentation. Designers should obtain the AMD Spartan-6 package pinout file and the device-specific datasheet before assigning power, clock, configuration, and I/O pins. The available sources identify the package and pin count, but they do not provide a complete verified ball-by-ball signal list or a manufacturer PDF URL for this exact ordering code. Those details should therefore be checked against the official device documentation rather than inferred from similar MPN suffixes. This page consolidates verified distributor availability, exact package and timing identifiers, drop-in family comparisons, procurement facts, and practical design cautions. It also distinguishes confirmed data from attributes that still require verification in the manufacturer datasheet, reducing the risk of treating a speed-, temperature-, or package-suffix change as an unqualified functional equivalent.

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XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
XC6SLX45-3FG676I

XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD

AMD XC6SLX45-3FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and a maximum internal frequency of 500 MHz, packaged in a 676-BGA. It targets industrial logic, embedded control, communications, instrumentation, and high-density programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important. The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components. The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment. For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.

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XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
XC6SLX45-3FGG484C

XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-3FGG484C is a Spartan®-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells, 316 user I/Os, and 2,138,112 system gates in a 484-ball flip-chip BGA package with 1.0 mm ball pitch (FBGA-484). It targets the -3 commercial speed grade and delivers up to 862 MHz operating frequency. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets. The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs. When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations. Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA
XC6SLX45-N3FG484C

XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA

The AMD Spartan-6 LX XC6SLX45-N3FG484C is a field-programmable gate array with 43,661 logic cells, 316 I/O, and a 484-BBGA package. It belongs to the Spartan-6 LX device family, a programmable-logic family positioned for integrated embedded systems requiring substantial parallel processing, flexible I/O, and configurable digital logic. The device combines a large programmable logic fabric with programmable I/O in a surface-mount package designed for compact industrial, communications, instrumentation, and control systems. An FPGA is a semiconductor whose digital functions are defined after fabrication by loading a configuration bitstream. A field-programmable gate array is therefore one type of FPGA, while FPGA belongs to the broader hierarchy of programmable-logic devices and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed, shorten product-development cycles, and support multiple hardware functions through parallel processing, state machines, serial interfaces, and embedded control logic. The XC6SLX45 device provides 43,661 logic cells and 316 user I/O in the Spartan-6 LX family. Its 484-BBGA package exposes a substantially larger connection set than a small quad-flat package, making it useful when a design contains numerous parallel buses, high-pin-count memory interfaces, or several external peripherals. The large logic resource count also allows multiple processing channels or control domains to be consolidated into one programmable device rather than implemented with separate fixed-function logic. The N3 ordering code identifies the target device configuration within AMD's Spartan-6 LX ordering system. Exact speed-grade limits, core supply values, programmable logic performance, embedded-memory capacities, and I/O standards should be confirmed in the manufacturer data sheet before setting timing constraints. In particular, interface timing depends on the selected I/O standard, bank voltage, package constraints, and board-level clock and signal-integrity implementation. Typical uses include industrial automation, embedded control, communications infrastructure, test and measurement, signal processing, and data-acquisition systems. For a 316-I/O design, the FPGA can consolidate parallel sensor acquisition, digital bus translation, control logic, and communication interfaces. A clocked datapath may use multiple logic slices in parallel, while block RAM and dedicated DSP resources can be added where the selected device and design tools support those functions. Board design should preserve every power, ground, configuration, clock, and I/O connection shown in the AMD package pinout files. Use the manufacturer package files to assign PCB balls accurately, especially because the target spelling in some listings differs between FG484C and FGG484C. Confirm the ordering code against the device marking before releasing production hardware or building the assembly bill of materials. This page combines the exact ordering information, package characteristics, compatible Spartan-6 alternatives, and practical design guidance needed for initial device selection. It also highlights where engineers must verify timing, power, compliance, and package details directly against the applicable AMD documentation before a design reaches production.

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XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD
XC6SLX45-N3FG484I

XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD

The AMD XC6SLX45-N3FG484I is a Spartan-6 LX field-programmable gate array containing 43,661 logic cells, 316 I/O, and 3,411 configurable logic blocks in a 484-BBGA package. Its industrial temperature grade covers -40°C to +100°C, while the 484-ball package provides 484 terminals and a 1.00 mm terminal pitch for high-density programmable logic systems. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks with programmable interconnect and block RAM into a flexible parallel-processing engine. The Spartan-6 LX family targets cost-sensitive systems requiring substantial logic density, deterministic parallel operation, and flexible post-build configuration. The XC6SLX45-N3FG484I provides 43,661 logic cells, 3,411 configurable logic blocks, and 316 I/O in one compact 484-BBGA package. The -3 device designation identifies its performance grade within the Spartan-6 LX family, while the industrial temperature qualification supports operation from -40°C to +100°C. These characteristics make the device useful where many parallel data paths must execute in real time rather than sequentially. Its architecture can combine configurable logic blocks, block RAM, dedicated digital signal processing resources, and programmable I/O to implement control logic, packet processing, signal acquisition, image processing, and embedded communication systems. The 316 available I/O support interfaces to external memory and peripheral devices, while the 484-ball package supports dense board routing. As an FPGA, the device allows configuration changes to be applied to the same hardware platform when system requirements evolve. Typical applications include industrial control, networking equipment, test and measurement instrumentation, video and image processing, communications infrastructure, and embedded signal-processing platforms. Designs that benefit from parallel architecture can distribute sampling, filtering, protocol handling, and data transformation across multiple logic paths. The device is particularly appropriate for compact systems requiring high I/O density and substantial programmable logic in one package. PCB design requires careful BGA layout, layer-stack planning, decoupling, and power-distribution design. Use the AMD Spartan-6 package device pinout files when assigning every ball, and follow the manufacturer's power, configuration, and decoupling recommendations. Thermal performance and signal integrity depend strongly on the PCB stackup, copper density, via strategy, trace lengths, and external memory topology used around the FPGA. This product page brings together the device identity, electrical and physical characteristics, qualified same-footprint alternatives, comparison parameters, application guidance, and practical PCB considerations. It supports faster engineering review while directing critical pin assignment and configuration decisions to the official AMD documentation and package files.

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XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD
XC6SLX45-N3FG676C

XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD

AMD XC6SLX45-N3FG676C is a Spartan-6 LX field-programmable gate array containing 43,661 logic elements, providing 358 I/O in a 676-ball FCBGA package. Manufactured on a 45 nm low-power copper process, the device combines programmable logic, fixed and configurable I/O, block RAM, and DSP resources in one reconfigurable semiconductor. It is positioned for cost-sensitive embedded systems requiring substantial parallel processing without the power and complexity of a high-end FPGA. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be programmed after manufacture. The Spartan-6 family occupies the configurable-logic and embedded-processing tiers of the FPGA hierarchy, below higher-performance programmable logic devices while providing broad I/O and embedded-memory capability. The XC6SLX45 is particularly useful when parallel data paths, deterministic control, hardware acceleration, or flexible field updates are required. The principal characteristics include 43,661 logic elements, 358 I/O, a 676-FCBGA package, and a 45 nm low-power copper implementation. These resources suit image pipelines, industrial controllers, communications equipment, test systems, and embedded signal-processing designs. The large I/O count also permits simultaneous connections to external memory, converters, transceivers, and parallel peripherals, reducing the need for additional interface logic. Spartan-6 LX devices combine programmable logic with block RAM and dedicated DSP arithmetic resources. This heterogeneous architecture allows parallel datapaths to be implemented more efficiently than with a bank of general-purpose processors. The device can support deterministic hardware control, protocol termination, data filtering, and real-time signal transformation, while configuration storage preserves the programmed function after power-up. Typical uses include industrial automation, video and imaging, communications infrastructure, instrumentation, and embedded control platforms. Its 358 available I/O is especially attractive for high-pin-count designs requiring memory interfaces and multiple external buses. Designers can also use the FPGA fabric to implement custom peripherals, bridge incompatible interfaces, or accelerate computationally intensive operations before transferring summarized results to a host processor. Design planning should begin with the AMD Spartan-6 package pinout and pinout files, followed by verification of power rails, configuration interface, clocking, and high-speed routing constraints. Because the exact ordering code and grade-specific timing information control the final qualification, the applicable AMD data sheet, package files, and design-support documentation should remain the authority for schematic and PCB implementation. This product overview consolidates the device identity, package characteristics, searchable ordering-code references, drop-in family alternatives, and practical design considerations into one engineering-focused resource. It supports initial device selection while distinguishing exact-footprint alternatives from options that would require a different package or PCB redesign.

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XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD
XC6SLX45-N3FG676I

XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD

The AMD XC6SLX45-N3FG676I is a Spartan-6 LX field-programmable gate array with 358 I/O and a 676-BGA package. The FPGA integrates programmable logic, configurable digital resources, block RAM, and dedicated DSP resources into a single device. Its 676-BGA land pattern supports dense PCB layouts where several high-speed interfaces and parallel buses must be implemented in a compact area. The device is positioned for industrial control, communications, instrumentation, embedded vision, and general-purpose programmable logic applications. An FPGA is a semiconductor whose digital behavior is configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel data paths, control logic, protocol bridges, signal processors, and hardware accelerators within one device. The Spartan-6 LX family occupies the FPGA product hierarchy: FPGA and CPLD devices are programmable-logic semiconductors, while the LX designation identifies the device family optimized for low-cost, system-level integration. The XC6SLX45-N3FG676I combines a 45-class Spartan-6 LX device designation with 358 user I/O in a 676-BGA package. This high pin count is useful when an interface requires substantial parallel connectivity, but it also makes ball assignment, power planning, and PCB layout more demanding than a smaller package. Designers should preserve the manufacturer's recommended ball map and distinguish fixed configuration pins, clock inputs, general-purpose I/O, and dedicated function pins before routing the board. Spartan-6 LX devices are well suited to designs that need flexible logic density without moving to a larger device family. Common implementation areas include parallel-to-serial data conversion, industrial control and data acquisition, network-interface front ends, embedded control logic, audio and communications signal conditioning, and test equipment. Programmable logic can also be combined with external processors or mixed-signal devices when deterministic timing, parallel processing, or multiple interface standards are required. Thermal and signal-integrity planning are central to a 676-BGA design. Although the package provides substantial interconnection capacity, high-speed nets should use controlled-impedance routing, continuous reference planes, and the shortest practical connections. Power and ground distribution should follow the manufacturer's ball assignments, and unused balls should follow the package-specific assembly and termination requirements rather than being treated as interchangeable connections. The most important replacement decision is package and pin compatibility. A device with the same 676-BGA outline is not automatically interchangeable because speed-grade, temperature-grade, and device identifiers can change I/O behavior or performance. Validate the complete pinout, configuration requirements, power rails, clock resources, and timing before approving any substitute. This page consolidates the exact package and I/O information, compatible Spartan-6 LX candidates, application guidance, and board-level design considerations for engineers evaluating the XC6SLX45-N3FG676I. It is intended to accelerate component identification, replacement screening, PCB planning, and system integration without changing the verified manufacturer naming.

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XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-2FG484I

XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

The AMD XC6SLX45T-2FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 3,411 configurable logic blocks, 6,822 adaptive logic modules, and 296 I/O, supplied in a 484-pin FBGA package. The verified part data identifies a 45 nm CMOS device with a 1.2 V core supply, 667 MHz performance figure, 23 mm by 23 mm package dimensions, and 1.0 mm ball pitch. Its -2 speed grade is intended for designs requiring a balance of logic density, embedded memory, DSP capability, and programmable I/O rather than the highest Spartan-6 performance tier. An FPGA is a programmable-logic semiconductor whose interconnect, logic, and I/O resources can be configured after manufacture. Spartan-6 devices belong to the FPGA and CPLD product hierarchy and combine configurable logic blocks with programmable input/output blocks, block RAM, DSP resources, clock management, and dedicated configuration mechanisms. The XC6SLX45T-2FG484I is suited to embedded systems requiring parallel interfaces, protocol handling, signal processing, control logic, and moderate on-chip data storage. Key verified features include the 43,661-cell Spartan-6 LXT architecture, 296 I/O, 3,411 configurable logic blocks, 6,822 adaptive logic modules, a 667 MHz listed operating-frequency figure, and a 1.2 V supply requirement. The 484-BBGA footprint provides a high pin count for systems using wide external buses, multiple high-speed interfaces, or several independent peripherals. The industrial-temperature suffix I identifies the grade used when the system requires operation across the industrial temperature range; exact limits are not supplied in the retrieved snippets. The device is built on 45 nm CMOS technology and is positioned for cost-sensitive, high-volume embedded applications where deterministic programmable logic is more valuable than a fixed function. The -2 speed grade provides a lower-performance option than the -3 grade identified in cross-reference data. Engineers should also consider clocking, configuration memory, power sequencing, I/O standards, and thermal dissipation when integrating the BGA package. Typical applications include industrial control gateways, networked embedded equipment, instrumentation, video and image processing, communications infrastructure, and consumer electronics. Its 296 I/O count is useful for bridging legacy parallel peripherals to serial networks, while its logic density can consolidate multiple fixed-function devices. The FPGA still requires a correctly configured bitstream, a suitable clock source, decoupling network, and thermal-aware PCB layout. The principal design consideration is package-level implementation. A 484-BBGA device requires a fine-pitch PCB land pattern, careful via-in-pad and escape-routing strategy, adequate thermal copper, and assembly process control. Designers should verify the exact Spartan-6 pinout and configuration requirements using the manufacturer package files before schematic or layout release. This page combines verified distributor and manufacturer references, drop-in family alternatives, and practical selection guidance for engineers evaluating the XC6SLX45T-2FG484I.

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XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484C

XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484C is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 296 I/O, and a 484-pin FBGA package. The device uses 45 nm CMOS technology and operates from a 1.2 V supply, making it a configurable logic platform for embedded control, communications, signal processing, and industrial systems. An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable I/O, embedded memory, clocking, and digital signal-processing resources. Designers implement and revise hardware behavior through a configuration bitstream rather than changing the integrated-circuit mask. The XC6SLX45T combines 43,661 logic cells with 296 I/O in the FG484C 484-pin FBGA package. Its -3 designation identifies the device speed grade used in the ordering code. The verified product listings also identify 45 nm CMOS fabrication and a 1.2 V operating supply. These resources make the device suitable for designs requiring parallel interfaces, protocol bridging, embedded control logic, and moderate signal-processing throughput. The Spartan-6 LXT architecture supports integration of programmable logic with dedicated block RAM and DSP resources. This allows a single FPGA to implement control state machines, packet buffering, waveform generation, filtering, and external interface bridging. The 296 available I/O provide substantial connectivity for parallel buses, memory interfaces, clocks, and control signals, although the exact user-assigned I/O standards must be confirmed against the manufacturer documentation. Typical applications include industrial automation, embedded instrumentation, communications equipment, video and image processing, motor control, and general-purpose digital signal processing. In each case, the FPGA is configured after power-up and can implement parallel processing or hardware protocols that would otherwise require several discrete logic devices, processors, memories, and interface components. Design planning must include the correct 484-BBGA footprint, power-plane distribution for the 1.2 V core rail, decoupling, configuration-interface implementation, and thermal analysis. Because the verified excerpts do not provide the complete pin table, pinout file contents, or package dimensions, engineers should download the official Spartan-6 documentation and verify all ball assignments before layout release. This page combines verified distributor specifications, availability information, and carefully qualified same-brand replacement guidance. It also adds application-focused design considerations, package comparison data, and explicit data gaps so procurement and engineering teams can distinguish documented facts from information that still requires manufacturer-document confirmation.

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XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484I

XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 45 nm CMOS technology, a 1.2 V supply specification, and a 484-ball FBGA package. The -3 suffix identifies the performance speed grade, while the industrial-temperature suffix supports deployments across demanding embedded, communications, industrial-control, and test-equipment environments. Its programmable logic architecture combines configurable logic, dedicated hardware resources, block RAM, and DSP resources in one integrated device. An FPGA is a digital semiconductor whose internal logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LXT family sits between low-cost Spartan-6 LX devices and larger FPGA families, balancing logic density, embedded processing support, connectivity, and implementation cost. XC6SLX45T-3FG484I is therefore useful when a fixed-function controller is insufficient but a larger or more expensive programmable-logic platform would be unnecessary. The verified product information identifies 43,661 logic cells, 45 nm CMOS fabrication, and 1.2 V operation for this device. The 484-ball package provides a high-density surface-mount interface suitable for multilayer PCB designs. The -3 speed designation is a meaningful selection criterion because FPGA timing, achievable clock rates, and design-tool performance targets must be evaluated together rather than treating the FPGA as a conventional fixed-function IC. Spartan-6 LXT devices are designed for parallel processing, high-speed interface bridging, custom data acquisition, industrial automation, communications infrastructure, embedded vision, and test-and-measurement systems. Their parallel logic fabric allows multiple independent channels or algorithms to execute concurrently, while dedicated block RAM reduces external-memory traffic for suitable buffering operations and DSP slices accelerate arithmetic-heavy filtering and signal-processing tasks. The primary PCB constraint is the 484-ball FBGA land pattern. Because its interconnects are fine-pitch and distributed beneath the package, escape routing, power-plane continuity, via structure, solder-mask design, and assembly capability require careful planning. The design must also be checked against the selected AMD or Xilinx implementation toolchain and the exact device, package, speed grade, and temperature-grade identifiers. Before releasing a new PCB, compare the target against XC6SLX45T-2FG484C, XC6SLX45T-2FGG484I, XC6SLX45T-N3FG484I, XC6SLX45-3FG484I, and XC6SLX45T-3FGG484I using the package pin files and device selection guidance. Speed-grade, temperature-grade, marking, and ordering-code differences affect qualification even when the mechanical footprint remains unchanged. This product page consolidates verified distributor pricing, package information, same-footprint alternatives, technical comparison data, and practical PCB-design guidance. Those details help engineers separate true pin-compatible purchasing alternatives from superficially similar Spartan-6 devices and support faster procurement, qualification, and design-review decisions.

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XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484C

XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX75-2CSG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 3,170,304 bits of block RAM, 11,662 adaptive logic modules, and 328 I/O in a 484-CSBGA package. The device operates from a 1.2 V core supply and belongs to the Spartan-6 LX FPGA family, providing programmable logic, embedded memory, and DSP resources within one integrated device. A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture through a configuration bitstream. The FPGA hierarchy places this device within programmable logic devices and complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control, protocol handling, signal generation, and interface logic in configurable hardware, allowing product revisions without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic cells and 3.02 Mbit of embedded memory for the XC6SLX75, with 11,662 adaptive logic modules and 132 DSP48A1 slices documented for the related XC6SLX75T configuration. The target package provides 328 user I/O, making the device suitable for designs requiring substantial parallel connectivity. Its 45 nm CMOS construction also places it within AMD's cost-conscious, low-power FPGA product positioning. The XC6SLX75 architecture can support parallel data processing, fixed-point DSP, control-plane logic, embedded-memory buffering, and communication interfaces. The -2 speed designation identifies the performance grade used for timing analysis and design constraints. The C suffix identifies the commercial temperature grade, while the 484-CSBGA package provides a high-density ball-grid interconnect suitable for multilayer PCB designs requiring many external connections. Typical uses include industrial control, test and measurement, video processing, communications infrastructure, embedded signal processing, and general-purpose programmable-logic platforms. Because the device combines substantial logic and memory capacity, it can consolidate several fixed-function components while retaining the flexibility to update configurations as interfaces or algorithms evolve. Projects should still verify timing, power, pinout, and configuration requirements against the exact Spartan-6 design tools and package documentation. PCB implementation requires careful power-plane distribution, decoupling, ball-escape routing, and thermal analysis for the 484-CSBGA package. The core rail is 1.2 V, while auxiliary supply requirements and configuration interface details must be taken directly from the manufacturer data sheets. Use the package pinout files and power-guidance documentation when assigning every ball and planning the power distribution network. This page combines the verified family-level characteristics, package information, searchable alternatives, comparison parameters, and practical implementation guidance in one engineering reference. It also distinguishes footprint-compatible Spartan-6 variants by speed grade, temperature grade, and device suffix so that a mechanical substitution is not mistaken for a fully qualified functional replacement.

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XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484I

XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2CSG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 11,662 adaptive logic modules, 3.02 Mbit of embedded memory, and up to 292 I/O in a 484-FBGA package. The device uses 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified by the -2 performance grade and I industrial temperature suffix. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, field-programmable gate arrays, and system-programmable devices. Spartan-6 LX devices provide parallel programmable logic resources for control, signal processing, communications, and embedded-system designs. The XC6SLX75-2CSG484I provides 74,637 logic cells and 11,662 adaptive logic modules. Its 3.02 Mbit of embedded block RAM supports buffering, packet storage, data acquisition, and general-purpose digital processing. The 292 available I/O provide connections to external converters, memory, communications transceivers, and control logic. These figures position the device between smaller Spartan-6 parts and higher-density programmable-logic devices. The part is manufactured on a 45 nm CMOS process and uses a 1.2 V core voltage. The -2 ordering code identifies the performance grade, while CSG484 identifies the 484-ball surface-mount package. An I suffix denotes the industrial temperature option. Because the available listing does not provide complete timing, power, I/O-standard, and absolute-maximum data, those details must be confirmed in the manufacturer documentation before a design is released. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, data acquisition, and compact control systems. Its combination of 74,637 logic cells and 3.02 Mbit of embedded memory allows designers to implement parallel algorithms and control functions in one programmable device while simplifying the logic around external ADCs, transceivers, and processors. PCB implementation requires careful BGA escape routing, power planning, decoupling, and thermal analysis. Because this is a 484-ball package, signal-integrity and assembly considerations are more significant than for a leaded package. The CSBGA footprint must match the PCB land pattern exactly, and the complete pinout must be checked against the selected Spartan-6 package documentation before routing. This page combines verified distributor and cross-reference data with practical qualification guidance for engineers evaluating the XC6SLX75-2CSG484I. It distinguishes documented density, memory, voltage, package, and lifecycle facts from unreported parameters and identifies the temperature- and package-code alternatives that require design review.

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