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📁 ADC/DAC 3,100+ پروڈکٹس 📁 ایمپلیفائر ICs 1,900+ پروڈکٹس 📁 آڈیو کوڈیکس 18 پروڈکٹس 📁 آڈیو ICs 2 پروڈکٹس 📁 گھڑی اور وقت بندی 670+ پروڈکٹس 📁 Comparator ICs 1 پروڈکٹس 📁 DSP 1,100+ پروڈکٹس 📁 ڈیٹا ایکوزیشن ICs 2 پروڈکٹس 📁 ڈیجیٹل پوٹینشیومیٹرز 4 پروڈکٹس 📁 ڈسپلے ڈرائیورز اور کنٹرولرز 1 پروڈکٹس 📁 FPGA اور CPLD 7,300+ پروڈکٹس 📁 انٹرفیس ICs 3,400+ پروڈکٹس 📁 LED ڈرائیورز 1 پروڈکٹس 📁 لاجک ICs 460+ پروڈکٹس 📁 میموری ICs 870+ پروڈکٹس 📁 مائیکرو کنٹرولرز 20,000+ پروڈکٹس 📁 مائیکرو پروسیسرز 4 پروڈکٹس 📁 موٹر ڈرائیورز 1 پروڈکٹس 📁 دیگر 1 پروڈکٹس 📁 سینسر اور ڈیٹیکٹر انٹرفیسز 1 پروڈکٹس 📁 اسپیشلائزڈ ICs 15 پروڈکٹس 📁 ویڈیو ICs 14 پروڈکٹس

مصنوعات (39,000+)

EP2S130GF1508C3N - Stratix II FPGA, 132K LEs, 1508-FCBGA | Altera
EP2S130GF1508C3N

EP2S130GF1508C3N - Stratix II FPGA, 132K LEs, 1508-FCBGA | Altera

The Altera (Intel) EP2S130GF1508C3N is a Stratix II family Field Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FCBGA) package. The device integrates 132,540 logic elements, 6,747,840 bits of embedded memory, and 1126 18x18-bit multipliers in a single die, fabricated on a 90 nm CMOS process and aimed at high-density DSP, datapath, and memory-rich designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) interconnected by a programmable routing fabric. It belongs to the broader hierarchy programmable logic device (PLD) -> CPLD/FPGA -> system-on-chip fabric -> semiconductor. FPGAs are differentiated from ASICs by being fully reconfigurable in the field, while delivering ASIC-class throughput for parallel workloads such as digital signal processing, packet processing, and high-speed interfacing. Key features of the EP2S130GF1508C3N include up to 36 embedded DSP blocks organized into a column-based multiplier/accumulator fabric, support for external memory interfaces up to DDR2 SDRAM and QDRII/RLDRAM-II, and a multi-gigabit transceiver-less general-purpose I/O subsystem with up to 1126 user I/Os. The device also supports Altera's Enhanced Configuration (EPC) devices for fast parallel configuration from flash memory. The Stratix II architecture uses an adaptive logic module (ALM) containing 8 inputs and a fracturable look-up table (LUT) that can be split into two 4-input LUTs or recombined to implement 7-input functions. Combined with the TriMatrix memory block hierarchy (MLABs, M512, M4K, M-RAM), the device delivers very high logic utilization and block-memory density for dataflow applications. Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-throughput memory controllers. The 1508-FCBGA package with exposed thermal lid enables high I/O density and efficient heat extraction for full-power operation. When designing with this device, pay close attention to power integrity and decoupling: the 1508-BGA package requires a multi-layer PCB with continuous power and ground planes beneath the device. Use the Quartus II power calculator and thermal-aware pin planner to manage the >15 W typical dissipation at full DSP utilization. This page synthesizes distributor stock, Stratix II family drop-in alternatives, and design notes not found in the manufacturer datasheet. Last refreshed 2026-09-09.

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EP2S15F484C3 - Stratix II FPGA, 15600 LE, 484-FBGA | Intel
EP2S15F484C3

EP2S15F484C3 - Stratix II FPGA, 15600 LE, 484-FBGA | Intel

The Intel EP2S15F484C3 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) fabricated on a 90 nm process, integrating 15,600 logic elements, 15600 logic elements, 419,328 bits of embedded memory, and 342 user I/Os in a 484-ball fine-pitch BGA (FBGA) package. Speed grade -3 denotes a commercial temperature-grade device optimized for higher toggle rates, and it is offered in tray packaging. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-programmable processors. Stratix II placed particular emphasis on adaptive logic modules (ALMs), each containing a fractured look-up table (LUT) structure that improves logic packing density versus earlier Stratix devices. Key features of this part include 780 LABs/CLBs, 6,240 ALMs, 156 DSP blocks capable of up to 384 GMACs of DSP throughput, four embedded PLLs for clock management, and up to 12 phase-locked loops with up to 16 global clock networks. The device supports a wide variety of I/O standards including LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X, and LVTTL, and integrates 419 Kbits of embedded RAM block memory plus additional logic-array distributed memory. Architecturally, Stratix II introduced the TriMatrix memory hierarchy with three block RAM sizes (M512, M4K, M-RAM) and a row-based architecture that places memory and DSP columns adjacent to the logic array. This provides predictable timing for high-throughput data paths in applications such as wireless baseband, video processing, and high-speed serial interfaces. The 90 nm process node combined with a 1.2 V core voltage gives the device a balance of performance and power efficiency for mid-density designs. Typical applications include telecommunications infrastructure, software-defined radio, high-speed imaging and video pipelines, ASIC prototyping, and industrial control. The device is also frequently used in test and measurement equipment where its DSP blocks and large memory are well matched to real-time signal processing. When designing with this FPGA, engineers must supply multiple voltage rails (core, PLL, I/O banks) and observe strict PCB layout requirements for the FBGA substrate, including microvia or via-in-pad construction to break out the 1.0 mm pitch BGA. Quartus II is the canonical design toolchain for programming and configuring this device family. This page synthesizes distributor pricing, same-family and cross-package alternatives, and practical design notes not collated in any single manufacturer document.

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EP2S15F484C3N - Stratix II FPGA 15K LEs 342 I/O 484FBGA | Intel
EP2S15F484C3N

EP2S15F484C3N - Stratix II FPGA 15K LEs 342 I/O 484FBGA | Intel

Intel EP2S15F484C3N is a member of the Stratix II FPGA family housed in a 484-ball FineLine BGA package (484FBGA) with 342 user I/O pins, designed around 15,600 logic elements and 419,328 bits of embedded memory. The C3 speed grade and industrial temperature profile make it a workhorse for medium-density, high-throughput digital designs that need embedded DSP and TriMatrix memory. A field programmable gate array (FPGA) is a semiconductor device whose logic fabric, interconnect, and I/O cells are configured after manufacture via a configuration bitstream, allowing the same silicon to implement almost any digital function from glue logic to fully featured processors. Within the broader taxonomy, the EP2S15 sits as an FPGA under programmable logic, which sits under digital logic ICs, which sit under integrated circuits. Stratix II was Intel's second-generation high-end FPGA, succeeding Stratix I with a refined 90 nm logic architecture and adaptive look-up tables (ALUTs) that improved performance per LE relative to its predecessor. Key features include 15,600 logic elements, 419,328 RAM bits organized into TriMatrix memory blocks, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDRAM, QDR, and RLDRAM. The device exposes 342 user I/Os across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X signaling. Configurable logic capacity is complemented by 15600 equivalent LEs, an internal configuration scheme, JTAG boundary scan, and active serial/parallel configuration modes. Typical applications include telecom line cards, high-speed serial protocol bridging (SPI 4.2, SFI, UTOPIA), DSP co-processing for radar and imaging, broadcast video processing, and PCI/PCI-X bus expansion. The combination of embedded multipliers and TriMatrix memory also suits software-defined radio front-end datapaths and ASIC prototyping. When designing with the EP2S15F484C3N, pay attention to power integrity on the 484-ball BGA - the Stratix II datasheet recommends a multi-layer PCB with dedicated power and ground planes and at least six PCB layers for signal integrity at DDR2 rates. Decoupling must follow Intel's reference decoupling network. Configuration scheme selection (AS, PS, JTAG, or Fast Passive Parallel) must be planned early because it affects pin allocation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2S15F484C4 - Stratix II FPGA, 15.6K LEs, 484-FBGA | Intel
EP2S15F484C4

EP2S15F484C4 - Stratix II FPGA, 15.6K LEs, 484-FBGA | Intel

The Intel EP2S15F484C4 is a member of the Stratix II FPGA family, featuring 15,600 logic elements (LEs) and 6,240 adaptive logic modules (ALMs/CLBs) in a 484-pin FineLine BGA (FBGA-484) package at 23 mm x 23 mm with 1 mm ball pitch. It integrates 419,328 bits of embedded RAM, up to 342 user I/O pins, and supports core speeds up to 717 MHz, making it a high-density programmable logic device for mid-range high-performance designs. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that uses programmable logic blocks and interconnect fabric to implement custom digital circuits. Within the broader hierarchy, an FPGA is a type of programmable logic device (PLD), a sibling category to ASICs, microcontrollers, and DSPs. The Stratix II family sits in the upper-mid tier of Intel's (formerly Altera) FPGA portfolio, optimized for high logic density, embedded memory, and DSP performance — bridging between the lower-cost Cyclone series and the high-end Stratix V/10 families. The EP2S15F484C4 is built on a 90 nm CMOS process and integrates DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory supporting true dual-port RAM, FIFO, and shift-register modes, plus high-speed transceiver support in select package variants. Its adaptive logic module architecture provides fine-grained logic packing efficiency, delivering approximately 4x the logic capacity per area compared to the prior Stratix generation. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, plus external memory interfaces to DDR, DDR2, and QDR SRAM. Typical applications include telecommunications line cards, baseband processing, military/aerospace signal processing, industrial imaging and machine vision, and high-throughput data-acquisition systems. The 484-FBGA package provides adequate I/O count for parallel external memory buses and multi-gigabit SERDES interfaces. Designers should use the Quartus II design suite (version supporting Stratix II) for synthesis, place-and-route, and timing closure. Pay attention to thermal dissipation at high toggle rates — the FBGA-484 package benefits from a thermal pad and forced-air cooling. The EP2S15F484C4 variant denotes the -4 speed grade (mid-tier) and C-grade temperature range (commercial, 0 C to +85 C junction). Pricing as of 2026-09-09 is approximately $334 per unit per the Heisener distributor listing. This page synthesizes distributor inventory, drop-in alternatives, pin-by-pin package matching, and practical design notes not consolidated on any single manufacturer or distributor page.

USD $205.00 رابطہ
EP2S15F484C4N - 15,600 LEs Stratix II FPGA 484-BGA | Intel
EP2S15F484C4N

EP2S15F484C4N - 15,600 LEs Stratix II FPGA 484-BGA | Intel

The Intel (formerly Altera) EP2S15F484C4N is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 15,600 logic elements, 419,328 bits of embedded RAM, and 342 user I/O in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm. The device belongs to the C4 speed grade (commercial, -4 speed) and supports a core supply of 1.15 V to 1.25 V with PLL support up to 717 MHz, targeting high-performance digital signal processing, telecom, and embedded computing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from configurable logic blocks (CLBs/LEs), programmable routing, embedded memory, and hardened IP such as multipliers, transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they are parallel by hardware, reprogrammable in the field, and typically consume more power than a comparable ASIC while delivering much faster time-to-market. Stratix II sits in the high-performance tier of the Altera/Intel FPGA portfolio, positioned above Cyclone II and below Stratix III/IV for designs needing high logic density, embedded memory bandwidth, and DSP throughput. Key features of the EP2S15F484C4N include 780 LABs (Logic Array Blocks), 15600 logic elements, up to 156 embedded multipliers (18 x 18), dedicated DSP blocks, TriMatrix embedded memory with 419,328 total RAM bits, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also includes 6 PLLs and up to 342 user I/O pins, with configuration supported through passive serial, fast passive parallel, and JTAG modes. Architecturally, Stratix II introduced the adaptive logic module (ALM) - an 8-input fracturable LUT replacing the classic 4-input LUT - which improves logic packing density by roughly 25% versus Stratix I. The 90 nm process node and 1.2 V core supply deliver a balance of performance and dynamic power, while the C4 speed grade positions this part for moderate-speed commercial designs rather than the highest timing closure requirements. Typical applications include telecom line cards, network switches/routers, high-speed image processing, military/aerospace signal processing, ASIC prototyping, and industrial control systems with DSP-intensive processing pipelines. The 484-BGA package and 342 user I/Os make this part suitable for systems requiring high off-chip bandwidth, such as parallel ADC/DAC interfaces, memory controllers, and backplane connectivity. Designers should note that the Stratix II family is mature and approaching end-of-life. Production planning should account for last-time-buy notices, and new designs should evaluate Stratix IV/V or Cyclone V as successors depending on logic, transceiver, and power requirements. The 484-BGA package requires careful PCB layout with multiple inner power/ground planes, controlled-impedance routing for high-speed signals, and a 4-6 layer stack-up minimum. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a consolidated reference for the EP2S15F484C4N that supports AI search and component selection workflows.

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EP2S15F484C5 - Stratix II FPGA, 15.6K LE, 342 I/O, 484-FBGA | Intel
EP2S15F484C5

EP2S15F484C5 - Stratix II FPGA, 15.6K LE, 342 I/O, 484-FBGA | Intel

The Intel EP2S15F484C5 is a Stratix II family field-programmable gate array (FPGA) housed in a 484-ball fine-pitch chip-scale BGA (FBGA) package, integrating 15,600 logic elements (LE), 6240 adaptive logic modules (ALMs), 780 LABs/CLBs, and 409 Kbit of embedded memory. According to the Stratix II family data, this device offers 342 user I/O, a 1.2 V core supply, and a maximum operating frequency around 609.76 MHz per distributor listings, making it suitable for high-throughput parallel datapath designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/ALMs), programmable routing channels, and dedicated hardware such as DSP blocks, block RAM (BRAM), and high-speed transceivers. FPGAs occupy a unique tier in the digital semiconductor hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in per-unit cost. They are re-programmed via configuration bitstreams, allowing engineers to implement custom parallel pipelines, soft processors, and interface bridges without the NRE cost of ASIC fabrication. Key features of the EP2S15F484C5 include Stratix II architecture with ALM-based logic, on-chip TriMatrix memory, embedded DSP blocks for high-speed multiply-accumulate operations, and support for external memory interfaces including DDR/DDR2 SDRAM, QDR II SRAM, and RLDRAM. The device targets design entries requiring up to 342 signal-breakout pins and operates across an industrial-grade temperature range. Built on a 90 nm process, the Stratix II family introduced ALM-based logic that improves packing efficiency over the prior 4-input LUT approach used in Stratix I. Typical applications include high-speed DSP pipelines (radar, baseband, video processing), telecom line-card datapaths, network protocol bridges, and parallel ASIC prototyping. Stratix II devices ship with Quartus II design software support. When designing with this part, ensure 1.2 V core decoupling is robust (low-ESL ceramic, multiple bulk capacitors), implement multi-voltage sequencing for 1.2 V core / 2.5 V / 3.3 V aux rails, and respect the I/O-bank VCCIO grouping rules per the FBGA pinout map.

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EP2S15F484C5N - Stratix II FPGA, 15K LEs, 484-FBGA | Intel
EP2S15F484C5N

EP2S15F484C5N - Stratix II FPGA, 15K LEs, 484-FBGA | Intel

The Intel EP2S15F484C5N is a member of the Stratix II family of high-performance FPGAs fabricated on a 90 nm process, integrating 15,600 equivalent logic elements (LEs) and up to 419 Kbits of embedded RAM into a 484-ball FineLine BGA package. It is a field-programmable gate array (FPGA) intended for high-speed digital logic, DSP, and embedded processing tasks in telecommunications, networking, and signal-processing designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital circuits through configuration memory rather than fixed mask lithography. FPGAs sit within the broader hierarchy of semiconductors: programmable logic -> PLD -> FPGA -> high-density FPGA. Stratix II devices occupy the high-performance tier of this hierarchy, offering dedicated DSP blocks, embedded transceivers on selected variants, and TriMatrix embedded memory that accelerates DSP, video, and packet-processing pipelines. Key features of the EP2S15F484C5N include 15,600 LEs, 419 Kbits of embedded RAM, dedicated DSP blocks for fixed- and floating-point arithmetic, support for external memory interfaces including DDR/DDR2 SDRAM and QDR II SRAM, and up to 342 user I/O pins. The -C5 speed grade designates a balanced performance/power operating point, while the industrial temperature range supports deployment in demanding environments. Internal configuration is achieved through active serial (AS), passive serial (PS), or JTAG interfaces. Architecturally, the Stratix II family introduced an adaptive logic module (ALM) structure that improved logic utilization versus prior architectures, paired with high-speed Row/Column interconnect. The device integrates PLLs for clock management, supports source-synchronous interfaces up to 1 Gbps on selected pins, and includes hardware multipliers optimized for DSP pipelines. The 484-FBGA package exposes enough I/O to drive multiple DDR2 channels in parallel. Typical applications for the EP2S15F484C5N include telecom line cards, baseband signal processing, video format conversion, military and aerospace signal processing, ASIC prototyping, and high-performance DSP coprocessing. The device is well suited as a hardware accelerator for compute-intensive algorithms or as a prototyping vehicle prior to ASIC tape-out. When designing with this device, allocate sufficient decoupling across the multi-rail supply pins (VCCINT, VCCIO, VCCA, VCCD_PLL), follow the Stratix II pin connection guidelines to tie unused pins to defined logic levels, and validate timing closure using the Quartus II design suite. PCB layout should target matched impedance for high-speed transceiver and DDR2/QSPI routes. This page synthesizes distributor pricing, drop-in package-compatible Stratix II alternatives, comparison data, and practical design notes not collated in the manufacturer datasheet alone.

RFQ رابطہ
EP2S15F484I4 - Stratix II FPGA, 15K LE, 484-FBGA, Industrial | Altera
EP2S15F484I4

EP2S15F484I4 - Stratix II FPGA, 15K LE, 484-FBGA, Industrial | Altera

The Altera (Intel) EP2S15F484I4 is a Stratix II family Field Programmable Gate Array (FPGA) with 15,600 logic elements, 419,328 bits of embedded RAM, and 342 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package at industrial temperature grade (-40C to +100C). Built on a 90 nm process node with a 1.2 V core supply, it integrates up to 12 transceiver blocks and dedicated DSP blocks for high-throughput signal processing in a single device. The 484-pin FBGA package provides high I/O density for memory-rich and transceiver-heavy designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that lets engineers configure digital logic, memory blocks, and I/O after manufacturing. Within the semiconductor hierarchy, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: more flexible than an ASIC and far more parallel than a CPU. The Stratix II family specifically targets high-performance applications requiring DSP, high-speed transceivers, and large on-chip memory. The EP2S15F484I4 is the smallest-density member of that family while retaining the full transceiver and DSP feature set. Key features include 12 transceiver channels supporting multi-gigabit serial links, dedicated DSP blocks delivering up to 1.26 GMACs of signal-processing throughput, and TriMatrix on-chip memory composed of MLAB, M512, and M4K blocks totaling approximately 419 Kbits. Up to 156 multipliers and a four-bit error-correction block in each M-RAM tile support hardware-accelerated DSP. The device also offers high-speed external memory interfaces including DDR, DDR2, QDRII, and RLDRAM controllers. Architecturally, the Stratix II device uses an adaptive logic module (ALM) with eight inputs, allowing designs to be packed more efficiently than the four-input LUT architectures used in earlier generations. Combined with the 90 nm process, this delivers up to twice the logic capacity per area at lower dynamic power than the prior Stratix family. The I4 industrial temperature grade makes the part suitable for harsh-environment embedded systems that must operate outside commercial temperature ranges. Typical applications include high-end telecommunications backhaul equipment, broadband aggregation routers, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of embedded transceivers, large on-chip memory, and DSP blocks makes the EP2S15F484I4 well suited to designs that require parallel processing alongside high-speed serial I/O. Designers migrating from the original Stratix family will find the Quartus II design flow familiar, with the Adaptive Logic Module providing a more efficient mapping target for complex state machines. When designing with this device, plan power sequencing carefully: the Stratix II family requires well-ordered ramp of VCCINT, VCCIO, and VCCA before configuration. Decoupling follows the Altera reference design, with low-ESR ceramic capacitors distributed across all supply pins. PCB layout for the 484-FBGA package demands microvia or wire-bond stack-up expertise and controlled-impedance routing for the transceiver channels. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II family, and practical design notes not found in the manufacturer datasheet.

RFQ رابطہ
EP2S15F484I4N - 15K Logic FPGA, 484-BGA | Intel
EP2S15F484I4N

EP2S15F484I4N - 15K Logic FPGA, 484-BGA | Intel

Intel EP2S15F484I4N is a Stratix II field-programmable gate array with 15,600 logic elements, 419,328 bits of embedded memory, 342 I/O pins, and 484-ball fine-pitch ball grid array packaging. Verified distributor data identifies it as a 1.2 V FPGA in the 484-BBGA package, with industrial temperature grading and a 1.2 V supply requirement. Its combination of programmable logic, embedded memory, and high I/O count supports complex digital systems where fixed-function ASICs would be inflexible. A field-programmable gate array is a programmable semiconductor device built from configurable logic blocks, routing resources, input/output elements, and often embedded memory and DSP-oriented blocks. FPGA devices sit within the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Engineers configure the logic and interconnect to implement control, communications, interface, and signal-processing functions after fabrication, enabling design changes without a new silicon mask set. The key electrical and physical characteristics include 15,600 logic elements, 419,328 memory bits, 342 I/O pins, 484 BGA balls, and a 1.2 V operating voltage. The large logic capacity and embedded memory allow parallel digital functions and data buffering within one package. The 342 I/O pins provide broad connectivity for external buses, control signals, and high-speed interfaces. The fine-pitch BGA format supports dense board routing but requires controlled assembly and reliable thermal design. The device belongs to the Stratix II FPGA family and is associated with 780 configurable logic blocks in the supplied distributor and comparison data. Its architecture is intended for configurable digital implementation rather than fixed application-specific processing. The combination of logic resources and embedded memory can be used for register-intensive designs, protocol handling, state machines, and interface bridging. Exact performance values such as maximum clock frequency, transceiver count, operating temperature limits, package dimensions, and supported I/O standards are not present in the supplied verified text and therefore require datasheet verification. Typical applications include industrial control, communications equipment, test and measurement, data acquisition, digital signal processing, and embedded systems. The 15,600 logic elements and 419,328 memory bits suit designs requiring substantial programmable logic and local storage, while 342 I/O pins support external memory, converters, processors, and peripheral interfaces. The 484-BBGA package is appropriate for space-constrained systems that need high connection density. A primary design consideration is that BGA assembly requires precise land-pattern implementation, via-in-pad or escape routing planning, controlled impedance where applicable, and thermal analysis. Before production, confirm pin assignments, voltage tolerances, configuration requirements, clock limits, and industrial temperature limits from the manufacturer datasheet. This page combines verified distributor specifications, compatible-device guidance, comparison parameters, and engineering design considerations to support part selection and BOM review.

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EP2S15F672C3 - Stratix II FPGA 15K LE, 672-FBGA | Intel / Altera
EP2S15F672C3

EP2S15F672C3 - Stratix II FPGA 15K LE, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S15F672C3 is a member of the Stratix II family of high-performance FPGAs, integrating 15,600 logic elements, 419,328 bits of embedded RAM, and 156 hardware DSP blocks in a 672-ball FineLine BGA package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, while supporting a maximum user I/O count of 366 across 12 I/O banks. A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic resources, routing, and I/O cells can be programmed by the end user to implement custom digital functions, glue logic, DSP pipelines, or even complete processor subsystems. Stratix II devices sit in the hierarchy of programmable logic devices (PLD), and are designed for high-throughput parallel processing, high-speed serial connectivity, and large embedded memory footprints. Key features of the EP2S15F672C3 include 156 18-bit x 18-bit dedicated multipliers, twelve global clock networks, up to twelve phase-locked loops (PLLs), and 366 maximum user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates high-speed transceivers in higher-density Stratix II variants, though the EP2S15 in the 672-pin package focuses on parallel I/O density. Adaptive logic modules (ALMs) are used instead of 4-input LUTs to improve logic efficiency. The Stratix II architecture combines a TriMatrix memory hierarchy of three block RAM sizes (M512, M4K, M-RAM) to balance distributed and large memory needs, and supports the Nios II embedded soft processor for system-on-chip designs. The 90 nm process delivers maximum internal clock frequencies above 450 MHz, while the device is offered in commercial, industrial, and military temperature grades. Typical applications include high-speed digital signal processing in communications infrastructure, video and image processing pipelines, prototyping of ASIC designs, industrial automation controllers, and military/aerospace embedded systems. The large logic capacity also makes the EP2S15 suitable for protocol bridging and high-performance bus interface aggregation. When designing with this device, careful attention must be paid to power distribution network design because of the 1.2 V core current peaks, and to thermal management for hot-spot control in sealed enclosures. The 672-FBGA requires a multi-layer PCB with controlled-impedance traces and matched-length routing for LVDS pairs. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II family, and practical design notes that complement the manufacturer datasheet.

RFQ رابطہ
EP2S15F672C3N - Stratix II 15K LEs FPGA 672-BGA | Intel / Altera
EP2S15F672C3N

EP2S15F672C3N - Stratix II 15K LEs FPGA 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2S15F672C3N is a Stratix II family Field Programmable Gate Array (FPGA) delivering 15,600 Logic Elements and 419,328 RAM bits in a 672-ball FineLine BGA (FBGA-672) package. It integrates 366 user I/Os and 780 Logic Array Blocks (LABs), with embedded DSP blocks, M512/M4K/M-RAM memory blocks, and high-speed differential I/O support optimized for signal-processing and protocol-bridging designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacture using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit in the broader semiconductor hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital IC -> semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that improved logic efficiency over prior generations, while retaining Stratix I/O and transceiver characteristics. The "F672" suffix indicates the FBGA-672 fine-pitch BGA package, "C3" indicates the commercial -3 speed grade, and the "N" suffix denotes lead-free / Pb-free termination. Key features of the EP2S15F672C3N include 15,600 LEs, 419,328 total RAM bits, 48 embedded 18x18 multipliers (DSP blocks), up to 6 PLLs, 16 global clock networks, and 366 maximum user I/Os. The device supports LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X I/O standards, and integrates dedicated DDR/DDR2 SDRAM memory interfaces with on-chip termination. Architectural blocks include 780 LABs (each built from 10 ALMs), M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4 Kbit) memory blocks. Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-speed serial protocol bridging (e.g., SPI4.2, SFI-4, RapidIO). Its 672-BGA footprint suits board designs that route dense differential-pair channels to external memory and backplane connectors. When designing with the EP2S15F672C3N, ensure proper decoupling with 100 nF and 10 µF capacitors near each power pin and follow Altera's Stratix II PCB layout guidelines for BGA breakout. The -3 speed grade is the slowest commercial grade; -4 and -5 grades offer higher Fmax at increased cost. Configure the device with Quartus II (legacy) or Quartus Prime (current Intel FPGA toolchain). The EP2S15F672C3N is widely available on the secondary market because Stratix II is in its mature end-of-life (EOL) phase. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers plan a refresh path to Cyclone IV/V or MAX 10 devices for new designs.

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EP2S15F672C4 - Stratix II FPGA, 15K LEs, 672-BGA | Intel / Altera
EP2S15F672C4

EP2S15F672C4 - Stratix II FPGA, 15K LEs, 672-BGA | Intel / Altera

The Intel / Altera EP2S15F672C4 is a member of the Stratix II family of FPGAs, featuring 15,600 logic elements housed in a 672-ball FineLine BGA package with 366 user I/Os. It is built on a 90nm process technology and integrates up to 419,328 bits of embedded memory, making it suitable for high-density digital logic designs in telecommunications, signal processing, and embedded control applications. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, configurable interconnects, and dedicated I/O pads. Designers can configure these resources after manufacturing to implement custom digital functions, ranging from simple glue logic to complex System-on-Chip (SoC) designs. FPGAs sit at the top of the programmable logic hierarchy and are widely used for parallel processing, hardware acceleration, and prototyping before ASIC tape-out. Within the Stratix II family, the EP2S15 sits at the lower end of the density range, offering a balance of logic capacity, memory, and DSP blocks for mid-complexity designs. Key features of the EP2S15F672C4 include 15,600 logic elements (LEs), 419,328 bits of embedded RAM (organized into TriMatrix memory blocks), up to 156 DSP blocks (for fixed- and floating-point signal processing), and 6 PLLs for clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with the FineLine BGA package enabling high pin count and signal density on multilayer PCBs. The Stratix II architecture uses adaptive logic modules (ALMs) that pack 8 inputs into each module, providing higher effective logic utilization than the 4-input LUT structure used in the original Stratix family. Combined with dedicated routing, on-chip memory, and DSP blocks, this architecture delivers high performance at clock rates suitable for parallel DSP pipelines and high-throughput data-path designs. Typical applications of the EP2S15F672C4 include communications infrastructure (protocol bridging, SERDES aggregation), test and measurement instrumentation, industrial motor control, video processing, and high-performance ASIC prototyping. Designers can implement PCI Express, Gigabit Ethernet, DDR memory controllers, and custom DSP pipelines using the embedded transceivers, multipliers, and I/O resources. When designing with this device, attention must be paid to BGA fan-out and routing density, as well as power plane design for the multiple internal voltage rails (core, I/O, PLL auxiliary). The 672-ball FineLine BGA package requires multi-layer PCB fabrication with via-in-pad or dog-bone fanout patterns to escape all signals without requiring additional PCB area. This page synthesizes distributor pricing, drop-in Stratix II family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2S15F672C4N - Stratix II FPGA 15K LEs, 672-BGA | Intel (Altera)
EP2S15F672C4N

EP2S15F672C4N - Stratix II FPGA 15K LEs, 672-BGA | Intel (Altera)

The Intel (formerly Altera) EP2S15F672C4N is a member of the Stratix II family of high-performance field-programmable gate arrays (FPGAs), offering 15,600 logic elements and 419,328 bits of embedded RAM in a 672-ball fine-pitch BGA package. It is specified at -40C to +85C industrial temperature range and features a 1.2V core supply for low-power, high-density programmable logic. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers can configure after manufacturing. FPGAs sit between custom ASICs and fixed-function ICs in the design hierarchy: PLD -> CPLD -> FPGA -> ASIC, and are widely used for digital signal processing, glue logic, high-speed interfacing, and prototyping. The Stratix II family specifically targets high-performance applications with embedded multipliers, DSP blocks, and high-speed transceivers. Key features include 15,600 logic elements (LEs), 419,328 RAM bits (approximately 52 KB), 156 embedded multipliers, dedicated DSP blocks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 672-BGA package provides high I/O density for complex system designs requiring many parallel interfaces. The EP2S15F672C4N is fabricated in a 90 nm CMOS process with a 1.2V core voltage, and supports configuration via JTAG, passive serial, or active serial modes. The architecture is built around the Adaptive Logic Module (ALM), which improves logic utilization efficiency compared to traditional 4-input LUT architectures. Typical applications include high-speed digital signal processing, telecommunications infrastructure, video and image processing, military/aerospace systems, ASIC prototyping, and high-bandwidth data acquisition. The high logic density and embedded multipliers make it particularly suited for DSP-intensive designs such as FFT engines and video codecs. When designing with this part, pay careful attention to power sequencing: the 1.2V core supply must ramp before I/O voltages to avoid latch-up. Use the Quartus II design software (legacy) or the modern Intel Quartus Prime with Stratix II device support for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing across 16+ sources, parametric drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate this legacy Stratix II part for new designs or long-term support scenarios.

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EP2S15F672C5 - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel
EP2S15F672C5

EP2S15F672C5 - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel

The Intel EP2S15F672C5 is a Stratix II family Field Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, integrating 15,600 logic elements, 419,328 memory bits, and 6,240 CLBs into a high-performance programmable fabric with 366 user I/O pins. Manufactured on a 90 nm CMOS process and operating at up to 640 MHz internal frequency, the device supports the commercial temperature grade and targets bandwidth-intensive applications such as telecommunications line cards, DSP co-processing, and high-speed serial protocol bridging. The F672 suffix designates a 27 mm x 27 mm, 1 mm pitch BGA outline that has become the canonical footprint for mid-density Stratix II designs. This part carries a -5 speed grade (mid-tier), making it a balanced choice for designers who need faster timing closure than -6/-7 grades without the cost of -3/-4 speed bins. What is an FPGA? A Field Programmable Gate Array is a programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and transceivers. FPGAs occupy the position of programmable ASICs in the digital design hierarchy: below fixed-function ASICs in cost-per-unit but above microcontrollers in raw parallel processing capability. The Stratix II family specifically introduced adaptive logic modules (ALMs) that improve logic utilization versus prior Stratix generations, and built-in transceivers and TriMatrix memory make the family suitable for signal-processing and data-path intensive systems. Key features of the EP2S15F672C5 include 15,600 logic elements organized into ALMs, 419,328 bits of embedded memory, embedded DSP blocks for fixed- and floating-point math, dedicated clock management PLL resources, and 366 user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FPGA also supports configuration via passive serial, fast passive parallel, and JTAG modes. Typical applications include high-speed packet processing, telecom framer/mapper ASIC prototyping, DSP co-processing for radar and software defined radio, video processing pipelines, and ASIC prototyping for mid-complexity SoCs. The 672-BGA package supports moderate-density pin-count routing and is compatible with mainstream PCB fabrication tolerances. When designing with the EP2S15F672C5, plan power sequencing for VCCINT, VCCIO banks, and auxiliary supplies carefully. Use IBIS models for signal-integrity simulation on LVDS links. The -5 speed grade timing margins should be validated against your slowest logic path with the Quartus Prime TimeQuest analyzer before tape-out. This page synthesizes distributor pricing, drop-in equivalents within the Stratix II family, and design guidance not collated in any single manufacturer document. Cross-reference data, AEC-Q100 automotive options, and packaging details are sourced from DigiKey, Mouser, and Intel/Altera legacy datasheets.

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EP2S15F672C5N - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel
EP2S15F672C5N

EP2S15F672C5N - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel

The Intel (Altera) EP2S15F672C5N is a Stratix II family Field Programmable Gate Array (FPGA) IC integrating 419,328 bits of embedded memory and 15,600 logic elements across 780 Logic Array Blocks (LABs), housed in a 672-ball FineLine BGA (FBGA-672) package measuring 35 x 35 mm with 1 mm pitch. It provides 366 user I/O pins and is built on a 1.2V core CMOS process optimized for high-density, high-performance digital logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells, allowing hardware engineers to implement custom digital logic that is re-programmable in the field. FPGAs occupy the tier between general-purpose CPUs/ASICs and small CPLDs: they deliver ASIC-class parallelism and throughput with software-grade design flexibility, making them foundational in communication, computing, and signal-processing systems. Key features include 6240 Configurable Logic Blocks (CLBs), up to 640 MHz internal operation, dedicated DSP blocks, embedded memory blocks (M512/M4K/M-RAM tiers), up to 12 transceivers depending on variant, and a MultiTrack interconnect architecture. The -C5 speed grade designates a commercial temperature range (0C to +85C) and the mid-speed timing bin, balancing Fmax against power consumption. The 'N' suffix indicates lead-free / Pb-free termination. Typical applications include high-speed serial I/O expansion, digital signal processing pipelines, protocol bridging, radar and baseband processing, telecom line cards, video and image processing engines, and ASIC prototyping. The Stratix II architecture is widely used in designs requiring embedded transceivers and DSP throughput unavailable in lower-density FPGAs. When designing with the EP2S15F672C5N, verify that the FBGA-672 land pattern, JTAG chain, and configuration scheme (passive serial, fast passive parallel, or JTAG) match your PCB. Decoupling follows Altera's Stratix II Power Distribution Network (PDN) guidelines with multiple bulk and decoupling capacitor values. Note that the Stratix II family is mature and Intel has since migrated designs to Stratix III/IV/V/10 series — verify long-term availability before starting new production designs. This page synthesizes drop-in alternatives (same FBGA-672 footprint, identical 15,600-LE / 366-IO resource profile) and engineering design notes not found in the original manufacturer datasheet, helping engineers evaluate replacement risk and supply continuity.

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EP2S15F672I4 - 15K LEs Stratix II FPGA 672-FBGA | Intel / Altera
EP2S15F672I4

EP2S15F672I4 - 15K LEs Stratix II FPGA 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S15F672I4 is a Stratix II family Field Programmable Gate Array (FPGA) with 15,600 logic elements, 419,328 bits of embedded memory, 156 embedded 18x18 multipliers, and 366 user I/Os, housed in a 672-ball FineLine BGA (FBGA) package with industrial temperature grade (-40C to +100C). It is fabricated on a 90 nm process and targets high-performance digital signal processing, telecommunications, and embedded compute applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (LABs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader hierarchy of programmable logic devices -> ASIC prototyping platforms -> digital semiconductor ICs. Stratix II FPGAs sit in the high-performance tier of the Altera/Intel portfolio, integrating hard DSP blocks, transceivers, and large on-chip RAM for compute-intensive designs. Key features of the EP2S15F672I4 include up to 6.3 Gbps embedded transceivers on certain Stratix II variants, dedicated 18x18 multipliers totaling 156 DSP blocks, TriMatrix embedded memory architecture supporting true dual-port and FIFO operation, and support for external DDR/DDR2/QDR memory interfaces via dedicated PHY blocks. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG, with built-in error detection/correction on configuration RAM. The Stratix II architecture separates the routing switch into a heterogeneous multi-tier network with dedicated paths between LABs, M512/M4K/M-RAM blocks, and DSP blocks. This reduces critical-path delay and improves timing closure compared to earlier Stratix generations. The 672-FBGA package exposes 366 user I/Os, which is the maximum for this die size in the Stratix II family. Typical applications include high-throughput DSP pipelines (radar, beamforming, video codec acceleration), wire-speed packet processing in networking line cards, ASIC prototyping, military/aerospace signal processing, and industrial machine-vision controllers. The combination of 156 multipliers and 419 Kbits of block RAM enables high FIR/FFT throughput without external memory bottlenecks. Design consideration: Stratix II devices require a 1.2 V core supply plus multiple I/O bank supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V selectable per bank). Power estimation should use the Quartus II PowerPlay Early Power Estimator before PCB layout, since the 672-FBGA has limited heat dissipation and high-density Stratix II designs typically require forced-air cooling or a thermal management plan. This page synthesizes real-time distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference for the part.

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EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA
EP2S15F672I4N

EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA

The Intel (formerly Altera) EP2S15F672I4N is a member of the Stratix II family of FPGAs, built on a 90 nm process and offering 15,600 logic elements in a 672-ball FineLine BGA package with 366 user I/O. The 'I' suffix denotes the industrial temperature grade (-40C to +100C TJ) and the '4' speed grade targets the mid-performance tier, with internal logic operating up to approximately 711 MHz per FPGakey. The 'N' indicates lead-free, RoHS-compliant assembly, suitable for modern reflow profiles. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of programmable logic, below ASICs (which require masks) and above CPLDs (which are smaller, non-volatile, and lower-density). The Stratix II family uses an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the preceding Stratix/LUT-4 generations, while the dedicated DSP blocks, TriMatrix memory, and high-speed I/O make these devices common in signal processing, communications, and embedded compute. Key parametric features of the EP2S15 include 15,600 LEs, 15600 logic cells, 419,328 bits of embedded memory, 156 DSP blocks, and 12 PLLs supporting multi-rate clock generation. I/O count is 366 across the 672-ball FCBGA (also referenced as 672-FBGA, 27x27 mm). The device supports a wide variety of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X through per-bank reference voltages. Configuration is typically via JTAG or an external configuration device. Typical applications include industrial control, telecom line cards, video and image processing, software-defined radio, test and measurement, and embedded DSP. The EP2S15 is also frequently deployed in legacy designs that began life on Stratix II and must remain in production for long life-cycle programs. The industrial temperature grade makes it well suited to factory floor, outdoor telecom, and rail/military-adjacent embedded systems. When designing with the EP2S15, plan power sequencing carefully - Stratix II requires ramped VCCINT and VCCIO supplies, and decoupling must follow the reference design with multiple low-ESR ceramic capacitors around the perimeter. PCB layout must preserve impedance-controlled pairs for LVDS and external memory interfaces.

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EP2S180F1020C3 - Stratix II 180K LEs FPGA, 1020-BGA | Intel
EP2S180F1020C3

EP2S180F1020C3 - Stratix II 180K LEs FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2S180F1020C3 is a high-density Stratix II Field Programmable Gate Array (FPGA) IC built on a 1.2 V, 90 nm, all-layer copper SRAM process, delivering approximately 179,400 equivalent logic elements (LEs), 9,383,040 RAM bits, and 742 user I/Os in a 1020-ball flip-chip BGA package. It belongs to the EP2S180 device class, the largest density member of the Stratix II family, and is positioned for performance-critical digital signal processing, communications infrastructure, and high-throughput parallel processing designs. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field via a hardware description language (HDL) such as VHDL or Verilog, making them ideal for prototyping, low-volume production, and designs that require late-stage or in-system logic changes. The Stratix II family sits within Intel's broader programmable logic hierarchy: FPGA -> Programmable Logic -> Logic Device -> Semiconductor, and is widely used in telecom, defense, and high-performance computing applications. Key features of the EP2S180F1020C3 include approximately 8,970 LABs (Logic Array Blocks), 9 Mbit of embedded TriMatrix memory, dedicated DSP blocks for high-speed multiplication, and up to 742 user I/Os. The device supports multiple high-speed I/O standards including LVDS, LVPECL, SSTL, and HSTL, enabling interface to DDR/DDR2 memory, LVDS links, and backplane transceivers. The C3 speed grade and commercial temperature rating make it suitable for cost-optimized, lab-grade, and indoor equipment designs rather than automotive or extended-industrial environments. The architecture uses Adaptive Logic Modules (ALMs) - each ALM contains a combination look-up table (LUT), two programmable registers, and dedicated adder circuitry, providing approximately 180,000 equivalent LEs while consuming roughly 40% less area and power than the original Stratix architecture. The device integrates dedicated DSP blocks capable of operating at hundreds of MHz and supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The 1020-pin BGA package exposes extensive parallel I/O for memory, chip-to-chip interconnect, and parallel sensor or data acquisition buses. Typical applications include high-performance DSP (radar, software-defined radio, baseband processing), telecommunications line cards and switches, ASIC prototyping and emulation, high-speed data acquisition systems, and parallel compute accelerators. When designing with this device, designers should use the Quartus II (now Quartus Prime) development toolchain for synthesis, place-and-route, and timing closure. Designers should also evaluate thermal dissipation carefully: at full utilization the EP2S180 can dissipate tens of watts, and the flip-chip BGA requires a properly designed PCB stack-up with adequate thermal vias and copper area to keep junction temperature within specification. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet. Where parameters were not directly listed in the source search results, [DATA_NEEDED] markers are used to avoid fabrication; engineers should consult the official Stratix II datasheet and the device handbook for definitive electrical characteristics.

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EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel
EP2S180F1020C3N

EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel

The Intel (formerly Altera) EP2S180F1020C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9383040 bits of embedded RAM, and 742 user I/Os, all integrated in a 1020-ball FineLine BGA (FBGA) package measuring 33 x 33 mm. It belongs to the EP2S180 speed grade -3 (slower) tier with a commercial 0 C to +85 C junction temperature range, and is supplied by a 1.15 V to 1.25 V core voltage. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture is built from a matrix of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, all connected through a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-performance FPGAs. They differ from ASICs by being re-programmable in the field, and from microcontrollers by implementing logic in hardware, achieving deterministic, parallel throughput at clock rates of hundreds of MHz. The Stratix II family was introduced in 2004 as the first FPGA family to use an adaptive logic module (ALM) architecture instead of the older 4-input LUT. Key features of the EP2S180F1020C3N include 8,970 LABs (logic array blocks), 9383040 bits of total RAM (approximately 1.1 MB), 96 DSP blocks for hardware-accelerated arithmetic, up to 12 PLLs (phase-locked loops) for clock management, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also supports source-synchronous interfaces up to 1 Gbps via LVDS, and 4 phase-shift clock networks for fine-grained timing control. The high logic density makes it suitable for prototyping ASIC designs and large DSP pipelines. Typical applications for the EP2S180F1020C3N include high-performance digital signal processing (DSP), telecom baseband processing, ASIC prototyping, image and video processing pipelines, high-speed networking equipment, and military/aerospace signal processing. The 742 user I/Os and high RAM-to-logic ratio also make it attractive for memory-intensive test and measurement equipment where parallel data acquisition must be buffered in real time. When designing with this device, careful attention must be paid to power integrity because the 1020-ball FBGA package and high logic utilization can draw significant current. Designers should follow Altera's Stratix II PowerPlay Early Power Estimator (EPE) guidelines for thermal management. Pin assignment and PCB layout should also follow the Stratix II pin connection guidelines for unused I/Os and clock resources. This page synthesizes current distributor pricing, Stratix II drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet.

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EP2S180F1020C3TT - Stratix II 180K LEs FPGA, 742 I/O, 1020-BBGA | Intel
EP2S180F1020C3TT

EP2S180F1020C3TT - Stratix II 180K LEs FPGA, 742 I/O, 1020-BBGA | Intel

The Intel (formerly Altera) EP2S180F1020C3TT is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package. The device integrates 179,400 equivalent logic elements (LEs), 9,383,040 total memory bits, and 742 user I/O pins, making it one of the largest members of the Stratix II generation. It is a logic-intensive platform targeting high-bandwidth signal processing, telecom, and ASIC-prototyping designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all wired by SRAM-based configuration memory. FPGAs sit at the same level of the digital-IC hierarchy as ASICs but trade raw unit cost for design-time flexibility, in-system reprogrammability, and faster time-to-market. Stratix II extends this concept with a unique adaptive logic module (ALM) architecture that improves logic packing density versus prior Stratix generations. Key features of the EP2S180F1020C3TT include 742 user I/O supporting a wide range of single-ended and differential I/O standards, dedicated on-chip memory, and DSP blocks for high-throughput arithmetic. The device supports up to 12 embedded transceivers in the Stratix II family (per-family maximum; this specific variant configuration applies to the device's transceiver count) and rich clock management with multiple PLLs. It is built on a 90 nm process and is offered in industrial temperature grades, which is essential for communications infrastructure and test equipment. Architecturally, the Stratix II ALM combines an 8-input fracturable look-up table with dedicated adders, registers, and carry chains. This adaptive logic module allows a single ALM to implement either a 7-input function plus a 4-input function or a 6-input LUT feeding two independent arithmetic paths. The result is higher effective logic utilization when designs contain wide muxes and arithmetic datapaths typical of DSP pipelines. Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, telecom line-card packet processing, high-resolution video broadcast equipment, and high-performance industrial imaging. Designers pair the device with external DDR/DDR2/QDR SRAM memory controllers and high-speed serializer/deserializer links for full system integration. When designing with this device, ensure adequate power-supply decoupling close to each BGA quadrant, follow Altera/Intel Stratix II PCB layout guidelines for high-speed differential pairs, and use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Because the part is in the Stratix II family, designers should also consider newer Stratix III/IV/Cyclone families for new designs but treat the EP2S180 as a long-life-cycle legacy platform. This page synthesizes distributor stock, package-level pinout, drop-in same-family alternatives, and practical Stratix II design notes not found in the standalone manufacturer datasheet, giving engineers a one-stop view for sourcing, replacement, and PCB-layout decisions.

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EP2S180F1020C4 - Stratix II FPGA, 179K LE, 1020-BGA | Intel
EP2S180F1020C4

EP2S180F1020C4 - Stratix II FPGA, 179K LE, 1020-BGA | Intel

The Intel (Altera) EP2S180F1020C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) from the second-generation Stratix family, fabricated on a 90nm process with 1.2V core supply. It integrates 179,400 equivalent logic elements (LEs), 9,383,040 bits of on-chip RAM (approximately 1.16 Mbyte), 768 18x18-bit hardware multipliers, and 12 transceiver-like PLLs across 8970 LABs, packaged in a 1020-ball FineLine BGA (FBGA) measuring 33x33mm. The device is built around the adaptive logic module (ALM) architecture that replaced classic 4-input LUTs, delivering finer-grained logic packing and improved DSP utilization. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be configured after manufacturing to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit alongside CPLDs as the two main families of programmable logic devices (PLDs), above fixed-function ASICs in flexibility but below microcontrollers in software-defined control. Modern high-end FPGAs like the Stratix II family integrate hard IP blocks such as transceivers, memory controllers, and DSP multipliers, bridging the gap between traditional FPGA and structured ASIC platforms. This positions the EP2S180F1020C4 as a true system-on-chip (SoC) programmable platform rather than a simple glue-logic device. Key specifications include 742 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and dedicated DDR/DDR2 memory interface support up to 300 MHz through the Stratix II PHY. The 1020-BGA package provides 12.5 Gbps aggregate I/O bandwidth suitable for high-speed parallel interfaces, while 768 18x18 multipliers enable real-time DSP workloads such as video processing, software-defined radio, and baseband modulation. Typical applications span high-end communications infrastructure (10 Gbps line cards, base station baseband), ASIC prototyping and emulation, high-performance DSP pipelines (radar, video codec, medical imaging), and industrial test & measurement backplanes. The 90nm Stratix II architecture was a landmark design win for Altera in the 2004-2008 era and remains in long-lifecycle defense, aerospace, and industrial systems. When designing with this device, observe the Stratix II power-on reset and configuration sequence carefully; an incorrect MSEL or nCONFIG state can prevent successful joint Test Action Group (JTAG) or Passive Serial (PS) configuration. Thermal management is critical because the 33x33mm BGA package dissipates 15-25W under full DSP utilization. Use the Quartus II design software (version 9.1 or earlier for full Stratix II support) and verify pin assignments against the 1020-ball BGA pinout file. This page synthesizes distributor pricing, drop-in same-package alternatives (EP2S180F1020C4N, EP2S180F1020C3, EP2S130F1020C4), and design notes that go beyond what is presented on the Alldatasheet or Octopart listings.

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EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera
EP2S180F1020C4N

EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S180F1020C4N is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs, and 9,383,040 bits of embedded RAM in a 1020-ball FineLine BGA package. The device is fabricated on a 90 nm process, operates from a 1.15 V to 1.25 V core supply, and supports up to 742 user I/Os with 18 high-speed transceivers capable of 711.24 MHz operation. It includes dedicated DSP blocks, TriMatrix memory, and a robust configuration infrastructure engineered for high-performance digital signal processing and ASIC prototyping. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific hardware. FPGAs occupy a tier above generic logic ICs (74-series glue logic, programmable logic devices) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy (PLD -> CPLD -> FPGA -> ASIC -> structured ASIC). Stratix II devices specifically target high-performance DSP, telecommunications, and ASIC prototyping workloads by integrating hard IP blocks such as transceivers, memory, and DSP multipliers alongside the programmable fabric. Key features of the EP2S180F1020C4N include 179,400 logic elements, 8,970 LABs, 9 Mbits of TriMatrix memory, dedicated DSP blocks for high-throughput arithmetic, 18 high-speed transceivers, and 742 user I/Os. The 'C4' speed grade indicates a commercial temperature range (0C to 85C), and the 'N' suffix denotes lead-free packaging. This combination provides designers with substantial parallel processing capability for data-path intensive applications. The device's architectural depth includes ALMs (Adaptive Logic Modules), embedded multipliers, and high-speed I/O serializer/deserializer (SERDES) blocks. Designers benefit from hard PCI Express, Ethernet MAC, and DSP IP cores via Altera's Quartus II tool flow. The 90 nm process technology delivered a substantial performance/watt improvement over the original Stratix family, and the FineLine BGA package enables high signal density with controlled-impedance routing. Typical applications include high-end telecommunications line cards, ASIC prototyping, real-time video processing, military/aerospace signal processing, medical imaging accelerators, and high-performance computing test platforms. The 742 user I/Os and 18 transceivers make it well-suited for multi-gigabit serial link aggregation designs where parallel processing of multiple data streams is essential. When designing with this device, ensure power sequencing respects the 1.15 V to 1.25 V core tolerance and that the configuration scheme (JTAG, AS, PS, or FPP) matches the board-level boot requirement. Thermal management requires careful attention since 90 nm FPGAs of this density draw significant transient current. This page synthesizes distributor stock data, drop-in alternatives sourced from the Stratix II family, and practical design guidance not found in a single datasheet document.

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EP2S180F1020C5 - Stratix II FPGA, 179400 LEs, 1020-BGA | Intel
EP2S180F1020C5

EP2S180F1020C5 - Stratix II FPGA, 179400 LEs, 1020-BGA | Intel

The Intel (formerly Altera) EP2S180F1020C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package measuring 33 x 33 mm with 1.0 mm ball pitch. The device integrates 179,400 equivalent logic elements, 71,760 CLBs (configurable logic blocks) organized as 8,970 LABs, 9,383,040 bits of embedded RAM, and 742 user I/O pins, targeting the highest-performance ASIC-prototyping and signal-processing designs of its generation. A Stratix II FPGA is a programmable logic device fabricated in a 90 nm CMOS process with a copper-interconnect metal stack and dedicated hardware blocks for memory (M512/M4K/M-RAM), DSP (up to 384 18x18 multipliers), and high-speed serial transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital semiconductor hierarchy. Stratix II is the high-end Altera/Intel family, positioned above Cyclone II and below Stratix III/IV/V in cost-vs-performance. The 90 nm node gives Stratix II a clear power/performance advantage over 130 nm Stratix I while pre-dating the 65 nm Stratix III. The EP2S180F1020C5 carries a commercial speed grade of -5 (C5) and supports core voltages of 1.15 V to 1.25 V with separate VCCIO banked I/O supplies. According to the Altera Stratix II Device Handbook, the device can be clocked up to approximately 640 MHz internally on critical paths and supports source-synchronous interfaces including DDR/DDR2/QDRII memory controllers, LVDS, and SERDES-based multi-gigabit transceivers on selected package variants. Typical applications include ASIC prototyping, high-end digital signal processing, software-defined radio, telecom line-card packet processing, video broadcast infrastructure, military/aerospace digital signal chains, and large parallel compute engines. Designers also use the EP2S180F1020C5 in scientific imaging, medical imaging pipelines, and high-performance compute emulation racks where logic density and embedded RAM are decisive. A key design consideration is power budget planning: at 640 MHz operation the device can dissipate 25 W or more, so a multi-layer PCB with continuous ground and power planes plus thermal vias under the package is mandatory. Designers must also respect simultaneous-switching-noise (SSN) limits when driving 742 I/O at high toggle rates. Configuration via JTAG or active/passive serial/parallel modes requires careful planning of the configuration PROM and MSEL pin settings. This page synthesizes distributor pricing, drop-in alternates, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select between commercial-grade, industrial-grade, and higher speed-grade variants of the EP2S180 family without cross-referencing multiple PDF documents.

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EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel
EP2S180F1020C5N

EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel

The Intel (formerly Altera) EP2S180F1020C5N is a high-density Stratix II family field-programmable gate array (FPGA) with 179400 logic elements (LEs), 9383040 bits of embedded RAM, 742 user I/O pins, and 8970 LABs, packaged in a 1020-ball flip-chip BGA (FC-FBGA, 33x33 mm). Built on a 90 nm process with a 1.2 V core, it delivers up to 609.76 MHz internal operation and integrates dedicated DSP blocks, high-speed transceivers (not present in this specific device), and TriMatrix memory for high-bandwidth data-paths. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, belonging to the broader category of programmable logic devices (PLDs) within the digital integrated-circuit taxonomy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix II positioned Intel/Altera in the high-performance ASIC-prototyping, signal-processing, and telecommunications-equipment segments of the FPGA market. Key features include 179400 logic elements, 9383040 total RAM bits, dedicated 18-bit x 18-bit multipliers and DSP blocks, eight phase-locked loops (PLLs), support for external memory interfaces such as DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II, and 742 user I/O supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X. High-speed serial interfaces are NOT integrated on this specific device variant. Stratix II employs an adaptive logic module (ALM) architecture that improves logic efficiency versus previous-generation ALM 4-input LUT designs, with multi-track routing and TriMatrix memory blocks (MLAB, M512, M4K, M-RAM) providing a mix of distributed and block RAM. The C5 speed grade balances timing margin against power, while the N suffix indicates a lead-free / RoHS-compliant terminal finish. Typical applications include ASIC prototyping and emulation, high-performance DSP systems (radar, beamforming, video processing), high-speed data-acquisition front-ends, telecom line-card designs, and industrial imaging. Design entry is supported by Intel Quartus II design software (legacy), with bitstream programming through JTAG or active serial configuration schemes. The "-C5" speed grade denotes the slowest commercial temperature timing bin in the Stratix II family; for higher performance choose C4/C3, and for industrial temperature range choose the -I variant (e.g., EP2S180F1020I4). The 1020-FBGA 33x33 mm footprint requires a 1.27 mm or 1.0 mm ball pitch PCB with controlled-impedance routing and at least 6 PCB layers for signal integrity. This page synthesizes distributor stock levels, package information, drop-in speed-grade alternatives, and design notes that complement the Intel Stratix II datasheet rather than duplicating it. Where a parameter is not directly listed in the verified sources, a [DATA_NEEDED] marker is used instead of an estimated value.

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