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TLE75004EPDXUMA1 - 4-Ch Low-Side SPI Switch, 470mA | Infineon
The Infineon TLE75004EPDXUMA1 is a 4-channel low-side power switch with integrated N-channel MOSFETs, each capable of 470 mA continuous drain current, housed in a PG-TSDSO-14-41 exposed-pad package. The device integrates a 16-bit SPI interface for channel control and diagnostic readback, supports 3 V cranking capability for cold-start automotive conditions, and provides a fail-safe (Limp Home) mode that maintains critical outputs when the microcontroller or SPI link fails. A low-side switch is a power distribution topology in which the MOSFET is placed between the load and ground, allowing the load to be tied to a permanent supply rail (e.g., the vehicle battery). This architecture belongs to the broader category of smart power switches (SPS), which combine a power transistor, gate driver, protection circuitry, and a digital diagnostic interface in a single IC. Smart low-side switches have largely replaced discrete MOSFETs + fuses in body electronics because they provide per-channel current limiting, overload shutdown, open-load detection, and thermal protection without external sense resistors. Key features of the TLE75004EPDXUMA1 include per-channel current limiting, open-load detection in both on and off states, over-temperature shutdown with auto-restart, short-to-ground and short-to-battery protection, and reverse battery protection via an external resistor. The SPI interface operates at clock rates up to 5 MHz, allowing fast update of output states and rapid polling of fault registers. An IDLE pin enables the Limp Home mode where input pins directly drive the outputs without SPI intervention. Typical applications include automotive body control modules (BCMs), door modules, seat controllers, and LED lighting drivers where multiple low-current relays, solenoids, or LEDs must be switched under microcontroller supervision. The PG-TSDSO-14-41 package provides an exposed thermal pad that keeps junction temperature low even when all four channels are delivering full current simultaneously. When designing with this part, ensure the SPI lines are pulled up to VCC and the IDLE pin is tied high for normal SPI-controlled operation. The exposed pad must be soldered to a sufficiently large copper pour (at least 1 cm²) to achieve the datasheet thermal resistance. According to the manufacturer datasheet, the device is qualified to AEC-Q100 Grade 1, making it suitable for under-hood and other harsh automotive environments.
TLE75080ESDXUMA1 - 8-Ch SPI High-Side Switch, 330mA | Infineon
The Infineon TLE75080ESDXUMA1 is an 8-channel high-side power switch in a PG-TSDSO-24-21 (exposed pad) package, delivering 330 mA per channel for automotive and industrial relay and LED loads. Each channel integrates an N-channel MOSFET with active current limiting, and the device communicates over a 16-bit SPI interface for diagnostics and PWM control. A high-side switch (also called a smart power switch) is a semiconductor device that sits between a load and the positive supply rail. It replaces mechanical relays and discrete MOSFETs by combining a power transistor with protection, diagnostic, and communication circuitry. High-side switches sit in the family hierarchy: high-side switch -> power distribution switch -> power management IC -> semiconductor, and they enable centralized load control in body control modules, BCMs, and zonal architectures. Key features include 8 independently controlled channels, 16-bit SPI daisy-chain capability, integrated reverse-battery protection, open-load detection in on and off states, overtemperature shutdown with per-channel thermal sensors, and a Limp Home mode that allows safe operation at 3.0 V cranking transients. The device operates across a wide 4.5 V to 28 V supply range and withstands load-dump transients up to 40 V. The architecture uses N-channel MOSFETs with charge-pump-driven gates for true low-RDS(on) switching. Each channel includes current-limit set registers, individual fault flags, and PWM generation up to several hundred Hz. The exposed-pad package provides a thermal resistance below 30 C/W on standard 2 oz copper, supporting sustained 330 mA output per channel. Typical applications include automotive body electronics (lighting, HVAC blowers, seat control), industrial PLC relay drivers, and 24 V LED matrix modules. The combination of SPI diagnostics and cranking tolerance makes it well suited for 12 V automotive subsystems that must survive cold-crank events down to 3 V. When designing with this part, allocate PCB area for the exposed thermal pad and connect it to a solid copper pour. The Limp Home feature requires the SPI watchdog to be configured in the application firmware; an unconfigured watchdog defaults to fail-safe behavior. Per-channel current limit registers must be tuned to the load to avoid nuisance trips on inrush loads such as incandescent lamps or DC motors. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that supplement the manufacturer datasheet and accelerate your evaluation.
TLE75080ESHXUMA1 - 8-Ch SPI High-Side Switch 330mA | Infineon
The Infineon TLE75080ESHXUMA1 is an eight-channel high-side power switch in the PG-TSDSO-24-21 (TSDSO-24) package with 16-bit SPI control, integrated PWM generators, and Limp Home mode, designed for 12 V automotive and industrial loads. Each of the eight channels is rated at 330 mA continuous current and is built on Infineon's Smart Power SPIDER technology, integrating a vertical N-channel power MOSFET with charge pump, gate driver, current sense, and protective circuitry on a single die. The device operates from a nominal 12 V supply (with load-dump and jump-start tolerance typical of the TLE75080 family) and is qualified to AEC-Q100 for automotive body and chassis applications. Key features of this multichannel high-side switch include per-channel diagnostics (open load, short to battery, short to ground, overtemperature), parallel-input capability for direct MCU PWM control, a 16-bit SPI interface for configuration and status readback, and selectable latching or auto-restart fault behavior. The integrated charge pump drives the N-channel MOSFETs fully on at low battery voltage, achieving low R_DS(on) per channel. The Limp Home function allows a predefined safe output pattern if SPI communication is lost, critical for fail-operational body modules. Technically, the TLE75080-ESH belongs to the high-side switch category within the broader power distribution IC hierarchy: high-side switch -> smart power switch -> power management IC -> semiconductor. It is designed as an alternative to discrete MOSFET + fuse combinations, replacing many components with one SPI-controlled block. Each channel's integrated protection eliminates the need for external sense resistors, TVS clamps, and PTCs in many 12 V load drive circuits. Typical applications include automotive body control modules (BCM) driving lamps, LEDs, relays, and small motors; heating systems such as seat heaters and mirror heaters; industrial 24 V (rescaled) load switching; and energy/power distribution nodes in zonal E/E architectures. The PG-TSDSO-24-21 exposed-pad package enables direct PCB thermal dissipation without a heatsink at typical 12 V loads. When designing with this device, follow Infineon's PCB layout guidance for the exposed thermal pad, keep the SPI bus length short, and add a reverse-polarity protection diode at VBAT. Decouple VBAT and VS pins with a 100 nF ceramic plus a low-ESR electrolytic capacitor as recommended in the TLE75080-ESH datasheet. This page synthesizes distributor pricing, drop-in alternatives from the Infineon SPIDER family, and practical design notes for 12 V body-control applications that are not consolidated in the manufacturer datasheet.
TLE75602ESHXUMA1 - 8-Ch SPI Power Switch 330mA | Infineon
The Infineon TLE75602ESHXUMA1 is an 8-channel low-side and high-side SPI-controlled power switch housed in a PG-TSDSO-24-21 package, delivering up to 330 mA per channel for 12 V automotive and industrial loads. Built on Infineon's SPIDER (Smart Power Integration Device with Embedded Regulation) technology, the device integrates eight MOSFET output stages, a 16-bit SPI interface, configurable PWM generators per channel, and comprehensive diagnostic features in a single exposed-pad thermally enhanced surface-mount package. An SPI-controlled power switch (sometimes called a multi-channel high-side switch, low-side switch, or smart solid-state relay) is a power-management IC that replaces discrete MOSFETs, fuses, and relay driver circuitry with an integrated, microcontroller-addressable load driver. It sits hierarchically as a child of power distribution switches, which themselves are a sub-family of power management ICs. By consolidating eight independently controllable outputs behind a serial-peripheral-interface (SPI) command set, the TLE75602-ESH eliminates dozens of discrete components while providing per-channel fault reporting, current monitoring, and PWM dimming that discrete implementations cannot match. Key features include an operating voltage range that supports 3.0 V cranking transients (typical 4.5 V to 28 V with load-dump survivability above this range), per-channel Rds(on) in the sub-200 mΩ class, integrated reverse-battery protection via an external resistor, programmable overcurrent shutdown, open-load detection in both on and off states, and overtemperature pre-warning and shutdown. The 16-bit SPI runs at clock rates up to 5 MHz and allows parallel operation of multiple TLE75602 devices for systems requiring more than eight channels. Architecturally, each of the eight channels combines an N-channel MOSFET output stage with charge pump, gate driver, current-sense amplifier, and fault logic. The on-chip diagnostic block can flag short-to-battery, short-to-ground, open load, and overtemperature events back to the host microcontroller through dedicated SPI status registers, enabling ASIL-aware functional-safety implementations under ISO 26262. Typical applications include automotive body controllers driving lamps, LEDs, relays, and small motors; zone-ECU load switching; industrial 24 V PLC discrete I/O; HVAC blower control; and centralized power distribution modules. The device's AEC-Q100 qualification and 3.0 V cranking capability make it well suited for cold-start conditions. When designing with this part, place at least one 100 nF decoupling capacitor close to the VCC pin and follow the PCB layout recommendations in the Infineon datasheet to keep the exposed thermal pad soldered for low RthJA. Always configure unused channels in a defined OFF state via SPI to avoid floating-output diagnostic noise. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
TLE8082ESXUMA1 - Engine Management PMIC 5V SPI PG-TSDSO-24 | Infineon
The Infineon TLE8082ESXUMA1 is an Engine Management Power Management IC (PMIC) housed in a PG-TSDSO-24 (24-pin TSSOP with exposed pad) package. It integrates a 5 V supply output, four low-side drivers, and an SPI control interface for small-engine and motorcycle ECU applications. According to Infineon's product page, the device accepts a wide 6 V to 40 V input voltage range, making it suitable for 12 V and 24 V automotive battery systems. Engine management PMICs are highly integrated power and driver ICs that combine a microcontroller-compatible supply rail, multiple low-side switches, communication interfaces, and protection features in a single package. They sit at the top of the small-engine ECU power tree, replacing discrete regulators plus discrete MOSFETs and reducing BOM count, PCB area, and quiescent losses. The TLE8082ES family is positioned in Infineon's TLE808x small-engine PMIC lineup. Key features include integrated 5 V linear or switching supply, four low-side driver outputs for injector or relay control, SPI-configurable diagnostics, and built-in protection such as thermal shutdown, overcurrent limiting, and reverse-battery robustness. The PG-TSDSO-24 exposed pad provides a thermal resistance path that supports sustained operation of the integrated drivers at engine ambient temperatures up to the AEC-Q100 automotive qualification envelope. Architecturally, the TLE8082ESXUMA1 combines an internal bandgap reference, a pre-regulator, a 5 V post-regulator, four gate drivers for low-side N-channel MOSFETs, and an SPI slave for microcontroller communication. This integration lets a small 32-bit MCU control fuel injection, ignition, and sensor power without auxiliary driver ICs. Typical applications include small-engine ECUs for motorcycles, scooters, mopeds, marine outboards, generators, and handheld power equipment. The wide VIN range and integrated drivers are tailored to single-cylinder and small-displacement powertrains where PCB area and BOM cost dominate the design. When designing with this part, ensure the exposed pad is soldered to a sufficient copper pour for thermal relief; sustained low-side driver currents can dissipate significant power. Use the SPI watchdog to detect MCU lockup, and follow Infineon's small-engine reference design for injector flyback sizing. This page synthesizes distributor stock, parametric specifications, design considerations, and drop-in alternatives that supplement the manufacturer datasheet.
TLE9104SHXUMA1 - 4-Ch 3A SPI Low-Side Switch | Infineon
The Infineon TLE9104SHXUMA1 is a 4-channel low-side power switch with integrated N-channel MOSFETs, delivering 3 A continuous load current per channel, housed in a 20-pin PG-DSO-20-88 power package. It features a 16-bit Serial Peripheral Interface (SPI) for control, diagnosis, and configuration, plus comprehensive protection including over-current, over-temperature, over-voltage, and open-load detection. A multi-channel low-side driver IC is an integrated circuit that switches multiple resistive or inductive loads to ground using internal MOSFETs, controlled by a digital logic interface. Low-side drivers sit at the bottom of the load path (load connected to supply, switch to ground) and belong to the broader family of power distribution switches, motor/valve drivers, and powertrain switches used in automotive body and engine ECUs. Key features of the TLE9104SHXUMA1 include a 4.5 V to 28 V supply range, very low R_DS(on) per channel for high-efficiency switching, parallel-channel operation up to ~12 A, SPI-configurable dV/dt slew-rate control, and a 5 V VIO logic reference compatible with 3.3 V microcontrollers. The PG-DSO-20-88 exposed-pad package achieves a junction-to-ambient thermal resistance suitable for continuous 3 A per-channel operation with proper PCB copper area. The device is built on Infineon's SMART7 power technology with embedded protection state machine, providing deterministic fault handling required for ASIL-rated systems. The diagnostic block reports per-channel fault status, open-load, short-to-battery, and overtemperature flags through dedicated SPI registers. Typical applications include automotive engine-management loads (solenoid, valve, relay, injector drivers), transmission and gearbox control, body control modules, and 12 V / 24 V industrial switching. When designing, allocate at least 6 cm² of copper area to the exposed pad per channel of continuous current, and respect the SPI timing budget for sequential reads during fault scans. This page synthesizes distributor pricing, drop-in alternatives, and SPI configuration notes not collected in a single datasheet excerpt.
TLE9180D32QKXUMA1 - 6-Ch BLDC Gate Driver 90V LQFP-64 | Infineon
The Infineon TLE9180D32QKXUMA1 is a multi-channel gate driver IC for six N-channel MOSFETs designed for 12 V, 24 V and 48 V brushless DC motor control in automotive environments. Housed in a PG-LQFP-64-27 (LQFP-64 with exposed pad) package, the part uses a high-voltage Smart Power technology that lets bridge, motor and supply pins withstand up to 90 V, while motor pins tolerate negative transients typical of inductive switching. The IC integrates three half-bridge drivers plus a charge pump, current-sense amplifier, and SPI diagnostics, making it a near-complete solution for 3-phase BLDC motor control. A gate driver IC (also called a MOSFET driver or predriver) is a power-management building block that translates low-current logic-level control signals from an MCU into the high peak currents required to rapidly charge and discharge a power MOSFET gate. In the system hierarchy, gate drivers sit between the microcontroller and the power stage: MCU -> gate driver -> power MOSFETs -> motor. Compared with discrete bootstrap drivers, an integrated multi-channel gate driver such as the MOTIX TLE9180D-32QK dramatically reduces BOM count, improves timing skew between high-side and low-side channels, and centralizes protection functions. Key features of this part include support for battery voltages from 5.5 V to 72 V, programmable gate drive currents up to 1 A source/sink, integrated current-shunt amplifier with adjustable gain, and ASIL-C functional safety support per ISO 26262. The device targets safety-relevant applications and is qualified to AEC-Q100 for automotive use. Typical applications are automotive electric water pumps, oil pumps, e-bike and e-scooter traction drives, 48 V mild-hybrid auxiliary drives, BLDC fans and blowers for HVAC, and small industrial 3-phase pumps. The wide input range allows a single PCB design to support both 12 V passenger-vehicle platforms and 48 V commercial-vehicle or mild-hybrid systems, reducing platform SKU count for tier-1 suppliers.
TLF11251EPXUMA1 - 2.5A Half-Bridge Gate Driver | Infineon
The Infineon TLF11251EPXUMA1 is an integrated half-bridge gate driver capable of sourcing/sinking 2.5 A, designed for OPTIREG PMIC TLF35584/85 pairing with AURIX TC38x/TC39x 32-bit microcontrollers. Housed in a 14-pin PG-TSDSO-14-5 package, the device drives a PMOS/NMOS output stage with non-inverting logic and a wide 2.35 V to 7 V supply input. The combination of 60 ns typical propagation delay and 2.5 A peak drive makes it the companion driver for the core voltage rails of high-end 2nd-generation TriCore AURIX microcontrollers. A half-bridge gate driver is a power-management building block that combines a high-side and a low-side MOSFET driver in one IC, translating low-current PWM logic signals from a controller into the high-current gate drive required to switch power MOSFETs or, in this case, a PMOS/NMOS bridge. Within the broader IC taxonomy, this places the part in the gate-driver sub-family of power management ICs, itself a subset of PMIC and analog mixed-signal semiconductors. Half-bridge drivers are commonly used as core-supply pre-regulators or post-regulators next to multi-rail PMICs. Key features include 2.5 A peak gate-drive current, 60 ns propagation delay, non-inverting input logic, and 2.35 V to 7 V supply operation. The PG-TSDSO-14-5 thermally-enhanced small-outline package provides a low thermal resistance path for the high peak currents encountered during MOSFET switching transitions, while the non-inverting interface simplifies PWM routing from the host controller. Internally, the TLF11251EP combines a PMOS high-side path and an NMOS low-side path with adaptive drive strength and protection features. The 2.5 A capability allows it to switch large PMOS/NMOS bridges quickly, reducing switching losses and improving transient response on the AURIX core supply rail. The OPTIREG product family designation confirms Infineon qualification for safety-relevant automotive power architectures. Typical applications include AURIX TC38x/TC39x core supply pre-regulation, OPTIREG TLF35584/85 PMIC companion drivers, automotive 12 V ECU power trees, and industrial 24 V buck/boost pre-drivers. The wide supply range and high drive strength also make it suitable as a general-purpose PMOS/NMOS half-bridge in 5 V and 12 V distributed power systems. When designing with this device, observe the absolute maximum supply rating of 7 V and provide a local 100 nF + 1 µF decoupling network directly at the VCC pin. Keep the gate-drive traces short and width-matched to limit parasitic inductance, which can otherwise cause ringing on the PMOS/NMOS gate that may violate the AURIX core supply tolerance window.
TLF11251LDXUMA1 - 2.5A Half-Bridge Gate Driver for AURIX | Infineon
The Infineon TLF11251LDXUMA1 is a 2.5 A half-bridge gate driver IC housed in a 10-pin PG-TSON-10-2 (exposed pad) package, designed as a companion driver for the OPTIREG PMIC TLF35584/85 in automotive ECU power architectures. The part uses a PMOS/NMOS output stage that delivers 2.5 A peak source/sink current with 60 ns typical rise and fall times, enabling fast switching of power MOSFETs in 12 V automotive battery rails. A half-bridge gate driver is a power-management IC that translates low-current logic-level PWM signals from a microcontroller into the high-current gate-drive signals required to switch the high-side and low-side MOSFETs of a synchronous buck or boost converter. In the broader power-management hierarchy, the TLF11251 sits between the microcontroller (control layer) and the discrete power MOSFETs (switching layer), making it a critical glue device in DC-DC converter sub-systems. Without a dedicated driver, a microcontroller GPIO pin cannot directly charge and discharge a power MOSFET gate fast enough for efficient high-frequency switching. Key specifications include a 3.5 V to 7 V supply range, 2.5 A peak output drive, 60 ns propagation delay matching between high-side and low-side channels, and integrated shoot-through protection that prevents both MOSFETs from conducting simultaneously. The non-inverting input logic simplifies PWM signal routing, and the exposed thermal pad keeps junction temperature low during continuous switching. The driver is qualified to AEC-Q100 for automotive under-hood and chassis applications. The TLF11251 is specifically engineered to pair with Infineon's AURIX TC38x and TC39x 32-bit TriCore microcontrollers, providing the gate-drive stage for downstream buck converters that power the MCU core, ADC, and communication peripherals. The tight propagation-delay matching supports the dead-time control required by the OPTIREG TLF35584/85 PMIC family. Internal shoot-through protection and under-voltage lockout (UVLO) on the driver supply safeguard the power stage during cold-crank and load-dump transients typical of 12 V automotive electrical systems. Typical applications include 12 V automotive DC-DC converters, AURIX TC38x/TC39x ECU power stages, body-control modules, ADAS sensor power rails, and industrial 24 V buck regulators. The 2.5 A drive strength is sufficient for switching most sub-100 V N-channel MOSFETs commonly used in point-of-load converters up to approximately 10 A load. When designing with this part, place the bootstrap capacitor for the high-side channel as close as possible to the BST and SW pins to minimize switching losses. The exposed pad must be soldered to a sufficiently large copper pour to keep junction temperature within the -40 C to +125 C automotive grade-A operating range. This page synthesizes distributor pricing, parametric comparisons, and practical PCB-layout guidance not collected in a single Infineon document.
TPS1HB08BQPWPRQ1 - 40V 8mΩ Smart High-Side Switch | TI
The Texas Instruments TPS1HB08BQPWPRQ1 is a 40-V, 8-mΩ, single-channel smart high-side switch intended for 12-V automotive systems, delivered in a 16-pin HTSSOP (PWP) package with PowerPAD exposed thermal pad. It is qualified to AEC-Q100 grade 1 and integrates a low-Rdson N-channel MOSFET with on-resistance of 8 mΩ typical, supporting continuous load currents up to 70 A per the DigiKey listing, with an operating voltage range of 4 V to 18 V nominal and absolute maximum of 40 V. A high-side switch is a power-distribution topology that places the switching element between the supply rail and the load, allowing the load to be tied to chassis ground and providing inherent short-to-ground protection. Smart high-side switches extend this with on-die diagnostics and protection. In the system hierarchy, the TPS1HB08BQPWPRQ1 sits inside the power-management subsystem (load driver -> high-side switch -> power distribution IC -> automotive PMIC), enabling ECU designers to replace discrete MOSFETs, fuses, and sense resistors with a single AEC-Q100 qualified device. Key features include an adjustable current limit (6.4 A to 70 A depending on variant), integrated thermal shutdown, reverse-battery and load-dump protection, open-load detection in on and off states, short-to-ground and short-to-battery diagnostics, and a current-sense analog feedback output. The exposed thermal pad and 8 mΩ on-resistance minimize conduction loss and junction-temperature rise at heavy loads. The device operates across -40°C to +125°C ambient, satisfying under-hood automotive requirements. Architecturally, the TPS1HB08-Q1 combines a vertical N-channel power MOSFET with charge pump, gate driver, current-sense mirror, and an SPI-compatible or PWM-friendly control interface. The charge pump maintains gate enhancement at low VIN, while the analog CSN pin provides a ground-referenced current proportional to load current for closed-loop monitoring and fault detection. Typical applications include automotive body electronics such as headlight LED drivers, HVAC blower and fan control, seat and mirror actuators, infotainment power rails, and front-camera heater supplies. It is also used in zone-architect 12-V domain controllers where each high-current rail requires independent protection and diagnostics. When designing with this device, allocate sufficient PCB copper area to the PowerPAD to keep junction temperature below 150°C under worst-case VIN and ILOAD, and bypass VIN with at least 100 nF plus 10 µF ceramic placed within 5 mm of the pin. Use the CSN sense resistor value to set the analog current-limit threshold for your load. This page synthesizes distributor pricing, drop-in alternatives, and practical thermal/diagnostic notes that complement the manufacturer datasheet for AEC-Q100 design reviews.
TPS2001CDGKR - 2A USB Power Switch, 72mΩ, 5V VSSOP-8 | TI
The Texas Instruments TPS2001CDGKR is a single-channel, current-limited USB power-distribution switch housed in an 8-pin VSSOP (DGK) package. It delivers up to 2 A continuous load current from a 4.5 V to 5.5 V input rail, with a 72 mΩ (typical) N-channel MOSFET high-side switch that minimizes voltage drop and power dissipation in USB and other hot-plug applications. A power-distribution switch (also called a USB power switch or load switch) is a smart high-side MOSFET combined with protection circuitry. It sits between a system power rail and a downstream port, providing controlled turn-on, fault isolation, and current limiting. Within the broader taxonomy, a load switch sits beneath hot-swap controllers and above discrete MOSFETs in the power-management hierarchy, typically integrating an N-channel MOSFET, charge pump, current sense amplifier, and fault logic into one IC. Key features of the TPS2001CDGKR include a fixed 2 A current-limit threshold with ±20% accuracy, fast 2 µs short-circuit response, true reverse-current blocking when disabled, an output discharge resistor for safe USB VBUS decay, and an active-high enable input for power sequencing. The device asserts an active-low fault flag (OC) whenever the output exceeds the current-limit threshold or experiences a reverse-voltage condition, simplifying host monitoring in compliant USB ports. The device uses an internal charge pump to drive the gate of the N-channel MOSFET, achieving low Rds(on) without requiring an external bootstrap supply. Built-in thermal protection shuts down the switch when junction temperature rises excessively, and auto-restart resumes operation once the fault clears. The 8-VSSOP (DGK) footprint (3.0 mm body width) is compatible with industry-standard pinouts, allowing direct layout reuse across the TPS20xxC family. Typical applications include USB 2.0/3.0 downstream ports on motherboards and hubs, charging ports for tablets and smartphones, set-top boxes, and any 5 V rail requiring inrush and short-circuit protection. The combination of high current limit, low on-resistance, and true reverse blocking makes it a strong fit for hot-plug VBUS distribution where back-feeding from peripherals must be prevented. When designing with the TPS2001CDGKR, observe input-capacitor placement guidelines and ensure the trace between IN and GND pins is short and wide to handle inrush transients. Decoupling with a 1 µF ceramic between IN and GND is strongly recommended to keep the device stable during load steps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
TPS2041BQDBVRQ1 - Automotive 0.5A USB Power Switch SOT-23-5 | TI
The Texas Instruments TPS2041BQDBVRQ1 is an automotive-qualified, single-channel, current-limited USB power-distribution switch housed in a 5-pin SOT-23 (DBV) package. It delivers a continuous load current of 500 mA from a 2.7 V to 5.5 V input rail, with an on-resistance of 105 mΩ (typical) and a factory-trimmed current limit of approximately 1 A. The TPS2041BQDBVRQ1 is the AEC-Q100 qualified variant of the TPS2041B, engineered for harsh automotive power-distribution environments. A USB power-distribution switch is a high-side load switch that sits between a 5 V bus and a downstream USB port or peripheral. It protects the host system from short circuits and over-current events by combining an N-channel MOSFET pass element with built-in current-limit, thermal shutdown, and undervoltage lockout. When the host asserts the active-low enable input, the switch closes to deliver current; when disabled, it presents a high-impedance path to block back-feeding. Key features include an accurate current limit at approximately 1 A, an integrated 105 mΩ N-channel MOSFET, thermal and short-circuit protection, an active-low logic enable input, and a flag output that asserts on fault. The SOT-23-5 footprint keeps board area minimal, making the part suitable for compact infotainment, telematics, and body-electronics modules where PCB real estate is constrained. The TPS2041BQDBVRQ1 uses an N-channel MOSFET pass element driven by an internal charge pump to achieve true low-RDS(on) high-side switching. This architecture minimizes I²R conduction loss on the 5 V rail and keeps thermal rise modest at the 500 mA continuous rating. The fixed current limit prevents the upstream automotive bus from sagging during load transients, while the thermal-shutdown circuit latches the switch off on excessive junction temperature. Typical applications include USB port power switching in automotive head units, body control modules, and rear-seat infotainment hubs. The device is also used to switch individual loads downstream of an LDO, providing fault isolation between branches. The wide input range (2.7 V to 5.5 V) tolerates cold-crank and load-dump conditions typical of 12 V automotive systems after regulation. When designing with this device, ensure the input supply is well-decoupled with at least 1 µF of ceramic capacitance placed close to IN. Avoid continuous operation above 500 mA and verify thermal performance against the SOT-23-5 θJA. This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone.
TPS2054 - Quad 0.5A USB Power Switch 80mOhm | Texas Instruments
The Texas Instruments TPS2054 is a quad-channel power-distribution switch integrating four N-channel MOSFET high-side switches in a single 16-pin SOIC package. Each channel supports 500 mA continuous current with a 0.9 A current limit, operating from a 2.7 V to 5.5 V input range with 80 mOhm maximum on-resistance (5 V input) and active-high enable inputs. A power-distribution switch is a type of load switch within the power management IC hierarchy that sits between a supply rail and its load, providing controlled turn-on, fault protection, and status reporting. USB power switches specifically guard downstream ports against overcurrent and short-circuit faults, preventing host rail collapse in systems that distribute 5 V power to multiple peripheral ports. Key features include 500 mA continuous current per channel for USB compliance, 135 mOhm typical high-side MOSFET resistance, short-circuit and thermal protection, and an overcurrent logic output (nFAULT) that signals fault conditions to the host controller. The device offers logic-level enable inputs, a 2.5 ms typical output rise time that limits inrush current during hot-plug events, and undervoltage lockout for predictable startup behavior. Internally, each switch uses a charge-pumped N-channel MOSFET gate drive with precision current-sense circuitry. When load current exceeds the 0.9 A limit, the device enters constant-current mode; sustained faults trigger thermal shutdown per channel. The open-drain overcurrent output allows direct connection to a microcontroller GPIO with a pull-up resistor. Typical applications include USB hub port power control, self-powered and bus-powered USB peripherals, multi-port charging accessories, hot-plug power switching in embedded systems, and industrial power-rail partitioning requiring per-channel fault isolation. Design tip: the controlled 2.5 ms rise time removes the need for external soft-start circuitry, but ensure PCB traces per channel are rated for 0.9 A fault current and place the input/output bypass capacitors close to the device pins for stable current-limit behavior.
TPS2054AD - Quad 500mA USB Power Distribution Switch | TI
The Texas Instruments TPS2054AD is a quad-channel current-limited power-distribution switch integrating four 80 mOhm N-channel MOSFET high-side switches, delivering 500 mA continuous current per channel (0.9 A minimum current limit) from a 2.7 V to 5.5 V input range in a 16-pin SOIC (D) package. A power-distribution switch, also called a high-side load switch or USB power switch, is a power management IC that sits between a supply rail and a load, turning the load on and off with a logic-level enable signal while protecting the upstream supply from faults. Within the power management hierarchy, it belongs to the power-distribution switch and load-driver class, complementing voltage regulators and hot-swap controllers in multi-port systems. Key features include independent enable inputs (CMOS- and TTL-compatible, active-high) for each channel pair, a per-channel current limit with independent thermal and short-circuit protection, and a shared fault-report logic output that flags overcurrent conditions to a host controller. A 2.5 ms typical output rise time limits inrush current when switching heavy capacitive loads, and undervoltage lockout keeps the outputs off until the input rail is valid. Architecturally, each N-channel MOSFET switch is driven by an internal charge-pump gate driver, which keeps on-resistance low at only 80 mOhm and minimizes voltage drop at full 500 mA load. Response to short circuits is fast, protecting the input rail from brownout during fault events. Typical applications include USB host and hub port power switching, hot-plug power distribution in set-top boxes and peripherals, and multi-rail power sequencing in industrial systems where heavy capacitive loads and short circuits are likely. A key design consideration: at 5.5 V input and full load on all four channels, estimate conduction loss as 4 x I^2 x RDS(on) = 4 x 0.25 x 0.08 = 80 mW (estimated), which the SOIC-16 package dissipates without a heatsink, but PCB copper around pins still aids thermal relief. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-brand alternatives (TPS2054BD, TPS2054DG4), and practical design notes for power-distribution switching designs.
TPS2062CDGNR - Dual 1A USB Power Switch | Texas Instruments
The Texas Instruments TPS2062CDGNR is a dual-channel, current-limited, power-distribution switch designed for USB and other hot-swap applications where heavy capacitive loads and short-circuits may be encountered. It integrates two 70-mΩ high-side N-channel MOSFET switches with independent enable inputs, providing a compact and robust power-switching solution in an 8-pin HVSSOP (DGK) package with exposed thermal pad. The device operates over an input voltage range of 2.7V to 5.5V and supports a continuous load current of 1A per channel, with a fixed current-limit threshold of 1.5A (typical) and an accurate ±20% current-limit tolerance. A power-distribution switch is a type of load switch that provides controlled power delivery to downstream circuits, offering protection against overcurrent, short-circuit, and over-temperature conditions. It sits between the power source and the load, acting as a smart switch that can be enabled or disabled via a control signal. In the system hierarchy, a power-distribution switch is a subset of power management ICs, which also include voltage regulators, DC-DC converters, and battery management devices. The TPS2062C family is specifically optimized for USB ports, where it ensures safe power delivery and protects the host controller from fault conditions. Key features of the TPS2062CDGNR include a fast overcurrent response time of 2 µs (typical), which quickly limits fault current to protect upstream components. The device also provides reverse current blocking, output discharge function, soft-start to reduce inrush current, and under-voltage lockout (UVLO) to ensure proper operation during power-up. Built-in over-temperature protection and short-circuit protection further enhance system reliability. The active-low enable inputs allow for simple logic control, and the 70-mΩ on-resistance minimizes power loss and voltage drop across the switch. Technically, the TPS2062CDGNR uses a constant-current limiting scheme that maintains a safe output current during overload conditions, preventing damage to the switch and the load. The output discharge function actively pulls the output to ground when the switch is disabled, ensuring no residual voltage remains on the load. The soft-start feature limits inrush current when driving capacitive loads, which is critical for USB applications where downstream capacitors can be large. The device is specified for operation over the industrial temperature range of -40°C to +125°C, making it suitable for a wide range of environments. Typical applications include USB ports on computers, hubs, and peripherals, as well as general-purpose power switching in consumer electronics, industrial equipment, and set-top boxes. The dual-channel configuration allows two independent loads to be controlled from a single device, saving board space and cost. The TPS2062CDGNR is also ideal for powering downstream devices in systems that require hot-swap capability, such as docking stations and battery chargers. When designing with this device, ensure that the input and output capacitors are placed close to the pins to minimize parasitic inductance and maintain stable operation. The exposed thermal pad should be soldered to a large copper area on the PCB to enhance heat dissipation, especially when operating at high currents. Additionally, the enable pins should be driven with proper logic levels to avoid unintended switching.
TPS2062DR - Dual 1A USB Power Switch | Texas Instruments
The Texas Instruments TPS2062DR is a dual-channel, current-limited power distribution switch designed for USB and general-purpose power management applications. It integrates two 70-mΩ high-side N-channel MOSFETs, each capable of delivering up to 1 A continuous current, with an input voltage range of 2.7 V to 5.5 V. The device is housed in an 8-pin SOIC (D) package and features an active-low enable input, making it suitable for power sequencing and hot-swap applications. A power distribution switch is a semiconductor device that controls and protects power delivery to downstream loads. It typically includes a high-side MOSFET, current sensing, and protection features such as overcurrent, thermal shutdown, and undervoltage lockout. In a system hierarchy, the TPS2062DR sits between the main power rail and peripheral devices, acting as a smart switch that can be turned on/off via a logic signal while providing fault protection. Key features of the TPS2062DR include a 70-mΩ high-side MOSFET, 1-A continuous current per channel, accurate current limit (1.1 A min, 2.1 A max), thermal and short-circuit protection, undervoltage lockout, deglitched fault report (OC), and a typical rise time of 0.6 ms. The active-low enable input allows for straightforward control from microcontrollers or logic gates. The device operates over a junction temperature range of -40°C to 125°C, making it suitable for industrial and automotive environments. Technically, the TPS2062DR uses a current-limited architecture that ensures safe operation under overload conditions. The accurate current limit prevents excessive current draw, protecting both the switch and the load. The deglitched fault report (OC) provides a clean signal to the host controller, avoiding false triggers from transient currents. The undervoltage lockout ensures the switch remains off until the input voltage is stable, preventing erratic behavior during power-up. Typical applications include USB port power switching, hot-swap power distribution, and power management in consumer electronics, industrial equipment, and networking devices. The dual-channel configuration allows independent control of two loads, making it ideal for applications requiring multiple power domains. When designing with the TPS2062DR, ensure adequate input and output capacitance to maintain stability and minimize voltage transients. Place the device close to the load to reduce parasitic inductance and improve fault response. The active-low enable pin should be pulled up or driven by a logic signal; do not leave it floating.
TPS2115APW - 1.25A, 5.5V Power Mux w/ Status | Texas Instruments
The Texas Instruments TPS2115APW is a 2.8-V to 5.5-V, 84-mΩ, 1.25-A autoswitching power multiplexer (power mux) housed in an 8-pin TSSOP (PW) package. It accepts two input supplies (IN1 and IN2) and delivers a regulated output to a common load with sub-ohm (84 mΩ typical) N-channel MOSFET pass elements per channel. The device features manual and automatic switchover modes, a STATUS output flag, and cross-conduction blocking logic to prevent momentary shorting between the two sources during transitions. A power mux is a category of power-management IC that arbitrates between two or more DC input sources (battery, wall adapter, USB, auxiliary rail) and routes one of them to the load. Within the broader taxonomy, power muxes sit below load switches and above simple ideal-diode OR-ing controllers, combining the low-loss benefits of MOSFET pass elements with intelligent source-selection logic. The TPS2115A family specifically targets systems requiring seamless transitions between a primary and backup supply without brown-outs on the load. Key features of the TPS2115APW include 84 mΩ typical on-resistance per channel, low 0.5 µA standby current, programmable current limiting, inrush current control, thermal shutdown protection, and a wide 2.8 V to 5.5 V operating range on both input rails. The integrated STATUS pin reflects which source is currently active, enabling host-side telemetry in multi-rail systems. Architecturally, the TPS2115APW uses back-to-back N-channel MOSFETs per channel driven by charge-pumped gate drivers. The body-diode reverse-blocking design prevents unintended current flow from a higher-voltage rail into a lower-voltage rail. The control logic implements break-before-make switching with user-programmable switchover thresholds and switching speed. Typical applications include battery-backed-up portable electronics, USB/wall-adapter power switching in handheld terminals, multi-rail industrial sensor nodes, redundancy power OR-ing in 5V systems, and any application requiring glitch-free transitions between two DC sources. When designing with the TPS2115APW, consider that the TSSOP-8 package has a thermal resistance of approximately 150 °C/W; continuous 1.25 A operation at high VIN requires adequate copper pour. The MS pin (mode select) and ILIM pin (current limit) require external component selection to balance inrush vs steady-state behavior. Cross-conduction blocking eliminates the need for external back-to-back FETs, simplifying BOM. This page synthesizes distributor pricing, drop-in alternatives within the TSSOP-8 footprint, and design guidance not found in the manufacturer datasheet alone - giving procurement and design engineers a one-stop reference for source-selection decisions.
TPS2121RUX - 22V 4.5A Priority Power MUX | Texas Instruments
The Texas Instruments TPS2121RUX is a 2.7-V to 22-V, 56-mΩ, 4.5-A priority power multiplexer (power MUX) with seamless switchover, housed in a 12-pin VQFN-HR (RUX) package measuring 2.0 mm × 2.5 mm. It manages two input power sources (IN1 and IN2) and selects one to power a single output (OUT) according to a user-defined priority scheme. The device supports up to 4.5 A continuous load current with an internal 56-mΩ (typical) Rds(on) MOSFET per channel, with adjustable current limit set by an external resistor. A power multiplexer is a load-sharing/redundancy switch that allows a system to draw power from one of two sources with priority logic, automatic switchover, and in-rush control. The TPS2121 belongs to the ORing controller / power MUX / load-switch product hierarchy, sitting between discrete MOSFET ORing designs (anode-to-cathode diodes or ideal-diode controllers) and full PMIC solutions. It integrates dual back-to-back N-channel MOSFETs, priority arbitration, adjustable current limit, soft-start, and seamless fast switchover (< 5 µs) inside a tiny QFN footprint, eliminating dozens of discrete components. Key features include 2.7-V to 22-V operating input range, 56-mΩ per-channel Rds(on), 4.5-A continuous current capability, adjustable current limit (ILIM), seamless switchover within 5 µs, and a logic-controlled priority mode (PR1 = High → IN1 priority; PR1 = Low → IN2 priority). The VQFN-HR-12 (RUX) package has an exposed thermal pad (PowerPAD) for low thermal resistance, supporting up to ~2 W continuous dissipation on a modest PCB copper pour. The device operates over -40 °C to +125 °C junction temperature and is characterized for industrial-grade environments. The architecture uses TI's priority-based power-path control: the device continuously compares IN1 and IN2 voltages against an internal reference (2.5 V typical on PR1) and switches to the higher-priority source when it is valid. During switchover, internal break-before-make control prevents cross-conduction; the output is held up by output capacitance during the brief (~5 µs) transition. The current-limit and soft-start blocks protect against in-rush spikes when a freshly-selected source is brought online. Typical applications include redundant power rails in industrial PLCs and factory automation, backup battery switching in portable medical and IoT devices, USB-C PD source multiplexing, multi-battery Point-of-Sale (POS) terminals, and automatic transfer of AC adapters versus battery in notebook docking stations. The compact 2 mm × 2.5 mm footprint makes it ideal for space-constrained designs that previously required a discrete ORing controller plus two MOSFETs. When designing with the TPS2121, place input and output ceramic capacitors as close as possible to the IC pins (10 µF minimum on IN1, IN2, and OUT recommended) to minimize voltage droop during switchover. Use the PR1 resistor divider to set the VIN1 priority threshold, set ILIM with an external resistor (RILIM = K / ILIM), and provide adequate copper area on the PowerPAD for thermal dissipation. Avoid parallel connection of multiple TPS2121 units - one device per system is standard. This page synthesizes distributor pricing, drop-in alternatives, prioritized selection guidance, and practical PCB layout notes that go beyond a typical manufacturer datasheet summary.
TPS22919-Q1 - 5.5V 1.5A Load Switch SC-70-6 | Texas Instruments
The Texas Instruments TPS22919-Q1 is a self-protected, single-channel load switch with controlled slew rate that integrates an N-channel MOSFET operating from 1.6 V to 5.5 V input, supporting up to 1.5 A of continuous current in a 6-pin SC-70 (DCK) package. The device offers a 90 mOhm typical on-resistance and AEC-Q100 Grade 1 automotive qualification. A load switch is a power management IC that acts as an electronic switch between a power rail and its load, enabling or disabling power delivery under logic control. Load switches sit within the power distribution and protection hierarchy of a system, complementing voltage regulators, e-fuses, and hot-swap controllers. They are used to sequence rails, reduce leakage in standby, and isolate faults downstream. Key differentiating features of the TPS22919-Q1 include controlled output slew rate for inrush-current limiting during turn-on, adjustable quick output discharge (QOD) that pulls the output low when the switch is off, and integrated self-protection including short-circuit current limiting. According to TI, the device is qualified for automotive applications under AEC-Q100 device temperature grade 1. The internal N-channel MOSFET pass element gives a low, well-controlled on-resistance of 90 mOhm, which limits voltage drop: at 1 A the drop is roughly 90 mV, dissipating about 90 mW. The controlled slew rate soft-starts capacitive loads, avoiding the large inrush spikes that can sag upstream rails or trip protection circuits. The QOD function is adjustable via an external resistor, letting designers trade discharge speed against pull-down current. Typical applications include automotive camera and sensor modules, infotainment power distribution, peripheral-rail switching in ADAS domains, and portable or industrial designs needing fault-isolated power gating. The wide 1.6 V to 5.5 V input range covers 1.8 V, 3.3 V, and 5 V rails in one footprint. For design, account for the Rds(on) power loss at high current, ensure the ON-pin logic threshold matches the controlling GPIO, and size the QOD resistor for the required discharge time. Do not rely on the switch to regulate voltage - it only gates the rail. This page synthesizes distributor availability data, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet.
TPS22970YZPR - 3.6V 4A 4.7mΩ Load Switch | Texas Instruments
The Texas Instruments TPS22970YZPR is a small, space-saving N-channel high-side load switch rated for 3.6 V operation, 4 A pulsed switch current, and 4.7 mΩ typical on-resistance, packaged in an 8-ball DSBGA (WCSP, YZP) chip-scale package. It integrates an N-channel MOSFET biased by a charge pump, an on/off logic input, and an optional output discharge resistor for controlled turn-off behavior. What is a load switch? A load switch is a power-management device that uses an internal MOSFET to connect or disconnect a downstream circuit (a "rail" or "load") from an upstream power source. Unlike a DC-DC converter, a load switch does not regulate voltage — its role is gating, inrush control, sequencing, isolation, and reverse-current blocking. Load switches belong to the broader category of power distribution switches (PDswitches), which sit hierarchically below discrete MOSFETs but above simple pass-gate FETs because they integrate control, protection, and timing into a single IC. Key features of the TPS22970YZPR include a wide input voltage range of 0.65 V to 3.6 V (compatible with 1-cell Li-ion rails as well as 1.0 V/1.2 V/1.8 V/2.5 V/3.3 V logic rails), continuous current up to 2 A and pulsed current up to 4 A, 4.7 mΩ RON that minimizes conduction loss, controlled turn-on to limit inrush current, and an internal discharge path that pulls the output to ground when the switch is disabled. The device operates over -40°C to +105°C and ships on a 0.9 mm pitch WCSP footprint measuring roughly 1.50 mm × 1.50 mm. Architecturally, the integrated charge pump generates a VGS boost above VIN so the NMOS can fully enhance even at very low input voltages — a non-trivial achievement because a standard NMOS would otherwise struggle to pass sub-1 V rails cleanly. This makes the part especially attractive for ultra-low-voltage core rails in mobile and battery-powered designs. Typical applications include power gating in smartphones, wearables, SSDs and solid-state storage modules, portable medical devices, and IoT sensor nodes where the load switch isolates a sleeping sub-system from a battery to extend standby life. The output discharge resistor is particularly useful in multi-rail systems where residual charge on a disabled rail could otherwise leak through the body diode of a downstream load. When designing with this device, pay close attention to the PCB footprint: the WCSP-8 (DSBGA) package requires NSMD pads with precise solder-mask openings and reflow profile matched to JEDEC J-STD-020. Avoid placing vias directly under the balls and follow TI's WCSP layout recommendations. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives from TI's load-switch family, and practical design notes not found in the manufacturer datasheet.
TPS22990DMLR - 10A, 5.5V, 3.9mOhm Load Switch | TI
The Texas Instruments TPS22990DMLR is a single-channel N-channel high-side load switch delivering up to 10 A continuous current with a 3.9 mOhm typical on-resistance, operating over an input voltage range of 0.6 V to 5.5 V in a 10-pin WSON (3x2 mm) package (DML, WSON-10 with exposed pad). A load switch is a power distribution IC that sits between a supply rail and its load, using an internal MOSFET pass element to connect, disconnect, and protect the rail. In the power-management hierarchy, load switches are siblings of hot-swap controllers and eFuses within power distribution ICs, and they are commonly paired with DC-DC converters and LDO regulators to sequence and gate individual rails. Key features of the TPS22990 include the ultra-low 3.9 mOhm on-resistance, which minimizes voltage drop and conduction power loss at high load currents; controlled and adjustable turn-on slew rate via an external CT capacitor, which suppresses inrush current and bus voltage sag; and an integrated power-good (PG) indicator for rail monitoring and sequencing. An optional quick output discharge (QOD) function actively pulls the output low when the switch is off. Architecturally, the device integrates an N-channel MOSFET pass element with gate-drive circuitry powered from a VBIAS supply, allowing the switch to operate down to 0.6 V input while supporting modern low-voltage rails. The adjustable rise time lets designers trade startup time against inrush current for a given output capacitance. Typical applications include server and notebook point-of-load power gating, SSD and storage rail switching, multi-rail power sequencing in SoC and FPGA systems, and battery-powered equipment where low voltage drop is critical. A key design consideration: at 10 A, even 3.9 mOhm dissipates roughly 0.39 W, so PCB copper area under the exposed pad is essential for thermal management. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
TPS22990NDMLR - 10A, 5.5V, 3.9mOhm Load Switch | TI
The Texas Instruments TPS22990NDMLR is a 5.5 V, 10 A, 3.9 mOhm single-channel N-channel high-side load switch housed in a 10-pin WSON (3x2 mm) package, featuring an adjustable controlled turn-on, integrated power-good (PG) indicator, and quick output discharge (QOD) function. A load switch is a power distribution switch, a type of power management IC that sits between a supply rail and its load to gate power on and off, control inrush current, and isolate faults. In the system hierarchy, it belongs to the family of high-side switches used in power trees alongside hot-swap controllers, e-fuses, and DC-DC converters, enabling fine-grained power sequencing and rail management. Key differentiating features include an ultra-low 3.9 mOhm on-resistance, which minimizes both the voltage drop across the switch and conduction power loss at the full 10 A continuous current, and a wide 0.6 V to 5.5 V input voltage range that spans modern sub-1 V core rails up to standard 5 V rails. The adjustable slew rate (soft-start), set via an external capacitor, suppresses inrush current during turn-on, while the integrated PG output simplifies power-rail sequencing and monitoring without external supervisory circuitry. The N-channel MOSFET architecture avoids the body-diode conduction and rds(on) penalties of older P-channel designs at high current. Internal control logic drives the gate with a controlled ramp defined by the CT pin capacitor, and the QOD option actively discharges the output when the switch is disabled, preventing floating rails in multi-rail systems. ESD protection on the pins adds robustness during assembly and handling. Typical applications include SSD and storage power distribution, FPGA and processor core-rail sequencing, networking cards, battery-powered portable systems, and server backplane point-of-load switching, all of which benefit from low-loss high-current switching with controlled turn-on. Design consideration: at 10 A, conduction loss is approximately I2 x R, so PCB copper pour on the IN and OUT pins is essential for thermal management. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
TPS22991IBNRAAR - 5.5V 2.7A Load Switch UQFN-HR | Texas Instruments
The Texas Instruments TPS22991IBNRAAR is a 5.5V, 2.7A, 28 mOhm single-channel load switch with controlled slew rate, housed in a 4-pin UQFN-HR (RAA) package measuring just 0.85 mm x 0.75 mm with 0.4 mm pitch. The device integrates an N-channel MOSFET that operates over a 1.0V to 5.5V input voltage range and is characterized for operation from -55C to +125C, covering extreme-temperature and wide-temperature industrial designs. A load switch is a type of power management IC (power distribution switch) that gates a voltage rail on and off under logic control, protecting downstream circuitry from inrush current and enabling power sequencing. Within the power-management hierarchy, the TPS22991I family sits between a voltage regulator and a simple discrete MOSFET switch: it provides controlled turn-on without regulation of the rail voltage itself. Key features include a low on-resistance of 28 mOhm, which minimizes voltage drop and conduction loss at multi-ampere loads, and a controlled slew rate that limits inrush current when charging large bulk capacitance. The ON/OFF control input interfaces directly with low-voltage GPIO signals, allowing the switch to be driven by microcontrollers and processors operating well below the main rail voltage. Low shutdown leakage makes the device suitable for battery-powered designs where off-state quiescent draw must be minimized. Technically, the integrated N-channel pass element is driven by an internal charge-pump-free gate-drive scheme referenced to the input pin, with slew-rate control implemented through a controlled gate-drive ramp. This gives a predictable, monotonic output voltage ramp that avoids the sharp turn-on transients typical of uncontrolled discrete MOSFET switching. Typical applications include power-rail gating for battery-powered portable electronics, module power sequencing in processors and FPGAs, and load switching in industrial sensors operating over extended temperature ranges. The tiny 0.85 mm x 0.75 mm footprint suits densely packed wearables and IoT modules. Design consideration: verify the device pinout carefully. Unlike most single-channel load switches that use an IN-OUT-GND-EN ordering, the TPS22991I pinout is documented as special in TI's E2E forum, so confirm pin assignments against the manufacturer datasheet before layout. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
TPS22992 - 5.5V 6A 8.7mΩ Load Switch | Texas Instruments
The Texas Instruments TPS22992 is a single-channel load switch with an integrated 8.7 mΩ power MOSFET designed to maximize power density in applications up to 5.5 V input and 6 A continuous output current, housed in an 8-pin WQFN-HR (1.5 mm x 1.25 mm) package. A load switch is a power management IC that sits between a power rail and its load, using an internal MOSFET pass element and control logic to connect or disconnect the load on demand. Load switches occupy the middle of the power management IC hierarchy, below full DC-DC converters and above discrete MOSFET solutions, providing controlled power-up, inrush limiting, rail sequencing, and fault isolation that a bare MOSFET cannot deliver without significant external circuitry. Key features of the TPS22992 include the ultra-low 8.7 mΩ on-resistance, which limits conduction losses to roughly 78 mW at a full 6 A load, an input voltage range up to 5.5 V, and a configurable rise time that gives designers flexibility for power sequencing. The adjustable rise time also minimizes inrush current when switching high-capacitance loads such as large ceramic capacitor banks or downstream SoC core rails. Technically, the TPS22992 uses an N-channel high-side power MOSFET driven by an internal charge-pump gate driver, which allows the switch to achieve extremely low Ron without the voltage-drop penalty of a P-channel device. The TPS22992x family consists of two members: the TPS22992 and the TPS22992S, which differ in their output discharge behavior, letting designers choose whether the output rail floats or is actively pulled low when the switch is disabled. Typical applications include powering processor cores and I/O rails in servers and SSDs, peripheral port power control in industrial systems, and general 5V-rail power distribution where a compact 6 A switch replaces discrete MOSFET-plus-driver solutions. When designing with the TPS22992, account for thermal rise at sustained high load: at 6 A, I2R losses through the 8.7 mΩ switch demand a solid ground-plane copper pour under the WQFN-HR thermal pad to keep junction temperature within limits. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.