MSP430F6638CY
MSP430F6638CY - 20MHz 16-Bit Mixed-Signal MCU | Texas Instruments
The Texas Instruments MSP430F6638CY is a 20 MHz, 16-bit mixed-signal microcontroller with 256KB of Flash memory, 16KB of SRAM, a 12-bit ADC, a 12-bit DAC, a comparator, DMA, USB connectivity, and support for a 160-segment LCD. The device is identified as a die-sale product, so the MSP430F6638CY ordering code is not associated with a standard finished package in the manufacturer product information shown here.
A mixed-signal microcontroller combines a digital processor with analog conversion and other peripheral functions on one integrated circuit. The MSP430F6638 belongs to the MSP430F6xx family, whose 16-bit RISC CPUXV2 architecture uses a reduced instruction set designed for efficient embedded control. USB, serial interfaces, DMA, and high-resolution analog peripherals make this device suitable for industrial instrumentation, data acquisition, communications, and control systems where integration can reduce external component count.
The MSP430F6638 operates with a 20 MHz maximum clock and provides 256KB of program Flash plus 16KB of SRAM. Its analog resources include a 12-bit ADC and 12-bit DAC, while the integrated comparator supports thresholding and signal monitoring. Additional peripherals include DMA, brown-out detection and reset, power-on reset, PWM, a watchdog timer, and a 160-segment LCD driver. These features support real-time acquisition, local control loops, human-machine interfaces, and firmware-managed peripheral movement.
The device provides I2C, IrDA, LINbus, SCI, SPI, UART/USART, and USB connectivity. USB can support a direct host or device-oriented peripheral role, while the serial interfaces allow connection to sensors, transceivers, displays, and external converters. The 74 I/O positions indicated for the MSP430F6638 family provide a broad hardware interface for a platform assembled from bare die or a qualified module.
Because MSP430F6638CY is offered as die sale rather than a conventional packaged ordering option, assembly into a finished electronic assembly requires die attach, wire bonding, electrical verification, and a package or substrate designed for the device. The die-sale designation also means that exposed-pad, lead, pinout, and standard package drawings cannot be assigned safely without the bonding map or assembly documentation.
For new production designs, engineers should use the MSP430F6638 family documentation, confirm the available memory and peripheral configuration, and plan the analog input conditioning around the ADC resolution. USB signal routing requires controlled impedance and careful placement of protection and bypass components, while firmware should verify reset behavior and watchdog behavior during startup.
This product summary consolidates the manufacturer specifications, ordering information, interface capabilities, die-sale constraints, and application guidance needed to evaluate the MSP430F6638CY before beginning an embedded mixed-signal design.
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