PIC32MZ1024EFK144-I/JWX
PIC32MZ1024EFK144-I/JWX - 200MHz 32-bit MCU 1MB Flash | Microchip
The Microchip Technology PIC32MZ1024EFK144-I/JWX is a 32-bit MIPS32 M-Class microcontroller running at 200 MHz with 1 MB (1024 KB) of Flash and 256 KB of SRAM, packaged in a 144-ball Thin Fine-Pitch BGA (TFBGA) measuring 7x7 mm with 0.65 mm pitch. It is a member of the PIC32MZ EF family of Embedded Connectivity with Floating Point Unit devices, integrating an IEEE 754-compliant FPU and a DSP-enhanced core with four 64-bit accumulators and single-cycle MAC, saturating, and fractional math. According to the Microchip product page, the EF family targets connectivity applications in Industrial, Automotive, IoT, Graphics (HMI) and Motor Control market segments, supporting up to 2 MB Flash and 512 KB SRAM across the family.
A microcontroller (MCU) is an integrated circuit containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals (UART, I2C, SPI, ADC, timers, GPIO) on a single silicon die. Modern 32-bit MCUs such as the PIC32MZ family occupy the high-performance tier of the microcontroller taxonomy: microcontroller -> 32-bit MCU -> ARM/MIPS Cortex- and Warrior-class MCU -> high-performance connectivity MCU with FPU and DSP. They are differentiated from 8/16-bit MCUs by wider datapaths, higher clock rates, larger memory, and DSP/FPU capabilities, and from microprocessors (MPUs) by integrating memory and peripherals on-chip.
Key features of the PIC32MZ1024EFK144-I/JWX include: 200 MHz core delivering up to 330 DMIPS, dual-panel Flash supporting live update, hardware crypto engine, two CAN modules, high-speed USB, Ethernet, 12-bit ADC, SQI (Serial Quad Interface) for external memory, and a peripheral pin select (PPS) system that allows flexible remapping of digital peripherals to GPIO. The device operates from 2.3 V to 3.6 V and supports an industrial temperature grade of -40°C to +85°C (the I suffix).
From an architecture standpoint, the PIC32MZ EF core is a 32-bit Harvard architecture with separate Flash and SRAM buses, prefetch cache to mask Flash latency, and a tightly-coupled FPU. The 144-ball TFBGA package exposes up to 120 GPIO lines via the peripheral pin select, making the device well-suited to graphics HMI panels, multi-protocol gateway designs, and motor-control firmware where high CPU throughput and deterministic interrupt response matter.
Typical applications include industrial IoT gateways with Ethernet and CAN, graphical HMI panels with TFT LCD driving, automotive connectivity and body controllers (non-AEC-Q100 grade), brushless-DC and stepper motor control, and high-performance consumer connectivity products. Designers leverage the FPU for sensor-fusion DSP, the crypto engine for TLS/DTLS acceleration, and the dual-panel Flash for secure firmware-over-the-air (FOTA) update flows.
When planning layout for this part, place 0.1 µF decoupling capacitors adjacent to every VDDCORE/VDDIO pair and follow Microchip's BGA fanout recommendation in the datasheet PCB layout section, since 0.65 mm-pitch BGA escape routing is non-trivial. Designers should also budget for the chip's internal core voltage regulator stabilization network (4.7 µF + 0.1 µF) before issuing the board layout, and confirm the device variant's temperature grade and Flash size against your firmware image and environmental spec.
This page synthesizes distributor stock, pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design considerations not found in a single datasheet, helping engineers shorten the BOM, layout, and qualification cycle for a 200 MHz-class 32-bit MCU with FPU.
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