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XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD
XC6SLX45-N3FG676C

XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD

AMD XC6SLX45-N3FG676C is a Spartan-6 LX field-programmable gate array containing 43,661 logic elements, providing 358 I/O in a 676-ball FCBGA package. Manufactured on a 45 nm low-power copper process, the device combines programmable logic, fixed and configurable I/O, block RAM, and DSP resources in one reconfigurable semiconductor. It is positioned for cost-sensitive embedded systems requiring substantial parallel processing without the power and complexity of a high-end FPGA. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be programmed after manufacture. The Spartan-6 family occupies the configurable-logic and embedded-processing tiers of the FPGA hierarchy, below higher-performance programmable logic devices while providing broad I/O and embedded-memory capability. The XC6SLX45 is particularly useful when parallel data paths, deterministic control, hardware acceleration, or flexible field updates are required. The principal characteristics include 43,661 logic elements, 358 I/O, a 676-FCBGA package, and a 45 nm low-power copper implementation. These resources suit image pipelines, industrial controllers, communications equipment, test systems, and embedded signal-processing designs. The large I/O count also permits simultaneous connections to external memory, converters, transceivers, and parallel peripherals, reducing the need for additional interface logic. Spartan-6 LX devices combine programmable logic with block RAM and dedicated DSP arithmetic resources. This heterogeneous architecture allows parallel datapaths to be implemented more efficiently than with a bank of general-purpose processors. The device can support deterministic hardware control, protocol termination, data filtering, and real-time signal transformation, while configuration storage preserves the programmed function after power-up. Typical uses include industrial automation, video and imaging, communications infrastructure, instrumentation, and embedded control platforms. Its 358 available I/O is especially attractive for high-pin-count designs requiring memory interfaces and multiple external buses. Designers can also use the FPGA fabric to implement custom peripherals, bridge incompatible interfaces, or accelerate computationally intensive operations before transferring summarized results to a host processor. Design planning should begin with the AMD Spartan-6 package pinout and pinout files, followed by verification of power rails, configuration interface, clocking, and high-speed routing constraints. Because the exact ordering code and grade-specific timing information control the final qualification, the applicable AMD data sheet, package files, and design-support documentation should remain the authority for schematic and PCB implementation. This product overview consolidates the device identity, package characteristics, searchable ordering-code references, drop-in family alternatives, and practical design considerations into one engineering-focused resource. It supports initial device selection while distinguishing exact-footprint alternatives from options that would require a different package or PCB redesign.

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XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD
XC6SLX45-N3FG676I

XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD

The AMD XC6SLX45-N3FG676I is a Spartan-6 LX field-programmable gate array with 358 I/O and a 676-BGA package. The FPGA integrates programmable logic, configurable digital resources, block RAM, and dedicated DSP resources into a single device. Its 676-BGA land pattern supports dense PCB layouts where several high-speed interfaces and parallel buses must be implemented in a compact area. The device is positioned for industrial control, communications, instrumentation, embedded vision, and general-purpose programmable logic applications. An FPGA is a semiconductor whose digital behavior is configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel data paths, control logic, protocol bridges, signal processors, and hardware accelerators within one device. The Spartan-6 LX family occupies the FPGA product hierarchy: FPGA and CPLD devices are programmable-logic semiconductors, while the LX designation identifies the device family optimized for low-cost, system-level integration. The XC6SLX45-N3FG676I combines a 45-class Spartan-6 LX device designation with 358 user I/O in a 676-BGA package. This high pin count is useful when an interface requires substantial parallel connectivity, but it also makes ball assignment, power planning, and PCB layout more demanding than a smaller package. Designers should preserve the manufacturer's recommended ball map and distinguish fixed configuration pins, clock inputs, general-purpose I/O, and dedicated function pins before routing the board. Spartan-6 LX devices are well suited to designs that need flexible logic density without moving to a larger device family. Common implementation areas include parallel-to-serial data conversion, industrial control and data acquisition, network-interface front ends, embedded control logic, audio and communications signal conditioning, and test equipment. Programmable logic can also be combined with external processors or mixed-signal devices when deterministic timing, parallel processing, or multiple interface standards are required. Thermal and signal-integrity planning are central to a 676-BGA design. Although the package provides substantial interconnection capacity, high-speed nets should use controlled-impedance routing, continuous reference planes, and the shortest practical connections. Power and ground distribution should follow the manufacturer's ball assignments, and unused balls should follow the package-specific assembly and termination requirements rather than being treated as interchangeable connections. The most important replacement decision is package and pin compatibility. A device with the same 676-BGA outline is not automatically interchangeable because speed-grade, temperature-grade, and device identifiers can change I/O behavior or performance. Validate the complete pinout, configuration requirements, power rails, clock resources, and timing before approving any substitute. This page consolidates the exact package and I/O information, compatible Spartan-6 LX candidates, application guidance, and board-level design considerations for engineers evaluating the XC6SLX45-N3FG676I. It is intended to accelerate component identification, replacement screening, PCB planning, and system integration without changing the verified manufacturer naming.

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XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-2FG484I

XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

The AMD XC6SLX45T-2FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 3,411 configurable logic blocks, 6,822 adaptive logic modules, and 296 I/O, supplied in a 484-pin FBGA package. The verified part data identifies a 45 nm CMOS device with a 1.2 V core supply, 667 MHz performance figure, 23 mm by 23 mm package dimensions, and 1.0 mm ball pitch. Its -2 speed grade is intended for designs requiring a balance of logic density, embedded memory, DSP capability, and programmable I/O rather than the highest Spartan-6 performance tier. An FPGA is a programmable-logic semiconductor whose interconnect, logic, and I/O resources can be configured after manufacture. Spartan-6 devices belong to the FPGA and CPLD product hierarchy and combine configurable logic blocks with programmable input/output blocks, block RAM, DSP resources, clock management, and dedicated configuration mechanisms. The XC6SLX45T-2FG484I is suited to embedded systems requiring parallel interfaces, protocol handling, signal processing, control logic, and moderate on-chip data storage. Key verified features include the 43,661-cell Spartan-6 LXT architecture, 296 I/O, 3,411 configurable logic blocks, 6,822 adaptive logic modules, a 667 MHz listed operating-frequency figure, and a 1.2 V supply requirement. The 484-BBGA footprint provides a high pin count for systems using wide external buses, multiple high-speed interfaces, or several independent peripherals. The industrial-temperature suffix I identifies the grade used when the system requires operation across the industrial temperature range; exact limits are not supplied in the retrieved snippets. The device is built on 45 nm CMOS technology and is positioned for cost-sensitive, high-volume embedded applications where deterministic programmable logic is more valuable than a fixed function. The -2 speed grade provides a lower-performance option than the -3 grade identified in cross-reference data. Engineers should also consider clocking, configuration memory, power sequencing, I/O standards, and thermal dissipation when integrating the BGA package. Typical applications include industrial control gateways, networked embedded equipment, instrumentation, video and image processing, communications infrastructure, and consumer electronics. Its 296 I/O count is useful for bridging legacy parallel peripherals to serial networks, while its logic density can consolidate multiple fixed-function devices. The FPGA still requires a correctly configured bitstream, a suitable clock source, decoupling network, and thermal-aware PCB layout. The principal design consideration is package-level implementation. A 484-BBGA device requires a fine-pitch PCB land pattern, careful via-in-pad and escape-routing strategy, adequate thermal copper, and assembly process control. Designers should verify the exact Spartan-6 pinout and configuration requirements using the manufacturer package files before schematic or layout release. This page combines verified distributor and manufacturer references, drop-in family alternatives, and practical selection guidance for engineers evaluating the XC6SLX45T-2FG484I.

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XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484C

XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484C is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 296 I/O, and a 484-pin FBGA package. The device uses 45 nm CMOS technology and operates from a 1.2 V supply, making it a configurable logic platform for embedded control, communications, signal processing, and industrial systems. An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable I/O, embedded memory, clocking, and digital signal-processing resources. Designers implement and revise hardware behavior through a configuration bitstream rather than changing the integrated-circuit mask. The XC6SLX45T combines 43,661 logic cells with 296 I/O in the FG484C 484-pin FBGA package. Its -3 designation identifies the device speed grade used in the ordering code. The verified product listings also identify 45 nm CMOS fabrication and a 1.2 V operating supply. These resources make the device suitable for designs requiring parallel interfaces, protocol bridging, embedded control logic, and moderate signal-processing throughput. The Spartan-6 LXT architecture supports integration of programmable logic with dedicated block RAM and DSP resources. This allows a single FPGA to implement control state machines, packet buffering, waveform generation, filtering, and external interface bridging. The 296 available I/O provide substantial connectivity for parallel buses, memory interfaces, clocks, and control signals, although the exact user-assigned I/O standards must be confirmed against the manufacturer documentation. Typical applications include industrial automation, embedded instrumentation, communications equipment, video and image processing, motor control, and general-purpose digital signal processing. In each case, the FPGA is configured after power-up and can implement parallel processing or hardware protocols that would otherwise require several discrete logic devices, processors, memories, and interface components. Design planning must include the correct 484-BBGA footprint, power-plane distribution for the 1.2 V core rail, decoupling, configuration-interface implementation, and thermal analysis. Because the verified excerpts do not provide the complete pin table, pinout file contents, or package dimensions, engineers should download the official Spartan-6 documentation and verify all ball assignments before layout release. This page combines verified distributor specifications, availability information, and carefully qualified same-brand replacement guidance. It also adds application-focused design considerations, package comparison data, and explicit data gaps so procurement and engineering teams can distinguish documented facts from information that still requires manufacturer-document confirmation.

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XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484I

XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 45 nm CMOS technology, a 1.2 V supply specification, and a 484-ball FBGA package. The -3 suffix identifies the performance speed grade, while the industrial-temperature suffix supports deployments across demanding embedded, communications, industrial-control, and test-equipment environments. Its programmable logic architecture combines configurable logic, dedicated hardware resources, block RAM, and DSP resources in one integrated device. An FPGA is a digital semiconductor whose internal logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LXT family sits between low-cost Spartan-6 LX devices and larger FPGA families, balancing logic density, embedded processing support, connectivity, and implementation cost. XC6SLX45T-3FG484I is therefore useful when a fixed-function controller is insufficient but a larger or more expensive programmable-logic platform would be unnecessary. The verified product information identifies 43,661 logic cells, 45 nm CMOS fabrication, and 1.2 V operation for this device. The 484-ball package provides a high-density surface-mount interface suitable for multilayer PCB designs. The -3 speed designation is a meaningful selection criterion because FPGA timing, achievable clock rates, and design-tool performance targets must be evaluated together rather than treating the FPGA as a conventional fixed-function IC. Spartan-6 LXT devices are designed for parallel processing, high-speed interface bridging, custom data acquisition, industrial automation, communications infrastructure, embedded vision, and test-and-measurement systems. Their parallel logic fabric allows multiple independent channels or algorithms to execute concurrently, while dedicated block RAM reduces external-memory traffic for suitable buffering operations and DSP slices accelerate arithmetic-heavy filtering and signal-processing tasks. The primary PCB constraint is the 484-ball FBGA land pattern. Because its interconnects are fine-pitch and distributed beneath the package, escape routing, power-plane continuity, via structure, solder-mask design, and assembly capability require careful planning. The design must also be checked against the selected AMD or Xilinx implementation toolchain and the exact device, package, speed grade, and temperature-grade identifiers. Before releasing a new PCB, compare the target against XC6SLX45T-2FG484C, XC6SLX45T-2FGG484I, XC6SLX45T-N3FG484I, XC6SLX45-3FG484I, and XC6SLX45T-3FGG484I using the package pin files and device selection guidance. Speed-grade, temperature-grade, marking, and ordering-code differences affect qualification even when the mechanical footprint remains unchanged. This product page consolidates verified distributor pricing, package information, same-footprint alternatives, technical comparison data, and practical PCB-design guidance. Those details help engineers separate true pin-compatible purchasing alternatives from superficially similar Spartan-6 devices and support faster procurement, qualification, and design-review decisions.

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XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484C

XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX75-2CSG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 3,170,304 bits of block RAM, 11,662 adaptive logic modules, and 328 I/O in a 484-CSBGA package. The device operates from a 1.2 V core supply and belongs to the Spartan-6 LX FPGA family, providing programmable logic, embedded memory, and DSP resources within one integrated device. A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture through a configuration bitstream. The FPGA hierarchy places this device within programmable logic devices and complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control, protocol handling, signal generation, and interface logic in configurable hardware, allowing product revisions without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic cells and 3.02 Mbit of embedded memory for the XC6SLX75, with 11,662 adaptive logic modules and 132 DSP48A1 slices documented for the related XC6SLX75T configuration. The target package provides 328 user I/O, making the device suitable for designs requiring substantial parallel connectivity. Its 45 nm CMOS construction also places it within AMD's cost-conscious, low-power FPGA product positioning. The XC6SLX75 architecture can support parallel data processing, fixed-point DSP, control-plane logic, embedded-memory buffering, and communication interfaces. The -2 speed designation identifies the performance grade used for timing analysis and design constraints. The C suffix identifies the commercial temperature grade, while the 484-CSBGA package provides a high-density ball-grid interconnect suitable for multilayer PCB designs requiring many external connections. Typical uses include industrial control, test and measurement, video processing, communications infrastructure, embedded signal processing, and general-purpose programmable-logic platforms. Because the device combines substantial logic and memory capacity, it can consolidate several fixed-function components while retaining the flexibility to update configurations as interfaces or algorithms evolve. Projects should still verify timing, power, pinout, and configuration requirements against the exact Spartan-6 design tools and package documentation. PCB implementation requires careful power-plane distribution, decoupling, ball-escape routing, and thermal analysis for the 484-CSBGA package. The core rail is 1.2 V, while auxiliary supply requirements and configuration interface details must be taken directly from the manufacturer data sheets. Use the package pinout files and power-guidance documentation when assigning every ball and planning the power distribution network. This page combines the verified family-level characteristics, package information, searchable alternatives, comparison parameters, and practical implementation guidance in one engineering reference. It also distinguishes footprint-compatible Spartan-6 variants by speed grade, temperature grade, and device suffix so that a mechanical substitution is not mistaken for a fully qualified functional replacement.

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XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484I

XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2CSG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 11,662 adaptive logic modules, 3.02 Mbit of embedded memory, and up to 292 I/O in a 484-FBGA package. The device uses 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified by the -2 performance grade and I industrial temperature suffix. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, field-programmable gate arrays, and system-programmable devices. Spartan-6 LX devices provide parallel programmable logic resources for control, signal processing, communications, and embedded-system designs. The XC6SLX75-2CSG484I provides 74,637 logic cells and 11,662 adaptive logic modules. Its 3.02 Mbit of embedded block RAM supports buffering, packet storage, data acquisition, and general-purpose digital processing. The 292 available I/O provide connections to external converters, memory, communications transceivers, and control logic. These figures position the device between smaller Spartan-6 parts and higher-density programmable-logic devices. The part is manufactured on a 45 nm CMOS process and uses a 1.2 V core voltage. The -2 ordering code identifies the performance grade, while CSG484 identifies the 484-ball surface-mount package. An I suffix denotes the industrial temperature option. Because the available listing does not provide complete timing, power, I/O-standard, and absolute-maximum data, those details must be confirmed in the manufacturer documentation before a design is released. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, data acquisition, and compact control systems. Its combination of 74,637 logic cells and 3.02 Mbit of embedded memory allows designers to implement parallel algorithms and control functions in one programmable device while simplifying the logic around external ADCs, transceivers, and processors. PCB implementation requires careful BGA escape routing, power planning, decoupling, and thermal analysis. Because this is a 484-ball package, signal-integrity and assembly considerations are more significant than for a leaded package. The CSBGA footprint must match the PCB land pattern exactly, and the complete pinout must be checked against the selected Spartan-6 package documentation before routing. This page combines verified distributor and cross-reference data with practical qualification guidance for engineers evaluating the XC6SLX75-2CSG484I. It distinguishes documented density, memory, voltage, package, and lifecycle facts from unreported parameters and identifies the temperature- and package-code alternatives that require design review.

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XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484C

XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484C is a Spartan-6 LX field-programmable gate array with 667 MHz internal frequency, 5,831 configurable logic blocks, 74,637 logic cells, and 484-ball FBGA packaging. It is designed for cost-sensitive, high-volume systems that combine programmable logic, extensive I/O, and integrated processing resources. The device operates from a 0 to 85 C temperature range and uses a 23 x 23 mm, 1 mm pitch MS-034 FBGA package. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration. The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern. Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions. The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.

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XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484I

XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484I is a Spartan-6 LX field-programmable gate array with 74,637 configurable logic elements, 5,831 logic blocks, up to 280 I/O, a 667 MHz internal frequency, and a 484-ball FBGA package. It targets industrial systems operating from 0°C to +85°C. The -2 speed grade and 23 mm by 23 mm, 1 mm-pitch MS-034 package make this device suitable for embedded control, communications, instrumentation, industrial automation, and signal-processing systems requiring programmable parallel logic and substantial I/O density. Its supply-voltage details, memory resources, block inventory, and complete ball assignment are not present in the supplied excerpts and must be confirmed in the manufacturer documentation. A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device. The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design. The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation. Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools. A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification. This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.

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XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-2FG676I

XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA

The AMD XC6SLX75-2FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, and a stated internal frequency of 667 MHz, supplied in a 676-BGA package. It combines programmable logic, block RAM, and DSP resources in one reconfigurable semiconductor for embedded control, signal processing, communications, and industrial systems. A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing. The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint. The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification. Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance. A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.

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XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I

XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.

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XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-2FGG676I

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-2FGG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and a maximum internal frequency of 667 MHz. The device is supplied in a lead-free 676-ball FBGA package measuring 27 mm by 27 mm with a 1 mm ball pitch, and its -2 speed grade supports a nominal 1 V supply. A field-programmable gate array is a programmable semiconductor in the FPGA category of digital logic devices. An FPGA combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks into an integrated circuit whose circuit behavior can be modified after manufacture. Within the broader semiconductor hierarchy, the Spartan-6 LX device provides a programmable alternative to application-specific integrated circuits when interfaces, parallel processing, or logic capacity must change between product variants. Principal device characteristics include 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, 667 MHz internal frequency, and operation from approximately -40°C to +100°C for the industrial-temperature ordering indicated by the I suffix. The 676-ball FBGA package supports dense board-level integration, while the lead-free construction is explicitly identified in the available product records. The -2 designation identifies the device's performance grade within the Spartan-6 LX family, which is manufactured on 45 nm CMOS technology. Its 676-ball package provides a high pin count for high-performance design implementations, including parallel data interfaces, embedded control, industrial automation, networking equipment, and general-purpose signal processing. System timing must still be evaluated against the specific clock, I/O, and resource requirements of each implemented design. Typical applications include industrial control systems, embedded video processing, communication infrastructure, test equipment, and high-density programmable logic. The combination of 408 I/O and 74,637 logic cells permits multiple interfaces to be consolidated in one device, reducing the need for separate programmable or discrete interface components when pin and performance requirements are satisfied. A primary design consideration is BGA assembly. The 1 mm pitch, 676-ball package requires a suitable land pattern, multilayer PCB construction, appropriate thermal management, and assembly-process controls. Designers should also confirm timing closure, power budget, configuration method, bank voltage requirements, and I/O standards against the manufacturer datasheet before releasing a production design. This page consolidates verified distributor specifications, package details, availability information, comparable Spartan-6 device options, and practical selection guidance. It supplements the manufacturer datasheet with decision-oriented information for engineers evaluating the XC6SLX75-2FGG676I as an industrial-grade, high-density FPGA.

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XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-3CSG484C

XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.

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XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-3CSG484I

XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-3CSG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 484-pin CSBGA package. It operates from a 1.2 V core supply, reaches an internal frequency of 667 MHz according to the retrieved specifications, and supports a 0 to 85 °C operating-temperature range. The device combines programmable logic, block RAM, dedicated DSP resources, and high-speed serial transceivers in one package. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose internal digital circuitry is defined by a configuration bitstream rather than fixed mask programming. Within the product hierarchy, an FPGA belongs to the programmable-logic and semiconductor families. The Spartan-6 LX family is positioned for cost-sensitive embedded systems requiring substantial parallel processing, deterministic interfaces, and flexible hardware updates without changing the printed circuit board. The XC6SLX75 combines 74,637 configurable logic cells with 5,831 CLBs and 328 reported I/O locations in the 484-pin CSPBGA package. Its 45 nm CMOS construction supports integration of logic, memory, and DSP blocks, while its -3 speed grade identifies one of the higher-performance grades described for the Spartan-6 LX family. The CSBGA package has a 1 mm pitch and a reported body size of 23 × 23 mm according to the retrieved distributor data. Spartan-6 devices support parallel processing, serial connectivity, and programmable logic through configurable I/O resources. This device family can implement control logic, communication bridges, data acquisition pipelines, embedded processors, and hardware signal-processing functions. Because a complete system can be implemented in programmable logic, the FPGA can also support field upgrades, product differentiation, and reduced external-component count when its resources match the design requirements. Typical uses include industrial automation and factory control, networked communications, test and measurement equipment, embedded video processing, data acquisition, and embedded processing platforms. The 74,637-cell count is particularly useful for designs that need multiple parallel channels or a combination of control logic and DSP. Designers must still verify the exact pin assignments, power rails, supported I/O standards, memory configuration, and transceiver features against the applicable AMD package and device documentation. Board-level implementation requires careful high-speed layout, continuous supply planes, correct BGA escape routing, and decoupling near the package power and ground balls. The 1 mm-pitch CSPBGA also demands controlled assembly processes, including suitable stencil design, solder-paste inspection, and thermal verification. External memory interfaces, serial links, and user I/O should be routed according to the official package pinout files and device-specific layout guidance. This product record combines verified distributor specifications, package information, pricing references, and same-package replacement findings with practical selection guidance. The alternative list is intentionally limited to candidates supported by the supplied cross-reference results, avoiding unsupported cross-package substitutions or packaging-only variants presented as drop-in replacements.

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XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG484I

XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.

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XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-3FG676C

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.

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XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG676I

XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and an industrial temperature grade in a 676-ball FCBGA package. Verified listings identify an 862 MHz maximum device frequency, a 27 mm by 27 mm body, a 1 mm ball pitch, and CMOS fabrication. The -3 speed grade is the highest-performance Spartan-6 LX grade presented in the verified comparison data. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost. The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability. Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation. The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly. Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields. This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.

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XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD
XC6SLX75-3FGG484C

XC6SLX75-3FGG484C - Spartan-6 LX FPGA, 74,637 Logic Cells | AMD

AMD (formerly Xilinx) XC6SLX75-3FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) in a 484-ball FBGA package (MS-034, 23 x 23 mm body, 1.0 mm pitch) providing 74,637 logic cells and 280 user I/O, with a maximum internal clock frequency of 667 MHz and a commercial-grade 0 °C to 85 °C operating temperature range. An FPGA is a semiconductor device whose logic, interconnects and I/O are defined by a configuration bitstream loaded from an external memory rather than by fixed mask wiring. Within the broader taxonomy, the XC6SLX75 belongs to the Spartan-6 LX family, which sits between low-cost CPLDs and higher-density FPGAs: it is a programmable logic device (PLD) built on 45 nm SRAM logic fabric with hard DSP slices and block RAM. The -3 suffix designates the fastest speed grade available in the family, while the FGG484 suffix defines the 484-ball flip-chip BGA package, and the trailing C identifies the commercial temperature grade. Key features of this device include the 667 MHz internal clock frequency, 280 I/O pins for external interfacing, and 74,637 logic cells for parallel datapath and control logic. Because the fabric is SRAM-based, the same silicon can be reconfigured in the field, allowing firmware-driven function updates, partial reconfiguration of individual regions, and in-field repair of deployed equipment. The 484-ball BGA package also exposes a large number of dedicated clock, configuration and power pins required for high-fanout designs. Architecturally, the Spartan-6 LX device combines programmable logic arrays, dedicated DSP48A slices for multiply-accumulate operations, and block RAM for on-chip buffering. The -3 speed grade delivers the highest logic performance of the Spartan-6 LX family, so designs that were previously timing-limited on -2 or -1L grades can close timing at lower clock periods without a device change. The same FGG484 land pattern is shared across several LX75 and LX100 variants, which simplifies PCB respins between density levels. Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and protocol bridging, motor and motion control front-ends, test and measurement data acquisition, video and image processing pipelines, and embedded instrumentation gateways where deterministic parallel logic and re programmability are valuable. When designing around this device, budget careful for the 484-ball BGA escape routing and for decoupling across the many distributed power and ground balls. Confirm the bitstream configuration interface levels and the required I/O standard for each bank, and verify that the -3 speed grade is genuinely needed before paying the performance premium over the -2 grade. This page consolidates verified distributor pricing, package and pinout references, drop-in same-footprint alternatives, and practical design guidance that are spread across many separate distributor and datasheet listings for the XC6SLX75-3FGG484C.

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XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx
XC6SLX75-3FGG676C

XC6SLX75-3FGG676C - Spartan-6 LX FPGA, 74637 Cells, 408 I/O | Xilinx

The Xilinx XC6SLX75-3FGG676C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, providing 74,637 logic cells in 5,831 configurable logic blocks (CLBs), 132 DSP48A1 slices, 3,096 Kbit of block RAM, and 408 user I/O in a 676-ball FBGA package. The device operates from a 1.14 V to 1.26 V supply voltage and is offered in the -3 (highest performance) speed grade with a commercial ambient temperature range of 0 C to 85 C. An FPGA is a programmable logic device in which the digital interconnect and processing elements are configured at power-up from a bitstream held in external flash or configuration EEPROM. The Spartan-6 LX family sits in the Xilinx/AMD product hierarchy below Artix-7 and Kintex-7, and is positioned as a low-cost, high-volume platform for bridging, interface, and control logic rather than ultra-high-speed serial fabrics. Key features of this device include a 27 mm x 27 mm FBGA-676 package on a 1 mm ball pitch, 408 user I/O for high connectivity, integrated Digital Clock Managers (DCM) and PLLs for clock generation and jitter cleanup, and hard DSP48A1 multipliers for signal-processing datapaths. The LX variant is logic-optimized, prioritizing logic density and I/O count over the high-speed serial transceivers found in the LXT line. Technically, the XC6SLX75-3FGG676C is a 45 nm FPGA whose logic fabric is built from 4-input LUT-based CLBs. Third-party listings for this device cite internal frequency figures of 400 MHz, 667 MHz, and 862 MHz depending on the metric quoted (logic maximum, DSP, or memory performance); the authoritative per-clock-domain Fmax tables should be taken from the manufacturer data sheet for the exact speed grade. Typical applications include automotive infotainment and cluster bridging, industrial automation and factory control, consumer set-top and video scaling, industrial networking gateways, and general-purpose embedded control platforms that need abundant parallel I/O. The key design consideration is ball-pitch and thermal compliance: FBGA-676 with 1 mm pitch requires a fine-pitch PCB layout with filled thermal vias under the package, and derating of junction temperature must be checked against the -3 speed grade power envelope in the datasheet. This page consolidates distributor availability, package and pin-assignment references, verified parametric alternatives, and practical PCB and clocking design notes that are typically spread across the manufacturer data sheet, selector guides, and separate package documents.

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XC6SLX75-L1FG676I - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-L1FG676I

XC6SLX75-L1FG676I - 74,637-Cell Spartan-6 LX FPGA | AMD

The AMD/Xilinx XC6SLX75-L1FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, a 1 V core supply, and a 676-ball FBGA package. Designed for industrial applications, it combines programmable logic resources with a 45 nm CMOS process in a 27 x 27 mm package with 1 mm ball pitch. The -L1 designation identifies the device speed and temperature grades, while FG676 identifies the 676-ball package configuration. A field-programmable gate array is a reconfigurable digital semiconductor in which the logic, interconnect, and input/output functions are defined by a bitstream rather than permanently etched during fabrication. Within the device hierarchy, an FPGA is a programmable logic device and a semiconductor. Spartan-6 LX belongs to AMD/Xilinx's Spartan-6 product family, which is intended to balance logic capacity, embedded memory, I/O availability, and cost in compact embedded systems. The XC6SLX75 provides 74,637 logic cells organized as 5,831 configurable logic blocks and offers 408 I/O. Its 408 I/O provide substantial connectivity for parallel buses, control interfaces, memory interfaces, and general-purpose digital peripherals. A 1 V core voltage supports modern FPGA implementation practices, while the 45 nm CMOS process establishes the device's process technology and helps define its performance and power characteristics. The 676-ball FBGA package supports dense board routing and is suitable for compact systems in which a large programmable logic resource must coexist with processors, external memory, transceivers, or high-speed interface components. The 27 x 27 mm body and 1 mm pitch require careful PCB layout, power planning, via-in-pad or microvia strategies, and a multilayer board structure capable of supporting hundreds of power, ground, and signal connections. Typical applications include industrial control systems, data acquisition, communications equipment, embedded processing platforms, video processing, and high-density digital interfaces. The Spartan-6 LX fabric can implement parallel protocols, control logic, state machines, packet processing, and custom accelerators. Systems requiring a large number of user I/O can use the device as the central programmable element rather than relying exclusively on discrete programmable logic. A primary design consideration is power integrity. Because the 676-ball package contains many supply and ground connections, the power grid must be designed according to the package power and ground assignments rather than distributed mechanically. Decoupling, layer transitions, thermal management, signal-integrity analysis, and exact pin constraints must be checked against the Spartan-6 device documentation before schematic capture or PCB release. This product overview combines the exact device identity, package characteristics, cell and I/O counts, family relationships, replacement analysis, and practical design guidance needed to evaluate the XC6SLX75-L1FG676I before it is assigned to an industrial FPGA design.

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XC6SLX75-N3FG484C - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-N3FG484C

XC6SLX75-N3FG484C - 74,637 LE Spartan-6 LX FPGA | AMD

AMD XC6SLX75-N3FG484C is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 280 I/O, 3,170,304 RAM bits, and a 484-ball BGA package. The -3 speed designation identifies the device performance grade, while the FG484 suffix identifies the 484-ball package configuration. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after fabrication. An FPGA sits within the broader programmable-logic hierarchy and can be described as a programmable logic device, digital integrated circuit, and semiconductor. Spartan-6 LX devices combine configurable logic blocks, block RAM, programmable input/output resources, and dedicated hardwired functions in one integrated circuit. The XC6SLX75 family provides 74,637 logic elements, 5,831 logic array blocks or configurable logic blocks, and 3,170,304 total RAM bits. Its 280 I/O positions support connections to external memory, control interfaces, communications links, and mixed-signal system inputs and outputs. The 484-BBGA package is intended for compact, high-density professional printed-circuit-board designs requiring numerous ball-grid connections. The -3 suffix selects the -3 performance grade, while the FG484 package code identifies the 484-ball configuration used by the target. Configuration and programming behavior, supported interfaces, electrical limits, and timing constraints must be established from the manufacturer datasheet and the Spartan-6 package pinout files. Designers should also validate the complete device configuration, system interface assignments, and PCB escape-routing capacity before release to fabrication. Typical uses include industrial control, embedded instrumentation, communications equipment, video processing, networking infrastructure, and general-purpose programmable logic. The Spartan-6 LX architecture is useful when a design requires substantially more parallel logic and memory resources than a small microcontroller or fixed-function digital device can provide, while retaining reconfigurability for product updates. PCB implementation should follow the AMD package pinout files, preserve the required power and ground distribution, and route every assigned ball according to the selected PCB stack-up. Because the package contains 484 balls, escape routing and via-in-pad or microvia strategy can materially affect routability, signal integrity, assembly yield, and thermal performance. Confirm BGA land pattern, solder-mask definition, and assembly process compatibility with the board manufacturer. This product guide combines the target device's 74,637 logic elements, 280 I/O, 3,170,304 RAM bits, and 484-BBGA configuration with same-package speed-grade options and practical implementation guidance. It supports faster part selection while directing engineers to the authoritative datasheet, package files, and design guidance for final engineering sign-off.

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XC6SLX75-N3FG484I - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-N3FG484I

XC6SLX75-N3FG484I - 74,637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-N3FG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 5,831 logic cells, 3,170,304 RAM bits, and 280 user I/O, packaged in a 484-ball FBGA measuring 23 mm by 23 mm. It operates from a 1.14 V to 1.26 V supply and is specified for a junction-temperature range of -40 °C to 100 °C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior is defined by a configuration bitstream. The Spartan-6 LX family belongs to the FPGA hierarchy, where programmable logic is combined with block RAM, digital clock managers, DSP resources, and SelectIO interfaces. This combination allows one physical device to implement control logic, signal processing, communications, and programmable I/O without requiring a custom application-specific integrated circuit. The XC6SLX75 provides unusually high logic density for a 45 nm FPGA family while maintaining 280 user I/O. Its 3,170,304 RAM bits support buffering, packet storage, data acquisition, and embedded-memory functions. The N3 speed designation identifies a higher-performance speed grade than the -2 variants, while the I suffix identifies the industrial-temperature configuration associated with the -40 °C to 100 °C junction-temperature specification. Within the Spartan-6 LX architecture, configurable logic blocks implement Boolean and sequential functions, while dedicated DSP48A1 slices accelerate arithmetic-heavy pipelines. Memory controllers support external memory interfaces, and the enhanced clock-management resources address regional and global clocking requirements. These resources make the device useful when a design needs both substantial parallel processing and numerous external connections. Typical applications include industrial control systems, network-interface equipment, embedded video processing, data-acquisition modules, and communication infrastructure. Its 280 I/O are particularly useful for parallel buses, sensor aggregation, control signals, and high-speed memory interfaces. The 484-ball FBGA also requires careful escape-routing and power-delivery planning on multilayer boards. When designing around this FPGA, verify every bank supply requirement and the permitted voltage range for each I/O standard. Use the AMD Spartan-6 package pinout files when assigning balls, and preserve the recommended power and ground plane arrangement. Confirm signal-integrity, configuration, thermal, and system-timing requirements before committing the PCB layout. This product record combines the exact device identity, key logic and memory resources, package characteristics, operating limits, application guidance, and verified same-family alternatives to support early design selection and sourcing decisions.

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XC6SLX75-N3FG676C - Spartan-6 LX FPGA | AMD | Industrial
XC6SLX75-N3FG676C

XC6SLX75-N3FG676C - Spartan-6 LX FPGA | AMD | Industrial

The AMD XC6SLX75-N3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic elements, 408 user I/O, and 3,170,304 bits of block RAM in a 676-ball BGA package. It operates from a 1.14 V to 1.26 V core supply and supports an industrial junction-temperature range of 0°C to 85°C. A field-programmable gate array, or FPGA, is a programmable semiconductor whose logic, memory, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, clocking resources, and dedicated multipliers in one device. This integration supports parallel processing, high-speed interfaces, and flexible hardware upgrades without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic elements organized into 5,831 logic activity blocks or configurable logic blocks, alongside 408 user I/O and 3,170,304 bits of block RAM. The -N3 speed grade and industrial temperature designation make the XC6SLX75-N3FG676C appropriate for embedded systems requiring sustained parallel processing under controlled commercial-industrial conditions. The 676-ball BGA package supports dense PCB routing and a large pin budget for external memory, high-speed serial links, parallel buses, and control peripherals. The device operates with a 1.14 V to 1.26 V supply. Its 408 user I/O provide substantial connectivity, while the large block-RAM capacity allows local buffering, packet storage, waveform capture, and data-processing pipelines to be implemented inside the FPGA rather than entirely in external memory. Typical applications include industrial control and acquisition, high-speed networking, video processing, instrumentation, communications infrastructure, and embedded signal-processing systems. The Spartan-6 LX architecture is especially useful when several buses or real-time channels must be processed concurrently, because each configurable logic block and RAM block can operate as a dedicated pipeline stage. PCB design should follow the AMD Spartan-6 package pinout files and the device power, decoupling, configuration, clocking, and differential-pair guidance. The 676-ball BGA requires careful escape-routing, via-in-pad considerations where applicable, and uninterrupted supply and ground planes. Configuration signals and clock inputs should be protected against ringing and noise during power-up. This page organizes the device’s principal specifications, verified drop-in options, application guidance, package considerations, and selection trade-offs into a practical engineering reference for designers evaluating the XC6SLX75-N3FG676C.

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XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
XC6SLX75T-2CSG484C

XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD

The AMD XC6SLX75T-2CSG484C is a Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a mature 45 nm low-power copper process technology. It delivers 74,637 logic cells, 3,170,304 total RAM bits, and 292 user I/O pins in a 484-pin CSBGA (19x19 mm) package. Operating from a 1.2V core supply (1.14V to 1.26V range), this device is designed for high-volume applications requiring leading system integration at the lowest total cost. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications. Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity. Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs. Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments. When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.

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