FPGA与CPLD
产品（6666)
EP2S130F1020C5N - Stratix II FPGA, 132K LEs, 1020-FBGA | Intel
The Intel (formerly Altera) EP2S130F1020C5N is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and 734 user I/Os in a 1020-ball FC-FBGA package. Built on a 90 nm process, the device operates from a 1.15 V to 1.25 V core supply with a maximum internal clock frequency of 609.76 MHz. According to the Stratix II Family datasheet, the EP2S130 is part of the largest members of the family, targeting high-throughput DSP, multi-gigabit serial I/O, and external memory interface applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows designers to configure digital logic, memory blocks, and DSP blocks after manufacturing. FPGAs sit within the broader hierarchy of integrated circuits, between standard logic ICs (fixed-function) and ASICs (custom-fabricated). The Stratix II family specifically targets high-performance applications by combining adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks, with high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. The EP2S130 features 4 PLLs, 16 global clock networks, and up to 12 transceivers (Stratix II GX family), plus dedicated hardware multipliers and DSP blocks optimized for high-speed signal processing. Adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs) deliver higher effective logic density than previous-generation Stratix devices, while the TriMatrix memory architecture provides three different memory block sizes (M512, M4K, M-RAM) for flexible on-chip data buffering. Typical applications include high-performance digital signal processing (radar, software-defined radio), high-speed serial protocol bridging, ASIC prototyping, video processing pipelines, and high-bandwidth data acquisition. The 1020-FBGA 33x33 mm package supports the large pin count required for wide external memory buses and multi-channel serial interfaces. Designers targeting these workloads can leverage Quartus II design software and IP cores from the Altera/Intel ecosystem. When designing with the EP2S130, ensure proper power supply decoupling with multiple bulk and high-frequency capacitors across VCCINT, VCCIO banks, and PLL supplies. Thermal management is critical at high toggle rates - the FC-FBGA package requires careful PCB stack-up and thermal via arrays beneath the exposed die region. Signal integrity on multi-gigabit I/Os demands impedance-controlled traces and length matching per the device pin-out guidelines. This page synthesizes distributor pricing, drop-in Stratix II variants, and practical design considerations that go beyond the manufacturer datasheet, helping procurement and FPGA engineers source and apply the EP2S130F1020C5N efficiently.
EP2S130F1020C5NRB - Stratix II FPGA, 132K LE, 1020-FBGA | Intel
The Intel (formerly Altera) EP2S130F1020C5NRB is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and 742 user I/O pins in a 1020-ball FineLine BGA package (33x33 mm). The device operates from a 1.15 V to 1.25 V core supply and is built on a 90 nm process with embedded logic and DSP blocks tuned for high-performance signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), evolving from simple PAL/GAL devices toward complex SoC-class chips. FPGAs are widely used for ASIC prototyping, parallel DSP, custom I/O interfacing, and hardware acceleration in networking, video, and industrial systems where time-to-market and reconfigurability outweigh the per-unit cost of an ASIC. Key features of the EP2S130F1020C5NRB include up to 742 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), embedded DSP blocks for high-throughput arithmetic, dedicated clock management with up to 12 PLLs, and a hard memory controller interface. The C5 speed grade and commercial 0C to +85C operating temperature make this variant suitable for laboratory, telecom, and embedded computing environments. The Stratix II architecture introduced adaptive logic modules (ALMs) that combine the traditional 4-input LUT with dedicated arithmetic and carry-chain hardware, increasing effective logic density versus previous-generation FPGAs. The 1020-FBGA package provides high I/O density with controlled-impedance signal routing, but requires careful PCB layout with microvia or via-in-pad technology and matched-length traces for high-speed signals. Typical applications include high-speed data acquisition systems, telecom baseband and channel-card designs, video broadcast and image processing pipelines, ASIC prototyping, military and aerospace signal processing (when the I-grade variant is selected), and high-performance DSP compute nodes. The 1020-FBGA footprint is shared across the Stratix II family, allowing drop-in migration between EP2S30, EP2S60, EP2S90, and EP2S130 density points within the same package. When designing with this device, allocate at least 4 PCB layers for power and ground, use a 1.0 mm pitch BGA land pattern with microvias, and follow Intel AN 461 for power-rail decoupling. Thermal management requires thermal vias under the package center array and adequate airflow at full operating speed. This page synthesizes distributor pricing, drop-in same-package Stratix II alternatives, and practical high-density FPGA layout guidance not found in the standalone manufacturer datasheet.
EP2S130F1020I4 - 132K LE Stratix II FPGA, 742 I/O, FC-FBGA-1020
The Intel (formerly Altera) EP2S130F1020I4 is a high-density Stratix II family FPGA built on a 1.2 V, 90 nm all-layer copper SRAM process, packaged in a 1020-ball FC-FBGA (33x33 mm). The device integrates 132,540 logic elements, 6,747,840 bits of embedded memory, 504 embedded 18x18 multipliers, and 742 user I/O pins, delivering up to ~180,000 equivalent LEs when accounting for adaptive logic modules. The 'I' speed grade and '4' device revision are factory-characterized over the industrial -40C to +100C junction range, making it suitable for harsh-environment prototyping. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized after manufacturing via a configuration bitstream stored in SRAM. FPGAs sit between microcontrollers (fixed-function, software-driven) and ASICs (fixed-function, hardware) in the compute hierarchy: programmable logic IC -> reconfigurable logic -> programmable logic device -> semiconductor. The Stratix II generation introduced the adaptive logic module (ALM) architecture that replaces the 4-input LUT of earlier families with an 8-input fracturable LUT, improving effective density and DSP performance per silicon area. Key features of the EP2S130F1020I4 include 12 high-speed transceiver-like channels (Stratix II does not include multi-gigabit transceivers, but supports LVDS I/O up to 1 Gbps), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory with true dual-port and FIFO modes, and support for external memory interfaces including DDR2, DDR, QDRII, and RLDRAM. The 1.2 V core VCC plus PLL and I/O banks operate from independent supplies, enabling mixed-voltage system design. Internal pull-up resistors on all user I/O pins simplify board bring-up. Typical applications span high-performance digital signal processing, ASIC prototyping, high-speed serial connectivity aggregation, and complex state-machine control in telecom, defense, and test-and-measurement equipment. The 742 I/O and large logic budget also suit memory-intensive datapaths such as packet buffering and image-processing pipelines. When designing with this part, pay attention to configuration scheme selection (Fast Passive Parallel x8 is common at power-up), I/O bank voltage compatibility with attached memories, and thermal management: a 90 nm high-density FPGA can exceed 10 W under full utilization, requiring airflow or a heatsink. Confirm FPGA fabric utilization headroom against the 132,540 LE budget and verify timing closure in Quartus II before tape-out-equivalent prototype release. This page synthesizes distributor pricing, drop-in alternative MPNs sharing the F1020 FC-FBGA footprint, and design notes not consolidated in the manufacturer datasheet.
EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera
The Intel (formerly Altera) EP2S130F1020I4N is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded RAM, and 742 user I/O pins in a 1020-ball FineLine BGA (FC-FBGA) package. It operates from a 1.15 V to 1.25 V core supply with I/O voltages up to 3.3 V, targets industrial temperature grades (-40C to +100C TJ), and is built on a 90 nm process with embedded DSP blocks and high-speed transceivers optimized for parallel DSP and memory-intensive designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic family of integrated circuits. FPGAs sit hierarchically as: FPGA -> programmable logic -> digital logic IC -> semiconductor. They combine configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers/DSP slices, PLLs, and (in newer families) transceivers, giving designers ASIC-class performance with the flexibility of in-system reprogrammability for prototyping, low-volume production, and standards-based acceleration. Key features of the EP2S130F1020I4N include 6,627 LABs (Logic Array Blocks), up to 711.24 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, TriMatrix embedded memory with true dual-port RAM, eight PLLs for clock management, and 12 phase-locked high-speed source-synchronous interfaces. The 1020-FBGA package provides abundant routing for DDR/DDR2 external memory interfaces with dedicated DQS logic. Architecturally, Stratix II uses an adaptive logic module (ALM) that combines look-up-table and register resources, yielding approximately 2.5x the logic density of the original Stratix family. Hard IP such as transceivers, multipliers, and block RAM removes overhead from soft implementations, allowing designers to push Fmax higher and lower system power versus gate-array equivalents. Typical applications include high-performance DSP for wireless baseband, ASIC prototyping, military radar, broadcast video processing, medical imaging, high-speed data acquisition, and telecommunications line cards. The 742 I/O count supports wide parallel buses and multiple external memory banks on a single device. Designers should leverage the Stratix II Device Handbook for pin assignments, IBIS models, and reference designs; Quartus II software is required for synthesis, place-and-route, and timing closure. Note that this family has reached end-of-life and is now distributed primarily through the secondary market. This page synthesizes distributor pricing, EOL status, and same-package alternative MPNs from the Stratix II family that are not consolidated on a single manufacturer or distributor page, with explicit notes on temperature grade and speed-bin differences.
EP2S130F1020I4RB - Stratix II FPGA 132540 Cells 1.2V FC-FBGA | Intel
The Intel EP2S130F1020I4RB is a Stratix II family Field Programmable Gate Array (FPGA) with 132,540 logic cells, 742 user I/O pins, and a 711.24 MHz internal operating frequency, built on a 90nm process technology with a 1.2V core supply and housed in a 1020-pin FC-FBGA (Fine-pitch Chip-scale Ball Grid Array) package. The 'I4' speed grade and 'RB' suffix denote an industrial temperature range variant supplied in tape-and-reel packaging, qualifying the device for -40C to +100C operation. A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit in the broader taxonomy programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor, and are used when design iteration, parallel processing, hardware acceleration, or low-NRE prototyping are required. The Stratix II family is Intel's (formerly Altera's) mid-2000s high-density flagship line, built on a 90nm process and introducing adaptive logic modules (ALMs) instead of the older 4-input LUT architecture of Stratix I. Key specifications of the EP2S130F1020I4RB include 132,540 logic elements, up to 6,747,840 bits of embedded memory (M4K/M512 blocks), embedded DSP blocks for fixed- and floating-point arithmetic, twelve embedded transceiver channels, and four phase-locked loops (PLLs). The device also exposes up to 742 general-purpose user I/O supporting multiple single-ended and differential I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be performed via JTAG, passive serial (PS), passive parallel synchronous (PPS), or via an external configuration device such as an EPCS or EPCQ flash. Architecturally, the Stratix II family introduced TriMatrix embedded memory (MLAB/M512/M4K/RAM) and dedicated DSP blocks operating at up to 450 MHz, with each DSP block capable of up to eight 18x18 multipliers. High-speed serial transceivers operate at up to 6.375 Gbps, supporting protocols such as Serial RapidIO, PCI Express, XAUI, and gigabit Ethernet, while the global clock network and up to 16 dedicated clock pins route low-skew clocks across the fabric. Typical applications for the EP2S130F1020I4RB include telecommunications infrastructure (baseband processing, framer/mapper cards), high-performance ASIC prototyping and emulation, military and aerospace signal processing, broadcast video engines, and high-end industrial imaging. The industrial temperature grade makes it suitable for outdoor telecom, factory automation, and defense platforms with extended thermal envelopes. When designing with this part, ensure the Quartus II design software (version 6.1 or later, with full support in later releases) is used for synthesis, place-and-route, and timing closure; the 1020-pin FC-FBGA package requires a multilayer PCB with 0.8mm or finer pitch and controlled-impedance routing for high-speed transceiver channels. This page consolidates distributor pricing, same-package drop-in alternatives from the Stratix II family, and practical design guidance beyond what is available in the original Intel/Altera datasheet, helping procurement and engineering teams evaluate the EP2S130F1020I4RB alongside modern equivalents.
EP2S130F1508C3 - 132K LE Stratix II FPGA, 1508-FCBGA | Intel
The Intel (Altera) EP2S130F1508C3 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded memory, and a 1,126-bit maximum user I/O count, housed in a 1,508-ball FineLine BGA (FC-BGA) package on a 90 nm process node. It targets designers building high-throughput digital signal processing, telecom datapath, and high-speed serial I/O systems that need a single-chip implementation of multi-gigabit interfaces and parallel processing pipelines. What is an FPGA? A Field Programmable Gate Array is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated memory, and hardened IP such as transceivers, PLLs, and DSP blocks. An FPGA is a type of programmable logic device (PLD), which itself belongs to the broader category of logic ICs within digital integrated circuits. Unlike an ASIC, the FPGA's function is defined after manufacture by loading a configuration bitstream into on-chip SRAM, allowing rapid design iteration and field upgrades. Key features of the EP2S130F1508C3 include up to 6.3 Gbps transceiver support (Stratix II GX block, on related devices), dedicated DSP blocks for high-speed multiply-accumulate, TriMatrix embedded memory supporting true dual-port RAM, ROM, and FIFO modes, and eight Fast PLLs plus four Enhanced PLLs. The 90 nm process enables a typical core voltage of 1.2 V with low static and dynamic power, and the 1,508-pin FC-BGA package supports the 1,126 user I/O count via an industrial-standard footprint. The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up tables, adders, and registers, giving designers higher effective logic density per LE compared to previous generations. The dedicated DSP blocks deliver up to 3.6 GMACS at 250 MHz, and the TriMatrix memory delivers 6+ Tbps of aggregate memory bandwidth when fully utilized. Configuration is via passive serial, fast passive parallel, or JTAG. Typical applications include high-end telecommunications line cards, baseband processing for wireless base stations, high-definition video broadcast equipment, military signal intelligence, ASIC prototyping, and high-performance compute accelerators. The 1,126 I/O count makes it well suited for memory-intensive designs interfacing DDR2 SDRAM, QDRII SRAM, and RLDRAM II. Design consideration: Stratix II devices require a 1.2 V core supply and a 3.3 V/2.5 V/1.8 V I/O supply; the Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Multi-voltage I/O banks allow mixing of standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS) on a single die. The FC-BGA package requires a high-layer-count PCB with matched-impedance routing and a 1.0 mm or finer ball pitch. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not found in the manufacturer datasheet alone, including the difference between the C3 commercial speed grade and the C4/C5/I3/I4 grades for timing margin analysis.
EP2S130F1508C3N - Stratix II 132K LE FPGA 1508-FCBGA | Intel
The Intel (formerly Altera) EP2S130F1508C3N is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1508-ball FCBGA package, delivering 132,540 equivalent logic elements, 6,747,840 bits of embedded memory, and 1,126 user I/O pins. It is built on a 90 nm process and features 6,627 LABs (logic array blocks) plus embedded DSP blocks and high-speed transceivers for high-performance digital design. The 'C3' speed grade and commercial temperature rating target mainstream logic, signal processing, and memory-intensive applications. According to the verified Altera Stratix II datasheet, this part is a member of the EP2S130 device family, which was the second-generation Stratix family that introduced the ALM (Adaptive Logic Module) architecture. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure digital logic blocks and interconnect them after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → FPGAs → high-density FPGAs → ASIC prototyping platforms → semiconductor ICs. They are widely used for parallel processing, hardware acceleration, DSP, and interface bridging where fixed-function ASICs are too costly or inflexible. Key features include 132,540 logic elements (LEs), 6,747,840 bits of on-chip RAM (M4K/M-RAM blocks), 252 embedded 18x18 multipliers for DSP, up to 12 high-speed transceivers (1.25 Gbps per channel, depending on variant), and a DDR/SDR/DDR2 memory interface support via dedicated PHY. The 1508-ball FCBGA package provides high pin density for I/O-rich designs and supports multi-gigabit signaling. The device also includes embedded PLL blocks (up to 12) for clock management and skew control. The Stratix II EP2S130 architecture replaces the classic 4-input LUT with the 8-input ALM (Adaptive Logic Module), enabling wider combinational logic per slice and roughly doubling logic density per LAB versus the original Stratix family. Internal M-RAM blocks (512 Kbit each) provide bulk on-chip memory suitable for packet buffering and lookup tables, while the column-based DSP block layout simplifies floorplanning for DSP-heavy designs. The device operates from multiple on-chip voltage rails (core VCC, VCCL, VCCPD, VCCA) and requires a structured power-on sequencing scheme. Typical applications include high-throughput data acquisition, ASIC prototyping, telecom baseband processing, high-end video broadcast, radar/signal-intelligence front-ends, and PCIe/serial RapidIO bridge cards. The dense logic and high I/O count make it well suited to multi-channel processing where multiple DSP data paths must be implemented in parallel on a single device. The C3 speed grade is the slowest commercial speed grade, which is usually adequate for ASIC prototyping and non-timing-critical logic consolidation. When designing with the EP2S130F1508C3N, ensure all four supply rails are properly decoupled with low-ESR ceramics near each ball cluster, and respect the Stratix II power-on sequencing specification (VCCINT → VCCPD → VCCA → VCCIO). Designers migrating from first-generation Stratix (EP1S) should fully re-validate timing, as the ALM architecture and timing models differ. Quartus II (legacy) is the supported design tool chain. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix II design considerations beyond what is found in the datasheet alone.
EP2S130F1508C4 - 132K LE Stratix II FPGA, FCBGA-1508 | Altera / Intel
The Intel (formerly Altera) EP2S130F1508C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) IC built on a 1.2-V, 90-nm all-layer copper SRAM process, offering 132,540 logic cells (equivalent), 53,016 CLBs, and 6,747,840 bits of embedded memory in a 1508-ball Flip-Chip BGA (FCBGA) package measuring 40 x 40 mm with 1 mm ball pitch. The device supports up to 1,126 user I/O pins and operates at a core voltage of 1.2 V with a maximum internal clock frequency near 717 MHz, enabling high-throughput DSP, datapath, and memory-intensive designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and dedicated hard-IP blocks (transceivers, memory, DSP, PLLs) that engineers can configure after manufacturing via an HDL bitstream. Within the broader taxonomy, the EP2S130 sits in the Stratix II family -> high-performance FPGA family -> programmable logic device -> integrated circuit -> semiconductor. Stratix II was the first Altera family to use an adaptive logic module (ALM) architecture, replacing the older 4-input LUT/LAB structure and improving logic utilization and timing closure for wide-function datapaths. Key features include 53016 Configurable Logic Blocks (CLBs), 1126 maximum user I/O pins, dedicated DSP blocks for high-speed multiplication/accumulation, on-chip TriMatrix memory with multiple block sizes, up to 12 high-speed transceivers on certain die variants, and support for external memory interfaces including DDR/DDR2 SDRAM, QDR II SRAM, and RLDRAM II. The FCBGA-1508 package supports high-pin-count routing with controlled-impedance signal integrity for parallel LVDS and source-synchronous interfaces. Typical applications include high-performance digital signal processing (radar, software-defined radio, medical imaging), ASIC prototyping, high-speed packet processing in networking line cards, military/aerospace signal processing, broadcast video processing, and high-bandwidth data acquisition systems. The combination of high logic density, embedded multipliers, and 1,126 I/O makes it well-suited to designs that previously required multiple lower-density FPGAs. When designing with the EP2S130F1508C4, ensure PCB layout accommodates the 1 mm-pitch BGA escape routing with microvia stackups and matched-length traces for parallel memory buses. Thermal management is critical at high toggle rates - follow the Stratix II thermal design guidelines with sufficient copper area and airflow to keep junction temperature below 85 C for C4 (commercial) grade. The device requires a configuration device (EPCS or JTAG) and a clean 1.2 V core supply within the datasheet tolerance window. This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, supporting component engineers, procurement teams, and FPGA designers during BOM selection, second-source qualification, and legacy hardware redesign.
EP2S130F1508C4N - Stratix II FPGA, 130K LE, 1126 I/O | Altera
The Altera (now Intel) EP2S130F1508C4N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix II family, fabricated on a 90 nm process node. Per the verified distributor data, it integrates 6,627 Logic Array Blocks (LABs) and provides 1,126 user I/O pins inside a 1,508-ball FineLine Ball-Grid Array (FBGA). The Stratix II architecture introduced the adaptive logic module (ALM), which delivers up to 2.5x the performance and 1.4x the logic capacity of the previous-generation Stratix family, while consuming 50% less dynamic power. What is a Stratix II FPGA? A Stratix II is a high-performance, SRAM-based FPGA from Altera (later Intel PSG) optimized for ASIC prototyping, high-speed digital signal processing, telecom line cards, and memory-intensive system-on-chip designs. Positioned in the broader taxonomy, it is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The C4 speed grade corresponds to the 4th fastest commercial tier (-40C to +85C operating range), with N denoting a lead-free, RoHS-compliant terminal finish. Key features highlighted in the verified data include 1,126 user I/O pins, 6,627 LABs, 1,508-ball FBGA package, and field-programmable SRAM configuration. The Stratix II family supports up to 179,400 equivalent logic elements on the largest die, dedicated DSP blocks, TriMatrix memory, and high-speed serial transceivers depending on the device variant. Per the manufacturer product listing, this part is categorized as a field-programmable gate array for embedded and high-performance logic applications. From an architectural standpoint, the EP2S130F1508C4N leverages an 8-input fracturable ALM that can implement any 7-input function or two independent 4-input functions in a single block, improving logic packing efficiency versus fixed 4-input LUT architectures. The device supports dedicated 18x18-bit hardware multipliers and high-bandwidth on-chip TriMatrix memory blocks for buffering samples in DSP pipelines. Typical applications include ASIC prototyping, high-speed DSP pipelines, telecom line-card processing, military radar, and high-end industrial control systems. Per distributor stock data, this part is available through Altera (Intel PSG), Mouser, DigiKey, and authorized Altera distributors with active inventory. Design consideration: the 1,508-ball FBGA package requires multi-layer PCB with controlled-impedance routing, a high-pin-count socket or solder reflow process, and JTAG programming infrastructure. Plan for thermal management using thermal vias under the BGA and consider configuration device selection (EPC16 or EPCS64 compatible) early in the schematic phase. This page synthesizes distributor pricing, drop-in alternatives from the Stratix II family, lifecycle status, and design guidance that consolidates information scattered across multiple Altera/Intel handbook volumes into a single, engineer-focused reference.
EP2S130F1508C4RB - 132K LE Stratix II FPGA, 1508-FBGA | Altera
The Altera (Intel) EP2S130F1508C4RB is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements, 6,747,840 bits of embedded memory, and 1,126 user I/O pins in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. It is fabricated on a 1.2 V, 90 nm all-layer copper SRAM process and is rated for commercial temperature operation with a maximum core speed grade of -4 (C4). A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that belongs to the broader category of programmable logic devices (PLDs) and ultimately to digital integrated circuits. Within the FPGA taxonomy, the Stratix II family sits at the high-density, high-performance tier, leveraging an innovative adaptive logic module (ALM) architecture that delivers up to 2.5x the performance and 50% lower power versus the original Stratix generation. The EP2S130 sits at the top of the Stratix II density range, intended for ASIC-prototype, telecom line-card, and DSP-intensive applications. Key features of the EP2S130F1508C4RB include dedicated on-chip memory (TriMatrix blocks totaling 6.75 Mbit), up to 36 DSP blocks providing roughly 384 18-bit x 18-bit multipliers, support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM II, and up to 12 high-speed transceiver channels (depending on variant). The device also embeds a flexible PLD-style clock network and hardware multipliers that simplify high-throughput signal-processing pipelines. The architecture is built around 16 ALMs per logic array block (LAB), each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and registers. The 1.2 V core supply is paired with dedicated phase-locked loops (PLLs) and a global clock tree supporting frequency synthesis across the device. According to public listings, the device operates at up to approximately 711.24 MHz internal clock frequencies, with maximum performance dependent on the Quartus II compile and the speed grade. Typical applications include high-speed data acquisition and processing, telecom baseband and line-card designs, ASIC prototyping, military and aerospace signal processing, image and video processing pipelines, software-defined radio (SDR) platforms, and high-performance DSP co-processing. The 1,126 user I/O count also makes it well suited for systems with very wide parallel buses or large external memory banks. When designing with this device, plan power-rail sequencing for the 1.2 V core alongside dedicated PLL and transceiver supplies, and ensure the PCB footprint and BGA escape routing accommodate the 1508-ball FC-FBGA. Designers should use the latest Quartus II design software (or a compatible third-party flow) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet.
EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S130F1508C5 is a high-density Stratix II Field-Programmable Gate Array (FPGA) IC delivering 132,540 logic elements, 6,627 Logic Array Blocks (LABs), and 1,126 user I/O pins in a 1508-ball FineLine BGA (FCBGA, 40x40 mm, 1.0 mm pitch) package. Built on a 90 nm CMOS process, it integrates up to 6.747 Mbits of embedded memory and 252 embedded 18x18 multipliers (DSP blocks), targeting high-performance parallel DSP, telecom, and ASIC prototyping applications. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM and DSP blocks. Within the broader hierarchy, an FPGA is a programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs are typically selected over ASICs for lower NRE cost, faster time-to-market, and the ability to update hardware functionality in-system after deployment. Key features of the EP2S130F1508C5 include Stratix II adaptive logic modules (ALMs) that pack more logic per LUT than previous architectures, dedicated high-speed external memory interfaces (DDR/DDR2/QDRII), up to 12 transceiver channels (Transceiver Block count per device variant), and rich clock management via PLLs. The device supports 1.15 V to 1.25 V core supply and is offered in the commercial speed grade C5. Internal clock networks, RAM blocks, and DSP blocks are tightly coupled to deliver >300 MHz DSP throughput in real designs. Typical applications include high-speed DSP for wireless baseband and radar processing, ASIC prototyping and emulation, high-throughput data-acquisition front ends, telecom line cards with packet processing, and broadcast video effects engines. The 1508-FBGA package exposes enough I/O to support wide external memory buses plus multiple high-speed serial links via companion transceivers. When designing with this part, engineers should validate PCB routing against the BGA escape pattern and use Altera/Intel Quartus II toolchain (or compatible) for synthesis and place-and-route. Confirm logic utilization and timing closure in simulation before committing to the production board. Note that the Stratix II family has been EOL'd by Intel; plan for long lead times or consider Stratix IV/V migration paths.
EP2S130F1508C5N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel
The Intel EP2S130F1508C5N is a high-density Stratix II family FPGA delivering 132,600 equivalent logic elements (LEs) with 6,627 logic array blocks (LABs) and 1126 user I/Os, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 1.2 V, 90 nm process, the device integrates up to 6.7 Mbits of on-chip RAM, embedded DSP blocks, and up to 12 transceiver channels (per Stratix II family architecture). The 1508-FBGA package supports the highest I/O count in the Stratix II family, enabling high-bandwidth parallel interfaces for ASIC prototyping, signal processing, and high-speed bridge applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM, and high-speed transceivers. FPGAs occupy the tier between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with software-level design flexibility. Stratix II is the second-generation high-performance FPGA family from what was Altera (now Intel PSG), succeeding the Stratix series and adding adaptive logic modules (ALMs) that improved area efficiency over the prior LE-based architecture. Key features of the EP2S130F1508C5N include 132,600 LEs (largest member of the Stratix II family), 6,627 LABs, 1,126 user I/Os in a 1508-ball FC-FBGA package, and the -5 speed grade designation (mid-tier, faster than -6/-7/-8, slower than -3/-4 grades). The device also integrates up to 6.7 Mbits of TriMatrix on-chip RAM, dedicated 18x18 multiplier DSP blocks (up to 384 18x18 multipliers per family datasheet), and 12 full-duplex embedded transceiver channels supporting up to 6.375 Gbps operation. The FC-FBGA substrate provides enhanced thermal and electrical performance for high-pin-count designs. The Stratix II architecture uses 8-input adaptive logic modules (ALMs) that pack variable ratios of combinational and register logic into a single structure, delivering higher effective logic density than the prior Stratix generation. Per the Altera/Intel datasheet, the 90 nm process and adaptive routing fabric deliver deterministic timing closure across complex multi-clock designs. Transceivers integrate clock-data-recovery and serializer/deserializer functions, allowing multi-gigabit serial links with minimal external PHY components. Typical applications for the EP2S130F1508C5N include ASIC and ASSP prototyping, high-speed data-acquisition systems, telecom baseband processing, military and aerospace signal processing, and high-end digital test equipment. The 1,126 user I/Os make it suitable for designs requiring very wide parallel data buses or many control signals, while the transceiver channels support chip-to-chip or backplane serial links. The 1508-FBGA package requires multilayer PCB design with controlled-impedance routing and matched-length traces for high-speed interfaces. Design consideration: The 1508-ball FC-FBGA package requires precise PCB footprint design with sub-millimeter ball pitch; ensure your PCB fab supports the required via-in-pad or microvia process. Plan decoupling capacitor placement and power-plane stack-up early, because post-layout rework on a 1508-ball BGA is impractical. The -C5 commercial temperature grade (0C to +85C) is suitable for lab and controlled-environment deployments; choose the -I industrial grade (EP2S130F1508I5N) for industrial temperature operation. This page synthesizes distributor pricing, drop-in alternatives within the Stratix II family, and practical design notes not found in the manufacturer datasheet itself.
EP2S130F1508C5NRB - Stratix II FPGA 132K LE 1508-FBGA | Intel
The Intel EP2S130F1508C5NRB is a high-density Stratix II family field-programmable gate array (FPGA) with up to 132,540 equivalent logic elements, 6,747,000 bits of embedded memory, and 1,126 user I/O pins, packaged in a 1508-ball fine-pitch BGA (FCBGA). Built on a 90 nm process with 1.2 V core supply and dedicated adaptive logic modules (ALMs), it targets high-throughput DSP, telecom, and ASIC-prototyping workloads. An FPGA (field-programmable gate array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user bitstream. Within the digital-IC taxonomy, FPGAs sit beside ASICs, CPLDs, and microcontrollers as the principal class of user-programmable logic. Stratix II was Intel FPGA's (formerly Altera's) mid-2000s high-end family, positioned between the Cyclone low-cost family and the Stratix III successor, and was widely adopted for ASIC prototyping, DSP co-processing, and high-speed serial bridging. Key features include 1,126 user I/O organized across multiple I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), 12 dedicated high-speed transceivers in selected package variants, and up to 96 DSP blocks (192 18x18 multipliers) for fixed- and floating-point arithmetic. The -C5 speed grade, together with the -NRB suffix, indicates the 1508-FBGA package, lead-free / RoHS-compliant termination finish, and Intel's tray packaging option. Typical applications include high-speed DSP co-processors for wireless baseband, military/aerospace signal processing, ASIC prototyping and emulation platforms, and high-performance industrial imaging pipelines. Designers migrating from Stratix to Stratix II typically reuse Quartus II design flows and the same set of IP cores. A critical design consideration is power-distribution network design: 1,126 I/O plus a 130K-LE core can exceed 20 W, so a multi-layer PCB with dedicated power/ground planes and bulk decoupling adjacent to every BGA quadrant is mandatory. Decoupling strategy must follow the Stratix II Hardware Reference guidance; sub-optimal decoupling will produce brown-out resets under heavy I/O switching. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Stratix II design notes that are not present in any single manufacturer datasheet revision. Lifecycle status and lead-time references are accurate as of 2026-09-09.
EP2S130F1508C5RB - Stratix II FPGA, 132K LE, 1508-BGA | Intel
The Intel EP2S130F1508C5RB is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering up to 132,600 equivalent logic elements (LEs), 6,727 Logic Array Blocks (LABs), and 1,126 user I/Os in a 1508-ball FineLine BGA (FBGA) package. It integrates 6.7 Mbits of embedded TriMatrix memory organized into MRAM blocks and 252 embedded 18x18 multipliers (504 9x9 multipliers), enabling DSP-intensive designs in a single device. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. Stratix II belongs to the high-performance programmable logic hierarchy: CLB -> LAB -> Logic Array -> FPGA -> Programmable Logic Device (PLD) -> Digital IC -> Semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than previous-generation LUT-based fabrics. Key features include support for up to 12 embedded transceiver channels (not bonded out on the F1508 package), adaptive logic modules with 8-input fracturable look-up tables, on-chip termination (OCT), and dedicated DSP blocks for high-speed arithmetic. The device supports multiple I/O standards including LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X, with true LVDS support up to 840 Mbps per channel on dedicated differential I/O. The EP2S130F1508C5RB is fabricated in a 90 nm CMOS process with 1.2 V core supply and operates over the commercial 0C to +85C junction temperature range. The 'C5' speed grade and 'RB' suffix indicate this variant ships in tray packaging as a commercial-temperature part. Typical applications include high-speed DSP (radar, baseband, software-defined radio), ASIC prototyping, high-throughput data acquisition, and communications infrastructure. For PCB design, the F1508 FBGA requires multilayer high-speed PCB stack-up with microvia or via-in-pad technology to route the 1.5 mm pitch ball array effectively. This page consolidates distributor pricing, same-brand Stratix II family drop-in alternatives, and design considerations not duplicated from the manufacturer datasheet, helping engineers accelerate procurement and design-in decisions.
EP2S130F1508I4 - Stratix II FPGA 132540 LE 1508-FBGA | Intel
The Intel (formerly Altera) EP2S130F1508I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded RAM, and 1,126 user I/O pins in a 1508-ball flip-chip BGA package. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device delivers up to 711.24 MHz core operation and approximately 180,000 equivalent LEs of logic capacity, targeting high-performance DSP, communications, and ASIC-prototyping designs. The industrial temperature grade (suffix I4) supports -40C to +100C ambient operation. An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and transceivers. Within the broader taxonomy, the Stratix II belongs to the high-performance FPGA tier, sitting above CPLDs and below structured ASICs. FPGAs are used when design flexibility, fast time-to-market, or post-silicon logic changes are required, and the Stratix II family specifically targets signal-processing and high-bandwidth data-path applications. Key features of the EP2S130F1508I4 include 672 embedded 18x18 multipliers, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, twelve clock per logic array block (LAB), and per-channel transceiver support depending on configuration. The 1.2 V core supply with separate VCCIO banks allows mixed-voltage interfacing across the 1,126 user I/Os. Multiple Phase-Locked Loops (PLLs) provide robust clock management across the 1,508-pin FCBGA. Architecturally, the Stratix II introduced the adaptive logic module (ALM), an 8-input fracturable LUT that improved logic utilization by up to 25% over prior generations. Combined with 90 nm process geometry and full-duplex high-speed I/O, this enables high aggregate bandwidth and efficient DSP pipelines, which is why the EP2S130 is widely used in ASIC prototyping, video processing, and software-defined radio platforms. Typical applications for the EP2S130F1508I4 include high-end ASIC prototyping platforms, software-defined radio (SDR) baseband processing, video broadcast and image processing, high-speed data acquisition, and high-performance DSP accelerator cards. Engineers typically pair the part with external DDR2/QDRII memory and a Stratix II development kit or third-party prototyping board such as the Altera DE3 or HES (Heterogeneous Evaluation System). Designers should plan PCB layout for the FCBGA-1508 (40x40 mm) footprint with matched-impedance length-matched routing for DDR2 interfaces and multiple decoupling tiers (10 uF, 100 nF, 1 nF) around the core. The industrial temperature grade makes the EP2S130F1508I4 well suited to telecom and industrial control applications where -40C to +100C operation is mandatory. This page synthesizes distributor stock, lifecycle status, and drop-in alternatives for the EP2S130F1508I4, including exact temperature-grade and speed-grade variants, complementing the manufacturer datasheet with cross-reference guidance unavailable in PDF form.
EP2S130F1508I4N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel
The Intel (formerly Altera) EP2S130F1508I4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 bits of embedded RAM, and 1126 user I/Os in a 1508-ball FCBGA measuring 40 x 40 mm with a 1.0 mm ball pitch. Built on a 90 nm CMOS process with 1.2 V core supply, the device integrates 6,627 Logic Array Blocks (LABs) and supports up to 717 MHz internal operation across the industrial temperature range (-40C to +100C). An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard-IP blocks such as memory, DSP, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which in turn belong to logic ICs and ultimately the integrated circuits (semiconductors) hierarchy. Stratix II devices specifically target high-performance digital signal processing, telecom, and ASIC-prototyping workloads where the combination of high logic density, abundant embedded memory, and a generous user-I/O count is essential. Key features of the EP2S130F1508I4N include 12 on-chip PLLs for clock synthesis and skew management, dedicated 18-bit x 18-bit hardware multipliers arranged as DSP blocks, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and a hard Nios II embedded processor soft-core option. The 1508-FCBGA package provides a large thermal pad for low thermal resistance, while the 1126 user I/Os offer ample connectivity for parallel memory buses, high-speed serial links via serializer/deserializer (SERDES) on companion Stratix II GX devices, and external PHY interfaces. Architecturally, the Stratix II family introduced the Adaptive Logic Module (ALM) - an 8-input fracturable LUT that delivers approximately 40 percent higher performance and 25 percent lower logic area than previous generations. Combined with the TriMatrix embedded memory architecture (three distinct RAM block sizes), this makes the EP2S130 the highest-density Stratix II variant, suitable for prototyping mid-to-large ASIC designs, high-end DSP pipelines, multi-channel telecom baseband processing, and high-throughput data acquisition systems. Typical applications include ASIC prototyping, multi-channel telecom infrastructure (SDH/SONET, OTN), high-speed data acquisition, software-defined radio (SDR) baseband processing, and high-end video/image processing systems. Designers choose this part when maximum logic density and embedded memory in a single device outweigh the need for the latest transceivers. When designing with the EP2S130F1508I4N, ensure a 4-layer or better PCB with continuous power planes and adequate decoupling on the 1.2 V VCCINT and 3.3 V VCCIO rails - the device draws significant inrush current during configuration. Industrial-grade temperature (the I4 suffix) is verified for -40C to +100C ambient operation. This page synthesizes distributor pricing, drop-in alternatives, design notes, and parametric comparisons that complement the Intel Stratix II Device Handbook, helping engineers source, qualify, and select the right Stratix II variant for production and prototype builds.
EP2S130F1508I4RB - Stratix II FPGA, 132K LEs, 1508-FCBGA | Intel
The Intel EP2S130F1508I4RB is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements, 6,747,840 bits of embedded memory, and 1,126 user I/O pins in a 1508-ball FineLine BGA (FCBGA) package, targeted at high-performance logic, DSP, and memory-intensive designs. The device is the industrial temperature grade variant and ships on tape-and-reel (suffix RB), making it production-line-ready for high-volume assembly. The Stratix II family is built on a 90 nm process and uses an adaptive logic module (ALM) architecture that delivers up to 50 percent higher performance and 40 percent lower power than the prior Stratix generation. An FPGA is a programmable logic device that engineers configure after manufacturing to implement arbitrary digital circuits, replacing fixed-function ASICs while providing faster time-to-market, in-system re-programmability, and integrated hard IP blocks such as transceivers, memory controllers, and DSP blocks. The Stratix II sits in the high-end of the Altera/Intel FPGA portfolio, between the Cyclone II cost-optimized family and the Stratix III mid-range, and is commonly used in telecom line cards, military signal processing, and ASIC prototyping. Key features include 132,540 equivalent logic elements (LEs), 6,747,840 embedded RAM bits organized in M512/M4K/M-RAM blocks, 1,126 user I/O pins with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), 12 dedicated clock pins, up to 1 Gbps LVDS performance, and embedded multiplier blocks for DSP. The 1508-FCBGA package uses Intel's flip-chip BGA technology for low-inductance power distribution and high pin count at modest board area (40 mm x 40 mm typ.). The Stratix II architecture introduces the ALM (8-input fracturable look-up table) which can be split into two independent 4-input LUTs, increasing effective logic utilization versus older 4-input LUT architectures. Each ALM also contains two dedicated adders and registers, enabling high-speed arithmetic paths without consuming general routing. TriMatrix memory provides three block sizes (M512, M4K, M-RAM) so that small FIFOs and large buffers share the same fabric with predictable timing. Typical applications include high-speed digital signal processing, ASIC prototyping, telecom line-card packet processing, military radar and signal intelligence, broadcast video processing, and high-throughput data-acquisition front-ends. The device is well matched to designs that need hundreds of DSP multipliers and megabits of on-chip buffering on a single die. When designing the PCB, allocate a continuous GND reference under the BGA, use at least 8 PCB layers with dedicated VCCINT/VCCIO planes, and decouple every 6-10 balls with 100 nF X7R capacitors plus bulk tantalum or polymer capacitors near the package. Configuration can be loaded via fast passive parallel (FPP), passive serial (PS), or JTAG, and the EP2S130 supports remote upgrade through the dedicated AS/PS configuration flash port.
EP2S130F1508I4TT - 132K LE Stratix II FPGA, 1508-BGA | Intel
The Intel (formerly Altera) EP2S130F1508I4TT is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 132,540 logic elements, 6,747,840 RAM bits, and 1,126 user I/Os in a 1508-ball FineLine BGA (FCBGA) package. Built on a 90 nm process, it integrates adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks, and high-speed transceivers, targeting high-performance DSP, communications, and ASIC prototyping workloads. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O can be reconfigured after manufacture, enabling hardware-level parallelism for compute-intensive tasks. Stratix II sits in the FPGA product hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets mid-to-high logic density applications that benefit from dedicated DSP blocks and embedded memory. Key features of the EP2S130F1508I4TT include up to 1,126 general-purpose user I/Os, 6,747,840 bits of TriMatrix embedded memory (~6.4 Mbit), dedicated DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards (LVDS, LVTTL, LVPECL, SSTL, HSTL), and clock management via up to 12 PLL blocks. The -I4 speed/temperature grade specifies industrial temperature operation (-40C to +100C ambient) and a -4 core speed grade. The Stratix II architecture uses 8-input adaptive logic modules (ALMs), each capable of implementing up to two independent combinational or registered functions. Combined with the TriMatrix memory hierarchy (three block RAM sizes per block) and dedicated 36x18 multipliers summed by hardware adders, the EP2S130 supports up to ~3.5 GMACs of DSP throughput at high core speeds, making it suitable for wireless baseband, video processing, and high-speed datapath designs. Typical applications include wireless base station signal processing, high-end ASIC prototyping, software-defined radio (SDR) datapaths, image and video processing pipelines, and high-speed serial protocol bridging. The large logic count makes the device particularly attractive for designs that require extensive parallel datapaths or large state machines. When designing with the EP2S130F1508I4TT, plan for multi-layer PCB stack-ups with continuous ground planes for the BGA, dedicated decoupling per power rail group, and signal-integrity-aware fanout for high-speed LVDS pairs. The 1508-ball FCBGA has fine 1.0 mm pitch; verify manufacturer land-pattern and reflow profiles against JEDEC J-STD-020. This page synthesizes distributor pricing snapshots, drop-in package-compatible Stratix II and Stratix family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP2S130F780C4 - Stratix II FPGA 132K LE 534 I/O FBGA | Intel / Altera
The Intel / Altera EP2S130F780C4 is a high-density Stratix II family field-programmable gate array (FPGA) housed in a 780-ball fine-pitch BGA (FC-FBGA) package measuring 40 x 40 mm with 1 mm ball pitch. The device integrates approximately 132,540 logic elements across 6,627 logic array blocks (LABs) and exposes 534 user I/O pins, with internal performance hardened to 717 MHz and built on a 90 nm CMOS process with a 1.2 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs occupy the highest tier of the programmable logic hierarchy, above CPLDs (smaller, non-volatile, simpler architecture) and below ASICs (custom-fabricated, lowest per-unit cost at scale). Within Altera's Stratix product tree, the Stratix II family specifically targets high-end DSP, telecom, and high-throughput data-pipeline applications using an adaptive logic module (ALM) architecture that delivers higher effective logic density than previous-generation 4-input LUT designs. The EP2S130F780C4's headline feature is its very large embedded memory and DSP multiplier count, which together enable designers to implement wide, parallel data paths without external memory. The device also integrates dedicated high-speed serial interfaces suited to backplane and chip-to-chip links, and its 780-pin FC-FBGA package provides sufficient I/O for parallel memory buses and multiple standard interfaces. The 'C4' speed grade and 'F' package code designate the commercial temperature range and the flip-chip BGA pinout, respectively. Typical applications include high-speed digital signal processing (radar, software-defined radio, video transcoding), ASIC prototyping, telecom line-card glue logic, high-throughput data acquisition, and embedded computing platforms that require parallel compute resources. Designers usually pair the device with external DDR/DDR2 memory and dedicated PHY companions to exploit its on-chip memory bandwidth. When designing with this FPGA, plan power-rail sequencing carefully - the 1.2 V core typically requires a multi-phase buck regulator, while the I/O and auxiliary supplies need separate rails. Thermal management is critical at full utilization: ensure adequate airflow or a heatsink attached to the 40 x 40 mm substrate, since FC-FBGA packages rely primarily on the PCB for heat dissipation. This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement decisions, and PCB-level implementation guidance.
EP2S130F780C4N - Stratix II FPGA, 132K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2S130F780C4N is a high-density Stratix II family FPGA housed in a 780-ball flip-chip BGA (FC-FBGA) package, built on a 90 nm CMOS process and operating from a 1.2 V core supply. It integrates 132,540 logic elements, 6,627 logic array blocks (LABs), and 534 user I/Os, with on-chip memory of approximately 6.7 Mbit and DSP blocks that deliver up to 384 embedded multipliers, making it well suited for DSP-intensive designs and high-throughput datapaths. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the wider semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. FPGAs sit between fixed-function ASICs and software-driven processors: they implement arbitrary digital logic in configurable look-up tables (LUTs), programmable interconnect, and dedicated hard IP such as block RAM, PLLs, transceivers, and DSP blocks, allowing rapid design iteration without the mask costs of an ASIC. Key features of the EP2S130F780C4N include up to 717 MHz internal clock frequency, embedded TriMatrix memory supporting dual-port and FIFO modes, up to 12 dedicated PLL blocks for clock synthesis and management, and support for external memory interfaces such as DDR, DDR2, QDR, and RLDRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O buffers with on-chip termination. Architecturally, the Stratix II family introduced an innovative adaptive logic module (ALM) topology that gives roughly 40% higher performance per area than the prior Stratix architecture, and the EP2S130F780C4N integrates up to 16 global clock networks plus regional clock trees. The 780-pin FC-FBGA package uses a 1 mm pitch on a 29x29 mm substrate, enabling dense PCB routing while supporting industrial temperature grades through ordering options. Typical applications include high-speed digital signal processing in radar and software-defined radio, ASIC prototyping, video processing and broadcast equipment, telecom line cards, industrial control and machine vision, and PCIe-based accelerator cards. The wide DSP block count and ample on-chip memory allow designers to push large FFT/fir pipelines at hundreds of MSPS without external memory round-trips. When designing with this device, careful attention must be paid to power integrity because Stratix II devices can exceed 25 W dynamic power under heavy utilization. Designers must follow Intel/Altera's power-supply decoupling guidance with bulk, mid-frequency, and high-frequency capacitors placed close to the dedicated VCCINT, VCCIO, and GND balls, and a multi-layer PCB stackup with dedicated power/ground planes is required for signal integrity at LVDS and DDR2 rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond what is found in the manufacturer datasheet, providing engineers with a single reference for sourcing, replacement planning, and PCB-level design considerations.
EP2S130F780C5 - Stratix II FPGA, 132K LE, 780-FBGA | Intel
The Intel (Altera) EP2S130F780C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 132,540 equivalent logic elements, 6,274 Kbits of embedded memory, and 252 embedded 18x18 multipliers in a 780-pin FC-FBGA package. The Stratix II family is built on a 90 nm CMOS process and operates at a 1.2 V core supply (1.15 V to 1.25 V range). The 'C5' speed grade targets commercial-temperature designs up to the Stratix II device family maximum internal clock frequency around 609.76 MHz. A Field-Programmable Gate Array (FPGA) is a reprogrammable logic device that combines configurable logic blocks, programmable routing, embedded memory, and hardened functional blocks (such as DSP blocks, transceivers, and PLLs) into a single IC. FPGAs sit above general-purpose microcontrollers in the programmable-logic taxonomy: programmable logic device (PLD) -> CPLD -> FPGA -> high-end SoC FPGA. Stratix II was specifically architected for ASIC prototyping, high-throughput DSP, and parallel processing in communications infrastructure, where deterministic hardware parallelism is required. Key features of the EP2S130F780C5 include 534 user I/O pins, an adaptive logic module (ALM) architecture (8-input fracturable LUTs), embedded DSP blocks delivering up to 1.4 GMACs DSP performance, and embedded TriMatrix memory supporting single-port, dual-port, and FIFO modes. The device family supports up to 12 global clock networks, 4 PLLs per quadrant, and up to 16 dedicated high-speed serial channels (transceivers) depending on package density. The 780-FBGA package pinout assigns 534 user I/Os plus the balance to power, ground, JTAG (IEEE 1149.1), and configuration pins. Architecturally, Stratix II was the first FPGA family to adopt an 8-input fracturable ALM with full carry-chain and dedicated arithmetic logic, which improves logic utilization and effective DSP throughput versus 4-input LUT predecessors. The 90 nm process also enabled integration of hard PCIe, DDR2 memory controllers, and 1 Gbps+ LVDS I/O without external PHY chips. Typical applications include ASIC prototyping, high-end telecommunication infrastructure (basestation baseband, SERDES aggregation), high-performance DSP (software-defined radio, radar signal processing, video codec acceleration), and large-scale industrial control. The commercial temperature grade ('C' suffix) targets 0C to +85C junction, suiting laboratory, enterprise, and rugged-but-non-automotive deployments. When designing with EP2S130F780C5, ensure the Altera/Intel Quartus II toolchain (or its maintained successor) supports the design's resource utilization, and verify the FPGA's 780-BGA PCB footprint supports the required power-delivery network (PDN) for multi-amp core currents. Note that Stratix II is a mature device family; new designs should evaluate Cyclone/Arria/Stratix V successors. This page synthesizes distributor pricing, BGA package details, parametric drops within the Stratix II family, and design notes not found in the manufacturer datasheet alone.
EP2S130F780C5N - Stratix II 132K LEs FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2S130F780C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a 90 nm CMOS process, the device integrates 132,540 logic elements, 6,627 Logic Array Blocks (LABs), 4,488 Kbit of on-chip memory (6,747,840 RAM bits), and 534 user I/Os. It operates from a 1.15 V to 1.25 V core supply, and the C5 speed grade targets commercial 0 °C to 85 °C environments with a typical internal frequency of 609.76 MHz. Background: An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that lets engineers implement arbitrary digital circuits by configuring an array of logic blocks, embedded memory, DSP blocks, and high-speed transceivers via a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs (lower NRE, higher unit cost) and microcontrollers (lower performance, software-driven) and dominate prototyping, low-volume production, and applications needing hardware-level parallelism such as DSP, packet processing, and high-speed I/O bridging. Key features include up to 12 embedded DSP blocks delivering high-throughput multiply-accumulate operations, dedicated high-speed I/O standards support including LVDS, SSTL, and DDR memory interfaces, eight clock networks with up to 16 global clocks, and on-chip PLL resources for frequency synthesis. The device integrates 4 PLLs and supports configuration via passive serial, fast passive parallel, and JTAG modes. Architecture: The Stratix II family uses an adaptive logic module (ALM) architecture that combines 8 inputs into a single lookup-table-equivalent resource, providing roughly 25% higher logic utilization versus traditional 4-input LUT families. The TriMatrix memory subsystem provides three block RAM sizes (M512, M4K, M-RAM) for flexible buffering, and the embedded DSP blocks deliver 36 x 36 bit multiplication natively, supporting signal-processing pipelines at hundreds of MHz. Typical applications include high-performance digital signal processing in telecommunications base stations, ASIC prototyping, industrial vision and image processing pipelines, broadband network switches, and test and measurement equipment. The 780-FBGA package and 534 I/Os make it well suited for designs requiring wide external memory buses (DDR/DDR2) and many parallel interfaces. Design considerations: Stratix II devices require two supply rails (1.15-1.25 V core, 3.3 V I/O) and careful decoupling with 0.1 µF and 0.01 µF ceramic capacitors near every power pin. The 780-FBGA 29 x 29 mm package uses a 1 mm ball pitch and demands a 4-to-6-layer PCB with microvia or via-in-pad technology for reliable manufacturing; signal integrity analysis is mandatory for DDR interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2S130F780I4N - 132K LEs Stratix II FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2S130F780I4N is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 132,540 equivalent logic elements in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 1.2 V, 90 nm all-layer copper SRAM process, this industrial-temperature (I4) device targets high-performance digital designs including DSP, telecom, and signal-processing systems, with 6,748,160 bits of embedded memory and up to 534 user I/Os. Maximum internal operating frequency is 711.24 MHz with dedicated multiplier blocks and TriMatrix on-chip memory. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (LABs), routing channels, and hard IP blocks (memory, multipliers, transceivers, PLLs) that engineers program via HDL to implement arbitrary digital logic, DSP pipelines, or bus interfaces. FPGAs sit below ASICs in NRE cost but above MCUs in raw parallel throughput, making them ideal for prototyping and low-to-medium volume production. The Stratix II family pioneered the adaptive logic module (ALM) architecture, doubling logic efficiency versus the original Stratix and enabling densities approaching 180,000 equivalent LEs. Key features include 6,627 LABs, 534 maximum user I/Os, embedded TriMatrix memory blocks totaling 6,748,160 bits, dedicated 18x18 multipliers for DSP, and up to 12 global clock networks with 16 PLLs per device. The 90 nm CMOS process and 1.2 V core VCC keep dynamic power competitive with previous generations, while the adaptive logic module (ALM) provides finer-grained packing than competing architectures. The FC-FBGA-780 package uses a 29x29 mm body with 1.0 mm ball pitch, supporting dense board layouts. Typical applications include high-speed DSP for radar and medical imaging, multi-gigabit serial-interface bridging, ASIC prototyping, telecom baseband processing, and high-performance data-acquisition back-ends. Industrial temperature grade (-40C to +100C case) supports factory and outdoor equipment. When designing, ensure multi-rail decoupling (1.2 V VCCINT, 2.5 V/3.3 V VCCIO, VCCPD, VCCA_PLL) follows the Stratix II pin connection guidelines; do not reuse older Stratix I power designs. This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, drop-in alternatives within the same 780-FBGA footprint, and practical design notes not found in the manufacturer datasheet itself.
EP2S130GF1508C3N - Stratix II FPGA, 132K LEs, 1508-FCBGA | Altera
The Altera (Intel) EP2S130GF1508C3N is a Stratix II family Field Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FCBGA) package. The device integrates 132,540 logic elements, 6,747,840 bits of embedded memory, and 1126 18x18-bit multipliers in a single die, fabricated on a 90 nm CMOS process and aimed at high-density DSP, datapath, and memory-rich designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) interconnected by a programmable routing fabric. It belongs to the broader hierarchy programmable logic device (PLD) -> CPLD/FPGA -> system-on-chip fabric -> semiconductor. FPGAs are differentiated from ASICs by being fully reconfigurable in the field, while delivering ASIC-class throughput for parallel workloads such as digital signal processing, packet processing, and high-speed interfacing. Key features of the EP2S130GF1508C3N include up to 36 embedded DSP blocks organized into a column-based multiplier/accumulator fabric, support for external memory interfaces up to DDR2 SDRAM and QDRII/RLDRAM-II, and a multi-gigabit transceiver-less general-purpose I/O subsystem with up to 1126 user I/Os. The device also supports Altera's Enhanced Configuration (EPC) devices for fast parallel configuration from flash memory. The Stratix II architecture uses an adaptive logic module (ALM) containing 8 inputs and a fracturable look-up table (LUT) that can be split into two 4-input LUTs or recombined to implement 7-input functions. Combined with the TriMatrix memory block hierarchy (MLABs, M512, M4K, M-RAM), the device delivers very high logic utilization and block-memory density for dataflow applications. Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-throughput memory controllers. The 1508-FCBGA package with exposed thermal lid enables high I/O density and efficient heat extraction for full-power operation. When designing with this device, pay close attention to power integrity and decoupling: the 1508-BGA package requires a multi-layer PCB with continuous power and ground planes beneath the device. Use the Quartus II power calculator and thermal-aware pin planner to manage the >15 W typical dissipation at full DSP utilization. This page synthesizes distributor stock, Stratix II family drop-in alternatives, and design notes not found in the manufacturer datasheet. Last refreshed 2026-09-09.