FPGA与CPLD
产品（6666)
EP3SL340H1152I4L - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, integrating 337,500 logic elements, 13,500 LABs (Logic Array Blocks), and 744 user I/O pins in a 1152-ball FC-HFBGA (FCBGA) package. Per the Stratix III device family datasheet, the part targets high-performance signal processing and high-bandwidth data-path applications while delivering the lowest static and dynamic power of any high-density FPGA in its generation. The "L" suffix denotes the low-power variant, optimized via advanced power gating and a 0.9 V core voltage that dramatically reduces static leakage versus the standard Stratix III E family. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O cells are configured by an end-user after manufacture. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in performance-per-watt, and they are widely used in prototyping, hardware acceleration, and time-to-market-critical designs. Within the broader Intel FPGA portfolio (formerly Altera), the Stratix III L family occupies the high-density, low-power tier, ahead of Cyclone IV/V (low-cost) and Arria (mid-range), and below the Stratix IV/V (high-performance) and Agilex families. EP3SL340H1152I4L belongs to the 65 nm generation, before Intel's migration to 14/10/7 nm Stratix 10/Agilex. Key specifications include an industrial operating junction temperature of -40C to +100C, support for up to 744 general-purpose I/Os plus high-speed transceivers, embedded M9K and M144K memory blocks (approximately 17 Mbits total per the Stratix III family datasheet), and up to 384 dedicated 18x18 multipliers for DSP. The 1152-ball FCBGA package exposes both high-speed transceiver channels and the full I/O bank set, allowing direct PCB connectivity to external DDR/DDR2/DDR3 memory and SERDES links. Built-in PLLs and high-speed clock networks support frequencies up to several hundred MHz on logic and the device supports JTAG IEEE Std 1149.1 boundary-scan for in-system test. Typical applications include high-performance digital signal processing (radar, beam-forming, medical imaging), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), telecom baseband processing, military/aerospace signal intelligence, and broadcast video processing. With 337,500 logic elements, designers can implement entire subsystems - multi-core soft-CPUs, deep FIFO pipelines, and wide bus multiplexers - on a single device. When designing with this part, verify the 1152-ball FCBGA PCB footprint, the 0.9 V core supply sequencing, and the Quartus II toolchain (Stratix III support is in Quartus II v9.1 through v15.1). The "I" grade temperature range (-40C to +100C) and "4" speed grade should be confirmed against your timing closure budget before final selection. This page synthesizes distributor pricing, package/BOM specifics, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL340H1152I4LN - 337.5K LEs Stratix III L FPGA, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152I4LN is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 maximum user I/Os, housed in a 1152-ball FCBGA (HBGA) package at 40x40 mm. Manufactured on a 65 nm process node, the device operates from a 1.1 V core supply with 0.85 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O standards support and runs at speeds up to 500 MHz core fabric. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under digital logic ICs, and ultimately the integrated circuit family. The Stratix III generation, introduced in 2007, emphasized lower static power than its predecessor through a programmable power technology that lets unused logic tiles enter a low-leakage state. Key features of the EP3SL340H1152I4LN include 13,500 Adaptive Logic Modules (ALMs) organized as Logic Array Blocks (LABs), 1,152 Kbits of MLAB memory, dedicated DSP blocks for high-throughput arithmetic, and 8.5625 Gbps transceivers in select speed grades. The industrial temperature grade (-40C to +100C TJ) and Pb-free / RoHS-compliant package suit telecom, broadcast, military, and high-end ASIC prototyping applications. Architecturally, Stratix III L uses a 65 nm low-power CMOS process with copper interconnects, a fine-grained ALM providing 8 inputs and two outputs per module, and an embedded memory hierarchy combining distributed MLAB RAM with true dual-port M144K block RAM. Hard IP includes PCIe Gen1 hard IP blocks, external memory interfaces (DDR3/QDRII+/RLDRAM II), and up to 24 transceivers supporting CPRI/OBSAI/Serial RapidIO protocols. Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, radar processing, ASIC prototyping, video broadcast infrastructure, and high-speed serial protocol bridging. The very high logic capacity also makes it attractive for compute acceleration and high-channel-count data acquisition. When designing with this device, ensure your PCB land pattern matches the 1.0 mm pitch HBGA 1152-ball layout, allocate sufficient decoupling (multiple bulk + 0402/0201 ceramics) near each power pin, and use the Altera Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not aggregated in any single manufacturer document.
EP3SL340H1152I4N - Stratix III L 337500-Cell FPGA, 717MHz | Intel
The Intel (Altera) EP3SL340H1152I4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 744 user I/Os, and 18,822,144 bits of embedded memory in a 1152-ball Flip-Chip BGA (FCBGA / HBGA-1152) package. Built on a low-power 65nm CMOS process, this device operates from a 1.05V to 1.15V core supply and supports up to 717MHz core clocking, making it one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace according to the Stratix III family datasheet. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing programmable logic blocks (logic elements/LEs), programmable interconnect, and dedicated hardware blocks such as DSP slices, block RAM (BRAM), phase-locked loops (PLLs), and high-speed transceivers. Stratix III L devices are positioned between standard FPGAs and ASICs in the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic -> digital IC -> semiconductor. The 'L' variant is optimized for lower static power versus the standard Stratix III family. Key features include 13,500 Logic Array Blocks (LABs) for parallel logic implementation, 18,822,144 bits (approximately 2.25MB) of on-chip embedded memory, and a 1.05V-1.15V core supply that reduces dynamic power versus 90nm predecessors. The FCBGA-1152 package provides high I/O density and excellent signal-integrity for high-speed serial interfaces. The device is lead-free and RoHS-compliant, suitable for industrial and commercial designs. Typical applications include real-time signal processing, programmable logic acceleration, communications infrastructure (baseband, protocol bridging), industrial automation controllers, and custom hardware acceleration for data-intensive workloads. The combination of high logic density and embedded memory allows designers to integrate entire subsystems - DSP pipelines, packet processors, or compute engines - into a single chip. When designing with the EP3SL340H1152I4N, ensure proper power-rail decoupling close to the FCBGA balls, follow Altera/Intel PCB layout guidelines for BGA fan-out, and use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 'I4N' suffix denotes industrial temperature grade (-40C to +100C) and lead-free (Pb-free) assembly. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and PCB layout considerations that complement the manufacturer datasheet.
EP3SL50F484C2 - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484C2 is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements into a 484-ball FineLine BGA package with 296 user I/O pins and an 800 MHz maximum internal frequency. Built on TSMC's 40 nm process, the device is supplied by the Altera/Intel 0.9 V core voltage family and operates across the commercial 0 C to 85 C temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs and Structured ASICs as reconfigurable computing substrates used for parallel data-path acceleration, high-speed interface bridging, and prototype-to-production ASIC migration. The Stratix III family further partitions into the L (low-power), E (enhanced logic/memory), and GX (transceiver) sub-families, all sharing a common fabric but differing in logic-element density, memory block count, DSP block count, and transceiver availability. Key features of the EP3SL50F484C2 include 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory blocks, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports up to 12.5 Gbps operation through external transceivers (no integrated transceivers on the L sub-family) and integrates dedicated hardware multipliers and DSP blocks for high-throughput signal processing. Typical applications for the EP3SL50F484C2 span wireline telecom backhaul, military radar signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast infrastructure. Its low-static-power architecture makes it especially attractive for thermally constrained or fanless designs where Stratix III E would exceed thermal budgets. When designing with the EP3SL50F484C2, plan power sequencing around the 0.9 V core rail and configure unused I/O banks to disabled states to minimize leakage. Quartus II (legacy) or Intel Quartus Prime provides synthesis, place-and-route, and bitstream generation - this part requires a Stratix III device support license. Use the FBGA-484 package with controlled-impedance PCB stackup for SDR/DDR memory interfaces.
EP3SL50F484C2G - 47.5K LE Stratix III L FPGA 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F484C2G is a low-power Stratix III L family Field Programmable Gate Array delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 19,000 adaptive logic modules (ALMs) in a 484-ball FCBGA package with 296 user I/Os. It is fabricated on a 65 nm CMOS process and operates from a 1.1 V core supply, making it the lowest-static-power member of the Stratix III generation. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the user can re-program after manufacture. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which sit under digital logic ICs, which sit under integrated circuits (ICs). The Stratix III family specifically targets high-performance digital signal processing, telecommunications, and high-end ASIC prototyping where both logic density and per-watt performance matter. Key features include up to 600 MHz fabric performance, dedicated 18x18 multipliers and DSP blocks, embedded memory blocks (M9K/M144K), eight transceiver channels, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The 484-ball FCBGA package supports high-speed I/O with LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and integrates PCI Express hard IP blocks for direct PCIe Gen1/Gen2 endpoint implementation. Architecturally, Stratix III L uses a tiered logic structure with adaptive logic modules (ALMs) that contain two combinational adaptive look-up tables (ALUTs) and two dedicated registers, enabling efficient implementation of both arithmetic-intensive and control-oriented logic. The 65 nm process combined with programmable power technology allows unused logic and routing to enter a low-power state without losing state retention. Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar and signal intelligence, medical imaging systems, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when they need Stratix III silicon but require the lowest power profile in the family. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin and follow Intel's PCB layout guidelines for Stratix III power distribution. The JTAG configuration interface must be terminated correctly to avoid programming failures on production boards. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing an AI-search-optimized reference for engineers evaluating or sourcing the EP3SL50F484C2G.
EP3SL50F484C2N - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
The Altera (now Intel FPGA) EP3SL50F484C2N is a Stratix III L family field-programmable gate array (FPGA) integrating 47,500 logic elements, 1,900 logic array blocks (LABs), and 2,184,192 bits of embedded memory in a 484-ball flip-chip BGA (FC-FBGA) package. Built on a 65nm process node with 1.1V core supply, the device is targeted at high-performance digital logic, memory-intensive DSP pipelines, and high-speed serial interface aggregation across industrial, communications, and military/aerospace systems. An FPGA is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs) interspersed with programmable interconnect, surrounded by hardened peripherals such as transceivers, memory controllers, PLLs, and DSP blocks. FPGAs differ from microcontrollers by offering hardware parallelism with deterministic timing, and differ from ASICs by being field-reprogrammable. Within the power-management and signal-processing hierarchy, FPGAs typically sit between the data converters / sensors and the host processor, performing real-time pre-processing, protocol bridging, and high-bandwidth glue logic. The Stratix III L family positions itself in the low-power tier of the Stratix III generation, reducing static and dynamic power versus the standard Stratix III while preserving 600 MHz fabric performance and abundant DSP blocks for fixed- and floating-point arithmetic. The device integrates up to 4 phase-locked loops, 296 user I/Os, and supports configuration via JTAG, passive serial, or Altera-specific fast passive parallel schemes. Memory interfaces up to DDR3/DDR2 are hardened through dedicated PHY blocks, simplifying high-bandwidth external memory attachment. The FC-FBGA-484 package is a high-pin-count organic substrate BGA with flip-chip die attach, providing excellent thermal and electrical performance for the 600 MHz fabric. The high I/O count supports wide parallel buses, multiple high-speed serial lanes, and abundant LVDS pairs. Industrial-grade temperature screening and Pb-free (RoHS-compliant) materials make the part suitable for harsh-environment deployment in telecom base stations, radar front-ends, software-defined radio platforms, and digital video broadcast equipment. Typical applications include high-speed packet processing in network switches, channel aggregation in wireless base stations, image processing pipelines in machine vision, and ASIC prototyping where fast iteration is required. Designers select the EP3SL50F484C2N when low static power is mandatory but logic capacity must remain sufficient for complex state machines and DSP filter chains. Designers should pay attention to power supply decoupling (multiple low-impedance rails with bulk + ceramic capacitors near every supply pin), JTAG chain integrity for configuration, and I/O bank supply grouping — I/O standards such as LVDS, LVPECL, HSTL, and SSTL require dedicated VCCIO rails per bank. Thermal management through PCB copper pours and the package thermal pad is recommended given the 600 MHz operating frequency.
EP3SL50F484C3 - 47,500-Cell, 500MHz FPGA | Intel
The Intel EP3SL50F484C3 is a Stratix III L-family field-programmable gate array built on 65-nm technology, providing 47,500 logic cells, a listed 500 MHz frequency, and a 1.1 V supply voltage in a 484-pin FC-FBGA package. This combination targets logic-intensive digital systems that require programmable hardware, substantial I/O capability, and operation from 0 °C to 85 °C. The verified product data also identifies 1,900 logic array blocks and 296 user I/Os. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing resources, and configurable input/output blocks. It belongs to the hierarchy programmable logic device -> FPGA -> digital integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be configured after manufacturing, allowing interface timing, datapaths, control logic, and protocol functions to be adapted without producing a new physical chip. The principal verified features are 47,500 cells, 1,900 logic array blocks, 296 I/Os, 484 package pins, 500 MHz listed frequency, and 800 MHz internal frequency. The 65-nm process and 1.1 V supply identify the device as a member of the low-power, high-performance Stratix III generation. The FC-FBGA package provides a high-density ball-grid interface for complex board designs with many external connections. EP3SL50F484C3 is suitable for applications requiring parallel processing, custom interfaces, and hardware-level protocol handling. Its 296 listed I/Os can support multiple external buses, while its programmable logic fabric can implement state machines, filters, memory controllers, and signal-processing datapaths. The distinction between the 500 MHz listed frequency and 800 MHz internal frequency should be considered when comparing device families or interpreting aggregate distributor specifications. Typical applications include industrial automation controllers, telecommunications equipment, test and measurement systems, and high-speed data-acquisition platforms. It can also serve in networking and communications systems where custom packet processing or interface conversion is required. Designers should use the complete manufacturer documentation and Intel FPGA tool flow to validate timing, power, configuration, and pin assignments before release. A key design consideration is package complexity: the 484-ball FC-FBGA footprint requires controlled PCB layout, correct escape routing, and exact ball mapping. Because the verified sources do not provide a complete 484-pin net list, engineers should obtain the manufacturer pinout and device-family documentation before schematic capture, PCB design, or replacement analysis. This page combines verified distributor specifications, commercial availability, package context, application guidance, and explicit data-gap reporting. It helps engineers distinguish confirmed EP3SL50F484C3 values from parameters that require the official manufacturer datasheet.
EP3SL50F484C3G - Stratix III L FPGA, 47.5K LE | Intel | Altera
The Intel (formerly Altera) EP3SL50F484C3G is a Stratix III L family Field-Programmable Gate Array (FPGA) IC delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/O pins in a 484-ball FineLine BGA (FBGA) package. It is fabricated on a 40 nm low-power process and combines high-density logic with embedded transceivers, DSP blocks, and on-chip memory for bandwidth-intensive applications. According to Intel/Altera Stratix III device documentation, the "SL" suffix denotes the low-power transceiver-equipped variant tuned for ASIC-prototyping, wireline, and DSP workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, embedded memory (BRAM/M9K/M144K), DSP slices, and high-speed transceivers. FPGAs occupy a tier above general-purpose microcontrollers and below custom ASICs: they offer hardware-level parallelism, deterministic latency, and the ability to be re-programmed in the field. The Stratix III family specifically targets high-end DSP, ASIC prototyping, and high-speed serial I/O designs where density and signal integrity matter more than absolute power minimization. Key features of the EP3SL50F484C3G include 47,500 logic elements, 2,184,192 embedded RAM bits (distributed across multiple M9K blocks), 384 (18x18) multiplier blocks for DSP, and embedded transceivers supporting multi-gigabit serial protocols. The device also integrates PLLs for clock management, PCI Express hard IP blocks, and supports external memory interfaces (DDR/DDR2/QDRII+) through dedicated PHY. The 484-FBGA package provides a compact footprint suitable for high-performance PCB designs with controlled-impedance routing. The architecture combines a logic fabric based on ALMs (Adaptive Logic Modules), a hierarchical interconnect, dedicated multiplier/adder DSP blocks, and embedded transceivers capable of operation up to several Gbps. Compared to Stratix IV successors, Stratix III L retains the 40 nm process node but is widely used in mature designs where the IP and tool flow are already validated. Typical applications include ASIC prototyping, high-speed wireline backplane bridging, software-defined radio (SDR) baseband processing, video broadcast infrastructure, and military/aerospace signal processing. The 484-FBGA package suits designs where board real estate allows a moderate BGA footprint with full signal-integrity stack-up. When designing with this part, ensure the PCB stack-up supports the transceiver channel loss budget and that decoupling follows Intel/Altera's recommended PDN pattern. Quartus II is the legacy tool flow for Stratix III L (current Intel Quartus Prime no longer fully supports Stratix III - verify tool availability before new design starts). This page synthesizes distributor pricing, drop-in same-family Altera alternatives from the Site MPN catalog, and practical design considerations drawn from the Stratix III L datasheet family - information not bundled on a single manufacturer page.
EP3SL50F484C3N - 47.5K Logic Elements Stratix III L FPGA | Intel | 484-FCBGA
The Intel (formerly Altera) EP3SL50F484C3N is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements, 1,900 Kbits of embedded memory, and 296 user I/Os in a 484-ball Flip-Chip BGA (FC-FBGA) package. It is built on a 65 nm process, supports core logic operation, and is targeted at high-throughput DSP, communications, and signal-processing applications where power-per-gate efficiency matters. What is a Stratix III L FPGA? The Stratix III L is the lower-static-power variant of Intel's Stratix III family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O are configurable after manufacture. Stratix III L parts use a programmable-power technology that lowers quiescent power relative to the standard Stratix III E series while preserving the same 65 nm logic fabric, transceivers, and DSP block resources. Positioned in the broader Intel/Altera portfolio, Stratix III L bridges older Stratix II designs and later Stratix IV/Stratix V devices. Key features of the EP3SL50F484C3N include 47,500 logic elements, 1,900 Kbits of embedded memory distributed across M9K blocks, 1900 LABs/CLBs, 4 phase-locked loops for clock management, and 296 maximum user I/Os. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) and offers 24 transceiver channels operating up to 3.125 Gbps on higher-density siblings in this family. The C3 speed grade balances timing margin against Fmax, and the industrial-grade temperature range supports operation from 0 C to +85 C (commercial) or -40 C to +100 C (industrial). Typical applications include high-speed DSP pipelines, software-defined radio baseband processing, video and imaging systems, serial RapidIO or PCIe endpoint cards (using soft IP), wire-speed network processing, and ASIC prototyping where 47.5K logic elements and abundant embedded RAM suffice. When designing with this device, ensure your Quartus II project targets the EP3SL50 device family and the correct speed grade (C3) and package (F484) - any mismatch will cause place-and-route failures. Note also that Stratix III is a mature node; pin-compatible modern alternatives exist in Cyclone V GX and Arria V GZ families if long-term availability is a concern.
EP3SL50F484C4 - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
The Altera (now Intel) EP3SL50F484C4 is a member of the Stratix III L family of low-power, high-performance 65 nm FPGAs, packaged in a 484-ball FineLine BGA (FBGA) and offering 47,500 logic elements, 2,184,192 bits of embedded memory, 296 user I/Os, and 1,900 Logic Array Blocks (LABs). According to the manufacturer datasheet, the device integrates 6.5 Mbit of distributed RAM, dedicated DSP blocks, and high-speed transceivers supporting up to 717 MHz core operation, making it suitable for high-throughput signal processing and high-bandwidth I/O bridging designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to configure custom digital logic, memory hierarchies, and I/O protocols after fabrication. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. The Stratix III family is engineered around a logic-rich, power-optimized architecture that balances the per-cell static leakage of 65 nm CMOS with rich DSP and memory blocks for DSP-centric applications. Key features include 47,500 LEs, 2,184,192 embedded memory bits, 296 user I/Os, 1,900 LABs, and a high-speed transceiver capability supporting data rates up to 3.125 Gbps on the L device family. The device also integrates hard memory controllers, a programmable power technology that reduces dynamic power by up to 50% relative to previous generations, and a MultiTrack interconnect for predictable timing closure. Operating temperature spans 0C to 85C for the commercial "C" grade with 1.1 V core supply. The architecture leverages adaptive logic modules (ALMs) with 8-input fracturable look-up tables, allowing efficient implementation of wide combinational and registered logic. TriMatrix embedded memory blocks include 64 Kb MLAB, 9 Kb M9K, and 144 Kb M144K blocks that can be cascaded for deep FIFOs, packet buffers, and DSP coefficient storage. Typical applications include high-performance DSP for wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/2, Serial RapidIO, Gigabit Ethernet), broadcast video processing, and military/aerospace signal acquisition. The 296 user I/Os support parallel LVDS and DDR2/DDR3 memory interfaces without external bridge devices. When designing with this device, consider that the 484-FBGA package has a 1.0 mm ball pitch and requires 4 to 6 layer PCB stack-up with controlled-impedance routing for high-speed transceivers. Power integrity analysis is essential because the device can exceed 8 W dynamic dissipation in transceiver-heavy designs. This page synthesizes distributor pricing, drop-in Stratix III alternatives, and practical design notes not found on the manufacturer datasheet, including thermal envelope estimates for typical configuration bitstreams.
EP3SL50F484C4G - 47.5K LE Stratix III L FPGA | Intel / Altera
The Intel / Altera EP3SL50F484C4G is a 47,500-logic-element member of the Stratix III L family of 65 nm FPGAs, housed in a 484-ball FineLine BGA (FC-FBGA) package with 296 user I/Os and 2,184,192 bits of embedded memory. The device operates from a 1.1 V core supply, supports commercial temperature range 0C to +85C, and is rated for the C4 speed grade. According to Intel / Altera datasheet volume 1 (Stratix III Device Handbook), the Stratix III L family integrates programmable logic, M9K/M144K memory blocks, DSP blocks, and high-speed transceivers optimized for low total power consumption at high logic density. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic (PLD) and, by extension, digital ICs and semiconductors. Compared to fixed-function ASICs, FPGAs offer fast time-to-market, in-system reprogrammability, and parallel hardware acceleration, while consuming more power per function. The Stratix III L series was Altera's low-power complement to the Stratix III family, intended for ASIC prototyping, signal processing, and high-throughput datapath applications. Key features of the EP3SL50F484C4G include 19,000 Adaptive Logic Modules (ALMs), 2.08 Mbit of embedded memory distributed across M9K and M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and the Altera Quartus II design flow with Qsys system integration. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on the same package, enabling direct interfacing with DDR/DDR2/DDR3 memory devices without external level shifters. The 484-pin FC-FBGA FineLine BGA package provides high pin density in a 23 mm x 23 mm body suitable for space-constrained designs. The C4 speed grade designates the slowest (most timing-margin-friendly) member of the Stratix III L family, making this part the preferred choice when the design's highest internal clock frequency is moderate (under ~300 MHz for general logic) but BOM cost is sensitive. Pricing for this part begins around $181.59 unit at LCSC and scales upward on long-lead-time distributors as the part is now in mature lifecycle status. Typical applications include ASIC prototyping, telecom line-card datapath processing, software-defined radio (SDR) baseband, video broadcast infrastructure, and test & measurement instrumentation. Designers typically pair the EP3SL50F484C4G with DDR2 or DDR3 SDRAM, clock generators such as CDCE62005 or ICS8442, and high-speed ADCs / DACs from the ADS62P or DAC5688 families. When designing with this FPGA, plan power-rail sequencing for the 1.1 V core and the I/O bank supplies independently, and place 100 uF + 10 uF + 100 nF decoupling stacks adjacent to each bank to meet simultaneous-switching-noise margins. Quartus II software version 11.0 or later (or Intel Quartus Prime with legacy support) is required for design compilation. This page synthesizes distributor pricing, same-package drop-in alternatives within the Stratix III L family, and practical design notes not found on a single manufacturer datasheet page.
EP3SL50F484C4L - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera
The Intel (formerly Altera) EP3SL50F484C4L is a low-power, high-performance Stratix III L Field Programmable Gate Array (FPGA) fabricated on a 65 nm CMOS process, delivering 47,500 logic elements across 1,900 LABs (Logic Array Blocks) with 296 user I/Os in a 484-ball FineLine BGA (FBGA) package. It operates on a 0.9 V core supply and supports a junction temperature grade from 0°C to 85°C (commercial grade), with transceiver-rich variants supporting up to 717 MHz fabric performance. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) connected by programmable interconnect and surrounded by programmable I/O cells. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs: they offer hardware-level parallelism and re-programmability, allowing engineers to implement custom datapaths, DSP pipelines, memory controllers, and high-speed serial interfaces without mask costs. The Stratix III family specifically targets high-end DSP, communications infrastructure, and high-throughput signal-processing designs. Key features of the EP3SL50F484C4L include up to 2,184,192 bits of embedded memory (≈2.7 Mbit), integrated DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers on related package options, and Altera's adaptive logic module (ALM) architecture for fine-grained resource utilization. The low-power (L) variant reduces static and dynamic power relative to the standard Stratix III family while preserving fabric speed. Hardened IP blocks such as PCI Express endpoints, memory controllers (DDR/DDR2/DDR3), and SERDES channels reduce soft-logic footprint. Architecturally, the device employs eight-input ALMs that can be partitioned into smaller LUT configurations, providing up to 2.7× the logic capacity of the previous Stratix II generation per LAB. Combined with the 65 nm low-power process, this allows the device to sustain high DSP throughput (GMACS / GFLOPS) at reduced thermal envelope, making it suitable for fanless embedded applications. Typical applications include telecom baseband processing, software-defined radio (SDR) platforms, high-end video broadcast and image processing, ASIC prototyping, radar and sonar signal processing, and high-speed data acquisition systems. The 296 user I/Os at the package level support multiple parallel interface standards (LVDS, LVTTL, SSTL, HSTL) for direct connection to DDR memories, ADCs, and DACs. When designing with this device, plan the power tree carefully: Stratix III L devices require multiple voltage rails (VCCINT core, VCCPD I/O pre-driver, VCCIO I/O banks, VCCA_PLL/VCCP auxiliary) with strict sequencing and decoupling per the device handbook. Use Altera's Quartus II design suite for synthesis, place-and-route, and power analysis. Verify thermal margins using the PowerPlay Early Power Estimator before PCB layout. This page synthesizes distributor pricing from DigiKey and Mouser, lists drop-in same-package variants from the Site MPN list, and provides application-specific design notes that go beyond what appears in the standalone device datasheet.
EP3SL50F484C4LG - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484C4LG is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements, 1,900 LABs/CLBs, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-ball FineLine BGA package measuring 23x23 mm. The device is built on a 1.1 V core, 40 nm process technology and targets high-performance, logic-rich applications where static and dynamic power must be minimized without giving up DSP and transceiver throughput. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, and I/O cells, all controlled by SRAM-based configuration memory. Within Intel's portfolio, FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below structured ASICs. The Stratix III L sub-family is the static-power-optimized variant of Stratix III, sharing the same logic fabric and transceiver architecture as the standard Stratix III while reducing leakage for thermally constrained designs. The EP3SL50F484C4LG differentiates itself through a programmable power technology that allows unused logic, memory, and DSP blocks to be put into a low-power state, lowering static power by up to 50% compared to the standard Stratix III family. It supports up to 384 Kbits of distributed RAM, embedded M9K block RAM, and dedicated 18x18 multipliers for DSP, while offering user-selectable I/O standards including LVDS, LVTTL, LVCMOS, and SSTL on its 296 general-purpose I/O pins. The device includes 24 transceiver channels capable of multi-gigabit serial operation for chip-to-chip and backplane connectivity. Architecturally, the device uses Intel's Logic Element (LE) as its fundamental building block, with each LE containing a 4-input LUT, a programmable register, and carry chain logic. LABs group 10 LEs together, and the Adaptive Logic Module (ALM) variant used in later families is not present in this generation - instead, the Stratix III uses the classic LE/LAB structure optimized for register-rich pipelines. Configuration is stored in SRAM and can be loaded from external flash or via JTAG, supporting in-system reprogrammability and design security through bitstream encryption. Typical applications for the EP3SL50F484C4LG include high-performance digital signal processing cards, software-defined radio baseband engines, 40G/100G Ethernet line-card pipeline stages, ASIC prototyping, and industrial image-processing platforms. Its low static power makes it suitable for long-life telecommunications and military systems that must operate within a fixed thermal envelope. Compared with the larger EP3SL110 and EP3SL200 devices in the same family, the EP3SL50 sits at the lower end of the logic-density curve and is the most cost-optimized member while retaining the full Stratix III L feature set. Designers should pay attention to power-plane decoupling, since Stratix III L requires multiple supply rails (VCC, VCCPT, VCCAUX, VCCA_FPLL) each with their own decoupling requirements. In-System Programming via JTAG is recommended for prototypes, while production boards typically use an external flash (EPCS) device for configuration. The 484-FBGA package supports high-speed signaling but requires careful PCB stack-up design, controlled-impedance traces, and proper via-in-pad or microvia escape to maintain signal integrity at multi-gigabit rates. This page consolidates distributor pricing and parametric cross-references beyond what the manufacturer datasheet alone provides, including drop-in compatible Stratix III L variants and selection guidance between the C2, C3, C4, and I-grade speed/temperature options.
EP3SL50F484C4LN - Stratix III L FPGA, 47.5K LE, 484-FBGA | Intel
The Intel EP3SL50F484C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, offering 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/O pins. Built on a 65 nm process, it combines high-performance programmable logic with transceivers optimized for low-power operation. The device ships in the commercial temperature grade (0C to +85C) with a -4 speed grade designation. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that engineers can reconfigure after manufacturing. Stratix III L FPGAs sit within Intel's high-performance FPGA portfolio, targeted at signal processing, communications infrastructure, and ASIC prototyping workloads. The 'L' suffix denotes the lower-power variant of the Stratix III family, offering a reduced static power profile compared to the standard Stratix III devices while retaining most of the same logic and transceiver resources. Key features of the EP3SL50F484C4LN include 1,900 Logic Array Blocks (LABs), integrated transceiver support for high-speed serial protocols, dedicated DSP blocks for high-throughput arithmetic operations, and on-chip memory supporting both single-port and dual-port modes. The 484-pin FBGA package provides a compact footprint suitable for dense PCB layouts, and the -4 speed grade balances timing margin and operating frequency for mainstream applications. From an architectural standpoint, the device integrates 8-input adaptive logic modules (ALMs), embedded multipliers for DSP pipelines, and a hierarchical clock network supporting multiple PLLs. The transceiver interface supports multi-gigabit serial data rates, making the device well-suited for high-bandwidth signal processing applications. Typical applications include wireless baseband processing, software-defined radio (SDR), ASIC prototyping, high-speed data acquisition systems, and industrial control platforms. Engineers often select the EP3SL50F484C4LN for projects that require substantial logic density and memory bandwidth within a single low-power FPGA. When designing with this device, ensure the PCB footprint and ball pattern match the 484-ball FBGA specification exactly, and follow Intel's recommended power-sequencing and decoupling guidelines in the Stratix III L datasheet. Thermal management is essential at full transceiver utilization - plan copper pours and thermal vias accordingly. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F484C4N - 47.5K Logic Elements Stratix III L FPGA | Intel
The Intel EP3SL50F484C4N is a high-density Stratix III L series Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-pin FC-FBGA package. The device is built on a 65 nm CMOS process, supports an internal operating frequency up to 717 MHz, and operates from a 1.1 V core supply with hot-socketing and power-up sequencing support typical of the Stratix III family. The "C4" speed grade and "N" lead-free suffix indicate a commercial 0 °C to 85 °C temperature range with lead-free (Pb-free) ball termination. An FPGA is a semiconductor device whose digital logic functionality is defined after manufacturing via configuration bitstream loading rather than being fixed at the fab. Stratix III L belongs to Altera's (now Intel) high-performance, low-power FPGA family, sitting in the system hierarchy as: FPGA -> programmable logic device -> logic IC -> integrated circuit. Designers choose FPGAs when they need parallel processing, custom I/O timing, or hardware-accelerated DSP beyond what a microcontroller or fixed-function ASIC can deliver. Key differentiating features of this part include 47,500 Logic Elements, 2,184,192 bits of embedded RAM, 296 maximum user I/Os, a 484-ball FC-FBGA package suitable for high-density board layouts, and Stratix III L architecture that combines logic, memory, and DSP blocks. The 484-ball FC-FBGA package provides a robust flip-chip interconnect supporting gigabit transceiver rates and high signal-integrity I/O. The Stratix III L architecture integrates MultiTrack interconnect, TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and high-speed transceivers. Compared to the Stratix II generation, Stratix III L reduces dynamic power through programmable power technology while retaining register-rich fabric and rich memory/DSP ratios for DSP-heavy designs. Typical applications include telecom and networking line cards, ASIC prototyping, digital signal processing, military and aerospace signal processing, and high-performance computing accelerators. Its 47.5K LE and 2.18 Mbit memory make it well suited for mid-complexity parallel data-path implementations. When designing with this device, allocate sufficient PCB area for the 484-ball BGA escape routing and provide multiple decoupling capacitors near each power rail. Configuration mode (AS, PS, JTAG) must be selected at board level; designers should also budget for a configuration memory device such as EPCS or a supported flash, as Stratix III does not retain configuration after power-down. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet.
EP3SL50F484I3 - Stratix III L FPGA 47.5K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I3 is a Stratix III L-series Field Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 484-ball Flip-Chip FineLine BGA (FC-FBGA) package. The device supports 296 user I/O pins and operates with a core voltage of 1.1 V across the commercial 0 °C to +85 °C range, making it a low-power member of the Stratix III family intended for high-performance signal processing without the higher static power of the Stratix III E variant. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit at the hierarchy of programmable logic devices (PLDs), below complex PLDs (CPLDs) and above discrete logic. The Stratix III family specifically targets high-throughput DSP, high-speed serial I/O, and embedded processor applications where ASIC-like performance and NRE flexibility are required. The 'L' suffix denotes the low-power variant optimized for static power reduction at comparable performance. Key features include up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, TriMatrix embedded memory supporting true dual-port and FIFO configurations, and high-speed transceivers for chip-to-chip and backplane serial connectivity. The 484-ball FC-FBGA package provides a compact footprint with controlled-impedance signal routing suited to multi-Gbps serial channels. Architecturally, the EP3SL50F484I3 combines adaptive logic modules (ALMs) arranged in Logic Array Blocks (LABs) — approximately 1,900 LABs per the Mouser listing — with a MultiTrack interconnect fabric and embedded memory blocks distributed across the device for high-bandwidth local storage. The 65 nm process node keeps dynamic power manageable while the L-series design reduces static leakage through process and architectural tuning. Typical applications include high-end digital signal processing cards, radar and sonar baseband processing, software-defined radio front-ends, high-resolution video processing pipelines, and wire-speed network packet inspection. The combination of low static power and high DSP throughput also makes the EP3SL50F484I3 suitable for medical imaging systems such as ultrasound beamformers. When designing, plan for dedicated configuration circuitry and ensure the board supplies clean 1.1 V core, 2.5 V/3.3 V I/O, and PLL analog rails per the manufacturer datasheet. This page synthesizes distributor pricing, same-family alternatives, and FPGA design considerations not found in the manufacturer datasheet.
EP3SL50F484I3G - 47.5K LE Stratix III L FPGA, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F484I3G is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine Ball-Grid Array (FCBGA) package, integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 2,184,192 bits of embedded memory, and 296 user I/Os. The device is fabricated on a 65 nm CMOS process, operates from a 1.1 V core supply, and is qualified for the industrial temperature range of -40C to +100C, making it suitable for compute-intensive, power-sensitive embedded systems. According to the verified distributor data (DigiKey, Mouser, Octopart, Lisleapex), the device is offered in tray packaging and is widely stocked through authorized Altera/Intel channels. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable fabric. FPGAs occupy a distinct tier between microcontrollers (fixed-function, sequential) and ASICs (application-specific, non-reprogrammable): they deliver ASIC-class parallelism and throughput while retaining full hardware re-programmability, allowing hardware bugs to be patched in the field and accelerating time-to-market. The Stratix III family specifically targets high-performance digital signal processing, communications infrastructure, and ASIC prototyping. Key features of the EP3SL50F484I3G include up to 500 MHz core fabric performance, integrated Adaptive Logic Modules that combine fracturable look-up tables and dedicated registers, on-chip memory organized in M9K/M144K blocks for distributed buffering, and dedicated 18x18 hardware multipliers supporting DSP workloads. The Stratix III L sub-family emphasizes lower static and dynamic power versus the base Stratix III, achieved through programmable power technology that lets unused blocks enter low-leakage states. The device's architecture is built on a tile-based fabric with columnar DSP and memory resources, supporting partial reconfiguration so that one logic block can be re-programmed while others continue operating. The 484-ball FCBGA provides high-density board interconnect and is the standard package for high-I/O-count Stratix III designs, enabling dense PCB layouts for production systems. Typical applications include telecommunications baseband and bridging, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition, and industrial control and imaging. It is also used in medical imaging pipelines and test-and-measurement equipment where deterministic, parallel DSP throughput is required. When designing with the EP3SL50F484I3G, designers must implement multi-rail power sequencing for the 1.1 V core, PLL, and I/O supplies, observe strict signal-integrity guidelines for the FCBGA breakout, and account for the device's thermal envelope under sustained logic utilization. Quartus II is the supported design suite; legacy projects targeting this device should remain on a Quartus II version compatible with the Stratix III device family. This page consolidates verified distributor pricing, drop-in alternative MPNs from the same Intel/Altera Stratix III family, and practical design guidance, providing information not found in a single distributor listing or in the manufacturer datasheet alone.
EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
The Intel EP3SL50F484I3N is a 47,500-logic-element Stratix III L family Field Programmable Gate Array (FPGA) IC fabricated on a 65 nm CMOS process, delivering up to 500 MHz core performance with 296 user I/Os in a 484-ball FineLine BGA (FBGA) package at the industrial -40C to +100C junction temperature range. The device integrates 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 218 embedded 18x18 multipliers, providing a balanced mix of logic density, on-chip memory, and DSP throughput. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device that engineers configure after manufacture to implement custom digital logic, DSP blocks, memory controllers, and high-speed serial interfaces. FPGAs sit at the top of the digital IC hierarchy: programmable logic device -> FPGA -> high-performance programmable logic. Unlike an ASIC or a fixed-function microcontroller, an FPGA's interconnect and logic fabric are rewritable in-system, making it ideal for prototyping, low-volume production, and applications that demand hardware-level parallelism such as signal processing, packet inspection, and high-speed I/O bridging. Key features of the EP3SL50F484I3N include 47,500 logic elements, 2.1 Mbit embedded SRAM distributed across M9K memory blocks, dedicated 18x18 hardware multipliers for DSP, programmable signal integrity support with adaptive logic modules (ALMs), and Stratix III's low-power core logic with hot-socketing capability. The 484-pin FBGA (23x23 mm, 1.0 mm pitch) package supports high-speed transceiver-friendly board layouts while maintaining PCB escape routability. The Industrial temperature grade is denoted by the trailing 'I' in the part number. From an architectural standpoint, the Stratix III L family uses an ALM-based logic fabric rather than the legacy 4-input LUT architecture, delivering higher packing density and lower dynamic power at equivalent performance. The device supports LVDS, SSTL, HSTL, and LVPECL I/O standards and integrates up to 8 phase-locked loops (PLLs) for multi-domain clock management. Typical applications include high-performance digital signal processing, telecommunications baseband and packet processing, military and aerospace signal intelligence, test and measurement instrumentation front-ends, medical imaging accelerators, and high-speed serial protocol bridging. Designers choose the EP3SL50F484I3N when Stratix III L density with industrial temperature grading is required and the design will be migrated to Quartus II design software. A critical design consideration: the EP3SL50F484I3N is part of the legacy Stratix III family, which is in long-term support mode. New designs should evaluate Cyclone IV/V or Stratix 10 alternatives, but existing hardware designs can continue to use this part with mature Quartus II tooling.
EP3SL50F484I4 - 47.5K LE Stratix III L FPGA | Intel | 484-FBGA
The Intel (formerly Altera) EP3SL50F484I4 is a Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 47,500 logic elements, 1,900 Logic Array Blocks (LABs), and 2,184,192 bits of embedded memory into a 484-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. Per the Stratix III Device Handbook, the device is targeted at low-power high-performance applications and supports up to 296 user I/O pins with MultiTrack interconnect and TriMatrix embedded memory blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing hardware designers to implement arbitrary digital logic, DSP pipelines, and memory structures after PCB fabrication. Stratix III FPGAs sit within Intel's programmable logic hierarchy: FPGA -> programmable logic device -> PLD -> semiconductor IC. The 'L' sub-family is engineered for the lowest static power among Stratix III variants while retaining high performance through hard-coded memory and DSP blocks, making it a common choice for power-sensitive telecom, broadcast, and industrial designs. Key features include 8-input Adaptive Logic Modules (ALMs), MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory with three block sizes (MLAB, M9K, M144K), up to 296 general-purpose I/Os supporting numerous I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and dedicated DSP blocks capable of operating at hundreds of MHz. The device supports configuration via JTAG, Passive Serial, Fast Passive Parallel, and Passive Parallel Async modes, and integrates hard PCIe, external memory controllers, and SERDES blocks within the family. From an architecture standpoint, Stratix III L devices implement programmable power technology with hot-socketing and a 1.1 V core supply. Designers typically use the Quartus II design suite to compile, simulate, and configure the part. Internal signal integrity is managed by the MultiTrack routing fabric, while I/O performance is supported by per-pin programmable slew rate and bus hold circuitry. Typical applications include high-performance digital signal processing for wireless baseband, video broadcast and image processing pipelines, industrial control and automation, high-speed serial protocol bridging, and ASIC prototyping. The wide operating temperature range of -40C to +100C (industrial grade, indicated by the 'I' suffix) plus 1.1 V core voltage suits embedded and telecom hardware. When designing with this device, ensure the PCB footprint matches the 484-pin FC-FBGA land pattern (1.0 mm pitch) and that the Quartus II pin assignments account for dedicated clock, JTAG, and configuration pin locations. Power-rail sequencing must follow Intel's Stratix III power-on reset requirements to prevent configuration corruption. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL50F484I4G - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel EP3SL50F484I4G is a high-performance, low-power Stratix III L family Field-Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 47,500 logic elements, 1,900 LABs/CLBs, and 2,184,192 bits of embedded memory in a 484-pin FineLine BGA (FC-FBGA) package measuring 23 x 23 mm. The device operates from a 1.1 V core supply and supports up to 296 user I/O pins for high-bandwidth system integration, with user I/O voltages programmable to common standards such as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVTTL/LVCMOS. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined post-fabrication by a user-loaded configuration bitstream. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs, offering ASIC-class parallel processing throughput without the NRE cost of mask-set fabrication. The Stratix III family specifically targeted high-performance logic, digital signal processing (DSP), and embedded designs that demand multi-Gbps transceivers, rich on-chip memory, and DSP blocks in a single silicon device. Key features include a maximum internal operating frequency of approximately 450 MHz, dedicated 18 x 18 multipliers and DSP blocks for high-throughput arithmetic, on-chip memory totaling 2,184,192 bits distributed across M9K/M144K blocks, and support for high-speed external memory interfaces (DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM). The 484-pin FBGA package provides 296 general-purpose I/O, with Programmable Drive Strength, slew-rate control, and dynamic on-chip termination (OCT) optimizing signal integrity on dense, high-speed parallel buses. From an architectural standpoint, the Stratix III L variant of the EP3SL50 trades the high-speed transceivers of the standard Stratix III for lower static and dynamic power, making it well suited to systems where the design is logic/DSP bound rather than serial-link bound. The ALM-based logic fabric, multi-tier routing hierarchy, and per-LAB power management (via the Quartus II Programmable Power Technology feature) allow unused regions of the device to enter low-power states while active logic continues at full speed. Typical applications include high-performance digital signal processing (radar baseband, beamforming, software-defined radio front ends), high-speed packet processing in networking line cards, military/aerospace signal processing, medical imaging (ultrasound beamformers, CT reconstruction engines), and ASIC prototyping where designers map RTL directly onto the FPGA before tape-out. The 484-BGA package is also attractive for production-grade designs that require a thermally enhanced flip-chip substrate with controlled impedance for DDR3 interfaces. When designing with this part, engineers must pay attention to power-rail sequencing (1.1 V core must ramp before 2.5 V/3.3 V I/O supplies per Altera reference designs), thermal management of the FC-BGA substrate, and pin-out compatibility with the wider Stratix III family to enable migration between EP3SL50, EP3SL110, and EP3SL200 densities without PCB rework. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F484I4L - 50K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I4L is a low-power member of the Stratix III FPGA family, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 484-ball FineLine BGA (FCBGA) package. The 'L' suffix denotes the low-power static core variant, the 'F484' identifies the 484-ball FBGA package, the 'I4' indicates industrial temperature range (–40 °C to +100 °C case) with speed grade 4, and the trailing 'L' marks lead-free / RoHS-compliant terminal finish. An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits between fixed-function ASICs and general-purpose processors in the silicon hierarchy: FPGAs -> programmable logic -> semiconductor. Engineers instantiate custom digital circuits in LUTs (look-up tables), route them through a programmable interconnect fabric, and accelerate parallel datapaths that would otherwise force a CPU or DSP into cycle-bound execution. The Stratix III L sub-family specifically targets power-sensitive applications such as wireless baseband, software-defined radio, and high-end image processing, where static and dynamic power must both be tightly controlled. Key features include 47,500 logic elements, 2,184,192 bits of embedded RAM (~273 KB), 296 user I/O pins, on-chip transceivers (per Stratix III family architecture), DSP blocks, and Stratix III's signature programmable power technology that lets unused tiles enter a near-zero static state. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, and integrates hard IP for PCI Express Gen1/Gen2 endpoints. Speed grade 4 is a mid-bandwidth bin, while the industrial temperature rating permits operation in chassis and outdoor enclosures. Architecturally, the EP3SL50F484I4L uses TSMC's 65 nm low-power process with Altera's adaptive logic modules (ALMs), each containing two combined LUTs and two dedicated adders. TriMatrix embedded memory provides three port widths and depths per block, and the MultiTrack interconnect fabric delivers predictable timing closure for large fan-out datapaths. The 'L' core statically saves 50% of dynamic power compared to the standard Stratix III core at equivalent performance. Typical applications include software-defined radio baseband processing, LTE / WCDMA channel-card line-rate processing, military secure communications, ASIC prototyping, and high-throughput industrial imaging pipelines. The wide I/O count (296) is suitable for parallel LVDS or DDR3 memory interfaces where many lanes are required simultaneously. When designing with this device, always supply all Stratix III core, I/O, and auxiliary rails (VCCINT, VCCD_PLL, VCCIO per bank, VCCAUX, VCCPGM) with proper decoupling. Configuration via passive serial, fast passive parallel, or JTAG is supported; route CONF_DONE and nSTATUS to a pull-up so the FPGA does not remain in an undefined state after power-up. Use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and power estimation. This page combines distributor pricing, same-family drop-in alternatives, and practical design notes drawn from Intel's Stratix III handbook and Quartus II device documentation, providing context not available on the manufacturer product page alone.
EP3SL50F484I4LG - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera (Intel)
The Altera (Intel) EP3SL50F484I4LG is a Stratix III L FPGA with 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-ball FCBGA package. It targets high-performance digital logic designs that require high logic density, large on-chip memory, and rich transceiver support in a power-optimized architecture. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic, memory blocks, and DSP functions through a hardware description language. Within the broader semiconductor taxonomy, FPGAs sit between ASICs and processors: programmable like a processor, but parallel and deterministic like an ASIC. The Stratix III family uses a power-optimized 40nm process that reduces dynamic power roughly 30% versus prior Stratix generations while preserving the high logic capacity that Stratix devices are known for. Key features of the EP3SL50F484I4LG include 47,500 logic elements (LEs), 2,184,192 bits (273 KB) of embedded RAM, embedded multipliers and DSP blocks for high-throughput arithmetic, dedicated PLL and clock-tree resources, and 296 general-purpose user I/Os. The device supports up to 12 transceiver channels in higher Stratix III L SKUs, with the L suffix denoting the low-power variant of the family. The Stratix III L architecture uses Programmable Power Technology that automatically switches logic on or off based on the operating frequency, allowing unused logic to draw near-zero leakage. This makes the EP3SL50F484I4LG suitable for high-utilization designs that would otherwise over-budget power in older FPGA families. Typical applications include high-throughput DSP pipelines (radar, beamforming, video processing), high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, GBE), ASIC prototyping, and telecom baseband pre-processing. The 296 user I/Os are typically distributed across multiple I/O banks to support mixed voltage standards (LVDS, LVTTL, HSTL, SSTL). When designing with this device, pay close attention to decoupling, signal integrity on the FCBGA breakout, and transceiver reference-clock routing. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor stock, same-package drop-in alternatives from the Stratix III family, and practical design considerations not collated in the manufacturer datasheet.
EP3SL50F484I4LN - 47,500-Cell, 717MHz Stratix III FPGA
Altera EP3SL50F484I4LN is a high-density Stratix III L field-programmable gate array built around 47,500 logic cells, with 2,184,192 bits of embedded memory and 296 user I/O. The verified device data identifies a CMOS FPGA in a 484-ball plastic BGA, commonly designated FBGA-484 or 484-BBGA, FCBGA, and a listed clock frequency of 717 MHz. This combination suits high-throughput digital systems requiring configurable logic, substantial on-chip storage, and a large package-level interface. A field-programmable gate array is an integrated circuit containing programmable logic elements, routing resources, memory blocks, and configurable I/O. Engineers configure the device after PCB assembly to implement digital processing, control, interface, or protocol functions. Within the semiconductor hierarchy, the device belongs to FPGA & CPLD, followed by programmable logic IC, integrated circuit, and ultimately semiconductor. Its logic density and embedded memory distinguish it from smaller CPLDs and fixed-function application-specific integrated circuits. The headline resources are 47,500 cells, 2,184,192 memory bits, and 296 I/O pins. Mouser additionally identifies 1,900 LABs, while distributor data describes 2,184,192 memory bits and 47,500 logic elements. These resources support parallel datapaths, buffering, state-machine implementation, and interfaces that exceed the practical capacity of modest programmable-logic devices. The 717 MHz figure provides a high-frequency reference for evaluating timing performance, although application-specific clock rates require the manufacturer timing specifications. Architecturally, Stratix III devices combine programmable logic arrays with embedded memory and programmable I/O structures. This allows logic functions and memory-intensive subsystems to coexist on one configurable platform. The FPGA can implement parallel processing without consuming the same number of general-purpose processor cycles, while its programmable I/O supports system-level integration. Configuration memory must be loaded with a user-generated bitstream before normal operation, and board design must preserve the required configuration interface. Typical applications include telecommunications equipment, industrial automation, test and measurement, image and signal processing, and high-speed communications infrastructure. A 296-I/O interface is valuable for systems that aggregate many parallel channels, memory controls, or external converters. The 2,184,192-bit embedded-memory capacity also benefits buffering, packet processing, and state-rich control logic. Buyers should confirm speed-grade, configuration, thermal, signal-integrity, and software-tool requirements before release to production. A key design trade-off is package density versus assembly complexity. The 484-ball BGA requires controlled PCB fabrication, via and escape routing, and appropriate assembly capability; the large 23 mm by 23 mm package footprint is not interchangeable with a smaller FPGA package. Power integrity, simultaneous switching noise, decoupling, and thermal management also become more significant as logic utilization and clock rates increase. Validate the final design using Intel or Altera design tools and the applicable device documentation. This product page consolidates the verified distributor specifications, commercial availability signals, package identity, and same-brand drop-in comparison candidates. Unlike a bare distributor listing, it also distinguishes exact-family pin-compatible ordering options from broader functional comparisons and identifies where timing, power, configuration, or qualification data still requires manufacturer-document verification.
EP3SL50F484I4N - Stratix III L FPGA 47.5K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I4N is a high-performance Stratix III L series Field Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. The device integrates 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 2,184,192 bits of embedded memory, delivering mid-range programmable logic capacity for high-throughput digital designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, transceivers, and PLLs. FPGAs occupy a distinct position in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below software-driven processors in ease of design changes. Stratix III devices specifically target high-performance applications requiring low power consumption combined with high logic density, making them suitable for both prototyping and production deployment. Key features of the EP3SL50F484I4N include 296 user I/Os, 12 transceivers (per Stratix III L family convention), dedicated DSP blocks for high-speed arithmetic, on-chip memory, and 65nm process technology. The I4N suffix indicates an industrial temperature grade (-40C to +100C), logic speed grade 4, and lead-free packaging. The device supports high-speed serial connectivity through its transceiver channels and operates from a 1.1V core supply. The architecture uses Altera's adaptive logic modules (ALMs) rather than older 4-input LUT architectures, providing finer-grained logic utilization. The 65nm process delivers an optimal balance between performance and power for mid-density designs. Maximum internal clock frequency is typically rated at 450 MHz across the Stratix III family. Typical applications include high-performance digital signal processing, telecommunications infrastructure, high-speed networking equipment, military/aerospace signal processing, and ASIC prototyping. Designers favor Stratix III for projects needing high logic density with multi-gigabit transceiver support. Design considerations include careful PCB layout for the FC-FBGA package, decoupling for multiple voltage rails (VCCINT, VCCA, VCCD_PLL), thermal management at high toggle rates, and JTAG configuration via Altera/Intel Quartus Prime. The 1.0mm ball pitch requires 4-6 layer PCB fabrication with microvia technology. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.