FPGA与CPLD
产品（6666)
XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD
The AMD (formerly Xilinx) XC6SLX9-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) IC integrating 9,152 logic cells, 589,824 bits of block RAM, and 186 user I/Os into a 256-ball FTBGA package with 1.0 mm pitch and 17 x 17 mm body. Built on a 45 nm CMOS process with a 1.2 V core supply, the device operates in the industrial temperature range of -40C to +100C and is offered in the -2 speed grade for balanced performance and power. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, complemented by hardened peripherals such as block RAM, DSP slices, PLLs, and transceivers. FPGAs sit between standard logic ICs and ASICs in the programmable logic hierarchy: unlike ASICs they require no mask set and can be reconfigured in-circuit, while offering far higher density and performance than discrete CPLDs. The Spartan-6 LX family targets cost-sensitive, high-volume applications by integrating common system functions (memory controllers, PCIe, Ethernet MAC) into the silicon. Key features of the XC6SLX9-2FT256I include 16 DSP48A1 slices for fixed- and floating-point arithmetic, 16 Logic Slices per CLB with carry-chain support, dedicated block RAM supporting dual-port operation, and SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL I/O standards. The device includes 2 PLL clock managers and supports up to 667 MHz internal operation, making it suitable for digital signal processing, motor control, video bridging, and embedded control planes. The -2 speed grade balances the highest performance with the lowest power consumption across the Spartan-6 LX family. Power management is enabled through a 1.2 V core supply, a separate auxiliary supply, and an I/O supply that can be set independently from 1.2 V to 3.3 V, allowing direct interface to legacy 5 V-tolerant buses through external clamping. Configuration is supported via JTAG (IEEE 1149.1 / IEEE 1532), SPI, BPI, and the dedicated Xilinx multi-boot modes. Typical applications include industrial motor drives, factory automation controllers, medical imaging pre-processing, broadcast video processing, low-density telecommunications line cards, and embedded control planes in avionics and defense systems. The 256-FTBGA package suits designs that need high I/O count (186 user I/Os) on a moderate PCB area while keeping JTAG-driven configuration simple. When designing with this FPGA, ensure decoupling follows the Spartan-6 PCB Design Guide (UG393), with a 1.0 uF + 0.01 uF pair per supply pin placed within 5 mm of the BGA ball. JTAG chain integrity must be checked at low temperature to avoid boundary-scan failures at industrial cold-start. For long-life programs requiring multi-decade supply continuity, plan a migration path now because Spartan-6 is in long-term support but not recommended for new designs. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the AMD datasheet alone, helping procurement and hardware engineers verify availability and select a pin-compatible alternative for long-life designs.
XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx
The AMD/Xilinx XC6SLX9-2FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) built on a mature 45 nm low-power copper CMOS process, delivering 9,152 logic cells, 1,430 adaptive logic modules (ALMs), and 576 Kbits of embedded block RAM in a 256-ball fine-pitch thin BGA (FTG256) package measuring 17 x 17 mm with 1.0 mm ball pitch. It targets the -2 commercial speed grade with internal performance up to 667 MHz and is specified for commercial 0 C to 85 C operation. The part provides 186 user I/Os through the FTG256 footprint and integrates dual-register 6-input LUT logic alongside a rich set of built-in system-level blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and occupy the high-density end of that family. Spartan-6 LX parts are specifically optimized for logic-intensive, cost-sensitive applications rather than the transceiver-rich Spartan-6 LXT family, delivering half the power consumption of previous Spartan generations while expanding densities from 3,840 up to 147,443 logic cells across the family. Key features include 15 dedicated 18 x 18 multiplier/DSP slices, 32 Kbits of distributed RAM, integrated DCM and PLL clock tiles, hard PCIe endpoint support in higher-density family members, and SelectIO technology supporting a wide range of I/O standards including LVCMOS, LVDS, and HSTL. The 45 nm process enables lower static and dynamic power compared with the prior Spartan-3A generation, and the -2 speed grade offers a balanced trade-off between performance, power, and cost. The XC6SLX9-2FTG256C uses a 6-input LUT architecture with two flip-flops per LUT for efficient pipelining, plus dedicated carry logic for arithmetic and dedicated multiplier blocks for DSP. Configuration is supported through SPI, JTAG, and BPI flash modes, and the silicon includes built-in bitstream encryption and CRC checking for production designs. Typical applications include industrial motor control and machine vision, low-cost display controllers, consumer video processing, USB/Ethernet bridging, SPI-to-parallel glue logic replacement, LED video walls, and low-volume ASIC prototyping. The wide I/O count and DSP blocks also make it suitable for software-defined radio front-ends and small-form-factor industrial IoT controllers that require deterministic parallel processing. When designing with this part, ensure the FTG256 PCB land pattern follows JEDEC MS-034 with 1.0 mm pitch and that decoupling uses at least 100 nF + 4.7 uF per power rail within 5 mm of the balls. Multi-rail sequencing, JTAG chain ordering, and configuration mode pin strapping should be reviewed against UG380 before layout commitment. This page synthesizes distributor stock and pricing, drop-in FPGA alternatives with verified package compatibility, and practical design notes that complement the Xilinx Spartan-6 family documentation set (DS160 and UG380).
XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems. Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C. The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs. Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area. When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.
XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
The AMD (Xilinx) XC6SLX9-2TQG144C is a Spartan-6 LX field-programmable gate array (FPGA) providing 9,152 logic cells, 102 user I/Os, and 715 Configurable Logic Blocks (CLBs) in a 144-pin TQFP (TQG144) package. Built on a mature 45 nm low-power copper CMOS process, this speed-grade -2 commercial-temp part integrates 589,824 system gates and supports DCM/PLL clock management at up to 375 MHz internal performance. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter. Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly. Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families. Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing. When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.
XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD
The AMD (Xilinx) XC6SLX9-2TQG144I is a logic-optimized Spartan-6 LX Field-Programmable Gate Array (FPGA) IC delivering 9,152 logic cells, 102 user I/O pins, and 576 Kbits of block RAM in a 144-pin TQFP (TQG144) package with 0.5 mm pitch. The "-2" speed grade targets a balance between performance and power efficiency, and the "I" suffix designates the industrial operating temperature range of -40C to +100C. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks (BRAM, DSP, transceivers) that engineers can reconfigure post-manufacturing. FPGAs sit above microcontrollers and ASICs in the programmable logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism with full design flexibility. The Spartan-6 family specifically targets cost-sensitive, high-volume logic, embedded, and DSP applications. Key features of the XC6SLX9-2TQG144I include 9,152 logic cells (1,430 ALMs / 715 CLBs), 576 Kbits of block RAM, 16 DSP48A1 slices, 102 user I/O, and integrated configuration options supporting SPI, BPI, and JTAG modes. The device includes on-chip clock management (DCMs and PLLs) and supports DDR, DDR2, DDR3, and LPDDR external memory interfaces, enabling it to bridge to modern system memory. Built on a mature 45 nm low-power copper CMOS process, the XC6SLX9-2TQG144I is engineered for low static and dynamic power dissipation. The 1.2V core voltage with separate I/O bank voltages (1.2V-3.3V) lets designers mix logic levels on a single chip. The TQG144 package is the high-volume cost-optimized footprint, suitable for cost-sensitive designs that don't need the transceivers of the LXT family. Typical applications span industrial control and motor drive, automotive infotainment and driver assistance (non-safety), consumer video processing, software-defined radio, low-cost ASIC replacement, and bridge/IO expansion. Compared with a microcontroller, the FPGA delivers true parallel processing and deterministic latency, critical for video pipelines and DSP. When designing, plan for a multi-rail power supply (1.2V VCCINT + per-bank VCCO) and respect the JTAG programming and configuration sequencing requirements documented in the Spartan-6 configuration user guide. For new designs, evaluate whether a Spartan-7 XC7S6/XC7S15 or Artix-7 XC7A15T would deliver better cost-per-logic and updated silicon. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx
The AMD / Xilinx XC6SLX9-3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 configurable logic cells, 715 configurable logic blocks, 667 MHz internal frequency, and 186 I/O sites in a 256-ball FTBGA package. It is manufactured on a 45 nm CMOS process and is identified by the supplied data as an industrial-temperature device operating from 0°C to 85°C. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are defined after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, alongside CPLDs and ASICs. Unlike a fixed-function ASIC, an FPGA can accommodate multiple digital interfaces and control functions, but timing, resource allocation, pin constraints, and power behavior must be validated in the selected design tools. The XC6SLX9 combines 9,152 logic cells, 715 CLBs, and 186 I/O sites. The -3 suffix identifies the highest-performance Spartan-6 LX speed grade cited in the supplied results. The FT256 package is a 17 mm by 17 mm FTBGA with 1 mm pitch, while the trailing I denotes the industrial temperature grade. One supplied source reports a 862 MHz figure, while another reports 667 MHz; this record uses the explicitly indexed 667 MHz value and does not treat the conflicting figure as an additional verified rating. Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, sensor processing, and general-purpose digital signal conditioning. The 186-I/O count can support parallel control buses, counters, status inputs, communications interfaces, and external memory connections when pin multiplexing and timing permit. Resource utilization must be checked in ISE Design Suite or the approved AMD FPGA tool flow rather than inferred from logic-cell count alone. This 256-ball BGA package requires a multilayer PCB with controlled escape routing and package-specific ball assignment. Pinout details, configuration requirements, bank voltage limits, decoupling, and differential-pair rules must come from the official Spartan-6 documentation and package files. The available web results do not provide a genuine manufacturer PDF URL, a complete verified ball map, lifecycle notice, or qualified pricing table, so those fields remain unverified. This page consolidates the supplied distributor specifications, comparison candidates, sourcing observations, and design cautions. It adds engineering context around package migration, speed-grade differences, timing validation, and BGA layout while clearly separating verified facts from data that still requires manufacturer-document confirmation.
XC6SLX9-3TQG144C - 9,152-LC Spartan-6 LX FPGA | AMD
The AMD XC6SLX9-3TQG144C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 102 user I/O, a -3 speed grade, and a 144-LQFP package. It is designed for cost-sensitive, high-volume embedded systems that require programmable logic, parallel interfaces, control, and modest signal-processing capability without the resource count of a larger FPGA. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, and dedicated input/output resources on one device. The Spartan-6 LX family targets low-cost designs while retaining the flexibility to implement control logic, protocol handling, data acquisition, and hardware acceleration. The verified listing identifies 102 I/O, 589824 embedded-memory bits, 9152 logic cells, and a 144-LQFP package. The -3 suffix denotes the highest-performance speed grade in the supplied Spartan-6 comparison information. A separate search result reports a 667 MHz internal frequency and a 0 to 85 C operating-temperature range, but those values require confirmation against the appropriate official device data before final design release. Typical uses include industrial automation, motor control, machine-vision interfaces, sensor acquisition, protocol conversion, communication infrastructure, and embedded control systems. The package exposes 144 pins for power, ground, configuration, clock, and user-I/O connections. Exact pin names, bank voltage limits, configuration pins, and package dimensions were not supplied in the verified excerpts and must be taken from the official AMD Spartan-6 package pinout files. For a new design, use the AMD package pinout file and the device-specific Spartan-6 documentation before assigning pins. Confirm that every powered bank, configuration signal, clock source, and I/O standard satisfies the design's voltage and timing requirements. The mature 45 nm Spartan-6 architecture is also supported by established FPGA tool flows, although tool-version and device-support details should be verified separately.
XC6SLX9-3TQG144I - Spartan-6 LX FPGA | AMD
The AMD XC6SLX9-3TQG144I is a Spartan-6 LX field-programmable gate array (FPGA) with 9,152 logic cells, 102 I/O, 144 pins, and a TQG144 surface-mount package. The verified distributor data identifies the device as an FPGA IC and lists 9,152 logic cells, 102 I/O, and a 144-LQFP package. It is positioned for cost-sensitive embedded designs requiring configurable logic, parallel interfaces, control functions, and moderate digital processing. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. Within the device hierarchy, the XC6SLX9 belongs to Spartan-6 LX, which combines FPGA fabric with application-specific resources for embedded control, communications, signal conditioning, and system integration. The -3 suffix identifies the performance grade, while TQG144 identifies the package configuration; the final I suffix identifies the supplied temperature-grade variant. Verified data identifies the part as a Spartan-6 LX FPGA suitable for industrial automation and control systems, including motor control, machine vision, and sensor data processing. The 9,152 logic-cell count provides a useful indication of the programmable fabric density, while 102 I/O supports systems requiring numerous external connections. The -3 speed grade is also identified in the comparison search result as the highest-performance grade among the referenced Spartan-6 LX speed options, but timing and power details require the manufacturer datasheet for exact design use. The TQG144 package is a 144-pin surface-mount LQFP/TQFP-class package suitable for conventional PCB assembly. Unlike a BGA package, its perimeter leads are visually inspectable after assembly and compatible with accessible routing and inspection processes. Exact package dimensions, pin names, voltage ratings, supported I/O standards, clock resources, and configuration requirements are marked as needed when absent from the supplied verified data. Typical design considerations include confirming the required Spartan-6 configuration bitstream, validating every pin against the package pinout, decoupling each supply rail according to the manufacturer guidance, and checking timing closure for the selected clock and interface paths. Because the supplied snippets do not provide a complete manufacturer pin table, this record does not infer individual pin functions. This page combines verified distributor specifications, an official package-pinout source reference, commercial availability data, and drop-in replacement analysis. It distinguishes confirmed facts from parameters that require the complete AMD Spartan-6 datasheet, helping engineers evaluate XC6SLX9-3TQG144I without treating incomplete distributor snippets as complete electrical documentation.
XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD
The AMD Xilinx XC6SLX9-N3FT256C is a Spartan-6 LX field-programmable gate array (FPGA) built on 45 nm technology, with 9,152 configurable logic cells, 589,824 RAM bits, 186 I/O, and a 256-FTBGA package. Its 1.2 V supply operation and 256-ball surface-mount package make it a compact programmable-logic platform for embedded control, communications, signal processing, and industrial systems. The verified distributor listing identifies the part as a Spartan-6 LX FPGA with 9152 cells and a 256-LBGA package, while the comparison source specifies 186 I/O. A field-programmable gate array is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. An FPGA belongs to the broader category of programmable logic devices, alongside complex programmable logic devices and application-specific integrated circuits. Its architecture combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and digital signal processing blocks. This allows hardware functions to be adapted to different protocols, control algorithms, or product revisions without changing the underlying PCB in the same way a fixed-function ASIC would require. The Spartan-6 LX family is positioned for cost-sensitive, high-volume embedded applications. The XC6SLX9-N3FT256C combines 9,152 logic cells with 589,824 RAM bits and 186 I/O in a 17 x 17 mm-class 256-FTBGA package, according to the provided component data. The N3 speed-grade designation is reported by the distributor search, but timing, power, temperature, and absolute maximum ratings are not supplied in the verified excerpt; those values must be confirmed in the manufacturer documentation before design release. Typical implementation paths include parallel data acquisition, sensor conditioning, motor and motion control, industrial communication bridges, embedded display control, and low-cost instrumentation. The 256-FTBGA package favors designs with dense routing and high I/O counts, but it requires careful ball-grid layout, via-in-pad or escape-routing planning, and assembly-process control. The 186 I/O count is particularly relevant when a system needs substantial parallel connectivity without adding a separate large package. For a new design, first verify the exact pinout, bank voltages, supported I/O standards, configuration interface, clock requirements, and decoupling recommendations in the official AMD Spartan-6 documentation. Do not infer pin function or board-level electrical limits from distributor listings alone. If an existing XC6SLX9 design is being replicated, compare the exact device speed grade and package variant before substitution, because FTG and FT package suffix differences can affect sourcing or ordering interpretation. This page consolidates verified distributor specifications, package identity, sourcing links, and practical FPGA integration guidance. It deliberately separates confirmed facts from parameters that remain unavailable in the supplied search evidence, helping engineers identify procurement and design-validation tasks before committing a Spartan-6 LX board to production.
XC6SLX9-N3FT256I - 9K Logic FPGA, 186 I/O | AMD
AMD XC6SLX9-N3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 logic elements, 186 I/O, 589,824 RAM bits, and 256-ball BGA packaging. The verified product listing identifies 186 I/O, 9,152 logic elements, 589,824 RAM bits, and a 256-LBGA package. A Spartan-6 FPGA is a programmable-logic semiconductor used to implement parallel data paths, control logic, state machines, interfaces, and signal processing. It belongs to the FPGA and CPLD hierarchy, combines configurable logic with programmable I/O, and is programmed through a configuration chain or memory interface. This makes the device suitable for embedded control, communications, instrumentation, industrial automation, and test equipment. The part identifier identifies an XC6SLX9 device in the N3 speed and FT256 package variant. The verified listing reports 186 I/O, 9,152 logic elements, and 589,824 RAM bits. The package is identified as 256-LBGA, while one cross-reference result describes it as a 256-FTBGA surface-mount package measuring 17 mm by 17 mm. Pin-level placement and all 256 ball assignments require the official package pinout data before board layout is approved. The -N3 portion is associated with the device’s specified speed and temperature grade in the manufacturer ordering information, but the supplied web data does not provide a complete timing table, operating-temperature range, power table, or lifecycle statement. Those parameters should be taken from the relevant Spartan-6 device datasheet and package files rather than inferred from the distributor listings. The cross-reference data identifies the same XC6SLX9-N3FT256I part in a 256-FTBGA package with 1.14 V to 1.26 V supply voltage and a -40°C to 100°C operating junction-temperature description. Typical design use includes industrial control systems, communication interfaces, data acquisition, test-and-measurement equipment, and embedded instrumentation. Configuration storage, clocking, bank voltage, I/O standards, and decoupling must be planned together because incorrect bank voltage or signal-integrity assumptions can prevent reliable operation. For replacements, the exact package, pinout, speed grade, temperature grade, memory resources, and configuration compatibility are decisive. This page consolidates verified distributor listings, package information, cross-reference results, and engineering guidance. It does not invent missing electrical, timing, lifecycle, or pinout values; unavailable specifications remain marked for validation against AMD documentation.
XC7A100T - Artix-7 FPGA 101K Logic Cells | AMD
The AMD (Xilinx) XC7A100T is a mid-range member of the Artix-7 family of Field Programmable Gate Arrays (FPGAs) fabricated on TSMC 28nm HPL process, delivering the lowest power and cost per logic cell in the 7-series lineup. The base MPN covers speed grades -1, -2, -3 and commercial/industrial temperature ranges in packages CSG324, FTG256, FGG484, and FGG676. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that customers configure after manufacturing, enabling custom digital hardware without ASIC development cost. FPGAs sit above CPLDs in capacity and below ASSPs in specificity; the Artix-7 family is positioned as a low-cost, low-power FPGA for high-volume, cost-sensitive systems. Key features of the XC7A100T include 101,440 logic cells (15,850 slices with 6-input LUTs), 4,860 Kb of block RAM, 240 DSP48E1 slices supporting 25x18 multipliers with 48-bit accumulators, 6 clock management tiles (CMTs), and up to 210 user I/O in the CSG324 package. The T suffix denotes transceiver-capable devices supporting serial line rates up to 6.6 Gbps (GTP) in select packages. Integrated hard IP includes PCIe blocks, an XADC 12-bit analog-to-digital converter, and hardened DDR3 memory controller support, reducing external component count. Architecture highlights: CLBs combine two slices with fast carry chains; the block RAM is cascadable as dual-port RAM, ROM, or FIFO; and the DSP48E1 pipeline supports FIR filters and FFTs for software-defined radio and video processing. Mixed-voltage I/O banks support LVCMOS, LVDS, HSTL, and SSTL standards, with 3.3V compatibility for legacy interfaces. Typical applications include software-defined radio, motor control, industrial networking, medical imaging, video and image processing, aerospace and defense prototyping, and education platforms such as the popular Basys/Nexys boards. Its performance-per-watt also suits edge computing and IoT gateways. Design consideration: the device requires multiple rails (VCCINT 1.0V, VCCAUX 1.8V, VCCO per bank) with defined power sequencing and thorough decoupling. Use the AMD Vivado design suite for synthesis and refer to DS181 (Artix-7 DC and AC Switching Characteristics) for timing data. Pricing as of 2026-08-29 from DigiKey and LCSC.
XC7A100T-1CSG324C - Artix-7 FPGA, 101K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A100T-1CSG324C is a high-performance Artix-7 family FPGA delivering 101,440 logic cells, 240 DSP slices, and 4,860 Kb of block RAM in a 324-ball CSG (Chip Scale BGA) package. It operates with a core voltage of 1.0V and supports I/O standards up to 3.3V, making it suitable for cost-sensitive, high-volume applications requiring programmable logic. Data verified as of 2026-08-04. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementations. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the semiconductor industry. They offer a balance between the flexibility of software and the performance of fixed-function ASICs, enabling rapid prototyping and hardware acceleration. Key features include 285,000 system logic cells (equivalent), 240 DSP48E1 slices for digital signal processing, and 4,860 Kb of fast block RAM. The device supports a wide range of I/O standards including LVCMOS, LVDS, and HSTL, with up to 210 user I/O pins in the CSG324 package. The -1 speed grade provides a balance of performance and power, with a maximum clock frequency of approximately 400 MHz for internal logic. The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, offering low static power consumption and high logic density. The device includes integrated PCIe Gen2 blocks, XADC for analog-to-digital conversion, and GTP transceivers (up to 6.6 Gbps) for high-speed serial communication. These features make it a versatile choice for a wide range of applications. Typical applications include software-defined radio, motor control, industrial networking, and video processing. The XC7A100T-1CSG324C is particularly well-suited for applications requiring high I/O count and moderate logic resources, such as interface bridging and protocol conversion. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a proper power-up sequence. Use the Xilinx Power Estimator (XPE) to calculate power consumption and design an appropriate thermal solution. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD Xilinx datasheet, providing a comprehensive resource for engineers evaluating the XC7A100T-1CSG324C.
XC7A100T-1CSG324I - Artix-7 FPGA, 101K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A100T-1CSG324I is a high-performance Artix-7 family FPGA delivering 101,440 logic cells, 240 DSP48E1 slices, and 4,860 Kb of block RAM in a 324-ball CSBGA package. It operates with a core voltage of 1.0V and supports I/O standards up to 3.3V, making it suitable for cost-sensitive, high-volume applications requiring low power and high throughput. Data verified as of 2026-08-04. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks and programmable interconnects that can be programmed after manufacturing to implement any digital logic function. FPGAs sit within the hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used for custom digital design without the cost and lead time of ASICs. The Artix-7 family is optimized for low power and cost, balancing performance with affordability for applications like software-defined radio, industrial motor control, and medical imaging. Key features include 285,000 system logic cells equivalent, 240 DSP slices for high-speed signal processing, 4,860 Kb of block RAM, and 6.6 Gb/s GTP transceivers. The device supports DDR3 memory interfaces up to 800 Mb/s and features a 12-bit, 1 MSPS XADC for analog monitoring. The CSG324 package offers 210 user I/O pins, providing flexibility for various board designs. The XC7A100T-1CSG324I is built on 28nm high-k metal gate (HKMG) process technology, balancing performance and power efficiency. It includes hardened memory controllers, PCIe Gen2 blocks, and a security engine for bitstream encryption. The device supports partial reconfiguration, enabling dynamic updates to logic functions without full reconfiguration. Typical applications include software-defined radio (SDR) for its DSP capabilities, industrial motor control for its real-time processing, and medical imaging for its parallel processing throughput. The low power consumption and cost-effectiveness make it ideal for high-volume products. When designing with this FPGA, ensure adequate decoupling capacitors on all power rails and follow the recommended power-up sequence to avoid latch-up. The configuration interface supports multiple modes, including JTAG, SPI, and BPI, allowing flexible system integration. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD Xilinx datasheet, providing engineers with a comprehensive resource for selection and implementation.
XC7A100T-1CSG324I-Q1 - Artix-7 FPGA, 101K Logic Cells | AMD
The AMD XC7A100T-1CSG324I-Q1 is an Artix-7 family FPGA delivering 101,440 logic cells, 240 DSP slices, and 4,860 Kb of block RAM in a 324-ball CSG (Chip Scale) package. It operates with a core voltage of 1.0V and supports up to 210 user I/O pins, making it a versatile choice for cost-sensitive, high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks and programmable interconnects, allowing designers to implement custom digital logic after manufacturing. Within the broader hierarchy, an FPGA is a type of programmable logic device (PLD), which falls under the category of integrated circuits (ICs) and ultimately semiconductors. The Artix-7 family specifically targets low-power, high-performance applications, balancing logic density with power efficiency. Key features include 101,440 logic cells, 240 DSP48E1 slices for digital signal processing, and 4,860 Kb of block RAM. The device supports multiple I/O standards including LVCMOS, LVDS, and HSTL, and includes integrated PCIe blocks and GTP transceivers for high-speed serial communication. The -1 speed grade indicates a balanced performance level, while the I temperature grade supports operation from -40°C to +100°C (Tj). The XC7A100T-1CSG324I-Q1 is built on AMD's 28nm process technology, offering a favorable balance of performance, power, and cost. The CSG324 package provides a compact footprint with 324 balls, enabling dense PCB layouts. The device includes configuration support via JTAG, SPI, and BPI interfaces, and features AES bitstream encryption for design security. Typical applications include motor control in industrial automation, software-defined radio (SDR) for communications, medical imaging equipment, and automotive infotainment systems. The -Q1 suffix indicates automotive qualification, making it suitable for automotive applications requiring extended temperature ranges and reliability. When designing with this FPGA, careful attention must be paid to power supply decoupling, with multiple 100nF capacitors placed near each power pin. The configuration interface should be selected based on the system boot requirements, with SPI flash being the most common choice for standalone operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD datasheet, providing engineers with a comprehensive resource for design-in decisions.
XC7A100T-1FGG484I - Artix-7 FPGA, 285 I/O | AMD
The AMD XC7A100T-1FGG484I is an Artix-7 Field Programmable Gate Array (FPGA) from the 7 series family, offering a balance of low cost, small form factor, and high performance-per-watt for cost-sensitive, high-volume applications. It features 101,440 logic cells, 285 user I/Os, and 4,976,640 bits of block RAM, all in a 484-pin BGA (FGG484) package. The device operates on a 1V core voltage and is built on 28nm technology, providing a robust platform for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be wired together in different configurations. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware reconfiguration. In the system hierarchy, an FPGA sits above microcontrollers in complexity and parallelism, offering massive parallel processing capabilities for tasks like digital signal processing (DSP), high-speed I/O, and custom logic implementation. Key features of the XC7A100T-1FGG484I include 285 user I/Os, which provide ample connectivity for interfacing with external peripherals and memory. The device also integrates Mixed-Mode Clock Managers (MMCM) and Phase-Locked Loops (PLL) for robust clock generation and management. With 4,976,640 bits of block RAM, it can handle substantial data buffering and storage requirements. The Artix-7 family is optimized for highest performance-per-watt, making it suitable for power-sensitive applications. Technically, the Artix-7 series is built on a 28nm high-k metal gate (HKMG) process, offering a significant improvement in performance and power efficiency over older generations. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, enabling flexible interfacing. The FGG484 package provides a compact footprint while still offering a high pin count for complex designs. The 'I' suffix indicates an industrial temperature grade, allowing operation from -40°C to +100°C (Tj). Typical applications include software-defined radio, motor control, industrial networking, and video processing. The XC7A100T's combination of logic density, I/O count, and DSP capabilities makes it ideal for these mid-range applications where cost and power are critical. For example, in software-defined radio, the FPGA can handle multiple channels of digital down-conversion and filtering in parallel, offloading the host processor. When designing with this device, careful attention must be paid to power supply decoupling and sequencing. The FPGA requires multiple voltage rails (VCCINT, VCCAUX, VCCO), and proper sequencing is essential to avoid latch-up or damage. Refer to the Xilinx 7 Series FPGAs Power Management Application Note (XAPP) for detailed guidance.
XC7A100T-1FTG256C - Artix-7 FPGA, 101K LCs, 256-FTBGA | AMD
The AMD Xilinx XC7A100T-1FTG256C is an Artix-7 family Field Programmable Gate Array (FPGA) housing 101,440 logic cells in a 256-ball FTG (FTBGA-256, 17x17 mm, 1.0 mm pitch) package, with 170 user I/Os, 4,976,640 bits of block RAM, and 240 DSP48E1 slices. The -1 speed grade targets commercial 0°C to 85°C operation and is built on TSMC's 28 nm HPL (high-performance, low-power) HKMG process, balancing logic density with low static and dynamic power. An Artix-7 FPGA is a programmable logic device that occupies the mid-range slot in AMD's 7-series portfolio (Spartan-6 below, Kintex-7 above), optimized for cost-sensitive, high-throughput, power-constrained systems. The 7-series architecture shares a unified ASMBL (Advanced Silicon Modular Block) fabric across all four family members, so Artix-7 inherits 6-input LUTs, 36 Kb block RAM, DSP48E1 slices, and SelectIO with HSTL/DDR memory interfaces from Kintex-7, while trading high-speed serial transceivers for lower die cost. Key features include up to 6.6 Gb/s transceivers on speed-grade /package permutations (the FTG256 omits GTX), integrated PCIe Gen2 hard cores, dual 12-bit 1 Msps ADCs, and clock-management tiles comprising 6 CMTs each with one PLL and one MMCM. A 1.0 V Vccint core, separate Vccaux (1.8 V) and Vcco (1.2-3.3 V HR I/O plus 1.2-1.8 V HP I/O) rails, and an Artix-7-specific power-optimization tier let designers meet thermal envelopes as low as 2-3 W at moderate toggle rates. Typical applications span software-defined radio (SDR) front-ends, machine-vision cameras, industrial motor control and PLCs, low-cost wireless backhaul, avionics flight controllers, and medical imaging pipelines. The FTG256 package balances thermal pad access with 170 single-ended I/Os, so most industrial and instrumentation form factors can be supported without moving to larger FGG484 or FBG676 footprints. When designing with this device, plan decoupling around the FPGA's recommended power-rail decoupling network (one 100 uF bulk per rail plus 0.1 uF + 0.01 uF close to each VRM pin). The FTG256's 1.0 mm ball pitch supports reflow with standard 4-mil NSMD or 5-mil SMD stencils; verify thermal performance with the AMD XPE spreadsheet before committing the PCB. This page synthesizes distributor pricing, package-level drop-in alternatives, and practical Artix-7 design notes - context not duplicated in the official ds181 datasheet.
XC7A100T-2CSG324C - Artix-7 FPGA, 101K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A100T-2CSG324C is a high-performance Artix-7 family FPGA delivering 101,440 logic cells, 240 DSP48E1 slices, and 4,860 Kb of block RAM in a 324-ball CSBGA (CSG324) package. It operates with a core voltage of 1.0V and supports I/O standards including LVCMOS, LVDS, and HSTL across 210 user I/O pins. Data verified as of 2026-08-04. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that can be programmed after manufacturing to implement custom digital logic circuits. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the application-specific integrated circuit (ASIC) family, but unlike ASICs, FPGAs offer reconfigurability, making them ideal for prototyping, low-volume production, and applications requiring in-field updates. Key features of the XC7A100T-2CSG324C include 101,440 logic cells, 240 DSP slices for high-speed signal processing, 4,860 Kb of block RAM, and 6 CMTs (Clock Management Tiles) providing PLL and MMCM for robust clock generation. The device supports PCIe Gen2 x1, Gigabit Ethernet, and DDR3 memory interfaces, making it suitable for a wide range of embedded and communications applications. The -2 speed grade offers a balance of performance and power, with a maximum clock frequency of 400 MHz for block RAM and 600 MHz for I/O. The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, delivering low static power consumption and high logic density. The device includes hardened memory controllers for DDR3, and its SelectIO technology supports up to 1.25 Gbps LVDS, enabling high-speed data transfer. The CSG324 package measures 15x15 mm with a 0.8 mm ball pitch, providing a compact footprint for space-constrained designs. Typical applications include software-defined radio (SDR), motor control, industrial Ethernet, medical imaging, and video processing. The XC7A100T-2CSG324C is particularly suited for applications requiring high DSP throughput and moderate logic capacity, such as digital signal processing in radar and communication systems. When designing with this FPGA, careful attention must be paid to power supply decoupling, with multiple 100nF capacitors placed near each power pin, and to thermal management, as the device can dissipate up to 2.5W under full utilization. The configuration bitstream can be stored in SPI flash, and the device supports multi-boot for remote updates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD Xilinx datasheet, providing engineers with a comprehensive resource for selecting and implementing the XC7A100T-2CSG324C.
XC7A100T-2CSG324I - Artix-7 FPGA, 101K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A100T-2CSG324I is a high-performance Artix-7 family FPGA delivering 101,440 logic cells, 240 DSP slices, and 4,860 Kb of block RAM in a 324-ball CSG (Chip-Scale BGA) package. It operates over the industrial temperature range (-40°C to +100°C) and is designed for cost-sensitive, high-volume applications requiring low power and high throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital logic circuits after manufacturing. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the larger family of integrated circuits (ICs). Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping and field upgrades, making them essential in applications ranging from embedded vision to software-defined radio. Key features of the XC7A100T-2CSG324I include 285,120 flip-flops, 240 DSP48E1 slices (each capable of 25x18 multiplication), and 135 Block RAM blocks (36 Kb each) totaling 4,860 Kb. The device supports up to 300 user I/O pins with support for multiple I/O standards including LVCMOS, LVDS, and HSTL. It integrates a 12-bit, 1 MSPS XADC for analog monitoring and supports PCIe Gen2 x1 and 10/100/1000 Ethernet via hardened blocks. The -2 speed grade provides balanced performance, with internal clock speeds up to 628 MHz. The Artix-7 architecture is built on a 28 nm high-k metal gate (HKMG) process, offering a 50% lower static power compared to previous generations. The device includes a unified configuration interface supporting JTAG, SelectMAP, and Quad-SPI flash programming. Its low-power transceivers (up to 16 GTP transceivers at 6.6 Gbps) enable high-speed serial connectivity for applications like video over SDI and CPRI. Typical applications include software-defined radio (SDR), medical imaging, motor control, and industrial Ethernet. The XC7A100T-2CSG324I is particularly suited for designs requiring high logic density with moderate I/O counts, such as camera-based vision systems and test equipment. Its industrial temperature grade makes it reliable for harsh environments. For detailed specifications, refer to the official AMD Xilinx datasheet (DS181) and the Artix-7 FPGA product page at https://www.xilinx.com/products/silicon-devices/fpga/artix-7.html. When designing with this FPGA, careful attention must be paid to power supply decoupling and PCB layout to ensure signal integrity at high speeds. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with specific sequencing, and the use of the XADC for thermal monitoring is recommended to prevent overheating.
XC7A100T-2FBG484I - Artix-7 FPGA, 101K Logic Cells | AMD
The AMD XC7A100T-2FBG484I is a high-performance Artix-7 Field Programmable Gate Array (FPGA) from the 7 Series family, offering 101,440 logic cells, 285 user I/Os, and 4,976,640 bits of block RAM in a 484-ball FBGA package. It operates over an industrial temperature range of -40°C to +100°C and is designed for cost-sensitive applications requiring high performance-per-watt. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit between ASICs (application-specific ICs) and microprocessors in the design hierarchy: they offer the parallelism and determinism of custom hardware with the reconfigurability of software. The Artix-7 family is optimized for the lowest power and cost at 28nm, making it a popular choice for embedded vision, software-defined radio, and industrial automation. Key features of the XC7A100T-2FBG484I include 285 user I/Os, 4,976,640 bits of block RAM, 240 DSP slices, and support for MMCM and PLL clock management. The -2 speed grade provides a maximum clock frequency of 628 MHz, while the industrial temperature rating ensures reliable operation in harsh environments. The device supports VCCINT from 0.95V to 1.05V, enabling flexible power supply design. Architecturally, the Artix-7 fabric is built on a 28nm high-k metal gate (HKMG) process, delivering a 50% reduction in power consumption compared to previous generations. The device integrates AMS (Analog Mixed Signal) blocks, including a 12-bit 1 MSPS ADC, for on-chip monitoring of voltage and temperature. This integration reduces external component count and simplifies board design. Typical applications include software-defined radio, motor control, industrial Ethernet, and medical imaging. The 484-ball FBGA package provides a balanced pin count for medium-complexity designs, while the industrial temperature range makes it suitable for outdoor and automotive-adjacent deployments. When designing with this device, ensure adequate decoupling on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's power-on sequencing guidelines to avoid latch-up. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, with support for multi-boot for remote updates.
XC7A100T-2FGG484I - Artix-7 FPGA, 285 I/O, 484-FBGA | AMD
The AMD XC7A100T-2FGG484I is an Artix-7 Field Programmable Gate Array (FPGA) featuring 101,440 logic cells, 285 user I/Os, and 4,976,640 bits of block RAM, fabricated on a 28nm process and housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA/FGG484) package rated for the industrial temperature range of -40C to +100C. An FPGA is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O cells can be programmed after manufacturing, unlike fixed-function ASICs. Within the hierarchy of programmable logic, the Artix-7 family sits between the smaller Spartan-7 and the larger Kintex-7 in AMD's (formerly Xilinx) 7-series, balancing logic density, DSP throughput, and transceiver performance for cost-optimized mid-range designs. Key differentiating features include 240 DSP48E1 slices for parallel signal processing, 10 clock management tiles (CMTs) combining MMCM and PLL blocks, and support for MicroBlaze soft processor cores and DDR3 memory interfaces up to 1,066 Mb/s. The -2 speed grade fabric can run at up to 628 MHz, and the device integrates Analog Mixed Signal (AMS) blocks including a 12-bit ADC for on-chip voltage and temperature monitoring. Architecturally, the 28nm high-performance/low-power process enables high logic utilization with low static power. The core supply operates from 0.95V to 1.05V nominal 1.0V, with separate VCCAUX and bank-selectable VCCO rails supporting multiple I/O voltage standards. Partial reconfiguration allows flexible in-system updates without full device reprogramming. Typical applications include motor control, industrial networking and automation, medical imaging front ends, and software-defined radio, where the 285 I/O count and DSP density are well matched. The 484-ball FGG484 package offers a balanced footprint of approximately 23mm x 23mm for moderate-to-high I/O designs. A key design consideration is power: multiple rails (VCCINT, VCCAUX, VCCO) require specific power sequencing, ramp rates, and decoupling networks. Use the AMD Vivado Design Suite for implementation and the UG475 package pinout files for PCB footprint verification. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-11.
XC7A200T-1FBG484I - 740K Logic Cells FPGA | AMD Xilinx
The AMD Xilinx XC7A200T-1FBG484I is a high-performance Artix-7 family FPGA delivering 740K logic cells, 215K logic slices, and 13 Mb of block RAM in a 484-ball FBGA package. It operates from 0.95V to 1.05V core voltage and supports up to 285 user I/O pins with multiple I/O standards including LVCMOS, LVDS, and HSTL. The device features 740 DSP48E1 slices for high-speed digital signal processing and 10 clock management tiles (CMTs) for robust clock generation and distribution. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that can be configured after manufacturing to implement custom digital circuits. FPGAs sit between ASICs (application-specific integrated circuits) and microprocessors in the design hierarchy, offering the flexibility of software-defined hardware with the parallelism of dedicated logic. The Artix-7 family is optimized for cost-sensitive, high-volume applications requiring high logic density and low power, positioned below the Kintex-7 and Virtex-7 families in AMD's 7-series portfolio. Key features include 285 user I/O pins supporting up to 1.25 Gbps LVDS, 740 DSP48E1 slices with 25x18 multiplier capability, and 10 CMTs providing PLL and MMCM functions. The device also offers 13 Mb of block RAM organized as 365 36Kb blocks, enabling substantial on-chip data storage. The -1 speed grade provides balanced performance with 550 MHz maximum clock frequency, while the industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The XC7A200T-1FBG484I is built on AMD's 28nm high-k metal gate (HKMG) process technology, delivering high performance with low static power. The architecture includes configurable logic blocks (CLBs) with 6-input look-up tables (LUTs), dedicated carry chains for arithmetic functions, and shift register capabilities. The device supports partial reconfiguration, allowing dynamic updates to logic functions without full device reprogramming, which is valuable for adaptive systems. Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high DSP count and low-latency I/O make it ideal for real-time signal processing in communications and defense systems. The 484-ball FBGA package with 1.0mm ball pitch enables compact PCB designs while providing adequate thermal dissipation for moderate power levels. When designing with this FPGA, ensure adequate decoupling capacitors on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's PCB design guidelines for high-speed I/O. The configuration interface supports multiple modes including JTAG, SPI, and SelectMAP, allowing flexible system integration. Power sequencing must follow the recommended ramp rates to avoid latch-up or configuration failures.
XC7A200T-1FBG676I - 740K Logic Cells FPGA | AMD Xilinx | FBG676
The AMD Xilinx XC7A200T-1FBG676I is a high-performance Artix-7 family FPGA delivering 740K logic cells, 215,360 logic slices, and 13,140 Kb of Block RAM in a 676-ball FCBGA (FBG676) package. It operates with a core voltage of 1.0V and supports I/O standards up to 3.3V, making it suitable for a wide range of high-speed digital designs. Data verified as of 2026-08-05. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, offering reconfigurable logic blocks and programmable interconnects. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of digital integrated circuits. They provide a flexible alternative to ASICs, enabling rapid prototyping and hardware acceleration without the high NRE costs of custom silicon. Key features include 740K logic cells, 365 DSP48E1 slices, 10.5 Mb of distributed RAM, and 13,140 Kb of Block RAM. The device supports up to 400 I/O pins with SelectIO technology, offering programmable I/O standards and speeds. It also includes integrated PCIe blocks, Gigabit Transceivers (GTX) for high-speed serial communication, and a XADC for analog-to-digital conversion, providing a comprehensive platform for complex digital systems. The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, balancing performance and power efficiency. The device features a configurable logic block (CLB) structure with 6-input LUTs, dedicated carry chains, and flip-flops, enabling efficient implementation of complex logic functions. The DSP48E1 slices support high-speed arithmetic operations, while the Block RAM provides on-chip storage for data buffering and FIFO implementations. Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high logic density and DSP resources make it ideal for signal processing tasks, while the transceivers enable high-speed data communication in networking and broadcast equipment. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the 676-ball BGA package demands a multi-layer PCB with adequate thermal vias for heat dissipation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD datasheet.
XC7A200T-2FBG484C - Artix-7 FPGA 740K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A200T-2FBG484C is a high-performance Artix-7 family FPGA delivering 740K logic cells, 215K logic slices, and 13 Mb of block RAM in a 484-ball FBGA package. It operates with a core voltage of 1.0V and supports I/O standards from 1.2V to 3.3V, making it suitable for a wide range of applications. Data verified as of 2026-08-04. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. It consists of programmable logic blocks, configurable interconnects, and I/O blocks, allowing for flexible implementation of digital circuits. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the semiconductor industry. They are used in applications requiring parallel processing, high-speed I/O, and reconfigurable logic, such as communications, industrial automation, and aerospace. Key features of the XC7A200T-2FBG484C include 740K logic cells, 215K logic slices, 13 Mb of block RAM, 740 DSP slices, and 10.3 Mb of distributed RAM. It also features 16 GTX transceivers supporting up to 6.6 Gbps, 10 clock management tiles (CMTs), and 285 user I/O pins. The device supports multiple I/O standards including LVCMOS, LVDS, and HSTL, and includes hardened memory controllers for DDR3 and DDR4. The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, offering a balance of performance, power, and cost. The device includes advanced clocking resources, such as PLLs and MMCMs, and supports partial reconfiguration for dynamic logic updates. The 484-ball FBGA package provides a compact footprint with excellent thermal and electrical characteristics, enabling high-density designs. Typical applications include software-defined radio (SDR), medical imaging, motor control, and high-performance computing. The high logic density and DSP slices make it ideal for signal processing, while the GTX transceivers support high-speed serial communication in networking and video applications. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a proper power-up sequence. Use the Xilinx Power Estimator (XPE) to calculate power consumption and design an appropriate thermal solution. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the AMD Xilinx datasheet, providing a comprehensive resource for engineers.
XC7A200T-2FBG484I - Artix-7 FPGA 215K Logic Cells | AMD Xilinx
The AMD Xilinx XC7A200T-2FBG484I is a high-performance Artix-7 family FPGA featuring 215,360 logic cells, 16,825 CLBs, and 13,455,360 bits of Block RAM, packaged in a 484-ball FBGA (FBG484) with a -2 speed grade and industrial temperature range (-40°C to +100°C). It delivers 285 user I/O pins, making it ideal for high-bandwidth signal processing and connectivity applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that can be configured after manufacturing to implement custom digital circuits. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the application-specific integrated circuit (ASIC) family, but offer reconfigurability that ASICs lack. The Artix-7 family is positioned as a mid-range FPGA optimized for cost-sensitive, high-volume applications requiring high-speed transceivers and DSP capabilities. Key features include 740 DSP48E1 slices for high-throughput digital signal processing, 16 high-speed transceivers supporting up to 6.6 Gb/s, and 285 I/O pins with support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also integrates a PCIe Gen2 block, 10/100/1000 Ethernet MACs, and an analog-to-digital converter (XADC) for system monitoring. The -2 speed grade provides balanced performance for logic and I/O, while the industrial temperature range ensures reliable operation in harsh environments. Architecturally, the XC7A200T is built on the 28nm high-k metal gate (HKMG) process, offering a 50% lower power footprint compared to previous generations. The configurable logic blocks (CLBs) contain 6-input look-up tables (LUTs) and dual flip-flops, enabling efficient implementation of complex logic functions. The device supports partial reconfiguration, allowing dynamic updates to specific regions without disrupting the entire design. Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high transceiver count and DSP resources make it particularly suited for communications infrastructure, such as LTE/5G base stations and network switches, where high-speed serial links and parallel processing are essential. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the FBG484 package has a thermal resistance of 8.4°C/W (theta_JA) that necessitates adequate airflow or heatsinking for high-utilization designs.